KR20170132088A - Dicing tape - Google Patents

Abstract

Provided is a dicing tape having good flexibility and excellent expandability. The dicing tape of the present invention comprises a base layer and an adhesive layer disposed on at least one side of the base layer, wherein an adhesive forming the adhesive layer comprises a (meth) acrylic polymer and a plasticizer, and the base layer comprises a polyvinyl chloride resin and a plasticizer having the same structure as the plasticizer contained in the adhesive. In one embodiment, the plasticizer contained in the adhesive is terephthalic acid bis (2-ethylhexyl), phthalate diisononyl and/or adipic acid polyester plasticizer.

Description

Dicing tape {DICING TAPE}

The present invention relates to a dicing tape.

Generally, in a semiconductor integrated circuit, after a high-purity silicon single crystal or the like is sliced into a wafer, a predetermined circuit pattern such as IC is etched on the surface of the wafer to etch the integrated circuit and then the back surface of the wafer is ground by a grinder, And dicing them into chips. At the time of dicing, a dicing tape is attached to the wafer, the wafer is diced in a fixed state, and then the dicing tape is extended to separate the chips from each other. Thereafter, the chips are picked up by the needles have.

BACKGROUND ART [0002] In recent years, with the miniaturization of electronic devices, semiconductor wafers have been made thinner, and thin wafers are likely to be damaged in the manufacturing process. Therefore, in order to prevent the chip from being damaged by reducing the load on the semiconductor wafer generated during expansion or pickup, higher durability and stress relaxation property are required.

In order to obtain a dicing tape satisfying the above characteristics, a polyvinyl chloride film is often used as a base material of the dicing tape. In general, a polyvinyl chloride film is formed by molding a resin composition obtained by adding a plasticizer and other additives (stabilizer, lubricant, colorant, filler, etc.) to a polyvinyl chloride resin in the form of a tape, Thereby imparting flexibility to the film (for example, Patent Documents 1 and 2). However, even in the case of a polyvinyl chloride film imparted with flexibility by adding a plasticizer, when a dicing tape is formed using the film (that is, when a pressure-sensitive adhesive layer is formed on a polyvinyl chloride film) Is still insufficient.

Japanese Patent Application Laid-Open No. 9-235522 Japanese Patent Application Laid-Open No. 2011-49753

The inventors of the present invention have studied the cause of the insufficient flexibility of the dicing tape and have found that the flexibility of the base material is lowered due to the movement (migration) of the plasticizer contained in the base material of the dicing tape to the pressure sensitive adhesive layer, The flexibility was found to be lowered.

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a dicing tape having good flexibility and excellent expandability. More specifically, the present invention is to provide a dicing tape excellent in expandability, without deteriorating the flexibility possessed by the base material.

The dicing tape of the present invention comprises a base layer and a pressure-sensitive adhesive layer disposed on at least one side of the base layer, wherein the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer comprises a (meth) acrylic polymer and a plasticizer, Layer comprises a polyvinyl chloride resin and a plasticizer having the same structure as the plasticizer contained in the pressure-sensitive adhesive.

In one embodiment, the plasticizer contained in the pressure-sensitive adhesive is bis (2-ethylhexyl) terephthalate, diisononyl phthalate, trimellitate tris (2-ethylhexyl) and / or adipic acid polyester plasticizers .

According to another aspect of the present invention, a method of manufacturing a dicing tape is provided. (Meth) acryl-based polymer and a plasticizer (a1) before the application of the pressure-sensitive adhesive on the base film, wherein the pressure-sensitive adhesive is applied to the substrate film by applying a pressure- Wherein the base film comprises a polyvinyl chloride resin and a plasticizer (a2), wherein the content of the plasticizer (a1) is 10 parts by weight to 150 parts by weight (100 parts by weight) relative to 100 parts by weight of the And the content of the plasticizer (a2) is 10 parts by weight to 80 parts by weight with respect to 100 parts by weight of the polyvinyl chloride resin. After applying the pressure-sensitive adhesive to the base film, the plasticizer ( a1) and the plasticizer (a2) is 10% by weight to 100% by weight based on the weight of the plasticizer (a1) in the pressure-sensitive adhesive before application.

