KR102278179B1 - Curable composition, manufacturing method of cured product, and cured product thereof - Google Patents
Curable composition, manufacturing method of cured product, and cured product thereof Download PDFInfo
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- KR102278179B1 KR102278179B1 KR1020187026668A KR20187026668A KR102278179B1 KR 102278179 B1 KR102278179 B1 KR 102278179B1 KR 1020187026668 A KR1020187026668 A KR 1020187026668A KR 20187026668 A KR20187026668 A KR 20187026668A KR 102278179 B1 KR102278179 B1 KR 102278179B1
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- South Korea
- Prior art keywords
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- carbon atoms
- formula
- curable composition
- epoxy
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- 239000000203 mixture Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 150000001875 compounds Chemical class 0.000 claims abstract description 69
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 66
- 239000000178 monomer Substances 0.000 claims abstract description 45
- 229920000642 polymer Polymers 0.000 claims abstract description 39
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 38
- 239000004593 Epoxy Substances 0.000 claims abstract description 28
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 27
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 25
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 20
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 14
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 13
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 6
- -1 7-oxabicyclo[4.1.0]heptan-3-yl Chemical group 0.000 claims description 118
- 125000003118 aryl group Chemical group 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 20
- 125000002947 alkylene group Chemical group 0.000 claims description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 125000003566 oxetanyl group Chemical group 0.000 claims description 12
- 125000005843 halogen group Chemical group 0.000 claims description 11
- 125000003545 alkoxy group Chemical group 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 8
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 5
- 125000004104 aryloxy group Chemical group 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 claims description 4
- 229960000250 adipic acid Drugs 0.000 claims description 4
- 235000011037 adipic acid Nutrition 0.000 claims description 4
- 125000006701 (C1-C7) alkyl group Chemical group 0.000 claims description 2
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000001723 curing Methods 0.000 claims description 2
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 claims description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 claims 1
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 43
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 26
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 9
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 239000002253 acid Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 150000001450 anions Chemical class 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
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- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 6
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 6
- 208000034189 Sclerosis Diseases 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229920000768 polyamine Polymers 0.000 description 6
- 229920002678 cellulose Polymers 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
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- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- 229960000834 vinyl ether Drugs 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- 239000006096 absorbing agent Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 125000004185 ester group Chemical group 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinyl group Chemical group C1(O)=CC(O)=CC=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
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- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XKOWGGVJZHBDJA-UHFFFAOYSA-N 2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCC1CC2OC2CC1 XKOWGGVJZHBDJA-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
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- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
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- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
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- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- HVMHLMJYHBAOPL-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)propan-2-yl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1C(C)(C)C1CC2OC2CC1 HVMHLMJYHBAOPL-UHFFFAOYSA-N 0.000 description 2
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
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- 229920000178 Acrylic resin Polymers 0.000 description 2
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- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
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- 239000002671 adjuvant Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
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- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
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- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- OCAAZRFBJBEVPS-UHFFFAOYSA-N prop-2-enyl carbamate Chemical class NC(=O)OCC=C OCAAZRFBJBEVPS-UHFFFAOYSA-N 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006239 protecting group Chemical group 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 125000006000 trichloroethyl group Chemical group 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
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- C08G65/18—Oxetanes
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- C08K5/10—Esters; Ether-esters
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Abstract
경화물의 유리 전이 온도가 높고, 밀착성이 우수한 경화성 조성물, 경화물의 제조 방법, 및 그 경화물을 제공한다.
양이온 중합성 성분(A) 30∼99 질량부와, 양이온 중합 개시제(B) 0.1∼10 질량부와, 라디칼 중합성 성분(C) 0∼55 질량부와, 라디칼 중합 개시제(D) 0∼10 질량부와, 식(I)
(식 중, X는, 탄소 원자수 1∼7의 알킬기 등)으로 표시되는 단량체로부터 얻어지는 폴리머, 식(II)
(식 중, R1은 수소 원자 등을 나타내고, X'는 탄소 원자수 1∼7의 알킬기 등)으로 표시되는 단량체로부터 얻어지는 폴리머 등으로부터 선택되는 중량 평균 분자량 1,000∼30,000인 폴리머(E) 1∼30 질량부을 함유하고, (A) 성분이 분자량 200 이상의 다가 알코올의 글리시딜화물 등과 지환식 에폭시 화합물\이며, (C) 성분이 에폭시기 등을 가지는 화합물 등이다.Disclosed are a curable composition having a high glass transition temperature and excellent adhesion, a method for producing a cured product, and a cured product thereof.
30-99 mass parts of a cationically polymerizable component (A), 0.1-10 mass parts of a cation polymerization initiator (B), 0-55 mass parts of a radically polymerizable component (C), and 0-10 mass parts of a radical polymerization initiator (D) parts by mass and formula (I)
A polymer obtained from a monomer represented by (wherein, X is an alkyl group having 1 to 7 carbon atoms, etc.), formula (II)
Polymers (E) having a weight average molecular weight of 1,000 to 30,000 selected from polymers obtained from monomers represented by (wherein, R 1 represents a hydrogen atom, etc., and X' is an alkyl group having 1 to 7 carbon atoms, etc.) It contains 30 parts by mass, the component (A) is a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, and an alicyclic epoxy compound, and the component (C) is a compound having an epoxy group or the like.
Description
본 발명은, 경화성 조성물, 경화물의 제조 방법, 및 그 경화물에 관한 것이며, 상세하게는, 경화물의 유리 전이 온도가 높고, 밀착성이 우수한 경화성 조성물, 경화물의 제조 방법, 및 그 경화물에 관한 것이다. The present invention relates to a curable composition, a method for producing a cured product, and a cured product thereof, and more particularly, to a curable composition having a high glass transition temperature and excellent adhesion of the cured product, a method for producing a cured product, and a cured product thereof .
경화성 조성물은, 잉크, 도료, 각종 코팅제, 접착제, 광학 부재 등의 분야에 있어서 사용되고 있다. 이와 같은, 경화성 조성물의 개량에 대하여, 다양한 보고가 이루어지고 있다.Curable compositions are used in fields, such as an ink, a paint, various coating agents, an adhesive agent, and an optical member. Various reports have been made about such improvement of the curable composition.
예를 들면, 하기 특허문헌 1∼3에는, 양이온 중합성 성분 및 라디칼 중합성 성분을 함유하는 에너지선 경화성 조성물 또는 그 경화물이 제안되어 있다. 예를 들면, 특허문헌 1에서는, 초기 경화성 및 접착성이 우수한 편광판용 접착제 조성물이 제안되어 있다. 또한, 특허문헌 2에서는, 저점도이며, 경화성이 우수하고, 도포·경화 시의 분위기 습도가 높아도 각종 플라스틱 필름 등으로의 접착력이 우수하고, 무색 투명성도 우수한 플라스틱 필름용 등에 사용하는 활성 에너지선 경화형 접착제 조성물이 제안되어 있다. 또한, 특허문헌 3에서는, 저점도이며, 경화성이 우수하고, (메타)아크릴 수지나 시클로올레핀 폴리머를 포함한 각종 플라스틱 필름 등으로의 접착력이 우수하고, 무색 투명성도 우수한 플라스틱 필름용 등에 사용하는 활성 에너지선 경화형 접착제 조성물이 제안되어 있다.For example, the energy-beam curable composition containing a cationically polymerizable component and a radically polymerizable component, or its hardened|cured material is proposed by the following patent documents 1-3. For example, in patent document 1, the adhesive composition for polarizing plates excellent in initial stage sclerosis|hardenability and adhesiveness is proposed. Further, in Patent Document 2, an active energy ray-curable type used for plastic films having low viscosity, excellent curability, excellent adhesion to various plastic films, etc. even at high atmospheric humidity during application and curing, and excellent colorless transparency Adhesive compositions have been proposed. Further, in Patent Document 3, active energy used for plastic films having low viscosity, excellent curability, excellent adhesion to various plastic films including (meth)acrylic resins and cycloolefin polymers, etc., and excellent colorless transparency A line-curable adhesive composition has been proposed.
그러나, 특허문헌 1∼3에 제안되어 있는 경화성 조성물이라도, 경화성 및 밀착성에 대해서는, 반드시 만족할 수 있는 것이 아닌 경우가 있고, 경화성 및 밀착성을 고도로 양립시킬 수 있는, 새로운 경화성 조성물이 요구되고 있는 것이 현재의 실정이다.However, even in the curable compositions proposed in Patent Documents 1 to 3, curability and adhesiveness may not always be satisfactory, and a new curable composition capable of making both curability and adhesiveness highly compatible is currently demanded. the situation of
이에, 본 발명의 목적은, 경화물의 유리 전이 온도가 높고, 밀착성이 우수한 경화성 조성물, 경화물의 제조 방법, 및 그 경화물을 제공하는 것에 있다.Then, the objective of this invention is high glass transition temperature of hardened|cured material, and it is providing the curable composition excellent in adhesiveness, the manufacturing method of hardened|cured material, and its hardened|cured material.
본 발명자들은, 상기 과제를 해결하기 위해 예의(銳意) 검토한 결과, 특정한 조성을 가지는 경화성 조성물이라면, 상기 과제를 해소할 수 있는 것을 발견하고, 본 발명을 완성하기에 이르렀다.MEANS TO SOLVE THE PROBLEM The present inventors discovered that the said subject could be eliminated if it was a curable composition which has a specific composition, as a result of earnestly examining in order to solve the said subject, and came to complete this invention.
즉, 본 발명의 경화성 조성물은, 양이온 중합성 성분(A) 30∼99 질량부와, 양이온 중합 개시제(B) 0.1∼10 질량부와, 라디칼 중합성 성분(C) 0∼55 질량부와, 라디칼 중합 개시제(D) 0∼10 질량부와,That is, the curable composition of the present invention contains 30 to 99 parts by mass of the cationically polymerizable component (A), 0.1 to 10 parts by mass of the cation polymerization initiator (B), 0 to 55 parts by mass of the radically polymerizable component (C), 0-10 parts by mass of a radical polymerization initiator (D);
하기 식(I)Formula (I)
(식중, X는, 탄소 원자수 1∼7의 알킬기, 탄소 원자수 1∼7의 알콕시기, 탄소 원자수 6∼12의 아릴기, 탄소 원자수 6∼12의 아릴옥시기 혹은 탄소 원자수 6∼10의 지환식 탄화 수소기, 또는 이들 기 중의 수소 원자가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환된 것임)으로 표시되는 단량체로부터 얻어지는 폴리머, 하기 식(II)(wherein X is an alkyl group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, an aryloxy group having 6 to 12 carbon atoms, or 6 carbon atoms -10 alicyclic hydrocarbon groups, or hydrogen atoms in these groups are substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group) A polymer obtained from a monomer represented by the following formula ( II)
(식중, R1은, 수소 원자, 메틸기 또는 할로겐 원자를 나타내고, X'는, 탄소 원자수 1∼7의 알킬기, 탄소 원자수 6∼12의 아릴기 혹은 탄소 원자수 6∼10의 지환식 탄화 수소기, 또는 이들 기 중의 수소 원자가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환된 것임)으로 표시되는 단량체로부터 얻어지는 폴리머, 상기 식(I)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 상기 식(II)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 또는 상기 식(I)으로 표시되는 단량체 및 상기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머로 이루어지는 군으로부터 선택되는 중량 평균 분자량 1,000∼30,000인 폴리머(E) 1∼30 질량부를, 상기 양이온 중합성 성분(A)과 상기 라디칼 중합성 성분(C)과 상기 폴리머(E)의 합계가 100질량부가 되도록 함유하고,(Wherein, R 1 represents a hydrogen atom, a methyl group or a halogen atom, and X' is an alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an alicyclic carbonation having 6 to 10 carbon atoms. A polymer obtained from a monomer represented by a hydrogen group or a hydrogen atom in these groups is substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group; a monomer represented by the formula (I) A polymer obtained from two or more monomers selected from, a polymer obtained from two or more monomers selected from the monomers represented by the formula (II), or a monomer represented by the formula (I) and a monomer represented by the formula (II) 1 to 30 parts by mass of a polymer (E) having a weight average molecular weight of 1,000 to 30,000 selected from the group consisting of polymers obtained from monomers, the cationically polymerizable component (A), the radically polymerizable component (C), and the polymer (E) It contains so that the total of 100 parts by mass,
상기 양이온 중합성 성분(A)이, 분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)과, 지환식 에폭시 화합물(A2)을 필수 성분으로 하고,The cationically polymerizable component (A) contains, as essential components, a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product of a polyhydric alcohol alkylene oxide adduct (A1) and an alicyclic epoxy compound (A2), ,
상기 라디칼 중합성 성분(C)이, 에폭시기 및 에틸렌성 불포화기를 가지는 화합물(C1), 또는 탄소 원자수 2∼20인 알코올의 아크릴산 에스테르 혹은 탄소 원자수 2∼20인 알코올의 메타크릴산 에스테르(C2)를 필수 성분으로 하는 것을 특징으로 하는 것이다. 여기서, 중량 평균 분자량이란, 테트라하이드로퓨란(THF) 용매 중, GPC에 의해 측정하여, 스티렌 환산으로 구한 중량 평균 분자량을 일컫는다.The radically polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylic acid ester of an alcohol having 2 to 20 carbon atoms or a methacrylic acid ester of an alcohol having 2 to 20 carbon atoms (C2) ) as an essential component. Here, the weight average molecular weight means the weight average molecular weight measured by GPC in a tetrahydrofuran (THF) solvent and calculated|required in styrene conversion.
