TWI802662B - 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 - Google Patents

聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 Download PDF

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Publication number
TWI802662B
TWI802662B TW108109022A TW108109022A TWI802662B TW I802662 B TWI802662 B TW I802662B TW 108109022 A TW108109022 A TW 108109022A TW 108109022 A TW108109022 A TW 108109022A TW I802662 B TWI802662 B TW I802662B
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Taiwan
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structural unit
polyimide
polyimide resin
compound represented
film
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TW108109022A
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English (en)
Chinese (zh)
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TW201942195A (zh
Inventor
安孫子洋平
關口慎司
末永修也
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日商三菱瓦斯化學股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW108109022A 2018-03-28 2019-03-18 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 TWI802662B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-062318 2018-03-28
JP2018062318 2018-03-28

Publications (2)

Publication Number Publication Date
TW201942195A TW201942195A (zh) 2019-11-01
TWI802662B true TWI802662B (zh) 2023-05-21

Family

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TW108109022A TWI802662B (zh) 2018-03-28 2019-03-18 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜

Country Status (5)

Country Link
JP (1) JP7424284B2 (ko)
KR (1) KR20200135953A (ko)
CN (1) CN111936553A (ko)
TW (1) TWI802662B (ko)
WO (1) WO2019188305A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7304338B2 (ja) 2018-03-30 2023-07-06 株式会社カネカ ポリイミド膜の製造方法および電子デバイスの製造方法
KR102551047B1 (ko) 2019-02-01 2023-07-04 주식회사 엘지화학 폴리이미드 필름, 이를 이용한 플렉서블 기판 및 플렉서블 기판을 포함하는 플렉서블 디스플레이
CN114466902A (zh) * 2019-09-30 2022-05-10 三菱瓦斯化学株式会社 聚酰亚胺树脂组合物、聚酰亚胺清漆和聚酰亚胺薄膜
TW202120634A (zh) * 2019-10-11 2021-06-01 日商三菱瓦斯化學股份有限公司 聚醯亞胺樹脂組成物、聚醯亞胺清漆、以及聚醯亞胺薄膜
CN115667368A (zh) * 2020-05-28 2023-01-31 旭化成株式会社 树脂组合物
KR20230066345A (ko) * 2020-09-10 2023-05-15 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 중합체 조성물, 바니시, 및 폴리이미드 필름
KR102481278B1 (ko) * 2020-12-30 2022-12-23 에스케이씨 주식회사 다층전자장비, 내열필름 및 이의 제조방법
KR102481277B1 (ko) * 2020-12-30 2022-12-23 에스케이씨 주식회사 다층전자장비, 내열필름 및 이의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206825A (ja) * 2005-01-31 2006-08-10 Jfe Chemical Corp 芳香族ポリイミド樹脂前駆体及び芳香族ポリイミド樹脂
US20090088551A1 (en) * 2007-09-27 2009-04-02 E. I. Du Pont De Nemours And Company Polyimide film
CN103755959A (zh) * 2014-01-22 2014-04-30 江苏亚宝绝缘材料股份有限公司 一种柔性透明聚酰亚胺薄膜
TW201500464A (zh) * 2013-04-03 2015-01-01 Mitsui Chemicals Inc 聚醯胺酸、包含聚醯胺酸的清漆、乾膜、聚醯亞胺、聚醯亞胺積層體的製造方法、顯示器裝置的製造方法、觸控面板顯示器、液晶顯示器、有機電致發光顯示器以及聚醯亞胺膜

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5412933B2 (ja) * 2008-08-01 2014-02-12 新日本理化株式会社 ポリイミド樹脂
TWI488887B (zh) * 2013-02-08 2015-06-21 長興材料工業股份有限公司 聚醯亞胺，由此形成之塗料組合物及其用途
JP6294116B2 (ja) * 2013-03-29 2018-03-14 住友電気工業株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂膜、フレキシブルプリント配線板、回路付きサスペンション及びハードディスクドライブ
JP6599620B2 (ja) 2015-03-05 2019-10-30 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206825A (ja) * 2005-01-31 2006-08-10 Jfe Chemical Corp 芳香族ポリイミド樹脂前駆体及び芳香族ポリイミド樹脂
US20090088551A1 (en) * 2007-09-27 2009-04-02 E. I. Du Pont De Nemours And Company Polyimide film
TW201500464A (zh) * 2013-04-03 2015-01-01 Mitsui Chemicals Inc 聚醯胺酸、包含聚醯胺酸的清漆、乾膜、聚醯亞胺、聚醯亞胺積層體的製造方法、顯示器裝置的製造方法、觸控面板顯示器、液晶顯示器、有機電致發光顯示器以及聚醯亞胺膜
CN103755959A (zh) * 2014-01-22 2014-04-30 江苏亚宝绝缘材料股份有限公司 一种柔性透明聚酰亚胺薄膜

Also Published As

Publication number Publication date
TW201942195A (zh) 2019-11-01
CN111936553A (zh) 2020-11-13
JPWO2019188305A1 (ja) 2021-05-13
KR20200135953A (ko) 2020-12-04
JP7424284B2 (ja) 2024-01-30
WO2019188305A1 (ja) 2019-10-03

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