In one embodiment, the plasticizer (a1) is terephthalic acid bis (2-ethylhexyl) phthalate diisononyl and / or adipic acid polyester plasticizer.

In one embodiment, the plasticizer (a1) and the plasticizer (a2) are the same series of plasticizers.

In one embodiment, the content of the plasticizer (a1) in the pressure-sensitive adhesive is 1 to 10 times the content of the plasticizer (a2) in the base film.

According to the present invention, since a plasticizer is added to both the base layer and the pressure-sensitive adhesive layer, a dicing tape having good flexibility and excellent expandability can be provided.

1 is a schematic sectional view of a dicing tape according to an embodiment of the present invention.

A. Dicing  Complete configuration of the tape

1 is a schematic cross-sectional view of a dicing tape according to one embodiment of the present invention. The dicing tape 100 includes a base layer 10 and a pressure-sensitive adhesive layer 20 disposed on at least one side of the base layer 10. [ The pressure-sensitive adhesive layer 20 is formed of a pressure-sensitive adhesive containing a (meth) acrylic polymer as the base polymer and a plasticizer (a1). The base layer 10 includes a polyvinyl chloride resin and a plasticizer. The substrate layer 10 includes a plasticizer having the same structure as the plasticizer (a1) contained in the pressure-sensitive adhesive, more specifically, a plasticizer (a1) transferred from the pressure-sensitive adhesive (details will be described later). Although not shown, the dicing tape of the present invention may be provided with a release liner on the outer side of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive surface until it is provided for use.

The dicing tape of the present invention is formed by forming the pressure-sensitive adhesive layer with a pressure-sensitive adhesive containing a predetermined plasticizer (a1), so that even if the plasticizer migrates between the base layer and the pressure-sensitive adhesive layer, The flexibility of the system is maintained. More specifically, in a dicing tape having a pressure-sensitive adhesive layer constituted by a conventional dicing tape, that is, a pressure-sensitive adhesive containing no plasticizer, the plasticizer in the base layer shifts to the pressure-sensitive adhesive layer. In the present invention, The transition from the base layer to the pressure-sensitive adhesive layer, and also from the pressure-sensitive adhesive layer to the base layer. As a result, flexibility of the base layer can be maintained without decreasing the plasticizer in the base layer. Such a dicing tape is excellent in expandability and can contribute to improvement in pick-up performance of the chip. Further, by forming the base layer having excellent flexibility, a dicing tape excellent in adhesion between the base layer and the pressure-sensitive adhesive layer can be obtained. In such a dicing tape, the pressure-sensitive adhesive layer can be prevented from being peeled off from the base layer and bubbles can be prevented from being generated by the peeling.

The thickness of the dicing tape is preferably 30 mu m to 300 mu m, more preferably 50 mu m to 200 mu m, and particularly preferably 60 mu m to 125 mu m.

The adhesive force of the dicing tape at 25 캜 is preferably 0.3 N / 20 mm to 3 N / 20 mm, and more preferably 0.4 N / 20 mm to 2.5 N / 20 mm. In this specification, the term "adhesive force" used herein means a test method in which a mirror wafer (made of silicone) is used as a test plate and a method according to JIS Z 0237 (2000) (bonding condition: 2 kg roller 1 round trip, aging: : 300 mm / min, peeling angle: 90 deg.).

The maximum tensile stress at 0 to 10% strain (stretching) of the dicing tape at 25 캜 is preferably 2000 N / cm 2 or less, and more preferably 500 to 1,500 N / cm 2. The maximum tensile stress is measured by an Instron type tensile tester (Autograph) manufactured by Shimadzu Corporation, according to JIS-K-7127 (1999). Specifically, the "maximum tensile stress at 0 to 10% strain (stretching)" means that a sample having a width of 10 mm and a length of 150 mm is set at a chuck distance of 50 mm and then deformed at a tensile rate of 300 m / (Elongation) is the maximum stress value when tensile is applied to 10%.

