TWI788285B - Curable composition, method for producing cured product, and cured product - Google Patents
Curable composition, method for producing cured product, and cured product Download PDFInfo
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- TWI788285B TWI788285B TW106110862A TW106110862A TWI788285B TW I788285 B TWI788285 B TW I788285B TW 106110862 A TW106110862 A TW 106110862A TW 106110862 A TW106110862 A TW 106110862A TW I788285 B TWI788285 B TW I788285B
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- 239000000203 mixture Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- -1 glycidyl compound Chemical class 0.000 claims abstract description 172
- 150000001875 compounds Chemical class 0.000 claims abstract description 72
- 229920000642 polymer Polymers 0.000 claims abstract description 48
- 239000000178 monomer Substances 0.000 claims abstract description 44
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 20
- 150000003254 radicals Chemical class 0.000 claims abstract description 14
- 125000002091 cationic group Chemical group 0.000 claims abstract description 13
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 11
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 10
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 10
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 70
- 125000003118 aryl group Chemical group 0.000 claims description 38
- 239000004593 Epoxy Substances 0.000 claims description 33
- 229920005862 polyol Polymers 0.000 claims description 33
- 125000000217 alkyl group Chemical group 0.000 claims description 32
- 150000003077 polyols Chemical class 0.000 claims description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 23
- 125000002723 alicyclic group Chemical group 0.000 claims description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 125000002947 alkylene group Chemical group 0.000 claims description 11
- 125000005843 halogen group Chemical group 0.000 claims description 11
- 125000003566 oxetanyl group Chemical group 0.000 claims description 11
- 125000003545 alkoxy group Chemical group 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 150000001768 cations Chemical class 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 125000004104 aryloxy group Chemical group 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 150000001721 carbon Chemical group 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 abstract description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 150000001450 anions Chemical class 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 150000002927 oxygen compounds Chemical class 0.000 description 7
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 229920002678 cellulose Polymers 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 239000001913 cellulose Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 241000208340 Araliaceae Species 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 3
- 235000003140 Panax quinquefolius Nutrition 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 125000004185 ester group Chemical group 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 235000008434 ginseng Nutrition 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 2
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 2
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- HVMHLMJYHBAOPL-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)propan-2-yl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1C(C)(C)C1CC2OC2CC1 HVMHLMJYHBAOPL-UHFFFAOYSA-N 0.000 description 2
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 150000001454 anthracenes Chemical class 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 208000028659 discharge Diseases 0.000 description 2
- 239000003759 ester based solvent Substances 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 150000002921 oxetanes Chemical class 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- TZMFJUDUGYTVRY-UHFFFAOYSA-N pentane-2,3-dione Chemical group CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinyl group Chemical group C1(O)=CC(O)=CC=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 1
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- KQQSTPXKXXMWOJ-UHFFFAOYSA-N (3,5-difluoro-4-methoxyphenoxy)boronic acid Chemical compound FC=1C=C(C=C(C=1OC)F)OB(O)O KQQSTPXKXXMWOJ-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- SJHPCNCNNSSLPL-CSKARUKUSA-N (4e)-4-(ethoxymethylidene)-2-phenyl-1,3-oxazol-5-one Chemical compound O1C(=O)C(=C/OCC)\N=C1C1=CC=CC=C1 SJHPCNCNNSSLPL-CSKARUKUSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-M 0.000 description 1
- DHYPEWXXSPZJNA-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8-hexadecafluorooctane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)F DHYPEWXXSPZJNA-UHFFFAOYSA-N 0.000 description 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- KOBSIMTVSKYQDD-UHFFFAOYSA-N 1,2-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1CCCCC1COC=C KOBSIMTVSKYQDD-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- KATAXDCYPGGJNJ-UHFFFAOYSA-N 1,3-bis(oxiran-2-ylmethoxy)propan-2-ol Chemical compound C1OC1COCC(O)COCC1CO1 KATAXDCYPGGJNJ-UHFFFAOYSA-N 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical group 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- UKXGGMCMWNJILJ-UHFFFAOYSA-N 1,4-dibutoxynaphthalene Chemical compound C1=CC=C2C(OCCCC)=CC=C(OCCCC)C2=C1 UKXGGMCMWNJILJ-UHFFFAOYSA-N 0.000 description 1
- LJSLYKNKVQMIJY-UHFFFAOYSA-N 1,4-diethoxynaphthalene Chemical compound C1=CC=C2C(OCC)=CC=C(OCC)C2=C1 LJSLYKNKVQMIJY-UHFFFAOYSA-N 0.000 description 1
- FWWRTYBQQDXLDD-UHFFFAOYSA-N 1,4-dimethoxynaphthalene Chemical compound C1=CC=C2C(OC)=CC=C(OC)C2=C1 FWWRTYBQQDXLDD-UHFFFAOYSA-N 0.000 description 1
- APQSQLNWAIULLK-UHFFFAOYSA-N 1,4-dimethoxynaphthalene Natural products C1=CC=C2C(C)=CC=C(C)C2=C1 APQSQLNWAIULLK-UHFFFAOYSA-N 0.000 description 1
- JJPJWPYRFJDRMH-UHFFFAOYSA-N 1,4-dipropoxynaphthalene Chemical compound C1=CC=C2C(OCCC)=CC=C(OCCC)C2=C1 JJPJWPYRFJDRMH-UHFFFAOYSA-N 0.000 description 1
- SKLWPWRPASAXHA-UHFFFAOYSA-N 1-[diethoxy(methyl)silyl]propan-2-yl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CC(C)OC(=O)C(C)=C SKLWPWRPASAXHA-UHFFFAOYSA-N 0.000 description 1
- BFVGWUGTUSQGSL-UHFFFAOYSA-N 1-cycloheptyl-1,2,2-trimethylcycloheptane Chemical group CC1(C)CCCCCC1(C)C1CCCCCC1 BFVGWUGTUSQGSL-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 description 1
- KTZWVUYCTDMQJH-UHFFFAOYSA-N 1-ethoxy-4-methoxynaphthalene Chemical compound C1=CC=C2C(OCC)=CC=C(OC)C2=C1 KTZWVUYCTDMQJH-UHFFFAOYSA-N 0.000 description 1
- 125000004066 1-hydroxyethyl group Chemical group [H]OC([H])([*])C([H])([H])[H] 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- FODCFYIWOJIZQL-UHFFFAOYSA-N 1-methylsulfanyl-3,5-bis(trifluoromethyl)benzene Chemical compound CSC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 FODCFYIWOJIZQL-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- NQFUSWIGRKFAHK-UHFFFAOYSA-N 2,3-epoxypinane Chemical compound CC12OC1CC1C(C)(C)C2C1 NQFUSWIGRKFAHK-UHFFFAOYSA-N 0.000 description 1
- VRRDONHGWVSGFH-UHFFFAOYSA-N 2,5-diethylcyclohexane-1,4-diamine Chemical compound CCC1CC(N)C(CC)CC1N VRRDONHGWVSGFH-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- ZGHZSTWONPNWHV-UHFFFAOYSA-N 2-(oxiran-2-yl)ethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCC1CO1 ZGHZSTWONPNWHV-UHFFFAOYSA-N 0.000 description 1
- 125000003821 2-(trimethylsilyl)ethoxymethyl group Chemical group [H]C([H])([H])[Si](C([H])([H])[H])(C([H])([H])[H])C([H])([H])C(OC([H])([H])[*])([H])[H] 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- JZUMVFMLJGSMRF-UHFFFAOYSA-N 2-Methyladipic acid Chemical compound OC(=O)C(C)CCCC(O)=O JZUMVFMLJGSMRF-UHFFFAOYSA-N 0.000 description 1
- XRBWKWGATZNBFW-UHFFFAOYSA-N 2-[2-(2-ethenoxyethoxy)ethoxy]ethanol Chemical compound OCCOCCOCCOC=C XRBWKWGATZNBFW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 1
- VSRMIIBCXRHPCC-UHFFFAOYSA-N 2-[2-[2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxy]ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCCOCCOCC1CO1 VSRMIIBCXRHPCC-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
- XAYUYBHNVNEQGZ-UHFFFAOYSA-N 2-ethyl-9,10-di(propan-2-yloxy)anthracene Chemical compound C1=CC=CC2=C(OC(C)C)C3=CC(CC)=CC=C3C(OC(C)C)=C21 XAYUYBHNVNEQGZ-UHFFFAOYSA-N 0.000 description 1
- VIIDFVJFNLYVJE-UHFFFAOYSA-N 2-ethyl-9,10-dihexoxyanthracene Chemical compound CCC1=CC=C2C(OCCCCCC)=C(C=CC=C3)C3=C(OCCCCCC)C2=C1 VIIDFVJFNLYVJE-UHFFFAOYSA-N 0.000 description 1
- BGNGHGABCPFGLQ-UHFFFAOYSA-N 2-ethyl-9,10-dipentoxyanthracene Chemical compound CCC1=CC=C2C(OCCCCC)=C(C=CC=C3)C3=C(OCCCCC)C2=C1 BGNGHGABCPFGLQ-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- IKCQWKJZLSDDSS-UHFFFAOYSA-N 2-formyloxyethyl formate Chemical compound O=COCCOC=O IKCQWKJZLSDDSS-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- KIBVFIDMXQZCBS-UHFFFAOYSA-N 2-methyloctanedioic acid Chemical compound OC(=O)C(C)CCCCCC(O)=O KIBVFIDMXQZCBS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- PTBXCABQWUPKMP-UHFFFAOYSA-N 2-methylpropanoic acid;pentane-1,1-diol Chemical compound CC(C)C(O)=O.CCCCC(O)O PTBXCABQWUPKMP-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 1
- HYPIHGLKOQBQNW-UHFFFAOYSA-N 3,7-dimethyldecanedioic acid Chemical compound OC(=O)CCC(C)CCCC(C)CC(O)=O HYPIHGLKOQBQNW-UHFFFAOYSA-N 0.000 description 1
- CPSKVIYXUCHQAR-UHFFFAOYSA-N 3,8-dimethyldecanedioic acid Chemical compound OC(=O)CC(C)CCCCC(C)CC(O)=O CPSKVIYXUCHQAR-UHFFFAOYSA-N 0.000 description 1
- JHTWIUGGPRQZRZ-UHFFFAOYSA-N 3-(3-ethyloxiran-2-yl)-2-methyl-2-(3-methyl-7-oxabicyclo[4.1.0]heptan-3-yl)propanoic acid Chemical compound CCC1OC1CC(C)(C(O)=O)C1(C)CC2OC2CC1 JHTWIUGGPRQZRZ-UHFFFAOYSA-N 0.000 description 1
- UKLWXKWTXHHMFK-UHFFFAOYSA-N 3-(chloromethyl)-3-ethyloxetane Chemical compound CCC1(CCl)COC1 UKLWXKWTXHHMFK-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- REEBWSYYNPPSKV-UHFFFAOYSA-N 3-[(4-formylphenoxy)methyl]thiophene-2-carbonitrile Chemical compound C1=CC(C=O)=CC=C1OCC1=C(C#N)SC=C1 REEBWSYYNPPSKV-UHFFFAOYSA-N 0.000 description 1
- MKNOYISMZFDLQP-UHFFFAOYSA-N 3-[1-[2-(oxetan-3-yl)butoxy]butan-2-yl]oxetane Chemical compound C1OCC1C(CC)COCC(CC)C1COC1 MKNOYISMZFDLQP-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- OKWYEBJNFREPEV-UHFFFAOYSA-N 3-[dimethoxy(phenylmethoxy)silyl]propan-1-amine Chemical compound NCCC[Si](OC)(OC)OCC1=CC=CC=C1 OKWYEBJNFREPEV-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- DYBDHAUFDFRVNL-UHFFFAOYSA-N 3-methyl-4-[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl]-7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C2OC2CC(C)C1(C(O)=O)CC1CC2OC2CC1C DYBDHAUFDFRVNL-UHFFFAOYSA-N 0.000 description 1
- ULYIFEQRRINMJQ-UHFFFAOYSA-N 3-methylbutyl 2-methylprop-2-enoate Chemical compound CC(C)CCOC(=O)C(C)=C ULYIFEQRRINMJQ-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- HYYPKCMPDGCDHE-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CC1CC2OC2CC1 HYYPKCMPDGCDHE-UHFFFAOYSA-N 0.000 description 1
- BOTGCZBEERTTDQ-UHFFFAOYSA-N 4-Methoxy-1-naphthol Chemical compound C1=CC=C2C(OC)=CC=C(O)C2=C1 BOTGCZBEERTTDQ-UHFFFAOYSA-N 0.000 description 1
