TWI797078B - Curable composition, method for producing cured product, and cured product - Google Patents
Curable composition, method for producing cured product, and cured product Download PDFInfo
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- TWI797078B TWI797078B TW106110861A TW106110861A TWI797078B TW I797078 B TWI797078 B TW I797078B TW 106110861 A TW106110861 A TW 106110861A TW 106110861 A TW106110861 A TW 106110861A TW I797078 B TWI797078 B TW I797078B
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- 125000006000 trichloroethyl group Chemical group 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006305 unsaturated polyester Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
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Abstract
本發明係提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。 The present invention provides a curable composition having a high glass transition temperature and excellent adhesion, a method for producing the cured product, and the cured product.
本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)45~90質量份、陽離子聚合起始劑(B)0.001~15質量份、自由基聚合性成分(C)1~15質量份、自由基聚合起始劑(D)1~10質量份、由下述式(I)
(式中,X係碳原子數1~7之烷基等)表示之單體所得之聚合物、由下述式(II)
(式中,R1表示氫原子等,X’係碳原子數1~7之烷基等)表示之單體所得之聚合物等(E)1~20質量份,使(A)成分與(C)成分之合計成為100質量份,(A)成分係以多元醇之環氧丙基化物等(A1)及氧雜環丁烷化合物(A2)為必須成分,(C)成分係以具有環氧基及乙烯性不飽和基的化合物(C1)等為必須成分。 (In the formula, R 1 represents a hydrogen atom, etc., and X' is an alkyl group with 1 to 7 carbon atoms, etc.) The polymer obtained from the monomer represented by (E) 1 ~ 20 parts by mass, the (A) component and ( The total of the C) components is 100 parts by mass, the (A) component is based on polyhydric alcohol glycidyl compound (A1) and the oxetane compound (A2) as essential components, and the (C) component has a ring The compound (C1) of an oxy group and an ethylenically unsaturated group is an essential component.
Description
本發明係有關硬化性組成物、硬化物之製造方法及其硬化物,詳細為有關硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。 The present invention relates to a curable composition, a method for producing a cured product, and a cured product thereof, and specifically relates to a curable composition having a high glass transition temperature and excellent adhesion, a method for producing a cured product, and a cured product thereof.
硬化性組成物係使用於油墨、塗料、各種塗覆劑、接著劑、光學構件等的領域。關於這種硬化性組成物之改良,有各種的報告。 Curable compositions are used in the fields of inks, paints, various coating agents, adhesives, optical members, etc. Various reports have been made on the improvement of such curable compositions.
例如下述專利文獻1~3中提案含有陽離子聚合性成分及自由基聚合性成分之能量線硬化性組成物及其硬化物。具體而言,專利文獻1中,提案初期硬化性及接著性優異的偏光板用接著劑組成物。又,專利文獻2中,提案即使以透濕度低之樹脂薄膜作為保護膜時,光照射後,也能快速展現接著力,且對於各種力,經過一定時間後接著力為良好,耐久試驗後亦不會產生問題,耐濕熱試驗結束後之接著力亦良好之低黏度的光硬化性接著劑。此外,專利文獻3中,提案含有不飽和脂環式環氧酯化合物之可兼具高耐熱性或高折射率化與透明性的活性能量線聚 合性樹脂組成物。 For example, the following Patent Documents 1 to 3 propose energy ray-curable compositions containing cationically polymerizable components and radically polymerizable components, and cured products thereof. Specifically, Patent Document 1 proposes an adhesive composition for polarizing plates excellent in initial curability and adhesiveness. In addition, in Patent Document 2, it is proposed that even when a resin film with low moisture permeability is used as a protective film, after light irradiation, the adhesive force can be quickly exhibited, and for various forces, the adhesive force is good after a certain period of time, and the durability test is also good. It is a low viscosity photocurable adhesive that does not cause problems and has good adhesion after the heat and humidity resistance test. In addition, Patent Document 3 proposes an active energy ray polymer containing an unsaturated alicyclic epoxy ester compound that can achieve both high heat resistance or high refractive index and transparency. Synthetic resin composition.
專利文獻1:日本特開2014-105218號公報 Patent Document 1: Japanese Patent Laid-Open No. 2014-105218
專利文獻2:日本特開2015-040283號公報 Patent Document 2: Japanese Patent Laid-Open No. 2015-040283
專利文獻3:日本特開2015-168757號公報 Patent Document 3: Japanese Patent Laid-Open No. 2015-168757
但是,即使為專利文獻1~3所提案之硬化性組成物,對於硬化性及密著性,亦有不一定能夠滿足的情況,現狀為期望能夠高度兼具硬化性及密著性之新穎的硬化性組成物。 However, even the curable compositions proposed in Patent Documents 1 to 3 may not always be able to satisfy the curability and adhesiveness, and the present situation is to expect a novel composition capable of highly curable and adhesive properties. hardening composition.
因此,本發明之目的為提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法、及其硬化物。 Therefore, an object of the present invention is to provide a curable composition having a high glass transition temperature and excellent adhesion, a method for producing a cured product, and a cured product thereof.
本發明人等為了解決上述課題而精心探討的結果,發現若為具有特定組成之硬化性組成物時,即可克服上述課題,而完成本發明。 As a result of earnest research to solve the above-mentioned problems, the inventors of the present invention found that the above-mentioned problems can be overcome if the curable composition has a specific composition, and completed the present invention.
亦即,本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)45~90質量份、陽離子聚合起始劑
(B)0.001~15質量份、自由基聚合性成分(C)1~15質量份、自由基聚合起始劑(D)1~10質量份、選自由下述式(I)
(式中,X係碳原子數1~7之烷基、碳原子數1~7之烷氧基、碳原子數6~12之芳基、碳原子數6~12之芳氧基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代者)表示之單體所得的聚合物、
由下述式(II)
(式中,R1表示氫原子、甲基或鹵素原子,X’係碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代者)表示之單體所得之聚合物、選自由前述式(I)表示之單體之二種以上之單體所得之聚合物、選自由前述式(II)表示之單體之二種以上的單體所得之聚合物、及由前述式(I)表示之單體及前述式(II)表示之單體所得之聚合物所成組之重量平均分子量1,000~30,000的聚合物(E)1~20質量 份,使前述陽離子聚合性成分(A)與前述自由基聚合性成分(C)與前述聚合物(E)之合計成為100質量份, 前述陽離子聚合性成分(A)係以多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)及氧雜環丁烷化合物(A2)為必須成分, 前述自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20之多元醇之丙烯酸酯或碳原子數2~20之多元醇的甲基丙烯酸酯(C2)為必須成分。在此,重量平均分子量係指在四氫呋喃(THF)溶劑中,藉由GPC測量,以苯乙烯換算求得的重量平均分子量。 (In the formula, R1 represents a hydrogen atom, a methyl group or a halogen atom, and X' is an alkyl group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, or an alicyclic hydrocarbon group with 6 to 10 carbon atoms , or the hydrogen atoms in these groups are substituted by one or more groups selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group and carboxyl group) The polymer obtained from monomers, A polymer obtained from two or more monomers of the monomers represented by the aforementioned formula (I), a polymer obtained from two or more monomers selected from the monomers represented by the aforementioned formula (II), and a polymer obtained by the aforementioned formula ( The monomer represented by I) and the polymer obtained by the monomer represented by the aforementioned formula (II) have a weight average molecular weight of 1,000 to 30,000 polymer (E) 1 to 20 parts by mass, so that the aforementioned cationic polymerizable component (A ) and the total of the aforementioned radical polymerizable component (C) and the aforementioned polymer (E) become 100 parts by mass, and the aforementioned cationic polymerizable component (A) is made of polyhydric alcohol glycidyl compound or polyhydric alcohol alkylene oxide The glycidyl compound (A1) and the oxetane compound (A2) of the finished product are essential components, and the aforementioned free radical polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group (C1 ), or acrylates of polyols with 2 to 20 carbon atoms or methacrylates (C2) of polyols with 2 to 20 carbon atoms are essential components. Here, the weight average molecular weight refers to the weight average molecular weight obtained in terms of styrene by GPC measurement in a tetrahydrofuran (THF) solvent.
本發明之硬化性組成物中,前述陽離子聚合性成分(A)進一步含有芳香族環氧化合物(A3)為佳。又,本發明之硬化性組成物中,前述芳香族環氧化合物(A3)為多官能芳香族環氧化合物為佳。此外,本發明之硬化性組成物中,前述聚合物(E)為由前述式(I)表示之單體及前述式(II)表示之單體所得的聚合物,前述式(I)中之X為碳原子數6~12之芳基,前述式(II)中之X’為碳原子數1~7之烷基,前述烷基經環氧基所取代為佳。 In the curable composition of the present invention, it is preferable that the cationically polymerizable component (A) further contains an aromatic epoxy compound (A3). Moreover, in the curable composition of this invention, it is preferable that the said aromatic epoxy compound (A3) is a polyfunctional aromatic epoxy compound. In addition, in the curable composition of the present invention, the aforementioned polymer (E) is a polymer obtained from a monomer represented by the aforementioned formula (I) and a monomer represented by the aforementioned formula (II), and in the aforementioned formula (I), X is an aryl group with 6 to 12 carbon atoms, X' in the aforementioned formula (II) is an alkyl group with 1 to 7 carbon atoms, and the aforementioned alkyl group is preferably substituted by an epoxy group.
本發明之硬化物之製造方法,其係對本發明之硬化性組成物進行活性能量線照射,或進行加熱。 The method for producing a cured product of the present invention comprises irradiating active energy rays or heating the curable composition of the present invention.
本發明之硬化物,其係本發明之硬化性組成物的硬化物。 The cured product of the present invention is a cured product of the curable composition of the present invention.
依據本發明時,可提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。本發明之硬化性組成物,特別是可用於接著劑。 According to the present invention, it is possible to provide a curable composition having a high glass transition temperature and excellent adhesion, a method for producing a cured product, and a cured product thereof. The curable composition of the present invention can be used especially as an adhesive.
以下詳細說明本發明之硬化性組成物。 The curable composition of the present invention will be described in detail below.
