TWI806270B - 靜電吸盤 - Google Patents

靜電吸盤 Download PDF

Info

Publication number
TWI806270B
TWI806270B TW110145168A TW110145168A TWI806270B TW I806270 B TWI806270 B TW I806270B TW 110145168 A TW110145168 A TW 110145168A TW 110145168 A TW110145168 A TW 110145168A TW I806270 B TWI806270 B TW I806270B
Authority
TW
Taiwan
Prior art keywords
porous
hole
porous portion
dielectric substrate
ceramic dielectric
Prior art date
Application number
TW110145168A
Other languages
English (en)
Chinese (zh)
Other versions
TW202213613A (zh
Inventor
白石純
西願修一郎
森達哉
渡邉仁弘
Original Assignee
日商Ｔｏｔｏ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｔｏ股份有限公司 filed Critical 日商Ｔｏｔｏ股份有限公司
Publication of TW202213613A publication Critical patent/TW202213613A/zh
Application granted granted Critical
Publication of TWI806270B publication Critical patent/TWI806270B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
TW110145168A 2018-10-30 2019-10-14 靜電吸盤 TWI806270B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-203749 2018-10-30
JP2018203749 2018-10-30
JP2019-166033 2019-09-12
JP2019166033A JP7002014B2 (ja) 2018-10-30 2019-09-12 静電チャック

Publications (2)

Publication Number Publication Date
TW202213613A TW202213613A (zh) 2022-04-01
TWI806270B true TWI806270B (zh) 2023-06-21

Family

ID=70549670

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110145168A TWI806270B (zh) 2018-10-30 2019-10-14 靜電吸盤
TW108136824A TWI751444B (zh) 2018-10-30 2019-10-14 靜電吸盤

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108136824A TWI751444B (zh) 2018-10-30 2019-10-14 靜電吸盤

Country Status (5)

Country Link
US (2) US11309204B2 (https=)
JP (2) JP7002014B2 (https=)
KR (2) KR102750908B1 (https=)
CN (1) CN118737928A (https=)
TW (2) TWI806270B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111668150B (zh) * 2019-03-05 2024-06-28 Toto株式会社 静电吸盘及处理装置
JP7433857B2 (ja) * 2019-11-25 2024-02-20 京セラ株式会社 試料保持具
WO2021241645A1 (ja) * 2020-05-28 2021-12-02 京セラ株式会社 通気性プラグ、基板支持アセンブリおよびシャワープレート
JP7330139B2 (ja) * 2020-06-18 2023-08-21 日立造船株式会社 加圧用吸着台およびこれを具備する加圧装置
JP7382978B2 (ja) * 2021-02-04 2023-11-17 日本碍子株式会社 半導体製造装置用部材及びプラグ
JP7558886B2 (ja) * 2021-05-17 2024-10-01 日本特殊陶業株式会社 保持装置
CN115732387A (zh) 2021-08-31 2023-03-03 Toto株式会社 静电吸盘以及处理装置
JP7255659B1 (ja) * 2021-11-25 2023-04-11 住友大阪セメント株式会社 静電チャック装置
US12341048B2 (en) * 2021-11-29 2025-06-24 Applied Materials, Inc. Porous plug for electrostatic chuck gas delivery
JP7620578B2 (ja) * 2022-01-07 2025-01-23 日本碍子株式会社 半導体製造装置用部材
JP7791723B2 (ja) * 2022-01-20 2025-12-24 新光電気工業株式会社 基板固定装置
JP7569343B2 (ja) * 2022-01-21 2024-10-17 日本碍子株式会社 半導体製造装置用部材
JP7569342B2 (ja) * 2022-01-21 2024-10-17 日本碍子株式会社 半導体製造装置用部材
US11794296B2 (en) * 2022-02-03 2023-10-24 Applied Materials, Inc. Electrostatic chuck with porous plug
KR20240159576A (ko) * 2022-03-08 2024-11-05 램 리써치 코포레이션 정적 척의 세라믹 플레이트 및 금속 베이스플레이트를 본딩하기 위한 캡슐화된 압축 와셔
CN115632029B (zh) * 2022-12-22 2023-03-17 河北博特半导体设备科技有限公司 一种高精度晶圆承片台的陶瓷旋转台结构
JP7551828B1 (ja) 2023-04-21 2024-09-17 日本特殊陶業株式会社 保持装置
JP2026036959A (ja) * 2024-08-21 2026-03-06 住友大阪セメント株式会社 静電チャック部材、および静電チャック装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI518841B (zh) * 2013-03-29 2016-01-21 Ｔｏｔｏ股份有限公司 Electrostatic sucker