본 발명의 경화성 조성물에 있어서는, 상기 분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)에서의 다가 알코올은, 축합환을 가지는 다가 알코올인 것이 바람직하다. 또한, 본 발명의 경화성 조성물에 있어서는, 상기 지환식 에폭시 화합물(A2)은, 3',4'-에폭시시클로헥실에틸-3,4-에폭시시클로헥산카르복실레이트, 7-옥사비시클로[4.1.0]헵탄, 폴리[옥시-(1-옥소-1,6-헥산디일)] 유도체, 헥산이산 비스[(7-옥사비시클로[4.1.0]헵탄-3-일)메틸], 1,2-에폭시-4-비닐시클로헥산, 3,4-에폭시시클로헥실메틸메타아크릴레이트 및 리모넨디옥시드로 이루어지는 군으로부터 선택되는 1종 이상인 것이 바람직하다. 또한, 본 발명의 경화성 조성물에 있어서는, 상기 폴리머(E)는, 상기 식(I)으로 표시되는 단량체 및 상기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머이며, 상기 식(I) 중의 X는, 탄소 원자수 6∼12의 아릴기이며, 상기 식(II) 중의 X'는, 탄소 원자수 1∼7의 알킬기이며, 상기 알킬기가 에폭시기로 치환되어 있는 것이 바람직하다.In the curable composition of the present invention, the polyhydric alcohol in the glycidylated product of the polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product (A1) of the polyhydric alcohol alkylene oxide adduct is preferably a polyhydric alcohol having a condensed ring. Do. Further, in the curable composition of the present invention, the alicyclic epoxy compound (A2) is 3',4'-epoxycyclohexylethyl-3,4-epoxycyclohexanecarboxylate, 7-oxabicyclo[4.1. 0]heptane, poly[oxy-(1-oxo-1,6-hexanediyl)] derivative, hexanedioic acid bis[(7-oxabicyclo[4.1.0]heptan-3-yl)methyl], 1,2 - At least one selected from the group consisting of -epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl methacrylate and limonene dioxide is preferable. Further, in the curable composition of the present invention, the polymer (E) is a polymer obtained from the monomer represented by the formula (I) and the monomer represented by the formula (II), wherein X in the formula (I) is, It is a C6-C12 aryl group, X' in the said Formula (II) is a C1-C7 alkyl group, It is preferable that the said alkyl group is substituted by the epoxy group.
본 발명의 경화물의 제조 방법은, 본 발명의 경화성 조성물에, 활성 에너지선을 조사하는 것, 또는, 가열하는 것을 특징으로 하는 것이다.The manufacturing method of the hardened|cured material of this invention is characterized by irradiating an active energy ray to the curable composition of this invention, or heating.
본 발명의 경화물은, 본 발명의 경화성 조성물의 경화물인 것을 특징으로 하는 것이다.The hardened|cured material of this invention is a hardened|cured material of the curable composition of this invention, It is characterized by the above-mentioned.
본 발명에 의하면, 경화물의 유리 전이 온도가 높고, 밀착성이 우수한 경화성 조성물, 경화물의 제조 방법, 및 그 경화물을 제공할 수 있다. 본 발명의 경화성 조성물은, 특히 접착제에 유용하다.ADVANTAGE OF THE INVENTION According to this invention, the glass transition temperature of hardened|cured material is high, and the curable composition excellent in adhesiveness, the manufacturing method of hardened|cured material, and its hardened|cured material can be provided. The curable composition of the present invention is particularly useful for adhesives.
이하, 본 발명의 경화성 조성물에 대하여 상세하게 설명한다.Hereinafter, the curable composition of this invention is demonstrated in detail.
본 발명의 경화성 조성물은, 양이온 중합성 성분(A) 30∼99 질량부와, 양이온 중합 개시제(B) 0.1∼10 질량부와, 라디칼 중합성 성분(C) 0∼55 질량부와, 라디칼 중합 개시제(D) 0∼10 질량부와, 하기 식(I)으로 표시되는 단량체로부터 얻어지는 폴리머, 하기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머, 하기 식(I)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 하기 식(II)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 또는 하기 식(I)으로 표시되는 단량체 및 하기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머로 이루어지는 군으로부터 선택되는 중량 평균 분자량 1,000∼30,000인 폴리머(E) 1∼30 질량부를, (A) 성분과 (C) 성분과 (E) 성분의 합계가 100질량부가 되도록 함유한다. 본 발명의 경화성 조성물에 있어서는, 양이온 중합성 성분(A)은, 분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)과, 지환식 에폭시 화합물(A2)을 필수 성분으로 하고, 라디칼 중합성 성분(C)은, 에폭시기 및 에틸렌성 불포화기를 가지는 화합물(C1), 또는 탄소 원자수 2∼20인 알코올의 아크릴산 에스테르, 혹은 탄소 원자수 2∼20인 알코올의 메타크릴산 에스테르(C2)를 필수 성분으로 한다.The curable composition of this invention contains 30-99 mass parts of cationically polymerizable components (A), 0.1-10 mass parts of cation polymerization initiators (B), 0-55 mass parts of radically polymerizable components (C), and radical polymerization 2 selected from 0 to 10 parts by mass of initiator (D), a polymer obtained from a monomer represented by the following formula (I), a polymer obtained from a monomer represented by the following formula (II), and a monomer represented by the following formula (I) A polymer obtained from at least two kinds of monomers, a polymer obtained from two or more kinds of monomers selected from monomers represented by the following formula (II), or a polymer obtained from a monomer represented by the following formula (I) and a monomer represented by the following formula (II) 1 to 30 parts by mass of a polymer (E) having a weight average molecular weight of 1,000 to 30,000 selected from the group consisting of In the curable composition of the present invention, the cationically polymerizable component (A) is a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product of a polyhydric alcohol alkylene oxide adduct (A1), and an alicyclic epoxy compound ( A2) as an essential component, and the radically polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylic acid ester of an alcohol having 2 to 20 carbon atoms, or having 2 to 20 carbon atoms The methacrylic acid ester of alcohol (C2) is an essential component.
여기서, 식(I) 중, X는, 탄소 원자수 1∼7의 알킬기, 탄소 원자수 1∼7의 알콕시기, 탄소 원자수 6∼12의 아릴기, 탄소 원자수 6∼12의 아릴옥시기 혹은 탄소 원자수 6∼10의 지환식 탄화 수소기, 또는 이들 기 중의 수소 원자가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환된 것이다.Here, in the formula (I), X is an alkyl group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aryloxy group having 6 to 12 carbon atoms. Alternatively, an alicyclic hydrocarbon group having 6 to 10 carbon atoms, or a hydrogen atom in these groups is substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group.
여기서, 식(II) 중, R1은, 수소 원자, 메틸기 또는 할로겐 원자를 나타내고, X'는, 탄소 원자수 1∼7의 알킬기, 탄소 원자수 6∼12의 아릴기 혹은 탄소 원자수 6∼10의 지환식 탄화 수소기, 또는 이들 기 중의 수소 원자가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환된 것이다.Here, in formula (II), R 1 represents a hydrogen atom, a methyl group or a halogen atom, and X' is an alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aryl group having 6 to carbon atoms. The alicyclic hydrocarbon group represented by 10 or a hydrogen atom in these groups is substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group.
본 발명의 경화성 조성물에 관한 양이온 중합성 성분(A)은, 에너지선 조사 또는 가열에 의해 활성화한 양이온 중합 개시제에 의해, 고분자화 또는 가교 반응을 일으키는 화합물이다. 에폭시 화합물, 옥세탄 화합물, 비닐에테르 화합물 등을 예로 들 수 있다.The cationically polymerizable component (A) concerning the curable composition of this invention is a compound which raise|generates polymerization or a crosslinking reaction with the cationic polymerization initiator activated by energy-beam irradiation or heating. An epoxy compound, an oxetane compound, a vinyl ether compound, etc. are mentioned.
본 발명의 경화성 조성물에 관한 양이온 중합성 성분(A)은, 분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)과, 지환식 에폭시 화합물(A2)을 필수 성분으로 하고 있지만, 그 외의 에폭시 화합물로서, 방향족 에폭시 화합물(A3) 등을 사용할 수도 있다. 양이온 중합성 성분(A)에서의, 상기 (A1) 성분 및 (A2) 성분의 비율은, 90질량% 이상이 바람직하다.The cationically polymerizable component (A) according to the curable composition of the present invention is a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product of a polyhydric alcohol alkylene oxide adduct (A1), and an alicyclic epoxy compound (A2) ) as an essential component, but an aromatic epoxy compound (A3) or the like can also be used as other epoxy compounds. As for the ratio of the said (A1) component and (A2) component in a cationically polymerizable component (A), 90 mass % or more is preferable.
상기 분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)로서는, 다가 알코올 또는 다가 알코올알킬렌옥사이드 부가물을 글리시딜화한 것을 들 수 있고, 글리시딜화물의 분자량이 200 이상이다. Examples of the glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product (A1) of a polyhydric alcohol alkylene oxide adduct include those obtained by glycidylating a polyhydric alcohol or polyhydric alcohol alkylene oxide adduct, The molecular weight of the sidylated product is 200 or more.
상기 분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)로서는, 1,4-부탄디올디글리시딜에테르, 1,6-헥산디올다글리시딜에테르, 네오펜틸글리콜디글리시딜에테르, 글리세린의 트리글리시딜에테르, 트리메틸올프로판의 트리글리시딜에테르, 소르비톨의 테트라글리시딜에테르, 디펜타에리트리톨의 헥사글리시딜에테르, 폴리에틸렌글리콜의 디글리시딜에테르, 폴리프로필렌글리콜의 디글리시딜에테르, 디시클로펜타디엔디메탄올디글리시딜에테르 등의 다가 알코올의 글리시딜에테르, 또한 프로필렌글리콜, 트리메틸올프로판, 글리세린 등의 지방족 다가 알코올에 1종 또는 2종 이상의 알킬렌옥사이드를 부가함으로써 얻어지는 폴리에테르폴리올의 폴리글리시딜에테르화물, 지방족 장쇄(長鎖) 이염기산의 디글리시딜에스테르를 예로 들 수 있다.As the glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product (A1) of a polyhydric alcohol alkylene oxide adduct, 1,4-butanediol diglycidyl ether, 1,6-hexanediol glycidyl Ether, neopentyl glycol diglycidyl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol Glycidyl ether of polyhydric alcohols such as glycidyl ether, diglycidyl ether of polypropylene glycol, and dicyclopentadiene dimethanol diglycidyl ether, and aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane, and glycerin The polyglycidyl ether product of the polyether polyol obtained by adding 1 type, or 2 or more types of alkylene oxide, and the diglycidyl ester of an aliphatic long-chain dibasic acid are mentioned.
다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)로서는, 또한 지방족 고급 알코올의 모노글리시딜에테르나 고급 지방산의 글리시딜에스테르, 에폭시화 대두유, 에폭시스테아르산 옥틸, 에폭시스테아르산 부틸, 에폭시화 대두유, 에폭시화 폴리부타디엔 등을 예로 들 수 있다.Examples of the glycidyl product of polyhydric alcohol or the glycidyl product (A1) of the polyhydric alcohol alkylene oxide adduct include monoglycidyl ethers of aliphatic higher alcohols, glycidyl esters of higher fatty acids, epoxidized soybean oil, and epoxystear. octyl acid, butyl epoxystearate, epoxidized soybean oil, epoxidized polybutadiene, and the like.
분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)로서는, 포화 축합환을 가지는 것이, 경화물의 경화성 및 밀착성이 향상되는 것에서 바람직하다.As a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product (A1) of a polyhydric alcohol alkylene oxide adduct, one having a saturated condensed ring is preferable from the viewpoint of improving the curability and adhesion of the cured product.
상기 분자량 200 이상의 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)로서는, 시판품을 사용할 수 있고, 예를 들면, 데나콜 EX-121, 데나콜 EX-171, 데나콜 EX-192, 데나콜 EX-211, 데나콜 EX-212, 데나콜 EX-313, 데나콜 EX-314, 데나콜 EX-321, 데나콜 EX-411, 데나콜 EX-421, 데나콜 EX-512, 데나콜 EX-521, 데나콜 EX-611, 데나콜 EX-612, 데나콜 EX-614, 데나콜 EX-622, 데나콜 EX-810, 데나콜 EX-811, 데나콜 EX-850, 데나콜 EX-851, 데나콜 EX-821, 데나콜 EX-830, 데나콜 EX-832, 데나콜 EX-841, 데나콜 EX-861, 데나콜 EX-911, 데나콜 EX-941, 데나콜 EX-920, 데나콜 EX-931(나가세켐텍스(주)사 제조); 에포라이트 M-1230, 에포라이트 40E, 에포라이트 100E, 에포라이트 200E, 에포라이트 400E, 에포라이트 70P, 에포라이트 200P, 에포라이트 400P, 에포라이트 1500NP, 에포라이트 1600, 에포라이트 80MF, 에포라이트 100MF(교에이샤화학(共榮社化學)(주)사 제조), 아데카글리시롤 ED-503, 아데카글리시롤 ED-503G, 아데카글리시롤 ED-506, 아데카글리시롤 ED-523T, 아데카레진 EP-4088S, 아데카레진 EP-4080E((주)ADEKA사 제조) 등이 있다.As the glycidylated product of the polyhydric alcohol having a molecular weight of 200 or more, or the glycidylated product (A1) of the polyhydric alcohol alkylene oxide adduct (A1), a commercially available product can be used, for example, denacol EX-121 and denacol EX-171 , Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Dena Call EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX -850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941 , denacol EX-920, denacol EX-931 (manufactured by Nagase Chemtex Co., Ltd.); Eporite M-1230, Eporite 40E, Eporite 100E, Eporite 200E, Eporite 400E, Eporite 70P, Eporite 200P, Eporite 400P, Eporite 1500NP, Eporite 1600, Eporite 80MF, Eporite 100MF ( Kyoeisha Chemical (manufactured by Kyoeisha Chemical Co., Ltd.), adecaglycerol ED-503, adecaglycerol ED-503G, adecaglycerol ED-506, adecaglycerol ED -523T, Adeka Resin EP-4088S, Adeka Resin EP-4080E (manufactured by ADEKA Corporation), and the like.