B. The pressure-

The pressure sensitive adhesive layer may be formed of a (meth) acrylic pressure sensitive adhesive. The (meth) acrylic pressure sensitive adhesive may be a curing pressure sensitive adhesive such as a thermosetting pressure sensitive adhesive, an active energy ray curable pressure sensitive adhesive, or the like, or may be a pressure sensitive adhesive. The pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer further comprises a plasticizer (a1).

The (meth) acrylic pressure sensitive adhesive includes a (meth) acrylic polymer as the base polymer. The (meth) acrylic polymer may be composed of a monomer component containing (meth) acrylic acid ester as a main monomer. In the (meth) acrylic polymer, the content ratio of the constitutional unit derived from the (meth) acrylate ester is preferably 50 parts by weight or more, more preferably 70 parts by weight or more, per 100 parts by weight of the (meth) 100 parts by weight, and more preferably 80 parts by weight to 90 parts by weight. The monomers in the monomer component may be only one kind or two or more kinds.

(Meth) acrylic esters include, for example, (meth) acrylic acid alkyl esters of alkyl groups having 1 to 30 carbon atoms (including cycloalkyl groups) and hydroxyl group-containing (meth) acrylic esters. The (meth) acrylic esters may be only one kind, or two or more kinds.

Examples of the (meth) acrylic acid alkyl ester of the alkyl group having 1 to 30 carbon atoms (inclusive of the cycloalkyl group) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) (Meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (Meth) acrylate, isobutyl (meth) acrylate, isobutyl (meth) acrylate, heptyl (meth) acrylate, (Meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl Decyl, nonadecyl (meth) acrylate, (meth) acrylate (Meth) acrylic acid alkyl ester of an alkyl group having 1 to 30 carbon atoms (inclusive of a cycloalkyl group) such as methyl (meth) acrylate, ethyl (meth) acrylate and lauryl (meth) acrylate. Among these (meth) acrylic acid esters, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and isononyl (meth) acrylate are preferable.

Examples of the hydroxyl group-containing (meth) acrylic acid esters include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.

The monomer component constituting the (meth) acrylic polymer may further contain other monomers copolymerizable with the (meth) acrylic acid ester. As other monomers, for example, the following monomers can be mentioned. The other monomers may be used alone, or two or more monomers may be used in combination.

Carboxyl group-containing monomers: ethylenically unsaturated monocarboxylic acids such as acrylic acid (AA), methacrylic acid (MAA) and crotonic acid; Ethylenically unsaturated dicarboxylic acids such as maleic acid, itaconic acid and citraconic acid, and anhydrides thereof (maleic anhydride, itaconic anhydride, etc.);

Monomer containing a hydroxyl group: unsaturated alcohols such as vinyl alcohol and allyl alcohol; Ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether;

An amino group-containing monomer; Epoxy group-containing monomers; Cyano group-containing monomers; A keto group-containing monomer; Monomers having a nitrogen atom-containing ring; Alkoxysilyl group-containing monomer.

The content of the other monomer-derived constituent units is preferably 50 parts by weight or less, more preferably 0.1 parts by weight to 50 parts by weight, and even more preferably 1 part by weight, based on 100 parts by weight of the (meth) Parts by weight to 30 parts by weight. With such a range, a pressure-sensitive adhesive layer having high cohesive strength and excellent adhesion can be formed.

The weight average molecular weight of the (meth) acrylic polymer is preferably 200,000 to 3,000,000, and more preferably 250,000 to 1,500,000. The weight average molecular weight can be measured by GPC (solvent: THF).

As the active energy ray-curable pressure-sensitive adhesive, any pressure-sensitive adhesive containing a suitable (meth) acrylic polymer may be used. (Meth) acrylic polymer having at least one curable functional group (e.g., a carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, or an acetylene group), a photopolymerization initiator Is used as a pressure-sensitive adhesive. Further, a pressure-sensitive adhesive containing a (meth) acrylic polymer, a curable monomer component and / or a curable oligomer component, and a photopolymerization initiator may be used. Examples of the curable monomer component and / or the curable oligomer component include a photoreactive monomer or oligomer having a functional group having a carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group or an acetylene group .

