A. 切晶帶之整體構成
圖1係本發明之一實施形態之切晶帶之概略剖視圖。切晶帶100具備基材層10及配置於基材層10之至少單側之黏著劑層20。黏著劑層20由包含作為基礎聚合物之(甲基)丙烯酸系聚合物及塑化劑(a1)之黏著劑形成。基材層10包含聚氯乙烯系樹脂及塑化劑。基材層10包含具有與黏著劑所含之塑化劑(a1)相同之構造之塑化劑，更具體而言包含自黏著劑轉移之塑化劑(a1)(詳見後述)。再者，雖未圖示，但本發明之切晶帶於直至供於使用為止之期間，出於保護黏著面之目的，可於黏著劑層之外側設置有剝離襯墊。 本發明之切晶帶藉由利用包含特定塑化劑(a1)之黏著劑來形成黏著劑層，即便塑化劑於基材層/黏著劑層之間轉移，基材層中之塑化劑亦不會減少，可維持基材層之柔軟性。更詳細而言，先前之切晶帶、即具有由不含塑化劑之黏著劑構成之黏著劑層之切晶帶中，基材層中之塑化劑會向黏著劑層轉移，但於本發明中，塑化劑自基材層向黏著劑層轉移，另一方面，塑化劑亦自黏著劑層向基材層轉移。其結果，基材層中之塑化劑不會減少，可維持基材層之柔軟性。此種切晶帶擴展性優異，可有助於提高晶片之拾取性。又，藉由形成柔軟性優異之基材層，能夠得到基材層與黏著劑層之密接性優異之切晶帶。此種切晶帶可防止黏著劑層自基材層剝離，並且防止因該剝離而產生氣泡。 切晶帶之厚度較佳為30 μm～300 μm，更佳為50 μm～200 μm，尤佳為60 μm～125 μm。 切晶帶於25℃下之黏著力較佳為0.3 N/20mm～3 N/20mm，更佳為0.4 N/20mm～2.5 N/20mm。再者，本說明書中之黏著力係指：以鏡面晶圓(矽製)作為試驗板，利用基於JIS Z 0237(2000)之方法(貼合條件：2 kg輥往返1次、熟化：於測定溫度下實施1小時、剝離速度：300 mm/分鐘、剝離角度：90°)測定所得之黏著力。 切晶帶於25℃下0～10%應變(伸長率)時之最大拉伸應力較佳為2000 N/cm2
以下，更佳為500～1500 N/cm2
。上述最大拉伸應力係按照JIS-K-7127(1999年)，利用INSTRON型拉伸試驗機(島津製作所製、自動繪圖儀)進行測定。具體而言，「0～10%應變(伸長率)時之最大拉伸應力」係將寬10 mm×長150 mm之樣品以夾具間距離為50 mm之形式設置後，以300 m/分鐘之拉伸速度拉伸至應變(伸長率)為10%為止時之最大應力值。B. 黏著劑層
上述黏著劑層可藉由(甲基)丙烯酸系黏著劑形成。(甲基)丙烯酸系黏著劑可為熱硬化型黏著劑、活性能量射線硬化型黏著劑等硬化型黏著劑，亦可為壓敏型黏著劑。形成黏著劑層之黏著劑進而包含塑化劑(a1)。 上述(甲基)丙烯酸系黏著劑包含作為基礎聚合物之(甲基)丙烯酸系聚合物。上述(甲基)丙烯酸系聚合物可由包含(甲基)丙烯酸酯作為主單體之單體成分構成。於(甲基)丙烯酸系聚合物中，源自(甲基)丙烯酸酯之構造單元之含有比率相對於(甲基)丙烯酸系聚合物100重量份較佳為50重量份以上，更佳為70重量份～100重量份，進而較佳為80重量份～90重量份。上述單體成分中之單體可僅為1種，亦可為2種以上。 作為(甲基)丙烯酸酯，可列舉出例如碳數為1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯、含羥基之(甲基)丙烯酸酯等。(甲基)丙烯酸酯可僅為1種，亦可為2種以上。 作為碳數為1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯，例如可列舉出：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯(Pentyl (meta)acrylate)、(甲基)丙烯酸戊酯(amyl (meta)acrylate)、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯、(甲基)丙烯酸月桂酯等碳數為1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯等。該等(甲基)丙烯酸酯之中，較佳為(甲基)丙烯酸丁酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸異壬酯。 作為含羥基之(甲基)丙烯酸酯，可列舉出例如(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸-4-羥基丁酯等。 構成上述(甲基)丙烯酸系聚合物之單體成分亦可進而包含能夠與(甲基)丙烯酸酯共聚之其它單體。作為其它單體，可列舉出例如下述單體。其它單體可僅為單獨1種，或者組合使用2種以上。 含羧基之單體：例如，丙烯酸(AA)、甲基丙烯酸(MAA)、丁烯酸等乙烯性不飽和單羧酸；馬來酸、衣康酸、檸康酸等乙烯性不飽和二羧酸及其酸酐(馬來酸酐、衣康酸酐等)； 含羥基之單體：例如，乙烯醇、烯丙醇等不飽和醇類；2-羥基乙基乙烯基醚、4-羥基丁基乙烯基醚、二乙二醇單乙烯醚等醚系化合物； 含氨基之單體；含環氧基之單體；含氰基之單體；含酮基之單體；具有含氮原子環之單體；含烷氧基甲矽烷基之單體。 源自上述其它單體之構造單元之含有比率相對於(甲基)丙烯酸系聚合物100重量份較佳為50重量份以下，更佳為0.1重量份～50重量份，進而較佳為1重量份～30重量份。若為此種範圍，則能夠形成內聚力高且密接性優異之黏著劑層。 上述(甲基)丙烯酸系聚合物之重量平均分子量較佳為20萬～300萬，更佳為25萬～150萬。重量平均分子量可藉由GPC(溶劑：THF)進行測定。 作為上述活性能量射線硬化型黏著劑，可使用包含任意適當之(甲基)丙烯酸系聚合物之黏著劑。較佳使用包含具有至少一個硬化性官能團(例如，丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、乙炔基等碳-碳多鍵)之(甲基)丙烯酸系聚合物及光聚合起始劑之黏著劑。此外，可使用包含(甲基)丙烯酸系聚合物、硬化性之單體成分及/或硬化性之低聚物成分、光聚合起始劑之黏著劑。作為硬化性之單體成分及/或硬化性之低聚物成分，可列舉出包含具有丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、乙炔基等碳-碳多鍵之官能團之光反應性單體或低聚物。 作為上述黏著劑所含之塑化劑(a1)，例如可列舉出；對苯二甲酸酯系、間苯二甲酸酯系、鄰苯二甲酸酯系、偏苯三甲酸酯系、己二酸酯系(例如，己二酸二辛酯、己二酸二異壬酯等)、己二酸聚酯系、磷酸酯系(例如，磷酸三甲苯酯等)、檸檬酸酯系(例如，乙醯基檸檬酸三丁酯等)、癸二酸酯系、壬二酸酯系、馬來酸酯系、苯甲酸酯系、聚醚系聚酯、環氧系聚酯、聚酯(例如，由羧酸及二醇形成之低分子聚酯等)等塑化劑。塑化劑可僅為1種，亦可為2種以上。 於一實施形態中，作為上述塑化劑(a1)，可使用對苯二甲酸酯系塑化劑。作為對苯二甲酸酯系塑化劑，可列舉出例如對苯二甲酸二丁酯(DBTP)、對苯二甲酸二異丁酯(DIBTP)、對苯二甲酸二正己酯(DHTP)、對苯二甲酸雙(2-乙基己基)酯(DOTP)、對苯二甲酸二正辛酯(DnOTP)、對苯二甲酸二異壬酯(DINTP)、對苯二甲酸二壬酯(DNTP)、對苯二甲酸二異癸酯(DIDTP)、對苯二甲酸雙丁基苄酯(BBTP)等。其中，較佳為DOTP。 一直以來，鄰苯二甲酸雙(2-乙基己基)酯(DOP)、鄰苯二甲酸二丁酯(DBP)等常被用作塑化劑，但該等化合物成為受RoHS指令管控之對象。本發明中，較佳使用並非RoHS指令管控對象之塑化劑。作為此種塑化劑，可列舉出DOTP、鄰苯二甲酸二異壬酯、偏苯三甲酸三(2-乙基己基)酯、己二酸聚酯系化合物等。本發明中，即便使用此種塑化劑，亦能夠得到柔軟性優異之切晶帶。 相對於黏著劑中之(甲基)丙烯酸系聚合物100重量份，上述黏著劑所含之塑化劑(a1)之含有比率較佳為10重量份～150重量份，更佳為20重量份～100重量份，進而較佳為30重量份～50重量份。若為此種範圍，則塑化劑於基材層/黏著劑層之間之轉移得以推進，其結果，能夠得到柔軟性優異之切晶帶。再者，「黏著劑所含之塑化劑(a1)之含有比率」係指將黏著劑塗佈於基材薄膜之前之塑化劑(a1)之含有比率，應留意對其與將黏著劑塗佈於基材薄膜之後(即，塑化劑於基材層/黏著劑層之間之轉移得以推進後)之黏著劑層所含之塑化劑之含有比率加以區分。本說明書中，將黏著劑塗佈於基材薄膜之後之黏著劑層所含之塑化劑簡稱為「黏著劑層所含之塑化劑」。由於塑化劑於黏著劑層/基材層之間轉移，因此，「黏著劑層所含之塑化劑」可為塑化劑(a1)及/或基材薄膜所含之塑化劑(a2)。再者，相對於(甲基)丙烯酸系聚合物100重量份，黏著劑層所含之塑化劑之含有比率較佳為1重量份～150重量份，更佳為2重量份～100重量份。 上述黏著劑亦可進而包含任意之適當之添加劑。作為上述添加劑，例如可列舉出聚合起始劑、交聯劑、黏著性賦予劑、防老劑、填充劑、著色劑、抗靜電劑、界面活性劑等。上述添加劑可單獨使用，亦可組合使用2種以上。使用2種以上之添加劑時，可1種1種地添加，亦可同時添加2種以上之添加劑。上述添加劑之調配量可設定為任意適當之量。 上述黏著劑層之厚度較佳為5 μm～200 μm，更佳為5 μm～100 μm。C. 基材層
基材層包含聚氯乙烯系樹脂及塑化劑。再者，如上所述，對於本發明之切晶帶而言，塑化劑可於基材層/黏著劑層之間轉移，本說明書中，「基材層」係指構成切晶帶之層(即，塗佈黏著劑後、塑化劑轉移後之層)。此外，將塗佈黏著劑之前之薄膜(即，作為材料之薄膜)稱為「基材薄膜」。 上述基材薄膜較佳包含塑化劑(a2)。即，本發明之切晶帶較佳使用包含塑化劑(a2)之基材薄膜，並對該基材薄膜塗佈包含塑化劑(a1)之黏著劑來形成。作為基材薄膜所含之塑化劑(a2)，可使用上述B項中說明之塑化劑。較佳使用並非RoHS指令管控對象之塑化劑(例如，DOTP、鄰苯二甲酸二異壬酯、偏苯三甲酸三(2-乙基己基)酯、己二酸聚酯系化合物等)。 於一實施形態中，黏著劑及基材薄膜包含同一系列之塑化劑。換言之，於一實施形態中，上述塑化劑(a1)與塑化劑(a2)為同一系列。「同一系列之塑化劑」係指化學構造類似之塑化劑。例如，於塑化劑為酯系化合物之情況下，源自含氧酸(oxo acid)之部分(為高分子系化合物時係源自含氧酸之構造單元)相同且源自含羥基化合物之部分(為高分子系化合物時係平均一個源自含羥基化合物之構造單元)之分子量差異處於288以下之酯系化合物群符合「同一系列之塑化劑」。作為「同一系列之塑化劑」之例，可列舉出例如鄰苯二甲酸雙(2-乙基己基)酯(DOP)與對苯二甲酸雙(2-乙基己基)酯(DOTP)之組合、DOP與鄰苯二甲酸二異壬酯之組合。於一實施形態中，黏著劑及基材薄膜包含相同之塑化劑。再者，黏著劑及基材薄膜包含複數種塑化劑時，可全部均為「同一系列之塑化劑」或「相同之塑化劑」，亦可至少1種為「同一系列之塑化劑」或「相同之塑化劑」。 相對於基材薄膜中之聚氯乙烯系樹脂100重量份，上述基材薄膜中之塑化劑(a2)之含有比率較佳為10重量份～80重量份，更佳為15重量份～50重量份。若為此種範圍，則會形成柔軟性優異之基材層，能夠得到對於拉伸等變形之追隨性優異、拾取性良好之切晶帶。再者，相對於基材層中之聚氯乙烯系樹脂100重量份，上述基材層中之塑化劑之含有比率(即，塑化劑(a1)與塑化劑(a2)之總含有比率)較佳為15重量份～80重量份，更佳為20重量份～60重量份。基材層中之塑化劑之含量較佳多於基材薄膜中之塑化劑(a2)之含量。 上述基材薄膜於不損害本發明效果之範圍內可包含任意適當之其它成分。 上述基材薄膜之按照JIS-K-7127(1999年)測定之最大伸長率較佳為100%以上，更佳為200%～1000%。藉由使用顯示出此種最大伸長率之基材薄膜，能夠得到具有適當之伸長率性且擴展性優異之切晶帶。最大伸長率可以於23℃之環境下以300 mm/分鐘之拉伸速度進行測定。 上述基材薄膜之按照JIS-K-7127(1999年)測定之拉伸強度較佳為1000 N/cm2
