TWI802547B - Adhesive tape - Google Patents

Adhesive tape Download PDF

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TWI802547B
TWI802547B TW106126185A TW106126185A TWI802547B TW I802547 B TWI802547 B TW I802547B TW 106126185 A TW106126185 A TW 106126185A TW 106126185 A TW106126185 A TW 106126185A TW I802547 B TWI802547 B TW I802547B
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adhesive
weight
meth
adhesive tape
parts
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TW106126185A
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Chinese (zh)
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TW201816034A (en
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由藤拓三
鄭淼
安藤雅彥
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日商日東電工股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/141—Feedstock

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)

Abstract

本發明之課題在於提供一種黏著帶，其具有充分之黏著力(具備具有充分之凝集性之黏著劑層)，並且雖然包含塑化劑，但可抑制該塑化劑從黏著劑層滲出而不易污染被黏著體。 本發明之黏著帶包括：基材、及配置於該基材之至少一面且包含丙烯酸系黏著劑之黏著劑層，構成該丙烯酸系黏著劑之基礎聚合物包含具有不含游離氫之氫鍵性官能基之結構單元，該黏著劑層包含塑化劑，且該黏著帶於23℃×30分鐘後對SUS板之黏著力為2.1 N/20 mm以下。The object of the present invention is to provide an adhesive tape that has sufficient adhesive force (adhesive layer with sufficient cohesiveness), and although it contains a plasticizer, it can suppress the plasticizer from seeping out of the adhesive layer so that it is not easy to Contamination of adherends. The adhesive tape of the present invention comprises: a base material, and an adhesive layer disposed on at least one side of the base material and comprising an acrylic adhesive. The structural unit of the functional group, the adhesive layer contains a plasticizer, and the adhesive force of the adhesive tape to the SUS plate is below 2.1 N/20 mm at 23°C for 30 minutes.

Description

黏著帶Adhesive tape

本發明係關於一種黏著帶。The invention relates to an adhesive tape.

通常，LED(Light Emitting Diode，發光二極體)封裝體(利用密封樹脂將LED晶片與螢光體密封於引線框架、底座(stem)、板(board)、殼體等所得之電子零件)係採取(拾取)搭載於出貨用黏著帶上之LED晶片而製造。拾取為如下方法：從該黏著帶上之未搭載LED晶片之面側用被稱為釘(pin)或針(needle)等之棒進行頂撞(所謂「針頂」)，然後利用被稱為吸嘴(collet)之吸附治具將LED晶片從黏著帶上吸附分離。通常，LED晶片係於搭載於出貨用黏著帶之狀態下從LED晶片之製造商出貨至LED封裝體之製造商。因此，該LED晶片直至將該LED晶片供於LED封裝體之製造步驟中使用前之期間，於出貨用黏著帶上被保管特定時間(數週～數月)，於LED封裝體之製造步驟中從出貨用黏著帶上被拾取。 如上述LED晶片之出貨用黏著帶所例示般將被黏著體長期貼附於黏著帶後拾取該被黏著體之情形時，存在容易產生對被黏著體之糊劑殘留，糊劑殘留會污染被黏著體之問題。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2005-019607號公報Usually, LED (Light Emitting Diode, light-emitting diode) packages (electronic components obtained by sealing LED chips and phosphors on lead frames, bases (stem), boards, housings, etc. by using sealing resin) are Manufactured by taking (picking up) LED chips mounted on adhesive tapes for shipping. The pick-up method is as follows: from the side of the adhesive tape that is not equipped with the LED chip, bump it with a stick called a pin or a needle (so-called "needle top"), and then use a so-called suction chip. The adsorption jig of the collet absorbs and separates the LED chip from the adhesive tape. Usually, the LED chip is shipped from the manufacturer of the LED chip to the manufacturer of the LED package in a state of being mounted on an adhesive tape for shipping. Therefore, the LED chip is stored on the adhesive tape for shipping for a certain period of time (several weeks to several months) until the LED chip is used in the manufacturing step of the LED package. is picked up from the shipping adhesive tape. When the adherend is attached to the adhesive tape for a long period of time as exemplified by the above-mentioned adhesive tape for shipment of LED chips, when the adherend is picked up, there is a tendency to generate paste residue on the adherend, and the paste residue will contaminate the adherend. The problem of the adherend. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2005-019607

[發明所欲解決之問題] 先前，多使用具有如下黏著劑層之黏著帶，上述黏著劑層含有作為凝集力優異之黏著劑之包含含羧基聚合物之黏著劑。又，通常，構成黏著帶之黏著劑層或基材中含有塑化劑。本發明之發明者等人發現，於先前之黏著帶中，由於含羧基聚合物之羧基與塑化劑之反應等，該聚合物及/或塑化劑會變質，其結果，變質之塑化劑本身變得容易從黏著劑層滲出，又，因變質而降低分散性之塑化劑會從黏著劑層滲出。從黏著劑層滲出之塑化劑會成為剝離被黏著體時之糊劑殘留，成為污染被黏著體之原因。 本發明係為了解決上述先前課題而完成者，其目的在於提供一種黏著帶，其具有充分之黏著力(具備具有充分之凝集性之黏著劑層)，並且雖然包含塑化劑，但抑制該塑化劑從黏著劑層滲出而不易污染被黏著體。 [解決問題之技術手段] 本發明之黏著帶具備：基材、及配置於該基材之至少一面且包含丙烯酸系黏著劑之黏著劑層，構成該丙烯酸系黏著劑之基礎聚合物包含具有不含游離氫之氫鍵性官能基之結構單元，該黏著劑層包含塑化劑，且該黏著帶於23℃×30分鐘後對SUS板之黏著力為2.1 N/20 mm以下。 於一實施形態中，上述具有不含游離氫之氫鍵性官能基之結構單元之含有比率相對於基礎聚合物100重量份為9重量份～23重量份。 於一實施形態中，上述基礎聚合物進而包含源自含羧基單體之結構單元，且源自含羧基單體之結構單元之含有比率相對於基礎聚合物100重量份為0.2重量份以下。 於一實施形態中，上述基礎聚合物不含源自含羧基單體之結構單元。 於一實施形態中，上述具有不含游離氫之氫鍵性官能基之結構單元為源自選自由N-乙烯基-2-吡咯啶酮、N,N-二乙基丙烯醯胺、丙烯醯基嗎啉及(甲基)丙烯酸2-(2-甲基咪唑基)乙酯所組成之群中之至少1種單體的結構單元。 [發明之效果] 根據本發明，能夠提供一種黏著帶，其具有充分之黏著力(具備具有充分之凝集性之黏著劑層)，並且雖然包含塑化劑，但抑制該塑化劑從黏著劑層滲出而不易污染被黏著體。[Problem to be Solved by the Invention] Conventionally, an adhesive tape having an adhesive layer containing an adhesive containing a carboxyl group-containing polymer as an adhesive excellent in cohesive force has been frequently used. In addition, usually, the adhesive layer or base material constituting the adhesive tape contains a plasticizer. The inventors of the present invention found that, in the conventional adhesive tape, the polymer and/or the plasticizer would deteriorate due to the reaction between the carboxyl group of the carboxyl group-containing polymer and the plasticizer, and as a result, the deteriorated plasticization The plasticizer itself becomes easy to ooze out from the adhesive layer, and the plasticizer whose dispersibility is reduced due to deterioration will ooze out from the adhesive layer. The plasticizer exuded from the adhesive layer becomes the paste residue when the adherend is peeled off, and causes contamination of the adherend. The present invention was made in order to solve the aforementioned problems, and its object is to provide an adhesive tape which has sufficient adhesive force (an adhesive layer having sufficient cohesiveness) and which suppresses the plasticizer although it contains a plasticizer. The chemical agent seeps out from the adhesive layer and is not easy to contaminate the adherend. [Technical means to solve the problem] The adhesive tape of the present invention comprises: a base material, and an adhesive layer disposed on at least one side of the base material and containing an acrylic adhesive, and the base polymer constituting the acrylic adhesive contains A structural unit of a hydrogen-bonding functional group containing free hydrogen, the adhesive layer contains a plasticizer, and the adhesive force of the adhesive tape to the SUS plate is less than 2.1 N/20 mm at 23°C for 30 minutes. In one embodiment, the content ratio of the structural unit having a hydrogen-bonding functional group not containing free hydrogen is 9 parts by weight to 23 parts by weight with respect to 100 parts by weight of the base polymer. In one embodiment, the base polymer further includes a structural unit derived from a carboxyl group-containing monomer, and the content ratio of the structural unit derived from a carboxyl group-containing monomer is 0.2 parts by weight or less with respect to 100 parts by weight of the base polymer. In one embodiment, the base polymer does not contain a structural unit derived from a carboxyl group-containing monomer. In one embodiment, the above-mentioned structural unit having a hydrogen-bonding functional group without free hydrogen is derived from the group consisting of N-vinyl-2-pyrrolidone, N,N-diethylacrylamide, acrylamide A structural unit of at least one monomer of the group consisting of morpholine and 2-(2-methylimidazolyl)ethyl (meth)acrylate. [Effects of the Invention] According to the present invention, it is possible to provide an adhesive tape having sufficient adhesive force (having an adhesive layer having sufficient cohesiveness) and containing a plasticizer, but suppressing the plasticizer from being released from the adhesive. Layer oozes out and is not easy to contaminate the adherend.