Examples of the plasticizer (a1) contained in the pressure-sensitive adhesive include terephthalate ester, isophthalate ester, phthalate ester, trimellitate ester, adipate ester (for example, dioctyl adipate, adipate (For example, tricresyl phosphate), citric acid esters (for example, tributyl acetylcitrate), sebacic acid esters, acetalic acid esters (for example, And plasticizers such as ester type, maleic ester type, benzoic acid ester type, polyether type polyester, epoxy type polyester and polyester (for example, low molecular polyester composed of carboxylic acid and glycol). The plasticizer may be one kind alone, or two or more kinds.

In one embodiment, a terephthalate ester plasticizer is used as the plasticizer (a1). Examples of the terephthalate ester plasticizer include dibutyl terephthalate (DBTP), diisobutyl terephthalate (DIBTP), terephthalic acid dinormalhexyl (DHTP), terephthalic acid bis (2-ethylhexyl) (DOTP), terephthalic acid dinormaloctyl ), Diisononyl terephthalate (DINTP), dinonyl terephthalate (DNTP), diisodecyl terephthalate (DIDTP), and bistyl terephthalate (BBTP). Among them, DOTP is preferable.

Conventionally, bis (2-ethylhexyl) phthalate (DOP), dibutyl phthalate (DBP) and the like have been widely used as plasticizers, but these compounds are subject to regulation by the RoHS Directive. In the present invention, it is preferable to use a plasticizer that is not subject to regulation by the RoHS Directive. Examples of such plasticizers include DOTP, diisononyl phthalate, trimellitate tris (2-ethylhexyl), and adipic acid polyester compounds. In the present invention, even when such a plasticizer is used, a dicing tape excellent in flexibility can be obtained.

The content of the plasticizer (a1) contained in the pressure-sensitive adhesive is preferably 10 parts by mass to 150 parts by mass, more preferably 20 parts by mass to 100 parts by mass, relative to 100 parts by mass of the (meth) acrylic polymer in the pressure- More preferably 30 parts by weight to 50 parts by weight. In such a range, migration of the plasticizer between the substrate layer and the pressure-sensitive adhesive layer proceeds, and as a result, a dicing tape excellent in flexibility can be obtained. The content ratio of the plasticizer (a1) contained in the pressure-sensitive adhesive means the content ratio of the plasticizer (a1) before the pressure-sensitive adhesive is applied to the base film. After the pressure-sensitive adhesive is applied to the base film Sensitive adhesive layer contained in the pressure-sensitive adhesive layer of the pressure-sensitive adhesive layer (that is, after the progress of the transition of the plasticizer between the substrate layer and the pressure-sensitive adhesive layer). In the present specification, the plasticizer contained in the pressure-sensitive adhesive layer after applying the pressure-sensitive adhesive to the base film is also simply referred to as " plasticizer contained in the pressure-sensitive adhesive layer ". The plasticizer contained in the pressure-sensitive adhesive layer may be the plasticizer (a1) and / or the plasticizer (a2) contained in the base film since the plasticizer migrates between the pressure-sensitive adhesive layer and the substrate layer. The content of the plasticizer contained in the pressure-sensitive adhesive layer is preferably 1 part by weight to 150 parts by weight, more preferably 2 parts by weight to 100 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer.

The pressure-sensitive adhesive may further comprise any suitable additive. Examples of the additive include a polymerization initiator, a crosslinking agent, a tackifier, an anti-aging agent, a filler, a colorant, an antistatic agent, and a surfactant. These additives may be used alone or in combination of two or more. When two or more kinds of additives are used, they may be added singly or two or more kinds of additives may be added at the same time. The compounding amount of the additive may be set to any suitable amount.

The thickness of the pressure-sensitive adhesive layer is preferably 5 m to 200 m, more preferably 5 m to 100 m.

C. The substrate layer

The base layer includes a polyvinyl chloride resin and a plasticizer. As described above, in the dicing tape of the present invention, the plasticizer can be transferred between the base layer and the pressure-sensitive adhesive layer. In the present specification, the " base layer " (That is, the layer after the application of the pressure-sensitive adhesive, after the plasticizer has been transferred). Further, the film before the application of the pressure-sensitive adhesive (i.e., the film as the material) is referred to as a " base film ".