- KVBPVOWVPNOMIJ-UHFFFAOYSA-N 4-butoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCCCC)=CC=C(O)C2=C1 KVBPVOWVPNOMIJ-UHFFFAOYSA-N 0.000 description 1
- XYHQAQRXVQZBQV-UHFFFAOYSA-N 4-ethoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCC)=CC=C(O)C2=C1 XYHQAQRXVQZBQV-UHFFFAOYSA-N 0.000 description 1
- INBYRLZHIQCNTL-UHFFFAOYSA-N 4-hexoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCCCCCC)=CC=C(O)C2=C1 INBYRLZHIQCNTL-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- KSGYKTRNRCPDHT-KVSWJAHQSA-N 4-n-[1-[(3-fluorophenyl)methyl]indazol-5-yl]-5-[(e)-2-methoxyethoxyiminomethyl]pyrimidine-4,6-diamine Chemical compound COCCO\N=C\C1=C(N)N=CN=C1NC1=CC=C(N(CC=2C=C(F)C=CC=2)N=C2)C2=C1 KSGYKTRNRCPDHT-KVSWJAHQSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- WDYWDYHAPSPLJO-UHFFFAOYSA-N 4-propoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCCC)=CC=C(O)C2=C1 WDYWDYHAPSPLJO-UHFFFAOYSA-N 0.000 description 1
- BMIOTMCWMGQPAA-UHFFFAOYSA-N 5-methyl-3-[(5-methyl-7-oxabicyclo[4.1.0]heptan-3-yl)methyl]-7-oxabicyclo[4.1.0]heptane-3-carboxylic acid Chemical compound C1C2OC2C(C)CC1(C(O)=O)CC1CC(C)C2OC2C1 BMIOTMCWMGQPAA-UHFFFAOYSA-N 0.000 description 1
- GAYWCADKXYCKCG-UHFFFAOYSA-N 5-pyridin-3-yl-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound N1NC(=S)N=C1C1=CC=CN=C1 GAYWCADKXYCKCG-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- NQSLZEHVGKWKAY-UHFFFAOYSA-N 6-methylheptyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C(C)=C NQSLZEHVGKWKAY-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- BIDNFOLOHMWYGB-UHFFFAOYSA-N 9,10-bis(2-butoxyethoxy)anthracene Chemical compound C1=CC=C2C(OCCOCCCC)=C(C=CC=C3)C3=C(OCCOCCCC)C2=C1 BIDNFOLOHMWYGB-UHFFFAOYSA-N 0.000 description 1
- BEFARLHNOSBDOH-UHFFFAOYSA-N 9,10-bis(2-ethoxyethoxy)anthracene Chemical compound C1=CC=C2C(OCCOCC)=C(C=CC=C3)C3=C(OCCOCC)C2=C1 BEFARLHNOSBDOH-UHFFFAOYSA-N 0.000 description 1
- FZNZCCNCEMMYRC-UHFFFAOYSA-N 9,10-bis(2-methoxyethoxy)anthracene Chemical compound C1=CC=C2C(OCCOC)=C(C=CC=C3)C3=C(OCCOC)C2=C1 FZNZCCNCEMMYRC-UHFFFAOYSA-N 0.000 description 1
- YUSXKJPJGSZRBY-UHFFFAOYSA-N 9,10-bis(3-butoxypropoxy)anthracene Chemical compound C1=CC=C2C(OCCCOCCCC)=C(C=CC=C3)C3=C(OCCCOCCCC)C2=C1 YUSXKJPJGSZRBY-UHFFFAOYSA-N 0.000 description 1
- IXYPOJJOFMWNSH-UHFFFAOYSA-N 9,10-di(propan-2-yloxy)anthracene Chemical compound C1=CC=C2C(OC(C)C)=C(C=CC=C3)C3=C(OC(C)C)C2=C1 IXYPOJJOFMWNSH-UHFFFAOYSA-N 0.000 description 1
- NYEVBSJUVMRZNE-UHFFFAOYSA-N 9,10-dibutoxy-2-ethylanthracene Chemical compound CCC1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 NYEVBSJUVMRZNE-UHFFFAOYSA-N 0.000 description 1
- FUWFDADDJOUNDL-UHFFFAOYSA-N 9,10-diethoxy-2-ethylanthracene Chemical compound CCC1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 FUWFDADDJOUNDL-UHFFFAOYSA-N 0.000 description 1
- GJNKQJAJXSUJBO-UHFFFAOYSA-N 9,10-diethoxyanthracene Chemical compound C1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 GJNKQJAJXSUJBO-UHFFFAOYSA-N 0.000 description 1
- LWRCGYDAUMSFSM-UHFFFAOYSA-N 9,10-dihexoxyanthracene Chemical compound C1=CC=C2C(OCCCCCC)=C(C=CC=C3)C3=C(OCCCCCC)C2=C1 LWRCGYDAUMSFSM-UHFFFAOYSA-N 0.000 description 1
- JWJMBKSFTTXMLL-UHFFFAOYSA-N 9,10-dimethoxyanthracene Chemical compound C1=CC=C2C(OC)=C(C=CC=C3)C3=C(OC)C2=C1 JWJMBKSFTTXMLL-UHFFFAOYSA-N 0.000 description 1
- JELGMNFSBVSQRB-UHFFFAOYSA-N 9,10-dipentoxyanthracene Chemical compound C1=CC=C2C(OCCCCC)=C(C=CC=C3)C3=C(OCCCCC)C2=C1 JELGMNFSBVSQRB-UHFFFAOYSA-N 0.000 description 1
- LBQJFQVDEJMUTF-UHFFFAOYSA-N 9,10-dipropoxyanthracene Chemical compound C1=CC=C2C(OCCC)=C(C=CC=C3)C3=C(OCCC)C2=C1 LBQJFQVDEJMUTF-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- AJDPRSJBHBDFOZ-UHFFFAOYSA-N C1CC2OC2(C)CC1(C(O)=O)CC1CC(C)(O2)C2CC1 Chemical compound C1CC2OC2(C)CC1(C(O)=O)CC1CC(C)(O2)C2CC1 AJDPRSJBHBDFOZ-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical group COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-O Thiophenium Chemical class [SH+]1C=CC=C1 YTPLMLYBLZKORZ-UHFFFAOYSA-O 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- SKEKWDDNGCWASM-UHFFFAOYSA-N [2-(ethenoxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCCC1COC=C SKEKWDDNGCWASM-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- NIYNIOYNNFXGFN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound OCC1CCC(CO)CC1.C1C(C(=O)O)CCC2OC21.C1C(C(=O)O)CCC2OC21 NIYNIOYNNFXGFN-UHFFFAOYSA-N 0.000 description 1
- DQMGZCOKSYOUNY-UHFFFAOYSA-N [O].C1=CC=CC2=CC3=CC=CC=C3C=C21 Chemical compound [O].C1=CC=CC2=CC3=CC=CC=C3C=C21 DQMGZCOKSYOUNY-UHFFFAOYSA-N 0.000 description 1
- NOKSMMGULAYSTD-UHFFFAOYSA-N [SiH4].N=C=O Chemical class [SiH4].N=C=O NOKSMMGULAYSTD-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- NQFUSWIGRKFAHK-BDNRQGISSA-N alpha-Pinene epoxide Natural products C([C@@H]1O[C@@]11C)[C@@H]2C(C)(C)[C@H]1C2 NQFUSWIGRKFAHK-BDNRQGISSA-N 0.000 description 1
- 229930006723 alpha-pinene oxide Natural products 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000009435 amidation Effects 0.000 description 1
- 238000007112 amidation reaction Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- WGQKYBSKWIADBV-UHFFFAOYSA-O benzylaminium Chemical class [NH3+]CC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-O 0.000 description 1
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000005997 bromomethyl group Chemical group 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000004063 butyryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- MIOPJNTWMNEORI-UHFFFAOYSA-N camphorsulfonic acid Chemical compound C1CC2(CS(O)(=O)=O)C(=O)CC1C2(C)C MIOPJNTWMNEORI-UHFFFAOYSA-N 0.000 description 1
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- NLUNLVTVUDIHFE-UHFFFAOYSA-N cyclooctylcyclooctane Chemical group C1CCCCCCC1C1CCCCCCC1 NLUNLVTVUDIHFE-UHFFFAOYSA-N 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- WPCPXPTZTOMGRF-UHFFFAOYSA-K di(butanoyloxy)alumanyl butanoate Chemical compound [Al+3].CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O WPCPXPTZTOMGRF-UHFFFAOYSA-K 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 125000004772 dichloromethyl group Chemical group [H]C(Cl)(Cl)* 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- UWGJCHRFALXDAR-UHFFFAOYSA-N diethoxy-ethyl-methylsilane Chemical compound CCO[Si](C)(CC)OCC UWGJCHRFALXDAR-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 125000006001 difluoroethyl group Chemical group 0.000 description 1
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- IFDFMWBBLAUYIW-UHFFFAOYSA-N ethane-1,2-diol;ethyl acetate Chemical compound OCCO.CCOC(C)=O IFDFMWBBLAUYIW-UHFFFAOYSA-N 0.000 description 1
- DRIIOWCRDBYORK-UHFFFAOYSA-N ethane-1,2-diol;methyl acetate Chemical compound OCCO.COC(C)=O DRIIOWCRDBYORK-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- HTSRFYSEWIPFNI-UHFFFAOYSA-N ethyl-dimethoxy-methylsilane Chemical compound CC[Si](C)(OC)OC HTSRFYSEWIPFNI-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000005817 fluorobutyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000006343 heptafluoro propyl group Chemical group 0.000 description 1
- NOVHEGOWZNFVGT-UHFFFAOYSA-N hydrazine Chemical class NN.NN NOVHEGOWZNFVGT-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000007037 hydroformylation reaction Methods 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- DAHJEWYONHAKHX-UHFFFAOYSA-N iron;thiolane Chemical compound [Fe].C1CCSC1 DAHJEWYONHAKHX-UHFFFAOYSA-N 0.000 description 1
- 229960004592 isopropanol Drugs 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- RWGFKTVRMDUZSP-UHFFFAOYSA-N isopropyl-benzene Natural products CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 1
- 125000005928 isopropyloxycarbonyl group Chemical group [H]C([H])([H])C([H])(OC(*)=O)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 125000004092 methylthiomethyl group Chemical group [H]C([H])([H])SC([H])([H])* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- IIGMITQLXAGZTL-UHFFFAOYSA-N octyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCC IIGMITQLXAGZTL-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Chemical compound [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000006239 protecting group Chemical group 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-O thiolan-1-ium Chemical compound C1CC[SH+]C1 RAOIDOHSFRTOEL-UHFFFAOYSA-O 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 125000006000 trichloroethyl group Chemical group 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
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- C08K5/00—Use of organic ingredients
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- C08K5/10—Esters; Ether-esters
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- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
Abstract
本發明係提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。 The present invention provides a curable composition having a high glass transition temperature and excellent adhesion, a method for producing the cured product, and the cured product.
本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)15~90質量份、陽離子聚合起始劑(B)1~10質量份、自由基聚合性成分(C)10~50質量份、自由基聚合起始劑(D)1~10質量份及選自由下述式(I)
Description
本發明係有關硬化性組成物、硬化物之製造方法及其硬化物,詳細為有關硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。 The present invention relates to a curable composition, a method for producing a cured product, and a cured product thereof, and specifically relates to a curable composition having a high glass transition temperature and excellent adhesion, a method for producing a cured product, and a cured product thereof.
硬化性組成物係使用於油墨、塗料、各種塗覆劑、接著劑、光學構件等的領域。關於這種硬化性組成物之改良,有各種的報告。 Curable compositions are used in the fields of inks, paints, various coating agents, adhesives, optical members, etc. Various reports have been made on the improvement of such curable compositions.
例如下述專利文獻1~3中提案含有陽離子聚合性成分及自由基聚合性成分之能量線硬化性組成物及其硬化物。具體而言,專利文獻1中,提案初期硬化性及接著性優異的偏光板用接著劑組成物。又,專利文獻2中,提案即使以透濕度低之樹脂薄膜作為保護膜時,光照射後,也能快速展現接著力,且對於各種力,經過一定時間後之接著力為良好,耐久試驗後亦不產生問題,耐濕熱試驗結束後之接著力亦良好之低黏度的光硬化性接著劑。此外,專利文獻3中,提案含有不飽和脂環式環氧酯化合物之可兼具高耐熱性或高折射率化與透明性的活性能量線聚合性 樹脂組成物。 For example, the following Patent Documents 1 to 3 propose energy ray-curable compositions containing cationically polymerizable components and radically polymerizable components, and cured products thereof. Specifically, Patent Document 1 proposes an adhesive composition for polarizing plates excellent in initial curability and adhesiveness. In addition, in Patent Document 2, it is proposed that even when a resin film with low moisture permeability is used as a protective film, after light irradiation, the adhesive force can be quickly exhibited, and for various forces, the adhesive force after a certain period of time is good. After the durability test It is also a low-viscosity light-curing adhesive that does not cause problems and has good adhesion after the heat-and-humidity test. In addition, Patent Document 3 proposes an active energy ray polymerizable compound containing an unsaturated alicyclic epoxy ester compound that can achieve both high heat resistance or high refractive index and transparency. Resin composition.
