TW201229670A - Photosensitive resin composition, pattern structure, display device and partition - Google Patents

Abstract

Provided is a negative type photosensitive resin composition having excellent liquid repellence, heat resistance and solvent resistance, and capable of forming a pattern without the photosensitive resin composition remained as residue at locations other than the pattern forming portion. The negative type photosensitive resin composition contains an alkali solvable resin (A), a fluorine liquid repellence (B), a cross-linker (C) and an acid generator (D), wherein the fluorine liquid repellence (B) is an addition polymer containing a structural unit derived from an unsaturated compound having C4-C6 fluoroalkyl group, and the addition ratio of the fluorine liquid repellence (B) is 0.01 to 1.0% by weight with respect to the total solid contents in the composition.

Description

201229670 6. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to a photosensitive resin composition, a pattern structure, a display device, and a partition wall. [Prior Art] In the method of manufacturing a display device or the like, a method of manufacturing a color filter or a liquid crystal display element constituting a part of the device or the like by a coating process such as an inkjet method has been reported. A method such as an electrode, an organic electroluminescence device (hereinafter sometimes referred to as "organic EL device"), or a circuit wiring substrate. In the coating type process such as the ink jet method, a partition wall formed using a photosensitive resin composition is used. For example, three kinds of organic EL elements in a display device using an organic EL element

The member is disposed on the support substrate. That is, (1) a red organic EL element that emits red light, (2) a green organic EL element that emits green light, and (3) a blue organic EL element that emits blue light are provided on the support substrate. A partition wall having a predetermined pixel pattern is generally provided on the support substrate, and the three types of organic EL elements are arranged in a row by the partition walls (i.e., the regions surrounded by the partition walls). Each of the organic EL elements is formed by the first electrode 2, the organic EL layer 4, and the second electrode 7 in the region 5 surrounded by the partition walls 3 (see Fig. 1). . A method of forming the organic EL layer 4 will be described with reference to Fig. 2 . First, the first electrode 2 and the partition 3 are formed on the support substrate 1. Then, the ink 6 composed of the material and solvent having the EXI 4 is supplied to the region 5 surrounded by the partition wall 4 323613 201229670 3 (Fig. 2A). The supplied ink 6 is accommodated in a region 5 (Fig. 2B) surrounded by the partition wall 3, and the organic solvent layer 4 is formed by evaporation of the k solvent of the ink 6 in the region 5 (Fig. 2C). A coating type process for supplying such an ink 6f has been proposed by an ink jet method, a nozzle coating method, or the like. & Here, the partition wall 3 defining the pixel pattern is patterned by photolithography using a photosensitive resin composition. It is required that the partition wall 3 used in the coating type process must positively accommodate and hold the ink 6 supplied into the region 5 surrounded by the partition wall to prevent the wetting from spreading to an unintended place, that is, having a so-called dialing Liquid. A photosensitive resin composition for forming a photosensitive resin composition for exhibiting the liquid repellency, and a photosensitive resin composition containing, for example, an α-substituted propionate having a fluoroalkyl group having 4 to 6 carbon atoms is known. The obtained polymer was polymerized (Patent Document 1). [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Application Laid-Open No. Hei. No. Hei. In the pattern structure of the partition wall, the partition wall which has an appropriate liquid repellency is provided, and the ink supplied to the area surrounded by the partition wall is accommodated and held, but the obtained pattern structure is rich in heat. There is a problem with low stability. Further, in order to form the organic EL it piece, when the partition wall is patterned on the support substrate, the residue of the photosensitive tree remains in the portion other than the portion where the pattern is formed, and the residue causes the ink to form the organic EL layer. When the ink is bounced to form a coating crucible, a coating film having a sufficiently uniform and flat film thickness may not necessarily be formed. In view of the above, it is an object of the present invention to provide a negative-sensitive photosensitive resin composition which is excellent in liquid-repellent property and heat-resistance and which does not form a residue in a portion other than the pattern forming portion and which forms a pattern. (Means for Solving the Problem) The present invention provides the following photosensitive resin composition, pattern structure, display device, and partition wall. [1] A photosensitive resin composition comprising a negative photosensitive resin containing an alkali-soluble resin (A), a fluorine-based liquid repellent (B), a crosslinking agent (c), and an acid generator (])) The fluorine-based liquid repellent (B) is an addition polymer containing a structural unit derived from an unsaturated compound having a fluoroalkyl group having 4 to 6 carbon atoms, and the fluorine-based liquid repellent (B) is added. 0重量百分比。 The ratio of the total solids in the composition is 〇〇1 to 1.0% by weight. [2] The photosensitive resin composition according to [1], which further contains a solvent 1 (e). [3] The photosensitive resin composition of [1] or [2], wherein the alkali-soluble resin (Α) contains a phenol resin. [4] The photosensitive resin composition according to any one of [1] to [3] wherein the alkali-soluble resin (Α) contains an acid varnish resin. [5] The photosensitive resin composition according to any one of [1] to [4] wherein the fluorine-based liquid repellent (Β) is composed of an unsaturated carboxylic acid and an unsaturated enemy An addition polymer of at least one structural unit selected from the group. The photosensitive resin composition of any one of [1] to [5], wherein the fluorine-based liquid repellent (B) contains a ring derived from having 2 to 4 carbon atoms. An addition polymer of a structural unit of an etherate structure of an unsaturated compound. v [7] A pattern structure formed by using the photosensitive resin composition according to any one of [1] to [6]. [8] A display device comprising the pattern structure of item [7]. [9] A partition wall for inkjet comprising the pattern structure of the item [7]. (Effects of the Invention) The present invention provides a negative photosensitive resin composition which is excellent in liquid repellency and heat resistance and which remains in the photosensitive resin composition other than the pattern forming portion without forming a residue. [Embodiment] The photosensitive resin composition of the present invention contains a negative photosensitive resin composition of the following (A), (B), (C) and (D). (A) Alkali-soluble resin (B) Fluoride-based liquid repellent (C) Cross-linking agent (D) Acid generator Further, in the present specification, exemplary compounds of the respective components may be used singly or in combination unless otherwise specified. . The fluorogreen agent (8) contained in the photosensitive resin composition of the present invention contains an unsaturated compound derived from a fluoroalkyl group having 4 to 6 carbon atoms, for example, a residue having a fluorine age and a carbon 1 double bond. The addition of the structure 7L is "the substance and the addition ratio thereof is relative to the photosensitive resin composition 323613 7 201229670. The total solid content is 〇. 01 to 1. 〇% by weight. Fluoride-based liquid repellent (Β) system For example, a polymer containing a structural unit derived from an unsaturated compound (d) having a perfluoroalkyl group having 4 to 6 carbon atoms (hereinafter sometimes referred to as "unsaturated compound (d)"). The unsaturated compound (d) is, for example, a compound represented by the following formula (d-Ο). ^^^0—Xd—Rf (d-0) [In the formula (d-Ο), Rf represents a fluoroalkyl group having 4 to 6 carbon atoms.

Rd represents a hydrogen atom, a halogen atom, a cyano group, a phenyl group, a phenylhydrazine group or an alkyl group having 1 to 21 carbon atoms, and the hydrogen atom contained in the alkyl group may be substituted with an i atom or a hydroxyl group. The formula £1 represents a single bond, a divalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, a divalent alicyclic hydrocarbon group having 3 to 10 carbon atoms, or a divalent aromatic hydrocarbon group having 6 to 12 carbon atoms. The aliphatic hydrocarbon group and one or more -CH2_ contained in the alicyclic hydrocarbon group may be substituted by _C0-, -C00_, -CeK phenyl), _NRa_, _S_ or -S〇2_.

Rf is preferably a perfluoroalkyl group having 4 to 6 carbon atoms. For example, perfluorobutyl group, perfluorohexyl group, and preferably perfluorobutyl group are mentioned.

The halogen atom in Rd is exemplified by F, Cl, Br, and I.

The alkyl group having 1 to 21 carbon atoms in Rd may, for example, be an anthracenyl group, an ethyl group, a n-propyl group, a n-butyl group, a n-pentyl group, a n-hexyl group, a n-heptyl group, an n-octyl group, a n-decyl group or a positive group. Linear alkyl such as fluorenyl; isopropyl, isobutyl, t-butyl, isopentyl, 1-decylpentyl, 323613 201229670 2-methylpentyl, 3-methylpentyl, 4 -methylpentyl, 1-ethylbutyl, 2-ethylbutyl, methylhexyl, 2-methylhexyl, 3-methylhexyl, 4-indolyl, 5-hexylhexyl, 5-ethylpentyl Base, 2-ethylpentyl, 3-ethylf-pentyl, propylpropyl, benzyl-heptyl, 2-methylheptyl, 3-methylheptyl, 4-decylheptyl, 5-methyl Heptyl, 6-methylheptyl, 1-ethylhexyl, 2-ethylhexyl, 3-ethylhexyl, 4-ethylhexyl, 2-propylpentyl, 1-butylbutyl, 1- Butyl-2-methylbutyl, 1-butyl-3-mercaptobutyl, tert-butyl, 1,1-dimercaptopropyl, 1,1-dimethylbutyl, i, 2 - Dimercaptobutyl, 1,3-dimercaptobutyl, 2,3-dimethylbutyl, 1-ethyl-2-mercaptopropyl, 1,1-dimethylpentyl, 1 ,2-dimethylpentyl, 1,3-dioxin Pentyl, 1,4-dioxylpentyl, 2,2-didecylpentyl, 2,3-dimercaptopentyl, 2,4-didecylpentyl, 3,3-dimethyl A branched chain alkyl group such as a pentyl group, a 3, 4-didecylpentyl group, a 1-ethyl-1-methylbutyl group or a 2-ethyl-3-mercaptobutyl group. Rd is preferably a hydrogen atom, a halogen atom or a methyl group. The divalent aliphatic hydrocarbon group having 1 to 1 carbon atom in Xd may, for example, be an anthracenylene group, an exoethyl group, a propane-1,3-diyl group, a propane-12-diyl group or a dibutyl group-1. ,4-diyl, butane-1,3-diyl, butane-1,2-diyl, pentane-yl, hexyl-1,6-diyl, heptane-1,7-diyl , octyl-l,8-diyl alkanediyl. The divalent alicyclic hydrocarbon group having 3 to 10 carbon atoms in Xd may, for example, be a cyclopropanediyl group, a cyclobutanediyl group, a cyclopentanediyl group, a cyclohexanediyl group or a cycloheptanediyl group. , cyclodecanediyl and the like. The divalent aromatic hydrocarbon group having 6 to 12 carbon atoms in Xd may, for example, be a phenylene group or a naphthalene diyl group. 9 323613 201229670

The Re group is exemplified by an aliphatic hydrocarbon group having 1 to 4 carbon atoms. The aliphatic hydrocarbon group and the -CH2- contained by the alicyclic hydrocarbon group are -0-, -CO-, -COO-, -C6H4-(phenylene), -NRa-, -S- or -S〇2- The substituted Xd may be exemplified by the formula (xd-Ι) to the formula (xd-ΙΟ).

(xd-4) (xd-5) (xd-6) (xd-7)

Xd is preferably an alkanediyl group having 1 to 6 carbon atoms, more preferably an ethyl group. The compound represented by the formula (d-Ο) may, for example, be a compound (d-Ι) to a compound (d-94) shown in the following table. In the table, the number indicated by Xd is the formula number of the above-exemplified base. Further, for example, the compound (d-1) is a compound represented by the following formula (d-Ι).