本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)45~90質量份、陽離子聚合起始劑(B)0.001~15質量份、自由基聚合性成分(C)1~15質量份、自由基聚合起始劑(D)1~10質量份、選自由下述式(I)表示之單體所得的聚合物、由下述式(II)表示之單體所得之聚合物、選自由下述式(I)表示之單體之二種以上之單體所得之聚合物、選自由下述式(II)表示之單體之二種以上的單體所得之聚合物、及由下前述式(I)表示之單體及下述式(II)表示之單體所得之聚合物所成群之重量平均分子量1,000~30,000的聚合物(E)1~20質量份。本發明之硬化性組成物中,陽離子聚合性成分(A)係以多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)及氧雜環丁烷化合物(A2)為必須成分,自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20之多元醇之丙烯酸酯或碳原子數2~20之多元醇的甲基丙烯酸酯(C2)為必須成分。 The curable composition of the present invention contains: 45 to 90 parts by mass of a cationic polymerizable component (A), 0.001 to 15 parts by mass of a cationic polymerization initiator (B), 1 to 15 parts by mass of a radical polymerizable component (C) Parts by mass, 1 to 10 parts by mass of radical polymerization initiator (D), selected from polymers obtained from monomers represented by the following formula (I), polymers obtained from monomers represented by the following formula (II) , a polymer obtained from two or more monomers selected from monomers represented by the following formula (I), a polymer obtained from two or more monomers selected from monomers represented by the following formula (II), and 1 to 20 parts by mass of polymer (E) with a weight average molecular weight of 1,000 to 30,000 of the polymer obtained from the monomer represented by the following formula (I) and the monomer represented by the following formula (II). In the curable composition of the present invention, the cationic polymerizable component (A) is a glycidyl compound of a polyol or a glycidyl compound of a polyalcohol alkylene oxide adduct (A1) and oxetane The compound (A2) is an essential component, and the free radical polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylate or carbon atom of a polyhydric alcohol with 2 to 20 carbon atoms The methacrylate (C2) of the polyhydric alcohol of the number 2~20 is an essential component.
在此,式(I)中,X係碳原子數1~7之烷基、碳原子數1~7之烷氧基、碳原子數6~12之芳基、碳原子數6~12之芳氧基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代者。 Here, in formula (I), X is an alkyl group with 1 to 7 carbon atoms, an alkoxy group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, and an aromatic group with 6 to 12 carbon atoms. Oxygen group or alicyclic hydrocarbon group with 6 to 10 carbon atoms, or a group in which the hydrogen atoms in these groups are selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group and carboxyl group replaced by.
在此,式(II)中,R1表示氫原子、甲基或鹵素原子,X’係碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代者。 Here, in formula (II), R 1 represents a hydrogen atom, a methyl group or a halogen atom, and X' is an alkyl group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, or an aryl group with 6 to 10 carbon atoms The alicyclic hydrocarbon group, or the hydrogen atoms in these groups are substituted by one or more groups selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group and carboxyl group.
本發明之硬化性組成物的陽離子聚合性成分(A)係藉由以能量線照射或加熱活性化的陽離子聚合起始劑,產生高分子化或交聯反應的化合物。可列舉環氧化合物、氧雜環丁烷化合物、乙烯醚化合物等。 The cationic polymerizable component (A) of the curable composition of the present invention is a cationic polymerization initiator activated by energy ray irradiation or heating, and undergoes macromolecularization or crosslinking reaction. Examples thereof include epoxy compounds, oxetane compounds, vinyl ether compounds, and the like.
本發明之硬化性組成物的陽離子聚合性成分(A)係以多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)及氧雜環丁烷化合物(A2)作為必須成 分,但是也可使用其他的環氧化合物,例如芳香族環氧化合物(A3)及脂環式環氧化合物(A4)等。 The cationic polymerizable component (A) of the curable composition of the present invention is a glycidyl compound of a polyol or a glycidyl compound (A1) of an alkylene oxide adduct of a polyol and an oxetane compound (A2) as a must However, other epoxy compounds such as aromatic epoxy compounds (A3) and alicyclic epoxy compounds (A4) can also be used.
上述多元醇之環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉將多元醇或多元醇環氧烷加成物進行環氧丙基化者,且環氧丙基化物的分子量為250以上者為佳。 Glycidylated products of the above-mentioned polyols or glycidated products (A1) of polyol alkylene oxide adducts include those obtained by glycidylating polyhydric alcohols or polyol alkylene oxide adducts , and the molecular weight of the glycidyl compound is preferably 250 or more.
上述多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉1,4-丁二醇二環氧丙醚、1,6-己二醇二環氧丙醚、新戊二醇二環氧丙醚、丙三醇之三環氧丙醚、三羥甲基丙烷之三環氧丙醚、山梨醣醇之四環氧丙醚、二季戊四醇之六環氧丙醚、聚乙二醇之二環氧丙醚、聚丙二醇之二環氧丙醚、二環戊二烯二甲醇二環氧丙醚等之多元醇之環氧丙醚,及藉由將1種或2種以上之環氧烷與丙二醇、三羥甲基丙烷、丙三醇等之脂肪族多元醇進行加成所得之聚醚多元醇的聚環氧丙醚化物、脂肪族長鏈二元酸之二環氧丙酯。 Glycidylated products of the above-mentioned polyols or glycidated products (A1) of polyol alkylene oxide adducts include 1,4-butanediol diglycidyl ether, 1,6-hexanediol Diglycidyl Ether, Neopentyl Glycol Diglycidyl Ether, Triglycidyl Ether of Glycerol, Triglycidyl Ether of Trimethylolpropane, Tetraglycidyl Ether of Sorbitol, Dipentaerythritol Hexaglycidyl ether, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, glycidyl ether of polyols such as dicyclopentadiene dimethanol diglycidyl ether, and Polyglycidyl ether compounds of polyether polyols, aliphatic long Diglycidyl ester of chain dibasic acid.
多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1),進一步可列舉脂肪族高級醇之單環氧丙醚或高級脂肪酸之環氧丙酯、環氧化大豆油、環氧基硬脂酸辛酯、環氧基硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。 Glycidyl compounds of polyols or glycidyl compounds (A1) of polyol alkylene oxide adducts, further examples include monoglycidyl ethers of aliphatic higher alcohols or glycidyl esters of higher fatty acids, cyclic Oxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized soybean oil, epoxidized polybutadiene, etc.
多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)係含有飽和縮合環者,可提高硬化物之硬化性及密著性,故較佳。 The glycidyl compound of polyol or the glycidyl compound of polyol alkylene oxide adduct (A1) contains a saturated condensed ring, which can improve the curability and adhesiveness of the cured product, so it is preferable.
上述多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)可使用市售品,可列舉例如Denacol EX-121、Denacol EX-171、Denacol EX-192、Denacol EX-211、Denacol EX-212、Denacol EX-313、Denacol EX-314、Denacol EX-321、Denacol EX-411、Denacol EX-421、Denacol EX-512、Denacol EX-521、Denacol EX-611、Denacol EX-612、Denacol EX-614、Denacol EX-622、Denacol EX-810、Denacol EX-811、Denacol EX-850、Denacol EX-851、Denacol EX-821、Denacol EX-830、Denacol EX-832、Denacol EX-841、Denacol EX-861、Denacol EX-911、Denacol EX-941、Denacol EX-920、Denacol EX-931(nagase chemtex(股)公司製);EpoliteM-1230、Epolite40E、Epolite100E、Epolite200E、Epolite400E、Epolite70P、Epolite200P、Epolite400P、Epolite1500NP、Epolite1600、Epolite80MF、Epolite100MF(共榮社化學(股)公司製)、ADEKA GLYCIROLED-503、ADEKA GLYCIROLED-503G、ADEKA GLYCIROLED-506、ADEKA GLYCIROLED-523T、ADEKA ResinEP-4088S、ADEKA ResinEP-4080E((股)ADEKA公司製)等。 As the glycidyl compound of the above-mentioned polyhydric alcohol or the glycidyl compound (A1) of the polyol alkylene oxide adduct, a commercially available product can be used, for example, Denacol EX-121, Denacol EX-171, Denacol EX-192 , Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611 , Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832 , Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagase Chemtex Co., Ltd.); EpoliteM-1230, Epolite40E, Epolite100E, Epolite200E, Epolite400E, Epolite70P, Epolite200P, Epolite400P, Epolite1500NP, Epolite1600, Epolite80MF, Epolite100MF (manufactured by Kyoeisha Chemical Co., Ltd.), ADEKA GLYCIROLED-503, ADEKA GLYCIROLED-503G, ADEKA GLYKGLYCIROLED-506, 3CDEIRKAResA inEP- 4088S, ADEKA ResinEP-4080E (manufactured by ADEKA Corporation) and the like.
上述氧雜環丁烷化合物(A2)可列舉3,7-雙(3-氧環丁基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧環丁基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧環丁基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧環丁基甲氧基)甲基]丙烷、乙二醇雙 (3-乙基-3-氧環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧環丁基甲基)醚、1,4-雙(3-乙基-3-氧環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧環丁基甲氧基)己烷等之二官能脂肪族氧雜環丁烷化合物、3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、3-乙基-3-(氯甲基)氧雜環丁烷等之一官能氧雜環丁烷化合物等。其中,二官能脂肪族氧雜環丁烷化合物可提高密著性,故較佳。此等可1種單獨使用或組合2種以上使用。 The aforementioned oxetane compound (A2) includes 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,4-bis[(3-ethyl-3-oxocyclo Butylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxocyclobutylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxo Cyclobutylmethoxy)methyl]propane, ethylene glycol bis (3-Ethyl-3-oxocyclobutylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxocyclobutylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxocyclobutyl) Butyl methyl) ether, 1,4-bis(3-ethyl-3-oxocyclobutylmethoxy)butane, 1,6-bis(3-ethyl-3-oxocyclobutylmethoxy)hexane, etc. Difunctional aliphatic oxetane compound, 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl-3-(hexyloxymethyl)oxetane Butane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl)oxetane, 3-ethyl- 3-(Chloromethyl)oxetane, etc., a functional oxetane compound, etc. Among these, a difunctional aliphatic oxetane compound is preferable since it can improve adhesiveness. These can be used individually by 1 type or in combination of 2 or more types.
上述氧雜環丁烷化合物(A2)可使用市售品,可列舉例如2-羥基乙基乙烯醚、二乙二醇單乙烯醚、4-羥基丁基乙烯醚(丸善石油化學(股)公司製);ARON OXETANEOXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成(股)公司製)、ETERNACOLLOXBP、OXTP(宇部興產(股)公司製)等。 The above-mentioned oxetane compound (A2) can use commercial products, for example, 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, 4-hydroxybutyl vinyl ether (Maruzen Petrochemical Co., Ltd. ARON OXETANEOXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (Toagosei Co., Ltd.), ETERNACOLLOXBP, OXTP (Ube Industries Co., Ltd. system) etc.
