CN107418463B

CN107418463B - Cutting belt

Info

Publication number: CN107418463B
Application number: CN201710370357.2A
Authority: CN
Inventors: 秋山淳; 水野浩二; 东别府优树
Original assignee: Nitto Denko Corp
Current assignee: Nitto Denko Corp
Priority date: 2016-05-23
Filing date: 2017-05-23
Publication date: 2021-11-16
Anticipated expiration: 2037-05-23
Also published as: TWI801338B; JP6797559B2; KR102370312B1; TW201805386A; KR20170132088A; JP2017212249A; CN107418463A

Abstract

The invention provides a dicing tape having good flexibility and excellent crystal expansion. The dicing tape of the present invention includes a base material layer and a pressure-sensitive adhesive layer disposed on at least one side of the base material layer, wherein the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer includes a (meth) acrylic polymer and a plasticizer, and the base material layer includes a polyvinyl chloride resin and a plasticizer having the same structure as the plasticizer included in the pressure-sensitive adhesive. In one embodiment, the plasticizer included in the adhesive is bis (2-ethylhexyl) terephthalate, diisononyl phthalate, and/or a polyester adipate plasticizer.

Description

Cutting belt

Technical Field

The present invention relates to a dicing tape.

Background

In general, a semiconductor integrated circuit is manufactured as follows: after a wafer is produced by slicing a high-purity silicon single crystal or the like, a specific circuit pattern such as an IC is formed by etching on the surface of the wafer to assemble an integrated circuit, and then the back surface of the wafer is ground by a grinder and finally diced to form chips. In the dicing, a dicing tape is attached to the wafer, dicing is performed in a state where the wafer is fixed, and then the dicing tape is expanded to separate the chips from each other, and then the chips are picked up by being pushed up by a needle.

In recent years, semiconductor wafers have become thinner with the miniaturization of electronic devices, and thin wafers are easily broken in the manufacturing process. Therefore, in order to reduce the load on the semiconductor wafer during the die expansion and pickup and prevent the chip from being damaged, higher flexibility and stress relaxation property are required for the dicing tape.

In order to obtain a dicing tape satisfying the above characteristics, a polyvinyl chloride film is generally used as a base material of the dicing tape. Generally, a polyvinyl chloride film is formed by molding a resin composition obtained by adding a plasticizer and other additives (a stabilizer, a lubricant, a colorant, a filler, and the like) to a polyvinyl chloride resin into a tape shape, and the plasticizer imparts flexibility to the film (for example, patent documents 1 and 2). However, even in the case of a polyvinyl chloride-based film having flexibility imparted by adding a plasticizer, when a dicing tape is formed using the film (that is, when an adhesive layer is formed on the polyvinyl chloride-based film), the flexibility as the dicing tape is still insufficient.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 9-235522

Patent document 2: japanese patent laid-open publication No. 2011-49753

Disclosure of Invention

Problems to be solved by the invention

The present inventors have studied the cause of insufficient flexibility of the dicing tape and found that: the plasticizer contained in the base material of the dicing tape moves (transfers) into the adhesive layer, and the flexibility of the base material is reduced, and as a result, the flexibility of the dicing tape is reduced.

The present invention has been made to solve the above conventional problems, and an object thereof is to provide a dicing tape having good flexibility and excellent crystal expansion properties. More specifically, a dicing tape is provided which has excellent crystal expansion properties without impairing the flexibility of the base material.

Means for solving the problems

The dicing tape of the present invention includes a base material layer and a pressure-sensitive adhesive layer disposed on at least one side of the base material layer, wherein the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer includes a (meth) acrylic polymer and a plasticizer, and the base material layer includes a polyvinyl chloride resin and a plasticizer having the same structure as the plasticizer included in the pressure-sensitive adhesive.

In one embodiment, the plasticizer included in the adhesive is bis (2-ethylhexyl) terephthalate, diisononyl phthalate, tris (2-ethylhexyl) trimellitate, and/or a polyester adipate plasticizer.