A.黏著帶之整體構成 圖1係本發明之一實施形態之黏著帶之概略剖視圖。黏著帶100具備：基材10、及配置於基材10之至少一面(圖示例中為單側)之黏著劑層20。黏著劑層20包含丙烯酸系黏著劑。又，黏著劑層20包含塑化劑。再者，黏著劑層中之塑化劑係指黏著劑層之形成材料(具體而言為黏著劑)中所含之塑化劑、及包含於基材之形成材料中並從基材轉移至黏著劑層之塑化劑。雖未進行圖示，但本發明之黏著片直至供於使用前之期間亦可出於保護黏著面之目的而於黏著劑層之外側設置剝離襯墊。 黏著劑層20中所含之丙烯酸系黏著劑包含基礎聚合物，該基礎聚合物包含具有不含游離氫之氫鍵性官能基之結構單元(詳細情況如後述)。本發明中，藉由使用包含具有不含游離氫之氫鍵性官能基之結構單元(以下，亦稱為結構單元A)之基礎聚合物，能夠抑制黏著劑層中之聚合物之凝集性之降低(即，不損害黏著劑層之黏著力)，並且使構成黏著劑之基礎聚合物中之羧基之含有比率減少或為零。藉由減少構成黏著劑之聚合物中之羧基之含有比率，能夠防止黏著劑層中之塑化劑之變質。其結果，抑制塑化劑從黏著劑層滲出，即使於將長期貼附之被黏著體從黏著帶剝離之情形時，亦防止對被黏著體之糊劑殘留(實質上為塑化劑之附著)。 圖2係本發明之另一實施形態之黏著帶之概略剖視圖。黏著帶200具備：基材10、配置於基材10之一面之黏著劑層20、及配置於基材10之與黏著劑層20為相反側之面之非黏著層30。 本發明之黏著帶之厚度較佳為20 μm～120 μm、更佳為30 μm～120 μm、進而較佳為40 μm～120 μm。若為此種範圍，則本發明之效果變得更顯著。於本發明之黏著帶之厚度過薄之情形時，有處理性變差之虞。於本發明之黏著帶之厚度過厚之情形時，有對延伸等變形之追隨性變差而基於針頂之拾取性降低之虞。 本發明之黏著帶於23℃×30分鐘後對SUS板之黏著力之上限較佳為2.1 N/20 mm、更佳為1 N/20 mm、進而較佳為0.5 N/20 mm、尤佳為0.2 N/20 mm、最佳為0.1 N/20 mm。再者，於一實施形態中，上述黏著力可藉由構成黏著劑層之黏著劑中之聚合物所含之羧基之含有比率而控制。換言之，較佳為以上述黏著力成為2.1 N/20 mm以下之方式對黏著劑中之聚合物所含之羧基之含有比率進行調整。本發明之黏著帶於23℃×30分鐘後對SUS板之黏著力之下限較佳為0.01 N/20 mm、更佳為0.05 N/20 mm、進而較佳為0.07 N/20 mm、尤佳為0.08 N/20 mm、最佳為0.09 N/20 mm。本說明書中，「x℃×y分鐘後對SUS板之黏著力」係指藉由依據JIS Z 0237：2000之方法測得之黏著力，係使2kg輥往返1次進行壓接而將黏著帶與SUS板積層，將獲得之積層體於x℃之環境下保管y分鐘，然後於23℃之環境下以拉伸速度300 mm/分鐘、剝離角度180°剝離黏著帶而測得之黏著力。 本發明之黏著帶於50℃×2天後對SUS板之黏著力為0.05 N/20 mm～0.85 N/20 mm、較佳為0.1 N/20 mm～0.8 N/20 mm、更佳為0.12 N/20 mm～0.7 N/20 mm、尤佳為0.15 N/20 mm～0.5 N/20 mm。 上述50℃×2天後之黏著力係假定長期保管、即從將被黏著體貼附於黏著帶至剝離前之期間為長期(例如常溫下約60天)之情形的加速試驗條件下之黏著力。假定長期保管之加速試驗條件(50℃×2天)係以下述方式決定。作為推測保管一定期間後之黏著劑之行為之方法，使用加熱加速試驗。其係藉由加熱而於短時間內預測長期變化者，其變化速度係假設依據阿瑞尼斯定律進行加速。阿瑞尼斯之式係由K＝A×exp(-Ea/RT)表示。此處，K為反應速度係數、A為頻度因數、Ea為活化能、R為氣體常數、T為絕對溫度(K)。Ea(活化能)係使用21000[cal/mol]，該數值係如「日東技報」Vol.27, No.2(Nov.1989)中所記載，假設由丙烯酸系黏著劑之力學物性測定值利用時間溫度換算法則所獲得之位移因數為阿瑞尼斯型而算出。由此，於20℃與50℃下之反應速度係數為 K(20℃)＝A×exp(-21000/293R) K(50℃)＝A×exp(-21000/323R)。 利用該式，兩溫度之反應速度係數比為 K(50℃)/K(20℃)＝28.5。 此處，假設於平均溫度20℃之環境下，於貼附於黏著帶之狀態下保管被黏著體。若將加速試驗之溫度設定為50℃，推算根據阿瑞尼斯定律於20℃之保存期間，則50℃×2天≈20℃×57天。 B.黏著劑層 B-1.丙烯酸系黏著劑 如上所述，黏著劑層包含丙烯酸系黏著劑。 B-1-1.基礎聚合物 上述丙烯酸系黏著劑包含(甲基)丙烯酸系聚合物作為基礎聚合物。於一實施形態中，上述(甲基)丙烯酸系聚合物可由包含(甲基)丙烯酸酯作為主單體、並且包含具有不含游離氫之氫鍵性官能基之單體(以下，亦稱為單體a)的單體成分生成。 (甲基)丙烯酸系聚合物中，源自主單體之結構單元之含有比率相對於基礎聚合物100重量份，較佳為60重量份以上、更佳為60重量份～95重量份、進而較佳為65重量份～85重量份。 (甲基)丙烯酸系聚合物中，具有不含游離氫之氫鍵性官能基之結構單元之含有比率相對於基礎聚合物100重量份，較佳為5重量份～40重量份、更佳為8重量份～35重量份、進而較佳為9重量份～30重量份、尤佳為9重量份～23重量份。若為此種範圍，則能夠形成凝集性優異並且糊劑殘留較少之黏著劑層。 (甲基)丙烯酸系聚合物中，具有氫鍵性官能基之結構單元之含有比率相對於基礎聚合物100重量份，較佳為10重量份～50重量份、更佳為10重量份～40重量份、進而較佳為10重量份～32重量份。若為此種範圍，則能夠形成凝集性優異之黏著劑層。 (具有不含游離氫之氫鍵性官能基之單體(單體a)) 單體a具有氫鍵性官能基。此處，氫鍵係指利用共價鍵連結於氮、氧、硫等陰電性較大之原子之氫原子(氫鍵供體)與存在於上述氫原子附近之氮、氧、硫等陰電性較大之原子(氫鍵受體)之孤立電子對藉由靜電相互作用而形成的非共價鍵性之化學鍵。 不含游離氫之氫鍵性官能基係指於氫鍵中可成為氫鍵受體之官能基，例如可列舉包含不直接與氫鍵結之高陰電性原子(例如、氮、氧、硫)之官能基。作為不含游離氫之氫鍵性官能基之具體例，可列舉：胺基(其中，胺基氮原子上未鍵結氫原子)、羰基、硫醯胺基(其中，硫醯胺基硫原子上未鍵結氫原子)、硫醚基、N-烷基醯胺基(其中，醯胺基氮原子上未鍵結氫原子)、N-烷基醯亞胺基等。其中較佳為胺基(其中，胺基氮原子上未鍵結氫原子)、硫醯胺基、硫醚基、N-烷基醯胺基或N-烷基醯亞胺基。該等官能基由於具有陰電性較大之原子(氮原子、硫原子)，因此氫鍵性較強，若使用具有該官能基之基礎聚合物，則能夠獲得凝集性較高並且能使塑化劑良好地分散之黏著劑。 作為上述單體a之具體例，可列舉：N-乙烯基-2-吡咯啶酮、N,N-二乙基丙烯醯胺、丙烯醯基嗎啉、(甲基)丙烯酸2-(2-甲基咪唑基)乙酯等。單體a可單獨使用僅1種，亦可組合2種以上使用。 由上述單體a形成之均聚物之玻璃轉移溫度較佳為50℃～150℃、更佳為60℃～150℃、進而較佳為70℃～145℃。均聚物之玻璃轉移溫度為上述範圍意味著該均聚物之聚合物鏈間之分子間力較強，意味著構成該均聚物之單體所具有之氫鍵性官能基之氫鍵結能力優異。 (主單體) 作為上述(甲基)丙烯酸酯，較佳為使用不具有氫鍵性之單體。作為上述(甲基)丙烯酸酯，例如可列舉碳數1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯。(甲基)丙烯酸酯可單獨使用僅1種，亦可組合2種以上使用。 作為碳數1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯，例如可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯(pentyl (metha)acrylate)、(甲基)丙烯酸戊酯(amyl (metha)acrylate)、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯、(甲基)丙烯酸月桂酯等碳數1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯等。該等(甲基)丙烯酸酯中，較佳為碳數2～20之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯、更佳為碳數4～18之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯。 (其他單體) 只要可獲得本發明之效果，則(甲基)丙烯酸系聚合物可包含源自除(甲基)丙烯酸酯(主單體)及單體a以外之其他單體之結構單元。 作為上述其他單體，例如可列舉：丙烯酸、甲基丙烯酸、伊康酸、馬來酸、富馬酸、巴豆酸、丙烯酸羧基乙酯等含羧基單體；(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯等含羥基單體；苯乙烯磺酸、烯丙基磺酸等含磺酸基單體；丙烯醯基磷酸2-羥基乙酯等含磷酸基單體等。於一實施形態中，可使用含羧基單體及/或含羥基單體作為其他單體。 亦可使用具有包含游離氫之氫鍵性官能基之單體(例如含羧基單體及/或含羥基單體)作為上述其他單體。(甲基)丙烯酸系聚合物中，具有包含游離氫之氫鍵性官能基之結構單元之含有比率相對於(甲基)丙烯酸系聚合物100重量份，較佳為20重量份以下、更佳為15重量份以下、進而較佳為10重量份以下。於一實施形態中，可使用含羧基單體作為其他單體，(甲基)丙烯酸系聚合物中，源自含羧基單體之結構單元之含有比率相對於基礎聚合物((甲基)丙烯酸系聚合物)100重量份為0.2重量份以下。於其他實施形態中，(甲基)丙烯酸系聚合物不含源自含羧基單體之結構單元。 B-1-2.添加劑 上述丙烯酸系黏著劑亦可包含任意適當之添加劑。 於一實施形態中，上述丙烯酸系黏著劑包含塑化劑。若使用包含塑化劑之丙烯酸系黏著劑，則能夠防止基材中之塑化劑轉移至黏著劑層，或抑制經轉移之塑化劑之影響，能夠獲得經時變化較少之黏著帶。作為上述塑化劑，例如可列舉：對苯二甲酸酯系塑化劑、間苯二甲酸酯系塑化劑、鄰苯二甲酸酯系塑化劑、偏苯三甲酸酯系塑化劑(偏苯三甲酸三辛酯等)、己二酸酯系塑化劑(己二酸二辛酯、己二酸二異壬酯等)、磷酸酯系塑化劑(磷酸三甲酚酯等)、己二酸系酯系塑化劑、檸檬酸酯系塑化劑(乙醯基檸檬酸三丁酯等)、癸二酸酯系塑化劑、壬二酸酯系塑化劑、馬來酸酯系塑化劑、苯甲酸酯系塑化劑、聚醚系聚酯系塑化劑、環氧系聚酯系塑化劑(環氧化大豆油、環氧化亞麻仁油等)、包含多元羧酸與多元醇之聚酯等。塑化劑可僅為1種，亦可為2種以上。 於一實施形態中，使用對苯二甲酸酯系塑化劑作為上述塑化劑。若使用對苯二甲酸酯系塑化劑，則能夠獲得即使於貼附尺寸相對較大之被黏著體(例如LED晶片)時亦能夠良好地拾取被黏著體而拾取性不降低之黏著帶。又，即使於貼附被黏著體之狀態下長期保管時，亦可抑制拾取性之降低。拾取性優異之黏著帶可製成出貨用黏著帶而良好地使用。作為對苯二甲酸酯系塑化劑，例如可使用對苯二甲酸與碳數4～16(較佳為6～14、更佳為8～13)之烷醇之二酯。作為對苯二甲酸酯系塑化劑，例如可列舉：對苯二甲酸二丁酯(DBTP)、對苯二甲酸二異丁酯(DIBTP)、對苯二甲酸二正己酯(DHTP)、對苯二甲酸雙(2-乙基己基)酯(DOTP)、對苯二甲酸二正辛酯(DnOTP)、對苯二甲酸二異壬酯(DINTP)、對苯二甲酸二壬酯(DNTP)、對苯二甲酸二異癸酯(DIDTP)、對苯二甲酸雙(丁基苄基)酯(BBTP)等。其中較佳為DOTP。 作為上述鄰苯二甲酸酯系塑化劑，例如可使用鄰苯二甲酸與碳數4～16(較佳為6～14、更佳為8～13)之烷醇之二酯。作為鄰苯二甲酸酯系塑化劑，例如可列舉：鄰苯二甲酸二正辛酯、鄰苯二甲酸二(2-乙基己基)酯、鄰苯二甲酸二異壬酯、鄰苯二甲酸二異癸酯等。 作為上述偏苯三甲酸酯系塑化劑，例如可使用偏苯三甲酸與碳數6～14(較佳為8～12)之烷醇之三酯。作為上述偏苯三甲酸酯系塑化劑，例如可列舉：偏苯三甲酸三正辛酯、偏苯三甲酸三(2-乙基己基)酯、偏苯三甲酸三異壬酯、偏苯三甲酸三正癸酯、偏苯三甲酸三異癸酯等。 作為上述均苯四甲酸酯系塑化劑，例如可使用均苯四甲酸與碳數6～14(較佳為8～12)之烷醇之四酯。作為上述均苯四甲酸酯系塑化劑，例如可列舉：均苯四甲酸四正辛酯、均苯四甲酸四(2-乙基己基)酯、均苯四甲酸三正癸酯等。 作為上述己二酸酯系塑化劑，例如可使用己二酸與碳數4～16(較佳為6～14、更佳為8～13)之烷醇之二酯。作為上述己二酸酯系塑化劑，例如可列舉：己二酸二正辛酯、己二酸二(2-乙基己基)酯、己二酸二異壬酯等。 作為上述包含多元羧酸與多元醇之聚酯，例如可使用由琥珀酸、己二酸、辛二酸、壬二酸、癸二酸、檸檬酸、鄰苯二甲酸、間苯二甲酸、對苯二甲酸、偏苯三甲酸等多元羧酸與(聚)乙二醇(此處「(聚)乙二醇」係包括乙二醇及聚乙二醇之含義；下同)、(聚)丙二醇、(聚)丁二醇、(聚)己二醇、(聚)新戊二醇、聚乙烯醇等多元醇獲得之聚酯化合物。作為上述多元羧酸，較佳為碳數4～12(較佳為6～10)之脂肪族二羧酸，例如可列舉己二酸、癸二酸等。作為上述多元醇，較佳為碳數2～10之脂肪族二醇，例如可列舉乙二醇、1,3-丁二醇、1,4-丁二醇等。 於上述丙烯酸系黏著劑包含塑化劑之情形時，塑化劑之含有比率相對於丙烯酸系黏著劑中之基礎聚合物100重量份，較佳為10重量份～90重量份、更佳為20重量份～80重量份、進而較佳為30重量份～70重量份、尤佳為40重量份～60重量份。 於一實施形態中，上述丙烯酸系黏著劑包含交聯劑。交聯劑之含有比率相對於基礎聚合物100重量份，較佳為0.1重量份～30重量份、更佳為0.3重量份～25重量份、進而較佳為0.5重量份～25重量份、進而較佳為1重量份～25重量份、進而較佳為3重量份～20重量份、尤佳為5重量份～15重量份。若為此種範圍，則能夠獲得將經小片化之被黏著體(例如LED晶片)長期保存於黏著帶上後亦能夠進一步抑制黏著力之上升而更容易拾取之黏著帶。又，能夠產生適度之交聯反應，能夠有效地防止對被黏著體之糊劑殘留。 作為交聯劑，例如可列舉：環氧系交聯劑、異氰酸酯系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。交聯劑可僅為1種，亦可為2種以上。 上述丙烯酸系黏著劑於不損害本發明之效果之範圍內可進而包含任意適當之其他添加劑。作為添加劑，例如可列舉：觸媒、紫外線吸收劑、填充劑、防老化劑、黏著賦予劑、顏料、染料、矽烷偶合劑等。 B-2.黏著劑層之特性等 黏著劑層之厚度較佳為1 μm～30 μm、更佳為1 μm～20 μm、進而較佳為3 μm～15 μm。於黏著劑層之厚度未達1 μm之情形時，有無法表現出充分之黏著力之虞。於黏著劑層之厚度大於30 μm之情形時，有經小片化之被黏著體(例如LED晶片)埋入至黏著劑層，拾取時之針頂位置之精度降低之虞。 黏著劑層於25℃下基於奈米壓痕法測得之彈性模數(以下，亦簡稱為奈米壓痕彈性模數)為4.0 MPa～30 MPa、較佳為4.5 MPa～27 MPa、更佳為6.0 MPa～25 MPa、尤佳為7.0 MPa～22 MPa。再者，基於奈米壓痕法測得之彈性模數可於下述條件下測定。 (測定裝置及測定條件) 裝置：Hysitron Inc. 製造之Tribo Indenter 使用壓頭：Berkovich(三角錐型) 測定方法：單一壓入測定 測定溫度：25℃ 壓入深度設定：約300 nm 壓入速度：約10 nm/秒 測定氣氛：空氣中 試樣尺寸：約1 cm×約1cm (測定方法) 使用上述裝置，將Berkovich型金剛石製壓頭從黏著劑層之表面垂直壓入直至深度300 nm。