上述芳香族環氧化合物(A3)係指含有芳香環的環氧化合物,而芳香族環氧化合物(A3)之具體例,可列舉酚、甲酚、丁酚等具有至少1個芳香族環的多元酚或其環氧烷加成物之單/聚環氧丙醚化物,可列舉例如雙酚A、雙酚F、或此等再加成有環氧烷之化合物之環氧丙醚化物或環氧基酚醛清漆樹脂;間苯二酚或氫醌、兒茶酚等之具有2個以上之酚性羥基的芳香族化合物之單/聚環氧丙醚化物;苯基二甲醇或苯基二乙醇、苯基二丁醇等之具有2個 以上之醇性羥基之芳香族化合物之環氧丙醚化物;鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等之具有2個以上之羧酸的多元酸芳香族化合物之環氧丙酯、苯甲酸之環氧丙酯、苯乙烯氧化物或二乙烯基苯之環氧化物等。 The above-mentioned aromatic epoxy compound (A3) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound (A3) include those having at least one aromatic ring such as phenol, cresol, and butylphenol. Mono/polyglycidyl ether compounds of polyphenols or their alkylene oxide adducts, such as bisphenol A, bisphenol F, or glycidyl ether compounds of these compounds added with alkylene oxide or Epoxy novolak resins; mono/polyglycidyl ether compounds of aromatic compounds having two or more phenolic hydroxyl groups such as resorcinol or hydroquinone or catechol; phenyldimethanol or phenyldimethanol Ethanol, phenyl butanol, etc. have 2 Glycidyl ether compounds of the above aromatic compounds with alcoholic hydroxyl groups; glycidyl esters of polyacid aromatic compounds having 2 or more carboxylic acids such as phthalic acid, terephthalic acid, trimellitic acid, etc. , Glycidyl benzoate, styrene oxide or divinylbenzene epoxide, etc.
上述芳香族環氧化合物(A3)可使用市售品,可列舉例如Denacol EX-146、Denacol EX-147、Denacol EX-201、Denacol EX-203、Denacol EX-711、Denacol EX-721、Oncoat EX-1020、Oncoat EX-1030、Oncoat EX-1040、Oncoat EX-1050、Oncoat EX-1051、Oncoat EX-1010、Oncoat EX-1011、Oncoat1012(nagase chemtex(股)公司製);OGSOLPG-100、OGSOLEG-200、OGSOLEG-210、OGSOLEG-250(大阪氣體化學(股)公司製);HP4032、HP4032D、HP4700(DIC(股)公司製);ESN-475V(新日鐵住金化學(股)公司製);EpikoteYX8800(三菱化學(股)公司製);Marproof G-0105SA、Marproof G-0130SP(日油(股)公司製);EPICLONN-665、EPICLONHP-7200(DIC(股)公司製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-7000L(日本化藥(股)公司製);ADEKA ResinEP-4000、ADEKA ResinEP-4005、ADEKA ResinEP-4100、ADEKA ResinEP-4901((股)ADEKA公司製);TECHMORE VG-3101L((股)Printec公司製)等。上述芳香族環氧化合物(A3)係多官能者,硬化性優異,故較佳。 Commercially available products can be used for the above-mentioned aromatic epoxy compound (A3), for example, Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX -1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat1012 (manufactured by Nagase Chemtex Co., Ltd.); OGSOLPG-100, OGSOLEG- 200, OGSOLEG-210, OGSOLEG-250 (Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700 (DIC Co., Ltd.); ESN-475V (Nippon Steel & Sumikin Chemical Co., Ltd.); EpikoteYX8800 (manufactured by Mitsubishi Chemical Corporation); Marproof G-0105SA, Marproof G-0130SP (manufactured by NOF Corporation); EPICLONN-665, EPICLONNHP-7200 (manufactured by DIC Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (manufactured by Nippon Kayaku Co., Ltd.); ADEKA ResinEP-4000 , ADEKA ResinEP-4005, ADEKA ResinEP-4100, ADEKA ResinEP-4901 (manufactured by ADEKA Corporation); TECHMORE VG-3101L (manufactured by Printec Corporation) and the like. The said aromatic epoxy compound (A3) is polyfunctional, and is excellent in curability, and is preferable.
上述脂環式環氧化合物(A4)係指環氧乙烷環 不經由鍵結基而直接鍵結於飽和環者。脂環式環氧化合物(A4)之具體例,可列舉藉由將具有至少1個脂環式環之多元醇的聚環氧丙醚化物或含有環己烯或環戊烯環之化合物以氧化劑進行環氧化所得的含有環己烯氧化物或環戊烯氧化物的化合物。可列舉例如3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯、6-甲基-3,4-環氧基環己基甲基-6-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-3-甲基環己基甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧基環己烷)、丙烷-2,2-二基-雙(3,4-環氧基環己烷)、2,2-雙(3,4-環氧基環己基)丙烷、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷羧酸酯)、環氧基六氫鄰苯二甲酸二辛酯、環氧基六氫鄰苯二甲酸二-2-乙基己酯、1-環氧基乙基-3,4-環氧基環己烷、1,2-環氧基-2-環氧基乙基環己烷、α-蒎烯氧化物、檸檬烯二氧化物等。脂環式環氧化合物(A4)從提高密著性的觀點,較佳為3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯或3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯。 Above-mentioned alicyclic epoxy compound (A4) refers to oxirane ring One that is directly bonded to a saturated ring without passing through a bonding group. Specific examples of the alicyclic epoxy compound (A4) include polyglycidyl ether compounds of polyhydric alcohols having at least one alicyclic ring or compounds containing cyclohexene or cyclopentene rings as oxidizing agents. A compound containing cyclohexene oxide or cyclopentene oxide obtained by epoxidation. Examples include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy Base-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexylcarboxylate, 3, 4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl -3,4-epoxy-5-methylcyclohexanecarboxylate, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methyl Cyclohexane carboxylate, methylenebis(3,4-epoxycyclohexane), propane-2,2-diyl-bis(3,4-epoxycyclohexane), 2, 2-bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, ethylidene bis(3,4-epoxycyclohexanecarboxylate), epoxyhexa Dioctylhydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2- Epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide, and the like. The alicyclic epoxy compound (A4) is preferably 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate or 3,4- Epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate.
上述脂環式環氧化合物(A4)可使用市售品,可列舉例如CELLOXID2021P、CELLOXID2081、CELLOXID2000、CELLOXID3000((股)DAICEL公司製) 等。 The said alicyclic epoxy compound (A4) can use a commercial item, For example, CELLOXID2021P, CELLOXID2081, CELLOXID2000, CELLOXID3000 (made by (stock) DAICEL company) wait.
上述乙烯醚化合物,可列舉例如二乙二醇單乙烯醚、三乙二醇二乙烯醚、n-十二烷基乙烯醚、環己基乙烯醚、2-乙基己基乙烯醚、2-氯乙基乙烯醚、乙基乙烯醚、異丁基乙烯醚、三乙二醇乙烯醚、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、1,6-環己烷二甲醇單乙烯醚、乙二醇二乙烯醚、1,4-丁二醇二乙烯醚、1,6-環己烷二甲醇二乙烯醚等。 The aforementioned vinyl ether compounds include, for example, diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, Ethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether , Ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether, etc.
上述陽離子聚合性成分(A)中,上述多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)、氧雜環丁烷化合物(A2)、芳香族環氧化合物(A3)、脂環式環氧化合物(A4)及乙烯醚化合物之使用比例係相對於陽離子聚合性成分(A)100質量份,多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)50~80質量份,氧雜環丁烷化合物(A2)20~50質量份,芳香族環氧化合物(A3)0~50質量份,脂環式環氧化合物(A4)0~30質量份,乙烯醚化合物0~20質量份時,可提高黏度、塗佈性、反應性及硬化性,故較佳。 Among the above-mentioned cationically polymerizable components (A), the above-mentioned glycidyl compound of the polyol or the glycidyl compound of the polyalcohol alkylene oxide adduct (A1), the oxetane compound (A2), the aromatic The usage ratio of epoxy compound (A3), alicyclic epoxy compound (A4) and vinyl ether compound is based on 100 parts by mass of cationic polymerizable component (A), glycidyl compound of polyol or polyol epoxy 50-80 parts by mass of glycidyl compound (A1) of alkane adduct, 20-50 parts by mass of oxetane compound (A2), 0-50 parts by mass of aromatic epoxy compound (A3), alicyclic When the epoxy compound (A4) is 0-30 parts by mass and the vinyl ether compound is 0-20 parts by mass, the viscosity, coating property, reactivity and hardening property can be improved, so it is preferable.
本發明之硬化性組成物的陽離子聚合起始劑(B)係指藉由能量線照射或加熱可釋放使陽離子聚合開始之物質的化合物時,皆可使用,較佳為藉由能量線照射釋放出路易斯酸之鎓鹽的複鹽或其衍生物。此化合物之代表性者,可列舉下述通式、[A]r+[B]r- The cationic polymerization initiator (B) of the curable composition of the present invention refers to a compound that can release a substance that initiates cationic polymerization by energy ray irradiation or heating, and can be used when it is released by energy ray irradiation. Double salts of onium salts of Lewis acids or their derivatives. Representatives of this compound include the following general formula, [A] r+ [B] r-
表示之陽離子與陰離子的鹽。 Represents the salt of cations and anions.
此處,陽離子[A]r+較佳為鎓類,其構造例如可以下述通式[(R2)aQ]r+ Here, the cation [A] r+ is preferably onium, and its structure can be, for example, the following general formula [(R 2 ) a Q] r+
表示。 express.
再者,此處,R2係碳原子數為1~60,也可含有幾個碳原子以外之原子的有機基。a為1~5之整數。a個之R2可各自獨立為相同或相異。又,至少1個為具有芳香環之如上述的有機基為佳。Q為選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成群之原子或原子團。又,陽離子[A]r+中之Q的原子價為q時,r=a-q之關係(惟,N=N視為原子價0)必須成立。 Furthermore, here, R 2 is an organic group having 1 to 60 carbon atoms and may contain atoms other than several carbon atoms. a is an integer from 1 to 5. a R 2 can be independently the same or different. Moreover, it is preferable that at least one is the above-mentioned organic group which has an aromatic ring. Q is an atom or an atom group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N=N. Also, when the atomic valence of Q in the cation [A] r+ is q, the relationship of r=aq (but N=N is regarded as atomic valence 0) must be established.
又,陰離子[B]r-較佳為鹵化物錯合物,其構造例如可以下述通式[LYb]r- Also, the anion [B] r- is preferably a halide complex, and its structure can be, for example, the following general formula [LY b ] r-
表示。 express.
此外,在此,L為鹵化物錯合物之中心原子的金屬或半金屬(Metalloid),其係B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y為鹵素原子。b為3~7之整數。又,陰離子[B]r-中之L的原子價當作p時,r=b-p之關係必須成立。 In addition, here, L is the metal or semimetal (Metalloid) of the central atom of the halide complex, which is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co, etc. Y is a halogen atom. b is an integer from 3 to 7. Also, when the atomic valence of L in the anion [B] r- is taken as p, the relationship of r=bp must be established.