10 323613 201229670 [Table 1-1 ] Compound Rd xd 〇d-1 H c2h< d-2 F CzH4 ^Y%—xd—c4f9 d-3 Cl C2H4 Rd d-4 Br C2H4 d-5 I C2H4 d-6 Cf3 C2H4 d-7 CHa C2H4 d-8 CN C2H4 d-9 CeHs C2H4 d-10 CHz-CeHs C2H4 d-11 H Single bond d-12 F Single bond d-13 Cl Single bond d-14 Br Single bond d- 15 I single bond d-16 CFa single bond d-17 CHs single bond d-18 H (xd-Ι) d-19 Cl (xd-1) d-20 ch3 (xd-1) d-21 H (xd- 2) d-22 Cl (xd-2) d-23 CHs (xd-2) d-24 H (xd-3) d-25 Cl (xd-3) d-26 CHa (xd-3) d-27 H (xd-4) d-28 Cl (xd-4) d-29 CHa (xd-4) d-30 H (xd-5) d-31 Cl (xd-5) d-32 CH3 (xd-5 11 323613 〇d-33 H (xd-6) d-34 Cl (xd-6) V^o-xd-c4f9 d-35 ch3 (xd-6) Rd d-36 H (xd-7) d- 37 Cl (xd-7) d-38 CH3 (xd-7) d-39 H (xd-8) d-40 Cl (xd-8) d-41 CH3 (xd-8) d-42 H (xd- 9) d-43 Cl (xd-9) d-44 ch3 (xd-9) d-45 H (xd-10) d-46 Cl (xd-10) d-47 CH3 (xd-10) 201229670 [Table 1-2] [Table 2-1] Compound Rd xd o d-48 H C2H4 d-49 F CeH4 d-50 Cl CiH4 R d-51 Br C2H4 d-52 I C2H4 d- 53 CFi C2H4 d-54 CHa C2H4 d-55 CN C2H4 d-56 c crystal C2H4 d-57 CH2-C6H5 C2H4 d-58 H single button d-59 F single button d-60 Cl single button d-61 Br single button D-62 I single bond d-63 cf3 single bond 12 323613 201229670 [Table 2-2] ο II d-64 CHa single key Xd C6F13 d-65 H (xd-1) d-66 Cl (xd-1) R D-67 CHa (xd-1) d-68 H (xd-2) d-69 Cl (xd-2) d-70 CHs (xd-2) d-71 H Cxd-3) d-72 Cl (xd -3) d-73 CHa (xd-3) d-74 H (xd-4) d-75 Cl (xd-4) d-76 CHa (xd-4) d-77 H (xd-5) d- 78 Cl (xd-5) d-79 CHa (xd-5) d-80 H (xd-6) d-81 Cl (xd-6) d-82 CHa (xd-6) d-83 H (xd- 7) d-84 Cl (xd-7) d-85 CH3 (xd-7) d-86 H (xd-8) d-87 Cl (xd-8) d-88 CHs (xd-8) d-89 H (xd-9) d-90 Cl (xd-9) d-91 ch3 (xd-9) d-92 H (xd-10) d-93 Cl (xd-10) d-94 CHa (xd-10 13 323613 201229670 The fluorine-based liquid repellent (B) is preferably a resin containing a structural unit derived from the unsaturated compound (d) and a structural unit derived from the unsaturated compound (a) described later, and more preferably contains a source. Structural unit derived from unsaturated compound (d) The structural unit derived from the unsaturated compound (a) and the resin derived from the structural unit of the unsaturated compound (b) described later. The fluorine-based liquid repellent (B) contains a structural unit derived from the unsaturated compound (a), and is excellent in developability, so that it tends to suppress unevenness due to residue or development. The fluorine-based liquid repellent (B) contains a structural unit derived from the unsaturated compound (b), and has a tendency to be excellent in solvent property. Further, the fluorine-based liquid repellent (B) may contain a structural unit derived from the unsaturated compound (c) described later. When the I-based liquid repellent (B) is a copolymer of the unsaturated compound (a) and the unsaturated compound (d), the ratio derived from the structural unit of each monomer is relative to the fluorine-containing liquid-repellent (B) The total of the structural units is preferably in the following range. The structural unit derived from the unsaturated compound (a): 5 to 40% by weight (more preferably 10 to 30% by weight/〇). The structural unit derived from the unsaturated compound (d): 60 to 95% by weight (more) 70 to 90% by weight) The gas-based liquid repellent (B) is a copolymer of the unsaturated compound (a), the unsaturated compound (b) and the unsaturated compound (d), and is derived from the structure of each monomer. The ratio of the unit is preferably in the following range with respect to the total number of moles of the structural unit constituting the fluorine-based liquid repellent (B). Structural unit derived from unsaturated compound (a): 5 to 40% by weight (more preferably 10 to 30% by weight) Structural unit derived from unsaturated compound (b): 5 to 80% by weight (more 14 323613) 201229670 Excellent system 10 to 70% by weight) Structural unit derived from unsaturated compound (d): 10 to 80% by weight, (more preferably 20 to 70% by weight/〇) IL-based liquid repellent (B) is not When the copolymer of the compound (a), the unsaturated compound (b), the unsaturated compound (c), and the unsaturated compound (d) is a copolymer, the ratio of the structural unit derived from each monomer is relative to the fluorine-containing liquid The total number of moles of the structural unit of the agent (B) is preferably in the following range. The structural unit derived from the unsaturated compound (a): 5 to 40% by weight (more preferably 10 to 30% by weight/〇) The structural unit derived from the unsaturated compound (b): 5 to 80% by weight (more 10 to 70% by weight of the structural unit derived from the unsaturated compound (c): 10 to 50% by weight (more preferably 20 to 40% by weight/〇) derived from the structural unit of the unsaturated compound (d) 10 to 80% by weight (more preferably 20 to 70% by weight) When the ratio of each structural unit is in the above range, the liquid repellency and the development property tend to be excellent. The weight average molecular weight of the fluorine-based liquid repellent (B) converted to polystyrene is preferably from 3,000 to 20,000, more preferably from 5,000 to 15,000. When the weight average molecular weight of the fluorine-based liquid repellent (B) is in the above range, the coating property tends to be excellent, and it is difficult to cause a film thickness reduction in the exposed portion during development, and further, it is easy to remove the non-exposure portion by development. . The acid value of the fluorine-based liquid repellent (B) is 20 to 200 mgKOH/g, preferably 40 to 150 mgKOH/g. 15 323613 201229670 The content of the fluorine-based liquid repellent (B) in the photosensitive resin composition is preferably 〇·001 when the total weight of the alkali-soluble resin (A) and the crosslinking agent (C) is 1 part by weight. To 10 parts by weight, more preferably 0.1 to 5 parts by weight. When the content of the fluorine-based liquid repellent (B) is within the above range, the pattern formation property is excellent at the time of pattern formation, and the liquid-repellency of the obtained pattern (top surface) tends to be excellent. The unsaturated compound (a) is an unsaturated compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides. The unsaturated compound (a) may, for example, be an unsaturated monocarboxylic acid such as acrylic acid, methacrylic acid, crotonic acid, o-vinylbenzoic acid, m-vinylbenzoic acid or p-vinylbenzoic acid; maleic acid or fumaric acid; , citraconic acid, mesaconic acid, itaconic acid, 3_vinyl phthalic acid, 4-vinyl decanoic acid, 3,4,5,6-tetrahydrofurfuric acid, tetrahydrofurfuric acid, diterpene An unsaturated dicarboxylic acid such as tetrahydrofurfuric acid, hydrazine or 4_cyclohexene dicarboxylic acid; mercapto-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2. 2·1] Hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy- 5-ethylbicyclo[2.2.1]hept-2-, 5-methoxy-6-methylbicyclo[2.21]hept-2-ene, 5-carboxyl-6-ethylbicyclo[2. 2 1] a bicyclic unsaturated compound having a carboxyl group such as hept-2-ene; maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3, 4, 5, 6 _ tetrahydrophthalic anhydride, hydrazine, 2, 3, 6_tetrahydrophthalic anhydride, dimethyl tetrahydrofuran anhydride, 5, 6-dicarboxybicyclo [2. 2. "Ging ^ yoghurt yx (nadic anhydride) (Himic anhydride)) Unsaturated bis-acid anhydride; bis-poic acid mono [2-(methyl) propylene methoxyethyl] ester, citric acid mono 16 323613 201229670 [2-(indenyl) propylene oxiranyl ethyl ester] The above unsaturated poly((indenyl) propylene oxyalkyl] ester of a polyvalent carboxylic acid; for example, it is such that (hydroxy hydroxy) acrylate contains a thiol group and a thiol group in the same molecule. Among them, acrylic acid, methacrylic acid, maleic anhydride, etc. are preferably used from the viewpoint of copolymerization reactivity or solubility. In the present specification, "(曱基)" "Binge Gman" means at least one selected from the group consisting of acrylic acid and methacrylic acid. The expressions "(meth)acrylonitrile" and "(mercapto) oleic acid vinegar" also have the same meaning. Unsaturated & (b) is a group of cyclic ethers having 2 to 4 carbon atoms (for example, an ethylene epoxide ring, a propylene propylene ring, and a tetrahydro sulphide ring). The at least one kind of unsaturated compound is preferably a monomer having a ring of carbon = 2 = 4 and a ethylenically unsaturated double bond, more preferably, an ether having a slave atom number of 2 to 4 and The sulfhydryl group (6) may be a compound (10) having a Weim early body (hereinafter referred to as "unsaturated compound (=================================================================== (10)"), which has a w-based group = unsaturation, sometimes referred to as "unsaturated compound (M)") (b3) (The following unsaturated compound (bl) may, for example, have a structurally unsaturated compound (bidkn 1 is cyclized (bl-Ι)"), and when the cyclic olefin is subjected to p, it is called "uninterrupted compound (9), and the following may be called "not enough; no, and the compound is unsaturated." ) _ Oxygen followed by ("methyl) (10) 323613 17 201229670 Structure and fat composition preservation stability: different monomers, photosensitive tree base rσ (8) '1) For example, (? base) propylene glycidol, ethyl acetophenate point - methyl glycidyl vinegar, (meth) benzoic acid benzoquinone ^, glycidyl red olefin, o-vinyl - B Check the soil "Gan" from the base, between the ''Ethyl-based methyl glycidol fine, the opposite If / base age glycerin fine, " base-(four) county benzylic oil base (four), am vinyl armor Glycidyl fine, heart methyl ethenyl benzyl glycidyl ether, 2,3 bis (glycidyloxymethyl) styrene, 2, 4 - bis (glycidyloxy oxime) Styrene, 2' 5-bis(glycidyloxyfluorenyl) stupid ethylene, 2,6-bis(glycidyloxymethyl)styrene, 2, 3, 4-glycol (glycidol) Methoxymethyl) stupid ethylene, 2, 3, 5-glycol (glycidyloxyindenyl) styrene, 2, 3,6-glycol (glycidyloxyfluorenyl) styrene, 3, 4 5 - ginseng (glycidyloxyindenyl) styrene, 2, 4, 6-glycol (glycidyloxyindenyl) styrene, and the compound described in JP-A-H07-248625. The saturated compound (M-2) can be, for example, a vinyl group. Hexene monooxide ' 1,2-epoxy-4-vinylcyclohexene (for example, Celloxide 2000; !^1 (manufactured by Chemical Industry Co., Ltd.), 3,4-epoxycyclohexyl acrylate) Methyl ester (for example, Cyclomer A400; manufactured by Daicel Chemical Industry Co., Ltd.), decyl-acrylic acid 3, 4-epoxycyclohexyl methyl vinegar (for example, Cyclomer M100; Daicei Chemical Industry Co., Ltd.), a compound represented by the formula (II), etc. 323613 18 201229670 ^Χχΐτχ (I) (Π) 鸯 In the formula (I) and the formula (II), R1 and r2 each independently represent a hydrogen atom Or a group having 1 to 4 carbon atoms, which may be substituted by a radical. X1 and X2 independently represent a single bond, _R3_, *_R3_〇_, *_r3~S_, and wood-R3-NH-, respectively. R3 represents an alkanediyl group having 1 to 6 carbon atoms. * indicates a bond with 0. The alkyl group having 1 to 4 carbon atoms represented by R1 and R2 may, for example, be a methyl group, an ethyl group, a n-propyl group, an isopropyl group, an n-butyl group, a second butyl group or a third butyl group. The alkyl group having a carbon number of 丨 to 4 substituted by a hydroxy group may, for example, be a hydroxymethyl group, a 1-transethyl group, a 2-ethylideneethyl group, a fluorenylpropyl group, a 2-propylidenepropyl group or a 3-hydroxy group. Propyl, hydroxy-hydrazine-methylethyl, 2-hydroxy-indole-methylethyl, 1-butylidene, 2-butylbutyl, 3-hydrylbutyl, 4-butylbutyl Wait. R and R2 are preferably, for example, a hydrogen atom, a methyl group, a hydroxymethyl group or a hydroxyethyl group: 2-hydroxyethyl group, and more preferably, for example, a hydrogen atom or a methyl group. r may not be burned - the base 'e.g., methylene, ethyl, propyl m diyl, propane - 1,3-diyl, butane 夂 4 - diyl, pentane], 5 - diyl, It has been burned-1,6-diyl and the like. X and X2 are preferably, for example, a single bond, a methylene group, or an ethylidene H 0 group*CH2CH2 0- group, and more preferably, for example, a single bond hCH2_〇_ 323613 19 201229670, wherein * represents The bond represented by the formula (I) may, for example, be a compound represented by the formula (M) to the formula (115). Preferably, for example, the formula (1-1), the formula Π-3), the formula (1-5), the formula (1-7), the formula (1-9), and the formula (b (1) to the formula (1-15)) More preferably, for example, the formula (Bu 1), the formula (1-7), the formula (1-9), and the formula (1-15). 〇/ 〇ο h2c=ch-co Η2〇=ΟΗ—C— O-CH2