使用解析軟體「Triboscan Ver.9.2.12.0」，由除去壓頭後獲得之位移、荷重與理論算出之壓痕面積求出表面之彈性模數。 如上所述，黏著劑層包含塑化劑(源自黏著劑之塑化劑及/或源自基材之塑化劑)。黏著劑層中之塑化劑之含有比率相對於構成黏著劑之基礎聚合物100重量份，較佳為10重量份～100重量份、更佳為20重量份～90重量份、進而較佳為30重量份～80重量份、尤佳為30重量份～70重量份。若為此種範圍，則能夠獲得柔軟性較高而對被黏著體之追隨性優異，並且塑化劑不易從黏著劑層滲出之黏著帶。 作為將黏著劑層設置於基材上之方法，可採用任意適當之方法。例如可藉由將形成黏著劑層之塗覆液塗覆於基材上而形成黏著劑層。 作為塗覆方式，可採用任意適當之塗覆方式。作為塗覆方式，例如可列舉逆轉方式、直接方式、與計量輥組合之各種方式等。 本發明之黏著帶亦可於黏著劑層之表面具備剝離襯墊。 作為剝離襯墊，可採用任意適當之隔離膜。作為此種剝離襯墊，例如可列舉：利用聚矽氧系、長鏈烷基系、氟系、硫化鉬等之剝離劑進行過表面處理之塑膠膜或紙等具有剝離層之基材；包含聚四氟乙烯、聚氯三氟乙烯、聚氟乙烯、聚偏二氟乙烯、四氟乙烯-六氟丙烯共聚物、氯氟乙烯-偏二氟乙烯共聚物等氟系聚合物之低接著性基材；包含烯烴系樹脂(例如聚乙烯、聚丙烯等)等無極性聚合物之低接著性基材；等。 於使用剝離襯墊之情形時，亦可藉由將塗覆液塗覆於剝離襯墊上，貼合於基材上使黏著劑層轉印而於基材上設置黏著劑層。 C.基材 基材之厚度較佳為20 μm～120 μm、更佳為30 μm～120 μm、進而較佳為40 μm～120 μm。於基材之厚度過薄之情形時，有處理性變差之虞。於基材之厚度過厚之情形時，有對延伸等變形之追隨性變差而基於針頂之拾取性降低之虞。 基材之依據JIS-K-7127(1999年)測得之最大伸長率較佳為100%以上、更佳為200%～1000%。藉由使用顯示出此種最大伸長率之基材，能夠賦予本發明之黏著帶適度之伸長性，例如可提高對被黏著體之追隨性。最大伸長率可於23℃之環境下測定。 作為構成基材之材料，可使用任意適當之材料。較佳為使用塑膠膜作為基材。 塑膠膜可包含任意適當之樹脂材料。作為此種樹脂材料，例如可列舉：聚氯乙烯、聚烯烴、乙烯-乙酸乙烯酯共聚物、聚酯、聚醯亞胺、聚醯胺等。其中較佳為聚氯乙烯、聚烯烴或乙烯-乙酸乙烯酯共聚物，更佳為聚氯乙烯。聚氯乙烯由於應力緩和性優異，因此能夠適度地緩和針頂時之衝擊，抑制經小片化之被黏著體(例如LED晶片)之位置偏移或脫落。若使用此種聚氯乙烯，則能夠獲得適合作為經小片化之被黏著體(例如LED晶片)之出貨用黏著帶之黏著帶。 作為塑膠膜中之上述樹脂材料之含有比率，相對於塑膠膜100重量份，例如為50重量份～100重量份、較佳為60重量份～100重量份、進而較佳為70重量份～100重量份。 於一實施形態中，上述基材所使用之塑膠膜包含塑化劑。作為塑膠膜中所含之塑化劑，可列舉上述B-1-2項中說明之塑化劑。塑膠膜中之塑化劑之含有比率相對於該塑膠膜中之上述樹脂材料100重量份，較佳為0.5重量份～50重量份、更佳為1.0重量份～40重量份。藉由使塑膠膜中以上述含有比率包含塑化劑，能夠獲得對延伸等變形之追隨性優異而拾取性良好之黏著帶。 於塑膠膜中，亦可於不損害本發明之效果之範圍內包含任意適當之其他成分。 基材可藉由任意適當之製造方法而製造。例如可藉由射出成形、擠出成形、吹脹成形、壓延成形、吹塑成形等成形方法獲得基材。 D.非黏著層 於一實施形態中，本發明之黏著帶於基材之單面具備黏著劑層，於該基材之與該黏著劑層相反之面具備非黏著層。再者，非黏著層係指即使於23℃壓接於SUS板亦無法維持密接狀態，容易產生位置偏移或自然剝離之層。 對此種非黏著層之組成等並無特別限定，作為其一例，可列舉：聚矽氧層、(甲基)丙烯酸系聚合物層、聚矽氧層與(甲基)丙烯酸系聚合物層之混合層、接枝聚合有(甲基)丙烯酸系聚合物之聚矽氧層等。該等之中，較佳為聚矽氧與(甲基)丙烯酸系聚合物之混合層。藉由將非黏著層設為聚矽氧與(甲基)丙烯酸系聚合物之混合層，非黏著層與基材(特別是塑膠膜)之適應性變良好，本發明之黏著帶對延伸等變形之追隨性變良好。 非黏著層之表面較佳為具有凹凸結構。藉由使非黏著層之表面具有凹凸結構，能夠獲得處理性優異之黏著帶。該凹凸結構具體而言，非黏著層之算數平均表面粗糙度Ra較佳為0.1 μm以上、更佳為0.1 μm～3.0 μm、進而較佳為0.2 μm～2.0 μm、尤佳為0.3 μm～2.0 μm、最佳為0.5 μm～2.0 μm。若為此種範圍，則能夠獲得黏連被抑制之黏著帶。表面粗糙度Ra可依據JIS B 0601：1994進行測定。 非黏著層之基於差示掃描熱量測定(DSC測定)所測得之玻璃轉移溫度Tg較佳為20℃以上、更佳為30℃以上、進而較佳為50℃以上、尤佳為55℃以上。對非黏著層之基於差示掃描量熱測定所測得之玻璃轉移溫度Tg之上限並無特別限定，就處理性等觀點而言，較佳為200℃以下、更佳為170℃以下、進而較佳為150℃以下、尤佳為130℃以下、最佳為100℃以下。若為此種範圍，則非黏著層具有適度之硬度，能夠防止由於搬送步驟中之摩擦等導致非黏著層脫落。 於非黏著層包含(甲基)丙烯酸系聚合物之情形時，非黏著層中之(甲基)丙烯酸系聚合物之SP值較佳為9.0(cal/cm3 )0.5 ～12.0(cal/cm3 )0.5 、更佳為9.5(cal/cm3 )0.5 ～11.5(cal/cm3 )0.5 、進而較佳為9.5(cal/cm3 )0.5 ～11.0(cal/cm3 )0.5 。SP值係根據Small式算出之溶解度參數。SP值之計算可藉由公知之文獻(例如Journal of Applied Chemistry, 3, 71, 1953.等)中記載之方法進行。 非黏著層較佳為具有相分離結構。藉由使非黏著層具有相分離結構，能夠於該非黏著層之表面高效地形成微小之凹凸結構。例如於非黏著層為聚矽氧與(甲基)丙烯酸系聚合物之混合層之情形時，推測因生成相分離結構時聚矽氧與(甲基)丙烯酸系聚合物之物質移動性之差異而產生凹凸。若如此形成凹凸結構，則可獲得處理性優異，並且製成捲筒形態時黏連被抑制之黏著帶。 非黏著層較佳為包含聚矽氧含量大於(甲基)丙烯酸系聚合物之富聚矽氧相與(甲基)丙烯酸系聚合物含量大於聚矽氧之富(甲基)丙烯酸系聚合物相。更具體而言，較佳為以上述富聚矽氧相與上述富(甲基)丙烯酸系聚合物相互相獨立之相分離結構包含非黏著層，更佳為上述富聚矽氧相存在於空氣界面側(基材之相反側)、上述富(甲基)丙烯酸系聚合物相存在於基材側。藉由具有此種相分離結構，而利用存在於空氣界面側之富聚矽氧相有效地抑制黏連，利用存在於基材側之富(甲基)丙烯酸系聚合物相使非黏著層與基材之適應性變良好，變形追隨性變良好。例如藉由如下所述地調整非黏著層中之聚矽氧與(甲基)丙烯酸系聚合物之混合比，可形成此種相分離結構。 可藉由任意適當之方法觀察非黏著層具有相分離結構、或包含如上所述聚矽氧含量大於(甲基)丙烯酸系聚合物之富聚矽氧相與(甲基)丙烯酸系聚合物含量大於聚矽氧之富(甲基)丙烯酸系聚合物相。作為此種觀察方法，例如可列舉使用穿透式電子顯微鏡(TEM)、掃描式電子顯微鏡(SEM)、電解發射掃描式電子顯微鏡(FE-SEM)等電子顯微鏡對非黏著層剖面進行形態觀察之方法。2層分離結構可藉由形態觀察圖像之深淺來判別。又，亦可列舉藉由利用基於全反射法之紅外吸收光譜，一邊使探針光深度從非黏著層空氣界面側向內部改變，一邊觀測組成中所含之矽或碳等之含量之變化來進行觀察之方法。此外，亦可列舉利用X射線顯微分析儀或X射線光電子光譜進行觀察之方法。又，亦可適當地組合該等方法觀察。 於非黏著層為聚矽氧與(甲基)丙烯酸系聚合物之混合層之情形時，非黏著層中之聚矽氧與(甲基)丙烯酸系聚合物之混合比以重量比計較佳為聚矽氧：(甲基)丙烯酸系聚合物＝1：50～50：1，更佳為聚矽氧：(甲基)丙烯酸系聚合物＝1：30～30：1，進而較佳為聚矽氧：(甲基)丙烯酸系聚合物＝1：10～10：1，尤佳為聚矽氧：(甲基)丙烯酸系聚合物＝1：5～5：1，最佳為聚矽氧：(甲基)丙烯酸系聚合物＝1：3～5：1。若非黏著層中之聚矽氧之含有比率過大，則有與基材(特別是塑膠膜)背面之化學親和性變低，不易與基材(特別是塑膠膜)背面相適應之虞。又，若非黏著層中之聚矽氧之含有比率過大，則有製成黏著帶之情形時對延伸等變形之追隨性變差之虞。若非黏著層中之(甲基)丙烯酸系聚合物之含有比率過大，則有非黏著層發揮作為丙烯酸系黏著劑之作用之虞，有容易產生黏連之虞。 作為聚矽氧，可採用任意適當之聚矽氧。作為此種聚矽氧，例如可列舉：將鉑系化合物作為觸媒，使含烯基聚二烷基矽氧烷與聚二烷基氫聚矽氧烷藉由加成反應而硬化，形成剝離性皮膜所獲得之加成型聚矽氧；利用錫系觸媒使含羥甲基聚二烷基矽氧烷與聚二烷基氫聚矽氧烷反應而獲得之縮合型聚矽氧等。作為加成型聚矽氧之例，例如可列舉Shin-Etsu Silicone製造之「KS-776A」、「KS-839L」等。作為縮合型聚矽氧之例，例如可列舉Shin-Etsu Silicone製造之「KS723A/B」等。再者，製造聚矽氧時，除了鉑系觸媒或錫系觸媒以外，亦可適當使用其他交聯劑、交聯促進劑等。又，按照聚矽氧之性狀，可分為溶解於甲苯等有機溶劑之類型、將該等乳化而成之乳化型、僅由聚矽氧構成之無溶劑型等。又，除了加成型聚矽氧或縮合型聚矽氧以外，可使用聚矽氧/丙烯酸系接枝聚合物、聚矽氧/丙烯酸系嵌段聚合物等。作為聚矽氧/丙烯酸系接枝聚合物，例如可列舉SYMAC GS-30、GS101、US-270、US-350、US-380(以上為東亞合成股份有限公司製造)等。作為聚矽氧/丙烯酸系嵌段聚合物，例如可列舉MODIPER FS700、FS710、FS720、FS730、FS770(以上為日油股份有限公司製造)等。 非黏著層中所含之(甲基)丙烯酸系聚合物為含有包含(甲基)丙烯酸系單體作為主單體之單體成分的聚合物。又，構成上述(甲基)丙烯酸系聚合物之單體成分亦可包含例如含羥基單體、含羧基單體等其他單體。 非黏著層中所含之(甲基)丙烯酸系聚合物中，源自(甲基)丙烯酸系單體之結構單元之含有比率相對於(甲基)丙烯酸系聚合物100重量份，較佳為50重量份以上、更佳為70重量份～100重量份、進而較佳為90重量份～100重量份、尤佳為95重量份～100重量份。上述單體成分中之單體可僅為1種，亦可為2種以上。 作為(甲基)丙烯酸系單體，可較佳列舉(甲基)丙烯酸酯、(甲基)丙烯酸。 作為(甲基)丙烯酸酯，例如可列舉碳數1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯、含羥基(甲基)丙烯酸酯等。(甲基)丙烯酸酯可僅為1種，亦可為2種以上。 作為碳數1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯，例如可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯(pentyl (metha)acrylate)、(甲基)丙烯酸戊酯(amyl (metha)acrylate)、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯、(甲基)丙烯酸月桂酯等碳數1～30之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯等。該等(甲基)丙烯酸酯中，較佳為碳數2～20之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯、更佳為碳數為4～18之烷基(亦包括環烷基)之(甲基)丙烯酸烷基酯。 作為含羥基(甲基)丙烯酸酯，例如可列舉：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯等。 為了充分表現本發明之效果，構成上述(甲基)丙烯酸系聚合物之單體成分亦可包含選自含羥基單體、含羧基單體之至少1種。 作為含羥基單體，例如可列舉烯丙醇等。含羥基單體可僅為1種，亦可為2種以上。 作為含羧基單體，例如可列舉：(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、巴豆酸、馬來酸、富馬酸、伊康酸等。含羧基單體可僅為1種，亦可為2種以上。 於非黏著層包含(甲基)丙烯酸系聚合物之情形時，非黏著層中之(甲基)丙烯酸系聚合物較佳為構成其之單體成分中之含羥基(甲基)丙烯酸酯之含有比率相對於除該含羥基(甲基)丙烯酸酯以外之單體成分之總量，較佳為2重量%～30重量%、更佳為3重量%～25重量%、尤佳為5重量%～20重量%。於非黏著層包含(甲基)丙烯酸系聚合物之情形時，構成非黏著層中之(甲基)丙烯酸系聚合物之單體成分中之含羥基(甲基)丙烯酸酯之含有比率相對於除該含羥基(甲基)丙烯酸酯以外之單體成分之總量若落入上述範圍內，則會於非黏著層之表面進一步高效地形成微小之凹凸結構，藉由形成該凹凸結構，能夠進一步有效地抑制本發明之黏著帶於捲筒狀形態下黏連，可進一步抑制從捲筒狀形態解捲時裂開或破裂。 於非黏著層包含(甲基)丙烯酸系聚合物之情形時，非黏著層中之(甲基)丙烯酸系聚合物較佳為於構成其之單體成分中之除含羥基(甲基)丙烯酸酯以外之單體成分中可包含(甲基)丙烯酸及/或(甲基)丙烯酸酯。於該情形時，關於(甲基)丙烯酸與(甲基)丙烯酸酯之含有比例，以重量比計，(甲基)丙烯酸：(甲基)丙烯酸酯較佳為0：100～20：80、更佳為0：100～10：90、進而較佳為0：100～5：95。 若(甲基)丙烯酸與(甲基)丙烯酸酯之含有比例落入上述範圍內，則會於非黏著層之表面進一步高效地形成微小之凹凸結構，藉由形成該凹凸結構，能夠進一步有效地抑制本發明之黏著帶於捲筒狀形態下之黏連，可進一步抑制從捲筒狀形態解捲時開裂或破裂。 (甲基)丙烯酸系聚合物可藉由任意適當之聚合方法而製造。 於不損害本發明之效果之範圍內，非黏著層中亦可包含任意適當之添加劑。作為此種添加劑，例如可列舉：觸媒、紫外線吸收劑、填充劑、防老化劑、黏著賦予劑、顏料、染料、矽烷偶合劑等。 非黏著層之厚度較佳為0.01 μm～10 μm、更佳為0.1 μm～5 μm、進而較佳為0.1 μm～2 μm。於非黏著層之厚度未達0.01 μm之情形時時，變得容易產生黏連。於非黏著層之厚度大於10 μm時，有對延伸等變形之追隨性變差之虞。 作為於基材之單面形成非黏著層之方法，例如可列舉於基材之單面塗佈非黏著層之材料並進行乾燥而形成非黏著層之方法。作為上述塗佈之方法，可列舉使用例如棒塗機、凹版塗佈機、旋塗器、輥塗機、刮刀塗佈機、敷料器等之方法。 [實施例] 以下，藉由實施例對本發明進行具體說明，但本發明不受該等實施例任何限定。只要無特別說明，則份係指重量份，%係指重量%。又，以溶液形式供給之試劑之量係由使溶液揮發而殘留之固形物成分之量(固形物成分換算量)表示。 [製造例1]軟質聚氯乙烯膜(1)之製造 藉由壓延法製造相對於聚合度P＝1050之聚氯乙烯100重量份包含DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)30重量份之軟質聚氯乙烯膜(1)。該軟質聚氯乙烯膜(1)之厚度為70 μm、依據JIS-K-7127測得之彈性模數(MD)為250 MPa、依據JIS-K-7127測得之最大伸長率(MD)為400%。又，剛製造後之表面粗糙度(算術平均表面粗糙度Ra)為0.1 μm。 [製造例2]軟質聚氯乙烯膜(2)之製造 藉由壓延法製造相對於聚合度P＝1050之聚氯乙烯100重量份包含DINP塑化劑(鄰苯二甲酸雙(異壬基)酯、J-PLUS製造)30重量份之軟質聚氯乙烯膜(2)。