上述通式之陰離子[LYb]r-的具體例,可列舉肆(五氟苯基)硼酸根、四(3,5-二氟-4-甲氧基苯基)硼酸 根、四氟硼酸根(BF4)-、六氟磷酸根(PF6)-、六氟銻酸根(SbF6)-、六氟砷酸根(AsF6)-、六氯銻酸根(SbCl6)-等。 Specific examples of the anion [LY b ] r- of the above general formula include tetrakis (pentafluorophenyl) borate, tetrakis (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroboric acid (BF 4 ) - , hexafluorophosphate (PF 6 ) - , hexafluoroantimonate (SbF 6 ) - , hexafluoroarsenate (AsF 6 ) - , hexachloroantimonate (SbCl 6 ) - and so on.
又,陰離子[B]r-亦可使用下述通式[LYb-1(OH)]r- Also, the anion [B] r- can also use the following general formula [LY b-1 (OH)] r-
表示之構造者。L、Y、b係與上述相同。又,其他可使用之陰離子,可列舉過氯酸離子(ClO4)-、三氟甲基亞硫酸離子(CF3SO3)-、氟磺酸離子(FSO3)-、甲苯磺酸陰離子、三硝基苯磺酸陰離子、樟腦磺酸根、九氟丁烷磺酸根、十六氟辛烷磺酸根、四芳基硼酸根、肆(五氟苯基)硼酸根等。 The constructor of the representation. The L, Y, and b systems are the same as above. In addition, other usable anions include perchlorate ion (ClO 4 ) - , trifluoromethylsulfite ion (CF 3 SO 3 ) - , fluorosulfonate ion (FSO 3 ) - , toluenesulfonate anion, Trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate, tetrakis(pentafluorophenyl)borate, etc.
本發明之硬化性組成物中,如此鎓鹽之中,以使用下述(甲)~(丙)之芳香族鎓鹽特別有效。可由此等之中以1種單獨使用或混合2種以上使用。 In the curable composition of the present invention, among such onium salts, it is particularly effective to use the following aromatic onium salts (A) to (C). Among these, 1 type can be used individually or 2 or more types can be mixed and used.
(甲)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等之芳基重氮鎓鹽 (A) Aryldiazonium salts of phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate, etc.
(乙)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-tert-丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪肆(五氟苯基)硼酸鹽等之二芳基錪鹽 (B) Diphenyliodonium hexafluoroantimonate, bis(4-methylphenyl)iodonium hexafluorophosphate, bis(4-tert-butylphenyl)iodonium hexafluorophosphate, tolyl cumene Diaryliodonium salts such as yliodonium(pentafluorophenyl)borate
(丙)下述群I或群II表示之鋶陽離子與六氟銻離子、六氟磷酸根離子、肆(五氟苯基)硼酸根離子等之鋶鹽 (C) Percilium salts of the following group I or II borate cations and hexafluoroantimony ions, hexafluorophosphate ions, tetrakis(pentafluorophenyl)borate ions, etc.
又,其他較佳者可列舉(η5-2,4-環戊二烯-1-基)[(1,2,3,4,5,6-η)-(1-甲基乙基)苯〕-鐵-六氟磷酸鹽等之鐵-芳烴錯合物、或參(乙醯丙酮)鋁、參(乙醯乙酸乙酯)鋁、參(水楊醛)鋁等之鋁錯合物與三苯基矽烷醇等之矽烷醇類的混合物;噻吩鎓鹽、四氫噻吩鐵鹽(thiolanium)、苄基銨、吡啶鎓鹽、鉼鹽(hydrazinium)等之鹽;二乙烯三胺、三乙烯三胺、四乙烯五胺等之聚烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛爾酮二胺等之脂環式多胺類;m-苯二甲胺、二胺基二苯基甲烷、二胺基二苯基碸等之芳香族多胺類;藉由一般方法使上述 多胺類與苯基環氧丙醚、丁基環氧丙醚、雙酚A-二環氧丙醚、雙酚F-二環氧丙醚等之環氧丙醚類或羧酸之環氧丙酯類等的各種環氧樹脂反應所製造的聚環氧基加成改質物;藉由一般方法使上述有機多胺類與鄰苯二甲酸、間苯二甲酸、二聚酸等之羧酸類反應所製造的醯胺化改質物;藉由一般方法使上述多胺類與甲醛等之醛類及酚、甲酚、二甲酚、第三丁基酚、間苯二酚等之於核具有至少一個醛化反應性場所的酚類反應所製造的曼尼希(Mannich)化改質物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、二聚酸等之脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等之芳香族二羧酸類;環己烷二羧酸等之脂環式二羧酸類;偏苯三甲酸、均苯三甲酸(Trimesic Acid)、蓖麻油脂肪酸之三聚物等之三羧酸類;均苯四酸等之四羧酸類等)之酸酐;雙氰胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。 Also, other preferred ones include (η 5 -2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl) Iron-arene complexes of benzene]-iron-hexafluorophosphate, etc., or aluminum complexes of ginseng (acetylacetone) aluminum, ginseng (ethyl acetate) aluminum, ginseng (salicylaldehyde) aluminum, etc. Mixtures with silanols such as triphenylsilanol; salts of thiophenium salt, tetrahydrothiophene iron salt (thiolanium), benzyl ammonium, pyridinium salt, hydrazinium salt (hydrazinium) and other salts; diethylenetriamine, three Polyalkylpolyamines such as ethylenetriamine and tetraethylenepentamine; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophor Alicyclic polyamines such as ketone diamine; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane, diaminodiphenylmethane, etc.; making the above polyamines by general methods Glycidyl ethers such as phenylglycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether, etc., or glycidyl esters of carboxylic acids The polyepoxy addition modification produced by reacting various epoxy resins such as phthalates; the reaction of the above-mentioned organic polyamines with carboxylic acids such as phthalic acid, isophthalic acid, and dimer acid by a general method The manufactured amidation modified substance; the above-mentioned polyamines and aldehydes such as formaldehyde and phenols, cresols, xylenols, tertiary butylphenols, resorcinols, etc. have at least one core Mannich-modified substances produced by phenolic reactions in the reactive sites of hydroformylation; polycarboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid , azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylglutaric acid, 2-methyl Suberic acid, 3,8-dimethylsebacic acid, 3,7-dimethylsebacic acid, hydrogenated dimer acid, aliphatic dicarboxylic acids such as dimer acid; phthalic acid, terephthalic acid Aromatic dicarboxylic acids such as formic acid, isophthalic acid, and naphthalene dicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; trimellitic acid, trimesic acid, castor oil Tricarboxylic acids such as trimers of fatty acids; anhydrides of tetracarboxylic acids such as pyromellitic acid); dicyandiamide, imidazoles, carboxylates, sulfonates, amidoimides, etc.
此等之中,就實用面與提高光感度的觀點,使用芳香族錪鹽、芳香族鋶鹽、鐵-芳烴錯合物為佳;相對於陽離子聚合起始劑(B)100質量%,又更佳為含有至少0.1質量%以上之具有下述構造之芳香族鋶鹽。 Among these, from the viewpoint of practicality and improvement of photosensitivity, it is preferable to use aromatic iodonium salts, aromatic permeic acid salts, and iron-aromatic complexes; More preferably, it contains at least 0.1% by mass of an aromatic percited salt having the following structure.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19及R20各自獨立地表示氫原子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R21、R22、R23及R24各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基,R25表示氫原子、鹵素原子、碳原子數1~10之烷基或選自下述化學式(A)~(C)中的任一取代基,Anq-表示q價的陰離子,p表示使電荷為中性的係數。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 each independently represent a hydrogen atom, a halogen atom, a carbon number of 1~ An alkyl group of 10, an alkoxy group with 1 to 10 carbon atoms, or an ester group with 2 to 10 carbon atoms, R 21 , R 22 , R 23 and R 24 each independently represent a hydrogen atom, a halogen atom or a carbon atom number An alkyl group of 1~10, R25 represents a hydrogen atom, a halogen atom, an alkyl group with 1~10 carbon atoms or any substituent selected from the following chemical formulas (A)~(C), An q- represents q Valence of anion, p represents the coefficient to make the charge neutral.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、 R29、R35、R36、R37、R38及R39各自獨立地表示氫原子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R30、R31、R32、R33及R34各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkyl group having 1 to 10 carbon atoms An alkoxy group or an ester group with 2 to 10 carbon atoms, R 30 , R 31 , R 32 , R 33 and R 34 each independently represent a hydrogen atom, a halogen atom or an alkyl group with 1 to 10 carbon atoms.
上述通式(1)表示之化合物中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之鹵素原子,可列舉氟、氯、溴、碘等。 Among the compounds represented by the above general formula (1), R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , Halogen represented by R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Atoms include fluorine, chlorine, bromine, iodine and the like.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之碳原子數1~10之烷基,可列舉甲基、乙基、丙基、異丙基、丁基、s-丁基、t-丁基、異丁基、戊基、異戊基、t-戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧基乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、t-丁硫基甲基、4-戊烯氧基甲 基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫乙基、三甲基甲矽烷基乙基、t-丁基二甲基甲矽烷氧基甲基、2-(三甲基甲矽烷基)乙氧基甲基、t-丁氧基羰基甲基、乙氧基羰基甲基、乙基羰基甲基、t-丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥基甲基、2-羥基乙基、1-羥基乙基、2-羥基丙基、3-羥基丙基、3-羥基丁基、4-羥基丁基、1,2-二羥基乙基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkyl groups with 1 to 10 carbon atoms, including Methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, pentyl, isopentyl, t-pentyl, hexyl, cyclohexyl, heptyl, Octyl, Nonyl, Ethyloctyl, 2-Methoxyethyl, 3-Methoxypropyl, 4-Methoxybutyl, 2-Butoxyethyl, Methoxyethoxyethyl methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoromethyl, trifluoromethyl, chloromethyl, dichloro Methyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nine Fluorobutyl, decafluoropentyl, tridecafluorohexyl, pentafluoroheptyl, heptadecafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, methoxy ethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4-pentenyloxymethyl, trichloroethoxymethyl, Bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1-methyl-1-methoxyethyl, ethyldithioethyl , trimethylsilylethyl, t-butyldimethylsilyloxymethyl, 2-(trimethylsilyl)ethoxymethyl, t-butoxycarbonylmethyl, ethyl Oxycarbonylmethyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, acryloxyethyl, methacryloxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl radical, acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxy Butyl, 4-hydroxybutyl, 1,2-dihydroxyethyl, etc.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數1~10之烷氧基,可列舉甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、s-丁氧基、t-丁氧基、異丁氧基、戊氧基、異戊氧基、t-戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲硫基乙氧基、三氟甲氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkoxy groups with 1 to 10 carbon atoms, including methoxy, ethoxy, propoxy, isopropoxy, Butoxy, s-butoxy, t-butoxy, isobutoxy, pentyloxy, isopentyloxy, t-pentyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethoxy , tetrahydrofuranoxy, tetrahydropyranyloxy, 2-methoxyethoxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethoxy, methoxy ethoxyethoxy, methoxyethoxyethoxyethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy, etc.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數2~10之酯基,可列舉甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二 氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、t-丁基羰氧基、甲氧基乙醯氧基、苯甲醯氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent ester groups with 2 to 10 carbon atoms, including methoxycarbonyl, ethoxycarbonyl, isopropoxycarbonyl, phenoxy ylcarbonyl, acetyloxy, propionyloxy, butyryloxy, chloroacetyloxy, dichloroacetyloxy, trichloroacetyloxy, trifluoroacetyloxy, t-butylcarbonyl Oxygen, methoxyacetyloxy, benzoyloxy, etc.