The base film preferably includes a plasticizer (a2). That is, the dicing tape of the present invention is preferably formed by applying a pressure-sensitive adhesive containing a plasticizer (a1) to the base film by using a base film containing the plasticizer (a2). As the plasticizer (a2) contained in the base film, the plasticizer described in the above section B can be used. Preferably, a plasticizer (for example, DOTP, diisononyl phthalate, trimellitate tris (2-ethylhexyl), adipic acid polyester compound or the like) which is not subject to regulation by the RoHS Directive is used do.

In one embodiment, the pressure-sensitive adhesive and the substrate film contain the same series of plasticizers. In other words, in one embodiment, the plasticizer (a1) and the plasticizer (a2) are the same series. &Quot; Plasticizer of the same family " means a plasticizer having a similar chemical structure. For example, when the plasticizer is an ester compound, the moiety derived from oxo acid (constituent unit derived from oxo acid in the case of a polymer compound) is the same, and the portion derived from a hydroxyl group-containing compound , The ester group compound group having a higher molecular weight of 288 or less per one structural unit derived from the hydroxyl group-containing compound corresponds to " the same series of plasticizers ". Examples of the " plasticizer of the same series " include a combination of bis (2-ethylhexyl) phthalate (DOP) and bis (2-ethylhexyl) terephthalate (DOTP) and a combination of DOP and diisononyl phthalate . In one embodiment, the pressure-sensitive adhesive and the substrate film contain the same plasticizer. In the case where the pressure-sensitive adhesive and the substrate film contain plural kinds of plasticizers, all of them may be " the same series of plasticizers " or " the same plasticizers ", and at least one of them may be of the same series or the same plasticizers.

The content of the plasticizer (a2) in the base film is preferably 10 parts by weight to 80 parts by weight, more preferably 15 parts by weight to 50 parts by weight, relative to 100 parts by weight of the polyvinyl chloride resin in the base film to be. With such a range, a dicing tape excellent in flexibility can be obtained, a base layer having excellent flexibility can be formed, excellent followability against deformation such as elongation can be obtained, and a pickup property can be obtained. The content ratio of the plasticizer in the base layer (that is, the total content of the plasticizer (a1) and the plasticizer (a2)) is preferably from 15 parts by weight to 100 parts by weight based on 100 parts by weight of the polyvinyl chloride resin in the base layer. 80 parts by weight, and more preferably 20 parts by weight to 60 parts by weight. The content of the plasticizer in the base layer is preferably larger than the content of the plasticizer (a2) in the base film.

The base film may contain any other suitable component insofar as the effect of the present invention is not impaired.

The maximum elongation of the base film measured according to JIS-K-7127 (1999) is preferably 100% or more, and more preferably 200% to 1000%. By using the base film showing the maximum elongation, a dicing tape having suitable stretchability and excellent expandability can be obtained. The maximum elongation can be measured at a tensile rate of 300 mm / min under an environment of 23 占 폚.

The base film has a tensile strength measured according to JIS-K-7127 (1999), preferably 1000 N / cm2 to 8000 N / cm2, more preferably 3000 N / cm2 to 6000 N / By using the base film exhibiting such a tensile strength, a dicing tape excellent in expandability can be obtained. The tensile strength is the strength at break at a tensile rate of 300 mm / min under an environment of 23 占 폚.

The base film can be produced by any suitable production method. For example, a base film can be obtained by a molding method such as injection molding, extrusion molding, inflation molding, calendar molding, or blow molding.

As described above, the substrate layer includes a plasticizer having the same structure as the plasticizer (a1) contained in the pressure-sensitive adhesive. More specifically, after a pressure-sensitive adhesive is applied to a base film, the plasticizer (a1) contained in the pressure-sensitive adhesive is transferred to a base film, and as a result, a base layer comprising a plasticizer having the same structure as the plasticizer contained in the pressure- do. In one embodiment, the base layer includes the plasticizer (a2) contained in the base film and the plasticizer (a1) contained in the adhesive.