專利文獻1:日本特開2014-105218號公報 Patent Document 1: Japanese Patent Laid-Open No. 2014-105218
專利文獻2:日本特開2015-040283號公報 Patent Document 2: Japanese Patent Laid-Open No. 2015-040283
專利文獻3:日本特開2015-168757號公報 Patent Document 3: Japanese Patent Laid-Open No. 2015-168757
但是,即使為專利文獻1~3所提案之硬化性組成物,對於硬化性及密著性,亦有不一定能夠滿足的情況,現狀為期望能夠高度兼具硬化性及密著性之新穎的硬化性組成物。 However, even the curable compositions proposed in Patent Documents 1 to 3 may not always be able to satisfy the curability and adhesiveness, and the present situation is that a novel composition capable of highly curable and adhesive properties is desired. hardening composition.
因此,本發明之目的為提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法、及其硬化物。 Therefore, an object of the present invention is to provide a curable composition having a high glass transition temperature and excellent adhesion, a method for producing a cured product, and a cured product thereof.
本發明人等為了解決上述課題而精心探討的結果,發現若為具有特定組成之硬化性組成物時,即可克服上述課題,而完成本發明。 As a result of earnest research to solve the above-mentioned problems, the inventors of the present invention found that the above-mentioned problems can be overcome if the curable composition has a specific composition, and completed the present invention.
亦即,本發明之硬化性組成物,其係含有:
陽離子聚合性成分(A)15~90質量份、陽離子聚合起始劑(B)1~10質量份、自由基聚合性成分(C)10~50質量份、自由基聚合起始劑(D)1~10質量份及選自由下述式(I)
本發明之硬化性組成物中,前述陽離子聚合性成分(A)進一步含有芳香族環氧化合物(A3)為佳。又,本發明之硬化性組成物中,前述芳香族環氧化合物(A3)為多官能芳香族環氧化合物為佳。此外,本發明之硬化性組成物中,前述聚合物(E)為由前述式(I)表示之單體及前述式(II)表示之單體所得的聚合物,前述式(I)中之X為碳原子數6~12之芳基,前述式(II)中之X’為碳原子數1~7之烷基,前述烷基經環氧基所取代為佳。 In the curable composition of the present invention, it is preferable that the cationically polymerizable component (A) further contains an aromatic epoxy compound (A3). Moreover, in the curable composition of this invention, it is preferable that the said aromatic epoxy compound (A3) is a polyfunctional aromatic epoxy compound. In addition, in the curable composition of the present invention, the aforementioned polymer (E) is a polymer obtained from a monomer represented by the aforementioned formula (I) and a monomer represented by the aforementioned formula (II), and in the aforementioned formula (I), X is an aryl group with 6 to 12 carbon atoms, X' in the aforementioned formula (II) is an alkyl group with 1 to 7 carbon atoms, and the aforementioned alkyl group is preferably substituted by an epoxy group.
本發明之硬化性組成物之製造方法,其係對本發明之硬化性組成物進行活性能量線照射,或進行加 熱。 The method for producing the curable composition of the present invention is to irradiate the curable composition of the present invention with active energy rays, or to hot.
本發明之硬化物,其係本發明之硬化性組成物的硬化物。 The cured product of the present invention is a cured product of the curable composition of the present invention.
依據本發明時,可提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。本發明之硬化性組成物,特別是可用於接著劑。 According to the present invention, it is possible to provide a curable composition having a high glass transition temperature and excellent adhesion, a method for producing a cured product, and a cured product thereof. The curable composition of the present invention can be used especially as an adhesive.
以下詳細說明本發明之硬化性組成物。 The curable composition of the present invention will be described in detail below.
本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)15~90質量份、陽離子聚合起始劑(B)1~10質量份、自由基聚合性成分(C)10~50質量份、自由基聚合起始劑(D)1~10質量份及選自由下述式(I)表示之單體所得之聚合物、由下述式(II)表示之單體所得之聚合物、選自前述式(I)表示之單體之二種以上之單體所得之聚合物、選自前述式(II)表示之單體之二種以上之單體所得之聚合物及由前述式(I)表示之單體及前述式(II)表示之單體所得之聚合物所成群之重量平均分子量1,000~30,000的聚合物(E)1~20質量份。 The curable composition of the present invention contains: 15 to 90 parts by mass of a cationic polymerizable component (A), 1 to 10 parts by mass of a cationic polymerization initiator (B), and 10 to 50 parts by mass of a radically polymerizable component (C). Parts by mass, 1 to 10 parts by mass of a radical polymerization initiator (D), and a polymer obtained from a monomer represented by the following formula (I), a polymer obtained from a monomer represented by the following formula (II) , a polymer obtained from two or more monomers selected from the monomers represented by the aforementioned formula (I), a polymer obtained from two or more monomers selected from the monomers represented by the aforementioned formula (II), and a polymer obtained by the aforementioned formula (II) 1 to 20 parts by mass of the polymer (E) having a weight average molecular weight of 1,000 to 30,000 and a polymer obtained from the monomer represented by (I) and the monomer represented by the aforementioned formula (II).
本發明之硬化性組成物中,前述陽離子聚合性成分(A)係以多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)及氧雜環丁烷化合物 (A2)為必須成分,且相對於陽離子聚合性成分(A)與自由基聚合性成分(C)與聚合物(E)之合計100質量份時,多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)為35~65質量份。又,自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)或碳原子數2~20的多元醇之丙烯酸酯或碳原子數2~20之多元醇的甲基丙烯酸酯(C2)為必須成分。 In the curable composition of the present invention, the aforementioned cationic polymerizable component (A) is a glycidyl compound of a polyol or a glycidyl compound of a polyalcohol alkylene oxide adduct (A1) and oxetane Alkanes (A2) is an essential component, and when the total of cationically polymerizable component (A), radically polymerizable component (C) and polymer (E) is 100 parts by mass, glycidyl compound of polyol or polyol The glycidyl compound (A1) of the alkylene oxide adduct is 35 to 65 parts by mass. In addition, the radically polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylate ester of a polyol with 2 to 20 carbon atoms or a polyol with 2 to 20 carbon atoms The methacrylate (C2) is an essential component.
在此,式(I)中,X為碳原子數1~7之烷基、碳原子數1~7之烷氧基、碳原子數6~12之芳基、碳原子數6~12之芳氧基或碳原子數6~10之脂環式烴基、或此等之基中之氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代者。 Here, in formula (I), X is an alkyl group with 1 to 7 carbon atoms, an alkoxy group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, or an aromatic group with 6 to 12 carbon atoms. Oxygen group or alicyclic hydrocarbon group with 6 to 10 carbon atoms, or a group in which the hydrogen atom in these groups is selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group and carboxyl group replaced by.
在此,式(II)中,R1表示氫原子、甲基或鹵素原子,X’為碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基、或此等之基中之氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上 之基所取代者。 Here, in formula (II), R 1 represents a hydrogen atom, a methyl group or a halogen atom, and X' is an alkyl group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, or an aryl group with 6 to 10 carbon atoms The alicyclic hydrocarbon group, or the hydrogen atom in these groups is substituted by one or more groups selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group and carboxyl group.
本發明之硬化性組成物的陽離子聚合性成分(A)係藉由以能量線照射或加熱活性化的陽離子聚合起始劑,產生高分子化或交聯反應的化合物。可列舉環氧化合物、氧雜環丁烷化合物、乙烯醚化合物等。 The cationic polymerizable component (A) of the curable composition of the present invention is a cationic polymerization initiator activated by energy ray irradiation or heating, and undergoes macromolecularization or crosslinking reaction. Examples thereof include epoxy compounds, oxetane compounds, vinyl ether compounds, and the like.
本發明之硬化性組成物的陽離子聚合性成分(A)係以多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)及氧雜環丁烷化合物(A2)作為必須成分,但是也可使用其他的環氧化合物,例如芳香族環氧化合物(A3)及脂環式環氧化合物(A4)等。 The cationic polymerizable component (A) of the curable composition of the present invention is a glycidyl compound of a polyol or a glycidyl compound (A1) of an alkylene oxide adduct of a polyol and an oxetane compound (A2) is an essential component, but other epoxy compounds such as aromatic epoxy compounds (A3) and alicyclic epoxy compounds (A4) can also be used.
上述多元醇之環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉將多元醇或多元醇環氧烷加成物進行環氧丙基化者,且環氧丙基化物的分子量為250以上者為佳。 Glycidylated products of the above-mentioned polyols or glycidated products (A1) of polyol alkylene oxide adducts include those obtained by glycidylating polyhydric alcohols or polyol alkylene oxide adducts , and the molecular weight of the glycidyl compound is preferably 250 or more.
上述多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉1,4-丁二醇二環氧丙醚、1,6-己二醇二環氧丙醚、新戊二醇二環氧丙醚、丙三醇之三環氧丙醚、三羥甲基丙烷之三環氧丙醚、山梨醣醇之四環氧丙醚、二季戊四醇之六環氧丙醚、聚乙二醇之二環氧丙醚、聚丙二醇之二環氧丙醚、二環戊二烯二甲醇二環氧丙醚等之多元醇之環氧丙醚,及藉由將1種或2種以上之環氧烷與丙二醇、三羥甲基丙烷、丙三醇等之脂肪族多元醇進行加成所得之聚醚多元醇的聚環氧丙醚化物、脂肪族長鏈二元酸之二環氧丙酯。 Glycidylated products of the above-mentioned polyols or glycidated products (A1) of polyol alkylene oxide adducts include 1,4-butanediol diglycidyl ether, 1,6-hexanediol Diglycidyl Ether, Neopentyl Glycol Diglycidyl Ether, Triglycidyl Ether of Glycerol, Triglycidyl Ether of Trimethylolpropane, Tetraglycidyl Ether of Sorbitol, Dipentaerythritol Hexaglycidyl ether, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, glycidyl ether of polyols such as dicyclopentadiene dimethanol diglycidyl ether, and Polyglycidyl ether compounds of polyether polyols, aliphatic long Diglycidyl ester of chain dibasic acid.
多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1),進一步可列舉脂肪族高級醇之單環氧丙醚或高級脂肪酸之環氧丙基酯、環氧化大豆油、環氧基硬脂酸辛酯、環氧基硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。 Glycidyl compounds of polyols or glycidyl compounds (A1) of alkylene oxide adducts of polyols, further examples include monoglycidyl ethers of aliphatic higher alcohols or glycidyl esters of higher fatty acids, Epoxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized soybean oil, epoxidized polybutadiene, etc.
多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)係含有飽和縮合環者,可提高硬化物之硬化性及密著性,故較佳。 The glycidyl compound of polyol or the glycidyl compound of polyol alkylene oxide adduct (A1) contains a saturated condensed ring, which can improve the curability and adhesiveness of the cured product, so it is preferable.
上述多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)可使用市售品,可列舉例如Denacol EX-121、Denacol EX-171、Denacol EX-192、Denacol EX-211、Denacol EX-212、Denacol EX-313、Denacol EX-314、Denacol EX-321、Denacol EX-411、Denacol EX-421、Dcnacol EX-512、Denacol EX-521、Denacol EX-611、Denacol EX-612、Denacol EX-614、Denacol EX-622、Denacol EX-810、Denacol EX-811、Denacol EX-850、Denacol EX-851、Denacol EX-821、Denacol EX-830、Denacol EX-832、Denacol EX-841、Denacol EX-861、Denacol EX-911、Denacol EX-941、Denacol EX-920、Denacol EX-931(nagase chemtex(股)公司製);EpoliteM-1230、Epolite40E、Epolite100E、Epolite200E、Epolite400E、Epolite70P、Epolite200P、Epolite400P、Epolite1500NP、Epolite1600、Epolite80MF、Epolite100MF(共榮社化學(股)公司 製)、ADEKA GLYCIROLED-503、ADEKA GLYCIROLED-503G、ADEKA GLYCIROLED-506、ADEKA GLYCIROLED-523T、ADEKA Resin-4088S、ADEKA Resin-4080E((股)ADEKA公司製)等。 As the glycidyl compound of the above-mentioned polyhydric alcohol or the glycidyl compound (A1) of the polyol alkylene oxide adduct, a commercially available product can be used, for example, Denacol EX-121, Denacol EX-171, Denacol EX-192 , Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Dcnacol EX-512, Denacol EX-521, Denacol EX-611 , Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832 , Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagase Chemtex Co., Ltd.); EpoliteM-1230, Epolite40E, Epolite100E, Epolite200E, Epolite400E, Epolite70P, Epolite200P, Epolite400P, Epolite1500NP, Epolite1600, Epolite80MF, Epolite100MF (Kyoeisha Chemical Co., Ltd. manufactured), ADEKA GLYCIROLED-503, ADEKA GLYCIROLED-503G, ADEKA GLYCIROLED-506, ADEKA GLYCIROLED-523T, ADEKA Resin-4088S, ADEKA Resin-4080E (manufactured by ADEKA Corporation), etc.