相對於(A)成分與(B)成分與(C)成分之合計100質量份,陽離子聚合起始劑(B)之使用比例為陽離子聚合起始劑(B)0.001~15質量份,較佳為0.1~10質量份。太少時,容易變得硬化不足,過多時,有時對於硬化物之吸水率或硬化物強度等之諸物性有不良影響的情形。 The ratio of cationic polymerization initiator (B) is 0.001 to 15 mass parts of cationic polymerization initiator (B) relative to 100 mass parts of the total of (A) component, (B) component and (C) component 0.1 to 10 parts by mass. When it is too small, hardening tends to be insufficient, and when it is too large, it may have a bad influence on various physical properties, such as the water absorption rate of a cured product, and the strength of a hardened product.
本發明之硬化性組成物的自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)或碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2)為必須成分。 The free radical polymerizable component (C) of the curable composition of the present invention is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylate ester of an alcohol with 2 to 20 carbon atoms or an acrylate with 2 carbon atoms. ~20 alcohol methacrylate (C2) is an essential ingredient.
上述具有環氧基及乙烯性不飽和基的化合物(C1),可列舉例如環氧基丙烯酸酯或環氧基甲基丙烯酸酯,具體而言,使以往公知之芳香族環氧樹脂、脂環式環氧樹脂、脂肪族環氧樹脂等與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯。此等之環氧基丙烯酸酯或環氧基甲基丙烯酸酯之中,特佳為醇類之環氧丙醚的丙烯酸酯或甲基丙烯酸酯。 The above-mentioned compound (C1) having an epoxy group and an ethylenically unsaturated group includes, for example, epoxy acrylate or epoxy methacrylate. Specifically, conventionally known aromatic epoxy resins, alicyclic Acrylic acid esters obtained by reacting formula epoxy resin, aliphatic epoxy resin, etc. with acrylic acid or methacrylic acid. Among these epoxy acrylates or epoxy methacrylates, acrylates or methacrylates of glycidyl ethers of alcohols are particularly preferred.
上述碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2),可列舉使分子中具有至少1個羥基的芳香族或脂肪族醇及其環氧烷加成物與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯或甲基丙烯酸酯。具體而言,可列舉2-乙基己基丙烯酸酯、2-羥基乙基丙烯酸酯、2-羥基丙基丙烯酸酯、異戊基丙烯酸酯、月桂基丙 烯酸酯、十八烷基丙烯酸酯、異辛基丙烯酸酯、四氫糠基丙烯酸酯、異莰基丙烯酸酯、苄基丙烯酸酯、1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、新戊二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯、ε-己內酯改質二季戊四醇六丙烯酸酯、2-乙基己基甲基丙烯酸酯、2-羥基乙基甲基丙烯酸酯、2-羥基丙基甲基丙烯酸酯、異戊基甲基丙烯酸酯、月桂基甲基丙烯酸酯、十八烷基甲基丙烯酸酯、異辛基甲基丙烯酸酯、四氫糠基甲基丙烯酸酯、異莰基甲基丙烯酸酯、苄基甲基丙烯酸酯、1,3-丁二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、新戊二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、聚丙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、二季戊四醇六甲基丙烯酸酯、ε-己內酯改質二季戊四醇六甲基丙烯酸酯等。又,此等之丙烯酸酯或甲基丙烯酸酯之中,特佳為多元醇之聚丙烯酸酯類或多元醇之聚甲基丙烯酸酯類。 The above-mentioned acrylates of alcohols with 2 to 20 carbon atoms or methacrylates (C2) of alcohols with 2 to 20 carbon atoms include aromatic or aliphatic alcohols and their rings having at least one hydroxyl group in the molecule. Acrylate or methacrylate obtained by reacting oxane adduct with acrylic acid or methacrylic acid. Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isopentyl acrylate, lauryl propyl acrylate, Acrylate, Octadecyl Acrylate, Isooctyl Acrylate, Tetrahydrofurfuryl Acrylate, Isocampyl Acrylate, Benzyl Acrylate, 1,3-Butanediol Diacrylate, 1,4- Butylene Glycol Diacrylate, 1,6-Hexanediol Diacrylate, Diethylene Glycol Diacrylate, Triethylene Glycol Diacrylate, Neopentyl Glycol Diacrylate, Polyethylene Glycol Diacrylate, Polypropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ε-caprolactone modified dipentaerythritol hexaacrylate, 2-ethylhexyl methacrylate, 2 -Hydroxyethyl Methacrylate, 2-Hydroxypropyl Methacrylate, Isoamyl Methacrylate, Lauryl Methacrylate, Octadecyl Methacrylate, Isooctyl Methacrylate , tetrahydrofurfuryl methacrylate, isocamphoryl methacrylate, benzyl methacrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate , 1,6-hexanediol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, polyethylene glycol dimethacrylate Acrylate, polypropylene glycol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexamethacrylate, ε-caprolactone modified dipentaerythritol hexamethacrylate Acrylic etc. Moreover, among these acrylates or methacrylates, polyol polyacrylates or polyol polymethacrylates are particularly preferred.
上述自由基聚合性成分(C)可使用(C1)或(C2)以外,藉由以能量線照射或加熱活性化之自由基聚合起始劑,進行高分子化或交聯反應的化合物,可列舉例如烯丙基胺基甲酸酯化合物、不飽和聚酯化合物、苯乙烯系化合 物等。自由基聚合性成分(C)中之上述(C1)成分及(C2)成分的比例,較佳為50質量%以上。 The above-mentioned radical polymerizable component (C) can use a compound other than (C1) or (C2), which undergoes a polymerization or crosslinking reaction by a radical polymerization initiator activated by energy ray irradiation or heating. Examples include allyl urethane compounds, unsaturated polyester compounds, styrene compounds things etc. It is preferable that the ratio of the said (C1) component and (C2) component in a radically polymerizable component (C) is 50 mass % or more.
本發明之硬化性組成物的自由基起始劑(D)無特別限制,可使用習知者。可使用例如苯乙酮系化合物、苄基系化合物、二苯甲酮系化合物、噻噸酮系化合物等之酮系化合物、肟系化合物等。 The free radical initiator (D) of the curable composition of the present invention is not particularly limited, and known ones can be used. For example, ketone-based compounds such as acetophenone-based compounds, benzyl-based compounds, benzophenone-based compounds, and thioxanthone-based compounds, oxime-based compounds, and the like can be used.
本發明之硬化性組成物的聚合物(E)係選自由上述式(I)表示之單體所得之聚合物、由上述式(II)表示之單體所得之聚合物、選自上述式(I)表示之單體之二種以上之單體所得之聚合物、選自上述式(II)表示之單體之二種以上之單體所得之聚合物及由上述式(I)表示之單體及上述式(II)表示之單體所得之聚合物所成群,且重量平均分子量以聚苯乙烯換算為1,000~30,000。 The polymer (E) of the curable composition of the present invention is selected from the polymer obtained from the monomer represented by the above formula (I), the polymer obtained from the monomer represented by the above formula (II), and the polymer obtained from the above formula ( I) A polymer obtained from two or more monomers of the monomer represented by the above formula (II), a polymer obtained from two or more monomers selected from the monomers represented by the above formula (II), and a monomer represented by the above formula (I) A polymer obtained from a monomer represented by the above-mentioned formula (II) and a monomer represented by the above formula (II) is grouped, and the weight average molecular weight is 1,000 to 30,000 in terms of polystyrene.
上述式(I)中之X表示之碳原子數1~7之烷基,可列舉甲基、乙基、丙基、iso-丙基、丁基、sec-丁基、tert-丁基、iso-丁基、戊基、iso-戊基、tert-戊基、己基、2-己基、3-己基、環己基、4-甲基環己基、庚基、2-庚基、3-庚基、iso-庚基、tert-庚基等。此等之中,從硬化性的觀點,碳原子數1~4之烷基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基進行部分取代之碳原子數1~4之烷基為佳。 The alkyl group with 1 to 7 carbon atoms represented by X in the above formula (I) includes methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso -butyl, pentyl, iso-pentyl, tert-pentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, etc. Among them, from the viewpoint of hardenability, an alkyl group having 1 to 4 carbon atoms may be partially substituted with one or more groups selected from epoxy groups, oxetanyl groups, hydroxyl groups, and carboxyl groups. An alkyl group with 1 to 4 carbon atoms is preferred.
上述式(I)中之X表示之碳原子數1~7之烷氧基,可列舉甲氧基、乙氧基、丙氧基、iso-丙氧基、丁氧基、sec-丁氧基、tert-丁氧基、iso-丁氧基、戊氧基、iso- 戊氧基、tert-戊氧基、己氧基、2-己氧基、3-己氧基、環己氧基、4-甲基環己氧基、庚氧基、2-庚氧基、3-庚氧基、iso-庚氧基、tert-庚氧基等。此等之中,從硬化性的觀點,碳原子數1~4之烷氧基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基進行部分取代之碳原子數1~4之烷氧基為佳。 An alkoxy group having 1 to 7 carbon atoms represented by X in the above formula (I) includes methoxy, ethoxy, propoxy, iso-propoxy, butoxy, sec-butoxy , tert-butoxy, iso-butoxy, pentyloxy, iso- Pentyloxy, tert-pentyloxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert-heptyloxy, etc. Among these, from the viewpoint of hardenability, an alkoxy group having 1 to 4 carbon atoms or one or more groups selected from the group consisting of epoxy, oxetanyl, hydroxyl and carboxyl groups carry out the moiety The substituted alkoxy group having 1 to 4 carbon atoms is preferred.