該軟質聚氯乙烯膜(2)之厚度為70 μm、依據JIS-K-7127測得之彈性模數(MD)為250 MPa、依據JIS-K-7127測得之最大伸長率(MD)為400%。又，剛製造後之表面粗糙度(算術平均表面粗糙度Ra)為0.1 μm。 [製造例3]軟質聚氯乙烯膜(3)之製造 藉由壓延法製造相對於聚合度P＝1050之聚氯乙烯100重量份包含己二酸系低分子聚酯塑化劑(ADEKA公司製造、商品名「ADEKA CIZER PN-7160」)30重量份之軟質聚氯乙烯膜(3)。該軟質聚氯乙烯膜(3)之厚度為70 μm、依據JIS-K-7127測得之彈性模數(MD)為250 MPa、依據JIS-K-7127測得之最大伸長率(MD)為400%。又，剛製造後之表面粗糙度(算術平均表面粗糙度Ra)為0.1 μm。 [製造例4]軟質聚氯乙烯膜(4)之製造 藉由壓延法製造相對於聚合度P＝1050之聚氯乙烯100重量份包含DOP塑化劑(鄰苯二甲酸雙(2-乙基己基)酯、J-PLUS製造)30重量份之軟質聚氯乙烯膜(4)。該軟質聚氯乙烯膜(4)之厚度為70 μm、依據JIS-K-7127測得之彈性模數(MD)為250 MPa、依據JIS-K-7127測得之最大伸長率(MD)為400%。又，剛製造後之表面粗糙度(算術平均表面粗糙度Ra)為0.1 μm。 [製造例5]軟質聚氯乙烯膜(5)之製造 藉由壓延法製造相對於聚合度P＝1050之聚氯乙烯100重量份包含DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)40重量份之軟質聚氯乙烯膜(5)。該軟質聚氯乙烯膜(5)之厚度為70 μm，依據JIS-K-7127測得之彈性模數(MD)為200 MPa、依據JIS-K-7127測得之最大伸長率(MD)為400%。又，剛製造後之表面粗糙度(算術平均表面粗糙度Ra)為0.1 μm。 [實施例1] 製備如下黏著劑之乙酸乙酯溶液，上述黏著劑含有：包含丙烯酸丁酯(BA)/N-乙烯基-2-吡咯啶酮(NVP)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝85/15/10/0.25(重量比)之丙烯酸系共聚物A(重量平均分子量＝1500000)100重量份、異氰酸酯系交聯劑(TOSOH製造、商品名「CORONATE L」)5重量份、乙二胺多元醇(ADEKA公司製造、商品名「Adeka polyol EDP-300」)2.5重量份、及DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份。再者，NVP為具有不含游離氫之氫鍵性官能基之單體，由該單體構成之均聚物之玻璃轉移溫度為54℃。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(1)。 [實施例2] 使用包含丙烯酸丁酯(BA)/N,N-二乙基丙烯醯胺(DEAA)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝85/15/10/0.25(重量比)之丙烯酸系共聚物B(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。再者，DEAA為具有不含游離氫之氫鍵性官能基之單體，由該單體構成之均聚物之玻璃轉移溫度為81℃。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(2)。 [實施例3] 使用包含丙烯酸丁酯(BA)/丙烯醯基嗎啉(ACMO)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝85/15/10/0.25(重量比)之丙烯酸系共聚物C(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。再者，ACMO為具有不含游離氫之氫鍵性官能基之單體，由該單體構成之均聚物之玻璃轉移溫度為145℃。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(3)。 [實施例4] 使用包含丙烯酸丁酯(BA)/N-乙烯基-2-吡咯啶酮(NVP)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝90/10/10/0.25(重量比)之丙烯酸系共聚物D(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(4)。 [實施例5] 使用包含丙烯酸丁酯(BA)/N,N-二乙基丙烯醯胺(DEAA)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝75/25/10/0.25(重量比)之丙烯酸系共聚物E(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(5)。 [實施例6] 使用包含丙烯酸丁酯(BA)/丙烯醯基嗎啉(ACMO)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝75/25/10/0.25(重量比)之丙烯酸系共聚物F(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(6)。 [實施例7] 使用包含丙烯酸丁酯(BA)/N-乙烯基-2-吡咯啶酮(NVP)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝85/15/2.5/0.25(重量比)之丙烯酸系共聚物G(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(7)。 [實施例8] 使用包含丙烯酸丁酯(BA)/丙烯醯基嗎啉(ACMO)/丙烯酸2-羥基乙酯(HEA)＝75/25/10/(重量比)之丙烯酸系共聚物H(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(8)。 [實施例9] 將黏著劑層之厚度設為5 μm，除此以外，以與實施例1同樣之方式獲得黏著帶(9)。 [實施例10] 使用DINP塑化劑(鄰苯二甲酸雙(異壬基)酯、J-PLUS製造)60重量份代替DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例2中獲得之軟質聚氯乙烯膜(2)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(10)。 [實施例11] 使用己二酸系低分子聚酯塑化劑(ADEKA公司製造、商品名「ADEKA CIZER PN-7160」)60重量份代替DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例3中獲得之軟質聚氯乙烯膜(3)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(11)。 [實施例12] 使用己二酸系低分子聚酯塑化劑(ADEKA公司製造、商品名「ADEKA CIZER PN-7160」)60重量份代替DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(12)。 [實施例13] 使用DOP塑化劑(鄰苯二甲酸雙(2-乙基己基)酯、J-PLUS製造)60重量份代替DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例4中獲得之軟質聚氯乙烯膜(4)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(13)。 [實施例14] 使用DOP塑化劑(鄰苯二甲酸雙(2-乙基己基)酯、J-PLUS製造)80重量份代替DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例5中獲得之軟質聚氯乙烯膜(5)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(14)。 [實施例15] 使用包含丙烯酸丁酯(BA)/咪唑聚合性單體(四國化成製造、商品名「1H2MZM」/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝85/15/10/0.25(重量比)之丙烯酸系共聚物I(重量平均分子量＝1500000)100重量份代替丙烯酸系共聚物A 100重量份，使用DOP塑化劑(鄰苯二甲酸雙(2-乙基己基)酯、J-PLUS製造)80重量份代替DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份，除此以外，以與實施例1同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(15)。 [實施例16] 製備如下黏著劑之乙酸乙酯溶液，上述黏著劑含有：包含丙烯酸丁酯(BA)/N-乙烯基-2-吡咯啶酮(NVP)/丙烯酸2-羥基乙酯(HEA)/丙烯酸(AA)＝85/15/5/0.25(重量比)之丙烯酸系共聚物J(重量平均分子量＝1500000)100重量份、異氰酸酯系交聯劑(TOSOH公司製造、商品名「CORONATE HX」)5重量份、乙二胺多元醇(ADEKA公司製造、商品名「Adeka polyol EDP-300」)2.5重量份、及DOTP塑化劑(對苯二甲酸雙(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單個表面後，以130℃×90秒進行乾燥，形成厚度7 μm之黏著劑層。 如此獲得黏著帶(16)。 [實施例17] 將異氰酸酯系交聯劑(TOSOH公司製造、商品名「CORONATE HX」)之調配量設為0.5重量份，不添加乙二胺多元醇(ADEKA公司製造、商品名「Adeka polyol EDP-300」)，除此以外，以與實施例16同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單個表面後，以130℃×90秒進行乾燥，形成厚度7 μm之黏著劑層。 如此獲得黏著帶(17)。 [實施例18] 將異氰酸酯系交聯劑(TOSOH公司製造、商品名「CORONATE HX」)之調配量設為0.3重量份，不添加乙二胺多元醇(ADEKA公司製造、商品名「Adeka polyol EDP-300」)，除此以外，以與實施例16同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單個表面後，以130℃×90秒進行乾燥，形成厚度7 μm之黏著劑層。 如此獲得黏著帶(18)。 [實施例19] 使用環氧系交聯劑(三菱瓦斯化學公司製造、商品名「TETRAD-C」)0.5重量份代替異氰酸酯系交聯劑(TOSOH公司製造、商品名「CORONATE HX」)5重量份，不添加乙二胺多元醇(ADEKA公司製造、商品名「Adeka polyol EDP-300」)，除此以外，以與實施例16同樣之方式製備黏著劑之乙酸乙酯溶液。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單個表面後，以130℃×90秒進行乾燥，形成厚度7 μm之黏著劑層。 如此獲得黏著帶(19)。 [比較例1] 製備如下黏著劑之乙酸乙酯溶液，上述黏著劑含有：包含丙烯酸丁酯(BA)/丙烯酸(AA)＝100/3.0(重量比)之丙烯酸系共聚物J(重量平均分子量＝1500000)100重量份、環氧系交聯劑(三菱瓦斯化學製造、商品名「TETRAD-C」)0.5重量份、及DOTP塑化劑(對苯二甲酸(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單個表面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(16)。 [比較例2] 製備如下黏著劑之乙酸乙酯溶液，上述黏著劑含有：包含丙烯酸2-乙基己酯(2-EHA)/丙烯醯基嗎啉(ACMO)/丙烯酸/丙烯酸2-羥基乙酯(HEA)＝75/25/3.0/0.1(重量比)之丙烯酸系共聚物K(重量平均分子量＝1500000)100重量份、環氧系交聯劑(三菱瓦斯化學製造、商品名「TETRAD-C」)1.0重量份、及DOTP塑化劑(對苯二甲酸(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單個表面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(17)。 [比較例3] 製備如下黏著劑之乙酸乙酯溶液，上述黏著劑含有：包含丙烯酸2-乙基己酯(2-EHA)/丙烯酸(AA)＝95/5.0(重量比)之丙烯酸系共聚物(重量平均分子量＝1500000)100重量份、環氧系交聯劑(三菱瓦斯化學製造、商品名「TETRAD-C」)0.5重量份、及DOTP塑化劑(對苯二甲酸(2-乙基己基)酯、ADEKA公司製造、商品名「ADEKA CIZER D-810」)60重量份。 將該黏著劑溶液塗佈於製造例1中獲得之軟質聚氯乙烯膜(1)之單個表面後，以130℃×90秒進行乾燥，形成厚度10 μm之黏著劑層。 如此獲得黏著帶(18)。 將實施例及比較例中獲得之黏著帶供於下述評價。將結果示於表1及表2。 (1)黏著力 將黏著帶(寬度20 mm×長度120 mm)於線壓78.5 N/cm、速度0.3 m/分鐘之條件下貼合於SUS430BA板。貼合後，於23℃、50%RH環境下靜置30分鐘後，於23℃、50%RH氣氛下，使用AUTOGRAPH AG-IS(SHIMADZU製造)，於拉伸角度180°、拉伸速度0.3 m/分鐘之條件下測定黏著力。 (2)帶浮起評價 用手壓輥往返1次而將切割成10 mm見方之Si晶圓貼合於黏著帶(寬度20 mm×長度120 mm)之中心部(寬度方向、長度方向之中心)。 貼合Si晶圓後，於23℃、50%RH環境下靜置30分鐘，於50℃之環氣氛下、於夾盤間距50 mm、拉伸速度0.3 m/分鐘、延伸距離50 mm之條件下對貼附有Si晶圓之帶樣品進行延伸。 藉由目視觀察此時之帶端部之浮起等級。關於接著面積，藉由將黏著劑與被黏著體接著而利用目測將帶外觀之顏色看上去較深之部分判斷為接著面積。 關於接觸面積之算出方法，將浮起觀察圖像以彩色印出至A4用紙上，僅切取晶圓部並測定其重量。然後切分出接著部(顏色較深之部分)與浮起部(顏色較淺之部分)，對該經切分之紙重量進行測定，算出接著部之重量比，按照下述基準進行評價。 〇：帶接著面積相對於初始貼附面積為70%以上 ×：帶接著面積相對於初始貼附面積為70%以下 (3)糊劑殘留評價 用手壓輥往返1次而於切割成10 mm見方之Si晶圓之鏡面貼合於黏著帶(寬度20 mm×長度120 mm)之中心部(寬度方向、長度方向之中心)。 貼合Si晶圓後，於23℃、50%RH環境下靜置30分鐘後，於50℃之環氣氛下，於夾盤間距50 mm、拉伸速度0.3 m/分鐘、延伸距離50 mm之條件下對貼附有Si晶圓之帶樣品進行延伸。然後，從延伸狀態放開帶樣品，之後以剝離角度180°、拉伸速度10 mm/秒將帶從Si晶圓剝離，藉由目測觀察Si晶圓表面之糊劑殘留之等級。 用數位顯微鏡(KEYENCE製造)以500倍之倍率觀察晶圓表面，將確認到長邊長度為10 μm以上之污染物之情形判斷為有糊劑殘留(表1中、×)。將未確認到長邊長度為10 μm以上之污染物之情形判斷為無糊劑殘留(表1中、×)。 [表1]