HjC: o H2〇=CHi-ci^-0—C2H4— ch3〇 ^^α-7) CH3〇 H2C=C—C—(

Η2〇=ΟΗ—C—0 —〇2^4' o II · -C—0-O2H4—N

H2c η ,=C—C—Ο—CH:,

H2C CH30 CHaO H2C —C —G' α-9) —〇2Η4

(Ml) :-〇-C2H4-S 0-6)

(M2) (1-13) C2H4QH0

(1-14) The compound represented by the formula (π) may, for example, be a compound represented by the formula (ΙΙ_υ to the formula (11-15), etc., preferably, for example, the formula (11_1;), the formula (ΙΙ- 3), Formula (ΙΙ-5), Formula (ΙΙ-7), Formula (IBu 9), Formula (1)_η) to Formula (11-15). More preferably, for example, the formula (Π-1), the formula (1丨_7), the formula (π_9), and the formula (11-15) 〇 323613 20 201229670

The compound represented by the formula (I) and the compound represented by the formula (II) can be used singly. Further, these may be used in combination at any ratio. When a compound represented by the formula (I) and a compound represented by the formula (II) are mixed, the molar ratio of the formula (I): formula (II) is preferably 5: 95 to 95: 5, More preferably 10:90 to 90:10, especially 20:80 to 80:20. The unsaturated compound (b2) is preferably a monomer having an oxypropylene group and a (meth) propylene methoxy group. The unsaturated compound (b2) may, for example, be 3-methyl-3-(methyl)propanyloxymethyl propylene propylene, 3__ethyl _3_(methyl) propyl oxymethyl ring Oxypropanone, 3-methyl+(indenyl)acryloxyethyl propylene oxide, 3-ethyl-3-(meth)acryloxyethyl propylene oxide, and the like. The unsaturated compound (10) is preferably a monomer having a tetrahydrofuranyl group and a (decyl) methoxy group 323613 21 201229670 decyloxy group. The unsaturated compound (b3) may, for example, be tetrahydrofuranyl acrylate (for example, Biscoat V #150, manufactured by Osaka Organic Chemical Industry Co., Ltd.) or tetrahydrofuranyl methacrylate. Examples of the unsaturated compound (c) include (fluorenyl) acrylates, N-substituted maleimide, unsaturated serotonic acid diesters, alicyclic unsaturated compounds, styrenes, and the like. Ethylene compound, etc. Examples of the (meth) acrylate include methyl ketone (meth) acrylate, ethyl acenoate (mercapto) acrylate, n-butyl (meth) acrylate, and butyl (decyl) acrylate. Alkyl esters such as esters and tert-butyl (meth)acrylate; (fluorenyl)cyclohexyl acrylate, 2-mercaptocyclohexyl (meth) acrylate, tricyclo(decyl) acrylate [5· 2. 1. 02'6] decane-8-yl ester (in the technical field, the customary name is dicyclopentanyl (meth)acrylate, (mercapto) Cycloalkyl esters such as dicyclopentyloxyethyl acrylate and isobornyl (mercapto) acrylate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (decyl) acrylate a hydroxyalkyl ester such as an ester; an aryl group or an aralkyl ester such as phenyl (meth)acrylate or benzyl (meth)acrylate; and an unsaturated dicarboxylic acid diester such as maleic acid Ethyl ester, diethyl fumarate, diethyl itaconate, etc. N-substituted maleimide may, for example, be N-phenylmaleimide, N-cyclohexylmaleimide, N -benzene Kima yimide, yttrium imino-3-maleimide acetoate, N-succinimide-4-mala 323613 22 201229670 Aminobutyrate, N- Amber quinone imine-6-maleimide caproate, N-amber succinimide-3-maleimide propionate, N-(9-acridinyl)maleimide And the alicyclic unsaturated compound may, for example, be bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[ 2.2. 1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxyindenylbicyclo[2·2.1]hept-2-ene, 5-(2'- Hydroxyethyl)bicyclo[2. 2-1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]g 2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxyindenyl)bicyclo[2. 2·1]hept-2-ene, 5, 6 -bis(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dioxaoxybicyclo[2.2.1]hept-2-ene, 5,6- Diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-mercaptobicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[ 2·2. 1]hept-2-ene, 5-hydroxymethyl-5-fluorenylbicyclo[2 · 2. 1]hept-2-ene, 5-t-butoxycarbonylbicyclo[2·2.1]hept-2-diene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]heptane- 2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(t-butoxycarbonyl)bicyclo[2·2.1]hept-2-ene a bicyclic unsaturated compound such as 5,6-bis(cyclohexyloxycarbonyl)bicyclo[2·2·1]hept-2-ene. Examples of the styrene include styrene, α-methylstyrene, m-methylstyrene, p-nonylstyrene, vinyl anthracene, p-nonyloxystyrene, and the like. Other vinyl compounds include, for example, (meth)acrylonitrile, ethylene ethylene, partial milk, (meth)acrylamide, acetic acid, 1,3-butadiene, isoprene, 2, 3-dimercapto-1,3-butadiene, and the like. From the viewpoint of copolymerization reactivity and alkali solubility, the unsaturated compound 323613 23 201229670 (c) is preferably, for example, styrene, N-stupyl maleimide, N-cyclohexylmaleimide, N-benzoinyl maleimine, bicyclo [2.2. 1] hept-2-ene, and the like. <Alkali-soluble resin (A)> The photosensitive resin composition of the present invention contains an alkali-soluble resin (A). The alkali-soluble resin (A) may be one having good compatibility with other components as long as it has good coating properties. The content of the alkali-soluble resin (A) when the total amount of the alkali-soluble resin (A) and the crosslinking agent (the hydrazine and the acid generator (D) in the photosensitive resin composition of the present invention is 1% by weight is preferably 60 to 98% by weight. When the content of the alkali-soluble resin (A) is in the above range, the development of the photosensitive resin composition, the adhesion of the obtained pattern, the solvent resistance, and the mechanical properties tend to be good. It is necessary to form a photosensitive resin composition on a structure of an organic EL device, for example, a transparent electrode ([o.g. tin-doped indium oxide), IZO (doped indium oxide: IZ), a transparent electrode). Since the photosensitive resin composition has good adhesion, even if an alkali-soluble resin is used, a pattern structure is formed, and a portion other than the pattern structure is, for example, a peripheral portion of the opening portion of the pattern structure. When the ink containing the organic EL material is applied to the opening of the pattern structure by an inkjet method or the like, the resin residual ink remaining on the peripheral edge portion of the opening portion is detached. "DeWetting" light The thickness of the micro-light-emitting layer or the like is uneven. For example, the film thickness of the light-emitting layer is thinner at the peripheral portion than the central portion of the open σ portion. Therefore, the electric power station and the central portion of the peripheral portion of the light-emitting layer are 323613 24 201229670 When the voltage is applied to the light-emitting layer, the current concentrates in the central portion of the peripheral portion. The center portion is darker than the peripheral portion. Thus, if the film thickness is uneven, it is considered to be caused by the film thickness difference. In particular, when "dewetting" is apparent, a light-emitting layer or the like is not formed on the peripheral portion of the opening, and when an electrode is formed directly on the light-emitting layer, a current leakage current is generated between the pair of electrodes. In order to solve the above problems, the present inventors have found that the alkali-soluble resin (A) is preferably a vinyl phenol resin (hereinafter sometimes referred to as " Polyvinyl phenol") or a novolac resin. In particular, it has been found that a pattern structure and a substrate which can ensure pattern formation of a photosensitive resin composition are obtained by using a polyvinyl phenol and a novolak resin in combination. The adhesion of (or the electrode) is substantially free of residue (the residue is not easily left) except for the pattern structure, and the heat resistance temperature is remarkably improved. The polyvinyl phenol may, for example, be a homopolymer of vinyl phenol, a vinyl phenol and a copolymer of a monomer copolymerizable with the like, etc. The polyvinyl phenol can be obtained by using 4-vinylphenol, 3-vinylphenol, 2-vinylphenol, 2-mercapto-4-vinylphenol, A vinyl phenol such as 2,6-dimercapto-4-vinylphenol may be used alone or in combination of two or more kinds thereof, and azobisisobutyronitrile or benzoquinone-based peroxide-specific polymerization initiator may be used for radical polymerization. The related vinyl phenols and polyvinyl phenols are described in detail in the "Phenol Phenol Foundation and Application," (published by the Education Publishing Center) of the Maruzen Petrochemical Research Institute. It can be copolymerized with vinyl phenol. The monomer may, for example, be isopropenylphenol, acrylic acid, methacrylic acid, stupid ethylene, maleic anhydride, maleic acid 25 323613 201229670 imine, ethyl acetate or the like. In the case of 4 笙 笙 t t t, etc., it is preferably a single polymer of vinyl phenol, particularly a single polymer of p-vinyl phenol. The weight average molecular weight of the freshly-dispersed polystyrene measured by the polyethylene-based average molecular (IV) H gel permeation chromatography (GPC) (five), generally from 3,000 to 20,000, preferably from 4,000 to 15 Torr, more preferably 5 〇. 〇〇 to 10000. If the weight average molecular weight of Juyi County is too low, even if the cross-linking reaction of the exposed area is caused, the molecular weight will not increase sufficiently, so it is easy to dissolve in the test liquid, X, and the improvement of the difficulty is reduced. It is difficult to obtain a good photoresist pattern because the weight average molecular weight of the alkenyl group is too large, and the difference in solubility between the exposed area and the unexposed ship hiding liquid becomes small. The varnish resin can also be used in a wide range of applications in the field of photoresist. The heterogeneous lipid system can be obtained, for example, by reacting _ with _fines in the presence of an acid catalyst such as oxalic acid. The hope class can be exemplified by, for example, categorical, phthalic acid, methicone, p-toluine, 2,3-dimethylphenol, 2,5-dimethylphenol, 3,4-dimethylphenol, 3,5 Dimethylphenol, 2"4-dinonylphenol, 2,6-didecylphenol, 2,3,5-tridecylphenol, 2,3,6-trimethylidene, 2-third Kipan, 3_Terti-butyl, di-butyl, 2'-methyl-benzene: phenol, 4-methyl resorcinol, 5-mercaptoresorcin, 4-third Base, 2_methoxy, 3-methoxy, 2-propyl, 3-propyl, 4-propyl, 2-isopropyl, 2-methoxy_5_曱基纷, third butyl + methyl expectant, thyme thyroid (thymQl), different thyme. These may be used alone or in combination of two or more. Examples of the aldehydes include formaldehyde, formalin, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropene 323613 26 201229670 aldehyde, /9-phenylpropane Aldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o-chlorobenzaldehyde, m-gas aldehyde, p-chlorobenzoaldehyde, o-methylbenzofural, m-Methylphenylfurfural, p-methylphenylfurfural, p-ethylphenylhydrazine, p-n-butylbenzoic acid, p- and the like. The ketones may, for example, be propylene, methyl ethyl ketone, diethyl ketone or diphenyl ketone. These may be used alone or in combination of two or more. Among the above, from the viewpoint of the sensitivity controllability of the photoresist, it is particularly preferable to use a combination of a sputum and a formazan to make a phenol novolak resin which is condensed with a plate, a fumarin or a polymethyl group. The feed weight ratio of m-cresol to p-cresol (m-cresol: p-nonylphenol) is generally 80: 20 to 20: 8 〇, and Yibei is 7 〇 30 to 50: 50. Further, it is also preferred to use 3,5-dinonylphenol (i.e., 3 5 -dioxanol). At this time, the weight ratio of cresols (the total amount of m-cresol and p-cresol) to the feed ratio of dimethyl phenol (preferably: 3,5_2?) is generally 5〇: '5〇 to Do not: 20, preferably 60 · 40 to 70: 30. The average molecular weight of the brittle varnish resin is the weight average molecular weight (Mw) converted to monodisperse polystyrene by GPC, generally from 1 〇〇〇 to 10,000, preferably from 2 〇〇〇 to 7 〇〇〇, more And it is 2500 to 6000. If the weight average molecular weight of the novolak resin is too low, even if the crosslinking reaction of the exposed portion is caused, the molecular weight increase effect = 1 is easily dissolved in the alkali developing solution. @If the average weight of the secret material m is too high, the difference in the solubility of the exposure liquid to the exposure liquid becomes small, so it is difficult to obtain a good = photoresist pattern. The weight of the polyethylene surface and the secret lyophile can be controlled within the desired range by adjusting the synthesis conditions.