TWI799567B - 導熱層、感光層、感光性組成物、導熱層之製造方法以及積層體及半導體器件 - Google Patents

導熱層、感光層、感光性組成物、導熱層之製造方法以及積層體及半導體器件 Download PDF

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TWI799567B
TWI799567B TW108113002A TW108113002A TWI799567B TW I799567 B TWI799567 B TW I799567B TW 108113002 A TW108113002 A TW 108113002A TW 108113002 A TW108113002 A TW 108113002A TW I799567 B TWI799567 B TW I799567B
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heat conduction
layer
conduction layer
photosensitive
laminate
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TW108113002A
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TW201943778A (zh
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山下広祐
嶋田和人
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日商富士軟片股份有限公司
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  • Combustion & Propulsion (AREA)
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  • Metallurgy (AREA)
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  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108113002A 2018-04-20 2019-04-15 導熱層、感光層、感光性組成物、導熱層之製造方法以及積層體及半導體器件 TWI799567B (zh)

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JP2018081904 2018-04-20
JP2018-081904 2018-04-20
JP2018-185069 2018-09-28
JP2018185069 2018-09-28
JP2019-041304 2019-03-07
JP2019041304 2019-03-07

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TWI799567B true TWI799567B (zh) 2023-04-21

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US (1) US11697754B2 (zh)
JP (1) JP7018126B2 (zh)
KR (1) KR102386491B1 (zh)
CN (1) CN112004887A (zh)
TW (1) TWI799567B (zh)
WO (1) WO2019203178A1 (zh)

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US20230227709A1 (en) * 2020-06-15 2023-07-20 3M Innovative Properties Company Flowable hardenable composition, thermally conductive composition, and electronic heat sink assembly including the same
CN214176013U (zh) * 2020-12-23 2021-09-10 迪科特测试科技(苏州)有限公司 半导体结构
CN112631073A (zh) * 2020-12-30 2021-04-09 福州大学 一种导热光刻胶及其应用
WO2022172349A1 (ja) * 2021-02-10 2022-08-18 キヤノンアネルバ株式会社 化学結合法及びパッケージ型電子部品
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