～8000 N/cm2
，更佳為3000 N/cm2
～6000 N/cm2
。藉由使用顯示出此種拉伸強度之基材薄膜，能夠得到擴展性優異之切晶帶。拉伸強度係於23℃之環境下以300 mm/分鐘之拉伸速度進行拉伸試驗時之斷裂時之強度。 上述基材薄膜可藉由任意之適當製造方法來製造。例如，可以藉由注射成形、擠出成形、吹脹成形、壓延成形、吹塑成形等成形方法來獲得基材薄膜。 如上所述，上述基材層包含具有與上述黏著劑所含之塑化劑(a1)相同之構造之塑化劑。更詳細而言，將黏著劑塗佈於基材薄膜後，該黏著劑所含之塑化劑(a1)轉移至基材薄膜，其結果，形成包括具有與黏著劑所含之塑化劑相同之構造之塑化劑之基材層。於一實施形態中，基材層含有基材薄膜所含之塑化劑(a2)及黏著劑所含之塑化劑(a1)。 基材層之厚度較佳為20 μm～300 μm，更佳為30 μm～200 μm，進而較佳為40 μm～150 μm。基材之厚度過薄時，處理性有可能變差。基材之厚度過厚時，有可能對於拉伸等變形之追隨性變差、拾取性降低。D. 切晶帶之製造方法
本發明之切晶帶之製造方法包括於上述基材薄膜上塗佈上述黏著劑，從而形成黏著劑層。 如上所述，基材薄膜包含聚氯乙烯系樹脂及塑化劑(a2)。此外，黏著劑包含(甲基)丙烯酸系聚合物及塑化劑(a1)。於一實施形態中，塑化劑(a1)及塑化劑(a2)為同一系列之塑化劑，較佳為相同之塑化劑。 將黏著劑塗佈於基材薄膜之前，相對於聚氯乙烯系樹脂100重量份，基材薄膜中之塑化劑(a2)之含有比率較佳為10重量份～80重量份，更佳為15重量份～50重量份。 將黏著劑塗佈於基材薄膜之前，相對於(甲基)丙烯酸系聚合物100重量份，黏著劑中之塑化劑(a1)之含有比率較佳為10重量份～150重量份，更佳為20重量份～100重量份，進而較佳為30重量份～50重量份。 將黏著劑塗佈於基材薄膜之前，黏著劑中之塑化劑(a1)之含有重量份較佳為基材薄膜中之塑化劑(a2)之含有重量份之1倍～10倍、更佳為1倍～5倍、進而較佳為1.5倍～3倍。若為此種範圍，則能夠形成包括具有與黏著劑所含之塑化劑相同之構造之塑化劑之基材層，能夠得到柔軟性優異之切晶帶。 黏著劑之塗佈例如可藉由將黏著劑塗佈於基材薄膜，並使塗佈層加熱乾燥來進行。作為塗佈方法，可以採用棒塗機塗佈、氣刀塗佈、凹版塗佈、凹版逆轉塗佈、逆轉輥塗佈、唇塗佈、模塗佈、浸漬塗佈、膠版印刷、柔版印刷、絲網印刷等各種方法。加熱乾燥之溫度例如為80℃～200℃。 藉由將黏著劑塗佈於基材薄膜，能夠得到具備基材層及黏著劑層之切晶帶。本發明之切晶帶中，塑化劑於基材層/黏著劑層之間轉移之結果，基材層可含有基材薄膜所含之塑化劑(a2)及/或黏著劑所含之塑化劑(a1)，黏著劑層亦可含有基材薄膜所含之塑化劑(a2)及/或黏著劑所含之塑化劑(a1)。將黏著劑塗佈於基材薄膜後，黏著劑層中之塑化劑之含量較佳達到塗佈前之黏著劑中之塑化劑(a1)之含量以下。將黏著劑塗佈於基材薄膜後，黏著劑層中之塑化劑之含量相對於塗佈前之黏著劑中之塑化劑(a1)之重量較佳為10重量%～100重量%，更佳為20重量%～80重量%，進而較佳為30重量%～60重量%。基材層中之塑化劑之含量較佳為基材薄膜中之塑化劑(a2)之含量以上。 作為黏著劑而使用硬化型之黏著劑時，可以對黏著劑層實施硬化處理，從而調整該黏著劑層之特性(黏著力、彈性模量等)。作為硬化處理，例如可列舉出紫外線照射、加熱處理等。 使用切晶帶進行擴展時，該擴展可使用以往公知之擴展裝置進行。擴展裝置具有：能夠借助切割環將切晶帶向下方按壓之環狀之外環、以及直徑小於外環且支承切晶帶之內環。藉由該擴展步驟，於作為後續步驟之拾取步驟中，能夠防止相鄰之半導體晶片彼此接觸而破損。 擴展速度較佳為0.1 mm/秒以上、更佳為1 mm/秒以上。為0.1 mm/秒以上時，可容易地切斷。另一方面，對擴展速度之上限並無特別限定。 [實施例] 以下，藉由實施例來具體說明本發明，但本發明不限定於該等實施例。此外，於實施例中，若未特別記載，則「份」及「%」為重量基準。 〔製造例1〕：基材薄膜(1)之製造 利用壓延法，將相對於聚氯乙烯100重量份包含DOP塑化劑20重量份之基材薄膜(1)製膜。所得基材薄膜(1)之厚度為70 μm，最大伸長率(拉伸速度為300 mm/分鐘)為320%，拉伸強度(拉伸速度為300 mm/分鐘時之斷裂時強度)為3600 N/cm2
。 〔製造例2〕：基材薄膜(2)之製造 利用壓延法，將相對於聚氯乙烯100重量份包含DOTP塑化劑20重量份之基材薄膜(1)製膜。所得基材薄膜(1)之厚度為70 μm，最大伸長率(拉伸速度為300 mm/分鐘)為290%，拉伸強度(拉伸速度為300 mm/分鐘時之斷裂時強度)為5200 N/cm2
。 [實施例1] 製備包含由丙烯酸丁酯(BA)/丙烯腈(AN)/丙烯酸(AA)=85/15/2.5(重量比)構成之丙烯酸系聚合物100重量份、三聚氰胺系交聯劑(丁醇改性三聚氰胺甲醛樹脂、DIC Corporation製、商品名「SUPER BECKAMINE J-820-60N」)10重量份、DOP塑化劑30重量份及甲苯之黏著劑(1)。將該黏著劑(1)塗佈於上述基材薄膜(1)後，以130℃乾燥90秒，形成厚度為10 μm之黏著劑層。 接著，於該黏著劑層面上貼合單面用矽酮進行了剝離處理且厚度為38 μm之剝離襯墊(聚酯薄膜、商品名：MRF、三菱化學聚酯株式會社製)，以50℃保存72小時，得到切晶帶1。 [實施例2] 除了使用DOTP塑化劑30重量份來代替DOP塑化劑30重量份之外，與實施例1同樣地製備黏著劑(2)。將該黏著劑(2)塗佈於上述基材薄膜(2)後，以150℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶2。 [實施例3] 除了將DOP塑化劑之調配量設為50重量份之外，與實施例1同樣地製備黏著劑(3)。將該黏著劑(3)塗佈於上述基材薄膜(1)後，以130℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶3。 [實施例4] 除了將DOTP塑化劑之調配量設為50重量份之外，與實施例2同樣地製備黏著劑(4)。將該黏著劑(4)塗佈於上述基材薄膜(2)後，以130℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶4。 [比較例1] 除了不添加塑化劑之外，與實施例1同樣地製備黏著劑(5)。將該黏著劑(5)塗佈於作為基材薄膜之聚乙烯後，以130℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶。 [比較例2] 除了不添加塑化劑之外，與實施例1同樣地製備黏著劑(5)。將該黏著劑(5)塗佈於基材薄膜(1)後，以130℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶。 [比較例3] 除了不添加塑化劑之外，與實施例1同樣地製備黏著劑(5)。將該黏著劑(5)塗佈於基材薄膜(2)後，以130℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶。 [參考例1] 除了將DOP塑化劑之調配量設為5重量份之外，與實施例1同樣地製備黏著劑(6)。將該黏著劑(6)塗佈於基材薄膜(1)後，以130℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶。 [參考例2] 除了將DOTP塑化劑之調配量設為5重量份之外，與實施例2同樣地製備黏著劑(7)。將該黏著劑(7)塗佈於上述基材薄膜(2)後，以130℃乾燥90秒，從而形成厚度為10 μm之黏著劑層，於黏著劑層面貼合單面用矽酮進行了剝離處理之聚酯薄膜(剝離襯墊)，從而得到切晶帶。 [評價]擴展性 按照下述方法及基準，評價實施例及比較例中得到之切晶帶之擴展性。將結果示於表1。 (1)於8英吋之切割環上貼合剝掉剝離襯墊之切晶帶。 (2)按照下述條件僅對切晶帶進行切割。 ＜切割條件＞ 切割尺寸：0.8 mm×0.8 mm 裝置：DISCO公司製、「DFD-6450」 切刀：DISCO公司製、「NBC-ZH 205O-SE 27HECC」 單次切割(single cut) 主軸：40000 rpm 切割速度：80 mm/秒 刀片高度：45 um (3)將切割後之切晶帶置於擴展裝置。 (4)按照下述擴張條件、擴張速度來擴展切晶帶。 ＜擴展條件＞ 擴展裝置：OEX-840II(大宮工業株式會社製) 擴張條件：頂起量為40mm 擴張速度：3mm/秒 基台溫度：室溫 (評價基準)將切晶帶於擴展時破裂之情況記作不合格(表1中為×)、將未破裂之情況記作合格(表1中為〇)。 [表1] A. Overall structure of crystal cutting tape Fig. 1 is a schematic cross-sectional view of a crystal cutting tape according to an embodiment of the present invention. The dicing tape 100 includes a base layer 10 and an adhesive layer 20 disposed on at least one side of the base layer 10 . The adhesive layer 20 is formed of an adhesive containing a (meth)acrylic polymer as a base polymer and a plasticizer (a1). The base material layer 10 contains a polyvinyl chloride resin and a plasticizer. The base material layer 10 includes a plasticizer having the same structure as the plasticizer (a1) contained in the adhesive, more specifically, includes a plasticizer (a1) transferred from the adhesive (details will be described later). Furthermore, although not shown, the crystal dicing tape of the present invention may be provided with a release liner on the outside of the adhesive layer for the purpose of protecting the adhesive surface until it is used. The dicing tape of the present invention forms an adhesive layer by using an adhesive containing a specific plasticizer (a1), even if the plasticizer transfers between the base layer/adhesive layer, the plasticizer in the base layer It will not be reduced, and the flexibility of the base layer can be maintained. More specifically, in the conventional dicing tape, that is, in the dicing tape having an adhesive layer composed of an adhesive containing no plasticizer, the plasticizer in the substrate layer would transfer to the adhesive layer, but in In the present invention, the plasticizer is transferred from the substrate layer to the adhesive layer, and on the other hand, the plasticizer is also transferred from the adhesive layer to the substrate layer. As a result, the plasticizer in the base layer does not decrease, and the flexibility of the base layer can be maintained. This kind of dicing tape has excellent expandability, which can help to improve the pick-up of chips. Moreover, by forming the base material layer excellent in flexibility, the dicing tape excellent in the adhesiveness of a base material layer and an adhesive layer can be obtained. Such crystal cutting tape can prevent the peeling of the adhesive layer from the substrate layer, and prevent the generation of air bubbles due to the peeling. The thickness of the dicing tape is preferably 30 μm-300 μm, more preferably 50 μm-200 μm, most preferably 60 μm-125 μm. The adhesive force of the dicing tape at 25°C is preferably 0.3 N/20mm to 3 N/20mm, more preferably 0.4 N/20mm to 2.5 N/20mm. Furthermore, the adhesive force in this specification refers to: using a mirror wafer (made of silicon) as a test plate, using a method based on JIS Z 0237 (2000) (bonding conditions: 2 kg roller back and forth once, aging: measured at Carried out at temperature for 1 hour, peeling speed: 300 mm/min, peeling angle: 90°) to measure the obtained adhesive force. The maximum tensile stress of the diced ribbon at 25°C at 0-10% strain (elongation) is preferably less than 2000 N/cm 2 , more preferably 500-1500 N/cm 2 . The above-mentioned maximum tensile stress was measured in accordance with JIS-K-7127 (1999) with an INSTRON type tensile testing machine (manufactured by Shimadzu Corporation, automatic plotter). Specifically, the "maximum tensile stress at the time of 0-10% strain (elongation)" is a sample with a width of 10 mm x a length of 150 mm and a distance between clamps of 50 mm. Tensile speed The maximum stress value when stretching to a strain (elongation) of 10%. B. Adhesive layer The above-mentioned adhesive layer can be formed with a (meth)acrylic adhesive. The (meth)acrylic adhesive may be a curable adhesive such as a thermosetting adhesive or an active energy ray curable adhesive, or may be a pressure-sensitive adhesive. The adhesive forming the adhesive layer further contains a plasticizer (a1). The (meth)acrylic adhesive includes a (meth)acrylic polymer as a base polymer. The above-mentioned (meth)acrylic polymer may be composed of a monomer component containing (meth)acrylate as a main monomer. In the (meth)acrylic polymer, the content ratio of the structural unit derived from (meth)acrylate is preferably 50 parts by weight or more, more preferably 70 parts by weight, based on 100 parts by weight of the (meth)acrylic polymer. Parts by weight to 100 parts by weight, more preferably 80 parts by weight to 90 parts by weight. The monomer in the said monomer component may be only 1 type, and may be 2 or more types. Examples of (meth)acrylates include alkyl (meth)acrylates of alkyl groups (including cycloalkyl groups) having 1 to 30 carbon atoms, hydroxyl group-containing (meth)acrylates, and the like. (Meth)acrylate may be only 1 type, and may be 2 or more types. Examples of alkyl (meth)acrylates of alkyl (including cycloalkyl) having 1 to 30 carbon atoms include: methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate, Base) Propyl Acrylate, Isopropyl (Meth) Acrylate, Butyl (Meth) Acrylate, Isobutyl (Meth) Acrylate, Second Butyl (Meth) Acrylate, Tertiary