上述式(I)中之X表示之碳原子數6~12之芳基,可列舉苯基、甲基苯基、萘基等。 The aryl group having 6 to 12 carbon atoms represented by X in the above formula (I) includes phenyl, methylphenyl, naphthyl and the like.
上述式(I)中之X表示之碳原子數6~12之芳氧基,可列舉苯氧基、甲基苯氧基、萘氧基等。 The aryloxy group having 6 to 12 carbon atoms represented by X in the above formula (I) includes phenoxy, methylphenoxy, naphthyloxy and the like.
上述式(1)中之X表示之碳原子數6~10之脂環式烴基,可列舉環己基、甲基環己基、降莰基、雙環戊基、雙環辛基、三甲基雙環庚基、三環辛基、三環癸基、螺辛基、螺雙環戊基、金剛烷基、異莰基等。 The alicyclic hydrocarbon group having 6 to 10 carbon atoms represented by X in the above formula (1) includes cyclohexyl, methylcyclohexyl, norbornyl, dicyclopentyl, bicyclooctyl, trimethylbicycloheptyl , tricyclooctyl, tricyclodecanyl, spirooctyl, spirobicyclopentyl, adamantyl, isobornyl, etc.
此等之烷基、烷氧基、芳基、芳氧基及脂環式烴基,可為此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代。 These alkyl groups, alkoxy groups, aryl groups, aryloxy groups and alicyclic hydrocarbon groups can be hydrogen atoms in these groups selected from epoxy groups, oxetanyl groups, hydroxyl groups and carboxyl groups. Groups of one or more bases are substituted.
上述式(I)中,X之一部分為經環氧基或氧雜環丁烷基取代時之式(I)表示的單體,可列舉例如下述式(1)~(3)表示之單體。 In the above-mentioned formula (I), a part of X is a monomer represented by the formula (I) when a part of X is substituted by an epoxy group or an oxetanyl group, and examples thereof include monomers represented by the following formulas (1) to (3). body.
在此,式(1)中,R3表示氫原子或碳原子數1~6之烷基,m為1~6之整數。 Here, in formula (1), R 3 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and m is an integer of 1 to 6.
在此,式(2)中,R4表示氫原子或碳原子數1~6之烷基,n為1~6之整數。 Here, in formula (2), R 4 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 6.
在此,式(3)中,R5表示氫原子或碳原子數1~6之烷基,s為1~6之整數。 Here, in formula (3), R 5 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and s is an integer of 1 to 6.
上述式(II)中,以R1所表示的鹵原子,可列舉氟、氯、溴、碘等。 In the above formula (II), the halogen atom represented by R 1 includes fluorine, chlorine, bromine, iodine and the like.
上述式(II)中,X’之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基,可列舉與上述式(I)同樣者。 In the above-mentioned formula (II), the alkyl group with 1 to 7 carbon atoms, the aryl group with 6 to 12 carbon atoms or the alicyclic hydrocarbon group with 6 to 10 carbon atoms of X' can be enumerated with the above-mentioned formula (I) the same.
上述式(II)中,X’之一部分經環氧基或氧雜環丁烷基取代時,作為式(II)所表示之單體,可列舉下述式(4)~(6)所表示者。 In the above formula (II), when a part of X' is substituted by an epoxy group or an oxetanyl group, the monomer represented by the formula (II) includes the following formulas (4) to (6) By.
在此,式(4)中,R1係與上述式(II)相同,R6表示氫原子或碳原子數1~6之烷基,t為1~6之整數。 Here, in the formula (4), R1 is the same as the above-mentioned formula (II), R6 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and t is an integer of 1 to 6.
在此,式(5)中,R1係與上述式(II)相同,R7表示氫原子或碳原子數1~6之烷基,q為1~6之整數。 Here, in the formula (5), R 1 is the same as the above-mentioned formula (II), R 7 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and q is an integer of 1 to 6.
在此,式(6)中,R1係與上述式(II)相同,R8表示氫原子或碳原子數1~6之烷基,y為1~6之整數。 Here, in the formula (6), R1 is the same as the above-mentioned formula (II), R8 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and y is an integer of 1 to 6.
上述聚合物(E)中,構成聚合物之單體的使用比例係上述X為經選自由環氧基、環雜環丁烷基、羥基及 羧基所成群之1種以上之基取代之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基時,使上述(I)或(II)表示之單體成為10~100質量%來使用,由於接著性提高,故較佳。 In the above-mentioned polymer (E), the use ratio of the monomers constituting the polymer is that the above-mentioned X is selected from epoxy group, cyclohetidine group, hydroxyl group and In the case of an alkyl group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, or an alicyclic hydrocarbon group with 6 to 10 carbon atoms substituted by one or more groups of carboxyl groups, the above (I) Or the monomer represented by (II) is used in an amount of 10 to 100% by mass, since the adhesiveness is improved, so it is preferable.
本發明之硬化性組成物中,相對於陽離子聚合性成分(A)與自由基聚合性成分(C)與聚合物(E)之合計為100質量份,上述陽離子聚合性成分(A)為45~90質量份、上述陽離子聚合起始劑(B)為0.001~15質量份、上述自由基聚合性成分(C)為1~15質量份、上述自由基聚合起始劑(D)為1~10質量份、上述聚合物(E)為1~20質量份。在上述摻合比例以外時,硬化物之硬化性及密著性有變差的疑慮。 In the curable composition of the present invention, the cationically polymerizable component (A) is 45 parts by mass relative to 100 parts by mass of the total of the cationically polymerizable component (A), the radically polymerizable component (C) and the polymer (E). ~90 parts by mass, the above-mentioned cationic polymerization initiator (B) is 0.001-15 parts by mass, the above-mentioned radical polymerizable component (C) is 1-15 parts by mass, and the above-mentioned radical polymerization initiator (D) is 1-15 parts by mass. 10 mass parts, the said polymer (E) is 1-20 mass parts. When the blending ratio is other than the above, the curability and adhesiveness of the cured product may be deteriorated.
本發明之硬化性組成物中,可依需要進一步使用增感劑及/或增感助劑。增感劑係於較陽離子聚合起始劑(B)所顯示之極大吸收波長更長的波長顯示極大吸收,促進藉由陽離子聚合起始劑(B)之聚合起始反應的化合物。又,增感助劑係更進一步促進增感劑之作用的化合物。 In the curable composition of the present invention, a sensitizer and/or a sensitizer can be further used as needed. The sensitizer is a compound that exhibits maximum absorption at a wavelength longer than that of the cationic polymerization initiator (B) and accelerates the polymerization initiation reaction by the cationic polymerization initiator (B). Moreover, a sensitizer is a compound which further promotes the action of a sensitizer.
增感劑及增感助劑可列舉蒽系化合物、萘系化合物等。 As a sensitizer and a sensitization aid, an anthracene type compound, a naphthalene type compound, etc. are mentioned.
蒽系化合物可列舉例如下述式(7)表示者。 As an anthracene type compound, what is represented by following formula (7) is mentioned, for example.
此處,式(7)中,R50及R51各自獨立地表示氫原子、碳原子數1~6之烷基或碳原子數2~12之烷氧基烷基,R52表示氫原子或碳原子數1~6之烷基。 Here, in formula (7), R 50 and R 51 each independently represent a hydrogen atom, an alkyl group with 1 to 6 carbon atoms, or an alkoxyalkyl group with 2 to 12 carbon atoms, and R 52 represents a hydrogen atom or An alkyl group with 1 to 6 carbon atoms.
列舉上述式(7)表示之蒽系化合物之具體例時,有如以下的化合物。 When specific examples of the anthracene-based compound represented by the above formula (7) are given, the following compounds are given.
可列舉例如9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽、9,10-二異丙氧基蒽、9,10-二丁氧基蒽、9,10-二戊氧基蒽、9,10-二己氧基蒽、9,10-雙(2-甲氧基乙氧基)蒽、9,10-雙(2-乙氧基乙氧基)蒽、9,10-雙(2-丁氧基乙氧基)蒽、9,10-雙(3-丁氧基丙氧基)蒽、2-甲基-或2-乙基-9,10-二甲氧基蒽、2-甲基-或2-乙基-9,10-二乙氧基蒽、2-甲基-或2-乙基-9,10-二丙氧基蒽、2-甲基-或2-乙基-9,10-二異丙氧基蒽、2-甲基-或2-乙基-9,10-二丁氧基蒽、2-甲基-或2-乙基-9,10-二戊氧基蒽、2-甲基-或2-乙基-9,10-二己氧基蒽等。 Examples include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diisopropoxyanthracene, 9,10-dibutyl Oxyanthracene, 9,10-dipentyloxyanthracene, 9,10-dihexyloxyanthracene, 9,10-bis(2-methoxyethoxy)anthracene, 9,10-bis(2-ethane Oxyethoxy)anthracene, 9,10-bis(2-butoxyethoxy)anthracene, 9,10-bis(3-butoxypropoxy)anthracene, 2-methyl- or 2- Ethyl-9,10-dimethoxyanthracene, 2-methyl- or 2-ethyl-9,10-diethoxyanthracene, 2-methyl- or 2-ethyl-9,10-di Propoxyanthracene, 2-methyl- or 2-ethyl-9,10-diisopropoxyanthracene, 2-methyl- or 2-ethyl-9,10-dibutoxyanthracene, 2- Methyl- or 2-ethyl-9,10-dipentyloxyanthracene, 2-methyl- or 2-ethyl-9,10-dihexyloxyanthracene, etc.
萘系化合物可列舉例如下述式(8)表示者。 Naphthalene-based compounds include, for example, those represented by the following formula (8).
此處,式(8)中,R53及R54各自獨立地表示碳原子數1 ~6之烷基。 Here, in formula (8), R 53 and R 54 each independently represent an alkyl group having 1 to 6 carbon atoms.
列舉上述式(8)表示之萘系化合物之具體例時,有如以下的化合物。 When specific examples of the naphthalene-based compound represented by the above formula (8) are given, the following compounds are given.
可列舉例如4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 Examples include 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyl Oxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene , 1,4-dibutoxynaphthalene, etc.
相對於上述陽離子聚合性成分(A)而言,增感劑及增感助劑之使用比例無特別限定,只要在不阻礙本發明之目的的範圍內,大致以通常使用比例使用即可,例如相對於上述陽離子聚合性成分(A)100質量份,由提高硬化性的觀點,增感劑及增感助劑各自為0.1~3質量份為佳。 With respect to the above cationic polymerizable component (A), the ratio of the sensitizer and the sensitizer is not particularly limited, as long as it does not hinder the purpose of the present invention, it may be used at a generally used ratio, for example With respect to 100 parts by mass of the above-mentioned cationically polymerizable component (A), the sensitizer and the sensitization assistant are each preferably 0.1 to 3 parts by mass from the viewpoint of improving curability.