According to another embodiment of the present invention, a method of manufacturing a dicing tape is provided. The production method comprises a step of forming an adhesive layer by applying an adhesive to a base film, wherein the adhesive comprises a (meth) acrylic polymer and a plasticizer (a1) before applying the adhesive to the base film, the base film comprises a polyvinyl chloride resin and a plasticizer (a2), the plasticizer (a1) is contained in an amount of 10 to 150 parts by weight based on 100 parts by weight of the (meth) acrylic polymer, the plasticizer (a2) is contained in an amount of 10 to 80 parts by weight based on 100 parts by weight of the polyvinyl chloride resin, and the total content of the plasticizer (a1) and the plasticizer (a2) in the adhesive layer after applying the adhesive to the base film is 10 to 100% by weight based on the weight of the plasticizer (a1) in the adhesive before applying.

In one embodiment, the plasticizer (a1) is bis (2-ethylhexyl) terephthalate, diisononyl phthalate, and/or a polyester adipate plasticizer.

In one embodiment, the plasticizer (a1) and the plasticizer (a2) are the same series of plasticizers.

In one embodiment, the content of the plasticizer (a1) in the adhesive is 1 to 10 times the content of the plasticizer (a2) in the base film.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, a dicing tape having good flexibility and excellent crystal expansion properties can be provided by adding a plasticizer to both the base material layer and the pressure-sensitive adhesive layer.

Drawings

Fig. 1 is a schematic cross-sectional view of a dicing tape according to an embodiment of the present invention.

Description of the reference numerals

10 base material layer

20 adhesive layer

100 cutting belt

Detailed Description

A. Integral formation of the cutting band

Fig. 1 is a schematic cross-sectional view of a dicing tape according to an embodiment of the present invention. The dicing tape 100 includes a base material layer 10 and a pressure-sensitive adhesive layer 20 disposed on at least one side of the base material layer 10. The adhesive layer 20 is formed of an adhesive containing a plasticizer (a1) and a (meth) acrylic polymer as a base polymer. The base layer 10 includes a polyvinyl chloride resin and a plasticizer. The base material layer 10 contains a plasticizer having the same structure as the plasticizer (a1) contained in the adhesive, and more specifically contains a plasticizer (a1) transferred from the adhesive (see details below). Although not shown, the dicing tape of the present invention may be provided with a release liner on the outer side of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive surface until the tape is used.

In the dicing tape of the present invention, the adhesive layer is formed using the adhesive containing the specific plasticizer (a1), and thus even if the plasticizer is transferred between the base material layer and the adhesive layer, the plasticizer in the base material layer is not reduced, and the flexibility of the base material layer can be maintained. More specifically, in a conventional dicing tape, that is, a dicing tape having a pressure-sensitive adhesive layer composed of a pressure-sensitive adhesive containing no plasticizer, the plasticizer in the base material layer transfers to the pressure-sensitive adhesive layer, but in the present invention, the plasticizer transfers from the base material layer to the pressure-sensitive adhesive layer, and the plasticizer also transfers from the pressure-sensitive adhesive layer to the base material layer. As a result, the plasticizer in the base material layer is not reduced, and the flexibility of the base material layer can be maintained. Such dicing tape is excellent in the ability to expand the crystallinity, and can contribute to improvement in the chip pickup ability. Further, by forming the base layer having excellent flexibility, a dicing tape having excellent adhesion between the base layer and the pressure-sensitive adhesive layer can be obtained. Such a dicing tape can prevent the adhesive layer from peeling from the base material layer and prevent bubbles from being generated due to the peeling.

The thickness of the dicing tape is preferably 30 to 300. mu.m, more preferably 50 to 200. mu.m, and particularly preferably 60 to 125. mu.m.

The adhesive force of the dicing tape at 25 ℃ is preferably 0.3N/20mm to 3N/20mm, more preferably 0.4N/20mm to 2.5N/20 mm. In the present specification, the adhesive force means: the resulting adhesive force was measured using a mirror wafer (made of silicon) as a test plate by a method based on JIS Z0237 (2000) (bonding conditions: 1 reciprocating movement of a 2kg roller, aging: 1 hour at a measuring temperature, a peeling speed: 300 mm/min, and a peeling angle: 90 ℃).