Figure 106126185-A0304-0001
Figure 106126185-A0304-0002
Figure 106126185-A0304-0003
 [表2]
Figure 106126185-A0304-0004
 A. Overall structure of adhesive tape FIG. 1 is a schematic sectional view of an adhesive tape according to an embodiment of the present invention. The adhesive tape 100 is equipped with the base material 10, and the adhesive agent layer 20 arrange|positioned at least one surface (one side in the figure example) of the base material 10. The adhesive layer 20 contains an acrylic adhesive. In addition, the adhesive layer 20 contains a plasticizer. Furthermore, the plasticizer in the adhesive layer refers to the plasticizer contained in the forming material of the adhesive layer (specifically, the adhesive), and the plasticizer contained in the forming material of the substrate and transferred from the substrate to the substrate. Plasticizer for adhesive layer. Although not shown in the figure, a release liner may be provided on the outside of the adhesive layer for the purpose of protecting the adhesive surface until the adhesive sheet of the present invention is used. The acrylic adhesive contained in the adhesive layer 20 includes a base polymer including a structural unit having a hydrogen-bonding functional group that does not contain free hydrogen (details will be described later). In the present invention, by using a base polymer including a structural unit (hereinafter also referred to as structural unit A) having a hydrogen-bonding functional group not containing free hydrogen, it is possible to suppress the aggregation of the polymer in the adhesive layer. Reduce (that is, not impair the adhesive force of the adhesive layer), and reduce or zero the carboxyl group content ratio in the base polymer constituting the adhesive. Deterioration of the plasticizer in the adhesive layer can be prevented by reducing the content ratio of the carboxyl group in the polymer constituting the adhesive. As a result, the leakage of the plasticizer from the adhesive layer is suppressed, and even when the adherend that has been attached for a long time is peeled off from the adhesive tape, the residue of the paste on the adherend (essentially the adhesion of the plasticizer) is prevented. ). Fig. 2 is a schematic sectional view of an adhesive tape according to another embodiment of the present invention. The adhesive tape 200 is equipped with the base material 10, the adhesive layer 20 arrange|positioned on one surface of the base material 10, and the non-adhesive layer 30 arrange|positioned on the surface of the base material 10 which is the side opposite to the adhesive layer 20. The thickness of the adhesive tape of the present invention is preferably from 20 μm to 120 μm, more preferably from 30 μm to 120 μm, and still more preferably from 40 μm to 120 μm. If it is such a range, the effect of this invention will become more remarkable. When the thickness of the adhesive tape of this invention is too thin, there exists a possibility that handling property may deteriorate. When the thickness of the adhesive tape of the present invention is too thick, the followability to deformation such as stretching may deteriorate, and the pick-up property by the needle tip may decrease. The upper limit of the adhesive force of the adhesive tape of the present invention to the SUS plate after 23°C×30 minutes is preferably 2.1 N/20 mm, more preferably 1 N/20 mm, further preferably 0.5 N/20 mm, especially preferably It is 0.2 N/20 mm, and the best is 0.1 N/20 mm. Furthermore, in one embodiment, the above-mentioned adhesive force can be controlled by the content ratio of the carboxyl group contained in the polymer in the adhesive constituting the adhesive layer. In other words, it is preferable to adjust the content ratio of the carboxyl group contained in the polymer in the adhesive so that the above-mentioned adhesive force becomes 2.1 N/20 mm or less. The lower limit of the adhesive force of the adhesive tape of the present invention to the SUS plate after 23°C×30 minutes is preferably 0.01 N/20 mm, more preferably 0.05 N/20 mm, further preferably 0.07 N/20 mm, and most preferably It is 0.08 N/20 mm, and the best is 0.09 N/20 mm. In this specification, "adhesion to SUS board after x°C x y minutes" refers to the adhesion measured by the method based on JIS Z 0237:2000. Laminate with SUS board, store the obtained laminate in an environment of x°C for y minutes, and then peel off the adhesive tape at a tensile speed of 300 mm/min and a peeling angle of 180° in an environment of 23°C to measure the adhesive force. The adhesion of the adhesive tape of the present invention to the SUS plate after 50°C×2 days is 0.05 N/20 mm to 0.85 N/20 mm, preferably 0.1 N/20 mm to 0.8 N/20 mm, more preferably 0.12 N/20 mm to 0.7 N/20 mm, preferably 0.15 N/20 mm to 0.5 N/20 mm. The above-mentioned adhesive force after 50°C×2 days is the adhesive force under accelerated test conditions assuming long-term storage, that is, the period from attaching the adherend to the adhesive tape until it is peeled off is a long-term period (for example, about 60 days at room temperature) . Accelerated test conditions (50°C x 2 days) assuming long-term storage are determined as follows. As a method of estimating the behavior of the adhesive after storage for a certain period of time, an accelerated heating test is used. It predicts long-term changes in a short period of time by heating, and its rate of change is assumed to be accelerated according to the law of Arrhenius. The formula of Arenis is represented by K=A×exp(-Ea/RT). Here, K is the reaction rate coefficient, A is the frequency factor, Ea is the activation energy, R is the gas constant, and T is the absolute temperature (K). Ea (activation energy) is 21000 [cal/mol], the value is as recorded in "Nitto Technical Report" Vol.27, No.2 (Nov.1989), assuming the measured value of the mechanical properties of the acrylic adhesive The displacement factor obtained by using the time-temperature conversion method is calculated for the Arenis type. Therefore, the reaction rate coefficient at 20°C and 50°C is K(20°C)=A×exp(-21000/293R) K(50°C)=A×exp(-21000/323R). Using this formula, the ratio of the reaction rate coefficients of the two temperatures is K(50°C)/K(20°C)=28.5. Here, it is assumed that the adherend is stored in a state of being attached to an adhesive tape in an environment with an average temperature of 20°C. If the temperature of the accelerated test is set at 50°C, and the storage period at 20°C is estimated according to the Arenis law, then 50°C×2 days≈20°C×57 days. B. Adhesive Layer B-1. Acrylic Adhesive As described above, the adhesive layer contains an acrylic adhesive. B-1-1. Base Polymer The acrylic pressure-sensitive adhesive includes a (meth)acrylic polymer as a base polymer. In one embodiment, the above-mentioned (meth)acrylic polymer may be composed of a monomer containing (meth)acrylate as a main monomer and containing a hydrogen-bonding functional group without free hydrogen (hereinafter also referred to as The monomer component of monomer a) is produced. In the (meth)acrylic polymer, the content ratio of the structural unit derived from the main monomer is preferably 60 parts by weight or more, more preferably 60 parts by weight to 95 parts by weight, and still more preferably 100 parts by weight of the base polymer. Preferably, it is 65 to 85 parts by weight. In the (meth)acrylic polymer, the content ratio of the structural unit having a hydrogen-bonding functional group without free hydrogen is preferably 5 to 40 parts by weight, more preferably 5 parts by weight to 100 parts by weight of the base polymer. 8 to 35 parts by weight, more preferably 9 to 30 parts by weight, most preferably 9 to 23 parts by weight. If it is such a range, it is excellent in cohesiveness and the adhesive layer with little paste residue can be formed. In the (meth)acrylic polymer, the content ratio of the structural unit having a hydrogen-bonding functional group is preferably 10 to 50 parts by weight, more preferably 10 to 40 parts by weight, based on 100 parts by weight of the base polymer. parts by weight, more preferably 10 parts by weight to 32 parts by weight. If it is such a range, the adhesive layer excellent in cohesiveness can be formed. (Monomer having a hydrogen-bonding functional group not containing free hydrogen (monomer a)) The monomer a has a hydrogen-bonding functional group. Here, a hydrogen bond refers to a hydrogen atom (hydrogen bond donor) that is covalently bonded to an atom with a relatively high electronegative such as nitrogen, oxygen, or sulfur, and an anion such as nitrogen, oxygen, or sulfur that exists near the hydrogen atom. A non-covalent chemical bond formed by the electrostatic interaction of the lone electron pair of an atom (hydrogen bond acceptor) with a higher electrical property. The hydrogen-bonding functional group without free hydrogen refers to a functional group that can become a hydrogen bond acceptor in a hydrogen bond, for example, it can include highly anionic atoms that do not directly bond with hydrogen (for example, nitrogen, oxygen, sulfur ) functional group. Specific examples of hydrogen-bonding functional groups that do not contain free hydrogen include: amine groups (wherein the nitrogen atom of the amine group is not bonded to a hydrogen atom), carbonyl, and sulfamide groups (wherein the sulfamide group sulfur atom a hydrogen atom not bonded to it), a thioether group, an N-alkylamido group (where no hydrogen atom is bonded to the nitrogen atom of the amido group), an N-alkylamido group, and the like. Among them, an amine group (where no hydrogen atom is bonded to the nitrogen atom of the amine group), a sulfamide group, a thioether group, an N-alkylamide group or an N-alkylimide group is preferred. Since these functional groups have atoms (nitrogen atoms, sulfur atoms) with relatively high electronegative properties, they have strong hydrogen bonding properties. If the base polymer with such functional groups is used, high cohesiveness and plasticity can be obtained. Adhesive with well-dispersed chemical agent. Specific examples of the above-mentioned monomer a include: N-vinyl-2-pyrrolidone, N,N-diethylacrylamide, acrylmorpholine, (meth)acrylic acid 2-(2- Methylimidazolyl) ethyl ester, etc. The monomer a may be used alone or in combination of two or more. The glass transition temperature of the homopolymer formed from the monomer a is preferably from 50°C to 150°C, more preferably from 60°C to 150°C, and still more preferably from 70°C to 145°C. The glass transition temperature of the homopolymer in the above range means that the intermolecular force between the polymer chains of the homopolymer is strong, which means that the hydrogen bonding of the hydrogen bonding functional groups of the monomers constituting the homopolymer Excellent ability. (Main monomer) As said (meth)acrylate, it is preferable to use the monomer which does not have hydrogen bond property. As said (meth)acrylic acid ester, the alkyl (meth)acrylic acid ester of the alkyl group (it also includes a cycloalkyl group) of 1-30 carbon atoms is mentioned, for example. (Meth)acrylate may be used individually by 1 type, and may use it in combination of 2 or more types. Examples of the alkyl (meth)acrylate of an alkyl group (including a cycloalkyl group) having 1 to 30 carbon atoms include: methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate Propyl acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, (Meth) pentyl (metha) acrylate, (meth) pentyl (amyl (metha) acrylate), (meth) hexyl acrylate, (meth) cyclohexyl acrylate, (meth) acrylate ) heptyl acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate , Decyl (meth)acrylate, Isodecyl (meth)acrylate, Undecyl (meth)acrylate, Dodecyl (meth)acrylate, Tridecyl (meth)acrylate , Myristyl (meth)acrylate, Pentadecyl (meth)acrylate, Octadecyl (meth)acrylate, Nonadecyl (meth)acrylate, (Meth)acrylic acid Alkyl (meth)acrylate of an alkyl group (including cycloalkyl group) having 1 to 30 carbon atoms such as eicosyl ester, lauryl (meth)acrylate, etc. Among these (meth)acrylic acid esters, alkyl (meth)acrylates of alkyl groups with 2 to 20 carbons (including cycloalkyl groups) are preferred, and alkyl groups with 4 to 18 carbons are more preferred ( Alkyl (meth)acrylates of cycloalkyl) are also included. (Other monomers) As long as the effects of the present invention can be obtained, the (meth)acrylic polymer may contain structural units derived from other monomers than (meth)acrylate (main monomer) and monomer a . Examples of the above-mentioned other monomers include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and carboxyethyl acrylate; 2-hydroxyethyl (meth)acrylate; Hydroxyl-containing monomers such as ester, hydroxypropyl (meth)acrylate, and hydroxybutyl (meth)acrylate; sulfonic acid-containing monomers such as styrenesulfonic acid and allylsulfonic acid; Monomers containing phosphoric acid groups such as ethyl ester, etc. In one embodiment, a carboxyl group-containing monomer and/or a hydroxyl group-containing monomer can be used as other monomers. A monomer having a hydrogen-bonding functional group including free hydrogen (for example, a carboxyl group-containing monomer and/or a hydroxyl group-containing monomer) can also be used as the above-mentioned other monomers. In the (meth)acrylic polymer, the content ratio of the structural unit having a hydrogen-bonding functional group including free hydrogen is preferably 20 parts by weight or less, more preferably 100 parts by weight of the (meth)acrylic polymer. It is 15 weight part or less, More preferably, it is 10 weight part or less. In one embodiment, a carboxyl group-containing monomer can be used as another monomer, and in the (meth)acrylic polymer, the content ratio of the structural unit derived from the carboxyl group-containing monomer relative to the base polymer ((meth)acrylic acid based polymer) is 0.2 parts by weight or less per 100 parts by weight. In another embodiment, the (meth)acrylic polymer does not contain a structural unit derived from a carboxyl group-containing monomer. B-1-2. Additives The above acrylic adhesive may contain any appropriate additives. In one embodiment, the acrylic adhesive includes a plasticizer. Using an acrylic adhesive containing a plasticizer can prevent the transfer of the plasticizer in the substrate to the adhesive layer, or suppress the influence of the transferred plasticizer, and obtain an adhesive tape with less change over time. Examples of the above-mentioned plasticizers include terephthalate-based plasticizers, isophthalate-based plasticizers, phthalate-based plasticizers, and trimellitate-based plasticizers. Plasticizers (trioctyl trimellitate, etc.), adipate-based plasticizers (dioctyl adipate, diisononyl adipate, etc.), phosphate-based plasticizers (tricresyl phosphate etc.), adipate-based plasticizers, citrate-based plasticizers (acetyl tributyl citrate, etc.), sebacate-based plasticizers, azelate-based plasticizers, Maleate-based plasticizers, benzoate-based plasticizers, polyether-based polyester-based plasticizers, epoxy-based polyester-based plasticizers (epoxidized soybean oil, epoxidized linseed oil, etc.) , Polyester containing polycarboxylic acid and polyol, etc. The plasticizer may be only 1 type, and may be 2 or more types. In one embodiment, a terephthalate-based plasticizer is used as the plasticizer. If a terephthalate-based plasticizer is used, it is possible to obtain an adhesive tape that can pick up the adherend well without reducing the pick-up property even when attaching a relatively large-sized adherend (such as an LED chip) . In addition, even when it is stored for a long period of time in a state where the adherend is attached, a decrease in pick-up property can be suppressed. Adhesive tapes with excellent pick-up properties can be used well as adhesive tapes for shipping. As the terephthalate-based plasticizer, for example, a diester of terephthalic acid and an alkanol having 4 to 16 carbon atoms (preferably 6 to 14, more preferably 8 to 13) can be used. Examples of terephthalate-based plasticizers include dibutyl terephthalate (DBTP), diisobutyl terephthalate (DIBTP), di-n-hexyl terephthalate (DHTP), Bis(2-ethylhexyl) terephthalate (DOTP), Di-n-octyl terephthalate (DnOTP), Diisononyl terephthalate (DINTP), Dinonyl terephthalate (DNTP) ), diisodecyl terephthalate (DIDTP), bis(butylbenzyl) terephthalate (BBTP), etc. Among them, DOTP is preferred. As the above-mentioned phthalate-based plasticizer, for example, a diester of phthalic acid and an alkanol having 4 to 16 carbon atoms (preferably 6 to 14, more preferably 8 to 13) can be used. Examples of phthalate-based plasticizers include: di-n-octyl phthalate, bis(2-ethylhexyl) phthalate, diisononyl phthalate, o-phthalate Diisodecyl dicarboxylate, etc. As the trimellitic acid ester plasticizer, for example, a triester of trimellitic acid and an alkanol having 6 to 14 carbon atoms (preferably 8 to 12 carbon atoms) can be used. Examples of the above-mentioned trimellitate-based plasticizer include: tri-n-octyl trimellitate, tris(2-ethylhexyl) trimellitate, triisononyl trimellitate, trimellitate, Tri-n-decyl tricarboxylate, Tri-isodecyl trimellitate, etc. As the above-mentioned pyromellitic acid ester plasticizer, for example, a tetraester of pyromellitic acid and an alkanol having 6 to 14 carbon atoms (preferably 8 to 12 carbon atoms) can be used. As said pyromellitic acid ester plasticizer, tetra-n-octyl pyromellitic acid, tetra(2-ethylhexyl) pyromellitic acid, tri-n-decyl pyromellitic acid, etc. are mentioned, for example. As the above-mentioned adipate-based plasticizer, for example, a diester of adipic acid and an alkanol having 4 to 16 carbon atoms (preferably 6 to 14, more preferably 8 to 13) can be used. As said adipate-type plasticizer, di-n-octyl adipate, di(2-ethylhexyl) adipate, diisononyl adipate, etc. are mentioned, for example. As the above-mentioned polyester containing polycarboxylic acid and polyhydric alcohol, for example, succinic acid, adipic acid, suberic acid, azelaic acid, sebacic acid, citric acid, phthalic acid, isophthalic acid, terephthalic acid, Polycarboxylic acids such as phthalic acid and trimellitic acid and (poly)ethylene glycol (herein, "(poly)ethylene glycol" includes the meaning of ethylene glycol and polyethylene glycol; the same below), (poly) Polyester compounds obtained from polyols such as propylene glycol, (poly)butylene glycol, (poly)hexylene glycol, (poly)neopentyl glycol, and polyvinyl alcohol. As said polyhydric carboxylic acid, an aliphatic dicarboxylic acid with 4-12 (preferably 6-10) carbon atoms is preferable, for example, adipic acid, sebacic acid, etc. are mentioned. As said polyhydric alcohol, C2-C10 aliphatic diol is preferable, For example, ethylene glycol, 1, 3- butanediol, 1, 4- butanediol etc. are mentioned. When the above-mentioned acrylic adhesive contains a plasticizer, the content ratio of the plasticizer is preferably 10 to 90 parts by weight, more preferably 20 parts by weight, relative to 100 parts by weight of the base polymer in the acrylic adhesive. Parts by weight to 80 parts by weight, more preferably 30 parts by weight to 70 parts by weight, particularly preferably 40 parts by weight to 60 parts by weight. In one embodiment, the acrylic adhesive includes a crosslinking agent. The content ratio of the crosslinking agent is preferably 0.1 to 30 parts by weight, more preferably 0.3 to 25 parts by weight, more preferably 0.5 to 25 parts by weight, and further preferably 0.5 to 25 parts by weight based on 100 parts by weight of the base polymer. Preferably it is 1-25 weight part, More preferably, it is 3-20 weight part, Most preferably, it is 5-15 weight part. If it is such a range, the adhesive tape which can further suppress the rise of adhesive force and can be picked up more easily can be obtained even after the adherend (for example, LED chip) which was reduced into pieces was stored on the adhesive tape for a long period of time. Also, moderate cross-linking reaction can be generated, and paste residue on the adherend can be effectively prevented. Examples of the crosslinking agent include epoxy-based crosslinking agents, isocyanate-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, metal alkoxide-based crosslinking agents, and metal chelate-based crosslinking agents. Cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, oxazoline-based cross-linking agent, aziridine-based cross-linking agent, amine-based cross-linking agent, etc. Only one type of crosslinking agent may be used, or two or more types may be used. The above-mentioned acrylic adhesive may further contain any other appropriate additives within the range that does not impair the effect of the present invention. Examples of additives include catalysts, ultraviolet absorbers, fillers, anti-aging agents, tackifiers, pigments, dyes, silane coupling agents, and the like. B-2. Characteristics of Adhesive Layer, etc. The thickness of the adhesive layer is preferably from 1 μm to 30 μm, more preferably from 1 μm to 20 μm, and still more preferably from 3 μm to 15 μm. When the thickness of the adhesive layer is less than 1 μm, sufficient adhesive force may not be expressed. When the thickness of the adhesive layer is greater than 30 μm, there is a possibility that the small-piece adherend (such as an LED chip) is embedded in the adhesive layer, and the accuracy of the pin tip position at the time of picking up may decrease. The elastic modulus of the adhesive layer measured based on the nano-indentation method at 25°C (hereinafter also referred to as the nano-indentation elastic modulus) is 4.0 MPa to 30 MPa, preferably 4.5 MPa to 27 MPa, and more The best range is 6.0 MPa to 25 MPa, and the most preferred range is 7.0 MPa to 22 MPa. Furthermore, the elastic modulus measured based on the nanoindentation method can be measured under the following conditions. (Measurement device and measurement conditions) Device: Tribo Indenter manufactured by Hysitron Inc. Indenter used: Berkovich (triangular cone type) Measurement method: Single indentation measurement Measurement temperature: 25°C Indentation depth setting: about 300 nm Indentation speed: About 10 nm/sec Measurement atmosphere: in air Sample size: about 1 cm x about 1 cm (Measurement method) Using the above device, press a Berkovich type diamond indenter vertically from the surface of the adhesive layer to a depth of 300 nm. Using the analysis software "Triboscan Ver.9.2.12.0", the elastic modulus of the surface was obtained from the displacement obtained after removing the indenter, the load and the theoretically calculated indentation area. As described above, the adhesive layer contains a plasticizer (adhesive-derived plasticizer and/or substrate-derived plasticizer). The content ratio of the plasticizer in the adhesive layer is preferably 10 to 100 parts by weight, more preferably 20 to 90 parts by weight, and still more preferably 100 parts by weight of the base polymer constituting the adhesive. 