TWI738754B - Hardenable composition, method of manufacturing hardened material and hardened material - Google Patents
Hardenable composition, method of manufacturing hardened material and hardened material Download PDFInfo
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- TWI738754B TWI738754B TW106110859A TW106110859A TWI738754B TW I738754 B TWI738754 B TW I738754B TW 106110859 A TW106110859 A TW 106110859A TW 106110859 A TW106110859 A TW 106110859A TW I738754 B TWI738754 B TW I738754B
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- 239000000243 solution Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000005415 substituted alkoxy group Chemical group 0.000 description 1
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- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-O thiolan-1-ium Chemical compound C1CC[SH+]C1 RAOIDOHSFRTOEL-UHFFFAOYSA-O 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 125000006000 trichloroethyl group Chemical group 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- GJOGTGLNIWPDPF-UHFFFAOYSA-N trifluoromethyl hydrogen sulfite Chemical compound OS(=O)OC(F)(F)F GJOGTGLNIWPDPF-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- ANEFWEBMQHRDLH-UHFFFAOYSA-N tris(2,3,4,5,6-pentafluorophenyl) borate Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1OB(OC=1C(=C(F)C(F)=C(F)C=1F)F)OC1=C(F)C(F)=C(F)C(F)=C1F ANEFWEBMQHRDLH-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Abstract
本發明係提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。 The present invention provides a curable composition with a high glass transition temperature and excellent adhesion of a cured product, a method for manufacturing a cured product, and a cured product.
本發明之硬化性組成物係含有:陽離子聚合性成分(A)30~99質量份、陽離子聚合起始劑(B)0.1~10質量份、自由基聚合性成分(C)0~55質量份、自由基聚合起始劑(D)0~10質量份及選自由式(I)
(式中,X係碳原子數1~7之烷基等)表示之單體所得之聚合物、式(II)
(式中,R1表示氫原子等,X’為碳原子數1~7之烷基等)表示之單體所得之聚合物等之重量平均分子量1,000~30,000的聚合物(E)1~30質量份,其中(A)成分為分子量200以上之多元醇的環氧丙基化物等與脂環式環氧化合物,(C)成分為具有環氧基等的化合物等。 (In the formula, R 1 represents a hydrogen atom, etc., X'is an alkyl group with 1 to 7 carbon atoms, etc.) represents the weight average molecular weight of the polymer obtained from the monomer, etc. The polymer has a weight average molecular weight of 1,000 to 30,000 (E) 1 to 30 Parts by mass, wherein the component (A) is a glycidyl compound of a polyol having a molecular weight of 200 or more and an alicyclic epoxy compound, and the component (C) is a compound having an epoxy group or the like.
Description
本發明係有關硬化性組成物、硬化物之製造方法及其硬化物,詳細為有關硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。 The present invention relates to a curable composition, a method for manufacturing a cured product, and a cured product, and in detail, a curable composition with a high glass transition temperature and excellent adhesion, a method for manufacturing a cured product, and a cured product.
硬化性組成物係使用於油墨、塗料、各種塗覆劑、接著劑、光學構件等的領域。關於這種硬化性組成物之改良,有各種的報告。 The curable composition is used in fields such as inks, paints, various coating agents, adhesives, and optical components. There are various reports on the improvement of this kind of curable composition.
例如下述專利文獻1~3中提案含有陽離子聚合性成分及自由基聚合性成分之能量線硬化性組成物及其硬化物。具體而言,專利文獻1中,提案初期硬化性及接著性優異的偏光板用接著劑組成物。又,專利文獻2中,提案即使低黏度,硬化性優異,即使塗佈.硬化時之環境濕度高,對各種塑膠薄膜等之接著力優異,無色透明性也優異的塑膠薄膜等用活性能量線硬化型接著劑組成物。此外,專利文獻3中,提案低黏度,硬化性優異,且對含有(甲基)丙烯酸樹脂或環烯烴聚合物之各種塑膠薄膜等之接著力優異,無色透明性也優異的塑膠薄膜等用活性能量線 硬化型接著劑組成物。 For example, the following Patent Documents 1 to 3 propose energy ray curable compositions containing cationically polymerizable components and radically polymerizable components and their cured products. Specifically, Patent Document 1 proposes an adhesive composition for a polarizing plate that is excellent in initial curability and adhesiveness. In addition, Patent Document 2 proposes an active energy ray for plastic films that has excellent curability even with low viscosity, high environmental humidity during coating and curing, excellent adhesion to various plastic films, etc., and excellent colorlessness and transparency. Hardening type adhesive composition. In addition, Patent Document 3 proposes a low viscosity, excellent curability, excellent adhesion to various plastic films containing (meth)acrylic resins or cycloolefin polymers, etc., and excellent colorless and transparent properties for plastic films, etc. Energy line Hardening type adhesive composition.
專利文獻1:日本特開2014-105218號公報 Patent Document 1: JP 2014-105218 A
專利文獻2:日本特開2015-057467號公報 Patent Document 2: Japanese Patent Application Publication No. 2015-057467
專利文獻3:日本特開2015-229744號公報 Patent Document 3: Japanese Patent Application Publication No. 2015-229744
但是,即使為專利文獻1~3所提案之硬化性組成物,對於硬化性及密著性,亦有不一定能夠滿足的情況,現狀為期望能夠高度兼具硬化性及密著性之新穎的硬化性組成物。 However, even for the curable compositions proposed in Patent Documents 1 to 3, the curability and adhesiveness may not always be satisfied. The current situation is that it is desired to have a high degree of curability and adhesiveness. Hardening composition.
因此,本發明之目的為提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法、及其硬化物。 Therefore, the object of the present invention is to provide a curable composition having a high glass transition temperature of a cured product and excellent adhesion, a method for producing a cured product, and a cured product thereof.
本發明人等為了解決上述課題而精心探討的結果,發現若為具有特定組成之硬化性組成物時,即可克服上述課題,而完成本發明。 The inventors of the present invention have intensively studied in order to solve the above-mentioned problems, and found that if it is a curable composition having a specific composition, the above-mentioned problems can be overcome, and the present invention has been completed.
亦即,本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)30~99質量份、陽離子聚合起始劑
(B)0.1~10質量份、自由基聚合性成分(C)0~55質量份、自由基聚合起始劑(D)0~10質量份及選自由下述式(I)
(式中,X係碳原子數1~7之烷基、碳原子數1~7之烷氧基、碳原子數6~12之芳基、碳原子數6~12之芳氧基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上的基所取代者)表示之單體所得之聚合物、由下述式(II)
(式中,R1表示氫原子、甲基或鹵素原子,X’係碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基、或此等之基中之氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代者)表示之單體所得之聚合物、選自前述式(I)表示之單體之二種以上之單體所得之聚合物、選自前述式(II)表示之單體之二種以上之單體所得之聚合物、或選自前述式(I)表示之單體及前述式(II)表示之單體所得之聚合物所成群組之重量平均分子量1,000~30,000的聚合物(E)1~30質量份,使前述陽離子聚合性成分(A)與前述自由基聚合性成分(C)與前 述聚合物(E)之合計成為100質量份,前述陽離子聚合性成分(A)係以分子量200以上之多元醇的環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)與脂環式環氧化合物(A2)為必須成分,前述自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2)為必須成分。在此,重量平均分子量係指在四氫呋喃(THF)溶劑中,藉由GPC測量,以苯乙烯換算求得的重量平均分子量。 (In the formula, R 1 represents a hydrogen atom, a methyl group or a halogen atom, and X'is an alkyl group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms or an alicyclic hydrocarbon group with 6 to 10 carbon atoms , Or the hydrogen atom in these groups is substituted by one or more groups selected from epoxy group, oxetanyl group, hydroxyl group and carboxyl group) represented by the polymer, selected A polymer obtained from two or more monomers of the monomer represented by the aforementioned formula (I), a polymer obtained from two or more monomers selected from the monomer represented by the aforementioned formula (II), or a polymer selected from the aforementioned formula (I) The monomer represented by the formula (II) and the polymer obtained from the monomer represented by the formula (II) form a group of a polymer having a weight average molecular weight of 1,000 to 30,000 (E) 1 to 30 parts by mass to make the aforementioned cationically polymerizable component (A) The total of the aforementioned radical polymerizable component (C) and the aforementioned polymer (E) is 100 parts by mass, and the aforementioned cationically polymerizable component (A) is a glycidyl product of a polyol having a molecular weight of 200 or more or The glycidyl compound (A1) and the alicyclic epoxy compound (A2) of the polyol alkylene oxide adduct are essential components. The radical polymerizable component (C) has an epoxy group and an ethylenic Saturated compound (C1), or acrylate of alcohol with 2 to 20 carbon atoms or methacrylate (C2) of alcohol with 2 to 20 carbon atoms are essential components. Here, the weight average molecular weight refers to the weight average molecular weight obtained by GPC measurement in tetrahydrofuran (THF) solvent and calculated in terms of styrene.
本發明之硬化性組成物,其中前述分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物之環氧丙基化物(A1)中之多元醇為具有縮合環的多元醇為佳。又,本發明之硬化性組成物中,前述脂環式環氧化合物(A2)為選自由3’,4’-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、7-氧雜二環[4.1.0]庚烷、聚[氧-(1-側氧-1,6-己烷二基)]衍生物、己二酸雙[(7-氧雜二環[4.1.0]庚烷-3-基)甲酯]、1,2-環氧基-4-乙烯基環己烷、3,4-環氧基環己基甲基丙烯酸甲酯及檸檬烯二氧化物所成群之一種以上為佳。此外,本發明之硬化性組成物中,前述聚合物(E)為由前述式(I)表示之單體及前述式(II)表示之單體所得的聚合物,前述式(I)中之X為碳原子數6~12之芳基,前述式(II)中之X’為碳原子數1~7之烷基,前述烷基經環氧基所取代者為佳。 The curable composition of the present invention, wherein the glycidyl compound of a polyhydric alcohol with a molecular weight of 200 or more or the glycidyl compound (A1) of a polyhydric alcohol alkylene oxide adduct has a polyhydric alcohol having a condensed ring Polyols are preferred. In addition, in the curable composition of the present invention, the alicyclic epoxy compound (A2) is selected from 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylic acid Esters, 7-oxabicyclo[4.1.0]heptane, poly[oxy-(1-oxo-1,6-hexanediyl)] derivatives, adipic acid bis[(7-oxabi Cyclo[4.1.0]heptan-3-yl)methyl], 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexyl methyl methacrylate and limonene More than one kind of oxides is preferred. In addition, in the curable composition of the present invention, the polymer (E) is a polymer obtained from the monomer represented by the formula (I) and the monomer represented by the formula (II). X is an aryl group having 6 to 12 carbon atoms, X'in the aforementioned formula (II) is an alkyl group having 1 to 7 carbon atoms, and the aforementioned alkyl group is preferably substituted by an epoxy group.
本發明之硬化性組成物之製造方法,其特徵 係對本發明之硬化性組成物進行活性能量線照射,或進行加熱。 The manufacturing method of the curable composition of the present invention is characterized by The curable composition of the present invention is irradiated with active energy rays or heated.