The maximum tensile stress of the cutting tape at 0-10% strain (elongation) at 25 ℃ is preferably 2000N/cm²The concentration is more preferably 500 to 1500N/cm². The maximum tensile stress was measured in accordance with JIS-K-7127 (1999) using an INSTRON tensile tester (manufactured by Shimadzu corporation, autograph). Specifically, the "maximum tensile stress at 0 to 10% strain (elongation)" is the maximum stress value at which a sample having a width of 10mm × a length of 150mm is stretched at a tensile speed of 300 m/min until the strain (elongation) becomes 10% after the sample is set at an inter-jig distance of 50 mm.

B. Adhesive layer

The adhesive layer may be formed by a (meth) acrylic adhesive. The (meth) acrylic adhesive may be a curable adhesive such as a thermosetting adhesive or an active energy ray curable adhesive, or may be a pressure-sensitive adhesive. The adhesive forming the adhesive layer further contains a plasticizer (a 1).

The above (meth) acrylic adhesive contains a (meth) acrylic polymer as a base polymer. The (meth) acrylic polymer may be composed of a monomer component containing a (meth) acrylate as a main monomer. The content of the structural unit derived from the (meth) acrylic ester in the (meth) acrylic polymer is preferably 50 parts by weight or more, more preferably 70 to 100 parts by weight, and still more preferably 80 to 90 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer. The number of the monomers in the monomer component may be only 1, or may be 2 or more.

Examples of the (meth) acrylate include alkyl (meth) acrylates having an alkyl group (including cycloalkyl groups) having 1 to 30 carbon atoms, hydroxyl group-containing (meth) acrylates, and the like. The number of (meth) acrylic acid esters may be only 1, or may be 2 or more.

Examples of the alkyl (meth) acrylate ester having an alkyl group (including cycloalkyl groups) having 1 to 30 carbon atoms include: methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, (amyl (meta) acrylate), hexyl (meth) acrylate, cyclohexyl (meth) acrylate, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, and the like, Alkyl (meth) acrylates having an alkyl group having 1 to 30 carbon atoms (including cycloalkyl groups) such as tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylate, eicosyl (meth) acrylate, and lauryl (meth) acrylate. Among these (meth) acrylic esters, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and isononyl (meth) acrylate are preferable.

Examples of the hydroxyl group-containing (meth) acrylate include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate.

The monomer component constituting the above (meth) acrylic polymer may further contain another monomer copolymerizable with the (meth) acrylic acid ester. Examples of the other monomers include the following monomers. The other monomers may be used alone in an amount of 1 kind, or in combination with 2 or more kinds.

Carboxyl group-containing monomer: for example, ethylenically unsaturated monocarboxylic acids such as Acrylic Acid (AA), methacrylic acid (MAA) and crotonic acid; ethylenically unsaturated dicarboxylic acids such as maleic acid, itaconic acid, and citraconic acid, and anhydrides thereof (such as maleic anhydride and itaconic anhydride);

hydroxyl group-containing monomer: unsaturated alcohols such as vinyl alcohol and allyl alcohol; ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether and diethylene glycol monovinyl ether;

an amino group-containing monomer; an epoxy-containing monomer; a cyano-containing monomer; a ketone group-containing monomer; a monomer having a nitrogen atom-containing ring; an alkoxysilyl group-containing monomer.

The content of the structural unit derived from the other monomer is preferably 50 parts by weight or less, more preferably 0.1 to 50 parts by weight, and still more preferably 1 to 30 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer. When the content is in this range, a pressure-sensitive adhesive layer having high cohesive strength and excellent adhesion can be formed.

The weight average molecular weight of the (meth) acrylic polymer is preferably 20 to 300 ten thousand, and more preferably 25 to 150 ten thousand. The weight average molecular weight can be measured by GPC (solvent: THF).

