TWI809240B - 半導體元件被覆用玻璃及使用其之半導體被覆用材料 - Google Patents

半導體元件被覆用玻璃及使用其之半導體被覆用材料 Download PDF

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Publication number
TWI809240B
TWI809240B TW109100840A TW109100840A TWI809240B TW I809240 B TWI809240 B TW I809240B TW 109100840 A TW109100840 A TW 109100840A TW 109100840 A TW109100840 A TW 109100840A TW I809240 B TWI809240 B TW I809240B
Authority
TW
Taiwan
Prior art keywords
glass
semiconductor element
sio
zno
covering
Prior art date
Application number
TW109100840A
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English (en)
Chinese (zh)
Other versions
TW202045451A (zh
Inventor
廣瀬将行
Original Assignee
日商日本電氣硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW202045451A publication Critical patent/TW202045451A/zh
Application granted granted Critical
Publication of TWI809240B publication Critical patent/TWI809240B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW109100840A 2019-01-29 2020-01-10 半導體元件被覆用玻璃及使用其之半導體被覆用材料 TWI809240B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019012914A JP7216323B2 (ja) 2019-01-29 2019-01-29 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料
JP2019-012914 2019-01-29

Publications (2)

Publication Number Publication Date
TW202045451A TW202045451A (zh) 2020-12-16
TWI809240B true TWI809240B (zh) 2023-07-21

Family

ID=71841307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109100840A TWI809240B (zh) 2019-01-29 2020-01-10 半導體元件被覆用玻璃及使用其之半導體被覆用材料

Country Status (3)

Country Link
JP (1) JP7216323B2 (ja)
TW (1) TWI809240B (ja)
WO (1) WO2020158187A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024004711A1 (ja) * 2022-06-29 2024-01-04 日本電気硝子株式会社 半導体素子被覆用ガラス、半導体素子被覆用材料、及び半導体素子被覆用焼結体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104025267A (zh) * 2012-05-08 2014-09-03 新电元工业株式会社 树脂封装型半导体装置以及树脂封装型半导体装置的制造方法
TW201811699A (zh) * 2016-08-03 2018-04-01 菲洛公司 用於半導體裝置的鈍化玻璃

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126639A (ja) * 1989-10-06 1991-05-29 Nippon Electric Glass Co Ltd 被覆用ガラス組成物
JP5773327B2 (ja) * 2010-09-01 2015-09-02 日本電気硝子株式会社 半導体被覆用ガラス
US9006113B2 (en) * 2011-08-29 2015-04-14 Shindengen Electric Manufacturing Co. Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104025267A (zh) * 2012-05-08 2014-09-03 新电元工业株式会社 树脂封装型半导体装置以及树脂封装型半导体装置的制造方法
TW201811699A (zh) * 2016-08-03 2018-04-01 菲洛公司 用於半導體裝置的鈍化玻璃

Also Published As

Publication number Publication date
WO2020158187A1 (ja) 2020-08-06
JP7216323B2 (ja) 2023-02-01
JP2020121893A (ja) 2020-08-13
TW202045451A (zh) 2020-12-16

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