本發明之硬化物,其特徵為本發明之硬化性組成物的硬化物。 The cured product of the present invention is characterized by the cured product of the curable composition of the present invention.
依據本發明時,可提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。本發明之硬化性組成物,特別是可用於接著劑。 According to the present invention, it is possible to provide a curable composition with a high glass transition temperature of the cured product and excellent adhesion, a method for manufacturing a cured product, and a cured product thereof. The curable composition of the present invention is particularly useful for adhesives.
以下詳細說明本發明之硬化性組成物。 The curable composition of the present invention will be described in detail below.
本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)30~99質量份、陽離子聚合起始劑(B)0.1~10質量份、自由基聚合性成分(C)0~55質量份、自由基聚合起始劑(D)0~10質量份及選自由下述式(I)表示之單體所得之聚合物、由下述式(II)表示之單體所得之聚合物、選自下述式(I)表示之單體之二種以上之單體所得之聚合物、選自下述式(II)表示之單體之二種以上之單體所得之聚合物、或選自下述式(I)表示之單體及下述式(II)表示之單體所得之聚合物所成群組之重量平均分子量1,000~30,000的聚合物(E)1~30質量份,使(A)成分與(C)成分與(E)成分之合計成為100質量份。本發明之硬化性組成物中,陽離子聚合性 成分(A)係以分子量200以上之多元醇的環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)與脂環式環氧化合物(A2)為必須成分,自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2)為必須成分。 The curable composition of the present invention contains: 30 to 99 parts by mass of cationic polymerizable component (A), 0.1 to 10 parts by mass of cationic polymerization initiator (B), and 0 to 55 parts by mass of radical polymerizable component (C) Parts by mass, 0-10 parts by mass of the radical polymerization initiator (D), and polymers selected from the monomers represented by the following formula (I), and polymers derived from the monomers represented by the following formula (II) , A polymer obtained from two or more monomers selected from the monomer represented by the following formula (I), a polymer obtained from two or more monomers selected from the monomer represented by the following formula (II), or 1-30 parts by mass of polymer (E) with a weight average molecular weight of 1,000 to 30,000 selected from the group consisting of a monomer represented by the following formula (I) and a monomer represented by the following formula (II), The total of (A) component, (C) component, and (E) component is 100 parts by mass. In the curable composition of the present invention, cationic polymerizable Component (A) is based on the glycidyl compound of a polyol with a molecular weight of 200 or more or the glycidyl compound (A1) and alicyclic epoxy compound (A2) of polyol alkylene oxide adducts as essential components. The radical polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylate of an alcohol with 2 to 20 carbon atoms, or a methyl group of an alcohol with 2 to 20 carbon atoms Acrylate (C2) is an essential component.
在此,式(I)中,X係碳原子數1~7之烷基、碳原子數1~7之烷氧基、碳原子數6~12之芳基、碳原子數6~12之芳氧基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上的基所取代者。 Here, in formula (I), X is an alkyl group with 1 to 7 carbon atoms, an alkoxy group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, and an aromatic group with 6 to 12 carbon atoms. An oxy group or an alicyclic hydrocarbon group with 6 to 10 carbon atoms, or hydrogen atoms in these groups are selected from one or more groups selected from the group consisting of epoxy, oxetanyl, hydroxyl, and carboxyl groups Replaced by.
在此,式(II)中,R1表示氫原子、甲基或鹵素原子,X’係碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基、或此等之基中之氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代者。 Here, in formula (II), R 1 represents a hydrogen atom, a methyl group or a halogen atom, and X'is an alkyl group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms or 6 to 10 carbon atoms The alicyclic hydrocarbon group or the hydrogen atom in these groups is substituted with one or more groups selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group and carboxyl group.
本發明之硬化性組成物的陽離子聚合性成分(A)係藉由以能量線照射或加熱活性化的陽離子聚合起始劑,產生高分子化或交聯反應的化合物。可列舉環氧化合物、氧雜環丁烷化合物、乙烯醚化合物等。 The cationically polymerizable component (A) of the curable composition of the present invention is a compound that undergoes polymerization or crosslinking reaction by a cationic polymerization initiator activated by energy ray irradiation or heating. Examples include epoxy compounds, oxetane compounds, and vinyl ether compounds.
本發明之硬化性組成物的陽離子聚合性成分(A)係以分子量200以上之多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)及脂環式環氧化合物(A2)作為必須成分,但是也可使用其他的環氧化合物,例如芳香族環氧化合物(A3)等。陽離子聚合性成分(A)中之上述(A1)成分及(A2)成分的比例,較佳為90質量%以上。 The cationically polymerizable component (A) of the curable composition of the present invention is based on the glycidyl compound (A1) of the polyol having a molecular weight of 200 or more or the glycidyl compound (A1) of the polyol alkylene oxide adduct and alicyclic ring The epoxy compound of the formula (A2) is an essential component, but other epoxy compounds such as aromatic epoxy compounds (A3) and the like can also be used. The ratio of the above-mentioned (A1) component and (A2) component in the cationically polymerizable component (A) is preferably 90% by mass or more.
上述分子量200以上之多元醇之環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉將多元醇或多元醇環氧烷加成物進行環氧丙基化者,且環氧丙基化物的分子量為200以上者為佳。 The epoxy propyl product of the polyhydric alcohol with a molecular weight of 200 or more or the glycidyl product (A1) of the polyhydric alcohol alkylene oxide adduct can be exemplified by the epoxy It is propylated, and the molecular weight of the glycidate is preferably 200 or more.
上述分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉1,4-丁二醇二環氧丙醚、1,6-己二醇二環氧丙醚、新戊二醇二環氧丙醚、丙三醇之三環氧丙醚、三羥甲基丙烷之三環氧丙醚、山梨醣醇之四環氧丙醚、二季戊四醇之六環氧丙醚、聚乙二醇之二環氧丙醚、聚丙二醇之二環氧丙醚、二環戊二烯二甲醇二環氧丙醚等之多元醇之環氧丙醚及藉由1種或2種以上之環氧烷與丙二醇、三羥甲基丙烷、丙三醇等之脂肪族多元醇進行加成所得之聚醚多元醇的聚環氧丙醚化物、脂肪族長鏈二元酸之二環氧丙酯。 The glycidyl product of the above-mentioned polyol having a molecular weight of 200 or more or the glycidyl product (A1) of the polyol alkylene oxide adduct includes 1,4-butanediol diglycidyl ether, 1, 6-Hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, triglycidyl ether of glycerol, triglycidyl ether of trimethylolpropane, tetraepoxy of sorbitol Propyl ether, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, dicyclopentadiene dimethanol diglycidyl ether, etc. Polyoxypropylene ether and polyoxypropylene etherate of polyether polyol obtained by addition of one or more kinds of alkylene oxide and aliphatic polyols such as propylene glycol, trimethylolpropane, glycerol, etc. , Diglycidyl ester of aliphatic long-chain dibasic acid.
多元醇之環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1),進一步可列舉脂肪族高級醇之單環氧丙醚或高級脂肪酸之環氧丙酯、環氧化大豆油、環氧基硬脂酸辛酯、環氧基硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。 The glycidyl compound of polyhydric alcohol or the glycidyl compound of polyhydric alcohol alkylene oxide adduct (A1), and further examples include the monoglycidyl ether of aliphatic higher alcohols or the glycidyl esters of higher fatty acids, cyclic Oxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized soybean oil, epoxidized polybutadiene, etc.
分子量200以上之多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)係含有飽和縮合環者,可提高硬化物之硬化性及密著性,故較佳。 The glycidyl compound (A1) of the polyol having a molecular weight of 200 or more or the glycidyl compound (A1) of the polyol alkylene oxide adduct contains saturated condensed rings, which can improve the hardenability and adhesion of the cured product, so Better.
上述分子量量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1)可使用市售品,可列舉例如Denacol EX-121、Denacol EX-171、Denacol EX-192、Denacol EX-211、Denacol EX-212、Denacol EX-313、Denacol EX-314、Denacol EX-321、Denacol EX-411、Denacol EX-421、Denacol EX-512、Denacol EX-521、Denacol EX-611、Denacol EX-612、Denacol EX-614、Denacol EX-622、Denacol EX-810、Denacol EX-811、Denacol EX-850、Denacol EX-851、Denacol EX-821、Denacol EX-830、Denacol EX-832、Denacol EX-841、Denacol EX-861、Denacol EX-911、Denacol EX-941、Denacol EX-920、Denacol EX-931(nagase chemtex(股)公司製);EpoliteM-1230、Epolite40E、Epolite100E、Epolite200E、Epolite400E、Epolite70P、Epolite200P、Epolite400P、Epolite1500NP、Epolite1600、Epolite80MF、Epolite100MF(共榮社化學 (股)公司製)、ADEKA GLYCIROLED-503、ADEKA GLYCIROLED-503G、ADEKA GLYCIROLED-506、ADEKA GLYCIROLED-523T、ADEKA ResinEP-4088S、ADEKA ResinEP-4080E((股)ADEKA公司製)等。 Commercially available products can be used for the glycidyl product of the polyol having a molecular weight of 200 or more or the glycidyl product (A1) of the polyol alkylene oxide adduct, for example, Denacol EX-121, Denacol EX- 171, Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX- 521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX- 830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagase Chemtex Corporation); EpoteM-1230, Epolite40E,Epolite100E,Epolite200E,Epolite400E,Epolite70P,Epolite200P,Epolite400P,Epolite1500NP,Epolite1600,Epolite80MF,Epolite100MF (Kyoeisha Chemical (Share) company), ADEKA GLYCIROLED-503, ADEKA GLYCIROLED-503G, ADEKA GLYCIROLED-506, ADEKA GLYCIROLED-523T, ADEKA ResinEP-4088S, ADEKA ResinEP-4080E ((share) ADEKA company), etc.
