TWI799457B - 具有增進的互連之晶片封裝組件以及製造其之方法 - Google Patents

具有增進的互連之晶片封裝組件以及製造其之方法 Download PDF

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TWI799457B
TWI799457B TW107136756A TW107136756A TWI799457B TW I799457 B TWI799457 B TW I799457B TW 107136756 A TW107136756 A TW 107136756A TW 107136756 A TW107136756 A TW 107136756A TW I799457 B TWI799457 B TW I799457B
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interconnects
fabricating
enhanced
same
chip package
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TW107136756A
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TW201931543A (zh
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賈斯匹利特 辛格 甘地
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美商吉林克斯公司
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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US20110304042A1 (en) * 2010-06-11 2011-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Copper Bump Structures Having Sidewall Protection Layers
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