30 to 80 parts by weight, preferably 30 to 70 parts by weight. If it is such a range, the adhesive tape which has high flexibility, excellent followability to an adherend, and which plasticizer does not bleed easily from an adhesive layer can be obtained. Any appropriate method can be adopted as a method of providing the adhesive layer on the base material. For example, the adhesive layer can be formed by applying a coating solution for forming the adhesive layer on the substrate. Any appropriate coating method can be adopted as the coating method. As the coating method, for example, a reverse method, a direct method, various methods combined with a metering roll, etc. are mentioned. The adhesive tape of the present invention may have a release liner on the surface of the adhesive layer. As the release liner, any appropriate release film can be used. As such a release liner, for example, a substrate having a release layer such as a plastic film or paper that has been surface-treated with a release agent such as polysiloxane-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide; Low adhesion of fluorine-based polymers such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluorovinyl-vinylidene fluoride copolymer, etc. Substrates; low-adhesion substrates containing non-polar polymers such as olefinic resins (such as polyethylene, polypropylene, etc.); etc. In the case of using a release liner, the adhesive layer can also be provided on the base material by applying the coating liquid to the release liner, sticking it on the base material, and transferring the adhesive layer. C. Substrate The thickness of the substrate is preferably from 20 μm to 120 μm, more preferably from 30 μm to 120 μm, and still more preferably from 40 μm to 120 μm. When the thickness of the base material is too thin, there is a possibility that the handleability may be deteriorated. When the thickness of the base material is too thick, the followability to deformation such as elongation may be deteriorated, and the pick-up property by the pin tip may be reduced. The maximum elongation of the substrate as measured in accordance with JIS-K-7127 (1999) is preferably at least 100%, more preferably 200% to 1000%. By using the base material which shows such a maximum elongation rate, moderate extensibility can be given to the adhesive tape of this invention, for example, followability to an adherend can be improved. The maximum elongation can be measured at 23°C. Any appropriate material can be used as the material constituting the base material. It is preferred to use a plastic film as the substrate. The plastic film may comprise any suitable resin material. Examples of such resin materials include polyvinyl chloride, polyolefin, ethylene-vinyl acetate copolymer, polyester, polyimide, and polyamide. Among them, polyvinyl chloride, polyolefin or ethylene-vinyl acetate copolymer is preferred, and polyvinyl chloride is more preferred. Since polyvinyl chloride has excellent stress relaxation properties, it can moderately relax the impact of pin pushing, and suppress the positional displacement or falling off of the small-piece adherend (such as LED chip). When such polyvinyl chloride is used, an adhesive tape suitable as an adhesive tape for shipment of adherends (for example, LED chips) reduced into small pieces can be obtained. The content ratio of the above-mentioned resin material in the plastic film is, for example, 50 to 100 parts by weight, preferably 60 to 100 parts by weight, and more preferably 70 to 100 parts by weight relative to 100 parts by weight of the plastic film. parts by weight. In one embodiment, the plastic film used as the base material includes a plasticizer. Examples of the plasticizer contained in the plastic film include those described in the section B-1-2 above. The content ratio of the plasticizer in the plastic film is preferably 0.5 to 50 parts by weight, more preferably 1.0 to 40 parts by weight relative to 100 parts by weight of the resin material in the plastic film. By making the plastic film contain a plasticizer at the above content ratio, an adhesive tape having excellent followability to deformation such as stretching and good pick-up property can be obtained. In the plastic film, any appropriate other components may be contained within the range that does not impair the effect of the present invention. The substrate can be manufactured by any suitable manufacturing method. For example, the substrate can be obtained by molding methods such as injection molding, extrusion molding, inflation molding, calender molding, and blow molding. D. Non-adhesive layer In one embodiment, the adhesive tape of this invention has an adhesive layer on one side of a base material, and has a non-adhesive layer on the surface opposite to this adhesive layer of this base material. In addition, the non-adhesive layer refers to a layer that cannot maintain an adhesive state even if it is crimped to a SUS board at 23°C, and is prone to positional displacement or natural peeling. The composition of the non-adhesive layer is not particularly limited, and examples include: a silicone layer, a (meth)acrylic polymer layer, a silicone layer and a (meth)acrylic polymer layer The mixed layer, the polysiloxane layer grafted with (meth)acrylic polymer, etc. Among them, a mixed layer of polysiloxane and (meth)acrylic polymer is preferable. By setting the non-adhesive layer as a mixed layer of polysiloxane and (meth)acrylic polymer, the adaptability between the non-adhesive layer and the substrate (especially plastic film) becomes better, and the adhesive tape of the present invention is resistant to stretching, etc. The followability of deformation becomes better. The surface of the non-adhesive layer preferably has a concave-convex structure. By making the surface of the non-adhesive layer have a concavo-convex structure, an adhesive tape excellent in handleability can be obtained. Specifically, the non-adhesive layer has an arithmetic average surface roughness Ra of 0.1 μm or more, more preferably 0.1 μm to 3.0 μm, further preferably 0.2 μm to 2.0 μm, and most preferably 0.3 μm to 2.0 μm. μm, preferably 0.5 μm to 2.0 μm. If it is such a range, the adhesive tape whose sticking is suppressed can be obtained. The surface roughness Ra can be measured in accordance with JIS B 0601:1994. The glass transition temperature Tg of the non-adhesive layer measured based on differential scanning calorimetry (DSC measurement) is preferably 20°C or higher, more preferably 30°C or higher, further preferably 50°C or higher, especially preferably 55°C or higher . The upper limit of the glass transition temperature Tg of the non-adhesive layer measured by differential scanning calorimetry is not particularly limited, but it is preferably 200°C or lower, more preferably 170°C or lower, and further It is preferably below 150°C, especially preferably below 130°C, most preferably below 100°C. If it is such a range, a non-adhesive layer will have moderate hardness, and it can prevent that a non-adhesive layer falls off by friction etc. in a conveyance process. When the non-adhesive layer comprises a (meth)acrylic polymer, the SP value of the (meth)acrylic polymer in the non-adhesive layer is preferably 9.0(cal/cm 3 ) 0.5-12.0 (cal/cm 3 ) 0.5 , more preferably 9.5(cal/cm 3 ) 0.5 to 11.5(cal/cm 3 ) 0.5 , still more preferably 9.5(cal/cm 3 ) 0.5 to 11.0(cal/cm 3 ) 0.5 . The SP value is a solubility parameter calculated according to the Small formula. Calculation of the SP value can be performed by a method described in known literature (for example, Journal of Applied Chemistry, 3, 71, 1953., etc.). The non-adhesive layer preferably has a phase-separated structure. By making the non-adhesive layer have a phase-separated structure, it is possible to efficiently form a fine uneven structure on the surface of the non-adhesive layer. For example, when the non-adhesive layer is a mixed layer of polysiloxane and (meth)acrylic polymer, it is presumed that the difference in material mobility between polysiloxane and (meth)acrylic polymer when the phase separation structure is formed resulting in bumps. Forming the concavo-convex structure in this way provides an adhesive tape that is excellent in handleability and suppresses sticking when it is made into a roll form. The non-adhesive layer preferably comprises a silicone-rich phase with a higher silicone content than the (meth)acrylic polymer and a (meth)acrylic-rich polymer with a higher (meth)acrylic polymer content than the silicone Mutually. More specifically, it is preferable that the above-mentioned silicone-rich phase and the above-mentioned (meth)acrylic-rich polymer are independently phase-separated to include a non-adhesive layer, and it is more preferable that the above-mentioned silicone-rich phase exists in the air On the interface side (opposite side to the substrate), the (meth)acrylic polymer-rich phase described above exists on the substrate side. By having such a phase separation structure, the adhesion is effectively suppressed by the polysiloxane-rich phase existing on the air interface side, and the non-adhesive layer and the The adaptability of the base material becomes better, and the deformation followability becomes better. Such a phase-separated structure can be formed, for example, by adjusting the mixing ratio of polysiloxane and (meth)acrylic polymer in the non-adhesive layer as follows. It can be observed by any suitable method that the non-adhesive layer has a phase-separated structure, or contains a silicone-rich phase and a (meth)acrylic polymer content that is greater than the (meth)acrylic polymer as described above. A (meth)acrylic-rich polymer phase larger than polysiloxane. As such an observation method, for example, morphological observation of a non-adhesive layer cross section using an electron microscope such as a transmission electron microscope (TEM), a scanning electron microscope (SEM), and an electrolysis emission scanning electron microscope (FE-SEM) can be cited. method. The two-layer separation structure can be judged by the depth of the morphological observation image. In addition, by using infrared absorption spectroscopy based on the total reflection method, changing the optical depth of the probe from the non-adhesive layer-air interface side to the inside, while observing changes in the content of silicon or carbon contained in the composition. method of observation. In addition, methods of observation using an X-ray microanalyzer or X-ray photoelectron spectroscopy are also exemplified. In addition, these observation methods may be appropriately combined. When the non-adhesive layer is a mixed layer of polysiloxane and (meth)acrylic polymer, the mixing ratio of polysiloxane and (meth)acrylic polymer in the non-adhesive layer is preferably Silicone: (meth)acrylic polymer = 1:50 to 50:1, more preferably polysiloxane: (meth)acrylic polymer = 1:30 to 30:1, and more preferably poly Silicone: (meth)acrylic polymer = 1:10-10:1, especially polysiloxane: (meth)acrylic polymer = 1:5-5:1, the best polysiloxane : (meth)acrylic polymer = 1:3 to 5:1. If the content ratio of polysiloxane in the non-adhesive layer is too large, the chemical affinity with the back of the substrate (especially plastic film) becomes low, and it may not be easy to adapt to the back of the substrate (especially plastic film). Also, unless the content ratio of polysiloxane in the adhesive layer is too high, the followability to deformation such as elongation may be deteriorated when it is made into an adhesive tape. If the content ratio of the (meth)acrylic polymer in the non-adhesive layer is too large, the non-adhesive layer may function as an acrylic adhesive, and blocking may easily occur. As polysiloxane, any suitable polysiloxane can be used. As such polysiloxane, for example, a platinum compound is used as a catalyst to harden an alkenyl-containing polydialkylsiloxane and a polydialkylhydrogenpolysiloxane through an addition reaction to form a peeling agent. Addition-type polysiloxane obtained from a permanent film; condensation-type polysiloxane obtained by reacting polydialkylsiloxane containing methylol with polydialkylhydrogenpolysiloxane using a tin-based catalyst. As an example of an addition type silicone, "KS-776A" and "KS-839L" manufactured by Shin-Etsu Silicone, etc. are mentioned, for example. As an example of condensation type silicone, "KS723A/B" by Shin-Etsu Silicone etc. are mentioned, for example. In addition, other crosslinking agents, crosslinking accelerators, and the like may be appropriately used in addition to platinum-based catalysts or tin-based catalysts when polysiloxane is produced. In addition, according to the properties of polysiloxane, it can be divided into the type dissolved in organic solvents such as toluene, the emulsified type obtained by emulsifying them, and the non-solvent type composed only of polysiloxane. Also, other than addition-type silicone or condensation-type silicone, silicone/acrylic graft polymer, silicone/acrylic block polymer, or the like can be used. Examples of silicone/acrylic graft polymers include SYMAC GS-30, GS101, US-270, US-350, and US-380 (the above are manufactured by Toagosei Co., Ltd.). Examples of silicone/acrylic block polymers include MODIPER FS700, FS710, FS720, FS730, and FS770 (manufactured by NOF Corporation). The (meth)acrylic polymer contained in the non-adhesive layer is a polymer containing a monomer component including a (meth)acrylic monomer as a main monomer. Moreover, the monomer component which comprises the said (meth)acrylic-type polymer may contain other monomers, such as a hydroxyl group containing monomer and a carboxyl group containing monomer, for example. In the (meth)acrylic polymer contained in the non-adhesive layer, the content ratio of the structural unit derived from the (meth)acrylic monomer is preferably 100 parts by weight of the (meth)acrylic polymer. 50 parts by weight or more, more preferably 70 to 100 parts by weight, still more preferably 90 to 100 parts by weight, particularly preferably 95 to 100 parts by weight. The monomer in the said monomer component may be only 1 type, and may be 2 or more types. As a (meth)acrylic-type monomer, Preferably, (meth)acrylate and (meth)acrylic acid are mentioned. Examples of (meth)acrylates include alkyl (meth)acrylates of alkyl groups having 1 to 30 carbon atoms (including cycloalkyl groups), hydroxyl group-containing (meth)acrylates, and the like. (Meth)acrylate may be only 1 type, and may be 2 or more types. Examples of the alkyl (meth)acrylate of an alkyl group (including a cycloalkyl group) having 1 to 30 carbon atoms include: methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate Propyl acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, (Meth) pentyl (metha) acrylate, (meth) pentyl (amyl (metha) acrylate), (meth) hexyl acrylate, (meth) cyclohexyl acrylate, (meth) acrylate ) heptyl acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate , Decyl (meth)acrylate, Isodecyl (meth)acrylate, Undecyl (meth)acrylate, Dodecyl (meth)acrylate, Tridecyl (meth)acrylate , Myristyl (meth)acrylate, Pentadecyl (meth)acrylate, Octadecyl (meth)acrylate, Nonadecyl (meth)acrylate, (Meth)acrylic acid Alkyl (meth)acrylate of an alkyl group (including cycloalkyl group) having 1 to 30 carbon atoms such as eicosyl ester, lauryl (meth)acrylate, etc. Among these (meth)acrylates, alkyl (meth)acrylates of alkyl groups (including cycloalkyl groups) having 2 to 20 carbon atoms are preferred, and alkyl groups having 4 to 18 carbon atoms are more preferred. Alkyl (meth)acrylates (also including cycloalkyl). As a hydroxyl group containing (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, etc. are mentioned, for example. In order to sufficiently express the effects of the present invention, the monomer component constituting the (meth)acrylic polymer may contain at least one selected from hydroxyl-containing monomers and carboxyl-containing monomers. As a hydroxyl group-containing monomer, allyl alcohol etc. are mentioned, for example. Only 1 type may be sufficient as a hydroxyl group containing monomer, and 2 or more types may be sufficient as it. As a carboxyl group-containing monomer, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, crotonic acid, maleic acid, fumaric acid, itaconic acid etc. are mentioned, for example. Only 1 type may be sufficient as a carboxyl group containing monomer, and 2 or more types may be sufficient as it. In the case where the non-adhesive layer contains a (meth)acrylic polymer, the (meth)acrylic polymer in the non-adhesive layer is preferably a hydroxyl group-containing (meth)acrylate in the monomer components constituting it. The content ratio is preferably 2% by weight to 30% by weight, more preferably 3% by weight to 25% by weight, and most preferably 5% by weight relative to the total amount of monomer components other than the hydroxyl-containing (meth)acrylate % to 20% by weight. When the non-adhesive layer contains a (meth)acrylic polymer, the content ratio of the hydroxyl-containing (meth)acrylate in the monomer component constituting the (meth)acrylic polymer in the non-adhesive layer is relative to If the total amount of the monomer components other than the hydroxyl group-containing (meth)acrylate falls within the above-mentioned range, a fine concave-convex structure can be formed more efficiently on the surface of the non-adhesive layer, and by forming the concave-convex structure, it is possible to Further effectively inhibiting the adhesion of the adhesive tape of the present invention in the roll form can further inhibit cracking or breaking when unrolled from the roll form. In the case where the non-adhesive layer contains a (meth)acrylic polymer, the (meth)acrylic polymer in the non-adhesive layer is preferably a (meth)acrylic acid containing a hydroxyl group in the monomer components constituting it. (Meth)acrylic acid and/or (meth)acrylate may be contained in monomer components other than ester. In this case, the content ratio of (meth)acrylic acid and (meth)acrylate is preferably 0:100 to 20:80 (meth)acrylic acid:(meth)acrylate by weight ratio, More preferably, it is 0:100 to 10:90, and still more preferably, it is 0:100 to 5:95. If the content ratio of (meth)acrylic acid and (meth)acrylate falls within the above-mentioned range, a fine concave-convex structure will be formed more efficiently on the surface of the non-adhesive layer. By forming this concave-convex structure, it is possible to further effectively Suppressing the adhesion of the adhesive tape of the present invention in the roll form can further inhibit cracking or rupture when unrolled from the