上述氧雜環丁烷化合物(A2)可列舉3,7-雙(3-氧環丁基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧環丁基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧環丁基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧環丁基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧環丁基甲基)醚、1,4-雙(3-乙基-3-氧環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧環丁基甲氧基)己烷等之二官能脂肪族氧雜環丁烷化合物、3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、3-乙基-3-(氯甲基)氧雜環丁烷等之一官能氧雜環丁烷化合物等。此等可1種單獨使用或組合2種以上使用。特別是多官能氧雜環丁烷化合物,提高硬化物之硬化性及密著性,故較佳。 The aforementioned oxetane compound (A2) includes 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,4-bis[(3-ethyl-3-oxocyclo Butylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxocyclobutylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxo Cyclobutylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxocyclobutylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxocyclobutylmethyl)ether, tetra Ethylene glycol bis(3-ethyl-3-oxocyclobutylmethyl)ether, 1,4-bis(3-ethyl-3-oxocyclobutylmethoxy)butane, 1,6-bis(3-ethyl Difunctional aliphatic oxetane compounds such as -3-oxetanylmethoxy)hexane, 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethane Base-3-(hexyloxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxy A functional oxetane compound, etc., which is one of methyl)oxetane, 3-ethyl-3-(chloromethyl)oxetane, and the like. These can be used individually by 1 type or in combination of 2 or more types. In particular, polyfunctional oxetane compounds are preferred because they improve the curability and adhesion of cured products.
上述氧雜環丁烷化合物(A2)可使用市售品,可列舉例如2-羥基乙基乙烯醚、二乙二醇單乙烯醚、4-羥基丁基乙烯醚(丸善石油化學(股)公司製);ARON OXETANEOXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成(股) 公司製)、ETERNACOLL OXBP、OXTP(宇部興產(股)公司製)等。 The above-mentioned oxetane compound (A2) can be a commercially available product, for example, 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, 4-hydroxybutyl vinyl ether (Maruzen Petrochemical Co., Ltd. system); ARON OXETANEOXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (Dong Yasei (stock) Company system), ETERNACOLL OXBP, OXTP (Ube Industries Co., Ltd. system), etc.
上述芳香族環氧化合物(A3)係指含有芳香環的環氧化合物,而芳香族環氧化合物(A3)之具體例,可列舉酚、甲酚、丁酚等具有至少1個芳香族環的多元酚或其環氧烷加成物之單/聚環氧丙醚化物,可列舉例如雙酚A、雙酚F、或此等再加成有環氧烷之化合物之環氧丙醚化物或環氧基酚醛清漆樹脂;間苯二酚或氫醌、兒茶酚等之具有2個以上之酚性羥基的芳香族化合物之單/聚環氧丙醚化物;苯基二甲醇或苯基二乙醇、苯基二丁醇等之具有2個以上之醇性羥基之芳香族化合物之環氧丙醚化物;鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等之具有2個以上之羧酸的多元酸芳香族化合物之環氧丙酯、苯甲酸之環氧丙酯、苯乙烯氧化物或二乙烯基苯之環氧化物等。 The above-mentioned aromatic epoxy compound (A3) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound (A3) include those having at least one aromatic ring such as phenol, cresol, and butylphenol. Mono/polyglycidyl ether compounds of polyphenols or their alkylene oxide adducts, such as bisphenol A, bisphenol F, or glycidyl ether compounds of these compounds added with alkylene oxide or Epoxy novolak resins; mono/polyglycidyl ether compounds of aromatic compounds having two or more phenolic hydroxyl groups such as resorcinol or hydroquinone or catechol; phenyldimethanol or phenyldimethanol Glycidyl ether compounds of aromatic compounds having two or more alcoholic hydroxyl groups, such as ethanol and phenyldibutanol; phthalic acid, terephthalic acid, trimellitic acid, etc., having two or more carboxyl groups Glycidyl ester of polybasic acid aromatic compound of acid, glycidyl ester of benzoic acid, styrene oxide or epoxide of divinylbenzene, etc.
上述芳香族環氧化合物(A3)可使用市售品,可列舉例如Denacol EX-146、Denacol EX-147、Denacol EX-201、Denacol EX-203、Denacol EX-711、Denacol EX-721、Oncoat EX-1020、Oncoat EX-1030、Oncoat EX-1040、Oncoat EX-1050、Oncoat EX-1051、Oncoat EX-1010、Oncoat EX-1011、Oncoat1012(nagase chemtex(股)公司製);OGSOLPG-100、OGSOLEG-200、OGSOLEG-210、OGSOLEG-250(大阪氣體化學(股)公司製);HP4032、HP4032D、HP4700(DIC(股)公司製);ESN-475V(新日鐵住金化學(股)公 司製);EpikoteYX8800(三菱化學(股)公司製);Marproof G-0105SA、Marproof G-0130SP(日油(股)公司製);EPICLONN-665、EPICLONHP-7200(DIC(股)公司製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-7000L(日本化藥(股)公司製);ADEKA ResinEP-4000、ADEKA ResinEP-4005、ADEKA ResinEP-4100、ADEKA ResinEP-4901((股)ADEKA公司製);TECHMORE VG-3101L((股)Printec公司製)等。上述芳香族環氧化合物(A3)中,多官能者因硬化性優異,故較佳。 Commercially available products can be used for the above-mentioned aromatic epoxy compound (A3), for example, Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX -1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat1012 (manufactured by Nagase Chemtex Co., Ltd.); OGSOLPG-100, OGSOLEG- 200, OGSOLEG-210, OGSOLEG-250 (manufactured by Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700 (manufactured by DIC Co., Ltd.); Division system); EpikoteYX8800 (Mitsubishi Chemical Corporation); Marproof G-0105SA, Marproof G-0130SP (NOF Corporation); EPICLONN-665, EPICLONNHP-7200 (DIC Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (Nippon Kayaku Co., Ltd.); ADEKA ResinEP-4000, ADEKA ResinEP-4005, ADEKA ResinEP-4100, ADEKA ResinEP-4901 (manufactured by ADEKA Corporation); TECHMORE VG-3101L (manufactured by Printec Corporation) and the like. Among the above-mentioned aromatic epoxy compounds (A3), polyfunctional ones are preferred because they are excellent in curability.
上述脂環式環氧化合物(A4)係指環氧乙烷環不經由鍵結基而直接鍵結於飽和環者。脂環式環氧化合物(A4)之具體例,可列舉藉由將具有至少1個脂環式環之多元醇的聚環氧丙醚化物或含有環己烯或環戊烯環之化合物以氧化劑進行環氧化所得的含有環己烯氧化物或環戊烯氧化物的化合物。可列舉例如3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯、6-甲基-3,4-環氧基環己基甲基-6-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-3-甲基環己基甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧基環己烷)、丙烷- 2,2-二基-雙(3,4-環氧基環己烷)、2,2-雙(3,4-環氧基環己基)丙烷、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷羧酸酯)、環氧基六氫鄰苯二甲酸二辛酯、環氧基六氫鄰苯二甲酸二-2-乙基己酯、1-環氧基乙基-3,4-環氧基環己烷、1,2-環氧基-2-環氧基乙基環己烷、α-蒎烯氧化物、檸檬烯二氧化物等。脂環式環氧化合物(A4)從提高密著性的觀點,較佳為3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯或3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯。 The above-mentioned alicyclic epoxy compound (A4) means that an oxirane ring is directly bonded to a saturated ring without a bonding group. Specific examples of the alicyclic epoxy compound (A4) include polyglycidyl ether compounds of polyhydric alcohols having at least one alicyclic ring or compounds containing cyclohexene or cyclopentene rings as oxidizing agents. A compound containing cyclohexene oxide or cyclopentene oxide obtained by epoxidation. Examples include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy Base-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexylcarboxylate, 3, 4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl -3,4-epoxy-5-methylcyclohexanecarboxylate, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methyl Cyclohexane carboxylate, methylenebis(3,4-epoxycyclohexane), propane- 2,2-diyl-bis(3,4-epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, Ethylbis(3,4-epoxycyclohexanecarboxylate), Dioctyl epoxyhexahydrophthalate, Di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxyethylcyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide, etc. . The alicyclic epoxy compound (A4) is preferably 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate or 3,4- Epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate.
上述脂環式環氧化合物(A4)可使用市售品,可列舉例如CELLOXID 2021P、CELLOXID 2081、CELLOXID 2000、CELLOXID 3000((股)DAICEL公司製)等。 A commercial item can be used for the said alicyclic epoxy compound (A4), For example, CELLOXID 2021P, CELLOXID 2081, CELLOXID 2000, CELLOXID 3000 (made by (stock) DAICEL company) etc. are mentioned.
上述乙烯醚化合物,可列舉例如二乙二醇單乙烯醚、三乙二醇二乙烯醚、n-十二烷基乙烯醚、環己基乙烯醚、2-乙基己基乙烯醚、2-氯乙基乙烯醚、乙基乙烯醚、異丁基乙烯醚、三乙二醇乙烯醚、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、1,6-環己烷二甲醇單乙烯醚、乙二醇二乙烯醚、1,4-丁二醇二乙烯醚、1,6-環己烷二甲醇二乙烯醚等。 The aforementioned vinyl ether compounds include, for example, diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, Ethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether , Ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether, etc.
上述陽離子聚合性成分(A)中,上述多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)、氧雜環丁烷化合物(A2)、芳香族環氧化合物(A3)、脂環式環氧化合物(A4)及乙烯醚化合物之使 用比例係相對於陽離子聚合性成分(A)與自由基聚合性成分(C)與聚合物(E)之合計為100質量份時,多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)50~90質量份、氧雜環丁烷化合物(A2)10~50質量份、芳香族環氧化合物(A3)0~50質量份、脂環式環氧化合物(A4)0~30質量份、乙烯醚化合物0~20質量份時,可提高黏度、塗佈性、反應性及硬化性,故較佳。 Among the above-mentioned cationically polymerizable components (A), the above-mentioned glycidyl compound of the polyol or the glycidyl compound of the polyalcohol alkylene oxide adduct (A1), the oxetane compound (A2), the aromatic Epoxy compound (A3), alicyclic epoxy compound (A4) and vinyl ether compound When the ratio is 100 parts by mass of the total of cationically polymerizable component (A), radically polymerizable component (C) and polymer (E), glycidyl compound of polyol or polyol alkylene oxide 50-90 parts by mass of glycidyl compound (A1), 10-50 parts by mass of oxetane compound (A2), 0-50 parts by mass of aromatic epoxy compound (A3), alicyclic ring When the oxygen compound (A4) is 0 to 30 parts by mass and the vinyl ether compound is 0 to 20 parts by mass, it is preferable because the viscosity, coatability, reactivity, and curability can be improved.
本發明之硬化性組成物的陽離子聚合起始劑(B)係指藉由能量線照射或加熱可釋放使陽離子聚合開始之物質的化合物時,皆可使用,較佳為藉由能量線照射釋放出路易斯酸之鎓鹽的複鹽或其衍生物。此化合物之代表性者,可列舉下述通式、[A]r+[B]r-表示之陽離子與陰離子的鹽。 The cationic polymerization initiator (B) of the curable composition of the present invention refers to a compound that can release a substance that initiates cationic polymerization by energy ray irradiation or heating, and can be used when it is released by energy ray irradiation. Double salts of onium salts of Lewis acids or their derivatives. Representative examples of this compound include salts of cations and anions represented by the following general formula, [A] r+ [B] r- .
此處,陽離子[A]r+較佳為鎓類,其構造例如可以下述通式[(R2)aQ]r+表示。 Here, the cation [A] r+ is preferably onium, and its structure can be represented by the following general formula [(R 2 ) a Q] r+ , for example.
再者,此處,R2係碳原子數為1~60,也可含有幾個碳原子以外之原子的有機基。a為1~5之整數。a個之R2可各自獨立為相同或相異。又,至少1個為具有芳香環之如上述的有機基較佳。Q為選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成群之原子或 原子團。又,陽離子[A]r+中之Q的原子價為q時,r=a-q之關係(惟,N=N視為原子價0)必須成立。 Furthermore, here, R 2 is an organic group having 1 to 60 carbon atoms and may contain atoms other than several carbon atoms. a is an integer from 1 to 5. a R 2 can be independently the same or different. Moreover, it is preferable that at least one is the above-mentioned organic group which has an aromatic ring. Q is an atom or an atom group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N=N. Also, when the atomic valence of Q in the cation [A] r+ is q, the relationship of r=aq (but N=N is regarded as atomic valence 0) must be established.
又,陰離子[B]r-較佳為鹵化物錯合物,其構造例如可以下述通式[LYb]r-表示。 Also, the anion [B] r- is preferably a halide complex, and its structure can be represented by the following general formula [LY b ] r- , for example.
此外,在此,L為鹵化物錯合物之中心原子的金屬或半金屬(Metalloid),其係B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y為鹵素原子。b為3~7之整數。又,陰離子[B]r-中之L的原子價當作p時,r=b-p之關係必須成立。 In addition, here, L is the metal or semimetal (Metalloid) of the central atom of the halide complex, which is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co, etc. Y is a halogen atom. b is an integer from 3 to 7. Also, when the atomic valence of L in the anion [B] r- is taken as p, the relationship of r=bp must be established.