As the active energy ray-curable adhesive, an adhesive containing any appropriate (meth) acrylic polymer can be used. A binder containing a photopolymerization initiator and a (meth) acrylic polymer having at least one curable functional group (for example, a carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, or an ethynyl group) is preferably used. Further, a binder containing a (meth) acrylic polymer, a curable monomer component and/or a curable oligomer component, and a photopolymerization initiator may be used. Examples of the curable monomer component and/or curable oligomer component include photoreactive monomers or oligomers having a functional group having a carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, or an ethynyl group.

Examples of the plasticizer (a1) contained in the adhesive include; and plasticizers such as terephthalate esters, isophthalate esters, phthalate esters, trimellitate esters, adipate esters (e.g., dioctyl adipate, diisononyl adipate), adipate esters, phosphate esters (e.g., tricresyl phosphate), citrate esters (e.g., tributyl acetyl citrate), sebacate esters, azelate esters, maleate esters, benzoate esters, polyether polyesters, epoxy polyesters, and polyesters (e.g., low molecular weight polyesters of carboxylic acid and diol). The number of the plasticizer may be only 1, or may be 2 or more.

In one embodiment, a terephthalate plasticizer may be used as the plasticizer (a 1). Examples of the terephthalate-based plasticizer include dibutyl terephthalate (DBTP), diisobutyl terephthalate (DIBTP), di-n-hexyl terephthalate (DHTP), bis (2-ethylhexyl) terephthalate (DOTP), di-n-octyl terephthalate (DnOTP), diisononyl terephthalate (DINTP), dinonyl terephthalate (DNTP), diisodecyl terephthalate (DIDTP), and dibutylbenzyl terephthalate (BBTP). Among them, DOTP is preferable.

Bis (2-ethylhexyl) phthalate (DOP), dibutyl phthalate (DBP), and the like have been conventionally used as plasticizers, but these compounds are subject to RoHS directive control. In the present invention, it is preferable to use a plasticizer which is not subject to RoHS directive control. Examples of such plasticizers include DOTP, diisononyl phthalate, tris (2-ethylhexyl) trimellitate, and adipic acid polyester compounds. In the present invention, even when such a plasticizer is used, a dicing tape having excellent flexibility can be obtained.

The content ratio of the plasticizer (a1) contained in the adhesive is preferably 10 to 150 parts by weight, more preferably 20 to 100 parts by weight, and still more preferably 30 to 50 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer in the adhesive. When the amount is within this range, the transfer of the plasticizer between the base material layer and the pressure-sensitive adhesive layer is promoted, and as a result, a dicing tape having excellent flexibility can be obtained. Note that the "content ratio of the plasticizer (a1) contained in the adhesive" refers to the content ratio of the plasticizer (a1) before the adhesive is applied to the base film, and it is necessary to distinguish this from the content ratio of the plasticizer contained in the adhesive layer after the adhesive is applied to the base film (that is, after the transfer of the plasticizer between the base layer and the adhesive layer is advanced). In the present specification, the plasticizer contained in the adhesive layer after the adhesive is applied to the base film is simply referred to as "the plasticizer contained in the adhesive layer". The "plasticizer contained in the adhesive layer" may be the plasticizer (a1) and/or the plasticizer (a2) contained in the substrate film, because the plasticizer is transferred between the adhesive layer/the substrate layer. The content ratio of the plasticizer contained in the pressure-sensitive adhesive layer is preferably 1 to 150 parts by weight, and more preferably 2 to 100 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer.

The above-mentioned binder may further comprise any suitable additive. Examples of the additives include a polymerization initiator, a crosslinking agent, an adhesion imparting agent, an anti-aging agent, a filler, a colorant, an antistatic agent, and a surfactant. The above additives may be used alone, or 2 or more of them may be used in combination. When 2 or more additives are used, 1 or more additives may be added, or 2 or more additives may be added simultaneously. The amount of the additive can be set to any appropriate amount.