상기 지환식 에폭시 화합물(A2)이란, 포화환에 결합기를 통하지 않고 직접 옥시란환이 결합되어 있는 것을 일컫는다. 지환식 에폭시 화합물(A2)의 구체예로서는, 적어도 1개의 지환식환을 가지는 다가 알코올의 폴리글리시딜에테르화물 또는 시클로헥센이나 시클로펜텐환 함유 화합물을 산화제로 에폭시화함으로써 얻어지는 시클로헥센옥사이드나 시클로펜텐옥사이드 함유 화합물을 들 수 있다. 예를 들면, 3,4-에폭시시클로헥실에틸-3,4-에폭시시클로헥산카르복실레이트, 3,4-에폭시-1-메틸시클로헥실-3,4-에폭시-1-메틸헥산카르복실레이트, 6-메틸-3,4-에폭시시클로헥실에틸-6-메틸-3,4-에폭시시클로헥산카르복실레이트, 3,4-에폭시-3-메틸시클로헥실메틸-3,4-에폭시-3-메틸시클로헥산카르복실레이트, 3,4-에폭시-5-메틸시클로헥실메틸-3,4-에폭시-5-메틸시클로헥산카르복실레이트, 비스(3,4-에폭시시클로헥실에틸)아디페이트, 3,4-에폭시-6-메틸시클로헥산카르복실레이트, 메틸렌비스(3,4-에폭시시클로헥산), 프로판-2,2-디일-비스(3,4-에폭시시클로헥산), 2,2-비스(3,4-에폭시시클로헥실)프로판, 디시클로펜타디엔디에폭사이드, 에틸렌비스(3,4-에폭시시클로헥산카르복실레이트), 에폭시헥사하이드로프탈산 디옥틸, 에폭시헥사하이드로프탈산 디-2-에틸헥실, 1-에폭시에틸-3,4-에폭시시클로헥산, 1,2-에폭시-2-에폭시에틸시클로헥산, α-피넨옥시드, 리모넨디옥시드 등을 들 수 있다. 지환식 에폭시 화합물(A2)로서는, 3,4-에폭시시클로헥실에틸-3,4-에폭시시클로헥산카르복실레이트 또는 3,4-에폭시-1-메틸시클로헥실-3,4-에폭시-1-메틸헥산카르복실레이트가, 밀착성 향상의 관점에서 바람직하다.The said alicyclic epoxy compound (A2) refers to the thing in which the oxirane ring is couple|bonded with the saturated ring directly without a bonding group. Specific examples of the alicyclic epoxy compound (A2) include cyclohexene oxide and cyclopentene oxide obtained by epoxidizing a polyglycidyl ether product of a polyhydric alcohol having at least one alicyclic ring or a compound containing cyclohexene or cyclopentene ring with an oxidizing agent. containing compounds. For example, 3,4-epoxycyclohexylethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-Methyl-3,4-epoxycyclohexylethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methyl Cyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis (3,4-epoxycyclohexylethyl) adipate, 3, 4-epoxy-6-methylcyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane), propane-2,2-diyl-bis (3,4-epoxycyclohexane), 2,2-bis ( 3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, ethylenebis(3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate , 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, α-pineneoxide, limonene dioxide and the like. As the alicyclic epoxy compound (A2), 3,4-epoxycyclohexylethyl-3,4-epoxycyclohexanecarboxylate or 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methyl Hexane carboxylate is preferable from a viewpoint of an adhesive improvement.
상기 지환식 에폭시 화합물(A2)로서는, 시판품을 사용할 수 있고, 예를 들면, 셀록사이드 2021P, 셀록사이드 2081, 셀록사이드 2000, 셀록사이드 3000((주)다이셀사 제조) 등이 있다.As said alicyclic epoxy compound (A2), a commercial item can be used, For example, Celoxide 2021P, Celoxide 2081, Celoxide 2000, Celoxide 3000 (made by Daicel Corporation) etc. exist.
상기 방향족 에폭시 화합물(A3)이란, 방향환를 포함하는 에폭시 화합물을 나타내고, 방향족 에폭시 화합물의 구체예로서는, 페놀, 크레졸, 부틸페놀 등, 적어도 1개의 방향족환을 가지는 다가 페놀 또는, 그의 알킬렌옥사이드 부가물의 모노/폴리글리시딜에테르화물, 예를 들면, 비스페놀 A, 비스페놀 F, 또는 이들에 알킬렌옥사이드를 부가한 화합물의 글리시딜에테르화물이나 에폭시 노볼락 수지; 레조르시놀이나 하이드로퀴논, 카테콜 등의 2개 이상의 페놀성 수산기를 가지는 방향족 화합물의 모노/폴리글리시딜에테르화물; 페닐디메탄올이나 페닐디에탄올, 페닐디부탄올 등의 알코올성 수산기를 2개 이상 가지는 방향족 화합물의 글리시딜에테르화물; 프탈산, 테레프탈산, 트리멜리트산 등의 2개 이상의 카르복시산을 가지는 다염기산 방향족 화합물의 글리시딜에스테르, 벤조산의 글리시딜에스테르, 스티렌옥사이드 또는 디비닐벤젠의 에폭시화물 등을 들 수 있다.The said aromatic epoxy compound (A3) represents the epoxy compound containing an aromatic ring, As a specific example of an aromatic epoxy compound, polyhydric phenol which has at least 1 aromatic ring, such as phenol, cresol, butylphenol, or its alkylene oxide adduct Mono/polyglycidyl ether products, for example, bisphenol A, bisphenol F, or glycidyl ether products or epoxy novolac resins of compounds obtained by adding an alkylene oxide to these; mono/polyglycidyl ether products of aromatic compounds having two or more phenolic hydroxyl groups such as resorcinol, hydroquinone and catechol; glycidyl ether products of aromatic compounds having two or more alcoholic hydroxyl groups such as phenyldimethanol, phenyldiethanol and phenyldibutanol; and glycidyl esters of polybasic acid aromatic compounds having two or more carboxylic acids such as phthalic acid, terephthalic acid and trimellitic acid, glycidyl esters of benzoic acid, and epoxides of styrene oxide or divinylbenzene.
상기 방향족 에폭시 화합물(A3)으로서는, 시판품을 사용할 수 있고, 예를 들면, 데나콜(Denacol) EX-146, 데나콜 EX-147, 데나콜 EX-201, 데나콜 EX-203, 데나콜 EX-711, 데나콜 EX-721, 온코트 EX-1020, 온코트 EX-1030, 온코트 EX-1040, 온코트 EX-1050, 온코트 EX-1051, 온코트 EX-1010, 온코트 EX-1011, 온코트 1012(나가세켐텍스(주)사 제조); 오그솔 PG-100, 오그솔 EG-200, 오그솔 EG-210, 오그솔 EG-250(오사카가스케미칼(주)사 제조); HP4032, HP4032D, HP4700(DIC(주)사 제조); ESN-475V(신닛테츠(新日鐵)스미킨(住金)화학(주)사 제조); 에피코트(Epikote) YX8800(미쓰비시가가쿠(주)사 제조); 마프루프 G-0105SA, 마프루프 G-0130SP(니치유(주)사 제조); 에피클론(epiclon) N-665, 에피클론 HP-7200(DIC(주)사 제조); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L(니혼화약(日本化藥)(주)사 제조); 아데카레진 EP-4000, 아데카레진 EP-4005, 아데카레진 EP-4100, 아데카레진 EP-4901((주)ADEKA사 제조); TECHMORE VG-3101L((주)프린텍사 제조) 등이 있다. 상기 방향족 에폭시 화합물로서는, 다관능인 것이 경화성이 우수하므로 바람직하다.As said aromatic epoxy compound (A3), a commercial item can be used, For example, Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX- 711, Denacol EX-721, Oncoat EX-1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat 1012 (manufactured by Nagase Chemtex Co., Ltd.); Ogsol PG-100, Ogsol EG-200, Ogsol EG-210, Ogsol EG-250 (manufactured by Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700 (manufactured by DIC Corporation); ESN-475V (manufactured by Nittetsu Sumikin Chemical Co., Ltd.); Epikote YX8800 (manufactured by Mitsubishi Chemical Co., Ltd.); Mapproof G-0105SA, Mapproof G-0130SP (manufactured by Nichiyu Co., Ltd.); Epiclone N-665, Epiclone HP-7200 (manufactured by DIC Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (Nippon Chemical Co., Ltd.) manufactured by the company); Adecare resin EP-4000, Adecare resin EP-4005, Adecare resin EP-4100, Adecare resin EP-4901 (manufactured by ADEKA Corporation); TECHMORE VG-3101L (manufactured by Printec Co., Ltd.) and the like. As said aromatic epoxy compound, since it is excellent in sclerosis|hardenability that it is polyfunctional, it is preferable.
상기 옥세탄 화합물로서는, 3,7-비스(3-옥세타닐)-5-옥사-노난, 1,4-비스[(3-에틸-3-옥세타닐메톡시)메틸]벤젠, 1,2-비스[(3-에틸-3-옥세타닐메톡시)메틸]에탄, 1,3-비스[(3-에틸-3-옥세타닐메톡시)메틸]프로판, 에틸렌글리콜비스(3-에틸-3-옥세타닐메틸)에테르, 트리에틸렌글리콜비스(3-에틸-3-옥세타닐메틸)에테르, 테트라에틸렌글리콜비스(3-에틸-3-옥세타닐메틸)에테르, 1,4-비스(3-에틸-3-옥세타닐메톡시)부탄, 1,6-비스(3-에틸-3-옥세타닐메톡시)헥산 등의 2관능 지방족 옥세탄 화합물, 3-에틸-3-[(페녹시)메틸]옥세탄, 3-에틸-3-(헥실옥시메틸)옥세탄, 3-에틸-3-(2-에틸헥실옥시메틸)옥세탄, 3-에틸-3-(하이드록시메틸)옥세탄, 3-에틸-3-(클로로메틸)옥세탄 등의 1관능 옥세탄 화합물 등을 예로 들 수 있다. 이들은 1종 단독 혹은 2종 이상을 조합하여 사용할 수 있다.Examples of the oxetane compound include 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 1,2 -bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycolbis(3-ethyl-3 -oxetanylmethyl)ether, triethyleneglycolbis(3-ethyl-3-oxetanylmethyl)ether, tetraethyleneglycolbis(3-ethyl-3-oxetanylmethyl)ether, 1,4-bis( Bifunctional aliphatic oxetane compounds such as 3-ethyl-3-oxetanylmethoxy)butane and 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, 3-ethyl-3-[(phenoxy) )methyl]oxetane, 3-ethyl-3-(hexyloxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl)oxetane and monofunctional oxetane compounds such as 3-ethyl-3-(chloromethyl)oxetane. These can be used individually by 1 type or in combination of 2 or more type.
상기 옥세탄 화합물로서는, 양이온 중합성 모노머를 주성분으로 하는 시판품을 사용할 수 있고, 예를 들면, 2-하이드록시에틸비닐에테르, 디에틸렌글리콜모노비닐에테르, 4-하이드록시부틸비닐에테르(마루젠석유화학(丸善石油化學)(주)사 제조); 아론옥세탄 OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212(도아합성(주)사 제조), 에타나콜 OXBP, OXTP(우베흥산(宇部興産)(주)사 제조) 등이 있다.As said oxetane compound, the commercial item which has a cationically polymerizable monomer as a main component can be used, For example, 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, 4-hydroxybutyl vinyl ether (Maruzen Petrochemical) Chemicals (manufactured by 丸善石油chemical); Aronoxetane OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (manufactured by Toah Synthetic Co., Ltd.), etanacol OXBP, OXTP (Ube Heungsan) Co., Ltd.) and the like.
상기 비닐에테르 화합물로서는, 예를 들면, 디에틸렌글리콜모노비닐에테르, 트리에틸렌글리콜디비닐에테르, n-도데실비닐에테르, 시클로헥실비닐에테르, 2-에틸헥실비닐에테르, 2-클로로에틸비닐에테르, 에틸비닐에테르, 이소부틸비닐에테르, 트리에틸렌글리콜비닐에테르, 2-하이드록시에틸비닐에테르, 4-하이드록시부틸비닐에테르, 1,6-시클로헥산디메탄올모노비닐에테르, 에틸렌글리콜디비닐에테르, 1,4-부탄디올디비닐에테르, 1,6-시클로헥산디메탄올디비닐에테르 등이 있다.Examples of the vinyl ether compound include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, Ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, ethylene glycol divinyl ether, 1 ,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether, and the like.
상기 양이온 중합성 성분(A)에 있어서, 상기 분자량 200 이상의 다가 알코올의 글리시딜화물 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1), 지환식 에폭시 화합물(A2), 방향족 에폭시 화합물(A3), 옥세탄 화합물 및 비닐에테르 화합물의 사용 비율은, 양이온 중합성 성분(A) 100질량부에 대하여, 분자량 200 이상의 다가 알코올의 글리시딜화물 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1) 10∼99 질량부, 지환식 에폭시 화합물(A2) 1∼50 질량부, 방향족 에폭시 화합물(A3) 0∼80 질량부, 옥세탄 화합물 0∼50 질량부, 비닐에테르 화합물 0∼20 질량부인 것이, 점도, 도포성, 반응성 및 경화성이 향상되는 점에서 바람직하다.In the cationically polymerizable component (A), a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more or a glycidylated product of a polyhydric alcohol alkylene oxide adduct (A1), an alicyclic epoxy compound (A2), an aromatic epoxy compound ( A3), the usage ratio of an oxetane compound and a vinyl ether compound is the glycidyl product of the polyhydric alcohol 200 or more molecular weight 200 or more, or the glycidyl product of the polyhydric alcohol alkylene oxide adduct with respect to 100 mass parts of cationically polymerizable components (A). (A1) 10-99 mass parts, alicyclic epoxy compound (A2) 1-50 mass parts, aromatic epoxy compound (A3) 0-80 mass parts, oxetane compound 0-50 mass parts, vinyl ether compound 0-20 mass It is preferable at the point that a viscosity, coatability, reactivity, and sclerosis|hardenability improve.
본 발명의 경화성 조성물에 관한 양이온 중합 개시제(B)과는, 에너지선 조사 또는 가열에 의해 양이온 중합을 개시시키는 물질을 방출시키는 것이 가능한 화합물이라면 어떤 것이라도 무방하지만, 바람직하게는, 에너지선의 조사에 의해 루이스산을 방출하는 오늄염인 복염, 또는 그의 유도체이다. 이러한 화합물의 대표적인 것으로서는, 하기 일반식,The cationic polymerization initiator (B) according to the curable composition of the present invention may be any compound capable of releasing a substance that initiates cationic polymerization by irradiation with energy rays or heating, but is preferably used for irradiation with energy rays. It is an onium salt that releases a Lewis acid by a double salt, or a derivative thereof. As a representative example of such a compound, the following general formula,
[A]r+[B]r- [A] r+ [B] r-
로 표시되는 양이온과 음이온의 염을 예로 들 수 있다.A salt of a cation and an anion represented by .
