TWI824071B - 中心檢測方法 - Google Patents
中心檢測方法 Download PDFInfo
- Publication number
- TWI824071B TWI824071B TW108144330A TW108144330A TWI824071B TW I824071 B TWI824071 B TW I824071B TW 108144330 A TW108144330 A TW 108144330A TW 108144330 A TW108144330 A TW 108144330A TW I824071 B TWI824071 B TW I824071B
- Authority
- TW
- Taiwan
- Prior art keywords
- outer peripheral
- detection area
- pixel
- axis direction
- light
- Prior art date
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 120
- 230000002093 peripheral effect Effects 0.000 claims abstract description 104
- 238000003384 imaging method Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 18
- 238000003672 processing method Methods 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 description 75
- 238000007689 inspection Methods 0.000 description 18
- 230000007246 mechanism Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009966 trimming Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000023077 detection of light stimulus Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-228008 | 2018-12-05 | ||
| JP2018228008A JP7185510B2 (ja) | 2018-12-05 | 2018-12-05 | 中心検出方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202022313A TW202022313A (zh) | 2020-06-16 |
| TWI824071B true TWI824071B (zh) | 2023-12-01 |
Family
ID=70776525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108144330A TWI824071B (zh) | 2018-12-05 | 2019-12-04 | 中心檢測方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7185510B2 (de) |
| KR (1) | KR20200068584A (de) |
| CN (1) | CN111276412B (de) |
| DE (1) | DE102019218969A1 (de) |
| TW (1) | TWI824071B (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112539714B (zh) * | 2020-06-30 | 2022-07-26 | 深圳中科飞测科技股份有限公司 | 一种偏心检测方法、检测方法、处理方法及检测设备 |
| CN112767363B (zh) * | 2021-01-22 | 2023-03-14 | 电子科技大学 | 一种对线图进行目标检测的方法 |
| CN114628299B (zh) * | 2022-03-16 | 2023-03-24 | 江苏京创先进电子科技有限公司 | 晶圆对中确认方法及太鼓环切割方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090116727A1 (en) * | 2006-05-02 | 2009-05-07 | Accretech Usa, Inc. | Apparatus and Method for Wafer Edge Defects Detection |
| US20090304258A1 (en) * | 2005-12-06 | 2009-12-10 | Yoshinori Hayashi | Visual Inspection System |
| JP5318784B2 (ja) * | 2007-02-23 | 2013-10-16 | ルドルフテクノロジーズ インコーポレイテッド | エッジビード除去プロセスを含む、ウェハ製造モニタリング・システム及び方法 |
| JP2015133371A (ja) * | 2014-01-10 | 2015-07-23 | 株式会社ディスコ | マーク検出方法 |
| US9734568B2 (en) * | 2014-02-25 | 2017-08-15 | Kla-Tencor Corporation | Automated inline inspection and metrology using shadow-gram images |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08149522A (ja) * | 1994-09-20 | 1996-06-07 | Matsushita Electric Ind Co Ltd | 位置検出装置及び画像補正装置 |
| JP3963300B2 (ja) | 2000-11-07 | 2007-08-22 | 株式会社安川電機 | ウエハの外周位置検出方法およびその方法を実行させるプログラムを記録したコンピュータ読み取り可能な記録媒体ならびにウエハの外周位置検出装置。 |
| JP2005268530A (ja) | 2004-03-18 | 2005-09-29 | Olympus Corp | 半導体ウエハのアライメント装置 |
| JP2006093333A (ja) | 2004-09-22 | 2006-04-06 | Disco Abrasive Syst Ltd | 切削方法 |
| JP5360403B2 (ja) * | 2009-09-29 | 2013-12-04 | サクサ株式会社 | 移動体撮像装置 |
| JP5486405B2 (ja) | 2010-05-27 | 2014-05-07 | 株式会社ディスコ | ウェーハの中心位置検出方法 |
| JP6174980B2 (ja) | 2013-11-22 | 2017-08-02 | 株式会社ディスコ | ウェーハの検出方法 |
| JP6555211B2 (ja) | 2016-08-15 | 2019-08-07 | Ｊｆｅスチール株式会社 | 二次元画像のエッジ抽出方法 |
-
2018
- 2018-12-05 JP JP2018228008A patent/JP7185510B2/ja active Active
-
2019
- 2019-11-26 KR KR1020190153532A patent/KR20200068584A/ko not_active Application Discontinuation
- 2019-12-03 CN CN201911218257.3A patent/CN111276412B/zh active Active
- 2019-12-04 TW TW108144330A patent/TWI824071B/zh active
- 2019-12-05 DE DE102019218969.5A patent/DE102019218969A1/de active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090304258A1 (en) * | 2005-12-06 | 2009-12-10 | Yoshinori Hayashi | Visual Inspection System |
| US20090116727A1 (en) * | 2006-05-02 | 2009-05-07 | Accretech Usa, Inc. | Apparatus and Method for Wafer Edge Defects Detection |
| JP5318784B2 (ja) * | 2007-02-23 | 2013-10-16 | ルドルフテクノロジーズ インコーポレイテッド | エッジビード除去プロセスを含む、ウェハ製造モニタリング・システム及び方法 |
| JP2015133371A (ja) * | 2014-01-10 | 2015-07-23 | 株式会社ディスコ | マーク検出方法 |
| US9734568B2 (en) * | 2014-02-25 | 2017-08-15 | Kla-Tencor Corporation | Automated inline inspection and metrology using shadow-gram images |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102019218969A1 (de) | 2020-06-10 |
| CN111276412A (zh) | 2020-06-12 |
| CN111276412B (zh) | 2024-06-07 |
| KR20200068584A (ko) | 2020-06-15 |
| JP7185510B2 (ja) | 2022-12-07 |
| TW202022313A (zh) | 2020-06-16 |
| JP2020091177A (ja) | 2020-06-11 |
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