乂^ If the resin obtained by the synthesis is pulverized by (1), the solid-liquid extraction method is carried out with the solvent of 323613 27 201229670, and (2) the sap of the tree obtained by the synthesis is dissolved in a good solvent. The weight average molecular weight can be controlled by weakly spraying or dropping a weak solvent to perform solid-liquid or liquid-to-liquid extraction. The measurement of the weight average molecular weight to which GPC is applied is carried out using Gpc measuring apparatus using a Gpc measuring apparatus under the following conditions. The column: T 〇 〇 〇 TS TS TS TS TS TS TS TS TS TS TS TS TS TS TS TS TS 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 〇. The ratio of use of imi polyvinyl alcohol to novolac resin is the weight ratio of polyethylene to varnish resin, generally 3〇: 7〇 to 95: 5, preferably 35: 65 to 95: 5, more preferably 40: 60 to 90: 10 range. The higher the ratio of the polyethylene is desired, the better the heat resistance of the photoresist pattern is, but it is easily peeled off from the substrate. If the ratio of the novolak resin becomes large, the problem that the resist pattern is peeled off from the substrate can be solved, but the heat resistance is lowered. Therefore, the ratio of the heat resistance to the peeling resistance is improved by the ratio of the two in the above range. <Acid generator (D)> The acid generator (D) is a compound which generates an acid by active light and generates an acid by heat. The compound which generates an acid by the active light is exposed by the actinic radiation. 'As long as it is a substance which produces Bronsted acid or Lewis acid 28 323613 201229670, it is not particularly limited, and rust salt and halogenated can be used. Organic compound, quinonediazide compound, α,α'-bis(sulfonyl)diazononane compound, α-carbonyl-α sulfonyldiazomethane compound, sulfone compound, organic acid ester compound, organic A known compound such as an acid amide compound or an organic acid quinone compound. Among these, aromatic sulfonate, aromatic iodonium salt, aromatic rust salt, aromatic compound having a halogenated alkyl residue, and the like are preferable. The acid generator (D) is preferably selected from the viewpoint of the spectral sensitivity in accordance with the wavelength of the light source for exposing the pattern. Examples of the rust salt include diazonium salt such as diazonium rust salt, ammonium salt, diphenyl iodine rust trifluorosulfonate, sulfur rust such as triphenyl sulfonium trifluorosulfonate, scale salt, and arsenic rust salt. Oxygen rust salts, etc. Examples of the halogenated organic compound include a halogen-containing oxadiazole-based compound, a three-till-based compound containing a halogen, a halogen-containing acetophenone-based compound, a halogen-containing benzophenone-based compound, and a halogen-containing sulfoxide-based compound. a compound containing a substance, a halogen-containing sputum, a halogen-containing scorpion, a halogen-containing squat, a halogen-containing 2-0 pyrone compound, and other halogen-containing compounds. A heterocyclic compound, a halogen-containing aliphatic hydrocarbon compound, a halogen-containing aromatic hydrocarbon compound, a halogenated sulfur-based compound, or the like. Specific examples of the halogenated organic compound include, for example, tris(2,3-dibromopropyl)phosphate, tris(2,3-dibromo-3-chloropropyl)phosphate, tetrabromochlorobutane, 2-[ 2-(3,4-Dimethoxyphenyl)vinyl]-4,6-bis(trichlorothyl)-S-three wells, hexachlorobenzene, hexabromobenzene, hexabromocyclodene, Hexabromocyclododecene, hexabromobiphenyl, allyltribromophenyl ether, tetrachlorobisphenol A, tetrabromobisphenol A, 29 323613 201229670 tetrachlorobisphenol A double (gas ethyl) Ether, bis(bromoethyl)ether of tetrabromobisphenol A, bis(2,3-di-propyl)ether of bisphenol A, bis(2,3-dibromopropyl)ether of bisphenol A, Tetrachlorobisphenol A bis(2,3-di-propyl)ether, tetrabromobisphenol octahydrate bis(2,3-dibromopropyl)ether, tetrachlorobisphenol s, tetrabromobisphenol 3. Four-gas bisphenol bis (chloroethyl) ether, tetrabromobisphenol s bis (bromoethyl) ether, bisphenol s bis (2, 3-dipropyl) ether, bisphenol s Bis(2,3-dibromopropyl)ether, tris(2,3-dibromopropyl)trimeric isocyanate, 2,2-bis(4-hydroxy-3,5-dibromophenyl)propane, 2,2-bis(4-(2-hydroxyethoxy)-3, 5-di Halogen-based flame retardant such as bromophenyl)propane; di-diphenyltrichloroethane, pentachlorophenol, 2,H diphenyl, 4-nitrophenyl ether, 2, 4-diphenyl, 3, _ 曱 一 一 4, _ Shi Xiaoji phenyl shout, 2, 4-dichlorophenoxyacetic acid, 4, 5, 6, 7-four gas 酜 internal brewing (4'5'6'7-tetrachlorop hthalide ), 1,1-bis(4-phenylphenyl)ethanol, 1,1-bis(4-phenylphenyl)-2, 2,2-trisethanol, 2, 4, 4,, 5-tetrachloro An organic chlorine-based pesticide such as diphenyl sulfide or 2, 4, 4, or 5-tetrachlorodiphenyl sulfone. Specific examples of the quinonediazide compound include, for example, anthracene, 2-benzoquinonediazide 4sulfonate, 1,2-naphthoquinonediazide-4-sulfonate, and 1,2-naphthoquinone Sulfonic acid ester of diazide derivative of nitrogen-5-sulfonate, 2, naphthoquinonediazide-4-sulfonate, 2, 1-benzoquinonediazide-5-acid ;丨,2-benzoquinone_2_diazide-4-sulfonate, anthracene, 2-naphthoquinone-2-diazide-4-sulfuric gas, 1,2-naphthoquinone-2-diplex Nitro- 5-sulfonium chloride, 1,2-naphthoquinone-1-diazide-6-sulfonate, 1,2-stupid-1-diazide~5_sulfonate, etc. Derivatives such as sulfonium gas. Specific examples of the α,α bis(sulfonyl)diazononane compound may, for example, be an unsubstituted, symmetric or asymmetric substituted alkyl group, alkenyl group, 30 323613 201229670 aromatic group, or heterocyclic ring. The olefinic group such as an alkyl group, an alkenyl group or a hydrazine group substituted with an A-generation symmetry or an asymmetry, or a continuation basis weight of a heterocyclic group, and a specific example of the compound may, for example, be a sulfone compound, a disulfone compound, or the like which is substituted or symmetrical with a substituted alkyl group, a aryl group, an aryl group, an aromatic group or a hetero group. Specific examples of the oxime organic acid ester include, for example, a carboxylic acid ester. Examples of the sulfonate, phosphonium, and the like, and the organic acid guanamine may, for example, be carboxyguanamine, sulfonamide or phosphoniumamine, and the oxime iodide may, for example, be carboxyimine, sulfonimide or phosphorus. Further, the acid generator (D) may, for example, be a cyclohexylmethyl group (2-side sulfonium hexyl) sulphide trifluorosulfonate or a dicyclohexyl group (a 2-oxo ring already). 11 thiopurine trifluorosulfonate, 2-oxocyclohexyl (2-norbornyl) trifluoromethanesulfonate, 2-cyclohexylsulfonylcyclohexanone, Methyl (2~ side dicyclohexyl) sulfonium trifluoromethanesulfonate, triphenylsulfonate trifluoromethane @ &amp; salt, diphenyl moth argon triflate, N- a succinimide = &amp; methane sulfonate, p-toluene benzene sulfonate, etc. The acid generator (D) relative to the alkali-soluble resin (A) 1 〇〇 by weight, _ generally with 0.1 It is used in a ratio of 10 parts by weight, preferably 0.3 to 8 parts by weight, more preferably 5 to 5 parts by weight. The ratio of the S-man generator (D) is too small, and has a resist pattern. The shape is deteriorated. _ &lt;crosslinking agent (C)&gt; 31 323613 201229670 Crosslinking agent (c) crosslinks the alkali-soluble resin in the presence of an acid generated by irradiation (exposure) of active light a compound (acidic substance). Such a crosslinking agent may, for example, be an alkoxymethylated urea resin, an alkoxymethylated melamine resin, an alkoxylated uronic acid resin, an alkoxy group. A well-known acid crosslinkable compound such as a glycolic urea resin or an alkoxymethylated amine resin. Other examples include alkyl etherified melamine resin and benzoguanamine resin. Alkyl etherified benzoguanamine resin, urea resin, alkyl etherified urea tree ruthenium, amine Sa Sa Sa 曱 树脂 resin, soluble 朌 e (e) type 酴曱 树脂 resin, alkyl Ether-soluble novolac type phenol formaldehyde resin, epoxy resin, etc. Among these, 'alkoxymethylated amine-based resin is preferable, and specific examples thereof include an oxiranyl amide-based amine resin and an ethoxy group. a methylated amino group-based resin, a n-propoxy-fluorenylated amine-based resin, a n-butoxymethylated amine-based resin, etc. Among these, 'in view of good resolution, particularly hexamethoxy A methoxymethylated amine-based resin such as melamine, and a commercially available product of an alkoxy-nonylated amino-based resin, for example, PL-1170, PL-1174, UFR65, CYMEL 300, CYMEL 303 (above 'Mitsui Cytec Corporation System), Βχ_4〇〇〇, NikaUc MW 30, MX 290 (above 'Sanwa Chemical Co., Ltd.), etc. These parent-linking agents can be used individually or in combination of 2 or more types. The crosslinking agent (C) is used in an amount of from 0.5 to 60 parts by weight, preferably from 1 to 50 parts by weight, more preferably from 2 to 40 parts by weight, based on 100 parts by weight of the alkali-soluble resin (A). . If the amount of the crosslinking agent used is too small, the crosslinking reaction is difficult to sufficiently proceed. 'The residual film ratio of the photoresist pattern after development using the alkali developing solution is lowered'. The swelling of the photoresist pattern or the meandering or the like is liable to occur. If the crosslinking agent is used too much, there is a decrease in resolution. 