roll form. The (meth)acrylic polymer can be produced by any appropriate polymerization method. Any appropriate additives may also be contained in the non-adhesive layer within the range that does not impair the effect of the present invention. Examples of such additives include catalysts, ultraviolet absorbers, fillers, anti-aging agents, tackifiers, pigments, dyes, silane coupling agents, and the like. The thickness of the non-adhesive layer is preferably from 0.01 μm to 10 μm, more preferably from 0.1 μm to 5 μm, and still more preferably from 0.1 μm to 2 μm. When the thickness of the non-adhesive layer is less than 0.01 μm, blocking is likely to occur. When the thickness of the non-adhesive layer exceeds 10 μm, there is a possibility that the followability to deformation such as elongation may be deteriorated. As a method of forming a non-adhesive layer on one side of a substrate, for example, a method of coating a material for a non-adhesive layer on one side of a substrate and drying it to form a non-adhesive layer is exemplified. As the above coating method, methods using, for example, a bar coater, a gravure coater, a spinner, a roll coater, a knife coater, an applicator, etc. are mentioned. [Examples] Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited by these examples. Unless otherwise specified, parts refer to parts by weight, and % refers to % by weight. In addition, the amount of the reagent supplied in the form of a solution is represented by the amount of solid content remaining after volatilizing the solution (converted amount of solid content). [Manufacturing example 1] Manufacture of soft polyvinyl chloride film (1) is produced by calendering, and 100 parts by weight of polyvinyl chloride with a degree of polymerization P=1050 contains DOTP plasticizer (bis(2-ethyl terephthalate) Hexyl) ester, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810") 30 parts by weight of a soft polyvinyl chloride film (1). The thickness of the soft polyvinyl chloride film (1) is 70 μm, the elastic modulus (MD) measured according to JIS-K-7127 is 250 MPa, and the maximum elongation (MD) measured according to JIS-K-7127 is 400%. In addition, the surface roughness (arithmetic mean surface roughness Ra) immediately after production was 0.1 μm. [Manufacturing example 2] Manufacture of soft polyvinyl chloride film (2) is produced by calendering with respect to 100 parts by weight of polyvinyl chloride with a degree of polymerization P=1050 containing DINP plasticizer (bis(isononyl phthalate) ester, manufactured by J-PLUS) 30 parts by weight of a soft polyvinyl chloride film (2). The thickness of the soft polyvinyl chloride film (2) is 70 μm, the elastic modulus (MD) measured according to JIS-K-7127 is 250 MPa, and the maximum elongation (MD) measured according to JIS-K-7127 is 400%. In addition, the surface roughness (arithmetic mean surface roughness Ra) immediately after production was 0.1 μm. [Manufacture Example 3] Manufacture of soft polyvinyl chloride film (3) was produced by calendering with respect to 100 parts by weight of polyvinyl chloride with a degree of polymerization P=1050 containing adipic acid-based low-molecular-weight polyester plasticizer (manufactured by ADEKA Co., Ltd. 30 parts by weight of a soft polyvinyl chloride film (3) with the trade name "ADEKA Cizer PN-7160". The thickness of the soft polyvinyl chloride film (3) is 70 μm, the elastic modulus (MD) measured according to JIS-K-7127 is 250 MPa, and the maximum elongation (MD) measured according to JIS-K-7127 is 400%. In addition, the surface roughness (arithmetic mean surface roughness Ra) immediately after production was 0.1 μm. [Manufacturing example 4] The manufacture of a soft polyvinyl chloride film (4) is produced by calendering with respect to 100 parts by weight of polyvinyl chloride with a degree of polymerization P=1050 containing a DOP plasticizer (bis(2-ethyl phthalate) Hexyl) ester, manufactured by J-PLUS) 30 parts by weight of a soft polyvinyl chloride film (4). The thickness of the soft polyvinyl chloride film (4) is 70 μm, the elastic modulus (MD) measured according to JIS-K-7127 is 250 MPa, and the maximum elongation (MD) measured according to JIS-K-7127 is 400%. In addition, the surface roughness (arithmetic mean surface roughness Ra) immediately after production was 0.1 μm. [Manufacturing Example 5] The manufacture of a soft polyvinyl chloride film (5) is produced by calendering relative to 100 parts by weight of polyvinyl chloride with a degree of polymerization P=1050 containing DOTP plasticizer (bis(2-ethyl terephthalate) Hexyl) ester, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810") 40 parts by weight of a soft polyvinyl chloride film (5). The thickness of the soft polyvinyl chloride film (5) is 70 μm, the elastic modulus (MD) measured according to JIS-K-7127 is 200 MPa, and the maximum elongation (MD) measured according to JIS-K-7127 is 400%. In addition, the surface roughness (arithmetic mean surface roughness Ra) immediately after production was 0.1 μm. [Example 1] The ethyl acetate solution of the following adhesive was prepared. The above adhesive contained: butyl acrylate (BA)/N-vinyl-2-pyrrolidone (NVP)/2-hydroxyethyl acrylate (HEA )/acrylic acid (AA) = 85/15/10/0.25 (weight ratio) acrylic copolymer A (weight average molecular weight = 1,500,000) 100 parts by weight, isocyanate crosslinking agent (manufactured by TOSOH, trade name "CORONATE L" ) 5 parts by weight, ethylenediamine polyol (manufactured by ADEKA, trade name "Adeka polyol EDP-300") 2.5 parts by weight, and DOTP plasticizer (bis(2-ethylhexyl) terephthalate, ADEKA Made by the company, brand name "ADEKA Cizer D-810") 60 parts by weight. Furthermore, NVP is a monomer having a hydrogen-bonding functional group without free hydrogen, and the glass transition temperature of a homopolymer composed of this monomer is 54°C. This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (1) is thus obtained. [Example 2] Using butyl acrylate (BA)/N,N-diethylacrylamide (DEAA)/2-hydroxyethyl acrylate (HEA)/acrylic acid (AA)=85/15/10/0.25 (weight ratio) 100 parts by weight of acrylic copolymer B (weight average molecular weight = 1,500,000) instead of 100 parts by weight of acrylic copolymer A, except that the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1 . Furthermore, DEAA is a monomer having a hydrogen-bonding functional group without free hydrogen, and the glass transition temperature of a homopolymer composed of this monomer is 81°C. This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (2) is thus obtained. [Example 3] Using butyl acrylate (BA) / acryl morpholine (ACMO) / 2-hydroxyethyl acrylate (HEA) / acrylic acid (AA) = 85/15/10/0.25 (weight ratio) The ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1 except that 100 parts by weight of the acrylic copolymer C (weight average molecular weight = 1,500,000) was replaced with 100 parts by weight of the acrylic copolymer A. Furthermore, ACMO is a monomer having a hydrogen-bonding functional group without free hydrogen, and the glass transition temperature of a homopolymer composed of this monomer is 145°C. This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (3) is thus obtained. [Example 4] Using butyl acrylate (BA)/N-vinyl-2-pyrrolidone (NVP)/2-hydroxyethyl acrylate (HEA)/acrylic acid (AA)=90/10/10/0.25 (weight ratio) 100 parts by weight of acrylic copolymer D (weight average molecular weight = 1,500,000) instead of 100 parts by weight of acrylic copolymer A, except that the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1 . This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (4) is thus obtained. [Example 5] Using butyl acrylate (BA)/N,N-diethylacrylamide (DEAA)/2-hydroxyethyl acrylate (HEA)/acrylic acid (AA)=75/25/10/0.25 (weight ratio) 100 parts by weight of acrylic copolymer E (weight average molecular weight = 1,500,000) instead of 100 parts by weight of acrylic copolymer A, except that the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1 . This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (5) is thus obtained. [Example 6] Using butyl acrylate (BA) / acryl morpholine (ACMO) / 2-hydroxyethyl acrylate (HEA) / acrylic acid (AA) = 75/25/10/0.25 (weight ratio) The ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1 except that 100 parts by weight of the acrylic copolymer F (weight average molecular weight = 1,500,000) was replaced with 100 parts by weight of the acrylic copolymer A. This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (6) is thus obtained. [Example 7] Using butyl acrylate (BA)/N-vinyl-2-pyrrolidone (NVP)/2-hydroxyethyl acrylate (HEA)/acrylic acid (AA)=85/15/2.5/0.25 (weight ratio) 100 parts by weight of acrylic copolymer G (weight average molecular weight = 1,500,000) instead of 100 parts by weight of acrylic copolymer A, except that the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1 . This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (7) is thus obtained. [Example 8] Acrylic copolymer H ( The ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1 except that 100 parts by weight of the acrylic copolymer A was replaced with 100 parts by weight of weight average molecular weight = 1500000). This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (8) is thus obtained. [Example 9] An adhesive tape (9) was obtained in the same manner as in Example 1 except that the thickness of the adhesive layer was 5 μm. [Example 10] 60 parts by weight of DINP plasticizer (bis(isononyl) phthalate, manufactured by J-PLUS) was used instead of DOTP plasticizer (bis(2-ethylhexyl) terephthalate) , ADEKA company make, brand name "ADEKA CIZER D-810") 60 parts by weight, the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1. This adhesive solution was applied to one side of the soft polyvinyl chloride film (2) obtained in Production Example 2, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (10) is thus obtained. [Example 11] 60 parts by weight of adipic acid-based low-molecular polyester plasticizer (manufactured by ADEKA Corporation, trade name "ADEKA CIZER PN-7160") was used instead of DOTP plasticizer (bis(2-ethylene terephthalate) Hexyl) ester, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810") 60 parts by weight, the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1. This adhesive solution was applied to one side of the soft polyvinyl chloride film (3) obtained in Production Example 3, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (11) is thus obtained. [Example 12] 60 parts by weight of adipic acid-based low-molecular polyester plasticizer (manufactured by ADEKA Corporation, trade name "ADEKA CIZER PN-7160") was used instead of DOTP plasticizer (bis(2-ethylene terephthalate) Hexyl) ester, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810") 60 parts by weight, the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1. This adhesive solution was applied to one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (12) is thus obtained. [Example 13] DOP plasticizer (bis(2-ethylhexyl) phthalate, manufactured by J-PLUS) was used instead of DOTP plasticizer (bis(2-ethylhexyl terephthalate) ) ester, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810") 60 parts by weight, the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1. This adhesive solution was applied to one side of the soft polyvinyl chloride film (4) obtained in Production Example 4, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (13) is thus obtained. [Example 14] 80 parts by weight of DOP plasticizer (bis(2-ethylhexyl) phthalate, manufactured by J-PLUS) was used instead of DOTP plasticizer (bis(2-ethylhexyl terephthalate ) ester, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810") 60 parts by weight, the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1. This adhesive solution was applied to one side of the soft polyvinyl chloride film (5) obtained in Production Example 5, and then dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (14) is thus obtained. [Example 15] Using butyl acrylate (BA) / imidazole polymerizable monomer (manufactured by Shikoku Chemicals, trade name "1H2MZM" / 2-hydroxyethyl acrylate (HEA) / acrylic acid (AA) = 85/15/ 100 parts by weight of acrylic copolymer I (weight average molecular weight=1500000) of 10/0.25 (weight ratio) replaces 100 parts by weight of acrylic copolymer A, using DOP plasticizer (two (2-ethylhexyl phthalate) ) ester, manufactured by J-PLUS) 80 parts by weight instead of 60 parts by weight of DOTP plasticizer (bis(2-ethylhexyl) terephthalate, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810"), except Otherwise, an ethyl acetate solution of the adhesive was prepared in the same manner as in Example 1. After coating the adhesive solution on one side of the soft polyvinyl chloride film (1) obtained in Production Example 1, the adhesive was heated at 130°C * Dry for 90 seconds to form an adhesive layer with a thickness of 10 μm. Obtain an adhesive tape (15) in this way. [Example 16] Prepare the ethyl acetate solution of the following adhesive. The above adhesive contains: butyl acrylate (BA) Acrylic copolymer J (weight average Molecular weight = 1500000) 100 parts by weight, isocyanate crosslinking agent (manufactured by TOSOH, trade name "CORONATE HX") 5 parts by weight, ethylenediamine polyol (manufactured by ADEKA company, trade name "Adeka polyol EDP-300") 2.5 parts by weight, and 60 parts by weight of DOTP plasticizer (bis(2-ethylhexyl) terephthalate, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810"). This adhesive solution is applied to the manufacturing The single surface of the soft polyvinyl chloride film (1) obtained in Example 1 was dried at 130°C for 90 seconds to form an adhesive layer with a thickness of 7 μm. In this way, an adhesive tape (16) was obtained. [Example 17] The blending amount of the isocyanate-based crosslinking agent (manufactured by TOSOH, trade name "CORONATE HX") was 0.5 parts by weight, and ethylenediamine polyol (manufactured by ADEKA, trade name "Adeka polyol EDP-300") was not added, except Otherwise, an ethyl acetate solution of an adhesive was prepared in the same manner as in Example 16. After the adhesive solution was applied to a single surface of the soft polyvinyl chloride film (1) obtained in Production Example 1, it was heated at 130° C. × 90 seconds to dry to form an adhesive layer with a thickness of 7 μm. In this way, an adhesive tape (17) was obtained. [Example 18] The blending amount of an isocyanate-based crosslinking agent (manufactured by TOSOH, trade name "CORONATE HX") was set to An ethyl acetate solution of the adhesive was prepared in the same manner as in Example 16 except that ethylenediamine polyol (manufactured by ADEKA, trade name "Adeka polyol EDP-300") was not added. This adhesive solution was applied to one surface of the flexible polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 7 μm. The adhesive tape (18) is thus obtained. [Example 19] 0.5 parts by weight of an epoxy-based cross-linking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C") was used instead of 5 parts by weight of an isocyanate-based cross-linking agent (manufactured by TOSOH, trade name "CORONATE HX") Parts, except that ethylenediamine polyol (manufactured by ADEKA, trade name "Adeka polyol EDP-300") was not added, the ethyl acetate solution of the adhesive was prepared in the same manner as in Example 16. This adhesive solution was applied to one surface of the flexible polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 7 μm. The adhesive tape (19) is thus obtained. [Comparative Example 1] Prepare an ethyl acetate solution of an adhesive containing: an acrylic copolymer J (weight average molecular weight) comprising butyl acrylate (BA)/acrylic acid (AA)=100/3.0 (weight ratio) =1500000) 100 parts by weight, 0.5 parts by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical, trade name "TETRAD-C"), and a DOTP plasticizer ((2-ethylhexyl terephthalate), ADEKA Corporation make, brand name "ADEKA CIZER D-810") 60 parts by weight. This adhesive solution was applied to a single surface of the flexible polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (16) is thus obtained. [Comparative Example 2] Prepare an ethyl acetate solution of the following adhesive, which contains: 2-ethylhexyl acrylate (2-EHA)/acryl morpholine (ACMO)/acrylic acid/2-hydroxyethyl acrylate 100 parts by weight of acrylic copolymer K (weight average molecular weight=1,500,000) of ester (HEA)=75/25/3.0/0.1 (weight ratio), epoxy crosslinking agent (manufactured by Mitsubishi Gas Chemical, trade name "TETRAD- C") 1.0 parts by weight, and 60 parts by weight of a DOTP plasticizer ((2-ethylhexyl) terephthalate, manufactured by ADEKA Corporation, trade name "ADEKA Cizer D-810"). This adhesive solution was applied to a single surface of the flexible polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (17) is thus obtained. [Comparative Example 3] Prepare an ethyl acetate solution of an adhesive containing: an acrylic copolymer comprising 2-ethylhexyl acrylate (2-EHA)/acrylic acid (AA)=95/5.0 (weight ratio) (weight average molecular weight = 1,500,000) 100 parts by weight, 0.5 parts by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical, trade name "TETRAD-C"), and DOTP plasticizer (terephthalic acid (2-ethylene glycol) Hexyl) ester, manufactured by ADEKA Corporation, trade name "ADEKA CIZER D-810") 60 parts by weight. This adhesive solution was applied to a single surface of the flexible polyvinyl chloride film (1) obtained in Production Example 1, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. The adhesive tape (18) is thus obtained. The adhesive tapes obtained in Examples and Comparative Examples were used for the following evaluations. The results are shown in Table 1 and Table 2. (1) Adhesive force The adhesive tape (width 20 mm x length 120 mm) was attached to the SUS430BA board under the conditions of linear pressure 78.5 N/cm and speed 0.3 m/min. After bonding, let it stand for 30 minutes at 23°C and 50%RH, and then use AUTOGRAPH AG-IS (manufactured by SHIMADZU) at 23°C and 50%RH at a stretching angle of 180° and a stretching speed of 0.3 Adhesion was measured under the condition of m/min. (2) Tape floating evaluation Use the hand roller to reciprocate once, and attach the Si wafer cut into 10 mm square to the center (width direction, length direction center) of the adhesive tape (width 20 mm x length 120 mm) ). After laminating the Si wafer, let it stand at 23°C, 50%RH for 30 minutes, under the conditions of a ring atmosphere at 50°C, a chuck distance of 50 mm, a tensile speed of 0.3 m/min, and a stretching distance of 50 mm. Next, the tape sample attached with the Si wafer is extended. The degree of floating at the end of the tape at this time was visually observed. Regarding the adhesion area, by bonding the adhesive to the adherend, the portion where the color of the tape appearance appears darker was visually judged as the adhesion area. Regarding the method of calculating the contact area, the floating observation image was printed out in color on A4 paper, and only the wafer portion was cut out to measure its weight. Then cut out the bonded part (the part with darker color) and the floating part (the part with lighter color), measure the weight of the cut paper, calculate the weight ratio of the bonded part, and evaluate according to the following criteria. 〇: Tape bonding area is 70% or more of the initial bonding area ×: Tape bonding area is 70% or less of the initial bonding area (3) Paste residue evaluation Use a hand roller to reciprocate once and cut into 10 mm The mirror surface of the square Si wafer is attached to the central part (the center of the width direction and the length direction) of the adhesive tape (width 20 mm x length 120 mm). After laminating the Si wafer, let it stand at 23°C and 50%RH for 30 minutes, then place it under a ring atmosphere at 50°C at a distance between chucks of 50 mm, a tensile speed of 0.3 m/min, and an extension distance of 50 mm. The tape sample attached with the Si wafer was extended under the conditions. Then, the tape sample was released from the stretched state, and then the tape was peeled from the Si wafer at a peeling angle of 180° and a tensile speed of 10 mm/sec, and the level of paste residue on the surface of the Si wafer was observed visually. The surface of the wafer was observed with a digital microscope (manufactured by KEYENCE) at a magnification of 500 times, and when contamination with a long side length of 10 μm or more was confirmed, it was judged that there was paste residue (in Table 1, ×). It was judged that there was no paste residue when no contamination with a long side length of 10 μm or more was confirmed (in Table 1, ×). [Table 1]
Figure 106126185-A0304-0001
Figure 106126185-A0304-0002
Figure 106126185-A0304-0003
 [Table 2]
Figure 106126185-A0304-0004