여기서 양이온 [A]r+는 오늄인 것이 바람직하고, 그 구조는, 예를 들면, 하기일반식,Here, the cation [A] r+ is preferably onium, and its structure is, for example, the following general formula,
[(R2)aQ]r+ [(R 2 ) a Q] r+
로 표시할 수 있다.can be displayed as
또한 여기서, R2는 탄소 원자수가 1∼60이며, 탄소 원자 이외의 원자를 몇 개 포함해도 되는 유기의 기이다. a는 1∼5로 되는 정수이다. a개의 R2는 각각 독립적이어서, 동일할 수도 있고 상이할 수도 있다. 또한, 적어도 1개는, 방향환를 가지는 상기와 같은 유기의 기인 것이 바람직하다. Q는 S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N=N으로 이루어지는 군으로부터 선택되는 원자 혹은 원자단이다. 또한, 양이온 [A]r+ 중의 Q의 원자가를 q로 했을 때, r=a-q가 되는 관계가 성립할 필요가 있다(다만, N=N은 원자가 0으로서 취급한다)Here, R 2 is an organic group having 1 to 60 carbon atoms and may contain any number of atoms other than carbon atoms. a is an integer from 1 to 5; a R 2 may be each independent and may be the same or different. Moreover, it is preferable that at least 1 is the above organic group which has an aromatic ring. Q is an atom or group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N=N. Further, when the valence of Q in the cation [A] r+ is set to q, it is necessary to establish a relationship such that r=aq (however, N=N is treated as valence 0)
또한, 음이온 [B]r-는, 할로겐화물 착체인 것이 바람직하고, 그 구조는, 예를 들면, 하기 일반식,In addition, it is preferable that anion [B] r- is a halide complex, and the structure is, for example, the following general formula,
[LYb]r- [LY b ] r-
로 표시할 수 있다.can be displayed as
또한 여기서, L은 할로겐화물 착체의 중심 원자인 금속 또는 반금속(Metalloid)이며, B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co 등이다. Y는 할로겐 원자이다. b는 3∼7이 되는 정수이다. 또한, 음이온 [B]r- 중의 L의 원자가를 p로 했을 때, r=b-p가 되는 관계가 성립할 필요가 있다.Here, L is a metal or metalloid that is the central atom of the halide complex, and B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr , Mn, Co, and the like. Y is a halogen atom. b is an integer used as 3-7. In addition, when the valence of L in the anion [B] r- is set to p, it is necessary to establish a relationship such that r = bp.
상기 일반식의 음이온 [LYb]r-의 구체예로서는, 테트라키스(펜타플루오로페닐)보레이트, 테트라(3,5-디플루오로-4-메톡시페닐)보레이트, 테트라플루오로보레이트(BF4)-, 헥사플루오로포스페이트(PF6)-, 헥사플루오로안티모네이트(SbF6)-, 헥사플루오로아르세네이트(AsF6)-, 헥사클로로안티모네이트(SbCl6)- 등을 들 수 있다.Specific examples of the anion [LY b ] r- of the above general formula include tetrakis(pentafluorophenyl)borate, tetra(3,5-difluoro-4-methoxyphenyl)borate, tetrafluoroborate (BF 4 ) ) - , hexafluorophosphate (PF 6 ) - , hexafluoroantimonate (SbF 6 ) - , hexafluoroarsenate (AsF 6 ) - , hexachloroantimonate (SbCl 6 ) - and the like. can
또한, 음이온 [B]r-는, 하기 일반식,In addition, the anion [B] r- is represented by the following general formula,
[LYb-1(OH)]r- [LY b-1 (OH)] r-
로 표시되는 구조인 것도 바람직하게 사용할 수 있다. L, Y, b는 상기와 같다. 또한, 그 외에 사용할 수 있는 음이온으로서는, 과염소산 이온(ClO4)-, 트리플루오로메틸아황산 이온(CF3SO3)-, 플루오로술폰산 이온(FSO3)-, 톨루엔술폰산 음이온, 트리니트로벤젠술폰산 음이온, 캠퍼술포네이트, 노나플루오로부탄술포네이트, 헥사데카플루오로옥탄술포네이트, 테트라아릴보레이트, 테트라키스(펜타플루오로페닐)보레이트 등을 예로 들 수 있다.A structure represented by can also be preferably used. L, Y and b are the same as above. In addition, as anions that can be used in addition, perchlorate ion (ClO 4 ) - , trifluoromethylsulfite ion (CF 3 SO 3 ) - , fluorosulfonic acid ion (FSO 3 ) - , toluenesulfonic acid anion, trinitrobenzenesulfonic acid anion , camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate, tetrakis(pentafluorophenyl)borate, and the like.
본 발명의 경화성 조성물에서는, 이와 같은 오늄염 중에서도, 하기 (가)∼ (다)의 방향족 오늄염을 사용하는 것이 특히 유효하다. 이들 중에서, 그 1종을 단독으로, 또는 2종 이상을 혼합하여 사용할 수 있다.In the curable composition of the present invention, it is particularly effective to use the following aromatic onium salts (a) to (c) among such onium salts. Among these, the 1 type can be used individually or 2 or more types can be mixed and used.
(가) 페닐디아조늄헥사플루오로포스페이트, 4-메톡시페닐디아조늄헥사플루오로안티모네이트, 4-메틸페닐디아조늄헥사플루오로포스페이트 등의 아릴디아조늄염(A) Aryldiazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, and 4-methylphenyldiazonium hexafluorophosphate
(나) 디페닐요오드늄헥사플루오로안티모네이트, 디(4-메틸페닐)요오드늄헥사플루오로포스페이트, 디(4-tert-부틸페닐)요오드늄헥사플루오로포스페이트, 트리쿠밀요오드늄테트라키스(펜타플루오로페닐)보레이트 등의 디아릴요오드늄염(B) Diphenyliodonium hexafluoroantimonate, di(4-methylphenyl)iodonium hexafluorophosphate, di(4-tert-butylphenyl)iodonium hexafluorophosphate, tricumyliodonium tetrakis ( Diaryliodonium salts such as pentafluorophenyl) borate
(다) 하기 군 I 또는 군 II로 표시되는 술포늄 양이온과 헥사플루오로안티몬 이온, 헥사플루오로포스페이트 이온, 테트라키스(펜타플루오로페닐)보레이트 이온 등의 술포늄염(C) Sulfonium salts such as sulfonium cations and hexafluoroantimony ions, hexafluorophosphate ions and tetrakis(pentafluorophenyl)borate ions represented by the following group I or group II
<군 I><Group I>
<군 II><Group II>
또한, 그 외의 바람직한 것으로서는, (η5-2,4-시클로펜타디엔-1-일)[(1,2,3,4,5,6-η)-(1-메틸에틸)벤젠]-아이언-헥사플루오로포스페이트 등의 철-아렌(arene) 착체나, 트리스(아세틸아세토네이트)알루미늄, 트리스(에틸아세토네이트아세테이트)알루미늄, 트리스(살리실알데히다토)알루미늄 등의 알루미늄 착체와 트리페닐실라놀 등의 실라놀류와의 혼합물; 티오페늄염, 티오라늄염, 벤질암모늄, 피리디늄염, 히드라지늄염 등의 염; 디에틸렌트리아민, 트리에틸렌트리아민, 테트라에틸렌펜타민 등의 폴리알킬폴리아민류; 1,2-디아미노시클로헥산, 1,4-디아미노-3,6-디에틸시클로헥산, 이소포론디아민 등의 지환식 폴리아민류; m-크실릴렌디아민, 디아미노디페닐메탄, 디아미노디페닐술폰 등의 방향족 폴리아민류; 상기 폴리아민류와, 페닐글리시딜에테르, 부틸글리시딜에테르, 비스페놀 A-디글리시딜에테르, 비스페놀 F-디글리시딜에테르 등의 글리시딜에테르류 또는 카르복시산의 글리시딜에스테르류 등의 각종 에폭시 수지를 통상적인 방법에 의해 반응시킴으로써 제조되는 폴리에폭시 부가 변성물; 상기 유기 폴리아민류와, 프탈산, 이소프탈산, 다이머산 등의 카르복시산류를 통상적인 방법에 의해 반응시킴으로써 제조되는 아미드화 변성물; 상기 폴리아민류와 포름알데히드 등의 알데히드류 및 페놀, 크레졸, 크실레놀, tert-부틸페놀, 레조르신 등의 핵에 적어도 1개의 알데히드화 반응성 장소를 가지는 페놀류를 통상적인 방법에 의해 반응시킴으로써 제조되는 만니히화 변성물; 다가 카르복시산(옥살산, 말론산, 숙신산, 글루타르산, 아디프산, 피멜산, 수베르산, 아젤라산, 세바스산, 도데칸이산, 2-메틸숙신산, 2-메틸아디프산, 3-메틸아디프산, 3-메틸펜탄이산, 2-메틸옥탄이산, 3,8- 디메틸데칸이산, 3,7- 디메틸데칸이산, 수첨(水添) 다이머산, 다이머산 등의 지방족 디카르복시산류; 프탈산, 테레프탈산, 이소프탈산, 나프탈렌디카르복시산 등의 방향족 디카르복시산류; 시클로헥산디카르복시산 등의 지환식 디카르복시산류; 트리멜리트산, 트리메스산, 피마자유 지방산의 3량체 등의 트리카르복시산류; 피로멜리트산 등의 테트라카르복시산류등)의 산무수물; 디시안디아미드, 이미다졸류, 카르복시산 에스테르, 술폰산 에스테르, 아민이미드 등을 예로 들 수 있다.Moreover, as another preferable thing, (η 5 -2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl)benzene]- Iron-arene complexes such as iron-hexafluorophosphate, aluminum complexes such as tris(acetylacetonate)aluminum, tris(ethylacetonate acetate)aluminum, tris(salicylaldehyde)aluminum, and triphenyl mixtures with silanols such as silanol; salts such as thiophenium salt, thioranium salt, benzylammonium, pyridinium salt, and hydrazinium salt; polyalkyl polyamines such as diethylenetriamine, triethylenetriamine, and tetraethylenepentamine; alicyclic polyamines such as 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane and isophoronediamine; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone; The above polyamines, glycidyl ethers such as phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether, or glycidyl esters of carboxylic acid, etc. polyepoxy addition-modified products prepared by reacting various epoxy resins of amidation-modified products produced by reacting the organic polyamines with carboxylic acids such as phthalic acid, isophthalic acid and dimer acid by a conventional method; Manufactured by reacting the polyamines with aldehydes such as formaldehyde and phenols having at least one aldehyde reactive site in the nucleus, such as phenol, cresol, xylenol, tert-butylphenol, resorcin, by a conventional method Mannichation modified product; Polyhydric carboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanoic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyl aliphatic dicarboxylic acids such as adipic acid, 3-methylpentanedioic acid, 2-methyloctanedioic acid, 3,8-dimethyldecanoic acid, 3,7-dimethyldecanedioic acid, hydrogenated dimer acid and dimer acid; , terephthalic acid, isophthalic acid, aromatic dicarboxylic acids such as naphthalenedicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; Tricarboxylic acids such as trimellitic acid, trimesic acid, and a trimer of castor oil fatty acid; pyromelli acid anhydrides of tetracarboxylic acids such as toric acid; and dicyandiamide, imidazoles, carboxylic acid esters, sulfonic acid esters, and amineimides.
이들 중에서도, 실용면과 광감도 향상의 관점에서, 방향족 요오드알루미늄염, 방향족 술포늄염, 철-아렌 착체를 사용하는 것이 바람직하고, 하기 구조를 가지는 방향족 술포늄염을, 양이온 중합 개시제(B) 100질량%에 대하여, 적어도 0.1질량% 이상 함유하는 것이 더욱 바람직하다.Among these, it is preferable to use an aromatic aluminum iodide salt, an aromatic sulfonium salt, and an iron- arene complex from the viewpoint of practical use and photosensitivity improvement, and an aromatic sulfonium salt having the following structure is used as a cationic polymerization initiator (B) 100% by mass It is more preferable to contain at least 0.1% by mass or more.
여기서, 식 중, R11, R12, R13, R14, R15, R16, R17, R18, R19 및 R20은, 각각 독립적으로, 수소 원자, 할로겐 원자, 탄소 원자수 1∼10의 알킬기, 탄소 원자수 1∼10의 알콕시기 또는 탄소 원자수 2∼10의 에스테르기를 나타내고, R21, R22, R23 및 R24는, 각각 독립적으로, 수소 원자, 할로겐 원자 또는 탄소 원자수 1∼10의 알킬기를 나타내고, R25는, 수소 원자, 할로겐 원자, 탄소 원자수 1∼10의 알킬기 또는 하기 화학식(A)∼화학식(C)으로부터 선택되는 어느 하나의 치환기를 나타내고, Anq -는 q가의 음이온을 나타내고, p는 전하를 중성으로 하는 계수를 나타낸다.wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 each independently represent a hydrogen atom, a halogen atom, and 1 carbon atom. represents an alkyl group of -10, an alkoxy group of 1 to 10 carbon atoms, or an ester group of 2-10 carbon atoms, R 21 , R 22 , R 23 and R 24 are each independently a hydrogen atom, a halogen atom or carbon represents an alkyl group having 1 to 10 atoms, R 25 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or any substituent selected from the following formulas (A) to (C), An q − represents an anion having a q valence, and p represents a coefficient for neutralizing the charge.
여기서, 식 중, R11, R12, R13, R14, R15, R16, R17, R18, R19, wherein R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 ,
R20, R21, R22, R23, R24, R26, R27, R28, R29, R35, R36, R37, R38 및 R39는, 각각 독립적으로, 수소 원자, 할로겐 원자, 탄소 원자수 1∼10의 알킬기, 탄소 원자수 1∼10의 알콕시기 또는 탄소 원자수 2∼10의 에스테르기를 나타내고, R30, R31, R32, R33 및 R34는, 각각 독립적으로, 수소 원자, 할로겐 원자 또는 탄소 원자수 1∼10의 알킬기를 나타낸다.R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 are each independently a hydrogen atom; represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms or an ester group having 2 to 10 carbon atoms, R 30 , R 31 , R 32 , R 33 and R 34 are each Independently, a hydrogen atom, a halogen atom, or a C1-C10 alkyl group is represented.
상기 일반식(1)으로 표시되는 화합물에 있어서, R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, R28, R29, R30, R31, R32, R33, R34, R35, R36, R37, R38 및 R39로 표시되는 할로겐 원자로서는, 불소, 염소, 브롬, 요오드 등을 예로 들 수 있다.In the compound represented by the general formula (1), R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Examples of the halogen atom represented include fluorine, chlorine, bromine, and iodine.