Butyl (Meth) Acrylate ester, (meth) pentyl (meta) acrylate, (meth) pentyl (amyl (meta) acrylate), (meth) hexyl, (meth) cyclohexyl, ( Heptyl methacrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, (meth)acrylic acid Isononyl, Decyl (meth)acrylate, Isodecyl (meth)acrylate, Undecyl (meth)acrylate, Lauryl (meth)acrylate, Tridecyl (meth)acrylate Alkyl esters, myristyl (meth)acrylate, pentadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, (meth)acrylate Base) Alkyl (meth)acrylates of alkyl groups (including cycloalkyl groups) having 1 to 30 carbon atoms such as eicosyl acrylate and lauryl (meth)acrylate, etc. Among these (meth)acrylates, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and isononyl (meth)acrylate are preferable. Examples of hydroxyl-containing (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. wait. The monomer component which comprises the said (meth)acryl-type polymer may further contain the other monomer which can copolymerize with (meth)acrylate. As other monomers, the following monomers are mentioned, for example. Other monomers may be used alone or in combination of two or more. Carboxyl-containing monomers: for example, ethylenically unsaturated monocarboxylic acids such as acrylic acid (AA), methacrylic acid (MAA), and crotonic acid; ethylenically unsaturated dicarboxylic acids such as maleic acid, itaconic acid, and citraconic acid Acids and their anhydrides (maleic anhydride, itaconic anhydride, etc.); hydroxyl-containing monomers: for example, unsaturated alcohols such as vinyl alcohol and allyl alcohol; 2-hydroxyethyl vinyl ether, 4-hydroxybutylethylene Ether compounds such as diethylene glycol monovinyl ether and diethylene glycol monovinyl ether; amino-containing monomers; epoxy-containing monomers; cyano-containing monomers; ketone-containing monomers; Body; monomer containing alkoxysilyl group. The content ratio of the structural unit derived from the above-mentioned other monomer is preferably 50 parts by weight or less, more preferably 0.1 to 50 parts by weight, and still more preferably 1 part by weight, based on 100 parts by weight of the (meth)acrylic polymer. parts to 30 parts by weight. If it is such a range, the pressure-sensitive adhesive layer with high cohesive force and excellent adhesiveness can be formed. The weight average molecular weight of the above-mentioned (meth)acrylic polymer is preferably from 200,000 to 3 million, more preferably from 250,000 to 1.5 million. The weight average molecular weight can be measured by GPC (solvent: THF). As the active energy ray-curable adhesive, an adhesive containing any appropriate (meth)acrylic polymer can be used. It is preferable to use (meth)acrylic polymers and photopolymers containing at least one hardening functional group (such as acryl, methacryl, vinyl, allyl, ethynyl, etc. carbon-carbon multiple bonds). Adhesive for polymerization initiators. In addition, an adhesive containing a (meth)acrylic polymer, a curable monomer component and/or a curable oligomer component, and a photopolymerization initiator can be used. Examples of curable monomer components and/or curable oligomer components include functional groups having carbon-carbon multiple bonds such as acryl, methacryl, vinyl, allyl, and ethynyl. Photoreactive monomers or oligomers. Examples of the plasticizer (a1) contained in the adhesive include terephthalate, isophthalate, phthalate, trimellitate, Adipate esters (e.g., dioctyl adipate, diisononyl adipate, etc.), adipate polyesters, phosphate esters (e.g., tricresyl phosphate, etc.), citrates ( For example, acetyl tributyl citrate, etc.), sebacate, azelate, maleate, benzoate, polyether polyester, epoxy polyester, poly Plasticizers such as esters (for example, low-molecular-weight polyesters formed from carboxylic acids and diols, etc.). The plasticizer may be only 1 type, and may be 2 or more types. In one embodiment, a terephthalate-based plasticizer can be used as the plasticizer (a1). Examples of terephthalate-based plasticizers include dibutyl terephthalate (DBTP), diisobutyl terephthalate (DIBTP), di-n-hexyl terephthalate (DHTP), Bis(2-ethylhexyl) terephthalate (DOTP), Di-n-octyl terephthalate (DnOTP), Diisononyl terephthalate (DINTP), Dinonyl terephthalate (DNTP) ), diisodecyl terephthalate (DIDTP), bisbutylbenzyl terephthalate (BBTP), etc. Among them, DOTP is preferred. Bis(2-ethylhexyl) phthalate (DOP) and dibutyl phthalate (DBP) have been used as plasticizers for a long time, but these compounds are subject to the control of RoHS directive . In the present invention, it is preferable to use plasticizers that are not