上述脂環式環氧化合物(A2)係指環氧乙烷環不經由鍵結基而直接鍵結於飽和環者。脂環式環氧化合物(A2)之具體例,可列舉藉由將具有至少1個脂環式環之多元醇的聚環氧丙醚化物或含有環己烯或環戊烯環之化合物以氧化劑進行環氧化所得的含有環己烯氧化物或環戊烯氧化物的化合物。可列舉例如3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯、6-甲基-3,4-環氧基環己基甲基-6-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-3-甲基環己基甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧基環己烷)、丙烷-2,2-二基-雙(3,4-環氧基環己烷)、2,2-雙(3,4-環氧基環己基)丙烷、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷羧酸酯)、環氧基六氫鄰苯二甲酸二辛酯、環氧基六氫鄰苯二甲酸二-2-乙基己酯、1-環氧基乙基-3,4-環氧基環己烷、1,2-環氧基-2-環氧基乙基環己烷、α-蒎烯氧化物、檸檬烯二氧化物等。脂環式環氧化合物(A2)從提高密著性的觀點,較佳為3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸 酯或3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯。 The above-mentioned alicyclic epoxy compound (A2) means that the ethylene oxide ring is directly bonded to a saturated ring without a bonding group. Specific examples of the alicyclic epoxy compound (A2) can be exemplified by using a polyglycidide etherate of a polyol having at least one alicyclic ring or a compound containing a cyclohexene or cyclopentene ring with an oxidizing agent Cyclohexene oxide or cyclopentene oxide-containing compound obtained by epoxidation. Examples include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy -1-methylhexane carboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexane carboxylate, 3, 4-Epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexane carboxylate, 3,4-epoxy-5-methylcyclohexylmethyl -3,4-Epoxy-5-methylcyclohexanecarboxylate, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methyl Cyclohexane carboxylate, methylene bis(3,4-epoxycyclohexane), propane-2,2-diyl-bis(3,4-epoxycyclohexane), 2, 2-bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, ethylenebis(3,4-epoxycyclohexane carboxylate), epoxy six Dioctyl hydrogen phthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2- Epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide, etc. The alicyclic epoxy compound (A2) is preferably 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylic acid from the viewpoint of improving adhesion Ester or 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexane carboxylate.
上述脂環式環氧化合物(A2)可使用市售品,可列舉例如CELLOXID 2021P、CELLOXID 2081、CELLOXID 2000、CELLOXID 3000((股)DAICEL公司製)等。 Commercial products can be used for the alicyclic epoxy compound (A2), and examples thereof include CELLOXID 2021P, CELLOXID 2081, CELLOXID 2000, and CELLOXID 3000 (manufactured by DAICEL Corporation).
上述芳香族環氧化合物(A3)係指含有芳香環的環氧化合物,而芳香族環氧化合物之具體例,可列舉酚、甲酚、丁酚等具有至少1個芳香族環的多元酚或其環氧烷加成物之單/聚環氧丙醚化物,可列舉例如雙酚A、雙酚F、或此等再加成有環氧烷之化合物之環氧丙醚化物或環氧基酚醛清漆樹脂;間苯二酚或氫醌、兒茶酚等之具有2個以上之酚性羥基的芳香族化合物之單/聚環氧丙醚化物;苯基二甲醇或苯基二乙醇、苯基二丁醇等之具有2個以上之醇性羥基之芳香族化合物之環氧丙醚化物;鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等之具有2個以上之羧酸的多元酸芳香族化合物之環氧丙酯、苯甲酸之環氧丙酯、苯乙烯氧化物或二乙烯基苯之環氧化物等。 The above-mentioned aromatic epoxy compound (A3) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound include polyhydric phenols having at least one aromatic ring, such as phenol, cresol, and butylphenol, or The mono/polyglycidyl etherate of its alkylene oxide adducts can include, for example, bisphenol A, bisphenol F, or the glycidyl etherate or epoxy group of these compounds to which alkylene oxide is added. Novolac resin; mono/polyglycidyl etherate of aromatic compounds with more than two phenolic hydroxyl groups such as resorcinol, hydroquinone, catechol, etc.; phenyl dimethanol or phenyl diethanol, benzene Glycidyl etherate of aromatic compounds with two or more alcoholic hydroxyl groups, such as dibutanol; polybasic carboxylic acid, such as phthalic acid, terephthalic acid, trimellitic acid, etc. Glycidyl ester of acid aromatic compounds, glycidyl ester of benzoic acid, styrene oxide or epoxide of divinylbenzene, etc.
上述芳香族環氧化合物(A3)可使用市售品,可列舉例如Denacol EX-146、Denacol EX-147、Denacol EX-201、Denacol EX-203、Denacol EX-711、Denacol EX-721、Oncoat EX-1020、Oncoat EX-1030、Oncoat EX-1040、Oncoat EX-1050、Oncoat EX-1051、Oncoat EX-1010、Oncoat EX-1011、Oncoat1012(nagase chemtex(股)公司製);OGSOLPG-100、OGSOLEG-200、OGSOLEG-210、OGSOLEG-250(大阪氣體化學(股)公司製);HP4032、HP4032D、HP4700(DIC(股)公司製);ESN-475V(新日鐵住金化學(股)公司製);EpikoteYX8800(三菱化學(股)公司製);Marproof G-0105SA、Marproof G-0130SP(日油(股)公司製);EPICLONN-665、EPICLONHP-7200(DIC(股)公司製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-7000L(日本化藥(股)公司製);ADEKA ResinEP-4000、ADEKA ResinEP-4005、ADEKA ResinEP-4100、ADEKA ResinEP-4901((股)ADEKA公司製);TECHMORE VG-3101L((股)Printec公司製)等。上述芳香族環氧化合物中,多官能者因硬化性優異,故較佳。 Commercial products can be used for the above-mentioned aromatic epoxy compound (A3), and examples include Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX -1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat 1012(nagase Chemtex Corporation); OGSOLPG-100, OGSOLEG-200, OGSOLEG-210, OGSOLEG-250 (Osaka Gas Chemical Corporation); HP4032, HP4032D, HP4700 (DIC Corporation); ESN- 475V (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); Epikote YX8800 (manufactured by Mitsubishi Chemical Co., Ltd.); Marproof G-0105SA, Marproof G-0130SP (manufactured by NOF Corporation); EPICLONN-665, EPICLONHP- 7200 (made by DIC Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L( Nippon Kayaku Co., Ltd.); ADEKA ResinEP-4000, ADEKA ResinEP-4005, ADEKA ResinEP-4100, ADEKA ResinEP-4901 (made by ADEKA Corporation); TECHMORE VG-3101L (made by Printec Corporation) Wait. Among the above-mentioned aromatic epoxy compounds, polyfunctional ones are preferred because they are excellent in curability.
上述氧雜環丁烷化合物,可列舉3,7-雙(3-氧環丁基)-5-氧雜-壬烷、1,4-雙〔(3-乙基-3-氧環丁基甲氧基)甲基]苯、1,2-雙〔(3-乙基-3-氧環丁基甲氧基)甲基]乙烷、1,3-雙〔(3-乙基-3-氧環丁基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧環丁基甲基)醚、1,4-雙(3-乙基-3-氧環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧環丁基甲氧基)己烷等之二官能脂肪族氧雜環丁烷化合物、3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基) 氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、3-乙基-3-(氯甲基)氧雜環丁烷等之一官能氧雜環丁烷化合物等。此等可1種單獨使用或組合2種以上使用。 The above-mentioned oxetane compounds include 3,7-bis(3-oxocyclobutyl)-5-oxa-nonane, 1,4-bis[(3-ethyl-3-oxocyclobutylmethoxy) Yl)methyl]benzene, 1,2-bis[(3-ethyl-3-oxocyclobutylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxobutylmethyl) Oxy)methyl)propane, ethylene glycol bis(3-ethyl-3-oxocyclobutylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxocyclobutylmethyl)ether, tetraethylenedi Alcohol bis(3-ethyl-3-oxocyclobutylmethyl)ether, 1,4-bis(3-ethyl-3-oxobutylmethoxy)butane, 1,6-bis(3-ethyl- Difunctional aliphatic oxetane compounds such as 3-oxocyclobutylmethoxy)hexane, 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl- 3-(hexyloxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl) Oxetane, 3-ethyl-3-(hydroxymethyl)oxetane, 3-ethyl-3-(chloromethyl)oxetane and other monofunctional oxetanes Compound etc. These can be used individually by 1 type or in combination of 2 or more types.
上述氧雜環丁烷化合物,可使用以陽離子聚合性單體為主成分的市售品,可列舉例如2-羥基乙基乙烯醚、二乙二醇單乙烯醚、4-羥基丁基乙烯醚(丸善石油化學(股)公司製);Aron Oxetane OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成(股)公司製)、ETERNACOLLOXBP、OXTP(宇部興產(股)公司製)等。 As the above-mentioned oxetane compound, a commercially available product containing a cationically polymerizable monomer as a main component can be used, and examples include 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, and 4-hydroxybutyl vinyl ether. (Manufactured by Maruzen Petrochemical Co., Ltd.); Aron Oxetane OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (manufactured by Toagosei Co., Ltd.), ETERNACOLLOXBP, OXTP (manufactured by Ube Industries Co., Ltd.), etc.
上述乙烯醚化合物,可列舉例如二乙二醇單乙烯醚、三乙二醇二乙烯醚、n-十二烷基乙烯醚、環己基乙烯醚、2-乙基己基乙烯醚、2-氯乙基乙烯醚、乙基乙烯醚、異丁基乙烯醚、三乙二醇乙烯醚、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、1,6-環己烷二甲醇單乙烯醚、乙二醇二乙烯醚、1,4-丁二醇二乙烯醚、1,6-環己烷二甲醇二乙烯醚等。 The above-mentioned vinyl ether compounds include, for example, diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl Vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether , Ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether, etc.
上述陽離子聚合性成分(A)中,上述分子量200以上之多元醇的環氧丙基化物或多元醇環氧烷加成物之環氧丙基化物(A1)、脂環式環氧化合物(A2)、芳香族環氧化合物(A3)、氧雜環丁烷化合物及乙烯醚化合物的使用比例係相對於陽離子聚合性成分(A)100質量份時,分子量200以上之多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)10~99質量份、脂環式環氧化合物 (A2)1~50質量份、芳香族環氧化合物(A3)0~80質量份、氧雜環丁烷化合物0~50質量份、乙烯醚化合物0~20質量份時,可提高黏度、塗佈性、反應性及硬化性,故較佳。 In the above-mentioned cationically polymerizable component (A), the glycidyl compound of the polyol having a molecular weight of 200 or more or the glycidyl compound of the polyol alkylene oxide adduct (A1), the alicyclic epoxy compound (A2) ), aromatic epoxy compound (A3), oxetane compound, and vinyl ether compound are used in proportions relative to 100 parts by mass of the cationically polymerizable component (A), the epoxy propyl group of a polyol with a molecular weight of 200 or more Epoxy propyl compound (A1) 10~99 mass parts, alicyclic epoxy compound or polyhydric alcohol alkylene oxide adduct (A2) 1 to 50 parts by mass, 0 to 80 parts by mass of aromatic epoxy compound (A3), 0 to 50 parts by mass of oxetane compound, and 0 to 20 parts by mass of vinyl ether compound can increase viscosity and coating Clothability, reactivity and hardening properties are preferred.
本發明之硬化性組成物的陽離子聚合起始劑(B)係指藉由能量線照射或加熱可釋放使陽離子聚合開始之物質的化合物時,皆可使用,較佳為藉由能量線照射釋出路易斯酸之鎓鹽的複鹽或其衍生物。此化合物之代表性者,可列舉下述通式、[A]r+[B]r- The cationic polymerization initiator (B) of the curable composition of the present invention refers to a compound that can release a substance that initiates cationic polymerization by energy ray irradiation or heating. It can be used, and it is preferably released by energy ray irradiation. The double salt of the onium salt of Lewis acid or its derivative. Representatives of this compound include the following general formula, [A] r+ [B] r-
表示之陽離子與陰離子的鹽。 Represents the salt of the cation and anion.