R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, R28, R29, R30, R31, R32, R33, R34, R35, R36, R37, R38 및 R39로 표시되는 탄소 원자수 1∼10의 알킬기로서는, 메틸, 에틸, 프로필, 이소프로필, 부틸, sec-부틸, tert-부틸, 이소부틸, 아밀, 이소아밀, tert-아밀, 헥실, 시클로헥실, 헵틸, 옥틸, 노닐, 에틸옥틸, 2-메톡시에틸, 3-메톡시프로필, 4-메톡시부틸, 2-부톡시에틸, 메톡시에톡시에틸, 메톡시에톡시에톡시에틸, 3-메톡시부틸, 2-메틸티오에틸, 플루오로메틸, 디플루오로메틸, 트리플루오로메틸, 클로로메틸, 디클로로메틸, 트리클로로메틸, 브로모메틸, 디브로모메틸, 트리브로모메틸, 디플루오로에틸, 트리클로로에틸, 디클로로디플루오로에틸, 펜타플루오로에틸, 헵타플루오로프로필, 노나플루오로부틸, 데카플루오로펜틸, 트리데카플루오로헥실, 펜타데카플루오로헵틸, 헵타데카플루오로옥틸, 메톡시메틸, 1,2-에폭시에틸, 메톡시에틸, 메톡시에톡시메틸, 메틸티오메틸, 에톡시에틸, 부톡시메틸, tert-부틸티오메틸, 4-펜테닐옥시메틸, 트리클로로에톡시메틸, 비스(2-클로로에톡시)메틸, 메톡시시클로헥실, 1-(2-클로로에톡시)에틸, 1-메틸-1-메톡시에틸, 에틸디티오에틸, 트리메틸실릴에틸, tert-부틸디메틸실릴옥시메틸, 2-(트리메틸실릴)에톡시메틸, tert-부톡시카르보닐메틸, 에틸옥시카르보닐메틸, 에틸카르보닐메틸, tert-부톡시카르보닐메틸, 아크릴로일옥시에틸, 메타크릴로일옥시에틸, 2-메틸-2-아다만틸옥시카르보닐메틸, 아세틸에틸, 2-메톡시-1-프로페닐, 하이드록시메틸, 2-하이드록시에틸, 1-하이드록시에틸, 2-하이드록시프로필, 3-하이드록시프로필, 3-하이드록시부틸, 4-하이드록시부틸, 1,2-디하이드록시에틸등을 예로 들 수 있다.R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 include, as an alkyl group having 1 to 10 carbon atoms, methyl , ethyl, propyl, isopropyl, butyl, sec-butyl, tert-butyl, isobutyl, amyl, isoamyl, tert-amyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoro Romethyl, trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoro Ethyl, heptafluoropropyl, nonafluorobutyl, decafluoropentyl, tridecafluorohexyl, pentadecafluoroheptyl, heptadecafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, Methoxyethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, tert-butylthiomethyl, 4-pentenyloxymethyl, trichloroethoxymethyl, bis(2-chloroethoxy)methyl, methoxycyclo Hexyl, 1-(2-chloroethoxy)ethyl, 1-methyl-1-methoxyethyl, ethyldithioethyl, trimethylsilylethyl, tert-butyldimethylsilyloxymethyl, 2-(trimethylsilyl)ethoxymethyl, tert-butoxycarbonylmethyl, ethyloxycarbonylmethyl, ethylcarbonylmethyl, tert-butoxycarbonylmethyl, acryloyloxyethyl, methacryloyloxyethyl, 2-methyl-2-adamantyloxy Carbonylmethyl, acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl , 4-hydroxybutyl, 1,2-dihydroxyethyl, etc. for example.
R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R26, R27, R28, R29, R35, R36, R37, R38 및 R39로 표시되는 탄소 원자수 1∼10의 알콕시기로서는, 메톡시, 에톡시, 프로필옥시, 이소프로필옥시, 부틸옥시, sec-부틸옥시, tert-부틸옥시, 이소부틸옥시, 펜틸옥시, 이소아밀옥시, tert-아밀옥시, 헥실옥시, 시클로헥실옥시, 시클로헥실메틸옥시, 테트라하이드로퓨라닐옥시, 테트라하이드로피라닐옥시, 2-메톡시에틸옥시, 3-메톡시프로필옥시, 4-메톡시부틸옥시, 2-부톡시에틸옥시, 메톡시에톡시에틸옥시, 메톡시에톡시에톡시에틸옥시, 3-메톡시부틸옥시, 2-메틸티오에틸옥시, 트리플루오로메틸옥시 등을 예로 들 수 있다.R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 as the alkoxy group having 1 to 10 carbon atoms are methoxy, ethoxy, propyloxy, isopropyloxy, butyloxy, sec- Butyloxy, tert-butyloxy, isobutyloxy, pentyloxy, isoamyloxy, tert-amyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethyloxy, tetrahydrofuranyloxy, tetrahydropyranyloxy, 2-Methoxyethyloxy, 3-methoxypropyloxy, 4-methoxybutyloxy, 2-butoxyethyloxy, methoxyethoxyethyloxy, methoxyethoxyethoxyethyloxy, 3-methoxybutyloxy , 2-methylthioethyloxy, trifluoromethyloxy, and the like.
R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R26, R27, R28, R29, R35, R36, R37, R38 및 R39로 표시되는 탄소 원자수 2∼10의 에스테르기로서는, 메톡시카르보닐, 에톡시카르보닐, 이소프로필옥시카르보닐, 페녹시카르보닐, 아세톡시, 프로피오닐옥시, 부티릴옥시, 클로로아세틸옥시, 디클로로아세틸옥시, 트리클로로아세틸옥시, 트리플루오로아세틸옥시, tert-부틸카르보닐옥시, 메톡시아세틸옥시, 벤조일옥시 등을 예로 들 수 있다.R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 as the ester group having 2 to 10 carbon atoms include methoxycarbonyl, ethoxycarbonyl, isopropyloxycarbonyl, and phenoxycarbonyl. carbonyl, acetoxy, propionyloxy, butyryloxy, chloroacetyloxy, dichloroacetyloxy, trichloroacetyloxy, trifluoroacetyloxy, tert-butylcarbonyloxy, methoxyacetyloxy, benzoyloxy, etc. can be heard
(A) 성분과 (C) 성분과 (E) 성분의 합계 100질량부에 대한 양이온 중합 개시제(B)의 사용 비율은, 양이온 중합 개시제(B) 0.1∼10 질량부, 바람직하게는 1∼6질량부이다. 지나치게 적으면 경화가 불충분하게 되기 쉽고, 지나치게 많으면 경화물의 흡수율이나 경화물 강도 등의 여러 물성에 악영향을 주는 경우가 있다.(A) The use ratio of the cationic polymerization initiator (B) with respect to a total of 100 mass parts of (A) component, (C)component, and (E) component is 0.1-10 mass parts of cationic polymerization initiators (B) Preferably 1-6 is the mass part. When too small, hardening tends to become inadequate easily, and when too large, it may exert a bad influence on various physical properties, such as water absorption of hardened|cured material and hardened|cured material intensity|strength.
본 발명의 경화성 조성물에 관한 라디칼 중합성 성분(C)은, 에폭시기 및 에틸렌성 불포화기를 가지는 화합물(C1) 또는 탄소 원자수 2∼20인 알코올의 아크릴산 에스테르 혹은 탄소 원자수 2∼20인 알코올의 메타크릴산 에스테르(C2)를 필수 성분으로 한다.The radically polymerizable component (C) according to the curable composition of the present invention is a compound (C1) having an epoxy group and an ethylenically unsaturated group, an acrylic acid ester of an alcohol having 2 to 20 carbon atoms, or meta of an alcohol having 2 to 20 carbon atoms. Acrylic acid ester (C2) is an essential component.
상기 에폭시기 및 에틸렌성 불포화기를 가지는 화합물(C1)로서는, 예를 들면, 에폭시아크릴레이트 또는 에폭시메타크릴레이트가 있고, 구체적으로는, 종래 공지의 방향족 에폭시 수지, 지환식 에폭시 수지, 지방족 에폭시 수지 등과, 아크릴산 또는 메타크릴산을 반응시켜 얻어지는 아크릴레이트이다. 이들 에폭시아크릴레이트 또는 에폭시메타크릴레이트 중, 특히 바람직한 것은, 알코올류의 글리시딜에테르의 아크릴레이트 또는 메타크릴레이트이다.The compound (C1) having an epoxy group and an ethylenically unsaturated group includes, for example, an epoxy acrylate or an epoxy methacrylate, and specifically, a conventionally known aromatic epoxy resin, an alicyclic epoxy resin, an aliphatic epoxy resin, etc.; It is an acrylate obtained by making acrylic acid or methacrylic acid react. Among these epoxy acrylates or epoxy methacrylates, acrylates or methacrylates of glycidyl ethers of alcohols are particularly preferable.
상기 탄소 원자수 2∼20인 알코올의 아크릴레이트 혹은 탄소 원자수 2∼20인 알코올의 메타크릴레이트(C2)로서는, 분자 중에 적어도 1개의 수산기를 가지는 방향족 또는 지방족 알코올, 및 그의 알킬렌옥사이드 부가체와 아크릴산 또는 메타크릴산을 반응시켜 얻어지는 아크릴레이트 또는 메타크릴레이트를 예로 들 수 있다. 구체적으로는, 2-에틸헥실아크릴레이트, 2-하이드록시에틸아크릴레이트, 2-하이드록시프로필아크릴레이트, 이소아밀아크릴레이트, 라우릴아크릴레이트, 스테아릴아크릴레이트, 이소옥틸아크릴레이트, 테트라하이드로푸르푸릴아크릴레이트, 이소보닐아크릴레이트, 벤질아크릴레이트, 1,3-부탄디올디아크릴레이트, 1,4-부탄디올디아크릴레이트, 1,6-헥산디올디아크릴레이트, 디에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 네오펜틸글리콜디아크릴레이트, 폴리에틸렌글리콜디아크릴레이트, 폴리프로필렌글리콜디아크릴레이트, 트리메틸올프로판트리아크릴레이트, 펜타에리트리톨테트라아크릴레이트, 디펜타에리트리톨헥사아크릴레이트, ε-카프로락톤 변성 디펜타에리트리톨헥사아크릴레이트, 2-에틸헥실메타크릴레이트, 2-하이드록시에틸메타크릴레이트, 2-하이드록시프로필메타크릴레이트, 이소아밀메타크릴레이트, 라우릴메타크릴레이트, 스테아릴메타크릴레이트, 이소옥틸메타크릴레이트, 테트라하이드로푸르푸릴메타크릴레이트, 이소보닐메타크릴레이트, 벤질메타크릴레이트, 1,3-부탄디올디메타크릴레이트, 1,4-부탄디올디메타크릴레이트, 1,6-헥산디올디메타크릴레이트, 디에틸렌글리콜디메타크릴레이트, 트리에틸렌글리콜디메타크릴레이트, 네오펜틸글리콜디메타크릴레이트, 폴리에틸렌글리콜디메타크릴레이트, 폴리프로필렌글리콜디메타크릴레이트, 트리메틸올프로판트리메타크릴레이트, 펜타에리트리톨테트라메타크릴레이트, 디펜타에리트리톨헥사메타크릴레이트, ε-카프로락톤 변성 디펜타에리트리톨헥사메타크릴레이트 등을 예로 들 수 있다. 그리고, 이들 아크릴레이트 또는 메타크릴레이트 중, 다가 알코올의 폴리아크릴레이트류 또는 다가 알코올의 폴리메타크릴레이트류가 특히 바람직하다.As the acrylate of the alcohol having 2 to 20 carbon atoms or the methacrylate (C2) of the alcohol having 2 to 20 carbon atoms, an aromatic or aliphatic alcohol having at least one hydroxyl group in the molecule, and an alkylene oxide adduct thereof and acrylates or methacrylates obtained by reacting with acrylic acid or methacrylic acid. Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isoamyl acrylate, lauryl acrylate, stearyl acrylate, isooctyl acrylate, tetrahydrofur Furyl acrylate, isobornyl acrylate, benzyl acrylate, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, diethylene glycol diacrylate, triethylene Glycol diacrylate, neopentyl glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ε-capro Lactone-modified dipentaerythritol hexaacrylate, 2-ethylhexyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, isoamyl methacrylate, lauryl methacrylate, stearyl Methacrylate, isooctyl methacrylate, tetrahydrofurfuryl methacrylate, isobornyl methacrylate, benzyl methacrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1 ,6-hexanediol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethyl Allpropane trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexamethacrylate, ε-caprolactone-modified dipentaerythritol hexamethacrylate, and the like are exemplified. And among these acrylates or methacrylates, polyacrylates of polyhydric alcohols or polymethacrylates of polyhydric alcohols are particularly preferable.
상기 라디칼 중합성 성분(C)으로서는, (C1) 또는 (C2) 이외의 에너지선 조사 또는 가열에 의해 활성화한 라디칼 중합 개시제에 의해 고분자화 또는 가교 반응하는 화합물을 사용할 수도 있고, 예를 들면, 알릴우레탄 화합물, 불포화 폴리에스테르 화합물, 스티렌계 화합물 등이 있다. 라디칼 중합성 성분(C)에서의, 상기 (C1) 성분 및 (C2) 성분의 비율은, 50질량% 이상이 바람직하다.As said radically polymerizable component (C), the compound which polymerizes or crosslinks with the radical polymerization initiator activated by energy ray irradiation or heating other than (C1) or (C2) can also be used, For example, allyl urethane compounds, unsaturated polyester compounds, styrene compounds, and the like. As for the ratio of the said (C1) component and (C2) component in a radically polymerizable component (C), 50 mass % or more is preferable.
본 발명의 경화성 조성물에 관한 라디칼 개시제(D)로서는 특별히 제한은 없고, 공지의 것을 사용할 수 있다. 예를 들면, 아세토페논계 화합물, 벤질계 화합물, 벤조페논계 화합물, 디옥산톤계 화합물 등의 케톤계 화합물, 옥심계 화합물 등을 사용할 수 있다.There is no restriction|limiting in particular as a radical initiator (D) which concerns on the curable composition of this invention, A well-known thing can be used. For example, ketone-based compounds such as acetophenone-based compounds, benzyl-based compounds, benzophenone-based compounds, and dioxanthone-based compounds, and oxime-based compounds can be used.
본 발명의 경화성 조성물에 관한 폴리머(E)는, 상기 식(I)으로 표시되는 단량체로부터 얻어지는 폴리머, 상기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머, 상기 식(I)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 상기 식(II)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 및 상기 식(I)으로 표시되는 단량체 및 상기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머로 이루어지는 군으로부터 선택되고, 중량 평균 분자량이, 폴리스티렌 환산으로 1,000∼30,000이다.The polymer (E) related to the curable composition of the present invention is selected from a polymer obtained from the monomer represented by the formula (I), a polymer obtained from the monomer represented by the formula (II), and a monomer represented by the formula (I). A polymer obtained from two or more monomers, a polymer obtained from two or more monomers selected from the monomers represented by the formula (II), and a monomer represented by the formula (I) and a monomer represented by the formula (II). It is selected from the group which consists of the polymer obtained, and a weight average molecular weight is 1,000-30,000 in terms of polystyrene.
