TWI799567B - 導熱層、感光層、感光性組成物、導熱層之製造方法以及積層體及半導體器件 - Google Patents
導熱層、感光層、感光性組成物、導熱層之製造方法以及積層體及半導體器件 Download PDFInfo
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- TWI799567B TWI799567B TW108113002A TW108113002A TWI799567B TW I799567 B TWI799567 B TW I799567B TW 108113002 A TW108113002 A TW 108113002A TW 108113002 A TW108113002 A TW 108113002A TW I799567 B TWI799567 B TW I799567B
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- Condensed Matter Physics & Semiconductors (AREA)
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Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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JP2018081904 | 2018-04-20 | ||
JP2018-081904 | 2018-04-20 | ||
JP2018-185069 | 2018-09-28 | ||
JP2018185069 | 2018-09-28 | ||
JP2019-041304 | 2019-03-07 | ||
JP2019041304 | 2019-03-07 |
Publications (2)
Publication Number | Publication Date |
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TW201943778A TW201943778A (zh) | 2019-11-16 |
TWI799567B true TWI799567B (zh) | 2023-04-21 |
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Application Number | Title | Priority Date | Filing Date |
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TW108113002A TWI799567B (zh) | 2018-04-20 | 2019-04-15 | 導熱層、感光層、感光性組成物、導熱層之製造方法以及積層體及半導體器件 |
Country Status (6)
Country | Link |
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US (1) | US11697754B2 (zh) |
JP (1) | JP7018126B2 (zh) |
KR (1) | KR102386491B1 (zh) |
CN (1) | CN112004887A (zh) |
TW (1) | TWI799567B (zh) |
WO (1) | WO2019203178A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20230227709A1 (en) * | 2020-06-15 | 2023-07-20 | 3M Innovative Properties Company | Flowable hardenable composition, thermally conductive composition, and electronic heat sink assembly including the same |
CN214176013U (zh) * | 2020-12-23 | 2021-09-10 | 迪科特测试科技(苏州)有限公司 | 半导体结构 |
CN112631073A (zh) * | 2020-12-30 | 2021-04-09 | 福州大学 | 一种导热光刻胶及其应用 |
WO2022172349A1 (ja) * | 2021-02-10 | 2022-08-18 | キヤノンアネルバ株式会社 | 化学結合法及びパッケージ型電子部品 |
WO2022180221A1 (en) * | 2021-02-25 | 2022-09-01 | Basf Se | Polymers having improved thermal conductivity |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200710571A (en) * | 2005-05-31 | 2007-03-16 | Taiyo Ink Mfg Co Ltd | Curable resin composition and cured object obtained therefrom |
JP2013080916A (ja) * | 2011-09-20 | 2013-05-02 | Kyodo Printing Co Ltd | シート及びその製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03295863A (ja) * | 1990-04-10 | 1991-12-26 | Toyo Alum Kk | 球状窒化アルミニウム粉末の製造方法 |
JP3003380B2 (ja) * | 1992-03-23 | 2000-01-24 | 富士ゼロックス株式会社 | 通電転写用記録ヘッド |
JPH1044330A (ja) * | 1996-08-06 | 1998-02-17 | Toppan Printing Co Ltd | 化粧材およびその製造方法 |
JP3943883B2 (ja) * | 2001-10-02 | 2007-07-11 | 新日鐵化学株式会社 | 絶縁用樹脂組成物及びこれを用いた積層体 |
JP3764083B2 (ja) * | 2001-10-16 | 2006-04-05 | 電気化学工業株式会社 | 窒化アルミニウム粉末の製造方法 |
US20080007890A1 (en) * | 2004-09-30 | 2008-01-10 | Harmon Julianne P | Thermally conductive composite and uses for microelectronic packaging |
JP4713948B2 (ja) * | 2005-05-31 | 2011-06-29 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物及びその硬化物 |
JP4375481B2 (ja) * | 2005-07-05 | 2009-12-02 | 日立化成工業株式会社 | 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品 |
US20100143673A1 (en) * | 2007-04-04 | 2010-06-10 | Kazuyuki Mitsukura | Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
JP2010234678A (ja) * | 2009-03-31 | 2010-10-21 | Yamagata Univ | 樹脂組成物を成形して得られる成形体及び該成形体の製造方法 |
JP5161924B2 (ja) * | 2010-06-25 | 2013-03-13 | パナソニック株式会社 | 半導体装置 |
JP5360285B2 (ja) * | 2012-01-26 | 2013-12-04 | 東レ株式会社 | 感光性導電ペースト |
US20150037575A1 (en) * | 2012-03-30 | 2015-02-05 | Showa Denko K.K. | Curable heat radiation composition |
KR101687394B1 (ko) | 2013-06-17 | 2016-12-16 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트 |
JP2015168783A (ja) * | 2014-03-07 | 2015-09-28 | 三井・デュポンフロロケミカル株式会社 | 高熱伝導性樹脂組成物 |
WO2018123012A1 (ja) * | 2016-12-28 | 2018-07-05 | 日立化成株式会社 | 熱伝導シート、熱伝導シートの製造方法及び放熱装置 |
EP4043394A4 (en) * | 2019-10-07 | 2023-03-08 | JFE Steel Corporation | BORON NITRIDE POWDER, BORON NITRIDE POWDER PRODUCTION METHOD, RESIN MATERIAL AND RESIN MATERIAL PRODUCTION METHOD |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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