The thickness of the pressure-sensitive adhesive layer is preferably 5 to 200. mu.m, more preferably 5 to 100. mu.m.

C. Substrate layer

The base material layer contains a polyvinyl chloride resin and a plasticizer. As described above, the dicing tape of the present invention can transfer a plasticizer between the base material layer and the pressure-sensitive adhesive layer, and in the present specification, the "base material layer" refers to a layer constituting the dicing tape (i.e., a layer after application of the pressure-sensitive adhesive and after transfer of the plasticizer). In addition, a film before application of the adhesive (i.e., a film as a material) is referred to as a "base film".

The base film preferably contains a plasticizer (a 2). That is, the dicing tape of the present invention is preferably formed by using a base film containing the plasticizer (a2) and coating the base film with an adhesive containing the plasticizer (a 1). As the plasticizer (a2) contained in the base film, the plasticizer described in the above item B can be used. Plasticizers that are not subject to RoHS directive management (e.g., DOTP, diisononyl phthalate, tris (2-ethylhexyl) trimellitate, adipate polyester compounds, etc.) are preferably used.

In one embodiment, the adhesive and the substrate film comprise the same series of plasticizers. In other words, in one embodiment, the plasticizer (a1) is the same plasticizer (a2) as the plasticizer (a 1). "the same series of plasticizers" refers to plasticizers that are chemically similar. For example, when the plasticizer is an ester-based compound, a group of ester-based compounds in which the portions derived from an oxyacid (oxoacid) (structural units derived from an oxyacid in the case of a polymer-based compound) are the same and the difference in molecular weight between the portions derived from a hydroxyl-containing compound (average one structural unit derived from a hydroxyl-containing compound in the case of a polymer-based compound) is 288 or less corresponds to "the same series of plasticizers". Examples of the "plasticizer of the same series" include a combination of bis (2-ethylhexyl) phthalate (DOP) and bis (2-ethylhexyl) terephthalate (DOTP), and a combination of DOP and diisononyl phthalate. In one embodiment, the adhesive and the substrate film comprise the same plasticizer. When the adhesive and the base film contain a plurality of plasticizers, all of them may be "the same series of plasticizers" or "the same plasticizers", or at least 1 of them may be "the same series of plasticizers" or "the same plasticizers".

The content ratio of the plasticizer (a2) in the base film is preferably 10 to 80 parts by weight, more preferably 15 to 50 parts by weight, based on 100 parts by weight of the polyvinyl chloride resin in the base film. Within such a range, a base layer having excellent flexibility is formed, and a dicing tape having excellent followability to deformation such as stretching and good pickup properties can be obtained. The content ratio of the plasticizer in the base layer (i.e., the total content ratio of the plasticizer (a1) and the plasticizer (a 2)) is preferably 15 to 80 parts by weight, and more preferably 20 to 60 parts by weight, based on 100 parts by weight of the polyvinyl chloride resin in the base layer. The content of the plasticizer in the base material layer is preferably more than the content of the plasticizer (a2) in the base material film.

The base film may contain any other suitable component within a range not impairing the effects of the present invention.

The maximum elongation of the base film is preferably 100% or more, more preferably 200 to 1000%, as measured according to JIS-K-7127 (1999). By using a base film exhibiting such a maximum elongation, a dicing tape having an appropriate elongation and excellent in crystallinity can be obtained. The maximum elongation can be measured at a tensile rate of 300 mm/min under an environment of 23 ℃.

The tensile strength of the base film is preferably 1000N/cm as measured according to JIS-K-7127 (1999)²～8000N/cm²More preferably 3000N/cm²～6000N/cm². By using a base film exhibiting such tensile strength, a dicing tape excellent in crystallinity can be obtained. The tensile strength is a strength at break when a tensile test is performed at a tensile rate of 300 mm/min in an environment of 23 ℃.

The base film can be produced by any suitable production method. For example, the base film can be obtained by a molding method such as injection molding, extrusion molding, inflation molding, calender molding, blow molding, or the like.