本發明之硬化性組成物中,可依需要使用矽烷偶合劑。矽烷偶合劑可使用例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等之烷基官能性烷氧基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等之烯基官能性烷氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽 烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧基官能性烷氧基矽烷、N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等之胺基官能性烷氧基矽烷、γ-巰基丙基三甲氧基矽烷等之巰基官能性烷氧基矽烷、四異丙烷氧化鈦、四正丁烷氧化鈦等之烷氧化鈦類、鈦二辛氧基雙(伸辛基甘醇酸鹽)、鈦二異丙氧基雙(乙基乙醯乙酸鹽)等之鈦鉗合物類、四乙醯丙酮鋯、三丁氧基單乙醯丙酮鋯等之鋯鉗合物類、三丁氧基硬脂酸鋯等之鋯醯化物類、甲基三異氰酸酯矽烷等之異氰酸酯矽烷類等。 In the curable composition of the present invention, a silane coupling agent may be used as needed. Silane coupling agents can be used such as dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane , methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane and other alkyl-functional alkoxysilanes, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethyl Alkenyl functional alkoxysilane such as oxysilane, allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane Dimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropylmethyldiethoxysilane Oxysilane, γ-Glycidoxypropyltrimethoxysilane, γ-Glycidoxypropylmethyldiethoxysilane Alkane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and other epoxy-functional alkoxysilanes, N-β(aminoethyl)-γ-aminopropyltrimethylsilane Amino-functional alkoxysilanes such as oxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxy Mercapto-functional alkoxysilanes such as silanes, titanium tetraisopropane oxides, titanium alkoxides such as tetra-n-butane titanium oxides, titanium dioctyloxybis(octyl glycolate), titanium diisopropyl Titanium chelates such as oxybis(ethyl acetylacetate), zirconium chelates such as tetraacetylacetonate, zirconium tributoxymonoacetylacetonate, etc., zirconium tributoxystearate Zirconium compounds, such as methyl triisocyanate silane, and other isocyanate silanes.
上述矽烷偶合劑之使用量並無特別限定,通常,相對於硬化性組成物中之固形物全部量100質量份,為0.01~20質量份的範圍。 The usage-amount of the said silane coupling agent is not specifically limited, Usually, it is the range of 0.01-20 mass parts with respect to 100 mass parts of total solids in a curable composition.
於本發明之硬化性組成物,依需要藉由使用熱可塑性有機聚合物,亦可改善硬化物之特性。熱可塑性有機聚合物,可列舉例如聚苯乙烯、聚甲基丙烯酸甲酯、甲基丙烯酸甲酯丙烯酸乙酯共聚物、甲基丙烯酸甲酯甲基丙烯酸縮水甘油酯共聚物、聚(甲基)丙烯酸、苯乙烯-(甲基)丙烯酸共聚物、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、(甲基)丙烯酸縮水甘油酯-聚甲基(甲基)丙烯酸酯共聚物、聚乙烯基縮丁醛、纖維素酯、聚丙烯醯胺、飽和聚酯等。 In the curable composition of the present invention, the properties of the cured product can also be improved by using a thermoplastic organic polymer as needed. Thermoplastic organic polymers, for example, polystyrene, polymethyl methacrylate, methyl methacrylate ethyl acrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, poly(methyl) Acrylic acid, styrene-(meth)acrylic acid copolymer, (meth)acrylic acid-methyl methacrylate copolymer, glycidyl (meth)acrylate-polymeth(meth)acrylate copolymer, polyethylene Butyral, cellulose ester, polyacrylamide, saturated polyester, etc.
本發明之硬化性組成物中,亦可依需要進一步使用紫外線吸收劑、或於常溫為不活性,且因加熱至特 定溫度/光照射/酸等會使保護基脫離而活性化,展現紫外線吸收能力的化合物。 In the curable composition of the present invention, an ultraviolet absorber may be further used as needed, or it is inactive at normal temperature, and due to heating to a specific A compound that deactivates and activates a protective group at a fixed temperature/light irradiation/acid, etc., and exhibits ultraviolet absorbing ability.
又,只要不損及本發明之效果時,可依需要添加多元醇、無機填料、有機填料、顏料、染料等之著色劑、消泡劑、增黏劑、界面活性劑、平坦劑、難燃劑、觸變劑、稀釋劑、可塑劑、安定劑、聚合抑制劑、紫外線吸收劑、抗氧化劑、抗靜電劑、流動調整劑、接著促進劑等之各種樹脂添加物等。 Also, as long as the effect of the present invention is not impaired, coloring agents such as polyols, inorganic fillers, organic fillers, pigments, dyes, defoamers, tackifiers, surfactants, leveling agents, flame retardants, etc. can be added as needed. Various resin additives such as additives, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, adhesion accelerators, etc.
本發明之硬化性組成物中,無特別限定,可使用通常所用之可溶解或分散上述(A)、(B)、(C)、(D)及(E)之各成分的溶劑。溶劑可列舉例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等之酮類;乙醚、二噁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲醚、二丙二醇二甲醚等之醚系溶劑;乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、2,2,4-三甲基-1,3-戊二醇異丁酸(Texanol)等之酯系溶劑;乙二醇單甲醚、乙二醇單乙醚等之溶纖劑系溶劑;甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等之醇系溶劑;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、乙酸3-甲氧基丁酯、丙酸乙氧基乙酯等之醚酯系溶劑;苯、甲苯、二甲苯等之BTX系溶劑;己烷、庚烷、辛烷、環己烷等之脂肪族烴系溶劑;松節油、 D-檸檬烯、蒎烯等之萜烯系烴油;礦油精、Swasol#310(Cosmo松山石油(股)公司製)、Solvesso#100(Exxon化學公司)等之鏈烷烴系溶劑;四氯化碳、氯仿、三氯乙烯、二氯甲烷、1,2-二氯乙烷等之鹵化脂肪族烴系溶劑;氯苯等之鹵化芳香族烴系溶劑;碳酸丙烯酯、卡必醇系溶劑、苯胺、三乙胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮、二甲基亞碸、水等。此等溶劑可使用1種或以2種以上之混合溶劑使用。 The curable composition of the present invention is not particularly limited, and generally used solvents that can dissolve or disperse the above-mentioned components (A), (B), (C), (D) and (E) can be used. Examples of solvents include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone; Ether solvents such as ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether, etc.; methyl acetate, Ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, 2,2,4-trimethyl-1,3 -Ester-based solvents such as pentanediol isobutyric acid (Texanol); cellosolve-based solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, iso- or n-propanol, iso- Or alcohol solvents such as n-butanol and pentanol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA) , dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate, etc. ether ester solvents; benzene, toluene, xylene, etc. BTX solvents; hexane, heptane , octane, cyclohexane and other aliphatic hydrocarbon solvents; turpentine, Terpene-based hydrocarbon oils such as D-limonene and pinene; paraffin-based solvents such as mineral spirits, Swasol #310 (manufactured by Cosmo Matsuyama Petroleum Co., Ltd.), Solvesso #100 (Exxon Chemical Co.); tetrachloride Halogenated aliphatic hydrocarbon solvents such as carbon, chloroform, trichloroethylene, dichloromethane, and 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; propylene carbonate, carbitol-based solvents, Aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfide, water, etc. . These solvents can be used alone or as a mixed solvent of two or more.
本發明之硬化性組成物會提高硬化性、接著性、液體保存安定性,故水分量為5質量份以下較佳,又更佳為3質量份以下。水分過多時,有產生白濁或成分析出之疑慮,故不佳。 The curable composition of the present invention improves curability, adhesiveness, and liquid storage stability, so the moisture content is preferably 5 parts by mass or less, and more preferably 3 parts by mass or less. When there is too much water, there may be doubts about white turbidity or separation of components, so it is not good.
本發明之硬化性組成物以輥塗佈器、淋幕塗佈器、各種之印刷、浸漬等之公知手段適用於支撐基體上。又,也可一旦施於薄膜等之支撐基體上後,轉印於其他支撐基體上,其適用方法並無限制。 The curable composition of the present invention is applied to the support substrate by known means such as roll coater, curtain coater, various printing, dipping and the like. In addition, after being applied to a supporting substrate such as a film once, it may be transferred to another supporting substrate, and the application method is not limited.
上述支撐基體之材料,無特別限制,可使用通常所使用者,可列舉例如玻璃等之無機材料;二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯基丙醯基纖維素、硝基纖維素等之纖維素酯;聚醯胺;聚醯亞胺;聚胺基甲酸酯;環氧樹脂;聚碳酸酯;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚-1,4-環己烷二亞甲基聚對苯二甲酸酯、 聚乙烯-1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚對苯二甲酸丁二酯等之聚酯;聚苯乙烯;聚乙烯、聚丙烯、聚甲基戊烯等之聚烯烴;聚乙酸乙烯酯、聚氯乙烯、聚氟乙烯等之乙烯基化合物;聚甲基丙烯酸甲酯、聚丙烯酸酯等之丙烯酸系樹脂;聚碳酸酯;聚碸;聚醚碸;聚醚酮;聚醚醯亞胺;聚氧乙烯、降莰烯樹脂、環烯烴聚合物(COP)等之高分子材料。又,亦可對上述支撐基體進行電暈放電處理、火焰處理、紫外線處理、高頻處理、輝光放電處理、活性電漿處理、雷射處理等之表面活性化處理。 The material of the above-mentioned support matrix is not particularly limited, and commonly used ones can be used, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), acryl cellulose, butyryl cellulose Cellulose esters of cellulose, acetylpropionyl cellulose, nitrocellulose, etc.; polyamides; polyimides; polyurethanes; epoxy resins; polycarbonates; polyterephthalates Ethylene formate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexane dimethylene terephthalate, Polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate, polyesters such as polybutylene terephthalate; polystyrene; polyethylene, polypropylene, polymethyl Polyolefins such as pentene; vinyl compounds such as polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, etc.; acrylic resins such as polymethyl methacrylate, polyacrylate, etc.; polycarbonate; polycarbonate; polyether Polymer materials such as polyetherketone, polyetherimide, polyoxyethylene, norcamphene resin, cycloolefin polymer (COP), etc. In addition, surface activation treatments such as corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, laser treatment, etc. may be performed on the support base.
藉由能量線照射本發明之硬化性組成物使硬化的方法中,能量線可列舉紫外線、電子線、X射線、放射線、高頻等,紫外線在經濟上最佳。紫外線之光源,可列舉紫外線雷射、水銀燈、氙雷射、金屬鹵素燈等。 In the method of curing the curable composition of the present invention by irradiating energy rays, examples of the energy rays include ultraviolet rays, electron rays, X-rays, radiation rays, high frequency, etc., and ultraviolet rays are most economically optimal. The light source of ultraviolet rays includes ultraviolet lasers, mercury lamps, xenon lasers, metal halide lamps, and the like.