controlled by the RoHS directive. Examples of such plasticizers include DOTP, diisononyl phthalate, tris(2-ethylhexyl) trimellitate, and adipate polyester compounds. In the present invention, even if such a plasticizer is used, a dicing tape excellent in flexibility can be obtained. The content ratio of the plasticizer (a1) contained in the adhesive is preferably 10 to 150 parts by weight, more preferably 20 parts by weight, relative to 100 parts by weight of the (meth)acrylic polymer in the adhesive. ~100 parts by weight, more preferably 30 parts by weight to 50 parts by weight. If it is such a range, the transfer of the plasticizer between the base material layer and the adhesive layer is promoted, and as a result, a dicing tape excellent in flexibility can be obtained. In addition, "the content ratio of the plasticizer (a1) contained in the adhesive" refers to the content ratio of the plasticizer (a1) before the adhesive is applied to the base film. The content ratio of the plasticizer contained in the adhesive layer after coating on the base film (that is, after the transfer of the plasticizer between the base layer/adhesive layer is promoted) is differentiated. In this specification, the plasticizer contained in the adhesive layer after applying the adhesive to the base film is simply referred to as "the plasticizer contained in the adhesive layer". Since the plasticizer is transferred between the adhesive layer/substrate layer, the "plasticizer contained in the adhesive layer" can be the plasticizer (a1) and/or the plasticizer contained in the substrate film ( a2). Furthermore, the content ratio of the plasticizer contained in the adhesive layer is preferably 1 to 150 parts by weight, more preferably 2 to 100 parts by weight, based on 100 parts by weight of the (meth)acrylic polymer. . The above-mentioned adhesive may further contain any appropriate additives. Examples of the above-mentioned additives include polymerization initiators, crosslinking agents, tackiness imparting agents, antioxidants, fillers, colorants, antistatic agents, and surfactants. These additives may be used alone or in combination of two or more. When two or more additives are used, they may be added one by one, or two or more additives may be added simultaneously. The compounding quantity of the said additive can be set to arbitrary appropriate quantity. The thickness of the adhesive layer is preferably from 5 μm to 200 μm, more preferably from 5 μm to 100 μm. C. Substrate layer The substrate layer contains a polyvinyl chloride resin and a plasticizer. Furthermore, as mentioned above, for the dicing tape of the present invention, the plasticizer can be transferred between the substrate layer/adhesive layer. In this specification, the "substrate layer" refers to the layer that constitutes the dicing tape (That is, the layer after the adhesive is applied and the plasticizer is transferred). In addition, the film (namely, the film which is a material) before applying an adhesive agent is called "substrate film". The above-mentioned base film preferably contains a plasticizer (a2). That is, the dicing tape of the present invention is preferably formed by using a base film containing the plasticizer (a2), and coating the base film with an adhesive containing the plasticizer (a1). As the plasticizer (a2) contained in the base film, the plasticizers described in the above section B can be used. It is preferable to use plasticizers that are not controlled by the RoHS directive (for example, DOTP, diisononyl phthalate, tris(2-ethylhexyl) trimellitate, adipate polyester compounds, etc.). In one embodiment, the adhesive and the base film contain the same series of plasticizers. In other words, in one embodiment, the above-mentioned plasticizer (a1) and the plasticizer (a2) are of the same series. "Plasticizers of the same series" refers to plasticizers with similar chemical structures. For example, when the plasticizer is an ester compound, the part derived from oxo acid (the structural unit derived from oxo acid in the case of a polymer compound) is the same and derived from the hydroxyl-containing compound Part of the ester compound group (in the case of a polymer compound, an average of one structural unit derived from a hydroxyl-containing compound) with a molecular weight difference of 288 or less meets the "plasticizer of the same series". Examples of "plasticizers of the same series" include bis(2-ethylhexyl) phthalate (DOP) and bis(2-ethylhexyl) terephthalate (DOTP). Combination, combination of DOP and diisononyl phthalate. In one embodiment, the adhesive and the base