TWI799444B - 用於分離暫時接合之基板堆疊之裝置及方法 - Google Patents

用於分離暫時接合之基板堆疊之裝置及方法 Download PDF

Info

Publication number
TWI799444B
TWI799444B TW107130300A TW107130300A TWI799444B TW I799444 B TWI799444 B TW I799444B TW 107130300 A TW107130300 A TW 107130300A TW 107130300 A TW107130300 A TW 107130300A TW I799444 B TWI799444 B TW I799444B
Authority
TW
Taiwan
Prior art keywords
separating
bonded substrate
substrate stack
temporarily bonded
temporarily
Prior art date
Application number
TW107130300A
Other languages
English (en)
Other versions
TW201923949A (zh
Inventor
伊莉莎白 布蘭德
波利斯 波維賽
湯瑪斯 烏爾曼
Original Assignee
奧地利商Ev集團E塔那有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧地利商Ev集團E塔那有限公司 filed Critical 奧地利商Ev集團E塔那有限公司
Publication of TW201923949A publication Critical patent/TW201923949A/zh
Application granted granted Critical
Publication of TWI799444B publication Critical patent/TWI799444B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW107130300A 2017-09-12 2018-08-30 用於分離暫時接合之基板堆疊之裝置及方法 TWI799444B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??PCT/EP2017/072869 2017-09-12
WOPCT/EP2017/072869 2017-09-12
PCT/EP2017/072869 WO2019052634A1 (de) 2017-09-12 2017-09-12 Vorrichtung und verfahren zum trennen eines temporär gebondeten substratstapels

Publications (2)

Publication Number Publication Date
TW201923949A TW201923949A (zh) 2019-06-16
TWI799444B true TWI799444B (zh) 2023-04-21

Family

ID=59856533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107130300A TWI799444B (zh) 2017-09-12 2018-08-30 用於分離暫時接合之基板堆疊之裝置及方法

Country Status (7)

Country Link
US (1) US11534868B2 (zh)
EP (1) EP3682470A1 (zh)
JP (2) JP7130735B2 (zh)
KR (2) KR102550390B1 (zh)
CN (1) CN111095519B (zh)
TW (1) TWI799444B (zh)
WO (1) WO2019052634A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7339031B2 (ja) * 2019-06-28 2023-09-05 株式会社ディスコ レーザー加工装置
US20210078294A1 (en) * 2019-09-16 2021-03-18 Shenzhenshi Yuzhan Precision Technology Co., Ltd. Glass article, methods for manufacturing the same, and laser welding equipemnt
CN111933531B (zh) * 2020-08-11 2023-06-20 中国电子科技集团公司第三十八研究所 一种基于激光键合的立体电路积层制造方法
TWI773067B (zh) * 2021-01-04 2022-08-01 財團法人工業技術研究院 雷射光路之調校方法與雷射光路之調校裝置
CN118385776B (zh) * 2024-06-17 2024-08-27 天津中科晶禾电子科技有限责任公司 激光解键合方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329233A1 (en) * 2014-11-07 2016-11-10 International Business Machines Corporation Double Layer Release Temporary Bond and Debond Processes and Systems

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8415208B2 (en) * 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
US20030224581A1 (en) * 2002-06-03 2003-12-04 Robert Bosch Gmbh Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
JP4439210B2 (ja) * 2002-08-29 2010-03-24 京セラ株式会社 ダミーウエハ
JP4038435B2 (ja) * 2002-10-15 2008-01-23 Ｊｕｋｉ株式会社 ダイボンディング装置
DE202009018064U1 (de) 2008-01-24 2010-12-02 Brewer Science, Inc. Gegenstände beim reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat
KR100953686B1 (ko) * 2008-02-18 2010-04-19 에이피시스템 주식회사 레이저 가공장치
JP2011040564A (ja) 2009-08-11 2011-02-24 Toshiba Corp 半導体素子の製造方法および製造装置
JP2011083795A (ja) * 2009-10-15 2011-04-28 Pulstec Industrial Co Ltd レーザ加工装置およびレーザ加工方法
WO2011071889A1 (en) * 2009-12-07 2011-06-16 J.P. Sercel Associates, Inc. Laser lift off systems and methods
JP5693705B2 (ja) * 2010-03-30 2015-04-01 イムラ アメリカ インコーポレイテッド レーザベースの材料加工装置及び方法
US9555644B2 (en) * 2011-07-14 2017-01-31 The Board Of Trustees Of The University Of Illinois Non-contact transfer printing
JP5878330B2 (ja) 2011-10-18 2016-03-08 株式会社ディスコ レーザー光線の出力設定方法およびレーザー加工装置
WO2013126927A2 (en) * 2012-02-26 2013-08-29 Solexel, Inc. Systems and methods for laser splitting and device layer transfer
JP6007688B2 (ja) * 2012-09-11 2016-10-12 富士電機株式会社 半導体装置の製造方法
JP6110136B2 (ja) * 2012-12-28 2017-04-05 株式会社ディスコ ウエーハのレーザー加工方法およびレーザー加工装置
US20140251533A1 (en) * 2013-03-11 2014-09-11 Samsung Display Co., Ltd. Substrate peeling device, method for peeling substrate, and method for fabricating flexible display device
GB2519088B (en) * 2013-10-08 2015-09-16 M Solv Ltd Laser scanning system for laser release
JP6399913B2 (ja) 2014-12-04 2018-10-03 株式会社ディスコ ウエーハの生成方法
JP6314082B2 (ja) 2014-12-18 2018-04-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US20180022079A1 (en) * 2015-01-14 2018-01-25 Ev Group E. Thallner Gmbh Method and device for detaching a substrate from a substrate stack
CN105977194A (zh) 2016-06-30 2016-09-28 华进半导体封装先导技术研发中心有限公司 纳秒固态激光调制系统及键合晶圆分离的方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329233A1 (en) * 2014-11-07 2016-11-10 International Business Machines Corporation Double Layer Release Temporary Bond and Debond Processes and Systems