32 323613 201229670 * The photosensitive resin composition of the present invention may contain a solvent (E). The solvent which can be used in the present invention is, for example, an ester solvent (a solvent containing -coo-), an ether solvent other than the ester solvent (a solvent containing _〇_), an ether v ester solvent (containing _C00-and- The ketone solvent (solvent containing -C0-) other than the solvent, the alcohol solvent, the aromatic hydrocarbon solvent, the guanamine solvent, the dimethyl sulfoxide, and the like are selected and used. Examples of the ester solvent include decyl lactate, ethyl lactate, butyl lactic acid, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetonate, amyl formate, isoamyl acetate, and propionic acid. Butyl ester, isopropyl butyrate, ethyl butyrate, butyl butyrate, decyl pyruvate, ethyl pyruvate, propyl pyruvate, decyl acetate, ethyl acetate, cyclohexanol Acid ester, ^ - butyrolactone and the like. Examples of the ether solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, and diethylene glycol. Monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3- Methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl Ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl hydrazine, large citron, phenylethyl, methyl macroinic acid, and the like. The ether ester solvent may, for example, be methyl methoxyacetate, ethyl decyloxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate or methyl 3-methoxypropionate. , 3-methoxypropionic acid ethyl acetate, 3-ethoxylate, 3-ethoxypropionic acid ethyl acetate, 2-methoxypropionic acid brewing, 2_$oxypropyl 323613 33 201229670 ethyl acetate, Propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-nonoxy-2-methylpropanoate, 2-ethoxylate _2_ethyl propyl propionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether Acid ester, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol Monobutyl ether acetate and the like. The ketone solvent may, for example, be 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptan, 4-heptanone, 4-mercapto-2-pentyl Ketone, cyclopentanone, cyclohexanone, isophorone, and the like. The alcohol solvent may, for example, be methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol or glycerin. Examples of the aromatic hydrocarbon solvent include benzene, toluene, xylene, and trimethylbenzene. The guanamine solvent may, for example, be N,N-dimethylformamide, N,N-dimethylacetamide or N-methyl pirone. These can be used in combination of two or more types. Among the above-mentioned solvents, from the viewpoint of coatability and dryness, it is preferred to use an organic solvent having a wavelength of 12 Gt: 1 or more at iatir. Among them, it is preferably propanol monomethyl, propylene glycol monomethyl acetate, 3-ethoxypropionate, monoethylene glycol methyl ethyl ether, 3-methoxybutyl acetate, 3 _Methoxy 1 butanol and the like. If the solvent is used for this purpose, the coating can be suppressed, and the flatness of the coating film can be improved. The total amount of the components contained in the resin-containing composition of the solvent (8) in the photosensitive tree composition is preferably from 6 to 95% by weight. 323613 34 201229670 is more preferably from 70 to 90% by weight. In other words, the solid content of the photosensitive resin composition is preferably from 5 to 40% by weight, more preferably from 1 to 30% by weight. When the content of the solvent is within the above range, the flatness of the crucible formed by coating the photosensitive resin composition tends to be high. Here, the solid portion is a component from which a solvent is removed from the photosensitive resin composition. A compound that absorbs active light (hereinafter sometimes referred to as "light absorbing agent (H)") may be added to the photosensitive resin composition of the present invention as needed. If the photosensitive resin compound contains a compound that absorbs active light, when it is exposed, light is absorbed in the depth direction of the photoresist film, and the seal can be obtained from a tapered shape to an inverse cone shape or an external protrusion. (overhang) photoresist pattern. Further, the shape of the resist pattern is affected even by light reflection by exposure of the substrate or the ITO film formed on the substrate. Therefore, in order to prevent reflection of exposure light, it is necessary to have a light absorbing agent (Hh, in particular, a photosensitive resin composition using a combination of an acid generator (D) and a crosslinking agent (C), a cross-linking type chemical amplification photoresist, The acid generated by the irradiation of light diffuses in the photoresist film, and the cross-linking reaction is also caused in the region where the light is not irradiated, so that the shape of the resist pattern can be controlled by the presence of the light absorbing agent (U) absorbing the active light. The light absorbing agent (H) may be selected from a compound having an absorption region in a wavelength region in accordance with the wavelength of the exposure light source. However, when the light absorbing agent (H) is a compound having a low solubility in an alkali developing solution, the image is developed. After the light absorbing agent (H) is left on the substrate, it is preferred to use a compound such as a ketone or a ruthenium group to increase the solubility of the alkali imaging solution. For the purpose of the problem caused by such residue, it is preferable to select a higher absorbance of δ, and a sufficient amount of absorbance can be obtained in a small amount. The formed 323613 35 201229670 photoresist pattern is exposed in a post-exposure baking (PEB) or sputtering step. At high temperatures In some cases, the light absorbing agent (H) sublimes to contaminate the device, so the light absorbing agent (the compound which is low in sublimation property) is preferably a so-called azo dye. The azo dye can be exemplified. Such as azobenzene derivatives, azonaphthalene derivatives, azobenzene or azo naphthalene substituents of arylpyrrolidone, pyrazolone, pyrexolone, beta ratio β a heterocyclic aryl azo compound such as σm β, 嗟η, etc. These aryl azo compounds can be appropriately selected in length or substituent in order to set the absorption wavelength in a desired region. The type, etc. can be formed, for example, by substitution with an electron attracting group such as a sulfonic acid (metal salt) group, a sulfonate group, a sulfhydryl group, a carboxyl group, a nitrogen group, a (substituted) aryl group, or an alkyl group, or a sulfonyl group. An aryl azo compound having an absorption region set to a short wavelength. Further, an amine group which is substituted by an already substituted (substituted) alkyl group, a (substituted) aryl group or a polyoxyalkylene group, a hydroxyl group, and an oxygen-burning oxygen Substituting an electron supply group such as a group or an aryloxy group, or forming an absorption wavelength An aryl olefin compound in a long wavelength region, because the substituent has a group which lowers the solubility of the image forming liquid such as an amine group, and a base which improves the solubility to the alkali developing solution like a carboxyl group or a hydroxyl group, The sensitivity of the photosensitive resin composition of the present invention is practical, and it is preferred to appropriately select the type of the substituent of the aryl azo compound. The azo dye can be used in the range of 200 by selecting the structure of the compound or the type of the substituent. A broad-wavelength region of 500 nm absorbs various compounds of active light. The length of the conjugated system or the choice of substituents also conforms to compounds other than azo dyes, which mainly correspond to the wavelength range of 300 to 400 nm 36 323613 201229670 The compound may, for example, be a phenethyl street organism obtained by condensing (substituted) a compound of a benzophenone with a compound having an active methylene group. The substituent of the stupid system may, for example, be a transalkyl group, an alkoxy group or an atom-substituted pyridylamino group polyoxyalkylene group, (tetra), (tetra), an alkyl group, an alkoxy group, an alkylcarbonyl group. Or an arylcarbonyl group, etc. Examples of the compound having an active fluorenylene group include, for example, B., aryl acetate, α-cyano ketone, malonic acid ester, acetamidine acetate, etc., 3-dione Class, etc. ' Further, the light absorbing agent (Η) may also be a methine dye obtained by condensing an aryl group with a sialo ketone and an aryl acid, an aryl benzotriazole, and an amine and an aldehyde. a natural compound such as azo methine dye, curcumin or xanthone obtained from a condensate, etc. A quinonediazide sulfonate compound or a double azide compound having a dye of an aryl hydroxyl group For example, the solubility of the alkali developing solution may be changed simultaneously with the absorption of the exposure light, or the compound of the crosslinking reaction may be used to adjust the development characteristics. Further, the light absorbing agent (H) may be, for example, a cyanoethylene group. Styrene compound, 1-cyano-2-(4-dialkylaminophenyl) B, 对 (halogen substituted phenyl) Nitro)-dialkylaminobenzenes, 1-alkoxy-4-(4'-N,N-dialkylaminophenylazo)benzenes, dialkylamino compounds, 1,2- Dicyanoethylene, 9-cyano onion, 9-onion methylenemalononitrile, N-ethyl~3-leaf-s-s-mercaptopropane dinitrile, 2-(3,3-dicyano -2~ propylene)_3-methyl-1,3- sulphide, etc. The commercially available dye is used as a light absorbing agent (H), for example, oil yellow #101, oil yellow #103, Oil yellow #117, oil pink #312, oil green 323613 37 201229670 Color BG, oil blue BOS, oil blue #603, oil black BY, oil black This oil black T-505 (above Orient Chemical Industry Co., Ltd.) , leeches purple (CI 42555), sulfhydryl violet (CI 42535), rose red 45170 Β), malachite green (CI 42000), methylene blue (C. L 52 () ι ^, etc. The aforementioned 1-cyano-2 The -(4-dialkylaminophenyl) oxime is, for example, 1-carboxy-1-cyano-2-(4-di-n-hexylaminophenyl)ethylene, 1-cyano-2 -(4-Di-n-butylaminophenyl)ethylene, carboxy- to oxime-cyano- -2-(4-di-n-heptylaminophenyl)ethene, etc., having a fluorenyl group at the 1-position Cyano-2-(4-dialkylaminophenyl)vinyl. These are 1-cyano-2-(4-dialkylaminophenyl)ethene, oil yellow #101, oil yellow #103,油黄#107, etc., is particularly preferable from the viewpoint of excellent formation of an inverse tapered photoresist pattern profile. Further, the reverse tapered shape means a pattern structure in which a photosensitive resin composition pattern is formed. The cross-sectional shape of the object is a shape that changes widely as it leaves the substrate. When the cross-section forms a resist pattern of a reverse cone shape or an outer protrusion shape, the amount of the light absorbing agent (8) can be used depending on the film thickness or light of the resin composition. It is appropriate to use the type of the agent (H), etc., and it is difficult to penetrate the light when the film thickness is thick. Therefore, the amount of use can be relatively thin when used. The light absorbing agent (H) is used in an amount of from 1 to 8 parts by weight, based on the weight of the soluble resin, and is usually from 15 to 15 parts by weight, preferably from 5 to 1 part by weight. When the cross-section forms a smooth-shaped resist pattern, it is compared with the cut-off (four) anti-cone or outer-like photoresist pattern light absorber ((8) is used in comparison with the soluble resin (A). The weight I part is used in a ratio of not used (〇) to less than Q. i by weight. 323613 38 201229670 The photosensitive resin composition of the present invention may further contain a surfactant (F). For example, a polyfluorene-based surfactant, a fluorine-based surfactant, a surfactant, a polyoxo-based surfactant having a fluorine atom, etc. However, the % surfactant (F) is a fluorine-based liquid-repellent agent. (B) A compound having a different structure as a main component. The polyoxo-based surfactant may, for example, be a surfactant having a decane bond. For example, Toray Silicone DC3PA, Toray