film contain the same plasticizer. Furthermore, when the adhesive and base film contain multiple plasticizers, all of them may be "plasticizers of the same series" or "plasticizers of the same type", or at least one of them may be "plasticizers of the same series". agent" or "the same plasticizer". With respect to 100 parts by weight of the polyvinyl chloride-based resin in the base film, the content ratio of the plasticizer (a2) in the base film is preferably 10 parts by weight to 80 parts by weight, more preferably 15 parts by weight to 50 parts by weight. parts by weight. If it is within such a range, a base layer having excellent flexibility is formed, and a dicing tape having excellent followability to deformation such as stretching and good pick-up properties can be obtained. Furthermore, with respect to 100 parts by weight of the polyvinyl chloride-based resin in the base layer, the content ratio of the plasticizer in the base layer (that is, the total content of the plasticizer (a1) and the plasticizer (a2) ratio) is preferably 15 to 80 parts by weight, more preferably 20 to 60 parts by weight. The content of the plasticizer in the substrate layer is preferably higher than the content of the plasticizer (a2) in the substrate film. The said base film may contain arbitrary appropriate other components in the range which does not impair the effect of this invention. The above base film has a maximum elongation measured in accordance with JIS-K-7127 (1999), preferably at least 100%, more preferably 200% to 1000%. By using a base film showing such a maximum elongation, a slit tape having appropriate elongation and excellent expandability can be obtained. The maximum elongation can be measured at a tensile speed of 300 mm/min in an environment of 23°C. The above-mentioned base film has a tensile strength measured in accordance with JIS-K-7127 (1999), preferably from 1000 N/cm 2 to 8000 N/cm 2 , more preferably from 3000 N/cm 2 to 6000 N/cm 2 . By using a base film exhibiting such tensile strength, a diced tape excellent in expandability can be obtained. Tensile strength is the strength at break when a tensile test is performed at a tensile speed of 300 mm/min in an environment of 23°C. The said base film can be manufactured by arbitrary appropriate manufacturing methods. For example, the base film can be obtained by molding methods such as injection molding, extrusion molding, inflation molding, calender molding, and blow molding. As mentioned above, the said base material layer contains the plasticizer which has the same structure as the plasticizer (a1) contained in the said adhesive agent. More specifically, after the adhesive is applied to the base film, the plasticizer (a1) contained in the adhesive is transferred to the base film. The substrate layer of the plasticizer of the structure. In one embodiment, the base layer contains the plasticizer (a2) contained in the base film and the plasticizer (a1) contained in the adhesive. The thickness of the substrate layer is preferably from 20 μm to 300 μm, more preferably from 30 μm to 200 μm, and still more preferably from 40 μm to 150 μm. When the thickness of the base material is too thin, the handling property may be deteriorated. When the thickness of the base material is too thick, the followability to deformation such as stretching may be deteriorated, and the pick-up property may be reduced. D. Manufacturing method of dicing tape The manufacturing method of the dicing tape of the present invention includes coating the above-mentioned adhesive on the above-mentioned base film to form an adhesive layer. As mentioned above, a base film contains a polyvinyl chloride resin and a plasticizer (a2). In addition, the adhesive contains a (meth)acrylic polymer and a plasticizer (a1). In one embodiment, the plasticizer (a1) and the plasticizer (a2) are the same series of plasticizers, preferably the same plasticizer. Before the adhesive is applied to the base film, the content ratio of the plasticizer (a2) in the base film is preferably 10 to 80 parts by weight, more preferably 100 parts by weight of the polyvinyl chloride resin. 