TWI815835B - 工件的切斷方法及線鋸 - Google Patents

工件的切斷方法及線鋸 Download PDF

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Publication number
TWI815835B
TWI815835B TW107145122A TW107145122A TWI815835B TW I815835 B TWI815835 B TW I815835B TW 107145122 A TW107145122 A TW 107145122A TW 107145122 A TW107145122 A TW 107145122A TW I815835 B TWI815835 B TW I815835B
Authority
TW
Taiwan
Prior art keywords
steel wire
workpiece
wire
cutting
fixed abrasive
Prior art date
Application number
TW107145122A
Other languages
English (en)
Chinese (zh)
Other versions
TW201932266A (zh
Inventor
小林健司
Original Assignee
日商信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW201932266A publication Critical patent/TW201932266A/zh
Application granted granted Critical
Publication of TWI815835B publication Critical patent/TWI815835B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107145122A 2018-01-25 2018-12-14 工件的切斷方法及線鋸 TWI815835B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018010478A JP6819621B2 (ja) 2018-01-25 2018-01-25 ワークの切断方法及びワイヤソー
JPJP2018-010478 2018-01-25

Publications (2)

Publication Number Publication Date
TW201932266A TW201932266A (zh) 2019-08-16
TWI815835B true TWI815835B (zh) 2023-09-21

Family

ID=67395366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107145122A TWI815835B (zh) 2018-01-25 2018-12-14 工件的切斷方法及線鋸

Country Status (5)

Country Link
JP (1) JP6819621B2 (ja)
KR (1) KR102620550B1 (ja)
CN (1) CN111670088B (ja)
TW (1) TWI815835B (ja)
WO (1) WO2019146287A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113580403B (zh) * 2021-09-30 2022-01-25 浙江晶科能源有限公司 晶硅切割方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006123055A (ja) * 2004-10-28 2006-05-18 Allied Material Corp 超砥粒ワイヤソーによる加工材の切断方法および超砥粒ワイヤソーにより切断加工された加工材
JP2006181701A (ja) * 2004-12-28 2006-07-13 Asahi Diamond Industrial Co Ltd 電着ワイヤ工具およびその製造方法
JP2013094881A (ja) * 2011-10-31 2013-05-20 Kyocera Corp ワイヤーソー装置およびそれを用いた切断方法ならびに半導体基板の製造方法
TW201725103A (zh) * 2016-01-07 2017-07-16 Shin-Etsu Handotai Co Ltd 晶棒的切斷方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3656317B2 (ja) 1996-03-27 2005-06-08 信越半導体株式会社 ワイヤソーによるワーク切断方法及び装置
JP3042604B2 (ja) * 1997-02-04 2000-05-15 サンケン電気株式会社 半導体ウエハ組立体切断法及び半導体ウエハ用ワイヤソー切断機
JP4006937B2 (ja) 2000-09-22 2007-11-14 住友化学株式会社 微細粒子量の低減されたフォトレジスト組成物の製造法
JP2002254327A (ja) * 2001-03-02 2002-09-10 Ngk Insulators Ltd ワイヤーソー用ソーワイヤーおよびそれを用いた加工方法
US7311847B2 (en) 2003-07-21 2007-12-25 Akrion Technologies, Inc. System and method for point-of-use filtration and purification of fluids used in substrate processing
JP2011031386A (ja) * 2009-07-10 2011-02-17 Mitsubishi Chemicals Corp 電着式固定砥粒ワイヤーおよびこれを用いた結晶スライス方法
JP2015147293A (ja) * 2014-01-09 2015-08-20 株式会社コベルコ科研 被加工物の切断方法
JP2015185830A (ja) * 2014-03-26 2015-10-22 株式会社巴川製紙所 ワイヤーソーダイシング法用の仮固定用接着部材、およびワイヤーソーダイシング法
JP6402700B2 (ja) * 2015-10-20 2018-10-10 信越半導体株式会社 ワークの切断方法及びワイヤソー
JP6270796B2 (ja) * 2015-10-28 2018-01-31 株式会社リード 固定砥粒ワイヤーソー及び固定砥粒ワイヤーのドレッシング方法
WO2018142888A1 (ja) 2017-02-01 2018-08-09 富士フイルム株式会社 薬液の製造方法、及び、薬液の製造装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006123055A (ja) * 2004-10-28 2006-05-18 Allied Material Corp 超砥粒ワイヤソーによる加工材の切断方法および超砥粒ワイヤソーにより切断加工された加工材
JP2006181701A (ja) * 2004-12-28 2006-07-13 Asahi Diamond Industrial Co Ltd 電着ワイヤ工具およびその製造方法
JP2013094881A (ja) * 2011-10-31 2013-05-20 Kyocera Corp ワイヤーソー装置およびそれを用いた切断方法ならびに半導体基板の製造方法
TW201725103A (zh) * 2016-01-07 2017-07-16 Shin-Etsu Handotai Co Ltd 晶棒的切斷方法

Also Published As

Publication number Publication date
JP6819621B2 (ja) 2021-01-27
TW201932266A (zh) 2019-08-16
JP2019126883A (ja) 2019-08-01
CN111670088B (zh) 2022-03-01
KR102620550B1 (ko) 2024-01-03
KR20200111697A (ko) 2020-09-29
CN111670088A (zh) 2020-09-15
WO2019146287A1 (ja) 2019-08-01

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