SiliconeSH7 PA, Toray SiliconeDCll PA, Toray SiliconeSH21 PA, Toray Silicone SH28 PA, Toray Silicone SH29 PA, Toray Silicone SH30 PA, Polyether Modified Poly Oxygen SH 8400 (trade name: Toray Dow Corning), KP321 , KP322, KP323, KP324, KP326, KP340, KP341 (Shin-Etsu Chemical Industry Co., Ltd.), 3戸400, Ding 3卩40 Bu Ding 3卩410, 78卩4300, TSF4440, TSF4445, TSF-4446, TSF4452 , TSF4460 (Momentive

Performance Materials Japan contract company) and so on. The fluorine-based surfactant may, for example, be a surfactant having a fluorocarbon chain. For example, Fluorinert (registered trademark) FC430, Fluorinert FC431 (manufactured by Sumitomo 3M Co., Ltd.), Megaface (registered trademark) F142D, Megaface F171, Megaface F172, Megaface F173, Megaface F177, Megaface F183, Megaface R30 (made by DIC), Eftop (registered trademark) EF301, Ef top EF303, Ef top EF35, Ef top EF352 (Mitsubishi Materials electronic system) Surflon (registered trademark) S381, Surflon S382, Surf Ion SC101, Surf Ion SC105 (made by Asahi Glass Co., Ltd.), E5844 (Daikin Fine Chemical Research Institute (share) 39 323613 201229670), and the like. The polyoxo-based surfactant having a fluorine atom may, for example, be a surfactant having a oxacyclooxygen bond or a fluorocarbon chain, and examples thereof include Megaface (registered trademark) R08, Megaface BL20, Megaface F475, and Megaface F477. Megaface F443 (DIC system) and so on. For example, Megaface (registered trademark) F475 can be mentioned. 002重量百分比以上。 The amount of the surfactant (F) is more than 5% by weight of the total amount of the component of the photosensitive resin composition. 1% by weight or less, more preferably 0% by weight or more. By including the surfactant (F) in this range, the flatness of the coating film can be improved. The photosensitive resin composition of the present invention may be used in combination with various additives such as a filler, another polymer compound, an adhesion promoter, an antioxidant, an ultraviolet absorber, a photostabilizer, and a chain transfer agent. λ The photosensitive resin composition of the present invention does not substantially contain a coloring agent such as a pigment or a dye. 5重量%。 The content of the composition of the composition of the present invention is preferably less than 0.5% by weight. The photosensitive resin composition of the present invention is filled in a quartz cell having an optical path length of km, and the average penetration when the transmittance is measured using a spectrophotometer at a wavelength of 4 〇〇 to 7 〇〇 is measured. The rate is better than the above, more than 80%. When the photosensitive resin composition of the present invention is applied to a film, the flat film permeability of the coating film is preferably 90% or more and more preferably 95% or more. The average transmittance is determined by using a 201229670 spectrophotometer to determine the twist hardening under the conditions of a wavelength of 400 to 7 〇〇 nra (for example, after hardening at 100 to 25 (rc, 5 minutes to 3 hours). The average value of the coating film having a thickness of zm is obtained, whereby a coating film having excellent transparency in the visible light region can be provided. / % The photosensitive resin composition of the present invention is applied to a substrate (for example, glass) as described later. A substrate such as a metal, a plastic, or the like, which is formed with a color filter ', various insulating films, a conductive film, or a driving circuit, etc., may be formed as a coating film. The coating film is preferably dried and hardened. The obtained coating film is patterned into a desired shape and can be used as a pattern structure. Further, these coating films or pattern structures can be formed into a part of components such as a display device. First, the present invention will be used. The photosensitive resin composition is applied onto a substrate. The coating system may be a spin coater, a slit and a coater, a die coater, an inkjet machine, a roll coater, or a dip coater. Various cloth devices, etc. η 乂 then, should Drying or pre-baking to remove volatile components such as a solvent, thereby obtaining a smooth unhardened coating film. The film thickness of the coating film at the time of the stomach is not particularly limited, and can be appropriately adjusted depending on the materials and applications used. Further, for example, about 1 to 6/zm. Further, the obtained uncured coating film 'lighting light from the mask for forming the intended pattern' is generated, for example, from a mercury lamp, a light-emitting diode ultraviolet light, or the like. The shape of the cover is not particularly limited, and the shape or size may be selected according to the use of the pattern. In recent years, in the exposure machine, a light film that intercepts the wavelength region is used, and 323613 41 201229670 is used to take light of less than 350 nm. Light in the vicinity of 436 nm, in the vicinity of 408 nm, and in the vicinity of 365 nm is selectively taken out by using a band pass filter that takes out these wavelength domains, and the entire exposed surface is uniformly irradiated with a substantially parallel ray. If a reticle aligner* stepper is used In this case, the correct alignment of the mask and the substrate can be performed at this time. The target pattern shape can be obtained by dissolving a specific portion such as non-exposure 4 and developing the coating film after exposure to the developing solution. 』The method can be liquid cover method (puddle ^M1〇pment), meaning: Ϊ: etc.. In the development of the image, the substrate can also be used as an aqueous solution of the test compound. The organic compound and the organic compound are organic compounds. Specific examples of the non-testable compound include, for example, sodium hydroxide, dibasic hydrogen hydride, dihydrogen sodium hydride, hydrogen phosphate, and dihydrogen. Dihydrogenation, sodium sulphate, potassium oxalate, sodium carbonate, carbon _, sodium bicarbonate, potassium hydrogen citrate, sodium borate, potassium borate, ammonia, etc. The organic compound can be mentioned, for example. Tetramethylated 2-hydroxyhexyltrimethylammonium hydroxide, monomethyl 7 sulfonium oxide monoethylamine, diethylamine, triethylamine, monotridecylamine 'amine, ethanolamine, and the like. 01至10质量百分比的更优选为〇。 03 to 5质量%。 The concentration of the aqueous solution of the inorganic and organic test compound of the early dibasic amine, diisopropyl ^ and the like is preferably from 0.01 to 10% by mass. The imaging night may contain a surfactant. The agent may be any of a nonionic surfactant, an anionic surfactant, or a 1% ionic surfactant. 323613 42 201229670 Non-ionic surfactants include, for example, polyoxyethylene acetonide, polyoxyethylene aryl ethers, poly-t-butyl aryl aryl scales, other polyoxyethylene derivatives, oxyethylene/oxygen Two-stage copolymer, sorbitan fatty acid vinegar, polyoxyethylene sorbitol needle fatty acid ester, polyoxyethylene sorbitol fatty acid hydrazine, glycerin fatty acid vinegar, polyoxyethylene fatty acid hydrazine, polyoxyethylene amide Wait. The anionic surfactant may, for example, be a higher alcoholic sulphate of lauryl sulphate or oleyl sulphate, a sodium laurate or a lauryl sulphate, and a 12-carbon benzene. The aryl aryl acid salt of sodium sulphate or sodium dodecyl sulfonate. The cationic surfactant may, for example, be stearylamine hydrochloride or vaporized lauryl trisole? The amine of the money is the fourth grade salt. The concentration of the surfactant in the alkali developing solution is preferably in the range of 〇〇1 to ι〇% by weight, more preferably 至. 05 to 8% by weight, optimal 〇. i to 5% by weight 0 after development The pattern structure can be obtained by patterning with water. Further, post-baking can be carried out as needed. The post-bake is preferably carried out, for example, at a temperature ranging from (10) to 24 ° C for 10 to 180 minutes. When the uncured enamel is exposed, the reticle formed with the pattern is not used, and the film is irradiated with light and/or the development is omitted, whereby a film having no pattern can be obtained. In this way, the structure obtained from the photosensitive resin composition of the present invention has high _ property and liquid repellency, and there is no residue (or very little) in the formation portion of the pattern, so In the coating type process such as the inkjet method, it is used as a partition for use in the production of a color light-receiving sheet, a liquid crystal display element (10) electrode, a 323613 43 201229670 organic EL display element, and a circuit wiring board. In particular, the photosensitive resin composition of the present invention is suitably used as a partition wall for producing an organic EL element from the above characteristics. Referring to Fig. 3, a partition wall forming process for forming a partition wall provided in an organic EL element on a support substrate by using the above-mentioned photosensitive resin composition will be described. Further, the tapered shape of the partition wall shown in Fig. 3 is not necessarily required to be exemplified, and may be any structure as long as the organic rainbow layer is formed into a uniform and flat film thickness. First, the support substrate 1 on which the first electrode 2 is formed is prepared (Fig. 3A). Then, the photosensitive resin composition 11 is formed on the support substrate 1 by a coating process, and prebaking is carried out (Fig. 3B). Thereafter, the film-forming photosensitive resin composition is selectively irradiated with light through the mask 10 only at a portion where the partition walls are to be formed (Fig. 3C). Further, by performing development, post-baking is performed to form the partition walls 3 (Fig. 3D). Further, the partition wall 3 is not limited to a single structure, and may be formed by, for example, overlapping the partition walls 3a on the partition wall 3 shown in Fig. 3 (see Figs. 4A to 4D). The partition walls 3 and 3a which are overlapped with each other may be formed using the same photosensitive resin composition, or may be formed using a different photosensitive resin composition. Further, the tapered shape of the partition walls shown in Figs. 4A to 4D is not necessarily required to be exemplified, and may be any structure as long as the organic EL layer can form a coating film having a uniform and flat film thickness. Thus, the laminated walls can be formed into the same or different shapes. When the partition walls are formed as described above, for example, in the support substrate obtained in FIG. 3D, the photosensitive resin composition is further coated into a film, and 323613 44 201229670 is prebaked (Fig. 4B), exposure (No. 4C), development, post-baking, and forming a partition 3a (Fig. 4D). Then, the configuration of the organic EL element which can be used as the organic EL display device can be exemplified. ▲ <Configuration of Organic EL Element> The organic EL element has at least one light-emitting layer as an organic EL layer, but the organic EL layer may have, for example, a hole injection layer, a hole transport layer, an electron blocking layer, and a hole blocking layer. , electron transport layer and electron injection layer. An example of a layer configuration of a possible organic EL device will be described below. a) anode/light-emitting layer/cathode b) anode/hole injection layer/light-emitting layer/cathode c) anode/hole injection layer/light-emitting layer/electron injection layer/cathode d) anode/hole injection layer/light-emitting layer/ Electron transport layer / cathode e) Anode / hole injection layer / luminescent layer / electron transport layer / electron injection layer / cathode Ο anode / hole transport layer / luminescent layer / cathode g) anode / hole transport layer / luminescent layer / Electron injection layer / cathode h) Anode / hole transport layer / luminescent layer / electron transport layer / cathode i) Anode / hole transport layer / luminescent layer / electron transport layer / electron injection layer / cathode j) Anode / hole injection Layer/hole transport layer/light-emitting layer/cathode k) anode/hole injection layer/hole transport layer/light-emitting layer/electron injection layer/cathode l) anode/hole injection layer/hole transport layer/light-emitting layer/ Electron transport layer / yin 45 323613 201229670 pole m) anode / hole injection layer / hole transport layer / luminescent layer / electron transport layer / electron injection layer / cathode 曰 )) anode / luminescent layer / electron injection layer / cathode 〇) Anode / luminescent layer / electron transport layer / cathode Ρ) anode / luminescent layer / electron transport layer / electron injection layer / cathode (here, mark "/" system Xiezhu shows layers adjacent symbol "/" and the laminated hereinafter the same). Further, the first electrode that functions as an anode can be disposed close to the branch substrate with respect to the second electrode, and the electrode that is decorated with the cathode function can be disposed closer to the branch substrate with respect to the second electrode, <support substrate> For the support substrate, those which are chemically unchanged in the step of producing the organic EL element can be suitably used, and for example, glass, plastic, polymer film, and stone plate can be used, and laminates and the like can be used. <Anode> When the light emitted from the light-emitting layer is emitted to the organic EL element constituted by the outside through the anode, an electrode for exhibiting light transmittance can be used for the anode. As the electrode for exhibiting light transmittance, a film such as a metal oxide, a metal sulfide or a metal can be used, and a conductivity and a light transmittance can be suitably used. Indium oxide, zinc oxide, tin oxide, ITG, indium zinc oxide (Indium) can be used as the anode.