As described above, the base material layer contains a plasticizer having the same structure as the plasticizer (a1) contained in the adhesive. More specifically, after the adhesive is applied to the base film, the plasticizer (a1) contained in the adhesive is transferred to the base film, and as a result, a base layer including a plasticizer having the same structure as the plasticizer contained in the adhesive is formed. In one embodiment, the base material layer contains the plasticizer (a2) contained in the base material film and the plasticizer (a1) contained in the binder.

The thickness of the substrate layer is preferably 20 to 300. mu.m, more preferably 30 to 200. mu.m, and still more preferably 40 to 150. mu.m. If the thickness of the substrate is too thin, the handling property may be deteriorated. If the thickness of the base material is too large, the following property against deformation such as stretching may be deteriorated, and the pickup property may be deteriorated.

D. Method for manufacturing dicing tape

The method for producing a dicing tape of the present invention includes applying the adhesive to the base film to form an adhesive layer.

As described above, the base film contains the polyvinyl chloride-based resin and the plasticizer (a 2). Further, the adhesive contains a (meth) acrylic polymer and a plasticizer (a 1). In one embodiment, the plasticizer (a1) and the plasticizer (a2) are the same series of plasticizers, preferably the same plasticizer.

The content ratio of the plasticizer (a2) in the base film is preferably 10 to 80 parts by weight, more preferably 15 to 50 parts by weight, based on 100 parts by weight of the polyvinyl chloride-based resin before the adhesive is applied to the base film.

The content of the plasticizer (a1) in the adhesive is preferably 10 to 150 parts by weight, more preferably 20 to 100 parts by weight, and still more preferably 30 to 50 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer before the adhesive is applied to the base film.

The content of the plasticizer (a1) in the adhesive is preferably 1 to 10 times, more preferably 1 to 5 times, and still more preferably 1.5 to 3 times the content of the plasticizer (a2) in the base film before the base film is coated with the adhesive. When the amount is within this range, a base material layer including a plasticizer having the same structure as the plasticizer contained in the binder can be formed, and a dicing tape having excellent flexibility can be obtained.

The adhesive can be applied, for example, by applying the adhesive to a base film and drying the coating layer by heating. As the coating method, various methods such as bar coater coating, air knife coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexo printing, screen printing, and the like can be employed. The temperature for the heat drying is, for example, 80 to 200 ℃.

By applying the adhesive to the base film, a dicing tape including a base layer and an adhesive layer can be obtained. In the dicing tape of the present invention, as a result of the transfer of the plasticizer between the base material layer/the adhesive layer, the base material layer may contain the plasticizer (a2) contained in the base material film and/or the plasticizer (a1) contained in the adhesive, and the adhesive layer may also contain the plasticizer (a2) contained in the base material film and/or the plasticizer (a1) contained in the adhesive. After the adhesive is applied to the base film, the content of the plasticizer in the adhesive layer is preferably not more than the content of the plasticizer (a1) in the adhesive before application. After the adhesive is applied to the base film, the content of the plasticizer in the adhesive layer is preferably 10 to 100% by weight, more preferably 20 to 80% by weight, and still more preferably 30 to 60% by weight, based on the weight of the plasticizer (a1) in the adhesive before application. The content of the plasticizer in the base material layer is preferably not less than the content of the plasticizer (a2) in the base film.

When a curable adhesive is used as the adhesive, the adhesive layer may be cured to adjust the properties (adhesive force, elastic modulus, etc.) of the adhesive layer. Examples of the curing treatment include ultraviolet irradiation and heat treatment.

When the dicing tape is used for the wafer expansion, the wafer expansion can be performed by using a conventionally known wafer expansion apparatus. The crystal expansion device comprises: the cutting device includes an annular outer ring capable of pressing the cutting belt downward via the cutting ring, and an inner ring having a smaller diameter than the outer ring and supporting the cutting belt. In the wafer-expanding step, the adjacent semiconductor chips can be prevented from contacting each other and being damaged in the pickup step which is a subsequent step.