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW561515B (en) * 2001-11-30 2003-11-11 Tokyo Electron Ltd Processing device, and gas discharge suppressing member
KR100505035B1 (ko) * 2003-11-17 2005-07-29 삼성전자주식회사 기판을 지지하기 위한 정전척
JP4390629B2 (ja) 2004-06-01 2009-12-24 Ｎｅｃエレクトロニクス株式会社 静電吸着装置およびプラズマ処理装置
JP4557814B2 (ja) * 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
JP5188696B2 (ja) * 2006-11-01 2013-04-24 株式会社日立ハイテクノロジーズ ウエハ載置用電極
US20090086401A1 (en) 2007-09-28 2009-04-02 Intevac, Inc. Electrostatic chuck apparatus
US8336891B2 (en) * 2008-03-11 2012-12-25 Ngk Insulators, Ltd. Electrostatic chuck
JP5331519B2 (ja) * 2008-03-11 2013-10-30 日本碍子株式会社 静電チャック
JP5449750B2 (ja) 2008-11-19 2014-03-19 株式会社日本セラテック 静電チャックおよびその製造方法
JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP6005579B2 (ja) * 2012-04-27 2016-10-12 日本碍子株式会社 半導体製造装置用部材
JP6432474B2 (ja) * 2014-03-27 2018-12-05 Toto株式会社 静電チャック
US9805963B2 (en) * 2015-10-05 2017-10-31 Lam Research Corporation Electrostatic chuck with thermal choke
JP6634315B2 (ja) * 2016-03-03 2020-01-22 日本特殊陶業株式会社 保持装置および保持装置の製造方法
US10770270B2 (en) * 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
JP6722518B2 (ja) * 2016-06-09 2020-07-15 新光電気工業株式会社 焼結体及びその製造方法と静電チャック
JP6865145B2 (ja) * 2016-12-16 2021-04-28 日本特殊陶業株式会社 保持装置
JP6489277B1 (ja) * 2018-03-14 2019-03-27 Toto株式会社 静電チャック

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI518841B (zh) * 2013-03-29 2016-01-21 Ｔｏｔｏ股份有限公司 Electrostatic sucker

Also Published As

Publication number Publication date
JP7424362B2 (ja) 2024-01-30
JP7002014B2 (ja) 2022-01-20
KR102750908B1 (ko) 2025-01-09
TW202017095A (zh) 2020-05-01
KR20200049511A (ko) 2020-05-08
TWI751444B (zh) 2022-01-01
US11309204B2 (en) 2022-04-19
JP2020072261A (ja) 2020-05-07
US20200135528A1 (en) 2020-04-30
CN118737928A (zh) 2024-10-01
TW202213613A (zh) 2022-04-01
KR20250007482A (ko) 2025-01-14
US12014947B2 (en) 2024-06-18
JP2022031333A (ja) 2022-02-18
KR102819118B1 (ko) 2025-06-12
US20220199452A1 (en) 2022-06-23

Similar Documents

Publication Publication Date Title
TWI806270B (zh) 靜電吸盤
TWI690020B (zh) 靜電吸盤
CN110277341B (zh) 静电吸盘
JP7441404B2 (ja) 静電チャック、および処理装置
JP7402411B2 (ja) 静電チャック
CN111128838B (zh) 静电吸盘
JP7205285B2 (ja) 静電チャック
JP7441402B2 (ja) 静電チャック、および処理装置
JP7441403B2 (ja) 静電チャック、および処理装置
CN110277343B (zh) 静电吸盘
CN111128837B (zh) 静电吸盘
JP6922874B2 (ja) 静電チャック