The thickness of the base layer is preferably 20 to 300 占 퐉, more preferably 30 to 200 占 퐉, and still more preferably 40 to 150 占 퐉. When the thickness of the substrate is too thin, the handling property may be deteriorated. When the thickness of the substrate is too thick, the followability against deformation such as stretching becomes poor, and there is a fear that the pick-up property is lowered

D. Dicing  Method of manufacturing tape

The method for producing a dicing tape according to the present invention comprises applying the pressure-sensitive adhesive on the base film to form a pressure-sensitive adhesive layer.

As described above, the base film includes a polyvinyl chloride resin and a plasticizer (a2). Further, the pressure-sensitive adhesive contains a (meth) acrylic polymer and a plasticizer (a1). In one embodiment, the plasticizer (a1) and the plasticizer (a2) are the same series of plasticizers, preferably the same plasticizers.

The content of the plasticizer (a2) in the base film before application of the pressure-sensitive adhesive to the base film is preferably 10 parts by weight to 80 parts by weight relative to 100 parts by weight of the polyvinyl chloride resin, 15 parts by weight to 50 parts by weight.

The content of the plasticizer (a1) in the pressure-sensitive adhesive is preferably 10 parts by weight to 150 parts by weight, more preferably 20 parts by weight, per 100 parts by weight of the (meth) acrylic polymer before the application of the pressure- To 100 parts by weight, and more preferably 30 parts by weight to 50 parts by weight.

The content by weight of the plasticizer (a1) in the pressure-sensitive adhesive before application of the pressure-sensitive adhesive to the base film is preferably 1 to 10 times, more preferably 1 to 5 times the content by weight of the plasticizer (a2) , And more preferably 1.5 times to 3 times. With such a range, a substrate layer containing a plasticizer having the same structure as the plasticizer contained in the pressure-sensitive adhesive can be formed, and a dicing tape excellent in flexibility can be obtained.

The application of the pressure-sensitive adhesive may be performed, for example, by applying a pressure-sensitive adhesive to the base film and heating and drying the applied layer. As the application method, various methods such as bar coater application, air knife application, gravure application, gravure reverse application, reverse roll application, lip application, die application, dip application, offset printing, flexo printing and screen printing can be adopted. The heating and drying temperature is, for example, 80 ° C to 200 ° C.

By applying the pressure-sensitive adhesive to the base film, a dicing tape having the base layer and the pressure-sensitive adhesive layer is obtained. In the dicing tape of the present invention, as a result of progress of the transition of the plasticizer between the substrate layer and the pressure-sensitive adhesive layer, the plasticizer (a2) contained in the base film and / or the plasticizer (a1) contained in the pressure- The pressure-sensitive adhesive layer may also contain the plasticizer (a2) contained in the base film and / or the plasticizer (a1) contained in the pressure-sensitive adhesive. It is preferable that the content of the plasticizer in the pressure-sensitive adhesive layer after application of the pressure-sensitive adhesive to the substrate film is not more than the content of the plasticizer (a1) in the pressure-sensitive adhesive before application. The content of the plasticizer in the pressure-sensitive adhesive layer after application of the pressure-sensitive adhesive to the base film is preferably 10% by weight to 100% by weight, more preferably 20% by weight, based on the weight of the plasticizer (a1) in the pressure- By weight to 80% by weight, and more preferably 30% by weight to 60% by weight. The content of the plasticizer in the base layer is preferably not less than the content of the plasticizer (a2) in the base film.

When the curable pressure-sensitive adhesive is used as the pressure-sensitive adhesive, the pressure-sensitive adhesive layer may be subjected to a curing treatment to adjust the properties (adhesive strength, elastic modulus, etc.) of the pressure-sensitive adhesive layer. Examples of the curing treatment include ultraviolet irradiation, heat treatment, and the like.

When expanding using a dicing tape, the expansion can be done using a conventionally known expansion device. The expansion device has a donut-shaped outer ring capable of pushing down the dicing tape through a dicing ring, and an inner ring having a smaller diameter than the outer ring and supporting the dicing tape. By this expansion process, adjacent semiconductor chips can be prevented from coming into contact with each other and being broken in the pickup process, which is a subsequent process.