A thin film made of ITO or IZ0 fine tantalum may be suitably used for a film composed of Zinc Oxide (IZ0), gold, silver, copper, and the like. Examples of the method for producing the anode include a vacuum evaporation method, a _ method, an ion clock method, 323613 46 201229670, a beer plating method, and the like. Further, as the anode, an organic transparent conductive film such as polyaniline or a derivative thereof, polybenzazole or a derivative thereof can be used. <Cathode> The material of the positive electrode is preferably a material having a small work function. The electron is easily injected into the light-emitting layer and has a high conductivity. Further, in order to reflect the light emitted from the light-emitting layer toward the anode side by the cathode, the material of the cathode is preferably a material having a high reflectance to visible light. As the cathode, for example, a metal, a soil-checking metal, a transition metal, and a Group 13 metal of the periodic table can be used. The material of the cathode can use metals such as clock, sodium, potassium, strontium, barium, strontium, magnesium, calcium, strontium, strontium, sulphur, ruthenium, ruthenium, ruthenium, steel, brocade, m mirror; among the aforementioned metals Two or more kinds of alloys; one or more of the above metals and one or more of gold, silver, platinum, copper, lanthanum, titanium, cobalt, nickel, tungsten, and tin; or graphite or graphite intercalation compounds Wait. Examples of the σ gold include, for example, a magnesium-silver alloy, a magnesium-indium alloy, a magnesium-aluminum alloy, an indium alloy, a lithium-aluminum alloy, a lithium-magnesium alloy, a lithium-indium alloy, and a calcium-aluminum alloy. Further, a transparent conductive electrode composed of a conductive metal oxide, a conductive organic substance or the like can be used as the cathode. Specifically, the conductive metal oxide may, for example, be indium oxide, zinc oxide, tin oxide, ruthenium 0, or ruthenium. The conductivity may be, for example, polyaniline or a derivative thereof, polyseptene or a derivative thereof. The X cathode may be formed by laminating two or more laminates. An electron injecting layer can also be used as the cathode. The production method of the electrode is, for example, a vacuum training method, an ion ore method, or the like. JL Μ· : 4 The film thickness of the cathode is considered to be the property or the simplicity of the film forming step, etc., and the mosquito is, for example, -1 (^, preferably the heart to / 47 323613 201229670 and the most 50 nm Ji 5G 〇 nm Further, among the anode and the cathode, the electrode corresponding to the second electrode is formed such that the interface between the second electrode and the _EL layer and the top surface of the partition wall in the thickness direction of the substrate are formed so that The thickness of the film is increased. <The hole injection layer> The hole injection material constituting the hole injection layer may, for example, be vanadium oxide, oxygen vortex, cerium oxide and oxidized oxide, or a phenylamine compound or light-emitting ( Starbum) type amine compound, phthalocyanine type, amorphous carbon, polyaniline, polythiophene derivative, etc. The film formation method of the hole injection layer is, for example, a film formation from a solution containing a hole injection material or a bucket. For example, a solution containing a hole-injecting material can be applied to a film by a specific coating method, and further cured to form a hole injection layer. ^ The film thickness of the hole injection layer is determined. The simplicity of the features and steps = and appropriate settings, such as lnU 1_, should be 2 to 500n m, the most is 5 nm to 200 nm. <Porous transport layer> The hole transporting material constituting the hole transport layer may, for example, be a polyvinyl scent or a derivative thereof, a polydise or a derivative thereof, on the side a polyoxyalkylene derivative having a aryl aromatic amine, a pyrazoline derivative, an arylamine derivative, a stilbene derivative, a triphenyldiamine derivative 'polyaniline or a derivative thereof, a poly Thiophene or a derivative thereof, a polyarylamine or a derivative thereof, a polypyrrole or a derivative thereof, a poly(p-phenylene vinylene) or a derivative thereof, or a poly(2,5-thiophenylene group) 323613 48 201229670 « The thickness of the hole transport layer is determined by the characteristics of the film thickness and the ease of the film formation step, for example, 1 nm to 1 &quot; m, preferably 2 nm to 500 nm, Most preferably, it is from 5 nm to 200 nm. <Light Emitting Layer> % The light emitting layer is generally formed mainly by an organic substance that emits fluorescence and/or phosphorescence, or an organic substance and a dopant which is supplemented with the dopant. Adding efficiency, or changing the wavelength of the light, and adding the organic matter constituting the light-emitting layer When a light-emitting layer is formed by a coating process for a low molecular compound or a polymer compound, the light-emitting layer preferably contains a polymer compound, and the number average molecular weight of the south molecular compound constituting the light-emitting layer in terms of polystyrene is, for example, about 10 to 10. Examples of the light-emitting material constituting the light-emitting layer include the following pigment-based materials, metal-based complex materials, polymer-based materials, and dopant materials (pigment-based materials). Iamine:; =: equal two-degree sitting derivative, and round organism, diphenyl polymer, pyrazoline dimeric flower derivative, oligosaccharide derivative, body, 喧 ° 丫 生物, coumarin derivative Etc. (Metal complex material) Rare earth ί] ί 系 系 系 系 系 系 系 系 系 系 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 Heavy benzene is stupid. Sitting on yrin) zinc oxazole, thiadiazole, phenylpyridine, phenyl benzimidazole, quinoline structure complex, for example, silver complex, # complex, etc. State of the luminescent gold; I complex, _ base (tetra) ^ hydroxyquinolinium complex, benzoxazolinyl zinc complex, a σ zinc complex, azo hydrazine zinc And porphyrin (porph, phenanthroline 铕 complex, etc. (polymer material). The polymer material may, for example, be a polyparaphenylene vinylene derivative, a polyphene derivative, or a poly pair. a phenyl derivative, a poly(tetra) derivative, a polyblock derivative, a polyg derivative, a polyethylene sulphide, a pigment material or a metal complex luminescent material, and the like. The thickness of the layer is generally about 2 nm to 200 nm. <Electron transport layer> The electron transport material constituting the electron transport layer may be a known one, and may be, for example, a derivative of sputum, a scallion, or a derivative thereof, benzene. From Kunming or its bio-naphthalene or its derivatives, onion or its derivatives, tetracyano onion-decane or its derivatives , a ketone derivative, diphenyldicyanoethylene or a derivative thereof, a biphenyl hydrazine derivative, or a metal complex of 8-hydroxyquinoline or a derivative thereof, polyquinoline or a derivative thereof, poly a quinoxaline or a derivative thereof, a polydipeptide or a derivative thereof, etc. The film thickness of the electron transport layer is appropriately determined in consideration of the properties and the film formation step, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, most preferably 5 nm to 2 〇〇 nm 〇 <electron injection layer> 50 323613 201229670 · (3) The material constituting the electron injection layer is appropriately selected depending on the type of the light-emitting layer, for example, metal inspection , a test metal, an alloy containing one or more kinds of metals, an alkali metal or an alkaline earth metal, a sulphate, a dentate, a carbonate, and the like, and an alkali metal oxide. Examples of the tooth compound and the carbonate salt include, for example, lithium, a fine surface, a surface, an oxidizing clock, a gasification clock, a sodium oxide, a sodium fluoride, a potassium oxychloride potassium fluoride, a rice oxide, a vaporization, an oxidation gas, and a gas. The two groups of bismuth carbonate and strontium carbonate are alkaline earth metals and alkaline earth metals. Oxides, halides, carbonates: for example, town, lock, oxidized town, gasification town, oxyvalerate calcium, cerium oxide, lanthanum fluoride, cerium oxide, fluorinated into layers can be laminated 2 The laminate structure of the layer or more may be, for example, a film thickness of the electron injection layer of about Inm to lem. Each of the above organic &amp; layers may be by nozzle printing method, inkjet printing method, printing method, gravure printing. A coating type process such as a method, or a vacuum evaporation method, a machine plating method, a CVD method, or the like. Further, in the #布型制巾, the ink containing the organic material of the organic layer is coated to form a film, and further The solvent is evaporated and solidified to form an organic EL'. The solvent used for the ink used in this case can be, for example, a chlorine-based solvent such as gas-chlorosilane-chlorobenzene, or an ether solvent such as tetrahydroanthracene. Aromatic hydrocarbon-based solvent such as acetone, sulfhydryl ethyl ketone, etc. _ solvent: acetic acid acetonitrile, acetic acid butyl, acetic acid ethyl sirushiol and other brewing solvents and water. (Embodiment) 323613 51 201229670 Hereinafter, the present invention will be described in more detail by way of examples. In the example, "0/〇 and "injury" are not specifically described, and are % by weight and parts by weight. (Synthesis Example 1) In a four-neck bottle equipped with a reflux cooling tube, a nitrogen gas introduction tube, a thermometer, and a dropping device, 30 parts of mercaptoacrylic acid and 2% ethylidene methyl hydrazide were placed. 3 bruises, 40 parts of isopropanol methacrylate, 5.9 parts of 2-sulfoethanol, and 163 parts of didiol monomethyl bond acetate were heated to 耽== for 30 minutes. Further, 3 parts of azobisisobutyronitrile was added, and the mixture was polymerized with 2% isocyanate ethyl ester (Karenz: Showa Denko (4)), 29.3 parts, and placed at 50 ppm relative to the total composition. The wind 醌 early methyl ether, under the nitrogen flow in the anti-reaction:, get the solid content of 34% by weight of the polymer r, ~, the temple, the night of the soluble resin ^ (synthesis example 2) sentence knife (Mw) is 4900. The second thermometer and _ set (four) 78 parts, methacrylic acid two 3'3, 4 of which 4, 5,5,6,6,6-9 vinegar 19.5 parts, methacrylic acid glycidyl acrylate isobornyl hydrazine, propylene glycol single Methyl ether hexancil = 13 parts of vinegar, y- 266 parts of dodecane thiol, heated to 70 ° C, 〇 t clock. Further, the fraction of "oxygen diisobutyronitrile 1 part, polymerization conversion" was 33 44%, and the acid value was 68 mg_KGH/g (the weight average molecular weight of the solid portion was 7,500. The fluorine-based liquid repellent Ba had the following structure list 323613 52 201229670

(Synthesis Example 3) In a four-necked flask equipped with a reflux cooling tube, a nitrogen gas introduction tube, a thermometer, and a stirring device, chloroacrylic acid 3, 3, 4, 4, 5, 5, 6, 6, 7, 7, 8 was placed. 5份,8,8-tridecafluorooctyl ester 78 parts, methacrylic acid 19.5 parts, isobornyl methacrylate 19.5 parts, glycidyl methacrylate 13 parts, 12-carbon thiol 12. 7 parts 266 parts of propylene glycol monomethyl ether acetate, heated to 7 (TC, stirred under a nitrogen stream for 30 minutes. Add 1 part of azobisisobutyronitrile, polymerization for 18 hours, to obtain a solid content of 33% by weight, acid value A solution of a copolymer (fluorine-based liquid repellent Bb) of 65 mg-KOH/g (solid content conversion). The obtained resin Bb has a weight average molecular weight of 6,800. The fluorine-based liquid repellent Bb has the following structural unit.

