TWI797892B - 感光性樹脂組成物及有機ｅｌ元件間隔壁 - Google Patents

感光性樹脂組成物及有機ｅｌ元件間隔壁 Download PDF

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Publication number
TWI797892B
TWI797892B TW110147123A TW110147123A TWI797892B TW I797892 B TWI797892 B TW I797892B TW 110147123 A TW110147123 A TW 110147123A TW 110147123 A TW110147123 A TW 110147123A TW I797892 B TWI797892 B TW I797892B
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TW
Taiwan
Prior art keywords
resin
mass
resin composition
photosensitive resin
group
Prior art date
Application number
TW110147123A
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English (en)
Chinese (zh)
Other versions
TW202238266A (zh
Inventor
石田恭裕
古江健太郎
倉本拓樹
Original Assignee
日商昭和電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW202238266A publication Critical patent/TW202238266A/zh
Application granted granted Critical
Publication of TWI797892B publication Critical patent/TWI797892B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Materials For Photolithography (AREA)
TW110147123A 2020-12-28 2021-12-16 感光性樹脂組成物及有機ｅｌ元件間隔壁 TWI797892B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020219137 2020-12-28
JP2020-219137 2020-12-28

Publications (2)

Publication Number Publication Date
TW202238266A TW202238266A (zh) 2022-10-01
TWI797892B true TWI797892B (zh) 2023-04-01

Family

ID=82260415

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110147123A TWI797892B (zh) 2020-12-28 2021-12-16 感光性樹脂組成物及有機ｅｌ元件間隔壁

Country Status (3)

Country Link
JP (1) JPWO2022145187A1 (https=)
TW (1) TWI797892B (https=)
WO (1) WO2022145187A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI852810B (zh) * 2022-10-25 2024-08-11 財團法人工業技術研究院 聚合物、感光組成物、乾膜光阻、與微影方法
CN117169182B (zh) * 2023-08-30 2024-03-15 广州沙艾生物科技有限公司 一种干细胞治疗制剂体外效力检测方法及其应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201229670A (en) * 2010-10-29 2012-07-16 Sumitomo Chemical Co Photosensitive resin composition, pattern structure, display device and partition
TW201901297A (zh) * 2017-04-07 2019-01-01 日商昭和電工股份有限公司 感光性樹脂組成物
TW202030901A (zh) * 2019-02-06 2020-08-16 日商昭和電工股份有限公司 感光性樹脂組成物、有機ｅｌ元件間隔壁，及有機ｅｌ元件

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6700020B2 (ja) * 2015-10-21 2020-05-27 昭和電工株式会社 ポジ型感光性樹脂組成物
JP6576386B2 (ja) * 2017-04-07 2019-09-18 昭和電工株式会社 感光性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201229670A (en) * 2010-10-29 2012-07-16 Sumitomo Chemical Co Photosensitive resin composition, pattern structure, display device and partition
TW201901297A (zh) * 2017-04-07 2019-01-01 日商昭和電工股份有限公司 感光性樹脂組成物
TW202030901A (zh) * 2019-02-06 2020-08-16 日商昭和電工股份有限公司 感光性樹脂組成物、有機ｅｌ元件間隔壁，及有機ｅｌ元件

Also Published As

Publication number Publication date
TW202238266A (zh) 2022-10-01
JPWO2022145187A1 (https=) 2022-07-07
WO2022145187A1 (ja) 2022-07-07

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