상기 식(I) 중의 X로 표시되는 탄소 원자수 1∼7의 알킬기로서는, 메틸, 에틸, 프로필, iso-프로필, 부틸, sec-부틸, tert-부틸, iso-부틸, 아밀, iso-아밀, tert-아밀, 헥실, 2-헥실, 3-헥실, 시클로헥실, 4-메틸시클로헥실, 헵틸, 2-헵틸, 3-헵틸, iso-헵틸, tert-헵틸 등을 예로 들 수 있다. 이들 중에서도, 탄소 원자수 1∼4의 알킬기, 또는, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 부분적으로 치환된 탄소 원자수 1∼4의 알킬기가, 경화성의 점에서 바람직하다.Examples of the alkyl group having 1 to 7 carbon atoms represented by X in the formula (I) include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl, iso-amyl, tert-amyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl and the like. Among these, an alkyl group having 1 to 4 carbon atoms, or an alkyl group having 1 to 4 carbon atoms partially substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group is a point of curability preferred in
상기 식(I) 중의 X로 표시되는 탄소 원자수 1∼7의 알콕시기로서는, 메톡시, 에톡시, 프로필옥시, iso-프로필옥시, 부틸옥시, sec-부틸옥시, tert-부틸옥시, iso-부틸옥시, 아밀옥시, iso-아밀옥시, tert-아밀옥시, 헥실옥시, 2-헥실옥시, 3-헥실옥시, 시클로헥실옥시, 4-메틸시클로헥실옥시, 헵틸옥시, 2-헵틸옥시, 3-헵틸옥시, iso-헵틸옥시, tert-헵틸옥시 등을 예로 들 수 있다. 이들 중에서도, 탄소 원자수 1∼4의 알콕시기, 또는, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 부분적으로 치환된 탄소 원자수 1∼4의 알콕시기가, 경화성의 점에서 바람직하다.Examples of the alkoxy group having 1 to 7 carbon atoms represented by X in the formula (I) include methoxy, ethoxy, propyloxy, iso-propyloxy, butyloxy, sec-butyloxy, tert-butyloxy, iso- Butyloxy, amyloxy, iso-amyloxy, tert-amyloxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2- heptyloxy, 3-heptyloxy, iso-heptyloxy, tert-heptyloxy and the like are exemplified. Among these, an alkoxy group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms partially substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group is a curable preferred in that respect.
상기 식(I) 중의 X로 표시되는 탄소 원자수 6∼12의 아릴기로서는, 페닐, 메틸페닐, 나프틸 등을 예로 들 수 있다.Examples of the aryl group having 6 to 12 carbon atoms represented by X in the formula (I) include phenyl, methylphenyl and naphthyl.
상기 식(I) 중의 X로 표시되는 탄소 원자수 6∼12의 아릴옥시기로서는, 페닐옥시, 메틸페닐옥시, 나프틸옥시 등을 예로 들 수 있다.Examples of the aryloxy group having 6 to 12 carbon atoms represented by X in the formula (I) include phenyloxy, methylphenyloxy and naphthyloxy.
상기 식(I) 중의 X로 표시되는 탄소 원자수 6∼10의 지환식 탄화 수소기로서는, 시클로헥실, 메틸시클로헥실, 노르보르닐, 비시클로펜틸, 비시클로옥틸, 트리메틸비시클로헵틸, 트리시클로옥틸, 트리시클로데카닐, 스피로옥틸, 스피로비시클로펜틸, 아다만틸, 이소보르닐 등을 예로 들 수 있다.Examples of the alicyclic hydrocarbon group having 6 to 10 carbon atoms represented by X in the formula (I) include cyclohexyl, methylcyclohexyl, norbornyl, bicyclopentyl, bicyclooctyl, trimethylbicycloheptyl, tricyclo octyl, tricyclodecanyl, spirooctyl, spirobicyclopentyl, adamantyl, isobornyl and the like are exemplified.
이들 알킬기, 알콕시기, 아릴기, 아릴옥시기 및 지환식 탄화 수소기는, 이들 기 중의 수소 원자가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환되어 있어도 된다.These alkyl groups, alkoxy groups, aryl groups, aryloxy groups and alicyclic hydrocarbon groups may be substituted with one or more groups in which hydrogen atoms in these groups are selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group.
상기 식(I)에 있어서, X의 일부가 에폭시기 또는 옥세탄기로 치환되어 있는 경우에서의, 식(I)으로 표시되는 단량체로서는, 예를 들면, 하기 식(1)∼식(3)으로 표시되는 단량체가 있다.In the formula (I), in the case where a part of X is substituted with an epoxy group or an oxetane group, the monomer represented by the formula (I) is, for example, represented by the following formulas (1) to (3) There are monomers that become
여기서, 식(1) 중, R3는, 수소 원자 또는 탄소 원자수 1∼6의 알킬기를 나타내고, m은, 1∼6의 정수이다.Here, in Formula (1), R<3> represents a hydrogen atom or a C1-C6 alkyl group, and m is an integer of 1-6.
여기서, 식(2) 중, R4는, 수소 원자 또는 탄소 원자수 1∼6의 알킬기를 나타내고, n은, 1∼6의 정수이다.Here, in Formula (2), R<4> represents a hydrogen atom or a C1-C6 alkyl group, and n is an integer of 1-6.
여기서, 식(3) 중, R5는, 수소 원자 또는 탄소 원자수 1∼6의 알킬기를 나타내고, s는, 1∼6의 정수이다.Here, in Formula (3), R<5> represents a hydrogen atom or a C1-C6 alkyl group, and s is an integer of 1-6.
상기 식(II)에 있어서, R1으로 표시되는 할로겐 원자로서는, 불소, 염소, 브롬, 요오드 등을 예로 들 수 있다.In the formula (II), examples of the halogen atom represented by R 1 include fluorine, chlorine, bromine, and iodine.
상기 식(II)에 있어서, X'의 탄소 원자수 1∼7의 알킬기, 탄소 원자수 6∼12의 아릴기 또는 탄소 원자수 6∼10의 지환식 탄화 수소기로서는, 상기 식(I)과 동일한 것을 예로 들 수 있다.In the formula (II), as an alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, X' is represented by the formula (I) and The same can be exemplified.
상기 식(II)에 있어서, X'의 일부가 에폭시기 또는 옥세탄기로 치환되어 있는 경우에서의, 식(II)으로 표시되는 단량체로서는, 하기 식(4)∼식(6)으로 표시되는 것을 예로 들 수 있다.In the formula (II), when a part of X' is substituted with an epoxy group or an oxetane group, examples of the monomer represented by the formula (II) include those represented by the following formulas (4) to (6). can be heard
여기서, 식(4) 중, R1은, 상기 식(II)과 동일하며, R6는, 수소 원자 또는 탄소 원자수 1∼6의 알킬기를 나타내고, t는, 1∼6의 정수이다.Here, in Formula (4), R<1> is the same as that of said Formula (II), R<6> represents a hydrogen atom or a C1-C6 alkyl group, and t is an integer of 1-6.
여기서, 식(5) 중, R1은, 상기 식(II)과 동일하며, R7은, 수소 원자 또는 탄소 원자수 1∼6의 알킬기를 나타내고, q는, 1∼6의 정수이다.Here, in Formula (5), R<1> is the same as that of said Formula (II), R<7> represents a hydrogen atom or a C1-C6 alkyl group, and q is an integer of 1-6.
여기서, 식(6) 중, R1은, 상기 식(II)과 동일하며, R8은, 수소 원자 또는 탄소 원자수 1∼6의 알킬기를 나타내고, y는, 1∼6의 정수이다.Here, in Formula (6), R<1> is the same as that of said Formula (II), R<8> represents a hydrogen atom or a C1-C6 alkyl group, and y is an integer of 1-6.
상기 폴리머(E)에 있어서, 폴리머를 구성하는 단량체의 사용 비율은, 상기 X가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환된 탄소 원자수 1∼7의 알킬기, 탄소 원자수 6∼12의 아릴기 혹은 탄소 원자수 6∼10의 지환식 탄화 수소기인 경우에서의, 상기 (I) 또는 (II)로 표시되는 단량체가 10∼100 질량%가 되도록 사용하는 것이, 접착성이 향상되는 점에서 바람직하다.In the above-mentioned polymer (E), the ratio of the monomer constituting the polymer to be used is, wherein X is an epoxy group, an oxetane group, a hydroxyl group, and a carboxyl group having 1 to 7 carbon atoms substituted with one or more groups selected from the group consisting of In the case of an alkyl group, an aryl group having 6 to 12 carbon atoms, or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, the monomer represented by (I) or (II) is 10 to 100% by mass. It is preferable at the point that adhesiveness improves.
본 발명의 경화성 조성물에 있어서, 상기 양이온 중합성 성분(A)은 30∼99 질량부, 바람직하게는 40∼95 질량부, 상기 양이온 중합 개시제(B)가 0.1∼10 질량부, 바람직하게는 1∼8 질량부, 상기 라디칼 중합성 성분(C)이 0∼55 질량부, 상기 라디칼 중합 개시제(D)가 0∼10 질량부, 바람직하게는 0.1∼8 질량부, 상기 폴리머(E)가 1∼30 질량부이다. 상기한 배합 비율 이외이면, 경화물의 경화성 및 밀착성이 좋지 못하게 될 우려가 있다.In the curable composition of the present invention, the cationically polymerizable component (A) is 30 to 99 parts by mass, preferably 40 to 95 parts by mass, and the cation polymerization initiator (B) is 0.1 to 10 parts by mass, preferably 1 -8 mass parts, 0-55 mass parts of said radically polymerizable component (C), 0-10 mass parts of said radical polymerization initiator (D), Preferably 0.1-8 mass parts, said polymer (E) is 1 -30 parts by mass. If it is other than the above-mentioned mixing ratio, there exists a possibility that sclerosis|hardenability and adhesiveness of hardened|cured material may become poor.
본 발명의 경화성 조성물에는, 필요에 따라, 증감제 및/또는 증감 조제를 더 사용할 수 있다. 증감제는, 양이온 중합 개시제(B)가 나타내는 극대 흡수 파장보다 긴 파장에 극대 흡수를 나타내고, 양이온 중합 개시제(B)에 의한 중합 개시 반응을 촉진시키는 화합물이다. 또한 증감 조제는, 증감제의 작용을 한층 촉진시키는 화합물이다.A sensitizer and/or a sensitizer adjuvant can further be used for the curable composition of this invention as needed. A sensitizer is a compound which shows maximum absorption in the wavelength longer than the maximum absorption wavelength which a cationic polymerization initiator (B) shows, and accelerates|stimulates the polymerization initiation reaction by a cationic polymerization initiator (B). Moreover, a sensitizer is a compound which accelerates|stimulates the action|action of a sensitizer further.
증감제 및 증감 조제로서는, 안트라센계 화합물, 나프탈렌계 화합물 등을 예로 들 수 있다.As a sensitizer and a sensitizer adjuvant, an anthracene type compound, a naphthalene type compound, etc. are mentioned.
안트라센계 화합물로서는, 예를 들면, 하기 식(7)으로 표시되는 것이 있다.As an anthracene-type compound, there exists a thing represented by following formula (7), for example.
여기서, 식(7) 중, R50 및 R51은, 각각 독립적으로 수소 원자, 탄소 원자수 1∼6의 알킬기 또는 탄소 원자수 2∼12의 알콕시알킬기를 나타내고, R52는 수소 원자 또는 탄소 원자수 1∼6의 알킬기를 나타낸다.Here, in formula (7), R 50 and R 51 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxyalkyl group having 2 to 12 carbon atoms, and R 52 is a hydrogen atom or a carbon atom. The number 1-6 alkyl group is shown.
상기 식(7)으로 표시되는 안트라센계 화합물의 구체예를 들면, 다음과 같은 화합물이 있다.Specific examples of the anthracene-based compound represented by the formula (7) include the following compounds.
예를 들면, 9,10-디메톡시안트라센, 9,10-디에톡시안트라센, 9,10-디프로폭시안트라센, 9,10-디이소프로폭시안트라센, 9,10-디부톡시안트라센, 9,10-디펜틸옥시안트라센, 9,10-디헥실옥시안트라센, 9,10-비스(2-메톡시에톡시)안트라센, 9,10-비스(2-에톡시에톡시)안트라센, 9,10-비스(2-부톡시에톡시)안트라센, 9,10-비스(3-부톡시프로폭시)안트라센, 2-메틸- 또는 2-에틸-9,10-디메톡시안트라센, 2-메틸- 또는 2-에틸-9,10-디에톡시안트라센, 2-메틸- 또는 2-에틸-9,10-디프로폭시안트라센, 2-메틸- 또는 2-에틸-9,10-디이소프로폭시안트라센, 2-메틸- 또는 2-에틸-9,10-디부톡시안트라센, 2-메틸- 또는 2-에틸-9,10-디펜틸옥시안트라센, 2-메틸- 또는 2-에틸-9,10-디헥실옥시안트라센 등이 있다.For example, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diisopropoxyanthracene, 9,10-dibutoxyanthracene, 9,10 -dipentyloxyanthracene, 9,10-dihexyloxyanthracene, 9,10-bis(2-methoxyethoxy)anthracene, 9,10-bis(2-ethoxyethoxy)anthracene, 9,10-bis (2-Butoxyethoxy)anthracene, 9,10-bis(3-butoxypropoxy)anthracene, 2-methyl- or 2-ethyl-9,10-dimethoxyanthracene, 2-methyl- or 2-ethyl -9,10-diethoxyanthracene, 2-methyl- or 2-ethyl-9,10-dipropoxyanthracene, 2-methyl- or 2-ethyl-9,10-diisopropoxyanthracene, 2-methyl- or 2-ethyl-9,10-dibutoxyanthracene, 2-methyl- or 2-ethyl-9,10-dipentyloxyanthracene, 2-methyl- or 2-ethyl-9,10-dihexyloxyanthracene, etc. have.
나프탈렌계 화합물로서는, 예를 들면, 하기 식(8)으로 표시되는 것이 있다.As a naphthalene type compound, there exists a thing represented by following formula (8), for example.
여기서, 식(8) 중, R53 및 R54는 각각 독립적으로 탄소 원자수 1∼6의 알킬 기를 나타낸다.Here, in formula (8), R 53 and R 54 each independently represent an alkyl group having 1 to 6 carbon atoms.
상기 식(8)으로 표시되는 나프탈렌계 화합물의 구체예를 들면, 다음과 같은 화합물이 있다.Specific examples of the naphthalene-based compound represented by the formula (8) include the following compounds.
