TWI820157B - 導電性粒子、導電材料及連接構造體 - Google Patents
導電性粒子、導電材料及連接構造體 Download PDFInfo
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- TWI820157B TWI820157B TW108122094A TW108122094A TWI820157B TW I820157 B TWI820157 B TW I820157B TW 108122094 A TW108122094 A TW 108122094A TW 108122094 A TW108122094 A TW 108122094A TW I820157 B TWI820157 B TW I820157B
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- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- 239000001923 methylcellulose Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
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- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical group OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
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- 229920003986 novolac Polymers 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
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- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ZESXUEKAXSBANL-UHFFFAOYSA-N trifluoromethyl prop-2-enoate Chemical compound FC(F)(F)OC(=O)C=C ZESXUEKAXSBANL-UHFFFAOYSA-N 0.000 description 1
- JRSJRHKJPOJTMS-UHFFFAOYSA-N trimethoxy(2-phenylethenyl)silane Chemical compound CO[Si](OC)(OC)C=CC1=CC=CC=C1 JRSJRHKJPOJTMS-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018119894 | 2018-06-25 | ||
| JP2018-119894 | 2018-06-25 |
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| TW202015074A TW202015074A (zh) | 2020-04-16 |
| TWI820157B true TWI820157B (zh) | 2023-11-01 |
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| JP (1) | JP7280880B2 (ja) |
| KR (1) | KR102647120B1 (ja) |
| CN (2) | CN112313758B (ja) |
| TW (1) | TWI820157B (ja) |
| WO (1) | WO2020004273A1 (ja) |
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| CN113728225A (zh) * | 2019-04-26 | 2021-11-30 | 纳博特斯克有限公司 | 传感器 |
| CN118112060A (zh) * | 2019-04-26 | 2024-05-31 | 纳博特斯克有限公司 | 传感器 |
| CN115699218A (zh) * | 2020-06-04 | 2023-02-03 | 积水化学工业株式会社 | 导电性粒子、导电材料和连接结构体 |
| JP7298568B2 (ja) * | 2020-08-25 | 2023-06-27 | 株式会社村田製作所 | 磁性粉の製造方法および圧粉成形体の製造方法 |
| US12002159B2 (en) * | 2021-06-09 | 2024-06-04 | Dassault Systemes Americas Corp. | Prediction of mechanical properties of sedimentary rocks based on a grain to grain parametric cohesive contact model |
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| JPH05190014A (ja) * | 1992-01-09 | 1993-07-30 | Sekisui Fine Chem Kk | 電極接続用導電性微球体 |
| TW200809879A (en) * | 2006-02-27 | 2008-02-16 | Hitachi Chemical Co Ltd | Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |
| TW201125661A (en) * | 2009-08-06 | 2011-08-01 | Hitachi Chemical Co Ltd | Conductive fine particles and anisotropic conductive material |
| JP2012142223A (ja) * | 2011-01-05 | 2012-07-26 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
| KR20130128336A (ko) * | 2012-05-16 | 2013-11-26 | 히타치가세이가부시끼가이샤 | 도전 입자, 이방성 도전 접착제 필름 및 접속 구조체 |
| TW201737267A (zh) * | 2016-04-05 | 2017-10-16 | Isc Co Ltd | 包括混合有異種粒子的導電粒子之各向異性導電片 |
| TW201935491A (zh) * | 2018-02-13 | 2019-09-01 | 日商保德科技股份有限公司 | 複合粒子、粉末、樹脂組合物及成形體 |
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| JP2002157918A (ja) * | 2000-11-17 | 2002-05-31 | Jsr Corp | 導電性複合粒子およびそれを用いた応用製品 |
| US7071722B2 (en) * | 2002-08-27 | 2006-07-04 | Jsr Corporation | Anisotropic, conductive sheet and impedance measuring probe |
| CA2418497A1 (en) * | 2003-02-05 | 2004-08-05 | Patrick Lemieux | High performance soft magnetic parts made by powder metallurgy for ac applications |
| CN101260243A (zh) * | 2008-04-30 | 2008-09-10 | 杨力 | 一种高分子复合导电材料电线芯材及制备方法 |
| IT1399315B1 (it) * | 2010-04-08 | 2013-04-16 | Cappelli | Procedimento per disporre su una qualsiasi superficie verniciabile, dei circuiti conduttori e/o generatori di cariche elettriche e circuiti realizzati con tale procedimento. |
| JP6369750B2 (ja) * | 2013-09-10 | 2018-08-08 | 日立金属株式会社 | 積層配線膜およびその製造方法ならびにＮｉ合金スパッタリングターゲット材 |
| EP3664106A4 (en) * | 2017-08-03 | 2021-05-05 | Powdertech Co., Ltd. | COMPOSITE PARTICLES, POWDER, RESIN COMPOSITION AND MOLDED BODY |
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2019
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- 2019-06-21 CN CN201980040888.2A patent/CN112313758B/zh active Active
- 2019-06-21 KR KR1020207031840A patent/KR102647120B1/ko active IP Right Grant
- 2019-06-21 JP JP2020527481A patent/JP7280880B2/ja active Active
- 2019-06-21 CN CN202310216345.XA patent/CN116189963A/zh active Pending
- 2019-06-25 TW TW108122094A patent/TWI820157B/zh active
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| JPH05190014A (ja) * | 1992-01-09 | 1993-07-30 | Sekisui Fine Chem Kk | 電極接続用導電性微球体 |
| TW200809879A (en) * | 2006-02-27 | 2008-02-16 | Hitachi Chemical Co Ltd | Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |
| TW201125661A (en) * | 2009-08-06 | 2011-08-01 | Hitachi Chemical Co Ltd | Conductive fine particles and anisotropic conductive material |
| JP2012142223A (ja) * | 2011-01-05 | 2012-07-26 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
| KR20130128336A (ko) * | 2012-05-16 | 2013-11-26 | 히타치가세이가부시끼가이샤 | 도전 입자, 이방성 도전 접착제 필름 및 접속 구조체 |
| TW201737267A (zh) * | 2016-04-05 | 2017-10-16 | Isc Co Ltd | 包括混合有異種粒子的導電粒子之各向異性導電片 |
| TW201935491A (zh) * | 2018-02-13 | 2019-09-01 | 日商保德科技股份有限公司 | 複合粒子、粉末、樹脂組合物及成形體 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116189963A (zh) | 2023-05-30 |
| KR102647120B1 (ko) | 2024-03-14 |
| JPWO2020004273A1 (ja) | 2021-08-05 |
| TW202015074A (zh) | 2020-04-16 |
| WO2020004273A1 (ja) | 2020-01-02 |
| JP7280880B2 (ja) | 2023-05-24 |
| CN112313758A (zh) | 2021-02-02 |
| KR20210022541A (ko) | 2021-03-03 |
| CN112313758B (zh) | 2023-02-28 |
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