-^ch2—A 4-ch2-&gt;=0 The weight average molecular weight (Mw) and the number average molecular weight (Μη) of the resins obtained in Synthesis Examples 1, 2, and 3 were determined by the GPC method as follows. Conditional implementation. Device: K 2479 (Shimadzu Corporation (stock) system)

Pipe string: SHIMADZU Shim-pack GPC-80M 53 323613 201229670

Column temperature: 40 ° C Solvent: THF (tetrahydrofuran) Flow rate: 1. Oml / min

Detector: RI The ratio (Mw/Mn) of the weight average molecular weight and the number average molecular weight converted into polystyrene obtained above was defined as a molecular weight distribution. (Synthesis Example 4) Dehydration condensation was obtained from a feed ratio of poly(p-vinylphenol) (weight average molecular weight 6000) of 90 parts by weight and a ratio of 70/30 (weight ratio) of m-p-/p---- The obtained phenolic acid varnish resin (weight average molecular weight: 4000) was 10 parts by weight of the soluble resin Aa. Further, it was obtained by dehydration condensation of 60 parts by weight of poly(p-vinylphenol) (weight average molecular weight 6000) and 70/3 Torr (weight ratio) of m-p-phenol/p-cresol with formaldehyde. The alkali-soluble resin Aa composed of 40 parts by weight of a varnish resin (weight average molecular weight: 4000). <Preparation of photosensitive resin> The negative photosensitive resin composition 1 described in Table 3 was obtained by mixing each component in the solvent Ea (propylene glycol monodecyl ether acetate) so that the solid content was 丨8.0%. 2, 3. 54 323613 201229670 [Table 3] Examples Examples Comparative Example Photosensitive Resin Composition 1 2 3 捡 Soluble Resin (A) Aa 96. 1 — — Aa, — 78. 8 Ab — A 63. 8 Fluoride-based liquid repellent (B) Ba — — 3. 4 Bb 0. 2 0. 2 A crosslinking agent (C) Ca 2.9 20. 2 — Cb — — 1.7 Acid generator (D) Da 1.0 1.0 An additive (H) Ha 5. 〇5. 0 one other component (G) Ga — — 7 Gb — — 2. 7 Gc — a 26.8 solid fraction (%) 18.0 18.0 18. 0 The numerical representation of the components in the examples in Table 3 When the solid content (A+C+D) in the photosensitive resin composition is 1 part by weight, the weight % (composition ratio) of each component. The numerical value of each component in the comparative example indicates the weight % (composition ratio) of each component when the solid content (A + B + C + G) in the photosensitive resin composition is 1 part by weight. The components used in the examples and comparative examples are as follows.

Ca · melamine resin crosslinker (manufactured by Mitsui Cytec, c me 1 303) yme

Cb. Dioxyamine-based resin cross-linking agent (manufactured by Mitsui Cytec Co., Ltd., Cyme 1 323613 55 201229670 300)

Ha: Light absorbing agent (dye) 〇rient Chemical Co., Ltd.: Oil yellow Ga: Tetrahydro uric anhydride (Rikacid TH: New Japan Physicochemical Co., Ltd.)

Gb : 2-hydroxy-lU~[4-(2-hydroxy-2-methylpropenyl)-benzyl]phenyl}-2-methylpropan-1-one (photopolymerization initiator irgacure) 127 ; BASF Japan (shareholding system)

Gc: pentaerythritol tetraacrylate (polymerizable compound α-ΤΜΜΤ; manufactured by Shin-Nakamura Chemical Co., Ltd.) <Permeability of composition> For the photosensitive resin composition obtained above, ultraviolet light-visible light is used Infrared spectrophotometer (V-650; manufactured by JASCO Corporation) (Shiyang trough, optical path length. 1 cm), and the average transmittance (%) in 400 to 70 Onra was measured. The results are shown in Table 4. [Table 4] Average transmittance (%) Photosensitive resin composition 1 91 Photosensitive resin composition 2 91 Photosensitive resin composition 3 93 <Production of coating film> A glass substrate of 2 inches square (Eagle XG; Corning company) Washed with neutral detergent, water and alcohol in order to 'dry. On the glass substrate, the photosensitive resin compositions 1, 2, and 3 obtained above were each spin-coated so that the film thickness after post-baking became 3. 〇vm, and the vacuum drying machine 56 323613 201229670 # (manufactured by Microtek Co., Ltd.) After drying under reduced pressure to a reduced pressure of 6 讥%, it was pre-baked at 80 ° C for 2 minutes on a hot plate and dried. After cooling, use an exposure machine (TME-15〇RSK; Topcon (source), light source: ultra-high pressure mercury lamp) to illuminate the exposure of 50mJ/cm2 (365nm reference) in the atmosphere. The irradiation of the photosensitive resin composition uses an ultrahigh pressure mercury lamp. After the light irradiation, the photosensitive resin compositions 1 and 2 were crosslinked by baking with a hot plate at Η ° C for 60 seconds. Thereafter, the coating film was immersed at 23 ° C in a water-based developing solution containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide, and shaken for 60 seconds to be brought into contact, and thereafter, in an oven. The film was heated at 230 ° C for 20 minutes (post-baking) to obtain a coating film. In the photosensitive resin composition 3, a coating film was obtained in the same manner as above except that the exposure amount was changed to 5 〇 0 mJ/cm 2 (the 365 nm standard) and the baking after the light irradiation was not performed. <Average Transmittance of Coating Film> The obtained coating film was measured for an average transmittance (%) of 400 to 700 nm using a microscopic spectrometry apparatus (0SP-SP200; manufactured by OLYMPUS Co., Ltd.). A high penetration rate means that the absorption becomes small. <Contact angle> With respect to the obtained coating film, the contact angle with anisole was measured using a contact angle meter (DGDFast/60; manufactured by GBX Corporation). The measurement results are shown in Table 5 〇57 323613 201229670 [Table 5] Contact angle (°) Coating film 33 of photosensitive resin composition 1 Coating film 30 of photosensitive resin composition 2 Coating film 28 of photosensitive resin composition 3 The higher the contact angle, the higher the liquid repellency. The higher the contact angle of the coating film, the higher the contact angle in the pattern formed using the same photosensitive resin composition. The partition wall is formed of a photosensitive resin composition having a high contact angle, and when ink is printed by an ink jet device surrounded by the partition wall, the ink is easily detached. Therefore, for example, if a color filter is produced by an ink jet method, it is difficult to produce a color mixture of inks between adjacent pixel regions. <Evaluation of heat resistance> The obtained coating film was heated at 240 ° C for 1 hour in a dust-free oven to measure the film thickness and the transmittance. From the film thickness before and after heating and the transmittance at 400 nm, the rate of change was determined according to the following formula. Film thickness change rate (%) = film thickness after heating (// m) / film thickness before heating (β m) xl00 rate of change of transmittance (%) = transmittance after heating (%) / before heating Transmittance (ο/〇) χ 100 If the heat resistance of the coating film is good, heat resistance is good even if a pattern formed of the same photosensitive resin composition is used. The results are shown in Table 6. 58 323613 201229670 [Table 6] Film thickness change rate (%) Transmissivity change rate Photosensitive resin composition 1 coating film 97 95 Photosensitive resin composition 2 coating film 97 95 Photosensitive resin composition 3 coating film 88 93 <Pattern formation> A 2 inch square glass substrate (Eagle XG; manufactured by Corning) was washed with a neutral detergent, water and alcohol, and dried. On the glass substrate, the photosensitive resin compositions 1 and 2 were spin-coated so that the film thickness after post-baking was 3.5 cm, and dried under reduced pressure in a vacuum dryer (manufactured by Microtek Co., Ltd.). After the degree of pressure reduction was 66 kPa, it was prebaked at 80 ° C for 2 minutes on a hot plate to be dried. After cooling, the distance between the substrate coated with the photosensitive resin compositions 1, 2, and 3 and the quartz glass mask was 10 &quot; m, using an exposure machine (TME-150RSK; Topcon), light source: super High-pressure mercury lamp), which emits light of an exposure amount of 50 mJ/cm 2 (365 nm reference) in an atmospheric environment. Further, the irradiation of the photosensitive resin composition at this time is carried out by passing the emitted light from the ultrahigh pressure mercury lamp through an optical filter film (UV-33; manufactured by Asahi Co., Ltd.). Further, as for the photomask, a pattern (a light-transmissive portion having a plurality of squares having an i-side of 13/zm and a square interval of 100/zm) (i.e., a light-transmitting portion) is formed on the same plane. After the light irradiation, the photosensitive resin composition was crosslinked by baking with a twisted plate at 1 HTC for 60 seconds. Thereafter, the film of the former 323613 59 201229670 was immersed in a water-in-water image solution containing 0.12% of a nonionic surfactant and potassium hydroxide 〇·_ at 25 ° C and shaken for 100 seconds to be imaged, after washing. In the oven, the pattern was obtained by baking at 235 C for 15 minutes. In the photosensitive resin composition 3, the exposure amount was changed to 5 〇〇mj/cm 2 (365 ηπι basis) and the baking was performed without performing light irradiation. The rest of the film was obtained in the same manner as described above. Determination of Residues Other than Patterns> In a region surrounded by the partition walls formed of the pattern structures formed as described above, pure water and large bacteria are filled with an inkjet device (Litrex 142Ρ manufactured by ULVAC). It was observed with a microscope whether or not repulsion occurred at the boundary portion between the partition wall and the region surrounded by the partition wall. The partition walls obtained from the photosensitive resin compositions 1 and 2 of the examples were not repelled, and the partition walls obtained from the photosensitive resin composition 3 of the comparative example were repelled. From the results of the examples, it is known that By using the negative photosensitive resin composition of the present invention, it is possible to form a pattern having no residue (very few) other than the coating film and the pattern portion having excellent heat resistance. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an organic EL element of a display device. Fig. 2A is a view for explaining a method of forming an organic EL layer. The figure is a diagram for explaining a method of forming an organic EL layer. The first graph is a diagram for explaining a method of forming an organic EL layer. Fig. 3A is a view for explaining a method of forming a partition wall. Fig. 3B is a view for explaining a method of forming the partition walls. Fig. 3C is a view for explaining a method of forming a partition wall. Fig. 3D is a view for explaining a method of forming a partition wall. 60 323613 201229670 Figure 4A is a diagram for explaining a method of forming a partition wall. Fig. 4B is a view for explaining a method of forming a partition wall. Fig. 4C is a view for explaining a method of forming a partition wall. Fig. 4D is a view for explaining a method of forming a partition wall. [Main component symbol description] 1 Support substrate 2 First electrode 3 Partition wall 3a Partition wall 4 Organic EL layer 5 Area surrounded by the partition wall 6 Ink 7 Second electrode 10 Mask 11 Photosensitive resin composition

Claims (1)

201229670 VII. Patent application scope: 1. A photosensitive resin composition containing an alkali-soluble resin (A), a fluorine-based liquid repellent (B), a crosslinking agent (C), and an acid generator (D). The photosensitive resin composition, the fluorine-based liquid repellent (B) is an addition polymer containing a structural unit derived from a fluorine-containing group having 4 to 6 carbon atoms, and a fluorine-based liquid. The addition ratio of the agent (B) is 0.01 to 1.% by weight based on the total solid damage in the composition. 2. The photosensitive resin composition according to claim 1, which further contains a solvent (E). 3. The photosensitive resin composition according to claim 1, wherein the alkali-soluble resin (A) contains a phenol resin. 4. The photosensitive resin composition according to claim 1, wherein the 'alkali-soluble resin (A) contains a novolac resin. 5. The photosensitive resin composition according to claim 1, wherein the fluorine-based liquid repellent (B) is selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides. An addition polymer of at least one structural unit. 6. The photosensitive resin composition according to claim 1, wherein the t' gas system liquid repellent (8) is a structural unit containing an unsaturated compound derived from a ring-shaped structure having 2 to 4 carbon atoms. Addition polymer. A pattern structure is formed by using the photosensitive resin composition as described in claim 1 of the patent application. 8. A display device comprising, for example, a straight fin. Figure 323613 1 201229670 Case structure. A partition wall for ink jet comprising the pattern structure as described in claim 7 of the patent application. 2 323613