예를 들면, 4-메톡시-1-나프톨, 4-에톡시-1-나프톨, 4-프로폭시-1-나프톨, 4-부톡시-1-나프톨, 4-헥실옥시-1-나프톨, 1,4-디메톡시나프탈렌, 1-에톡시-4-메톡시나프탈렌, 1,4-디에톡시나프탈렌, 1,4-디프로폭시나프탈렌, 1,4-디부톡시나프탈렌 등이 있다.For example, 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyloxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene, 1,4-dibutoxynaphthalene, and the like.
상기 양이온 중합성 성분(A)에 대한 증감제 및 증감 조제의 사용 비율은 특별히 한정되지 않고, 본 발명의 목적을 저해하지 않는 범위 내에서 대체로 통상의 사용 비율로 사용하면 바람직하지만, 예를 들면, 상기 양이온 중합성 성분(A)의 100질량부에 대하여, 증감제 및 증감 조제 각각 0.1∼3 질량부인 것이, 경화성 향상의 관점에서 바람직하다.The ratio of use of the sensitizer and the sensitizer to the cationically polymerizable component (A) is not particularly limited, and it is preferably used in a generally normal ratio within the range that does not impair the object of the present invention, for example, It is preferable from a viewpoint of sclerosis|hardenability improvement that it is 0.1-3 mass parts, respectively, of a sensitizer and a sensitizer with respect to 100 mass parts of the said cationically polymerizable component (A).
본 발명의 경화성 조성물에는, 필요에 따라 실란 커플링제를 사용할 수 있다. 실란 커플링제로서는, 예를 들면, 디메틸디메톡시실란, 디메틸디에톡시실란, 메틸에틸디메톡시실란, 메틸에틸디에톡시실란, 메틸트리메톡시실란, 메틸트리에톡시실란, 에틸트리메톡시실란, 에틸트리메톡시실란 등의 알킬 관능성 알콕시실란, 비닐트리클로로실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 알릴트리메톡시실란 등의 알케닐 관능성 알콕시실란, 3-메타크릴옥시프로필트리에톡시실란, 3-메타크릴옥시프로필트리메톡시실란, 3-메타크릴옥시프로필메틸디에톡시실란, 3-메타크릴옥시프로필메틸디메톡시실란, 2-메타크릴옥시프로필트리메톡시실란, γ-글리시독시프로필트리메톡시실란, γ-글리시독시프로필메틸디에톡시실란, β-(3,4-에폭시시클로헥실)에틸트리메톡시실란 등의 에폭시 관능성 알콕시실란, N-β(아미노에틸)-γ-아미노프로필트리메톡시실란, γ-아미노프로필트리에톡시실란, N-페닐-γ-아미노프로필트리메톡시실란 등의 아미노 관능성 알콕시실란, γ-머캅토프로필트리메톡시실란 등의 머캅토 관능성 알콕시실란, 티탄테트라이소프로폭시드, 티탄테트라노르말부톡시드 등의 티탄알콕시드류, 티탄디옥틸옥시비스(옥틸렌글리콜레이트), 티탄디이소프로폭시비스(에틸아세토아세테이트) 등의 티탄 킬레이트류, 지르코늄테트라아세틸아세토네이트, 지르코늄트리부톡시모노아세틸아세토네이트 등의 지르코늄 킬레이트류, 지르코늄트리부톡시모노스테아레이트 등의 지르코늄아실레이트류, 메틸트리이소시아네이트실란 등의 이소시아네이트실란류 등을 사용할 수 있다.A silane coupling agent can be used for the curable composition of this invention as needed. Examples of the silane coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyl Alkenyl functional alkoxysilanes, such as alkyl functional alkoxysilanes, such as trimethoxysilane, vinyltrichlorosilane, vinyl trimethoxysilane, vinyl triethoxysilane, and allyl trimethoxysilane, 3-methacryloxypropyl tri Ethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane, γ- Epoxy functional alkoxysilanes, such as glycidoxypropyl trimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, N-β(aminoethyl )-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, amino-functional alkoxysilane such as N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, etc. Titanium alkoxides such as mercapto functional alkoxysilane, titanium tetraisopropoxide, and titanium tetranormal butoxide, titanium dioctyloxybis (octylene glycolate), titanium diisopropoxybis (ethylacetoacetate), etc. titanium chelates, zirconium chelates such as zirconium tetraacetylacetonate and zirconium tributoxy monoacetyl acetonate, zirconium acylates such as zirconium tributoxy monostearate, and isocyanate silanes such as methyl triisocyanate silane Can be used.
상기 실란 커플링제의 사용량은, 특별히 한정되지 않지만, 통상, 경화성 조성물 중의 고형물의 전량 100질량부에 대하여, 0.01∼20 질량부의 범위이다.Although the usage-amount of the said silane coupling agent is not specifically limited, Usually, it is the range of 0.01-20 mass parts with respect to 100 mass parts of whole quantity of solids in a curable composition.
본 발명의 경화성 조성물에는, 필요에 따라 열가소성 유기 중합체를 사용함으로써, 경화물의 특성을 개선할 수도 있다. 열가소성 유기 중합체로서는, 예를 들면, 폴리스티렌, 폴리메틸메타크릴레이트, 메틸메타크릴레이트에틸아크릴레이트 공중합체, 메틸메타크릴레이트글리시딜메타크릴레이트 공중합체, 폴리(메타)아크릴산, 스티렌-(메타)아크릴산 공중합체, (메타)아크릴산-메틸메타크릴레이트 공중합체, 글리시딜(메타)아크릴레이트-폴리메틸(메타)아크릴레이트 공중합체, 폴리비닐부티랄, 셀룰로오스 에스테르, 폴리아크릴아미드, 포화 폴리에스테르 등이 있다.The properties of the cured product can also be improved by using a thermoplastic organic polymer in the curable composition of the present invention as needed. Examples of the thermoplastic organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate ethyl acrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, poly(meth)acrylic acid, styrene-(meth). ) acrylic acid copolymer, (meth)acrylic acid-methyl methacrylate copolymer, glycidyl (meth)acrylate-polymethyl (meth)acrylate copolymer, polyvinyl butyral, cellulose ester, polyacrylamide, saturated poly esters and the like.
본 발명의 경화성 조성물에는, 필요에 따라, 자외선 흡수제나, 상온(常溫)에서는 불활성이며 소정의 온도로의 가열·광조사·산 등에 의해 보호기가 탈리(脫離)하여, 활성화되어 자외선 홉수능이 발현되는 화합물을 사용할 수도 있다.In the curable composition of the present invention, if necessary, the UV absorber or UV absorber is inactive at room temperature, and the protecting group is detached by heating to a predetermined temperature, light irradiation, acid, etc. compounds may be used.
또한, 본 발명의 효과를 손상시키지 않는 한, 필요에 따라, 폴리올, 무기 필러, 유기 필러, 안료, 염료 등의 착색제, 소포제(消泡劑), 증점제(增粘劑), 계면활성제, 레벨링제, 난연제, 틱소제, 희석제, 가소제, 안정제, 중합 금지제, 자외선 흡수제, 산화방지제, 정전방지제, 유동(流動) 조정제, 접착 촉진제 등의 각종 수지 첨가물 등을 첨가할 수 있다.In addition, as long as the effects of the present invention are not impaired, colorants such as polyols, inorganic fillers, organic fillers, pigments, and dyes, defoamers, thickeners, surfactants, and leveling agents, if necessary and various resin additives such as flame retardants, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, and adhesion promoters.
본 발명의 경화성 조성물에는, 특별히 제한되지 않고 통상 사용되는 상기 (A), (B), (C), (D) 및 (E)의 각 성분을 용해 또한 분산할 수 있는 용매를 사용할 수 있다. 용매로서는, 예를 들면, 메틸에틸케톤, 메틸아밀케톤, 디에틸케톤, 아세톤, 메틸이소프로필케톤, 메틸이소부틸케톤, 시클로헥사논, 2-헵타논 등의 케톤류; 에틸에테르, 디옥산, 테트라하이드로퓨란, 1,2-디메톡시에탄, 1,2-디에톡시에탄, 프로필렌글리콜모노메틸에테르, 디프로필렌글리콜디메틸에테르 등의 에테르계 용매; 아세트산 메틸, 아세트산 에틸, 아세트산-n-프로필, 아세트산 이소프로필, 아세트산 n-부틸, 아세트산 시클로헥실, 락트산 에틸, 숙신산 디메틸, 텍사놀 등의 에스테르계 용매; 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르 등의 셀로솔브계 용매; 메탄올, 에탄올, 이소- 또는 n-프로판올, 이소- 또는 n-부탄올, 아밀알코올 등의 알코올계 용매; 에틸렌글리콜모노메틸아세테이트, 에틸렌글리콜모노에틸아세테이트, 프로필렌글리콜-1-모노메틸에테르-2-아세테이트(PGMEA), 디프로필렌글리콜모노메틸에테르아세테이트, 3-메톡시부틸아세테이트, 에톡시에틸프로피오네이트 등의 에테르에스테르계 용매; 벤젠, 톨루엔, 크실렌 등의 BTX계 용매; 헥산, 헵탄, 옥탄, 시클로헥산 등의 지방족 탄화 수소계 용매; 테레핀유, D-리모넨, 피넨 등의 테르펜계 탄화 수소유; 석유 알코올, 스와졸 #310(코스모 마쓰야마(松山) 석유(주)사 제조), 소르벳소 #100(엑손(Exxon) 화학사) 등의 파라핀계 용매; 사염화탄소, 클로로포름, 트리클로로에틸렌, 염화메틸렌, 1,2-다이클로로에탄 등의 할로겐화 지방족 탄화 수소계 용매; 클로로벤젠 등의 할로겐화 방향족 탄화 수소계 용매; 프로필렌카보네이트, 카르비톨계 용매, 아닐린, 트리에틸아민, 피리딘, 아세트산, 아세토니트릴, 이황화 탄소, N,N-디메틸포름아미드, N,N-디메틸아세트아미드, N-메틸피롤리돈, 디메틸술폭시드, 물 등이 있다. 이들 용매는, 1종 또는 2종 이상의 혼합 용매로서 사용할 수 있다.It does not restrict|limit especially for the curable composition of this invention, A solvent which can dissolve and disperse|distribute each component of said (A), (B), (C), (D), and (E) which is used normally can be used for it. Examples of the solvent include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone; ether solvents such as ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, and dipropylene glycol dimethyl ether; ester solvents such as methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, and texanol; cellosolve solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; alcohol solvents such as methanol, ethanol, iso- or n-propanol, iso- or n-butanol, and amyl alcohol; Ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate, etc. of an ether ester solvent; BTX solvents such as benzene, toluene, and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, and cyclohexane; Terpene hydrocarbon oils, such as turpentine oil, D-limonene, and pinene; Paraffinic solvents, such as petroleum alcohol, Swasol #310 (made by Cosmo Matsuyama Petroleum Co., Ltd.), and Sorvesso #100 (Exxon Chemical Corporation); halogenated aliphatic hydrocarbon solvents such as carbon tetrachloride, chloroform, trichloroethylene, methylene chloride and 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; Propylene carbonate, carbitol solvent, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide , and water. These solvents can be used as 1 type or 2 or more types of mixed solvent.
본 발명의 경화성 조성물은, 경화성, 접착성, 액 보존 안정성이 향상되므로, 물분량이 5질량부 이하인 것이 바람직하고, 3질량부 이하인 것이 더욱 바람직하다. 수분이 지나치게 많으면, 백탁하거나 성분이 석출할 우려가 있으므로, 바람직하지 않다.Since sclerosis|hardenability, adhesiveness, and liquid storage stability improve, it is preferable that it is 5 mass parts or less, and, as for the curable composition of this invention, it is more preferable that it is 3 mass parts or less. When there is too much water|moisture content, since there exists a possibility that it may become cloudy or a component may precipitate, it is unpreferable.
본 발명의 경화성 조성물은, 롤 코터, 커튼 코터, 각종 인쇄, 침지 등의 공지의 수단에 의해, 지지 기체(基體) 상에 적용된다. 또한, 일단 필름 등의 지지 기체 상에 실시한 후, 다른 지지 기체 상에 전사할 수도 있으며, 그 적용 방법에 제한은 없다.The curable composition of this invention is applied on a support base material by well-known means, such as a roll coater, a curtain coater, various printing, and immersion. Moreover, after carrying out once on support substrates, such as a film, it can also be transcribe|transferred on another support substrate, and there is no restriction|limiting in the application method.
상기 지지 기체의 재료로서는, 특별히 제한되지 않고 통상 사용되는 것을 사용할 수 있고, 예를 들면, 유리 등의 무기 재료; 디아세틸셀룰로오스, 트리아세틸셀룰로오스(TAC), 프로피오닐셀룰로오스, 부티릴셀룰로오스, 아세틸프로피오닐셀룰로오스, 니트로셀룰로오스 등의 셀룰로오스 에스테르; 폴리아미드; 폴리이미드; 폴리우레탄; 에폭시 수지; 폴리카보네이트; 폴리에틸렌테레프탈레이트, 폴리에틸렌 나프탈레이트, 폴리부틸렌 테레프탈레이트, 폴리-1,4-시클로헥산지메틸렌테레프탈레이트, 폴리에틸렌-1,2-디페녹시에탄-4,4'-디카르복실레이트, 폴리부틸렌테레프탈레이트 등의 폴리에스테르; 폴리스티렌; 폴리에틸렌, 폴리프로필렌, 폴리메틸펜텐 등의 폴리올레핀; 폴리아세트산 비닐, 폴리염화비닐, 폴리 불화 비닐 등의 비닐 화합물; 폴리메틸메타크릴레이트, 폴리아크릴레이트 등의 아크릴계 수지; 폴리카보네이트; 폴리술폰; 폴리에테르술폰; 폴리에테르케톤; 폴리에테르이미드; 폴리옥시에틸렌, 노르보르넨 수지, 시클로올레핀 폴리머(COP) 등의 고분자 재료가 있다. 그리고, 상기 지지 기체에, 코로나 방전 처리, 화염 처리, 자외선 처리, 고주파 처리, 글로우 방전 처리, 활성 플라스마 처리, 레이저 처리 등의 표면 활성화 처리를 행해도 된다.It does not restrict|limit especially as a material of the said support base, What is normally used can be used, For example, Inorganic materials, such as glass; cellulose esters such as diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, butyryl cellulose, acetyl propionyl cellulose, and nitrocellulose; polyamide; polyimide; Polyurethane; epoxy resin; polycarbonate; Polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanezymethylene terephthalate, polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate, polybutyl polyesters such as lenterephthalate; polystyrene; polyolefins such as polyethylene, polypropylene, and polymethylpentene; vinyl compounds such as polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; acrylic resins such as polymethyl methacrylate and polyacrylate; polycarbonate; polysulfone; polyether sulfone; polyether ketone; polyetherimide; polymer materials such as polyoxyethylene, norbornene resin, and cycloolefin polymer (COP). In addition, you may perform surface activation processing, such as a corona discharge treatment, a flame treatment, an ultraviolet treatment, a high frequency treatment, a glow discharge treatment, an active plasma treatment, and a laser treatment, to the said support base body.