15 to 50 parts by weight. Before applying the adhesive to the substrate film, the content ratio of the plasticizer (a1) in the adhesive is preferably 10 to 150 parts by weight relative to 100 parts by weight of the (meth)acrylic polymer, and more preferably Preferably, it is 20 weight part - 100 weight part, More preferably, it is 30 weight part - 50 weight part. Before the adhesive is applied to the substrate film, the content of the plasticizer (a1) in the adhesive is preferably 1 to 10 times the content of the plasticizer (a2) in the substrate film. More preferably, it is 1 time - 5 times, More preferably, it is 1.5 times - 3 times. If it is within such a range, a base material layer including a plasticizer having the same structure as the plasticizer contained in the adhesive can be formed, and a dicing tape excellent in flexibility can be obtained. The application of the adhesive can be performed, for example, by applying the adhesive to the base film and heating and drying the applied layer. As the coating method, bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing can be used , screen printing and other methods. The temperature of heating and drying is, for example, 80°C to 200°C. By applying the adhesive to the base film, a dicing tape having a base layer and an adhesive layer can be obtained. In the dicing tape of the present invention, as a result of the transfer of the plasticizer between the substrate layer/adhesive layer, the substrate layer may contain the plasticizer (a2) contained in the substrate film and/or the plasticizer (a2) contained in the adhesive The plasticizer (a1), the adhesive layer may contain the plasticizer (a2) contained in the base film and/or the plasticizer (a1) contained in the adhesive. After coating the adhesive on the substrate film, the content of the plasticizer in the adhesive layer is preferably less than the content of the plasticizer (a1) in the adhesive before coating. After the adhesive is applied to the base film, the content of the plasticizer in the adhesive layer is preferably 10% by weight to 100% by weight relative to the weight of the plasticizer (a1) in the adhesive before coating, More preferably, it is 20 weight% - 80 weight%, More preferably, it is 30 weight% - 60 weight%. The content of the plasticizer in the base layer is preferably more than the content of the plasticizer (a2) in the base film. When a hardening type adhesive is used as the adhesive, the adhesive layer may be cured to adjust the properties of the adhesive layer (adhesive force, elastic modulus, etc.). As curing treatment, ultraviolet irradiation, heat treatment, etc. are mentioned, for example. When using a dicing tape to perform expansion, the expansion can be performed using a conventionally known expansion device. The expansion device has: an annular outer ring capable of pressing the crystal cutting belt downward by means of the cutting ring, and an inner ring with a diameter smaller than that of the outer ring and supporting the crystal cutting belt. By this expanding step, in the pick-up step which is a subsequent step, it is possible to prevent adjacent semiconductor wafers from contacting each other and being damaged. The expansion speed is preferably at least 0.1 mm/sec, more preferably at least 1 mm/sec. When it is 0.1 mm/sec or more, it can be cut easily. On the other hand, the upper limit of the expansion speed is not particularly limited. EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. In addition, in an Example, unless otherwise stated, "part" and "%" are based on weight. [Manufacturing example 1]: Manufacture of base film (1) The base film (1) containing 20 weight part of DOP plasticizers with respect to 100 weight part of polyvinyl chlorides was formed into a film by the calendering method. The obtained substrate film (1) had a thickness of 70 μm, a maximum elongation (stretching speed of 300 mm/min) of 320%, and a tensile strength (strength at break of a stretching speed of 300 mm/min) of 3600 N/cm 2 . [Manufacturing example 2]: Manufacture of the base film (2) The base film (1) containing 20 weight part of DOTP plasticizers with respect to 100 weight part of polyvinyl chlorides was formed into a film by the calendering method. The obtained substrate film (1) had a thickness of 70 μm, a maximum elongation (stretching speed of 300 mm/min) of 290%, and a tensile strength (strength at break of a stretching speed of 300 mm/min) of 5200 N/cm 2 . [Example 1] Preparation of 100 parts by weight of an acrylic polymer composed of butyl acrylate (BA)/acrylonitrile (AN)/acrylic acid (AA)=85/15/2.5 (weight ratio), and a melamine-based crosslinking agent Adhesive (1) of 10 parts by weight of (butanol-modified melamine formaldehyde resin, manufactured by DIC Corporation, trade name "SUPER BECKAMINE J-820-60N"), 30 parts by weight of DOP plasticizer, and toluene. After coating the adhesive (1) on the substrate film (1), it was dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. Next, a release liner (polyester film, trade name: MRF, manufactured by Mitsubishi Chemical