10‧‧‧基材20‧‧‧黏著劑層30‧‧‧非黏著層100、200‧‧‧黏著帶10‧‧‧substrate 20‧‧‧adhesive layer 30‧‧‧non-adhesive layer 100,200‧‧‧adhesive tape

圖1係本發明之黏著帶之一實施形態之概略剖視圖。 圖2係本發明之黏著帶之另一實施形態之概略剖視圖。Fig. 1 is a schematic sectional view of an embodiment of the adhesive tape of the present invention. Fig. 2 is a schematic sectional view of another embodiment of the adhesive tape of the present invention.

10‧‧‧基材 10‧‧‧Substrate

20‧‧‧黏著劑層 20‧‧‧adhesive layer

100‧‧‧黏著帶 100‧‧‧adhesive tape

Claims (12)

一種黏著帶，其包括：基材、及配置於該基材之至少一面且包含丙烯酸系黏著劑之黏著劑層，構成該丙烯酸系黏著劑之基礎聚合物包含具有不含游離氫之氫鍵性官能基之結構單元，該黏著劑層包含塑化劑，且該黏著帶於23℃×30分鐘後對SUS板之黏著力為2.1N/20mm以下。 An adhesive tape, comprising: a base material, and an adhesive layer disposed on at least one side of the base material and comprising an acrylic adhesive, the base polymer constituting the acrylic adhesive includes a hydrogen-bonding polymer that does not contain free hydrogen The structural unit of the functional group, the adhesive layer contains a plasticizer, and the adhesive force of the adhesive tape to the SUS plate after 23°C×30 minutes is 2.1N/20mm or less. 如請求項1之黏著帶，其中上述黏著劑層配置於上述基材之一面，且上述黏著帶進而包括配置於該基材之與該黏著劑層為相反側之面之非黏著層。 The adhesive tape according to claim 1, wherein the adhesive layer is arranged on one side of the substrate, and the adhesive tape further includes a non-adhesive layer arranged on the side of the substrate opposite to the adhesive layer. 如請求項1之黏著帶，其厚度為20μm~120μm。 For example, the adhesive tape of claim 1 has a thickness of 20 μm to 120 μm. 如請求項1之黏著帶，其中上述黏著劑層之厚度為1μm~30μm。 The adhesive tape according to claim 1, wherein the thickness of the adhesive layer is 1 μm to 30 μm. 如請求項1之黏著帶，其中上述具有不含游離氫之氫鍵性官能基之結構單元之含有比率相對於上述基礎聚合物100重量份為9重量份~23重量份。 The adhesive tape according to claim 1, wherein the content ratio of the structural unit having a hydrogen-bonding functional group without free hydrogen is 9 parts by weight to 23 parts by weight relative to 100 parts by weight of the base polymer. 如請求項1之黏著帶，其中由構成上述具有不含游離氫之氫鍵性官能 基之結構單元之單體a形成的均聚物之玻璃轉移溫度為50℃~150℃。 The adhesive tape as claimed in claim 1, wherein the above-mentioned hydrogen-bonding functions without free hydrogen are composed of The glass transition temperature of the homopolymer formed by the monomer a of the basic structural unit is 50°C~150°C. 如請求項1之黏著帶，其中上述黏著劑層中之塑化劑之含有比率相對於構成黏著劑之基礎聚合物100重量份為10重量份~100重量份。 The adhesive tape according to claim 1, wherein the content ratio of the plasticizer in the adhesive layer is 10 to 100 parts by weight relative to 100 parts by weight of the base polymer constituting the adhesive. 如請求項1之黏著帶，其中上述基礎聚合物進而包含源自含羧基單體之結構單元，且該源自含羧基單體之結構單元之含有比率相對於基礎聚合物100重量份為0.2重量份以下。 The adhesive tape according to claim 1, wherein the base polymer further includes a structural unit derived from a carboxyl group-containing monomer, and the content ratio of the structural unit derived from a carboxyl group-containing monomer is 0.2 parts by weight relative to 100 parts by weight of the base polymer servings or less. 如請求項1之黏著帶，其中上述基礎聚合物不含源自含羧基單體之結構單元。 The adhesive tape according to claim 1, wherein the base polymer does not contain a structural unit derived from a carboxyl group-containing monomer. 如請求項1之黏著帶，其中上述具有不含游離氫之氫鍵性官能基之結構單元為源自選自由N-乙烯基-2-吡咯啶酮、N,N-二乙基丙烯醯胺、丙烯醯基嗎啉及(甲基)丙烯酸2-(2-甲基咪唑基)乙酯所組成之群中之至少1種單體的結構單元。 The adhesive tape as claimed in claim 1, wherein the structural unit having a hydrogen-bonding functional group without free hydrogen is derived from the group consisting of N-vinyl-2-pyrrolidone, N,N-diethylacrylamide A structural unit of at least one monomer selected from the group consisting of , acrylmorpholine and 2-(2-methylimidazolyl)ethyl (meth)acrylate. 如請求項1之黏著帶，其中上述塑化劑為對苯二甲酸酯系塑化劑。 The adhesive tape according to claim 1, wherein the plasticizer is a terephthalate-based plasticizer. 如請求項1之黏著帶，其中上述塑化劑為對苯二甲酸雙(2-乙基己基)酯。 The adhesive tape according to claim 1, wherein the plasticizer is bis(2-ethylhexyl) terephthalate.
TW106126185A 2016-08-26 2017-08-03 Adhesive tape TWI802547B (en)

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