藉由加熱使本發明之硬化性組成物硬化的方法的條件為70~250℃、1~100分鐘。可於預烤(PAB;Pre applied bake)之後加壓進行後烘烤(PEB;Post exposure bake);亦可以不同的數階段的溫度烘烤。加熱條件雖依各成分之種類及摻合比例而異,但例如70~180℃下,烘箱為5~15分鐘,加熱板則為1~5分鐘。然後,為了使塗膜硬化,藉由於180~250℃,較佳為200~250℃,烘箱為30~90分鐘,加熱板則為5~30分鐘進行加熱處理,可得到硬化膜。 The conditions for the method of curing the curable composition of the present invention by heating are 70 to 250° C. for 1 to 100 minutes. It can be pre-baked (PAB; Pre applied bake) and then pressurized for post-baking (PEB; Post exposure bake); it can also be baked at different stages of temperature. Although the heating conditions vary depending on the type and blending ratio of each component, for example, at 70-180°C, it takes 5-15 minutes in an oven, and 1-5 minutes on a heating plate. Then, in order to harden the coating film, heat treatment is performed at 180-250°C, preferably 200-250°C, in an oven for 30-90 minutes, and on a heating plate for 5-30 minutes to obtain a cured film.
本發明之硬化性組成物或其硬化物之具體的用途,可列舉接著劑、眼鏡、以攝影用透鏡為代表之光學 材料、塗料、塗覆劑、襯墊(lining)劑、油墨、阻劑、液狀阻劑、印刷版、彩色電視、PC監視器、行動資訊終端、數位相機、有機EL、觸控面板等之顯示元件、絕緣清漆、絕緣薄片、層合板、印刷基板、半導體裝置用/LED封裝用/液晶注入口用/有機EL用/光元件用/電絕緣用/電子零件用/分離膜用等之封裝劑、成形材料、油灰、玻璃纖維含浸劑、木粉填料、半導體用/太陽電池用等之鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置之背光所使用之稜鏡透鏡薄片、投影電視等之螢幕所使用之菲涅耳透鏡薄片、雙凸透鏡薄片等之透鏡薄片之透鏡部、或使用這種薄片之背光等、微透鏡等之光學透鏡、光學元件、光連接器、光波導、光學造形用鑄型劑等。 Specific applications of the curable composition of the present invention or its cured product include adhesives, eyeglasses, and optical lenses represented by photographic lenses. Materials, coatings, coating agents, lining agents, inks, resists, liquid resists, printing plates, color TVs, PC monitors, mobile information terminals, digital cameras, organic EL, touch panels, etc. Packaging for display elements, insulating varnishes, insulating sheets, laminates, printed circuit boards, semiconductor devices/LED packaging/liquid crystal injection ports/organic EL/optical elements/electrical insulation/electronic parts/separation films, etc. Agent, molding material, putty, glass fiber impregnating agent, wood powder filler, passivation film for semiconductor/solar battery, etc., interlayer insulating film, protective film, lens sheet used for backlight of liquid crystal display device, projection TV, etc. Fresnel lens sheets used in screens, lenticular lens sheets, etc., lens parts of lens sheets, or backlights using such sheets, optical lenses such as microlenses, optical elements, optical connectors, optical waveguides, optical moldings Use casting agents, etc.
本發明之顯示裝置可列舉於透明支撐體上依需要設置有底塗層、抗反射層、偏光元件層、相位差層、雙折射率層、光散射層、硬質塗層、潤滑層、保護層等之各層者,於各層可使用由本發明之硬化物所成的薄膜。 The display device of the present invention can be enumerated on the transparent support to be provided with a primer layer, an anti-reflection layer, a polarizer layer, a phase difference layer, a birefringence layer, a light scattering layer, a hard coat layer, a lubricating layer, and a protective layer. For each layer, a film made of the cured product of the present invention can be used for each layer.
以下列舉實施例等更詳細說明本發明,但本發明不限定於此等實施例。 Examples and the like are given below to describe the present invention in more detail, but the present invention is not limited to these examples.
以下述[表1]~[表5]所示之調配,將各成分充分地混 合,得到各實施例1~20之硬化性組成物及比較例1~7之硬化性組成物。又,實施例及比較例之單位為質量份。 According to the deployment shown in the following [Table 1] ~ [Table 5], fully mix the ingredients Combined, the curable compositions of Examples 1-20 and the curable compositions of Comparative Examples 1-7 were obtained. In addition, the unit of an Example and a comparative example is a mass part.
陽離子聚合性成分(A)係使用下述化合物。 As the cationically polymerizable component (A), the following compounds were used.
化合物(A1-1):新戊二醇二環氧丙醚 Compound (A1-1): Neopentyl glycol diglycidyl ether
化合物(A1-2):1,4-丁二醇二環氧丙醚 Compound (A1-2): 1,4-Butanediol Diglycidyl Ether
化合物(A2-1):ARON OXETANEOXT-221(東亞合成(股)公司製) Compound (A2-1): ARON OXETANEOXT-221 (manufactured by Toagosei Co., Ltd.)
化合物(A3-1):雙酚型二環氧丙醚 Compound (A3-1): Bisphenol Diglycidyl Ether
化合物(A3-2):TECHMORE VG3101(芳香族3官能環氧樹脂:(股)Printec公司製) Compound (A3-2): TECHMORE VG3101 (aromatic trifunctional epoxy resin: manufactured by Printec Corporation)
陽離子聚合起始劑(B)為使用下述化合物(B-1)。 As a cationic polymerization initiator (B), the following compound (B-1) was used.
化合物(B-1):下述式(9)表示之化合物及下述式(10)表示之化合物之混合物的碳酸丙烯酯50%溶液 Compound (B-1): 50% propylene carbonate solution of a mixture of a compound represented by the following formula (9) and a compound represented by the following formula (10)
自由基聚合性成分(C)為使用下述化合物。 As the radical polymerizable component (C), the following compounds were used.
化合物(C1-1):環氧基酯M-600A(共榮社化學(股)公司製) Compound (C1-1): Epoxy ester M-600A (manufactured by Kyoeisha Chemical Co., Ltd.)
化合物(C1-2):環氧基酯70PA(共榮社化學(股)公司製) Compound (C1-2): Epoxy ester 70PA (manufactured by Kyoeisha Chemical Co., Ltd.)
化合物(C2-1):1,6-己二醇二丙烯酸酯 Compound (C2-1): 1,6-hexanediol diacrylate
自由基聚合起始劑(D)為使用下述化合物(D-1)。 As a radical polymerization initiator (D), the following compound (D-1) was used.
化合物(D-1):IRGACURE184(BASF公司製) Compound (D-1): IRGACURE184 (manufactured by BASF Corporation)
聚合物(E)為使用下述化合物(E-1)。 As the polymer (E), the following compound (E-1) was used.
聚合物(E-1):甲基丙烯酸甲酯75質量份與環氧丙基甲基丙烯酸酯25之共聚物(重量平均分子量7,000) Polymer (E-1): Copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 7,000)
聚合物(E’)為使用下述化合物(E’-1)及(E’-2)。 As the polymer (E'), the following compounds (E'-1) and (E'-2) were used.
化合物(E’-1):甲基丙烯酸甲酯75質量份與環氧丙基甲基丙烯酸酯25之共聚物(重量平均分子量800) Compound (E'-1): a copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 800)
化合物(E’-2:甲基丙烯酸甲酯75質量份與環氧丙基甲基丙烯酸酯25之共聚物(重量平均分子量35,000) Compound (E'-2: Copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 35,000)
對於所得之實施例1~20及比較例1~7之各硬化性組成物,依據下述步驟評價玻璃轉移溫度(Tg)、彈性模數、黏性及密著性之評價。結果併記於[表1]~[表5]。 For each curable composition obtained in Examples 1-20 and Comparative Examples 1-7, the glass transition temperature (Tg), modulus of elasticity, viscosity and adhesion were evaluated according to the following procedure. The results are recorded in [Table 1] ~ [Table 5].
將所得之實施例1~20及比較例1~7之各硬化性組成物分別以塗佈棒塗佈於聚對苯二甲酸乙二酯(PET)薄膜上 形成30μm的厚度,使用金屬鹵素燈照射3000mJ/cm2之能量。24小時後,自薄膜取出接著劑硬化物,使用(股)Hitachi High-Tech Science製之黏彈性測量裝置(DMA7100),測量Tg及80℃下的彈性模數。 The curable compositions obtained in Examples 1-20 and Comparative Examples 1-7 were coated on polyethylene terephthalate (PET) film with a coating bar to form a thickness of 30 μm, and metal halide lamps were used to The energy of 3000mJ/cm 2 is irradiated. After 24 hours, the hardened adhesive was taken out from the film, and the elastic modulus at Tg and 80° C. was measured using a viscoelasticity measuring device (DMA7100) manufactured by Hitachi High-Tech Science.
對於所得之實施例1~20及比較例1~7之各硬化性組成物,分別以E型黏度計測量25℃時之黏度。結果如[表1]~[表5]所示。 For each curable composition obtained in Examples 1-20 and Comparative Examples 1-7, the viscosity at 25° C. was measured with an E-type viscometer. The results are shown in [Table 1] ~ [Table 5].
將上述所得之實施例1~20及比較例1~7之組成物,各自塗佈於一片電暈處理PMMA薄膜(住友化學(股)公司製:Technolloy 125S001)後,使用層合機與另一片經電暈放電處理的COP(環烯烴聚合物、日本Zeon(股)公司製:型號Zeonor Film 14-060)薄膜貼合,使用無電極紫外光燈透過COP薄膜照射相當於1000mJ/cm2之光進行接著,以得到試驗片。對於所得之試驗片進行90度剝離試驗。 The compositions of Examples 1-20 and Comparative Examples 1-7 obtained above were each coated on a piece of corona-treated PMMA film (manufactured by Sumitomo Chemical Co., Ltd.: Technolloy 125S001), and then laminated with the other piece using a laminator. Corona discharge treated COP (cycloolefin polymer, Japan Zeon Co., Ltd.: model Zeonor Film 14-060) film lamination, using an electrodeless ultraviolet lamp to irradiate light equivalent to 1000mJ/cm 2 through the COP film Then, a test piece was obtained. A 90-degree peel test was performed on the obtained test piece.
由[表1]~[表5]得知本發明之硬化性組成物係硬化物之硬化性及密著性優異。 From [Table 1] to [Table 5], it can be seen that the curable composition of the present invention is excellent in curability and adhesion of cured products.
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