上述通式之陰離子[LYb]r-的具體例,可列舉肆(五氟苯基)硼酸根、四(3,5-二氟-4-甲氧基苯基)硼酸根、四氟硼酸根(BF4)-、六氟磷酸根(PF6)-、六氟銻酸根(SbF6)-、六氟砷酸根(AsF6)-、六氯銻酸根(SbCl6)-等。 Specific examples of the anion [LY b ] r- of the above general formula include tetrakis (pentafluorophenyl) borate, tetrakis (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroboric acid (BF 4 ) - , hexafluorophosphate (PF 6 ) - , hexafluoroantimonate (SbF 6 ) - , hexafluoroarsenate (AsF 6 ) - , hexachloroantimonate (SbCl 6 ) - and so on.
又,陰離子[B]r-亦可使用下述通式[LYb-1(OH)]r-表示之構造者。L、Y、b係與上述相同。又,其他可使用之陰離子,可列舉過氯酸離子(ClO4)-、三氟甲基亞硫酸離子(CF3SO3)-、氟磺酸離子(FSO3)-、甲苯磺酸陰離子、三硝基苯磺酸陰離子、樟腦磺酸根、九氟丁烷磺酸根、十六氟辛烷磺酸根、四芳基硼酸根、肆(五氟苯基)硼酸根等。 Also, as the anion [B] r-, a structure represented by the following general formula [LY b-1 (OH)] r- can also be used. The L, Y, and b systems are the same as above. In addition, other usable anions include perchlorate ion (ClO 4 ) - , trifluoromethylsulfite ion (CF 3 SO 3 ) - , fluorosulfonate ion (FSO 3 ) - , toluenesulfonate anion, Trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate, tetrakis(pentafluorophenyl)borate, etc.
本發明之硬化性組成物中,如此鎓鹽之中, 以使用下述(甲)~(丙)之芳香族鎓鹽特別有效。可由此等之中以1種單獨使用或混合2種以上使用。 In the curable composition of the present invention, among such onium salts, It is especially effective to use the following aromatic onium salts (A)~(C). Among these, 1 type can be used individually or 2 or more types can be mixed and used.
(甲)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等之芳基重氮鎓鹽 (A) Aryldiazonium salts of phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate, etc.
(乙)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-tert-丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪肆(五氟苯基)硼酸鹽等之二芳基錪鹽 (B) Diphenyliodonium hexafluoroantimonate, bis(4-methylphenyl)iodonium hexafluorophosphate, bis(4-tert-butylphenyl)iodonium hexafluorophosphate, tolyl cumene Diaryliodonium salts such as yliodonium(pentafluorophenyl)borate
(丙)下述群I或群II表示之鋶陽離子與六氟銻離子、六氟磷酸根離子、肆(五氟苯基)硼酸根離子等之鋶鹽 (C) Percilium salts of the following group I or II borate cations and hexafluoroantimony ions, hexafluorophosphate ions, tetrakis(pentafluorophenyl)borate ions, etc.
又,其他較佳者可列舉(η5-2,4-環戊二烯-1-基)[(1,2,3,4,5,6-η)-(1-甲基乙基)苯]-鐵-六氟磷酸鹽等之鐵-芳烴錯合物、或參(乙醯丙酮)鋁、參(乙醯乙酸乙酯)鋁、參(水楊醛)鋁等之鋁錯合物與三苯基矽烷醇等之矽烷醇類的混合物;噻吩鎓鹽、四氫噻吩鐵鹽(thiolanium)、苄基銨、吡啶鎓鹽、鉼鹽(hydrazinium)等之鹽;二乙烯三胺、三乙烯三胺、四乙烯五胺等之聚烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛爾酮二胺等之脂環式多胺類;m-苯二甲胺、二胺基二苯基甲烷、二胺基二苯基碸等之芳香族多胺類;藉由一般方法使上述多胺類與苯基環氧丙醚、丁基環氧丙醚 、雙酚A-二環氧丙醚、雙酚F-二環氧丙醚等之環氧丙醚類或羧酸之環氧丙酯類等的各種環氧樹脂反應所製造的聚環氧基加成改質物;藉由一般方法使上述有機多胺類與鄰苯二甲酸、間苯二甲酸、二聚酸等之羧酸類反應所製造的醯胺化改質物;藉由一般方法使上述多胺類與甲醛等之醛類及酚、甲酚、二甲酚、第三丁基酚、間苯二酚等之於核具有至少一個醛化反應性場所的酚類反應所製造的曼尼希(Mannich)化改質物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、二聚酸等之脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等之芳香族二羧酸類;環己烷二羧酸等之脂環式二羧酸類;偏苯三甲酸、均苯三甲酸(Trimesic Acid)、蓖麻油脂肪酸之三聚物等之三羧酸類;均苯四酸等之四羧酸類等)之酸酐;雙氰胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。 Also, other preferred ones include (η 5 -2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl) Iron-arene complexes of benzene]-iron-hexafluorophosphate, etc., or aluminum complexes of ginseng (acetylacetone) aluminum, ginseng (ethyl acetate) aluminum, ginseng (salicylaldehyde) aluminum, etc. Mixtures with silanols such as triphenylsilanol; salts of thiophenium salt, tetrahydrothiophene iron salt (thiolanium), benzyl ammonium, pyridinium salt, hydrazinium salt (hydrazinium) and other salts; diethylenetriamine, three Polyalkylpolyamines such as ethylenetriamine and tetraethylenepentamine; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophor Alicyclic polyamines such as ketone diamine; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane, diaminodiphenylmethane, etc.; making the above polyamines by general methods Glycidyl ethers such as phenylglycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether, etc., or glycidyl esters of carboxylic acids The polyepoxy addition modification produced by reacting various epoxy resins such as phthalates; the reaction of the above-mentioned organic polyamines with carboxylic acids such as phthalic acid, isophthalic acid, and dimer acid by a general method The manufactured amidation modified substance; the above-mentioned polyamines and aldehydes such as formaldehyde and phenols, cresols, xylenols, tertiary butylphenols, resorcinols, etc. have at least one core Mannich-modified substances produced by phenolic reactions in the reactive sites of hydroformylation; polycarboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid , azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylglutaric acid, 2-methyl Suberic acid, 3,8-dimethylsebacic acid, 3,7-dimethylsebacic acid, hydrogenated dimer acid, aliphatic dicarboxylic acids such as dimer acid; phthalic acid, terephthalic acid Aromatic dicarboxylic acids such as formic acid, isophthalic acid, and naphthalene dicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; trimellitic acid, trimesic acid, castor oil Tricarboxylic acids such as trimers of fatty acids; anhydrides of tetracarboxylic acids such as pyromellitic acid); dicyandiamide, imidazoles, carboxylates, sulfonates, amidoimides, etc.
此等之中,就實用面與提高光感度的觀點,使用芳香族錪鹽、芳香族鋶鹽、鐵-芳烴錯合物為佳;相對於陽離子聚合起始劑(B)100質量%,又更佳為含有至少0.1質量%以上之具有下述構造之芳香族鋶鹽。 Among these, from the viewpoint of practicality and improvement of photosensitivity, it is preferable to use aromatic iodonium salts, aromatic permeic acid salts, and iron-aromatic complexes; More preferably, it contains at least 0.1% by mass of an aromatic percited salt having the following structure.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19及R20各自獨立地表示氫原子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R21、R22、R23及R24各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基,R25表示氫原子、鹵素原子、碳原子數1~10之烷基或選自下述化學式(A)~(C)中的任一取代基,Anq-表示q價的陰離子,p表示使電荷為中性的係數。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 each independently represent a hydrogen atom, a halogen atom, a carbon number of 1~ An alkyl group of 10, an alkoxy group with 1 to 10 carbon atoms, or an ester group with 2 to 10 carbon atoms, R 21 , R 22 , R 23 and R 24 each independently represent a hydrogen atom, a halogen atom or a carbon atom number An alkyl group of 1~10, R25 represents a hydrogen atom, a halogen atom, an alkyl group with 1~10 carbon atoms or any substituent selected from the following chemical formulas (A)~(C), An q- represents q Valence of anion, p represents the coefficient to make the charge neutral.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39各自獨立地表示氫原子、鹵 素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R30、R31、R32、R33及R34各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkyl group having 1 to 10 carbon atoms An alkoxy group or an ester group with 2 to 10 carbon atoms, R 30 , R 31 , R 32 , R 33 and R 34 each independently represent a hydrogen atom, a halogen atom or an alkyl group with 1 to 10 carbon atoms.
上述通式表示之化合物中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之鹵素原子,可列舉氟、氯、溴、碘等。 Among the compounds represented by the above general formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , The halogen atoms represented by R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 may be Examples thereof include fluorine, chlorine, bromine, iodine and the like.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之碳原子數1~10之烷基,可列舉甲基、乙基、丙基、異丙基、丁基、s-丁基、t-丁基、異丁基、戊基、異戊基、t-戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧基乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、t-丁硫基甲基、4-戊烯氧基甲基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫乙基、三甲基甲矽烷基乙基、t-丁基二甲基甲矽烷氧基甲基、2-(三甲基甲矽烷基)乙氧基甲基、t-丁氧基羰基甲基、乙氧基羰基甲基、乙基羰基甲基、t-丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥基甲基、2-羥基乙基、1-羥基乙基、2-羥基丙基、3-羥基丙基、3-羥基丁基、4-羥基丁基、1,2-二羥基乙基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkyl groups with 1 to 10 carbon atoms, including Methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, pentyl, isopentyl, t-pentyl, hexyl, cyclohexyl, heptyl, Octyl, Nonyl, Ethyloctyl, 2-Methoxyethyl, 3-Methoxypropyl, 4-Methoxybutyl, 2-Butoxyethyl, Methoxyethoxyethyl methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoromethyl, trifluoromethyl, chloromethyl, dichloro Methyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nine Fluorobutyl, decafluoropentyl, tridecafluorohexyl, pentafluoroheptyl, heptadecafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, methoxy ethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4-pentenyloxymethyl, trichloroethoxymethyl, Bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1-methyl-1-methoxyethyl, ethyldithioethyl , trimethylsilylethyl, t-butyldimethylsilyloxymethyl, 2-(trimethylsilyl)ethoxymethyl, t-butoxycarbonylmethyl, ethyl Oxycarbonylmethyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, acryloxyethyl, methacryloxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl radical, acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxy Butyl, 4-hydroxybutyl, 1,2-dihydroxyethyl, etc.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數1~10之烷氧基,可列舉甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、s-丁氧基、t-丁氧基、異丁氧基、戊氧基、異戊氧基、t-戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲硫基乙氧基、三氟甲氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkoxy groups with 1 to 10 carbon atoms, including methoxy, ethoxy, propoxy, isopropoxy, Butoxy, s-butoxy, t-butoxy, isobutoxy, pentyloxy, isopentyloxy, t-pentyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethoxy , tetrahydrofuranoxy, tetrahydropyranyloxy, 2-methoxyethoxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethoxy, methoxy ethoxyethoxy, methoxyethoxyethoxyethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy, etc.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數2~10之酯基,可列舉甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯 乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、t-丁基羰氧基、甲氧基乙醯氧基、苯甲醯氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent ester groups with 2 to 10 carbon atoms, including methoxycarbonyl, ethoxycarbonyl, isopropoxycarbonyl, phenoxy ylcarbonyl, acetyloxy, propionyloxy, butyryloxy, chloroacetyloxy, dichloroacetyloxy, trichloroacetyloxy, trifluoroacetyloxy, t-butylcarbonyl Oxygen, methoxyacetyloxy, benzoyloxy, etc.
本發明之硬化性組成物的自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)或碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2)為必須成分。 The free radical polymerizable component (C) of the curable composition of the present invention is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylate ester of an alcohol with 2 to 20 carbon atoms or an acrylate with 2 carbon atoms. ~20 alcohol methacrylate (C2) is an essential ingredient.
上述具有環氧基及乙烯性不飽和基的化合物(C1),可列舉例如環氧基丙烯酸酯或環氧基甲基丙烯酸酯,具體而言,使以往公知之芳香族環氧樹脂、脂環式環氧樹脂、脂肪族環氧樹脂等與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯。此等之環氧基丙烯酸酯或環氧基甲基丙烯酸酯之中,特佳為醇類之環氧丙醚的丙烯酸酯或甲基丙烯酸酯。 The above-mentioned compound (C1) having an epoxy group and an ethylenically unsaturated group includes, for example, epoxy acrylate or epoxy methacrylate. Specifically, conventionally known aromatic epoxy resins, alicyclic Acrylic acid esters obtained by reacting formula epoxy resin, aliphatic epoxy resin, etc. with acrylic acid or methacrylic acid. Among these epoxy acrylates or epoxy methacrylates, acrylates or methacrylates of glycidyl ethers of alcohols are particularly preferred.