The crystal growth rate is preferably 0.1 mm/sec or more, more preferably 1 mm/sec or more. When the thickness is 0.1 mm/sec or more, the cutting can be easily performed. On the other hand, the upper limit of the crystal growth rate is not particularly limited.

Examples

The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In the examples, "part(s)" and "%" are based on weight unless otherwise specified.

[ production example 1 ]: production of base film (1)

By calendering, the weight of the PVC is 100A base film (1) containing 20 parts by weight of DOP plasticizer was produced. The thickness of the resulting base film (1) was 70 μm, the maximum elongation (tensile rate 300 mm/min) was 320%, and the tensile strength (strength at break at tensile rate 300 mm/min) was 3600N/cm²。

[ production example 2 ]: production of base film (2)

A base film (1) containing 20 parts by weight of a DOTP plasticizer per 100 parts by weight of polyvinyl chloride was formed into a film by a calendering method. The thickness of the resulting base film (1) was 70 μm, the maximum elongation (tensile rate 300 mm/min) was 290%, and the tensile strength (strength at break at tensile rate 300 mm/min) was 5200N/cm²。

[ example 1]

Adhesive (1) comprising 100 parts by weight of AN acrylic polymer composed of Butyl Acrylate (BA)/Acrylonitrile (AN)/Acrylic Acid (AA) 85/15/2.5 (weight ratio), 10 parts by weight of a melamine-based crosslinking agent (butanol modified melamine formaldehyde resin, manufactured by DIC Corporation, trade name "SUPER BECKAMINEJ-820-60N"), 30 parts by weight of DOP plasticizer, and toluene was prepared. The adhesive (1) was applied to the base film (1), and then dried at 130 ℃ for 90 seconds to form an adhesive layer having a thickness of 10 μm.

Then, a release liner (a polyester film, trade name: MRF, manufactured by Mitsubishi chemical polyester Co., Ltd.) having a thickness of 38 μm and having one surface subjected to a release treatment with silicone was attached to the surface of the pressure-sensitive adhesive layer, and the resultant was stored at 50 ℃ for 72 hours to obtain a dicing tape 1.

[ example 2]

Adhesive (2) was prepared in the same manner as in example 1, except that 30 parts by weight of DOTP plasticizer was used instead of 30 parts by weight of DOP plasticizer. The pressure-sensitive adhesive (2) was applied to the base film (2), and then dried at 150 ℃ for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 μm, and a polyester film (release liner) having one surface thereof subjected to a release treatment with silicone was bonded to the pressure-sensitive adhesive layer surface to obtain a dicing tape 2.

[ example 3]

An adhesive (3) was prepared in the same manner as in example 1, except that the blending amount of the DOP plasticizer was changed to 50 parts by weight. The adhesive (3) was applied to the base film (1), and then dried at 130 ℃ for 90 seconds to form an adhesive layer having a thickness of 10 μm, and a polyester film (release liner) whose one surface was subjected to a release treatment with silicone was bonded to the adhesive layer surface to obtain a dicing tape 3.

[ example 4]

An adhesive (4) was prepared in the same manner as in example 2, except that the amount of the DOTP plasticizer was changed to 50 parts by weight. The pressure-sensitive adhesive (4) was applied to the base film (2), and then dried at 130 ℃ for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 μm, and a polyester film (release liner) having one surface thereof subjected to a release treatment with silicone was bonded to the pressure-sensitive adhesive layer surface to obtain a dicing tape 4.

Comparative example 1

Adhesive (5) was prepared in the same manner as in example 1, except that no plasticizer was added. The pressure-sensitive adhesive (5) was applied to polyethylene as a base film, and then dried at 130 ℃ for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 10 μm, and a polyester film (release liner) having one surface thereof subjected to a release treatment with silicone was bonded to the pressure-sensitive adhesive layer surface to obtain a dicing tape.

Comparative example 2

Adhesive (5) was prepared in the same manner as in example 1, except that no plasticizer was added. The adhesive (5) was applied to a base film (1), and then dried at 130 ℃ for 90 seconds to form an adhesive layer having a thickness of 10 μm, and a polyester film (release liner) having one surface thereof treated with silicone release was bonded to the adhesive layer surface to obtain a dicing tape.