The expansion speed is preferably 0.1 mm / second or more, more preferably 1 mm / second or more. If it is 0.1 mm / second or more, it can be easily divided. On the other hand, the upper limit of the expansion speed is not particularly limited.

[Example]

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to these Examples. In the examples, " part " and "% " are by weight unless otherwise specified.

[Production Example 1] Production of Base Material Film (1)

A base film (1) containing 20 parts by weight of a DOP plasticizer was formed by a calendering method on 100 parts by weight of polyvinyl chloride. The obtained base film 1 had a thickness of 70 탆, the maximum elongation (tensile rate 300 mm / min) was 320%, and the tensile strength (tensile strength at break at 300 mm / min) was 3600 N / cm 2.

[Production Example 2]: Production of base material film (2)

A substrate film (1) containing 20 parts by weight of a DOTP plasticizer with respect to 100 parts by weight of polyvinyl chloride was formed by a calendering method. The obtained base film 1 had a thickness of 70 탆, a maximum elongation (tensile rate 300 mm / min) of 290% and a tensile strength (breaking strength at a tensile rate of 300 mm / min) of 5200 N / cm 2.

[Example 1]

100 parts by weight of an acrylic polymer composed of butyl acrylate (BA) / acrylonitrile (AN) / acrylic acid (AA) = 85/15 / 2.5 (weight ratio), melamine crosslinking agent (butanol modified melamine formaldehyde resin, , Trade name " Superbeckamine J-820-60N "), 30 parts by weight of a DOP plasticizer and toluene were prepared. The pressure-sensitive adhesive (1) was applied to the base film (1) and dried at 130 캜 for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 탆.

Subsequently, a release liner (polyester film, trade name: MRF, manufactured by Mitsubishi Chemical Polyester Co., Ltd.) having a thickness of 38 탆 and one side of which had been exfoliated with silicone was bonded to the pressure-sensitive adhesive layer surface and stored at 50 캜 for 72 hours , And a dicing tape (1).

[Example 2]

A pressure-sensitive adhesive (2) was prepared in the same manner as in Example 1 except that 30 parts by weight of a DOTP plasticizer was used instead of 30 parts by weight of a DOP plasticizer. The pressure-sensitive adhesive (2) was applied to the base film (2) and then dried at 150 DEG C for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 mu m. A polyester film Peeling liner) were bonded to each other to obtain a dicing tape 2.

[Example 3]

A pressure-sensitive adhesive (3) was prepared in the same manner as in Example 1 except that the blending amount of the DOP plasticizer was changed to 50 parts by weight. This pressure sensitive adhesive 3 was applied to the base film 1 and then dried at 130 캜 for 90 seconds to form a pressure sensitive adhesive layer having a thickness of 10 탆 and a polyester film Liner) were bonded to obtain a dicing tape 3.

[Example 4]

A pressure-sensitive adhesive (4) was prepared in the same manner as in Example 2 except that the blending amount of the DOTP plasticizer was changed to 50 parts by weight. The pressure-sensitive adhesive (4) was applied to the base film (2) and dried at 130 占 폚 for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 占 퐉. A polyester film Liner) were bonded to each other to obtain a dicing tape 4.

[Comparative Example 1]

A pressure-sensitive adhesive (5) was prepared in the same manner as in Example 1 except that no plasticizer was added. The pressure-sensitive adhesive (5) was applied to polyethylene as a base film and dried at 130 占 폚 for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 占 퐉. A polyester film (release liner) To obtain a dicing tape.

[Comparative Example 2]

A pressure-sensitive adhesive (5) was prepared in the same manner as in Example 1 except that no plasticizer was added. The pressure-sensitive adhesive (5) was applied to the base film (1) and dried at 130 占 폚 for 90 seconds to form a pressure sensitive adhesive layer having a thickness of 10 占 퐉. A polyester film ) Were bonded to each other to obtain a dicing tape.

[Comparative Example 3]

A pressure-sensitive adhesive (5) was prepared in the same manner as in Example 1 except that no plasticizer was added. The pressure-sensitive adhesive (5) was applied to the base film (2) and dried at 130 占 폚 for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 占 퐉. A polyester film ) Were bonded to each other to obtain a dicing tape.