上述碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2),可列舉使分子中具有至少1個羥基的芳香族或脂肪族醇及其環氧烷加成物與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯或甲基丙烯酸酯。具體而言,可列舉2-乙基己基丙烯酸酯、2-羥基乙基丙烯酸酯、2-羥基丙基丙烯酸酯、異戊基丙烯酸酯、月桂基丙烯酸酯、十八烷基丙烯酸酯、異辛基丙烯酸酯、四氫糠基丙烯酸酯、異莰基丙烯酸酯、苄基丙烯酸酯、1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、新戊二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯 酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯、ε-己內酯改質二季戊四醇六丙烯酸酯、2-乙基己基甲基丙烯酸酯、2-羥基乙基甲基丙烯酸酯、2-羥基丙基甲基丙烯酸酯、異戊基甲基丙烯酸酯、月桂基甲基丙烯酸酯、十八烷基甲基丙烯酸酯、異辛基甲基丙烯酸酯、四氫糠基甲基丙烯酸酯、異莰基甲基丙烯酸酯、苄基甲基丙烯酸酯、1,3-丁二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、新戊二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、聚丙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、二季戊四醇六甲基丙烯酸酯、ε-己內酯改質二季戊四醇六甲基丙烯酸酯等。又,此等之丙烯酸酯或甲基丙烯酸酯之中,特佳為多元醇之聚丙烯酸酯類或多元醇之聚甲基丙烯酸酯類。 The above-mentioned acrylates of alcohols with 2 to 20 carbon atoms or methacrylates (C2) of alcohols with 2 to 20 carbon atoms include aromatic or aliphatic alcohols and their rings having at least one hydroxyl group in the molecule. Acrylate or methacrylate obtained by reacting oxane adduct with acrylic acid or methacrylic acid. Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isoamyl acrylate, lauryl acrylate, octadecyl acrylate, isooctyl acrylate, acrylate, tetrahydrofurfuryl acrylate, isocamphoryl acrylate, benzyl acrylate, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol Alcohol Diacrylate, Diethylene Glycol Diacrylate, Triethylene Glycol Diacrylate, Neopentyl Glycol Diacrylate, Polyethylene Glycol Diacrylate, Polypropylene Glycol Dipropylene ester, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ε-caprolactone modified dipentaerythritol hexaacrylate, 2-ethylhexyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, isopentyl methacrylate, lauryl methacrylate, octadecyl methacrylate, isooctyl methacrylate, tetrahydro Furfuryl methacrylate, isocamphoryl methacrylate, benzyl methacrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1, 6-hexanediol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, polyethylene glycol dimethacrylate , polypropylene glycol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexamethacrylate, ε-caprolactone modified dipentaerythritol hexamethacrylate, etc. . Moreover, among these acrylates or methacrylates, polyol polyacrylates or polyol polymethacrylates are particularly preferred.
上述自由基聚合性成分(C)可使用(C1)或(C2)以外,藉由以能量線照射或加熱活性化之自由基聚合起始劑,進行高分子化或交聯反應的化合物,可列舉例如烯丙基胺基甲酸酯化合物、不飽和聚酯化合物、苯乙烯系化合物等。自由基聚合性成分(C)中之上述(C1)成分及(C2)成分的比例,較佳為50質量%以上。 The above-mentioned radical polymerizable component (C) can use a compound other than (C1) or (C2), which undergoes a polymerization or crosslinking reaction by a radical polymerization initiator activated by energy ray irradiation or heating. For example, an allyl urethane compound, an unsaturated polyester compound, a styrene-type compound, etc. are mentioned. It is preferable that the ratio of the said (C1) component and (C2) component in a radically polymerizable component (C) is 50 mass % or more.
本發明之硬化性組成物的自由基起始劑(D)無特別限制,可使用習知者。可使用例如苯乙酮系化合物、苄基系化合物、二苯甲酮系化合物、噻噸酮系化合物 等之酮系化合物、肟系化合物等。 The free radical initiator (D) of the curable composition of the present invention is not particularly limited, and known ones can be used. For example, acetophenone-based compounds, benzyl-based compounds, benzophenone-based compounds, and thioxanthone-based compounds can be used Ketone compounds, oxime compounds, etc.
本發明之硬化性組成物的聚合物(E)係選自由上述式(I)表示之單體所得之聚合物、由上述式(II)表示之單體所得之聚合物、選自上述式(I)表示之單體之二種以上之單體所得之聚合物、選自上述式(II)表示之單體之二種以上之單體所得之聚合物及由上述式(I)表示之單體及上述式(II)表示之單體所得之聚合物所成群,且重量平均分子量以聚苯乙烯換算為1,000~30,000。 The polymer (E) of the curable composition of the present invention is selected from the polymer obtained from the monomer represented by the above formula (I), the polymer obtained from the monomer represented by the above formula (II), and the polymer obtained from the above formula ( I) A polymer obtained from two or more monomers of the monomer represented by the above formula (II), a polymer obtained from two or more monomers selected from the monomers represented by the above formula (II), and a monomer represented by the above formula (I) A polymer obtained from a monomer represented by the above-mentioned formula (II) and a monomer represented by the above formula (II) is grouped, and the weight average molecular weight is 1,000 to 30,000 in terms of polystyrene.
上述式(I)中之X表示之碳原子數1~7之烷基,可列舉甲基、乙基、丙基、iso-丙基、丁基、sec-丁基、tert-丁基、iso-丁基、戊基、iso-戊基、tert-戊基、己基、2-己基、3-己基、環己基、4-甲基環己基、庚基、2-庚基、3-庚基、iso-庚基、tert-庚基等。此等之中,從硬化性的觀點,碳原子數1~4之烷基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基進行部分取代之碳原子數1~4之烷基為佳。 The alkyl group with 1 to 7 carbon atoms represented by X in the above formula (I) includes methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso -butyl, pentyl, iso-pentyl, tert-pentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, etc. Among them, from the viewpoint of hardenability, an alkyl group having 1 to 4 carbon atoms may be partially substituted with one or more groups selected from epoxy groups, oxetanyl groups, hydroxyl groups, and carboxyl groups. An alkyl group with 1 to 4 carbon atoms is preferred.
上述式(I)中之X表示之碳原子數1~7之烷氧基,可列舉甲氧基、乙氧基、丙氧基、iso-丙氧基、丁氧基、sec-丁氧基、tert-丁氧基、iso-丁氧基、戊氧基、iso-戊氧基、tert-戊氧基、己氧基、2-己氧基、3-己氧基、環己氧基、4-甲基環己氧基、庚氧基、2-庚氧基、3-庚氧基、iso-庚氧基、tert-庚氧基等。此等之中,從硬化性的觀點,碳原子數1~4之烷氧基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基進行部分取代 之碳原子數1~4之烷氧基為佳。 An alkoxy group having 1 to 7 carbon atoms represented by X in the above formula (I) includes methoxy, ethoxy, propoxy, iso-propoxy, butoxy, sec-butoxy , tert-butoxy, iso-butoxy, pentyloxy, iso-pentyloxy, tert-pentyloxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert-heptyloxy, etc. Among these, from the viewpoint of hardenability, an alkoxy group having 1 to 4 carbon atoms or one or more groups selected from the group consisting of epoxy, oxetanyl, hydroxyl and carboxyl groups carry out the moiety replace An alkoxy group with 1 to 4 carbon atoms is preferred.
上述式(I)中之X表示之碳原子數6~12之芳基,可列舉苯基、甲基苯基、萘基等。 The aryl group having 6 to 12 carbon atoms represented by X in the above formula (I) includes phenyl, methylphenyl, naphthyl and the like.
上述式(I)中之X表示之碳原子數6~12之芳氧基,可列舉苯氧基、甲基苯氧基、萘氧基等。 The aryloxy group having 6 to 12 carbon atoms represented by X in the above formula (I) includes phenoxy, methylphenoxy, naphthyloxy and the like.
上述式(I)中之X表示之碳原子數6~10之脂環式烴基,可列舉環己基、甲基環己基、降莰基、雙環戊基、雙環辛基、三甲基雙環庚基、三環辛基、三環癸基、螺辛基、螺雙環戊基、金剛烷基、異莰基等。 The alicyclic hydrocarbon group with 6 to 10 carbon atoms represented by X in the above formula (I) may include cyclohexyl, methylcyclohexyl, norbornyl, dicyclopentyl, bicyclooctyl, trimethylbicycloheptyl , tricyclic octyl, tricyclodecanyl, spirooctyl, spirobicyclopentyl, adamantyl, isobornyl, etc.
此等之烷基、烷氧基、芳基、芳氧基及脂環式烴基,可為此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代。 These alkyl groups, alkoxy groups, aryl groups, aryloxy groups and alicyclic hydrocarbon groups can be hydrogen atoms in these groups selected from epoxy groups, oxetanyl groups, hydroxyl groups and carboxyl groups. Groups of one or more bases are substituted.
上述式(I)中,X之一部分為經環氧基或氧雜環丁烷基取代時之式(I)表示的單體,可列舉例如下述式(1)~(3)表示之單體。 In the above-mentioned formula (I), a part of X is a monomer represented by the formula (I) when a part of X is substituted by an epoxy group or an oxetanyl group, and examples thereof include monomers represented by the following formulas (1) to (3). body.
在此,式(1)中,R3表示氫原子或碳原子數1~6之烷基,m為1~6之整數。 Here, in formula (1), R 3 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and m is an integer of 1 to 6.
在此,式(2)中,R4表示氫原子或碳原子數1~6之烷基,n為1~6之整數。 Here, in formula (2), R 4 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 6.
在此,式(3)中,R5表示氫原子或碳原子數1~6之烷基,s為1~6之整數。 Here, in formula (3), R 5 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and s is an integer of 1 to 6.
上述式(II)中,以R1所表示的鹵原子,可列舉氟、氯、溴、碘等。 In the above formula (II), the halogen atom represented by R 1 includes fluorine, chlorine, bromine, iodine and the like.
上述式(II)中,X’之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基,可列舉與上述式(I)同樣者。 In the above-mentioned formula (II), the alkyl group with 1 to 7 carbon atoms, the aryl group with 6 to 12 carbon atoms or the alicyclic hydrocarbon group with 6 to 10 carbon atoms of X' can be enumerated with the above-mentioned formula (I) the same.
上述式(II)中,X’之一部分經環氧基或氧雜環丁烷基取代時,作為式(II)所表示之單體,可列舉下述式(4)~(6)所表示者。 In the above formula (II), when a part of X' is substituted by an epoxy group or an oxetanyl group, the monomer represented by the formula (II) includes the following formulas (4) to (6) By.
在此,式(4)中,R1係與上述式(II)相同,R6表示氫原子或碳原子數1~6之烷基,t為1~6之整數。 Here, in the formula (4), R1 is the same as the above-mentioned formula (II), R6 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and t is an integer of 1 to 6.
在此,式(5)中,R1係與上述式(II)相同,R7表示氫原子或碳原子數1~6之烷基,q為1~6之整數。 Here, in the formula (5), R 1 is the same as the above-mentioned formula (II), R 7 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and q is an integer of 1 to 6.
在此,式(6)中,R1係與上述式(II)相同,R8表示氫原子或碳原子數1~6之烷基,y為1~6之整數。 Here, in the formula (6), R1 is the same as the above-mentioned formula (II), R8 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and y is an integer of 1 to 6.
上述聚合物(E)中,構成聚合物之單體的使用比例係上述X為經選自由環氧基、環雜環丁烷基、羥基及羧基所成群之1種以上之基取代之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基時,使上述(I)或(II)表示之單體成為10~100質量%來使用,由於接著性提高,故較佳。 In the above-mentioned polymer (E), the proportion of the monomers constituting the polymer is such that the above-mentioned X is a carbon substituted by one or more groups selected from the group consisting of epoxy group, cyclobutanyl group, hydroxyl group and carboxyl group In the case of an alkyl group with 1 to 7 atoms, an aryl group with 6 to 12 carbon atoms, or an alicyclic hydrocarbon group with 6 to 10 carbon atoms, the monomer represented by the above (I) or (II) is 10 to 100 by mass % to use, because of improved adhesion, it is better.
本發明之硬化性組成物中,上述陽離子聚合性成分(A)係15~90質量份,較佳為50~80質量份,上述陽離子聚合起始劑(B)為1~10質量份,較佳為1~6質量份,上述自由基聚合性成分(C)為10~50質量份,較佳為10~20質量份,上述自由基聚合起始劑(D)為1~10質量份,較佳為1~5質量份,上述聚合物(E)為1~20質量份, 較佳為5~15質量份。上述調配比例以外時,硬化物之硬化性及密著性有變差的疑慮。又,陽離子聚合性成分(A)與自由基聚合性成分(C)與聚合物(E)之合計為100質量份。 In the curable composition of the present invention, the above-mentioned cationic polymerizable component (A) is 15-90 parts by mass, preferably 50-80 parts by mass, and the above-mentioned cationic polymerization initiator (B) is 1-10 parts by mass, preferably Preferably 1-6 parts by mass, the radical polymerizable component (C) is 10-50 parts by mass, preferably 10-20 parts by mass, the radical polymerization initiator (D) is 1-10 parts by mass, Preferably 1-5 parts by mass, the above-mentioned polymer (E) is 1-20 parts by mass, Preferably it is 5-15 mass parts. When the blending ratio is other than the above, the curability and adhesiveness of the cured product may be deteriorated. Moreover, the total of a cation polymerizable component (A), a radical polymerizable component (C), and a polymer (E) is 100 mass parts.