此處,陽離子[A]r+較佳為鎓類,其構造例如可以下述通式[(R2)aQ]r+ Here, the cation [A] r+ is preferably an onium, and its structure can be, for example, the following general formula [(R 2 ) a Q] r+
表示。 Express.
再者,此處,R2係碳原子數為1~60,也可含有幾個碳原子以外之原子的有機基。a為1~5之整數。a個之R2可各自獨立為相同或相異。又,至少1個為具有芳香環之如上述的有機基較佳。Q為選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成群之原子或原子團。又,陽離子[A]r+中之Q的原子價為q時,r=a-q之關係(惟,N=N視為原子價0)必須成立。 In addition, here, R 2 is an organic group having 1 to 60 carbon atoms, and may contain several atoms other than carbon atoms. a is an integer from 1 to 5. R 2 of a can be the same or different independently. In addition, at least one of them is preferably an organic group as described above having an aromatic ring. Q is an atom or group of atoms selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N=N. In addition, when the valence of Q in the cation [A] r+ is q, the relationship r=aq (but N=N is regarded as the valence 0) must be established.
又,陰離子[B]r-較佳為鹵化物錯合物,其構造例如可以下述通式[LYb]r- In addition, the anion [B] r- is preferably a halide complex, and its structure can be, for example, the following general formula [LY b ] r-
表示。 Express.
此外,在此,L為鹵化物錯合物之中心原子的金屬或半金屬(Metalloid),其係B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y為鹵素原子。b為3~7之整數。又,陰離子[B]r-中之L的原子價當作p時,r=b-p之關係必須成立。 In addition, here, L is the metal or semimetal (Metalloid) of the central atom of the halide complex, which is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co, etc. Y is a halogen atom. b is an integer of 3-7. In addition, when the valence of L in the anion [B] r- is regarded as p, the relationship r=bp must be established.
上述通式之陰離子[LYb]r-的具體例,可列舉肆(五氟苯基)硼酸根、四(3,5-二氟-4-甲氧基苯基)硼酸根、四氟硼酸根(BF4)-、六氟磷酸根(PF6)-、六氟銻酸根(SbF6)-、六氟砷酸根(AsF6)-、六氯銻酸根(SbCl6)-等。 Specific examples of the anion [LY b ] r- of the above general formula include tetrakis (pentafluorophenyl) borate, tetrakis (3,5-difluoro-4-methoxyphenyl) borate, and tetrafluoroboric acid root (BF 4) -, hexafluorophosphate (PF 6) -, hexafluoroantimonate (SbF 6) -, hexafluoroarsenate (AsF 6) -, hexachloro antimonate (SbCl 6) - and the like.
又,陰離子[B]r-亦可使用下述通式[LYb-1(OH)]r- In addition, the anion [B] r- also the following general formula [LY b-1 (OH) ] r-
表示之構造者。L、Y、b係與上述相同。又,其他可使用之陰離子,可列舉過氯酸離子(ClO4)-、三氟甲基亞硫酸離子(CF3SO3)-、氟磺酸離子(FSO3)-、甲苯磺酸陰離子、三硝基苯磺酸陰離子、樟腦磺酸根、九氟丁烷磺酸根、十六氟辛烷磺酸根、四芳基硼酸根、肆(五氟苯基)硼酸根等。 The constructor of the representation. L, Y, and b are the same as above. In addition, other usable anions include perchlorate ion (ClO 4 ) - , trifluoromethyl sulfite ion (CF 3 SO 3 ) - , fluorosulfonic acid ion (FSO 3 ) - , toluenesulfonic acid anion, Trinitrobenzene sulfonate anion, camphor sulfonate, nonafluorobutane sulfonate, hexafluorooctane sulfonate, tetraaryl borate, tetrakis (pentafluorophenyl) borate, etc.
本發明之硬化性組成物中,如此鎓鹽之中,以使用下述(甲)~(丙)之芳香族鎓鹽特別有效。可由此等之中以1種單獨使用或混合2種以上使用。 In the curable composition of the present invention, among such onium salts, it is particularly effective to use the following aromatic onium salts (A) to (C). Among these, one type can be used alone or two or more types can be mixed and used.
(甲)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等之芳基重氮鎓鹽 (A) Phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate and other aryl diazonium salts
(乙)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-tert-丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪肆(五氟苯基)硼酸鹽等之二芳基錪鹽 (B) Diphenyl hexafluoroantimonate, bis(4-methylphenyl) hexafluorophosphate, bis(4-tert-butylphenyl) hexafluorophosphate, tolylcumene Diaryl iodonium salts such as pentafluorophenyl borate
(丙)下述群I或群II表示之鋶陽離子與六氟銻離子、六氟磷酸根離子、肆(五氟苯基)硼酸根離子等之鋶鹽 (C) The following group I or group II represented by alumium cation and hexafluoroantimony ion, hexafluorophosphate ion, tetrakis (pentafluorophenyl) borate ion, etc.
又,其他較佳者可列舉(η5-2,4-環戊二烯-1-基)〔(1,2,3,4,5,6-η)-(1-甲基乙基)苯〕-鐵-六氟磷酸鹽等之鐵-芳烴錯合物、或參(乙醯丙酮)鋁、參(乙醯乙酸乙酯)鋁、參(水楊醛)鋁等之鋁錯合物與三苯基矽烷醇等之矽烷醇類的混合物;噻吩鎓鹽、四氫噻吩鐵鹽(thiolanium)、苄基銨、吡啶鎓鹽、鉼鹽(hydrazinium)等之鹽;二乙烯三胺、三乙烯三胺、四乙烯五胺等之聚烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛爾酮二胺等之脂環式多胺類;m-苯二甲胺、二胺基二苯基甲烷、二胺基二苯基碸等之芳香族多胺類;藉由一般方法使上述 多胺類與苯基環氧丙醚、丁基環氧丙醚、雙酚A-二環氧丙醚、雙酚F-二環氧丙醚等之環氧丙醚類或羧酸之環氧丙酯類等的各種環氧樹脂反應所製造的聚環氧基加成改質物;藉由一般方法使上述有機多胺類與鄰苯二甲酸、間苯二甲酸、二聚酸等之羧酸類反應所製造的醯胺化改質物;藉由一般方法使上述多胺類與甲醛等之醛類及酚、甲酚、二甲酚、第三丁基酚、間苯二酚等之於核具有至少一個醛化反應性場所的酚類反應所製造的曼尼希(Mannich)化改質物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、二聚酸等之脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等之芳香族二羧酸類;環己烷二羧酸等之脂環式二羧酸類;偏苯三甲酸、均苯三甲酸(Trimesic Acid)、蓖麻油脂肪酸之三聚物等之三羧酸類;均苯四酸等之四羧酸類等)之酸酐;雙氰胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。 Moreover, other preferable ones include (η 5 -2,4-cyclopentadien-1-yl) [(1,2,3,4,5,6-η)-(1-methylethyl) Benzene]-iron-hexafluorophosphate and other iron-arene complexes, or ginseng (acetone) aluminum, ginseng (acetate ethyl) aluminum, ginseng (salicylic aldehyde) aluminum and other aluminum complexes Mixtures with silanols such as triphenylsilanol; thiophenium salt, thiolanium, benzylammonium, pyridinium salt, hydrazinium salt, etc.; diethylenetriamine, tris Polyalkyl polyamines such as ethylene triamine and tetraethylene pentamine; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophor Alicyclic polyamines such as ketonediamines; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane, diaminodiphenylmethane, etc.; the above-mentioned polyamines are made by general methods Glycidyl ethers such as phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether, etc. or glycidyl ester of carboxylic acid The polyepoxy adduct modified product produced by the reaction of various epoxy resins such as epoxy resins; the above-mentioned organic polyamines are reacted with carboxylic acids such as phthalic acid, isophthalic acid, and dimer acid by a general method. The produced amide modified product; the above-mentioned polyamines, formaldehyde and other aldehydes, phenols, cresols, xylenol, tertiary butylphenol, resorcinol, etc., have at least one in the core by a general method Mannich modified product produced by phenolic reaction in the aldehyde reactive site; polycarboxylic acid (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid) , Azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylglutaric acid, 2-methyl Aliphatic dicarboxylic acids such as suberic acid, 3,8-dimethyl sebacic acid, 3,7-dimethyl sebacic acid, hydrogenated dimer acid, dimer acid; phthalic acid, terephthalic acid Aromatic dicarboxylic acids such as formic acid, isophthalic acid and naphthalenedicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexane dicarboxylic acid; trimellitic acid, trimesic acid, castor oil Tricarboxylic acids such as trimers of fatty acids; tetracarboxylic acids such as pyromellitic acid, etc.) anhydrides; dicyandiamide, imidazoles, carboxylic acid esters, sulfonates, amide imides, etc.
此等之中,就實用面與提高光感度的觀點,使用芳香族錪鹽、芳香族鋶鹽、鐵-芳烴錯合物為佳;相對於陽離子聚合起始劑(B)100質量%,又更佳為含有至少0.1質量%以上之具有下述構造之芳香族鋶鹽。 Among these, from the viewpoint of practicality and improvement of photosensitivity, it is preferable to use aromatic iodonium salt, aromatic sulfonium salt, iron-arene complex; relative to 100% by mass of the cationic polymerization initiator (B), and More preferably, it contains at least 0.1% by mass or more of an aromatic sulfonium salt having the following structure.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19及R20各自獨立地表示氫原子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R21、R22、R23及R24各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基,R25表示氫原子、鹵素原子、碳原子數1~10之烷基或選自下述化學式(A)~(C)中的任一取代基,Anq-表示q價的陰離子,p表示使電荷為中性的係數。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 each independently represent a hydrogen atom, a halogen atom, and the number of carbon atoms from 1 to 10 alkyl group, C 1-10 alkoxy group or C 2-10 ester group, R 21 , R 22 , R 23 and R 24 each independently represent a hydrogen atom, a halogen atom or the number of carbon atoms An alkyl group of 1 to 10, R 25 represents a hydrogen atom, a halogen atom, an alkyl group of 1 to 10 carbon atoms, or any substituent selected from the following chemical formulas (A) to (C), An q- represents q For a valence anion, p represents a coefficient that makes the charge neutral.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39各自獨立地表示氫原子、鹵 素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R30、R31、R32、R33及R34各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 each independently represent a hydrogen atom, a halogen atom, an alkyl group with 1 to 10 carbon atoms, and 1 to 10 carbon atoms R 30 , R 31 , R 32 , R 33 and R 34 each independently represent a hydrogen atom, a halogen atom or an alkyl group with 1 to 10 carbon atoms.