Comparative example 3

Adhesive (5) was prepared in the same manner as in example 1, except that no plasticizer was added. The adhesive (5) was applied to a base film (2), and then dried at 130 ℃ for 90 seconds to form an adhesive layer having a thickness of 10 μm, and a polyester film (release liner) having one surface thereof treated with silicone release was bonded to the adhesive layer surface to obtain a dicing tape.

[ reference example 1]

An adhesive (6) was prepared in the same manner as in example 1, except that the blending amount of the DOP plasticizer was changed to 5 parts by weight. The adhesive (6) was applied to a base film (1), and then dried at 130 ℃ for 90 seconds to form an adhesive layer having a thickness of 10 μm, and a polyester film (release liner) having one surface thereof treated with silicone release was bonded to the adhesive layer surface to obtain a dicing tape.

[ reference example 2]

A pressure-sensitive adhesive (7) was prepared in the same manner as in example 2, except that the amount of the DOTP plasticizer was changed to 5 parts by weight. The adhesive (7) was applied to the base film (2), and then dried at 130 ℃ for 90 seconds to form an adhesive layer having a thickness of 10 μm, and a polyester film (release liner) whose one surface was subjected to a release treatment with silicone was bonded to the adhesive layer surface to obtain a dicing tape.

[ evaluation ] Crystal expansion Property

The dicing tapes obtained in examples and comparative examples were evaluated for their crystal expansion according to the following methods and criteria. The results are shown in Table 1.

(1) A cutting tape with a release liner peeled off was attached to an 8-inch cutting ring.

(2) Only the cut tape was cut under the following conditions.

< cutting conditions >

Cutting size: 0.8mm × 0.8mm

The device comprises the following steps: manufactured by DISCO, "DFD-6450"

A cutter: manufactured by DISCO, "NBC-ZH 205O-SE 27 HECC"

Single cut (Single cut)

A main shaft: 40000rpm

Cutting speed: 80 mm/sec

The height of the blade is as follows: 45um

(3) And placing the cut cutting belt in a crystal expanding device.

(4) The dicing tape was expanded under the following expansion conditions and expansion speed.

< extended conditions >

A crystal expanding device: OEX-840II (Dagong Industrial Co., Ltd.)

And (3) expansion conditions: the jacking amount is 40mm

Expansion speed: 3 mm/sec

Base station temperature: at room temperature

(evaluation criteria) the case where the dicing tape broke during the die-expanding was regarded as a failure (X in Table 1), and the case where the dicing tape did not break was regarded as a failure (good in Table 1).

[ Table 1]

Claims

1. A method for manufacturing a dicing tape, comprising a step of applying an adhesive to a base film to form an adhesive layer,

prior to application of the adhesive to a substrate film,

the adhesive comprises a (meth) acrylic polymer and a plasticizer (a1),

the base film comprises a polyvinyl chloride resin and a plasticizer (a2),

the plasticizer (a1) is contained in an amount of 10 to 150 parts by weight based on 100 parts by weight of the (meth) acrylic polymer,

the plasticizer (a2) is contained in an amount of 10 to 80 parts by weight based on 100 parts by weight of the polyvinyl chloride resin,

the content of the plasticizer (a1) in the adhesive is 1 to 10 times the content of the plasticizer (a2) in the base film,

after the adhesive is applied to the substrate film,

the total content of the plasticizer (a1) and the plasticizer (a2) in the adhesive layer is 10 to 100 wt% based on the weight of the plasticizer (a1) in the adhesive before coating,

the plasticizer (a1) is a terephthalate plasticizer.

2. The method of manufacturing a dicing tape according to claim 1, wherein the plasticizer (a1) is bis (2-ethylhexyl) terephthalate.

3. The method of manufacturing a dicing tape according to claim 1 or 2, wherein the plasticizer (a1) and the plasticizer (a2) are the same series of plasticizers.