本發明之硬化性組成物中,可依需要進一步使用增感劑及/或增感助劑。增感劑係於較陽離子聚合起始劑(B)所顯示之極大吸收波長更長的波長顯示極大吸收,促進藉由陽離子聚合起始劑(B)之聚合起始反應的化合物。又,增感助劑係更進一步促進增感劑之作用的化合物。 In the curable composition of the present invention, a sensitizer and/or a sensitizer can be further used as needed. The sensitizer is a compound that exhibits maximum absorption at a wavelength longer than that of the cationic polymerization initiator (B) and accelerates the polymerization initiation reaction by the cationic polymerization initiator (B). Moreover, a sensitizer is a compound which further promotes the action of a sensitizer.
增感劑及增感助劑可列舉蒽系化合物、萘系化合物等。 As a sensitizer and a sensitization aid, an anthracene type compound, a naphthalene type compound, etc. are mentioned.
蒽系化合物可列舉例如下述式(7)表示者。 As an anthracene type compound, what is represented by following formula (7) is mentioned, for example.
此處,式(7)中,R50及R51各自獨立地表示氫原子、碳原子數1~6之烷基或碳原子數2~12之烷氧基烷基,R52表示氫原子或碳原子數1~6之烷基。 Here, in formula (7), R 50 and R 51 each independently represent a hydrogen atom, an alkyl group with 1 to 6 carbon atoms, or an alkoxyalkyl group with 2 to 12 carbon atoms, and R 52 represents a hydrogen atom or An alkyl group with 1 to 6 carbon atoms.
列舉上述式(7)表示之蒽系化合物之具體例時,有如以下的化合物。 When specific examples of the anthracene-based compound represented by the above formula (7) are given, the following compounds are given.
可列舉例如9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽、9,10-二異丙氧基蒽、9,10-二丁氧 基蒽、9,10-二戊氧基蒽、9,10-二己氧基蒽、9,10-雙(2-甲氧基乙氧基)蒽、9,10-雙(2-乙氧基乙氧基)蒽、9,10-雙(2-丁氧基乙氧基)蒽、9,10-雙(3-丁氧基丙氧基)蒽、2-甲基-或2-乙基-9,10-二甲氧基蒽、2-甲基-或2-乙基-9,10-二乙氧基蒽、2-甲基-或2-乙基-9,10-二丙氧基蒽、2-甲基-或2-乙基-9,10-二異丙氧基蒽、2-甲基-或2-乙基-9,10-二丁氧基蒽、2-甲基-或2-乙基-9,10-二戊氧基蒽、2-甲基-或2-乙基-9,10-二己氧基蒽等。 Examples include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diisopropoxyanthracene, 9,10-dibutyl oxygen Anthracene, 9,10-dipentyloxyanthracene, 9,10-dihexyloxyanthracene, 9,10-bis(2-methoxyethoxy)anthracene, 9,10-bis(2-ethoxy ethoxy)anthracene, 9,10-bis(2-butoxyethoxy)anthracene, 9,10-bis(3-butoxypropoxy)anthracene, 2-methyl- or 2-ethane -9,10-dimethoxyanthracene, 2-methyl- or 2-ethyl-9,10-diethoxyanthracene, 2-methyl- or 2-ethyl-9,10-dipropane Oxyanthracene, 2-methyl- or 2-ethyl-9,10-diisopropoxyanthracene, 2-methyl- or 2-ethyl-9,10-dibutoxyanthracene, 2-methanthracene Base- or 2-ethyl-9,10-dipentyloxyanthracene, 2-methyl- or 2-ethyl-9,10-dihexyloxyanthracene, etc.
萘系化合物可列舉例如下述式(8)表示者。 Naphthalene-based compounds include, for example, those represented by the following formula (8).
此處,式(8)中,R53及R54各自獨立地表示碳原子數1~6之烷基。 Here, in formula (8), R 53 and R 54 each independently represent an alkyl group having 1 to 6 carbon atoms.
列舉上述式(8)表示之萘系化合物之具體例時,有如以下的化合物。 When specific examples of the naphthalene-based compound represented by the above formula (8) are given, the following compounds are given.
可列舉例如4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 Examples include 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyl Oxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene , 1,4-dibutoxynaphthalene, etc.
相對於上述陽離子聚合性成分(A)而言,增感劑及增感助劑之使用比例無特別限定,只要在不阻礙本發明之目的的範圍內,大致以通常使用比例使用即可,例 如相對於上述陽離子聚合性成分(A)100質量份,由提高硬化性的觀點,增感劑及增感助劑各自為0.1~3質量份為佳。 With respect to the above cationic polymerizable component (A), the ratio of the sensitizer and the sensitizer is not particularly limited, as long as it does not hinder the purpose of the present invention, it can be used in a generally used ratio, for example From the viewpoint of improving curability, the sensitizer and the sensitizing assistant are each preferably 0.1 to 3 parts by mass relative to 100 parts by mass of the above-mentioned cationically polymerizable component (A).
本發明之硬化性組成物中,可依需要使用矽烷偶合劑。矽烷偶合劑可使用例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等之烷基官能性烷氧基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等之烯基官能性烷氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧基官能性烷氧基矽烷、N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等之胺基官能性烷氧基矽烷、γ-巰基丙基三甲氧基矽烷等之巰基官能性烷氧基矽烷、四異丙烷氧化鈦、四正丁烷氧化鈦等之鈦烷氧化物類、鈦二辛氧基雙(伸辛基甘醇酸鹽)、鈦二異丙氧基雙(乙基乙醯乙酸鹽)等之鈦螯合物類、四乙醯丙酮鋯、三丁氧基單乙醯丙酮鋯等之鋯螯合物類、三丁氧基單硬脂酸鋯等之鋯醯化物 類類、甲基三異氰酸酯矽烷等之異氰酸酯矽烷類等。 In the curable composition of the present invention, a silane coupling agent may be used as needed. Silane coupling agents can be used such as dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane , methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane and other alkyl-functional alkoxysilanes, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethyl Alkenyl functional alkoxysilane such as oxysilane, allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane Dimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropylmethyldiethoxysilane Oxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyl Epoxy-functional alkoxysilane such as trimethoxysilane, N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N - Amino-functional alkoxysilanes such as phenyl-γ-aminopropyltrimethoxysilane, mercapto-functional alkoxysilanes such as γ-mercaptopropyltrimethoxysilane, titanium tetraisopropane oxide, Titanium alkoxides such as tetra-n-butane titanium oxide, titanium dioctyloxybis(octyl glycolate), titanium diisopropoxybis(ethyl acetylacetate) and other titanium chelates Zirconium chelates such as zirconium tetraacetylacetonate and zirconium tributoxymonoacetylacetonate, zirconium acyl compounds such as zirconium tributoxy monostearate Classes, isocyanate silanes such as methyl triisocyanate silane, etc.
上述矽烷偶合劑之使用量並無特別限定,通常,相對於硬化性組成物中之固形物全部量100質量份,為0.01~20質量份的範圍。 The usage-amount of the said silane coupling agent is not specifically limited, Usually, it is the range of 0.01-20 mass parts with respect to 100 mass parts of total solids in a curable composition.
於本發明之硬化性組成物,依需要藉由使用熱可塑性有機聚合物,亦可改善硬化物的特性。熱可塑性有機聚合物,可列舉例如聚苯乙烯、聚甲基丙烯酸甲酯、甲基丙烯酸甲酯丙烯酸乙酯共聚物、甲基丙烯酸甲酯甲基丙烯酸環氧丙酯共聚物、聚(甲基)丙烯酸、苯乙烯-(甲基)丙烯酸共聚物、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、(甲基)丙烯酸環氧丙酯-聚甲基(甲基)丙烯酸酯共聚物、聚乙烯基縮丁醛、纖維素酯、聚丙烯醯胺、飽和聚酯等。 In the curable composition of the present invention, the characteristics of the cured product can also be improved by using a thermoplastic organic polymer as needed. Thermoplastic organic polymers, such as polystyrene, polymethyl methacrylate, methyl methacrylate ethyl acrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, poly(methacrylate ) acrylic acid, styrene-(meth)acrylic acid copolymer, (meth)acrylic acid-methyl methacrylate copolymer, (meth)glycidyl acrylate-polymethyl(meth)acrylate copolymer, Polyvinyl butyral, cellulose ester, polyacrylamide, saturated polyester, etc.
本發明之硬化性組成物中,亦可依需要進一步使用紫外線吸收劑、或於常溫為不活性,且因加熱至特定溫度/光照射/酸等會使保護基脫離而活性化,展現紫外線吸收能力的化合物。 In the curable composition of the present invention, ultraviolet absorbers can be further used as needed, or they are inactive at room temperature, and the protective group will be detached and activated by heating to a specific temperature/light irradiation/acid, etc., and exhibit ultraviolet absorption. Ability compound.
又,只要不損及本發明之效果時,可依需要添加多元醇、無機填料、有機填料、顏料、染料等之著色劑、消泡劑、增黏劑、界面活性劑、平坦劑、難燃劑、觸變劑、稀釋劑、可塑劑、安定劑、聚合抑制劑、紫外線吸收劑、抗氧化劑、抗靜電劑、流動調整劑、接著促進劑等之各種樹脂添加物等。 Also, as long as the effect of the present invention is not impaired, coloring agents such as polyols, inorganic fillers, organic fillers, pigments, dyes, defoamers, tackifiers, surfactants, leveling agents, flame retardants, etc. can be added as needed. Various resin additives such as additives, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, adhesion accelerators, etc.
本發明之硬化性組成物中,無特別限定,可 使用通常所用之可溶解或分散上述(A)、(B)、(C)、(D)及(E)之各成分的溶劑。溶劑可列舉例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等之酮類;乙醚、二噁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲醚、二丙二醇二甲醚等之醚系溶劑;乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、2,2,4-三甲基-1,3-戊二醇異丁酸(Texanol)等之酯系溶劑;乙二醇單甲醚、乙二醇單乙醚等之溶纖劑系溶劑;甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等之醇系溶劑;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、3-甲氧基丁基乙酸酯、乙氧基乙基丙酸酯等之醚酯系溶劑;苯、甲苯、二甲苯等之BTX系溶劑;己烷、庚烷、辛烷、環己烷等之脂肪族烴系溶劑;松節油、D-檸檬烯、蒎烯等之萜烯系烴油;礦油精、Swasol#310(Cosmo松山石油(股)公司製)、Solvesso#100(Exxon化學社)等之鏈烷烴系溶劑;四氯化碳、氯仿、三氯乙烯、二氯甲烷、1,2-二氯乙烷等之鹵化脂肪族烴系溶劑;氯苯等之鹵化芳香族烴系溶劑;碳酸丙烯酯、卡必醇系溶劑、苯胺、三乙基胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮、二甲基亞碸、水等。此等溶劑可使用1種或以2種以上之混合溶劑使用。 The curable composition of the present invention is not particularly limited, and may be A commonly used solvent capable of dissolving or dispersing the respective components of (A), (B), (C), (D) and (E) above is used. Examples of solvents include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone; Ether solvents such as ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether, etc.; methyl acetate, Ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, 2,2,4-trimethyl-1,3 -Ester-based solvents such as pentanediol isobutyric acid (Texanol); cellosolve-based solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, iso- or n-propanol, iso- Or alcohol solvents such as n-butanol and pentanol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA) , dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate, etc. ether ester solvents; benzene, toluene, xylene, etc. BTX solvents; hexane Aliphatic hydrocarbon solvents such as , heptane, octane, and cyclohexane; terpene-based hydrocarbon oils such as turpentine, D-limonene, and pinene; mineral spirits, Swasol#310 (manufactured by Cosmo Matsuyama Oil Co., Ltd. ), Solvesso#100 (Exxon Chemical Co.) Halogenated aromatic hydrocarbon solvents such as benzene; propylene carbonate, carbitol-based solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N- Dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, water, and the like. These solvents can be used alone or as a mixed solvent of two or more.
本發明之硬化性組成物會提高硬化性、接著性、液體保存安定性,故水分量為5質量份以下較佳,又更佳為3質量份以下。水分過多時,有產生白濁或成分析出之疑慮,故不佳。 The curable composition of the present invention improves curability, adhesiveness, and liquid storage stability, so the moisture content is preferably 5 parts by mass or less, and more preferably 3 parts by mass or less. When there is too much water, there may be doubts about white turbidity or separation of components, so it is not good.
本發明之硬化性組成物以輥塗佈器、淋幕式塗佈器、各種之印刷、浸漬等之公知手段適用於支撐基體上。又,也可一旦施於薄膜等之支撐基體上後,轉印於其他支撐基體上,其適用方法並無限制。 The curable composition of the present invention is applied to the supporting substrate by known means such as roll coater, curtain coater, various printing, dipping and the like. In addition, after being applied to a supporting substrate such as a film once, it may be transferred to another supporting substrate, and the application method is not limited.