上述通式(1)表示之化合物中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之鹵素原子,可列舉氟、氯、溴、碘等。 In the compound represented by the above general formula (1), R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , Halogen represented by R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Examples of the atom include fluorine, chlorine, bromine, and iodine.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之碳原子數1~10之烷基,可列舉甲基、乙基、丙基、異丙基、丁基、s-丁基、t-丁基、異丁基、戊基、異戊基、t-戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧基乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、t-丁硫基甲基、4-戊烯氧基甲基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己 基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫乙基、三甲基甲矽烷基乙基、t-丁基二甲基甲矽烷氧基甲基、2-(三甲基甲矽烷基)乙氧基甲基、t-丁氧基羰基甲基、乙氧基羰基甲基、乙基羰基甲基、t-丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥基甲基、2-羥基乙基、1-羥基乙基、2-羥基丙基、3-羥基丙基、3-羥基丁基、4-羥基丁基、1,2-二羥基乙基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkyl groups with 1 to 10 carbon atoms, including Methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, pentyl, isopentyl, t-pentyl, hexyl, cyclohexyl, heptyl, Octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl Group, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoromethyl, trifluoromethyl, chloromethyl, dichloro Methyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nine Fluorobutyl, decafluoropentyl, tridecafluorohexyl, pentafluoroheptyl, heptafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, methoxy Ethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4-pentenoxymethyl, trichloroethoxymethyl, Bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1-methyl-1-methoxyethyl, ethyldithioethyl , Trimethylsilylethyl, t-butyldimethylsilyloxymethyl, 2-(trimethylsilyl)ethoxymethyl, t-butoxycarbonylmethyl, ethyl Oxycarbonylmethyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, acryloxyethyl, methacryloxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl Group, acetoxyethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxy Butyl, 4-hydroxybutyl, 1,2-dihydroxyethyl, etc.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數1~10之烷氧基,可列舉甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、s-丁氧基、t-丁氧基、異丁氧基、戊氧基、異戊氧基、t-戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲硫基乙氧基、三氟甲氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkoxy groups having 1 to 10 carbon atoms, including methoxy, ethoxy, propoxy, isopropoxy, Butoxy, s-butoxy, t-butoxy, isobutoxy, pentoxy, isopentoxy, t-pentoxy, hexyloxy, cyclohexyloxy, cyclohexylmethoxy , Tetrahydrofuranoxy, tetrahydropyranoxy, 2-methoxyethoxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethoxy, methoxy Group ethoxyethoxy, methoxyethoxyethoxyethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy and the like.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數2~10之酯基,可列舉甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、t-丁基羰氧 基、甲氧基乙醯氧基、苯甲醯氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent ester groups with 2 to 10 carbon atoms, including methoxycarbonyl, ethoxycarbonyl, isopropoxycarbonyl, and phenoxy Carbonyl, acetoxy, propoxy, butoxy, chloroacetoxy, dichloroacetoxy, trichloroacetoxy, trifluoroacetoxy, t-butylcarbonyl Oxy, methoxyacetoxy, benzyloxy and the like.
相對於(A)成分與(B)成分與(C)成分之合計100質量份,陽離子聚合起始劑(B)之使用比例為陽離子聚合起始劑(B)0.1~10質量份,較佳為1~6質量份。太少時,容易變得硬化不足,過多時,有時對於硬化物之吸水率或硬化物強度等之諸物性有不良影響的情形。 The use ratio of the cationic polymerization initiator (B) is 0.1-10 parts by mass of the cationic polymerization initiator (B) relative to 100 parts by mass of the total of component (A), component (B) and component (C), preferably It is 1 to 6 parts by mass. When the amount is too small, the hardening is likely to be insufficient. When the amount is too large, it may adversely affect various physical properties such as the water absorption rate and the strength of the hardened product.
本發明之硬化性組成物的自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)或碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2)為必須成分。 The radically polymerizable component (C) of the curable composition of the present invention is a compound having an epoxy group and an ethylenically unsaturated group (C1) or an acrylate of an alcohol with 2 to 20 carbon atoms or an acrylate with 2 to 20 carbon atoms. ~20 alcohol methacrylate (C2) is an essential ingredient.
上述具有環氧基及乙烯性不飽和基的化合物(C1),可列舉例如環氧基丙烯酸酯或環氧基甲基丙烯酸酯,具體而言,使以往公知之芳香族環氧樹脂、脂環式環氧樹脂、脂肪族環氧樹脂等與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯。此等之環氧基丙烯酸酯或環氧基甲基丙烯酸酯之中,特佳為醇類之環氧丙醚的丙烯酸酯或甲基丙烯酸酯。 The compound (C1) having an epoxy group and an ethylenically unsaturated group includes, for example, epoxy acrylate or epoxy methacrylate. Specifically, conventionally known aromatic epoxy resins and alicyclic Formula epoxy resins, aliphatic epoxy resins, etc., are acrylates obtained by reacting with acrylic acid or methacrylic acid. Among these epoxy acrylates or epoxy methacrylates, acrylate or methacrylate of glycidyl ether of alcohols is particularly preferred.
上述碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2),可列舉使分子中具有至少1個羥基的芳香族或脂肪族醇及其環氧烷加成物與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯或甲基丙烯酸酯。具體而言,可列舉2-乙基己基丙烯酸酯、2-羥基乙基丙烯酸酯、2-羥基丙基丙烯酸酯、異戊基丙烯酸酯、月桂基丙烯酸酯、十八烷基丙烯酸酯、異辛基丙烯酸酯、四氫糠基丙 烯酸酯、異莰基丙烯酸酯、苄基丙烯酸酯、1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、新戊二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯、ε-己內酯改質二季戊四醇六丙烯酸酯、2-乙基己基甲基丙烯酸酯、2-羥基乙基甲基丙烯酸酯、2-羥基丙基甲基丙烯酸酯、異戊基甲基丙烯酸酯、月桂基甲基丙烯酸酯、十八烷基甲基丙烯酸酯、異辛基甲基丙烯酸酯、四氫糠基甲基丙烯酸酯、異莰基甲基丙烯酸酯、苄基甲基丙烯酸酯、1,3-丁二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、新戊二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、聚丙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、二季戊四醇六甲基丙烯酸酯、ε-己內酯改質二季戊四醇六甲基丙烯酸酯等。又,此等之丙烯酸酯或甲基丙烯酸酯之中,特佳為多元醇之聚丙烯酸酯類或多元醇之聚甲基丙烯酸酯類。 The above-mentioned acrylates of alcohols with 2 to 20 carbon atoms or methacrylates (C2) of alcohols with 2 to 20 carbon atoms include aromatic or aliphatic alcohols having at least one hydroxyl group in the molecule and their rings Acrylate or methacrylate obtained by reacting an oxane adduct with acrylic acid or methacrylic acid. Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isoamyl acrylate, lauryl acrylate, octadecyl acrylate, and isooctyl acrylate can be cited. Acrylate, tetrahydrofurfuryl propylene Acrylate, isobornyl acrylate, benzyl acrylate, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, diethyl Glycol diacrylate, triethylene glycol diacrylate, neopentyl glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, Dipentaerythritol hexaacrylate, ε-caprolactone modified dipentaerythritol hexaacrylate, 2-ethylhexyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, iso Amyl methacrylate, lauryl methacrylate, octadecyl methacrylate, isooctyl methacrylate, tetrahydrofurfuryl methacrylate, isobornyl methacrylate, benzyl Methacrylate, 1,3-Butanediol Dimethacrylate, 1,4-Butanediol Dimethacrylate, 1,6-Hexanediol Dimethacrylate, Diethylene Glycol Dimethacrylate Base acrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylolpropane trimethyl Acrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexamethacrylate, ε-caprolactone is modified dipentaerythritol hexamethacrylate, etc. Furthermore, among these acrylates or methacrylates, polyacrylates of polyols or polymethacrylates of polyols are particularly preferred.
上述自由基聚合性成分(C)可使用(C1)或(C2)以外,藉由以能量線照射或加熱活性化之自由基聚合起始劑,進行高分子化或交聯反應的化合物,可列舉例如烯丙基胺基甲酸酯化合物、不飽和聚酯化合物、苯乙烯系化合物等。自由基聚合性成分(C)中之上述(C1)成分及(C2)成分 的比例,較佳為50質量%以上。 The above-mentioned radically polymerizable component (C) may be a compound other than (C1) or (C2), which is polymerized or cross-linked by a radical polymerization initiator activated by energy ray irradiation or heating. For example, an allyl carbamate compound, an unsaturated polyester compound, a styrene compound, etc. are mentioned. The above (C1) component and (C2) component in the radical polymerizable component (C) The ratio of is preferably 50% by mass or more.
本發明之硬化性組成物的自由基起始劑(D)無特別限制,可使用習知者。可使用例如苯乙酮系化合物、苄基系化合物、二苯甲酮系化合物、噻噸酮系化合物等之酮系化合物、肟系化合物等。 The radical initiator (D) of the curable composition of the present invention is not particularly limited, and conventional ones can be used. For example, ketone-based compounds such as acetophenone-based compounds, benzyl-based compounds, benzophenone-based compounds, and thioxanthone-based compounds, and oxime-based compounds can be used.
本發明之硬化性組成物的聚合物(E)係選自由上述式(I)表示之單體所得之聚合物、由上述式(II)表示之單體所得之聚合物、選自上述式(I)表示之單體之二種以上之單體所得之聚合物、選自上述式(II)表示之單體之二種以上之單體所得之聚合物及由上述式(I)表示之單體及上述式(II)表示之單體所得之聚合物所成群,且重量平均分子量以聚苯乙烯換算為1,000~30,000。 The polymer (E) of the curable composition of the present invention is selected from polymers derived from the monomer represented by the above formula (I), polymers derived from the monomer represented by the above formula (II), selected from the above formula ( I) A polymer obtained from two or more monomers of the monomer represented by the above formula (II), a polymer obtained from two or more monomers selected from the monomer represented by the above formula (II), and a monomer represented by the above formula (I) The weight average molecular weight is 1,000 to 30,000 in terms of polystyrene.
上述式(I)中之X表示之碳原子數1~7之烷基,可列舉甲基、乙基、丙基、iso-丙基、丁基、sec-丁基、tert-丁基、iso-丁基、戊基、iso-戊基、tert-戊基、己基、2-己基、3-己基、環己基、4-甲基環己基、庚基、2-庚基、3-庚基、iso-庚基、tert-庚基等。此等之中,從硬化性的觀點,碳原子數1~4之烷基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基進行部分取代之碳原子數1~4之烷基為佳。 The alkyl group having 1 to 7 carbon atoms represented by X in the above formula (I) includes methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso -Butyl, pentyl, iso-pentyl, tert-pentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, etc. Among them, from the viewpoint of hardening, the alkyl group with 1 to 4 carbon atoms or one or more groups selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group and carboxyl group are partially substituted The alkyl group with 1 to 4 carbon atoms is preferred.