Polyester Co., Ltd.) with a thickness of 38 μm that has been released with silicone on one side and made by Mitsubishi Chemical Polyester Co., Ltd. Preserve for 72 hours to obtain cut crystal zone 1. EXAMPLE 2 Except having used 30 weight part of DOTP plasticizers instead of 30 weight part of DOP plasticizers, it carried out similarly to Example 1, and produced the adhesive agent (2). After coating the adhesive (2) on the base film (2), dry it at 150°C for 90 seconds to form an adhesive layer with a thickness of 10 μm, and attach silicone on one side to the adhesive layer. The treated polyester film (release liner) was peeled off to obtain a dicing tape 2 . [Example 3] An adhesive (3) was prepared in the same manner as in Example 1 except that the compounded amount of the DOP plasticizer was 50 parts by weight. After coating the adhesive (3) on the base film (1), dry it at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm, and attach silicone on one side to the adhesive layer. The treated polyester film (release liner) was peeled off to obtain a dicing tape 3 . [Example 4] An adhesive (4) was prepared in the same manner as in Example 2 except that the compounded amount of the DOTP plasticizer was 50 parts by weight. After coating the adhesive (4) on the base film (2), dry it at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm, and attach silicone on one side to the adhesive layer. The treated polyester film (release liner) was peeled off to obtain a dicing tape 4 . [Comparative Example 1] An adhesive (5) was prepared in the same manner as in Example 1 except that no plasticizer was added. The adhesive (5) was coated on polyethylene as a base film, and dried at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm. Silicone was bonded on one side of the adhesive layer. The treated polyester film (release liner) was peeled off to obtain a dicing tape. [Comparative Example 2] An adhesive (5) was prepared in the same manner as in Example 1 except that no plasticizer was added. After coating the adhesive (5) on the base film (1), dry it at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm, and peel off the adhesive layer with silicone on one side. Treated polyester film (release liner) to obtain crystal dicing tape. [Comparative Example 3] An adhesive (5) was prepared in the same manner as in Example 1 except that no plasticizer was added. After coating the adhesive (5) on the substrate film (2), dry it at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm, and peel it off with silicone on one side of the adhesive layer. Treated polyester film (release liner) to obtain crystal dicing tape. REFERENCE EXAMPLE 1 An adhesive (6) was prepared in the same manner as in Example 1 except that the compounding amount of the DOP plasticizer was 5 parts by weight. After coating the adhesive (6) on the substrate film (1), dry it at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm, and peel it off with silicone on one side of the adhesive layer. Treated polyester film (release liner) to obtain crystal dicing tape. REFERENCE EXAMPLE 2 An adhesive (7) was prepared in the same manner as in Example 2 except that the compounded amount of the DOTP plasticizer was 5 parts by weight. After coating the adhesive (7) on the base film (2), dry it at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm, and attach silicone on one side to the adhesive layer. The treated polyester film (release liner) was peeled off to obtain a dicing tape. [Evaluation] Spreadability The spreadability of the cut crystal tapes obtained in Examples and Comparative Examples was evaluated according to the following method and criteria. The results are shown in Table 1. (1) Lay the dicing tape with the release liner off on the 8-inch dicing ring. (2) Only the dicing tape was diced under the following conditions. <Cutting conditions> Cutting size: 0.8 mm×0.8 mm Device: DISCO Corporation, "DFD-6450" Cutter: DISCO Corporation, "NBC-ZH 205O-SE 27HECC" Single cut (single cut) Spindle: 40000 rpm Cutting speed: 80 mm/sec Blade height: 45 um (3) Place the cut crystal tape on the extension device. (4) Expand the cut zone according to the following expansion conditions and expansion speeds. <Expansion conditions> Expansion device: OEX-840II (manufactured by Omiya Industrial Co., Ltd.) Expansion conditions: Jack-up amount: 40mm Expansion speed: 3mm/sec Abutment temperature: Room temperature (evaluation standard) Cut crystal tape before it breaks during expansion The case was marked as unacceptable (x in Table 1), and the case of no rupture was marked as pass (o in Table 1). [Table 1]