[Referential Example 1]

A pressure-sensitive adhesive (6) was prepared in the same manner as in Example 1 except that the blending amount of the DOP plasticizer was changed to 5 parts by weight. This pressure-sensitive adhesive 6 was applied to the base film 1 and dried at 130 占 폚 for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 占 퐉. A polyester film (a release liner ) Were bonded to each other to obtain a dicing tape.

[Reference Example 2]

A pressure-sensitive adhesive (7) was prepared in the same manner as in Example 2 except that the blending amount of the DOTP plasticizer was changed to 5 parts by weight. This pressure-sensitive adhesive 7 was applied to the base film 2 and then dried at 130 캜 for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 탆. A polyester film (one side) Liner) were bonded to each other to obtain a dicing tape.

[Rating] Scalability

The extensibility of the dicing tape obtained in Examples and Comparative Examples was evaluated according to the following methods and standards. The results are shown in Table 1.

(1) A dicing tape having a release liner peeled off is bonded to an 8-inch dicing ring.

(2) Dicing only the dicing tape under the following conditions.

<Dicing Condition>

Dicing size: 0.8 mm x 0.8 mm

Device: "DFD-6450" manufactured by DISCO Corporation

Blade: "NBC-ZH 205O-SE 27HECC" manufactured by DISCO Corporation

Single cut

Spindle: 40000rpm

Cutting speed: 80 mm / sec

Blade height: 45um

(3) Dicing Complete the dicing tape on the expansion unit.

(4) Expansion of the dicing tape at the expansion conditions and expansion speeds below.

<Extension condition>

Extension device: OEX-840II (manufactured by Omiya Corporation)

Expansion condition: Push-up amount 40㎜

Expansion speed: 3mm / sec

Table temperature: room temperature

(Evaluation Criteria) When the dicing tape is torn when it is extended, it is rejected (× in Table 1), and when it is not torn, it is passed (○ in Table 1).

10: substrate layer
20: pressure-sensitive adhesive layer
100: Dicing tape

Claims (6)

A pressure-sensitive adhesive sheet comprising: a substrate layer; and a pressure-sensitive adhesive layer disposed on at least one side of the substrate layer,
Wherein the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer comprises a (meth) acrylic polymer and a plasticizer,
Wherein the substrate layer comprises a polyvinyl chloride resin and a plasticizer having the same structure as the plasticizer contained in the pressure-
Dicing tape. The method according to claim 1,
Wherein the plasticizer contained in the pressure-sensitive adhesive is terephthalic acid bis (2-ethylhexyl) phthalate diisononyl, trimellitate tris (2-ethylhexyl) and / or adipic acid polyester plasticizer. Applying a pressure-sensitive adhesive to the base film to form a pressure-sensitive adhesive layer,
Before applying the pressure-sensitive adhesive to the substrate film,
Wherein the pressure-sensitive adhesive comprises a (meth) acrylic polymer and a plasticizer (a1)
Wherein the base film comprises a polyvinyl chloride resin and a plasticizer (a2)
The content of the plasticizer (a1) is 10 parts by weight to 150 parts by weight based on 100 parts by weight of the (meth) acrylic polymer,
Wherein the content of the plasticizer (a2) is 10 parts by weight to 80 parts by weight based on 100 parts by weight of the polyvinyl chloride resin,
After applying the pressure-sensitive adhesive to the substrate film,
Wherein the total content of the plasticizer (a1) and the plasticizer (a2) in the pressure-sensitive adhesive layer is 10% by weight to 100% by weight based on the weight of the plasticizer (a1) in the pressure-
A method for producing a dicing tape. The method of claim 3,
Wherein the plasticizer (a1) is bis (2-ethylhexyl) terephthalate, diisononyl phthalate, trimellitate tris (2-ethylhexyl) and / or adipic acid polyester plasticizer. The method according to claim 3 or 4,
Wherein the plasticizer (a1) and the plasticizer (a2) are the same series of plasticizers. 6. The method according to any one of claims 3 to 5,
Wherein the content by weight of the plasticizer (a1) in the pressure-sensitive adhesive is 1 to 10 times the content by weight of the plasticizer (a2) in the base film.

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