上述式(I)中之X表示之碳原子數1~7之烷氧基,可列舉甲氧基、乙氧基、丙氧基、iso-丙氧基、丁氧基、sec-丁氧基、tert-丁氧基、iso-丁氧基、戊氧基、iso-戊氧基、tert-戊氧基、己氧基、2-己氧基、3-己氧基、環 己氧基、4-甲基環己氧基、庚氧基、2-庚氧基、3-庚氧基、iso-庚氧基、tert-庚氧基等。此等之中,從硬化性的觀點,碳原子數1~4之烷氧基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基進行部分取代之碳原子數1~4之烷氧基為佳。 The alkoxy group having 1 to 7 carbon atoms represented by X in the above formula (I) includes methoxy, ethoxy, propoxy, iso-propoxy, butoxy, and sec-butoxy , Tert-butoxy, iso-butoxy, pentyloxy, iso-pentoxy, tert-pentoxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, ring Hexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert-heptyloxy, etc. Among these, from the viewpoint of curability, an alkoxy group having 1 to 4 carbon atoms or one or more groups selected from the group consisting of epoxy group, oxetanyl group, hydroxyl group, and carboxyl group are part of it. The substituted alkoxy group having 1 to 4 carbon atoms is preferred.
上述式(I)中之X表示之碳原子數6~12之芳基,可列舉苯基、甲基苯基、萘基等。 The aryl group having 6 to 12 carbon atoms represented by X in the above formula (I) includes phenyl, methylphenyl, naphthyl and the like.
上述式(I)中之X表示之碳原子數6~12之芳氧基,可列舉苯氧基、甲基苯氧基、萘氧基等。 The aryloxy group having 6 to 12 carbon atoms represented by X in the above formula (I) includes a phenoxy group, a methylphenoxy group, and a naphthoxy group.
上述式(I)中之X表示之碳原子數6~10之脂環式烴基,可列舉環己基、甲基環己基、降莰基、雙環戊基、雙環辛基、三甲基雙環庚基、三環辛基、三環癸基、螺辛基、螺雙環戊基、金剛烷基、異莰基等。 The alicyclic hydrocarbon group with 6 to 10 carbon atoms represented by X in the above formula (I) includes cyclohexyl, methylcyclohexyl, norbornyl, dicyclopentyl, bicyclooctyl, and trimethylbicycloheptyl , Tricyclooctyl, tricyclodecyl, spirooctyl, spirobicyclopentyl, adamantyl, isobornyl, etc.
此等之烷基、烷氧基、芳基、芳氧基及脂環式烴基,可為此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代。 These alkyl groups, alkoxy groups, aryl groups, aryloxy groups and alicyclic hydrocarbon groups can be selected from the group consisting of epoxy, oxetanyl, hydroxy and carboxyl groups. A group of more than one group is substituted.
上述式(I)中,X之一部分為經環氧基或氧雜環丁烷基取代時之式(I)表示的單體,可列舉例如下述式(1)~(3)表示之單體。 In the above formula (I), a part of X is a monomer represented by the formula (I) when it is substituted with an epoxy group or an oxetanyl group. Examples include the monomers represented by the following formulas (1) to (3) body.
在此,式(1)中,R3表示氫原子或碳原子數1~6之烷 基,m為1~6之整數。 Here, in formula (1), R 3 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and m is an integer of 1 to 6.
在此,式(2)中,R4表示氫原子或碳原子數1~6之烷基,n為1~6之整數。 Here, in formula (2), R 4 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 6.
在此,式(3)中,R5表示氫原子或碳原子數1~6之烷基,s為1~6之整數。 Here, in formula (3), R 5 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and s is an integer of 1 to 6.
上述式(II)中,以R1所表示的鹵原子,可列舉氟、氯、溴、碘等。 In the above formula (II), the halogen atom represented by R 1 includes fluorine, chlorine, bromine, and iodine.
上述式(II)中,X’之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基,可列舉與上述式(I)同樣者。 In the above formula (II), the alkyl group with 1 to 7 carbon atoms, the aryl group with 6 to 12 carbon atoms or the alicyclic hydrocarbon group with 6 to 10 carbon atoms of X'can be exemplified by the above formula (I) Same thing.
上述式(II)中,X’之一部分經環氧基或氧雜環丁烷基取代時,作為式(II)所表示之單體,可列舉下述式(4)~(6)所表示者。 In the above formula (II), when a part of X'is substituted with an epoxy group or an oxetanyl group, the monomer represented by the formula (II) may be represented by the following formulas (4) to (6) By.
在此,式(4)中,R1係與上述式(II)相同,R6表示氫原子或碳原子數1~6之烷基,t為1~6之整數。 Here, in the formula (4), R 1 is the same as the above formula (II), R 6 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and t is an integer of 1 to 6.
在此,式(5)中,R1係與上述式(II)相同,R7表示氫原子或碳原子數1~6之烷基,q為1~6之整數。 Here, in the formula (5), R 1 is the same as the above formula (II), R 7 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and q is an integer of 1 to 6.
在此,式(6)中,R1係與上述式(II)相同,R8表示氫原子或碳原子數1~6之烷基,y為1~6之整數。 Here, in the formula (6), R 1 is the same as the above formula (II), R 8 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and y is an integer of 1 to 6.
上述聚合物(E)中,構成聚合物之單體的使用比例係上述X為經選自由環氧基、環雜環丁烷基、羥基及羧基所成群之1種以上之基取代之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基時,使上述(I)或(II)表示之單體成為10~100質量%來使用,由於接著性提高,故較佳。 In the above-mentioned polymer (E), the use ratio of the monomers constituting the polymer is that the above-mentioned X is a carbon substituted with one or more groups selected from the group consisting of epoxy group, cyclobutane group, hydroxyl group and carboxyl group In the case of an alkyl group with 1 to 7 atoms, an aryl group with 6 to 12 carbon atoms, or an alicyclic hydrocarbon group with 6 to 10 carbon atoms, make the monomer represented by (I) or (II) above 10-100 mass % To use, because the adhesion is improved, so it is better.
本發明之硬化性組成物中,上述陽離子聚合性成分(A)係30~99質量份、較佳為40~95質量份,上述陽離子聚合起始劑(B)為0.1~10質量份、較佳為1~8質量份,上述自由基聚合性成分(C)為0~55質量份,上述自由基聚合起始劑(D)為0~10質量份、較佳為0.1~8質量份,上述聚合物(E)為1~30質量份。在上述調配比例以外時,硬化物之硬化性及密著性有變差的疑慮。 In the curable composition of the present invention, the cationic polymerizable component (A) is 30 to 99 parts by mass, preferably 40 to 95 parts by mass, and the cationic polymerization initiator (B) is 0.1 to 10 parts by mass. It is preferably 1 to 8 parts by mass, the radical polymerizable component (C) is 0 to 55 parts by mass, and the radical polymerization initiator (D) is 0 to 10 parts by mass, preferably 0.1 to 8 parts by mass, The said polymer (E) is 1-30 mass parts. If the blending ratio is other than the above, the curability and adhesion of the cured product may be deteriorated.
本發明之硬化性組成物中,可依需要進一步使用增感劑及/或增感助劑。增感劑係於較陽離子聚合起始劑(B)所顯示之極大吸收波長更長的波長顯示極大吸收,促進藉由陽離子聚合起始劑(B)之聚合起始反應的化合物。又,增感助劑係更進一步促進增感劑之作用的化合物。 In the curable composition of the present invention, a sensitizer and/or a sensitizer auxiliary may be further used as needed. The sensitizer is a compound that exhibits maximum absorption at a wavelength longer than the maximum absorption wavelength shown by the cationic polymerization initiator (B), and promotes the polymerization initiation reaction by the cationic polymerization initiator (B). In addition, the sensitization aid is a compound that further promotes the action of the sensitizer.
增感劑及增感助劑可列舉蒽系化合物、萘系化合物等。 Examples of sensitizers and sensitization aids include anthracene-based compounds and naphthalene-based compounds.
蒽系化合物可列舉例如下述式(7)表示者。 Examples of the anthracene compound include those represented by the following formula (7).
此處,式(7)中,R50及R51各自獨立地表示氫原子、碳原子數1~6之烷基或碳原子數2~12之烷氧基烷基,R52表示氫原子或碳原子數1~6之烷基。 Here, in formula (7), R 50 and R 51 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxyalkyl group having 2 to 12 carbon atoms, and R 52 represents a hydrogen atom or An alkyl group with 1 to 6 carbon atoms.
列舉上述式(7)表示之蒽系化合物之具體例時,有如以下的化合物。 Specific examples of the anthracene compound represented by the above formula (7) include the following compounds.
可列舉例如9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽、9,10-二異丙氧基蒽、9,10-二丁氧基蒽、9,10-二戊氧基蒽、9,10-二己氧基蒽、9,10-雙(2-甲氧基乙氧基)蒽、9,10-雙(2-乙氧基乙氧基)蒽、9,10-雙(2-丁氧基乙氧基)蒽、9,10-雙(3-丁氧基丙氧基)蒽、2-甲基-或2-乙基-9,10-二甲氧基蒽、2-甲基-或2-乙基-9,10-二乙氧基蒽、2-甲基-或2-乙基-9,10-二丙氧基蒽、2-甲基-或2-乙基-9,10-二異丙氧基蒽、2-甲基-或2-乙基-9,10-二丁氧基蒽、2-甲基-或2-乙基-9,10-二戊氧基蒽、2-甲基-或2-乙基-9,10-二己氧基蒽等。 Examples include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diisopropoxyanthracene, 9,10-dibutyl Oxyanthracene, 9,10-dipentyloxyanthracene, 9,10-dihexoxyanthracene, 9,10-bis(2-methoxyethoxy)anthracene, 9,10-bis(2-ethyl Oxyethoxy)anthracene, 9,10-bis(2-butoxyethoxy)anthracene, 9,10-bis(3-butoxypropoxy)anthracene, 2-methyl- or 2- Ethyl-9,10-dimethoxyanthracene, 2-methyl- or 2-ethyl-9,10-diethoxyanthracene, 2-methyl- or 2-ethyl-9,10-di Propoxyanthracene, 2-methyl- or 2-ethyl-9,10-diisopropoxyanthracene, 2-methyl- or 2-ethyl-9,10-dibutoxyanthracene, 2- Methyl-or 2-ethyl-9,10-dipentyloxyanthracene, 2-methyl-or 2-ethyl-9,10-dihexyloxyanthracene, etc.
萘系化合物可列舉例如下述式(8)表示者。 Examples of the naphthalene-based compound include those represented by the following formula (8).
此處,式(8)中,R53及R54各自獨立地表示碳原子數1~6之烷基。 Here, in formula (8), R 53 and R 54 each independently represent an alkyl group having 1 to 6 carbon atoms.
列舉上述式(8)表示之萘系化合物之具體例時,有如以下的化合物。 When specific examples of the naphthalene-based compound represented by the above formula (8) are given, there are the following compounds.
可列舉例如4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 Examples include 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyl Oxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene , 1,4-Dibutoxynaphthalene, etc.