上述支撐基體之材料,無特別限制,可使用通常所使用者,可列舉例如玻璃等之無機材料;二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯基丙醯基纖維素、硝基纖維素等之纖維素酯;聚醯胺;聚醯亞胺;聚胺基甲酸酯;環氧樹脂;聚碳酸酯;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚-1,4-環己烷二亞甲基聚對苯二甲酸酯、聚乙烯-1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚對苯二甲酸丁二酯等之聚酯;聚苯乙烯;聚乙烯、聚丙烯、聚甲基戊烯等之聚烯烴;聚乙酸乙烯酯、聚氯乙烯、聚氟乙烯等之乙烯基化合物;聚甲基丙烯酸甲酯、聚丙烯酸酯等之丙烯酸系樹脂;聚碳酸酯;聚碸;聚醚碸;聚醚酮;聚醚醯亞胺;聚氧乙烯、降莰烯樹脂、環烯烴聚合物(COP)等之高分子材料。又,亦可對上述支撐基體進行電暈放電處理、火焰處理、紫外線處理、高頻處理、輝光放電處理、活性電漿處理、雷射處理等之表面活性化處理。 The material of the above-mentioned support matrix is not particularly limited, and commonly used ones can be used, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), acryl cellulose, butyryl cellulose Cellulose esters of cellulose, acetylpropionyl cellulose, nitrocellulose, etc.; polyamides; polyimides; polyurethanes; epoxy resins; polycarbonates; polyterephthalates Ethylene formate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexane dimethylene terephthalate, polyethylene-1,2- Polyesters such as diphenoxyethane-4,4'-dicarboxylate and polybutylene terephthalate; polystyrene; polyolefins such as polyethylene, polypropylene, and polymethylpentene; Vinyl compounds such as polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, etc.; acrylic resins such as polymethyl methacrylate, polyacrylate, etc.; polycarbonate; Etherimide; polymer materials such as polyoxyethylene, norcamphene resin, cycloolefin polymer (COP), etc. In addition, surface activation treatments such as corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, laser treatment, etc. may be performed on the above-mentioned support base.
藉由能量線照射本發明之硬化性組成物使硬化的方法中,能量線可列舉紫外線、電子線、X射線、放射線、高頻等,紫外線在經濟上最佳。紫外線之光源,可列舉紫外線雷射、水銀燈、氙雷射、金屬鹵素燈等。 In the method of curing the curable composition of the present invention by irradiating energy rays, examples of the energy rays include ultraviolet rays, electron rays, X-rays, radiation rays, high frequency, etc., and ultraviolet rays are most economically optimal. The light source of ultraviolet rays includes ultraviolet lasers, mercury lamps, xenon lasers, metal halide lamps, and the like.
藉由加熱使本發明之硬化性組成物硬化的方法的條件為70~250℃、1~100分鐘。可於預烤(PAB;Pre applied bake)後加壓進行後烘烤(PEB;Post exposure bake);亦可以不同的數階段的溫度烘烤。加熱條件雖依各成分之種類及摻合比例而異,但例如70~180℃下,烘箱為5~15分鐘,加熱板則為1~5分鐘。然後,為了使塗膜硬化,藉由於180~250℃,較佳為200~250℃,烘箱為30~90分鐘,加熱板則為5~30分鐘進行加熱處理,可得到硬化膜。 The conditions for the method of curing the curable composition of the present invention by heating are 70 to 250° C. for 1 to 100 minutes. It can be pre-baked (PAB; Pre applied bake) and then pressurized for post-baking (PEB; Post exposure bake); it can also be baked at different stages of temperature. Although the heating conditions vary depending on the type and blending ratio of each component, for example, at 70-180°C, it takes 5-15 minutes in an oven, and 1-5 minutes on a heating plate. Then, in order to harden the coating film, heat treatment is performed at 180-250°C, preferably 200-250°C, in an oven for 30-90 minutes, and on a heating plate for 5-30 minutes to obtain a cured film.
本發明之硬化性組成物或其硬化物之具體的用途,可列舉接著劑、眼鏡、以攝影用透鏡為代表之光學材料、塗料、塗覆劑、襯墊(lining)劑、油墨、阻劑、液狀阻劑、印刷版、彩色電視、PC監視器、行動資訊終端、數位相機、有機EL、觸控面板等之顯示元件、絕緣清漆、絕緣薄片、層合板、印刷基板、半導體裝置用/LED封裝用/液晶注入口用/有機EL用/光元件用/電絕緣用/電子零件用/分離膜用等之封裝劑、成形材料、油灰、玻璃纖維含浸劑、木粉填料、半導體用/太陽電池用等之鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置之背光所使用之稜鏡透鏡薄片、投影電視等之螢幕所使用之菲涅耳透鏡薄片、 雙凸透鏡薄片等之透鏡薄片之透鏡部、或使用這種薄片之背光等、微透鏡等之光學透鏡、光學元件、光連接器、光波導、光學造形用鑄型劑等。 Specific applications of the curable composition of the present invention or its cured product include adhesives, eyeglasses, optical materials represented by photographic lenses, paints, coating agents, lining agents, inks, and resists. , liquid resist, printing plates, color TVs, PC monitors, mobile information terminals, digital cameras, organic EL, display elements such as touch panels, insulating varnishes, insulating sheets, laminates, printed substrates, semiconductor devices/ Encapsulant, molding material, putty, glass fiber impregnant, wood powder filler, semiconductor for LED encapsulation/liquid crystal injection port/organic EL/optical element/electrical insulation/electronic parts/separation film, etc. Passivation film for solar cells, interlayer insulating film, protective film, sapphire lens sheet used for backlight of liquid crystal display device, Fresnel lens sheet used for screen of projection TV, etc. Lens portion of lens sheet such as lenticular lens sheet, or backlight using such sheet, optical lens such as microlens, optical element, optical connector, optical waveguide, molding agent for optical molding, etc.
本發明之顯示裝置可列舉於透明支撐體上依需要設置有底塗層、抗反射層、偏光元件層、相位差層、雙折射率層、光散射層、硬質塗層、潤滑層、保護層等之各層者,於各層可使用由本發明之硬化物所成的薄膜。 The display device of the present invention can be enumerated on the transparent support to be provided with a primer layer, an anti-reflection layer, a polarizer layer, a phase difference layer, a birefringence layer, a light scattering layer, a hard coat layer, a lubricating layer, and a protective layer. For each layer, a film made of the cured product of the present invention can be used for each layer.
以下列舉實施例等更詳細說明本發明,但本發明不限定於此等實施例。 Examples and the like are given below to describe the present invention in more detail, but the present invention is not limited to these examples.
以下述[表1]~[表6]所示之調配,將各成分充分地混合,得到各實施例1~19之硬化性組成物及比較例1~8之硬化性組成物。又,實施例及比較例之單位為質量份。 According to the preparation shown in the following [Table 1] to [Table 6], each component was fully mixed to obtain the curable compositions of Examples 1 to 19 and the curable compositions of Comparative Examples 1 to 8. In addition, the unit of an Example and a comparative example is a mass part.
陽離子聚合性成分(A)係使用下述化合物。 As the cationically polymerizable component (A), the following compounds were used.
化合物(A1-1):新戊二醇二環氧丙醚 Compound (A1-1): Neopentyl glycol diglycidyl ether
化合物(A1-2):1,4-丁二醇二環氧丙醚 Compound (A1-2): 1,4-Butanediol Diglycidyl Ether
化合物(A2-1):ARON OXETANEOXT-221(東亞合成(股)公司製) Compound (A2-1): ARON OXETANEOXT-221 (manufactured by Toagosei Co., Ltd.)
化合物(A3-1):雙酚型二環氧丙醚 Compound (A3-1): Bisphenol Diglycidyl Ether
化合物(A3-2):TECHMORE VG3101(芳香族3官 能環氧樹脂:(股)Printec公司製) Compound (A3-2): TECHMORE VG3101 (aromatic trifunctional Epoxy resin: (produced by Printec Co., Ltd.)
陽離子聚合起始劑(B)為使用下述化合物(B-1)。 As a cationic polymerization initiator (B), the following compound (B-1) was used.
化合物(B-1):下述式(9)表示之化合物及下述式(10)表示之化合物之混合物的碳酸丙烯酯50%溶液 Compound (B-1): 50% propylene carbonate solution of a mixture of a compound represented by the following formula (9) and a compound represented by the following formula (10)
自由基聚合性成分(C)為使用下述化合物。 As the radical polymerizable component (C), the following compounds were used.
化合物(C1-1):環氧基酯M-600A(共榮社化學(股)公司製) Compound (C1-1): Epoxy ester M-600A (manufactured by Kyoeisha Chemical Co., Ltd.)
化合物(C1-2):環氧基酯70PA(共榮社化學(股)公司製) Compound (C1-2): Epoxy ester 70PA (manufactured by Kyoeisha Chemical Co., Ltd.)
化合物(C2-1):1,6-己二醇二丙烯酸酯 Compound (C2-1): 1,6-hexanediol diacrylate
自由基聚合起始劑(D)為使用下述化合物(D-1)。 As a radical polymerization initiator (D), the following compound (D-1) was used.
化合物(D-1):IRGACURE184(BASF公司製) Compound (D-1): IRGACURE184 (manufactured by BASF Corporation)
聚合物(E)為使用下述化合物(E-1)及(E-2)。 As the polymer (E), the following compounds (E-1) and (E-2) were used.
聚合物(E-1):甲基丙烯酸甲酯75質量份與環氧丙基甲基丙烯酸酯25之共聚物(重量平均分子量7,000) Polymer (E-1): Copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 7,000)
聚合物(E’)為使用下述化合物(E’-1)及(E’-2)。 As the polymer (E'), the following compounds (E'-1) and (E'-2) were used.
化合物(E’-1):甲基丙烯酸甲酯75質量份與環氧丙基甲基丙烯酸酯25之共聚物(重量平均分子量800) Compound (E'-1): a copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 800)
化合物(E’-2):甲基丙烯酸甲酯75質量份與環氧丙基甲基丙烯酸酯25之共聚物(重量平均分子量35,000) Compound (E'-2): Copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 35,000)
對於所得之實施例1~19及比較例1~8之各硬化性組成物,依據下述步驟評價玻璃轉移溫度(Tg)、彈性模數及密著性之評價。結果併記於[表1]~[表6]。 For each curable composition obtained in Examples 1 to 19 and Comparative Examples 1 to 8, glass transition temperature (Tg), elastic modulus, and adhesiveness were evaluated according to the following procedure. The results are recorded in [Table 1] ~ [Table 6].
將所得之實施例1~19及比較例1~8之各硬化性組成物分別以塗佈棒塗佈於聚對苯二甲酸乙二酯(PET)薄膜上形成30μm的厚度,使用金屬鹵素燈照射3000mJ/cm2之能量。24小時後,自薄膜取出接著劑硬化物,使用(股)Hitachi High-Tech Science製之黏彈性測量裝置(DMA7100),測量Tg及80℃下的彈性模數。 Each of the curable compositions obtained in Examples 1-19 and Comparative Examples 1-8 was coated on a polyethylene terephthalate (PET) film with a coating bar to form a thickness of 30 μm, and a metal halide lamp was used to The energy of 3000mJ/cm 2 is irradiated. After 24 hours, the hardened adhesive was taken out from the film, and the elastic modulus at Tg and 80° C. was measured using a viscoelasticity measuring device (DMA7100) manufactured by Hitachi High-Tech Science.
對於所得之實施例1~19及比較例1~8之硬化性組成物 分別以E型黏度計測量25℃下的黏度。 For the curable compositions obtained in Examples 1-19 and Comparative Examples 1-8 The viscosity at 25°C was measured with an E-type viscometer.
將上述所得之實施例1~19及比較例1~8之硬化性組成物,各自塗佈於一片經電暈處理PMMA薄膜(住友化學(股)公司製:Technolloy 125S001)後,使用層合機與另一片經電暈放電處理的COP(環烯烴聚合物、日本Zeon(股)公司製:型號Zeonor Film 14-060)薄膜貼合,使用無電極紫外光燈透過COP薄膜照射相當於1000mJ/cm2之光進行接著,以得到試驗片。對於所得之試驗片進行90度剝離試驗。 The curable compositions of Examples 1 to 19 and Comparative Examples 1 to 8 obtained above were each coated on a corona-treated PMMA film (manufactured by Sumitomo Chemical Co., Ltd.: Technolloy 125S001), and a laminator was used to Bond with another corona discharge treated COP (cycloolefin polymer, Japan Zeon Co., Ltd.: model Zeonor Film 14-060) film, and use an electrodeless ultraviolet lamp to irradiate through the COP film equivalent to 1000mJ/cm Step 2 was followed to obtain a test piece. A 90-degree peel test was performed on the obtained test piece.
由[表1]~[表6]得知本發明之硬化性組成物係硬化物之玻璃轉移溫度高及密著性優異。 From [Table 1] to [Table 6], it can be seen that the curable composition of the present invention is a cured product with a high glass transition temperature and excellent adhesion.
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