Also Published As

Publication number Publication date
CN111095519B (zh) 2023-08-18
CN111095519A (zh) 2020-05-01
JP2022133361A (ja) 2022-09-13
WO2019052634A1 (de) 2019-03-21
US11534868B2 (en) 2022-12-27
JP7428752B2 (ja) 2024-02-06
US20210060710A1 (en) 2021-03-04
TW201923949A (zh) 2019-06-16
JP7130735B2 (ja) 2022-09-05
KR20200050967A (ko) 2020-05-12
KR20220116568A (ko) 2022-08-23
JP2020537817A (ja) 2020-12-24
EP3682470A1 (de) 2020-07-22
KR102550390B1 (ko) 2023-07-03

Similar Documents

Publication Publication Date Title
TWI799444B (zh) 用於分離暫時接合之基板堆疊之裝置及方法
EP3478903A4 (en) METHOD AND DEVICE FOR MANAGING AND SEPARATING A TONGUE FROM A LANGUAGE DRAFT
EP3580778A4 (en) APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
EP3893109A4 (en) METHOD AND DEVICE FOR CONNECTING BLUETOOTH DEVICES
EP3208828A4 (en) Method for bonding substrates together, and substrate bonding device
EP3572478A4 (en) ADHESIVE FILM AND PROCESS FOR MANUFACTURING AN ELECTRONIC DEVICE
EP3699973A4 (en) BATTERY, ELECTRONIC DEVICE, AND METHOD OF PACKAGING A BATTERY
EP3507827A4 (en) DEVICE AND METHOD FOR CLAMPING CURVED WAFER
EP3409032A4 (en) PROCESS FOR BUILDING A SECURED CONNECTION BETWEEN LWM2M DEVICES
EP3676181A4 (en) AIRCRAFT SEPARATION DEVICE AND SEPARATION PROCESS
EP3337693A4 (en) Electronic device and method for controlling a transport device thereof
EP3468318A4 (en) ADHESIVE DEVICE AND ADHESIVE METHOD FOR CONDUCTIVE ADHESIVE
EP3481758A4 (en) GRIP DEVICE, LOADING STATION AND METHOD FOR GRAPPING A STACK
EP3605627A4 (en) PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE PIEZOELECTRIC DEVICE
EP3751018A4 (en) VACUUM REACTION DEVICE AND REACTION PROCEDURE
EP3848451A4 (en) SEPARATION DEVICE AND PROCESS FOR SEPARATING MATERIAL TO BE SEPARATED BY THE USER
EP3826050A4 (en) SUBSTRATE WELDING DEVICE
EP3398680A4 (en) DEVICE FOR SEPARATING OR ALIGNING PARTICULAR PARTICLES AND METHOD FOR SEPARATING OR ALIGNING FINE PARTICLES WITH USE THEREOF
EP3598503A4 (en) METHOD OF MANUFACTURING A DISPLAY SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY DEVICE
EP3309822A4 (en) Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package
EP3532970A4 (en) SYSTEM AND METHOD FOR SECURING ELECTRONIC DEVICES
EP3265412A4 (en) Apparatus and method for repeatedly separating and displacing a topmost bag of a stack of bags
EP3728045A4 (en) SEPARATING DEVICE
EP3196265A4 (en) Film-like adhesive composite sheet and method for manufacturing semiconductor device
EP3533850A4 (en) ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TEST DEVICE