相對於上述陽離子聚合性成分(A)而言,增感 劑及增感助劑之使用比例無特別限定,只要在不阻礙本發明之目的的範圍內,大致以通常使用比例使用即可,例如相對於上述陽離子聚合性成分(A)100質量份,由提高硬化性的觀點,增感劑及增感助劑各自為0.1~3質量份為佳。 Relative to the above-mentioned cationically polymerizable component (A), sensitization The use ratio of the agent and the sensitization aid is not particularly limited, as long as it is within a range that does not hinder the purpose of the present invention, it may be used in a general use ratio, for example, relative to 100 parts by mass of the above-mentioned cationically polymerizable component (A). From the viewpoint of improving the hardenability, the sensitizer and the sensitizer auxiliary are preferably 0.1 to 3 parts by mass each.
本發明之硬化性組成物中,可依需要使用矽烷偶合劑。矽烷偶合劑可使用例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等之烷基官能性烷氧基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等之烯基官能性烷氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧基官能性烷氧基矽烷、N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等之胺基官能性烷氧基矽烷、γ-巰基丙基三甲氧基矽烷等之巰基官能性烷氧基矽烷、四異丙烷氧化鈦、四正丁烷氧化鈦等之鈦烷氧化物類、鈦二辛氧基雙(伸辛基甘醇酸鹽)、鈦二異丙氧基雙(乙基乙醯乙酸鹽)等之鈦螯合物類、四乙醯丙酮鋯、三丁氧基單乙醯丙酮鋯等之鋯螯合 物類、三丁氧基單硬脂酸鋯等之鋯醯化物類類、甲基三異氰酸酯矽烷等之異氰酸酯矽烷類等。 In the curable composition of the present invention, a silane coupling agent can be used as needed. As the silane coupling agent, for example, dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, and methyltrimethoxysilane can be used. , Methyl triethoxy silane, ethyl trimethoxy silane, ethyl trimethoxy silane and other alkyl functional alkoxy silanes, vinyl trichlorosilane, vinyl trimethoxy silane, vinyl triethyl Alkenyl functional alkoxysilanes such as oxysilane, allyltrimethoxysilane, etc., 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane Methoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethyl Oxyoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyl diethoxysilane, β-(3,4-epoxycyclohexyl)ethyl Epoxy functional alkoxysilane such as trimethoxysilane, N-β(aminoethyl)-γ-aminopropyl trimethoxysilane, γ-aminopropyltriethoxysilane, N -Phenyl-γ-aminopropyltrimethoxysilane such as amino functional alkoxysilane, γ-mercaptopropyltrimethoxysilane such as mercapto functional alkoxysilane, tetraisopropane titanium oxide, Titanium alkoxides such as tetra-n-butane titanium oxide, titanium dioctyloxy bis (octyl glycolate), titanium diisopropoxy bis (ethyl acetyl acetate) and titanium chelate Zirconium chelate Materials, zirconium amides such as tributoxy zirconium monostearate, isocyanate silanes such as methyl triisocyanate silane, etc.
上述矽烷偶合劑之使用量並無特別限定,通常,相對於硬化性組成物中之固形物全部量100質量份,為0.01~20質量份的範圍。 The amount of the silane coupling agent used is not particularly limited, but it is usually in the range of 0.01 to 20 parts by mass relative to 100 parts by mass of the total solid content in the curable composition.
於本發明之硬化性組成物,依需要藉由使用熱可塑性有機聚合物,亦可改善硬化物的特性。熱可塑性有機聚合物,可列舉例如聚苯乙烯、聚甲基丙烯酸甲酯、甲基丙烯酸甲酯丙烯酸乙酯共聚物、甲基丙烯酸甲酯甲基丙烯酸環氧丙酯共聚物、聚(甲基)丙烯酸、苯乙烯-(甲基)丙烯酸共聚物、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、(甲基)丙烯酸環氧丙酯-聚甲基(甲基)丙烯酸酯共聚物、聚乙烯基縮丁醛、纖維素酯、聚丙烯醯胺、飽和聚酯等。 In the curable composition of the present invention, by using a thermoplastic organic polymer as needed, the properties of the cured product can also be improved. Thermoplastic organic polymers, for example, polystyrene, polymethyl methacrylate, methyl methacrylate ethyl acrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, poly(methyl methacrylate) ) Acrylic acid, styrene-(meth)acrylic acid copolymer, (meth)acrylic acid-methyl methacrylate copolymer, glycidyl (meth)acrylate-polymethyl(meth)acrylate copolymer, Polyvinyl butyral, cellulose ester, polypropylene amide, saturated polyester, etc.
本發明之硬化性組成物中,亦可依需要進一步使用紫外線吸收劑、或於常溫為不活性,且因加熱至特定溫度/光照射/酸等會使保護基脫離而活性化,展現紫外線吸收能力的化合物。 In the curable composition of the present invention, a UV absorber may be further used as needed, or it may be inactive at room temperature, and the protective group will be detached and activated by heating to a specific temperature/light irradiation/acid, etc., thereby exhibiting UV absorption Ability compound.
又,只要不損及本發明之效果時,可依需要添加多元醇、無機填料、有機填料、顏料、染料等之著色劑、消泡劑、增黏劑、界面活性劑、平坦劑、難燃劑、觸變劑、稀釋劑、可塑劑、安定劑、聚合抑制劑、紫外線吸收劑、抗氧化劑、抗靜電劑、流動調整劑、接著促進劑等之各種樹脂添加物等。 In addition, as long as the effects of the present invention are not impaired, coloring agents such as polyols, inorganic fillers, organic fillers, pigments, dyes, defoamers, thickeners, surfactants, leveling agents, and flame retardants can be added as needed. Various resin additives such as additives, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, adhesion promoters, etc.
本發明之硬化性組成物中,無特別限定,可 使用通常所用之可溶解或分散上述(A)、(B)、(C)、(D)及(E)之各成分的溶劑。溶劑可列舉例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等之酮類;乙醚、二噁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲醚、二丙二醇二甲醚等之醚系溶劑;乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、2,2,4-三甲基-1,3-戊二醇異丁酸(Texanol)等之酯系溶劑;乙二醇單甲醚、乙二醇單乙醚等之溶纖劑系溶劑;甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等之醇系溶劑;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、3-甲氧基丁基乙酸酯、乙氧基乙基丙酸酯等之醚酯系溶劑;苯、甲苯、二甲苯等之BTX系溶劑;己烷、庚烷、辛烷、環己烷等之脂肪族烴系溶劑;松節油、D-檸檬烯、蒎烯等之萜烯系烴油;礦油精、Swasol#310(Cosmo松山石油(股)公司製)、Solvesso#100(Exxon化學公司)等之鏈烷烴系溶劑;四氯化碳、氯仿、三氯乙烯、二氯甲烷、1,2-二氯乙烷等之鹵化脂肪族烴系溶劑;氯苯等之鹵化芳香族烴系溶劑;碳酸丙烯酯、卡必醇系溶劑、苯胺、三乙基胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮、二甲基亞碸、水等。此等溶劑可使用1種或以2種以上之混合溶劑使用。 The curable composition of the present invention is not particularly limited, and it can be Use a commonly used solvent that can dissolve or disperse the above-mentioned (A), (B), (C), (D), and (E) components. Examples of the solvent include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone; Ether solvents such as diethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether, etc.; methyl acetate, Ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, 2,2,4-trimethyl-1,3 -Ester solvents such as pentanediol isobutyric acid (Texanol); cellosolve solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, iso- or n-propanol, iso- Or alcohol solvents such as n-butanol and pentanol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA) , Dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate and other ether ester solvents; benzene, toluene, xylene, etc. BTX solvents; hexane Aliphatic hydrocarbon solvents such as, heptane, octane, and cyclohexane; terpene hydrocarbon oils such as turpentine, D-limonene, pinene, etc.; mineral spirits, Swasol#310 (manufactured by Cosmo Songshan Petroleum Co., Ltd.) ), Solvesso#100 (Exxon Chemical Company) and other paraffinic solvents; halogenated aliphatic hydrocarbon solvents such as carbon tetrachloride, chloroform, trichloroethylene, methylene chloride, 1,2-dichloroethane, etc.; chlorine Halogenated aromatic hydrocarbon solvents such as benzene; propylene carbonate, carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N- Dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, water, etc. These solvents can be used singly or as a mixed solvent of two or more kinds.
本發明之硬化性組成物會提高硬化性、接著性、液體保存安定性,故水分量為5質量份以下較佳,又更佳為3質量份以下。水分過多時,有產生白濁或成分析出之疑慮,故不佳。 The curable composition of the present invention improves curability, adhesiveness, and liquid storage stability, so the water content is preferably 5 parts by mass or less, and more preferably 3 parts by mass or less. When the moisture is too much, it will cause white turbidity or doubts about the composition, so it is not good.
本發明之硬化性組成物以輥塗佈器、淋幕式塗佈器、各種之印刷、浸漬等之公知手段適用於支撐基體上。又,也可一旦施於薄膜等之支撐基體上後,轉印於其他支撐基體上,其適用方法並無限制。 The curable composition of the present invention is applied to the supporting substrate by known means such as roll coater, curtain coater, various printing, dipping, and the like. In addition, once applied to a supporting substrate such as a film, it can be transferred to another supporting substrate. The application method is not limited.
上述支撐基體之材料,無特別限制,可使用通常所使用者,可列舉例如玻璃等之無機材料;二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯基丙醯基纖維素、硝基纖維素等之纖維素酯;聚醯胺;聚醯亞胺;聚胺基甲酸酯;環氧樹脂;聚碳酸酯;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚-1,4-環己烷二亞甲基聚對苯二甲酸酯、聚乙烯-1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚對苯二甲酸丁二酯等之聚酯;聚苯乙烯;聚乙烯、聚丙烯、聚甲基戊烯等之聚烯烴;聚乙酸乙烯酯、聚氯乙烯、聚氟乙烯等之乙烯基化合物;聚甲基丙烯酸甲酯、聚丙烯酸酯等之丙烯酸系樹脂;聚碳酸酯;聚碸;聚醚碸;聚醚酮;聚醚醯亞胺;聚氧乙烯、降莰烯樹脂、環烯烴聚合物(COP)等之高分子材料。又,亦可對上述支撐基體進行電暈放電處理、火焰處理、紫外線處理、高頻處理、輝光放電處理、活性電漿處理、雷射處理等之表面活性化處理。 The material of the above-mentioned support matrix is not particularly limited, and ordinary users can be used, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), acryl cellulose, butyric cellulose Cellulose esters of cellulose, acetyl propyl cellulose, nitrocellulose, etc.; polyamide; polyimide; polyurethane; epoxy resin; polycarbonate; polyterephthalate Ethylene formate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene polyterephthalate, polyethylene-1,2- Polyesters such as diphenoxyethane-4,4'-dicarboxylate and polybutylene terephthalate; polystyrene; polyolefins such as polyethylene, polypropylene, and polymethylpentene; Vinyl compounds such as polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; acrylic resins such as polymethyl methacrylate and polyacrylate; polycarbonate; polyether; polyether ketone; polyether ketone; poly Ether imine; polyoxyethylene, norbornene resin, cyclic olefin polymer (COP) and other polymer materials. In addition, surface activation treatments such as corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, and laser treatment may be performed on the above-mentioned support substrate.
藉由能量線照射本發明之硬化性組成物使硬化的方法中,能量線可列舉紫外線、電子線、X射線、放射線、高頻等,紫外線在經濟上最佳。紫外線之光源,可列舉紫外線雷射、水銀燈、氙雷射、金屬鹵素燈等。 In the method of curing the curable composition of the present invention by irradiating energy rays, the energy rays include ultraviolet rays, electron rays, X-rays, radiation rays, high frequency, etc., and ultraviolet rays are economically optimal. The light source of ultraviolet light can include ultraviolet laser, mercury lamp, xenon laser, metal halide lamp, etc.
藉由加熱使本發明之硬化性組成物硬化的方法的條件為70~250℃、1~100分鐘。可於預烤(PAB;Pre applied bake)後加壓進行後烘烤(PEB;Post exposure bake);亦可以不同的數階段的溫度烘烤。加熱條件雖依各成分之種類及摻合比例而異,但例如70~180℃下,烘箱為5~15分鐘,加熱板則為1~5分鐘。然後,為了使塗膜硬化,藉由於180~250℃,較佳為200~250℃,烘箱為30~90分鐘,加熱板則為5~30分鐘進行加熱處理,可得到硬化膜。 The conditions of the method of curing the curable composition of the present invention by heating are 70 to 250° C. for 1 to 100 minutes. It can be pre-baked (PAB; Pre applied bake) and then pressurized to perform post-bake (PEB; Post exposure bake); it can also be baked at different temperatures in several stages. Although the heating conditions vary depending on the types and blending ratios of the ingredients, for example, at 70-180°C, the oven takes 5 to 15 minutes, and the hot plate takes 1 to 5 minutes. Then, in order to harden the coating film, heat treatment is performed at 180 to 250°C, preferably 200 to 250°C, in an oven for 30 to 90 minutes, and a hot plate for 5 to 30 minutes, to obtain a cured film.
本發明之硬化性組成物或其硬化物之具體的用途,可列舉接著劑、眼鏡、以攝影用透鏡為代表之光學材料、塗料、塗覆劑、襯墊(lining)劑、油墨、阻劑、液狀阻劑、印刷版、彩色電視、PC監視器、行動資訊終端、數位相機、有機EL、觸控面板等之顯示元件、絕緣清漆、絕緣薄片、層合板、印刷基板、半導體裝置用/LED封裝用/液晶注入口用/有機EL用/光元件用/電絕緣用/電子零件用/分離膜用等之封裝劑、成形材料、油灰、玻璃纖維含浸劑、木粉填料、半導體用/太陽電池用等之鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置之背光所使用之稜鏡透鏡薄片、投影電視等之螢幕所使用之菲涅耳透鏡薄片、雙凸 透鏡薄片等之透鏡薄片之透鏡部、或使用這種薄片之背光等、微透鏡等之光學透鏡、光學元件、光連接器、光波導、光學造形用鑄型劑(casting agent)等。 Specific uses of the curable composition of the present invention or its cured product include adhesives, glasses, optical materials represented by photographic lenses, paints, coating agents, lining agents, inks, and resists. , Liquid resists, printing plates, color TVs, PC monitors, mobile information terminals, digital cameras, organic EL, touch panels and other display elements, insulating varnishes, insulating sheets, laminates, printed circuit boards, semiconductor devices/ LED encapsulation/liquid crystal injection port/organic EL/optical element/electrical insulation/electronic parts/separation film, etc. encapsulant, molding material, putty, glass fiber impregnant, wood powder filler, semiconductor use/ Passivation films for solar cells, interlayer insulating films, protective films, lenticular lens sheets used in backlights of liquid crystal display devices, Fresnel lens sheets used in screens of projection TVs, etc., biconvex Lens parts of lens sheets such as lens sheets, or backlights, etc. using such sheets, optical lenses such as microlenses, optical elements, optical connectors, optical waveguides, optical casting agents, etc.
本發明之顯示裝置可列舉於透明支撐體上依需要設置有底塗層、抗反射層、偏光元件層、相位差層、雙折射率層、光散射層、硬質塗層、潤滑層、保護層等之各層者,於各層可使用由本發明之硬化物所成的薄膜。 The display device of the present invention can be enumerated on a transparent support provided with a primer layer, an anti-reflection layer, a polarizing element layer, a retardation layer, a birefringence layer, a light scattering layer, a hard coating layer, a lubricating layer, and a protective layer as required. For each layer, a film made of the cured product of the present invention can be used for each layer.
以下列舉實施例等更詳細說明本發明,但本發明不限定於此等實施例。 Hereinafter, the present invention will be explained in more detail with examples and the like, but the present invention is not limited to these examples.
以下述[表1]及[表2]所示之調配,將各成分充分地混合,得到各實施例1~11之硬化性組成物及比較例1之硬化性組成物。又,實施例及比較例之單位為質量份。 With the formulations shown in the following [Table 1] and [Table 2], each component was thoroughly mixed to obtain the curable composition of each of Examples 1 to 11 and the curable composition of Comparative Example 1. In addition, the units of Examples and Comparative Examples are parts by mass.
陽離子聚合性成分(A)使用下述化合物(A1-1)~(A1-2)及(A2-1)~(A2-2)。 The following compounds (A1-1) to (A1-2) and (A2-1) to (A2-2) are used as the cationically polymerizable component (A).
化合物(A1-1):ADEKA ResinEP-4088L((股)ADEKA公司製) Compound (A1-1): ADEKA Resin EP-4088L (manufactured by ADEKA Corporation)
化合物(A1-2):1,6-己二醇二環氧丙醚 Compound (A1-2): 1,6-hexanediol diglycidyl ether
化合物(A2-1):CELLOXID2021P(脂環式環氧基:DAICEL(股)公司製) Compound (A2-1): CELLOXID2021P (alicyclic epoxy group: manufactured by DAICEL Co., Ltd.)
化合物(A2-2):檸檬烯二氧化物 Compound (A2-2): Limonene dioxide
化合物(A4-1):Aron Oxetane OXT-221(東亞合成(股)公司製) Compound (A4-1): Aron Oxetane OXT-221 (manufactured by Toagosei Co., Ltd.)
陽離子聚合起始劑(B)使用下述化合物(B-1)。 The following compound (B-1) was used as the cationic polymerization initiator (B).
化合物(B-1):下述式(9)表示之化合物及下述式(10)表示之化合物之混合物的碳酸丙烯酯50%溶液 Compound (B-1): Propylene carbonate 50% solution of a mixture of the compound represented by the following formula (9) and the compound represented by the following formula (10)
自由基聚合性成分(C)為使用下述化合物(C2-1)。 The radical polymerizable component (C) uses the following compound (C2-1).
化合物(C2-1):1,6-己二醇二丙烯酸酯 Compound (C2-1): 1,6-hexanediol diacrylate
化合物(C2-2):乙氧基化異三聚氰酸三丙烯酸酯 Compound (C2-2): Ethoxylated isocyanuric acid triacrylate
化合物(C2-3):四氫糠基丙烯酸酯 Compound (C2-3): Tetrahydrofurfuryl acrylate
自由基聚合起始劑(D)為使用下述化合物(D-1)。 As the radical polymerization initiator (D), the following compound (D-1) was used.
化合物(D-1):IRGACURE184(BASF公司製) Compound (D-1): IRGACURE184 (manufactured by BASF)
聚合物(E)為使用下述化合物(E-1)。 For the polymer (E), the following compound (E-1) was used.
聚合物(E-1):甲基丙烯酸甲酯75質量份與環氧丙基甲基丙烯酸酯25質量份之共聚物(重量平均分子量7,000) Polymer (E-1): a copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 7,000)
聚合物(E-2):甲基甲基丙烯酸酯35質量份、苯乙烯35質量份及環氧丙基甲基丙烯酸酯30質量份之共聚物(重量平均分子量8,000) Polymer (E-2): a copolymer of 35 parts by mass of methacrylate, 35 parts by mass of styrene, and 30 parts by mass of glycidyl methacrylate (weight average molecular weight 8,000)
對於所得之實施例1~11及比較例1之各硬化性組成物,依據下述步驟評價玻璃轉移溫度(Tg)、彈性模數及密著性之評價。結果併記於[表1]及[表2]。 For each curable composition of Examples 1-11 and Comparative Example 1 obtained, the evaluation of glass transition temperature (Tg), elastic modulus, and adhesion was evaluated according to the following procedures. The results are recorded in [Table 1] and [Table 2].
將所得之實施例1~11及比較例1之各硬化性組成物,分別以塗佈棒塗佈於聚對苯二甲酸乙二酯(PET)薄膜上形成30μm的厚度,使用金屬鹵素燈照射3000mJ/cm2之能量。24小時後,自薄膜取出接著劑硬化物,使用(股)Hitachi High-Tech Science製之黏彈性測量裝置(DMA7100),測量Tg及80℃下的彈性模數。 The curable compositions of Examples 1 to 11 and Comparative Example 1 were respectively coated on a polyethylene terephthalate (PET) film with a coating bar to form a thickness of 30 μm, and irradiated with a metal halide lamp 3000mJ/cm 2 energy. After 24 hours, the cured adhesive was taken out from the film, and a viscoelasticity measuring device (DMA7100) manufactured by Hitachi High-Tech Science was used to measure Tg and elastic modulus at 80°C.
對於所得之實施例1~11及比較例1之硬化性組成物分別以E型黏度計測量25℃下的黏度。結果併記於[表1]及[表2]。 For the obtained curable compositions of Examples 1-11 and Comparative Example 1, the viscosity at 25° C. was measured with an E-type viscometer. The results are recorded in [Table 1] and [Table 2].
將上述所得之實施例1~11及比較例1之硬化性組成物,各自塗佈於一片經電暈處理PMMA薄膜(住友化學(股)公司製:Technolloy 125S001)後,使用層合機與另一片經電暈放電處理的COP(環烯烴聚合物、日本Zeon(股)公司製:型號Zeonor Film 14-060)薄膜貼合,使用無電極紫外光燈透過COP薄膜照射相當於1000mJ/cm2之光進行接著,以得到試驗片。對於所得之試驗片進行90度剝離試驗。結果如[表1]及[表2]所示。 The curable compositions of Examples 1-11 and Comparative Example 1 obtained above were each coated on a corona-treated PMMA film (manufactured by Sumitomo Chemical Co., Ltd.: Technolloy 125S001), and then used a laminator and another A piece of corona discharge treated COP (cycloolefin polymer, Japan Zeon Co., Ltd.: model Zeonor Film 14-060) film is laminated, and an electrodeless ultraviolet lamp is used to irradiate the COP film with equivalent to 1000mJ/cm 2 Light was followed to obtain a test piece. A 90-degree peel test was performed on the obtained test piece. The results are shown in [Table 1] and [Table 2].
由[表1]~[表2]得知本發明之硬化性組成物係硬化物之玻璃轉移溫度高及密著性優異。 From [Table 1] to [Table 2], it is known that the cured product of the curable composition system of the present invention has a high glass transition temperature and excellent adhesion.
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