본 발명의 경화성 조성물을 에너지선의 조사에 의해 경화시키는 방법에 있어서, 에너지선으로서는, 자외선, 전자선, X선, 방사선, 고주파 등을 예로 들 수 있고, 자외선이 경제적으로 가장 바람직하다. 자외선의 광원으로서는, 자외선 레이저, 수은 램프, 크세논 레이저, 메탈할라이드 램프 등을 예로 들 수 있다.In the method of hardening the curable composition of this invention by irradiation of an energy ray, an ultraviolet-ray, an electron beam, X-ray, a radiation, a radio frequency etc. are mentioned as an energy-beam, and an ultraviolet-ray is economically most preferable. As a light source of an ultraviolet-ray, an ultraviolet laser, a mercury lamp, a xenon laser, a metal halide lamp, etc. are mentioned.
본 발명의 경화성 조성물을 가열에 의해 경화시키는 방법에서의 조건은, 70∼250 ℃에서 1∼100 분이다. 프리베이크(PAB; Pre applied bake)한 후, 가압하고, 포스트베이크(PEB; Post exposure bake)해도 되고, 상이한 수 단계의 온도로 베이크해도 된다. 가열 조건은 각 성분의 종류 및 배합 비율에 의해 상이하지만, 예를 들면, 70∼180 ℃에서, 오븐이라면 5∼15 분간, 핫 플레이트(hot plate)라면 1∼5 분간이다. 그 후, 도막(塗膜)을 경화시키기 위해 180∼250 ℃, 바람직하게는 200∼250 ℃에서, 오븐이라면 30∼90 분간, 핫 플레이트라면 5∼30 분간 가열 처리함으로써 경화막을 얻을 수 있다.The conditions in the method of hardening the curable composition of this invention by heating are 1-100 minutes at 70-250 degreeC. After pre-baking (PAB; Pre applied bake), it may pressurize, post exposure bake (PEB) may be carried out, and you may bake at the temperature of several different steps. Although the heating conditions differ depending on the type and mixing ratio of each component, for example, at 70 to 180°C, for 5 to 15 minutes in an oven, and 1 to 5 minutes in the case of a hot plate. Then, in order to harden a coating film, a cured film can be obtained by heat-processing at 180-250 degreeC, Preferably it is 200-250 degreeC, 30-90 minutes in an oven, and 5-30 minutes in case of a hot plate.
본 발명의 경화성 조성물 또는 그의 경화물이 구체적인 용도로서는, 접착제, 안경, 촬상용 렌즈로 대표되는 광학 재료, 도료, 코팅제, 라이닝제, 잉크, 레지스트, 액상(液狀) 레지스트, 인쇄판, 컬러 TV, PC 모니터, 휴대 정보 단말기, 디지털카메라, 유기 EL, 터치패널 등의 표시 소자, 절연 바니쉬, 절연 시트, 적층판, 프린트 기판, 반도체 장치용·LED 패키지용·액정 주입구용·유기 EL용·광소자용·전기 절연용·전자 부품용·분리막용 등의 봉지제(封止劑), 주형 재료, 퍼티, 유리 섬유 함침제, 실링제, 반도체용·태양 전지용 등의 패시베이션막, 층간 절연막, 보호막, 액정 표시 장치의 백라이트에 사용되는 프리즘 렌즈 시트, 프로젝션 TV 등의 스크린에 사용되는 프레넬 렌즈 시트, 렌티큘러 렌즈 시트 등의 렌즈 시트의 렌즈부, 또는 이와 같은 시트를 사용한 백라이트 등, 마이크로 렌즈 등의 광학 렌즈, 광학 소자, 광 커넥터, 광도파로, 광학적 조형용 주형제 등을 예로 들 수 있다.Specific uses of the curable composition of the present invention or its cured product include adhesives, glasses, optical materials typified by imaging lenses, paints, coatings, linings, inks, resists, liquid resists, printing plates, color TVs, PC monitor, portable information terminal, digital camera, organic EL, display elements such as touch panel, insulating varnish, insulating sheet, laminated board, printed circuit board, for semiconductor device, for LED package, for liquid crystal inlet, for organic EL, for optical element, Encapsulant for electrical insulation/electronic component/separator, etc., casting material, putty, glass fiber impregnating agent, sealing agent, passivation film for semiconductor/solar cell, etc., interlayer insulating film, protective film, liquid crystal display A lens part of a lens sheet such as a prism lens sheet used for a backlight of a device, a Fresnel lens sheet used for a screen such as a projection TV, a lenticular lens sheet, or an optical lens such as a micro lens, such as a backlight using such a sheet; An optical element, an optical connector, an optical waveguide, a casting agent for optical shaping|molding, etc. are mentioned as an example.
본 발명의 표시 장치로서는, 투명 지지체에, 필요에 따라 언더코트층, 반사 방지층, 편광 소자층, 위상차층, 복굴절율층, 광산란층, 하드 코트층, 윤활층, 보호층 등의 각 층을 설치한 것을 예로 들 수 있고, 각 층에 본 발명의 경화물로 이루어지는 필름을 사용할 수 있다.In the display device of the present invention, each layer, such as an undercoat layer, an antireflection layer, a polarizing element layer, a retardation layer, a birefringence layer, a light scattering layer, a hard coat layer, a lubricant layer, and a protective layer, is provided on a transparent support body as needed One can be mentioned as an example, and the film which consists of the hardened|cured material of this invention can be used for each layer.
[실시예][Example]
이하, 실시예 등을 예로 들어 본 발명을 더욱 상세하게 설명하지만, 본 발명은 이들 실시예로 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail by taking examples and the like, but the present invention is not limited to these examples.
[실시예 1∼7, 참고예 1∼4, 비교예 1][Examples 1 to 7, Reference Examples 1 to 4, Comparative Example 1]
하기 [표 1] 및 [표 2]에 나타낸 배합으로 각 성분을 충분히 혼합하여, 각각 실시예 1∼7, 참고예 1∼4의 경화성 조성물 및 비교예 1의 경화성 조성물을 얻었다. 그리고, 실시예 및 비교예의 단위는 질량부이다.Each component was sufficiently mixed by the formulation shown in [Table 1] and [Table 2] below to obtain the curable compositions of Examples 1 to 7 and Reference Examples 1 to 4 and the curable composition of Comparative Example 1, respectively. In addition, the unit of an Example and a comparative example is a mass part.
양이온 중합성 성분(A)으로서는 하기 화합물(A1-1)∼화합물(A1-2) 및 화합물(A2-1)∼화합물(A2-2)을 사용했다.As the cationically polymerizable component (A), the following compounds (A1-1) to (A1-2) and (A2-1) to (A2-2) were used.
화합물(A1-1): 아데카레진 EP-4088L((주)ADEKA사 제조)Compound (A1-1): Adeka resin EP-4088L (manufactured by ADEKA Corporation)
화합물(A1-2): 1,6-헥산디올디글리시딜에테르Compound (A1-2): 1,6-hexanediol diglycidyl ether
화합물(A2-1): 셀록사이드 2021P(지환식 에폭시: 다이셀(주)사 제조)Compound (A2-1): Celoxide 2021P (alicyclic epoxy: manufactured by Daicel Co., Ltd.)
화합물(A2-2): 리모넨디옥사이드Compound (A2-2): limonene dioxide
화합물(A4-1): 아론옥세탄 OXT-221(도아합성(주)사 제조)Compound (A4-1): Aronoxetane OXT-221 (manufactured by Toa Synthesis Co., Ltd.)
양이온 중합 개시제(B)로서는 하기 화합물(B-1)을 사용했다.The following compound (B-1) was used as a cationic polymerization initiator (B).
화합물(B-1): 하기 식(9)으로 표시되는 화합물 및 하기 식(10)으로 표시되는 화합물의 혼합물의 프로필렌카보네이트 50% 용액Compound (B-1): 50% solution of propylene carbonate of a mixture of a compound represented by the following formula (9) and a compound represented by the following formula (10)
라디칼 중합성 성분(C)으로서는, 하기 화합물(C2-1)을 사용했다.As the radically polymerizable component (C), the following compound (C2-1) was used.
화합물(C2-1): 1,6-헥산디올디아크릴레이트Compound (C2-1): 1,6-hexanediol diacrylate
화합물(C2-2): 에톡시화 이소시아누르산 트리아크릴레이트Compound (C2-2): ethoxylated isocyanuric acid triacrylate
화합물(C2-3): 테트라하이드로푸르푸릴아크릴레이트Compound (C2-3): tetrahydrofurfuryl acrylate
라디칼 중합 개시제(D)로서는, 하기 화합물(D-1)을 사용했다.As the radical polymerization initiator (D), the following compound (D-1) was used.
화합물(D-1): 이르가큐어 184(BASF사 제조)Compound (D-1): Irgacure 184 (manufactured by BASF)
폴리머(E)로서는, 하기 화합물(E-1)을 사용했다.As the polymer (E), the following compound (E-1) was used.
폴리머(E-1): 메틸메타크릴레이트 75질량부와 글리시딜메타크릴레이트 25질량부의 공중합체(중량 평균 분자량 7,000)Polymer (E-1): A copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 7,000)
폴리머(E-2): 메틸메타크릴레이트 35질량부, 스티렌 35질량부 및 글리시딜 메타크릴레이트 30질량부의 공중합체(중량 평균 분자량 8,000)Polymer (E-2): A copolymer of 35 parts by mass of methyl methacrylate, 35 parts by mass of styrene, and 30 parts by mass of glycidyl methacrylate (weight average molecular weight of 8,000)
얻어진 실시예 1∼7, 참고예 1∼4 및 비교예 1의 각 경화성 조성물에 대하여, 하기 수순에 따라, 유리 전이 온도(Tg), 탄성율 및 밀착성의 평가를 행하였다. 결과를 [표 1] 및 [표 2]에 병기한다.About each curable composition of the obtained Examples 1-7, Reference Examples 1-4, and Comparative Example 1, the glass transition temperature (Tg), an elasticity modulus, and adhesiveness were evaluated according to the following procedure. A result is written together in [Table 1] and [Table 2].
(유리 전이 온도 및 탄성율)(Glass Transition Temperature and Modulus of Elasticity)
얻어진 실시예 1∼7, 참고예 1∼4 및 비교예 1의 각 경화성 조성물을, 각각을 폴리에틸렌테레프탈레이트(PET) 필름 상에, 바 코터로 30㎛의 두께로 도포하고, 메탈할라이드 램프를 사용하여 3000mJ/cm2의 에너지를 조사했다. 24시간 후에 필름으로부터 접착제 경화물을 꺼내고, (주)히타치하이테크사이언스에서 제조한 점탄성 측정 장치(DMA7100)를 사용하여 Tg 및 80℃에서의 탄성율을 측정했다.Each of the obtained curable compositions of Examples 1 to 7, Reference Examples 1 to 4, and Comparative Example 1 was applied on a polyethylene terephthalate (PET) film to a thickness of 30 µm with a bar coater, and a metal halide lamp was used. to irradiate an energy of 3000 mJ/cm 2 . After 24 hours, the adhesive cured product was taken out from the film, and the elastic modulus at Tg and 80°C was measured using a viscoelasticity measuring device (DMA7100) manufactured by Hitachi High-Tech Sciences Co., Ltd.
(점도)(Viscosity)
얻어진 실시예 1∼7, 참고예 1∼4 및 비교예 1의 각 경화성 조성물 각각에 대하여, 25℃에서의 점도를 E형 점도계로 측정했다. 결과를 [표 1] 및 [표 2]에 병기한다.About each curable composition of each of the obtained Examples 1-7, Reference Examples 1-4, and Comparative Example 1, the viscosity in 25 degreeC was measured with the E-type viscometer. A result is written together in [Table 1] and [Table 2].
(밀착성)(Adhesiveness)
상기에서 얻어진 실시예 1∼7, 참고예 1∼4와 비교예 1의 경화성 조성물을, 1장의 코로나 처리 PMMA 필름(스미토모화학(주)사 제조: 테크노로이 125S001)에 각각 도포한 후, 또 1장의 코로나 방전 처리를 실시한 COP(시클로올레핀 폴리머, 니혼제온(주)사 제조: 품번 제오노아 필름 14-060) 필름과 라미네이터를 사용하여 접합하고, 무전극 자외광 램프를 사용하여 1000mJ/cm2에 상당하는 광을 COP 필름 너머로 조사하여 접착하여 시험편을 얻었다. 얻어진 시험편에 대하여, 90도 필(peel) 시험을 행하였다. 결과를 [표 1] 및 [표 2]에 나타내었다.The curable compositions of Examples 1 to 7, Reference Examples 1 to 4, and Comparative Example 1 obtained above were respectively coated on one corona-treated PMMA film (Sumitomo Chemical Co., Ltd.: Technoroy 125S001), and then 1 COP (cycloolefin polymer, manufactured by Nippon Zeon Co., Ltd.: Part No. Zeonoa Film 14-060) film subjected to corona discharge treatment of the intestine is bonded using a laminator, and 1000mJ/cm 2 using an electrodeless UV lamp Corresponding light was irradiated over the COP film and adhere|attached, and the test piece was obtained. The obtained test piece was subjected to a 90 degree peel test. The results are shown in [Table 1] and [Table 2].
[표 1][Table 1]
[표 2][Table 2]
[표 1]∼[표 2]에 의해, 본 발명의 경화성 조성물은, 경화물의 유리 전이 온도가 높고, 밀착성이 우수한 것을 명백하게 알 수 있다.[Table 1] to [Table 2] show clearly that the curable composition of the present invention has a high glass transition temperature of the cured product and is excellent in adhesiveness.
Claims (7)
하기 식(I)으로 표시되는 단량체로부터 얻어지는 폴리머:
(상기 식(I) 중에서, X는, 탄소 원자수 1∼7의 알킬기, 탄소 원자수 1∼7의 알콕시기, 탄소 원자수 6∼12의 아릴기, 탄소 원자수 6∼12의 아릴옥시기 혹은 탄소 원자수 6∼10의 지환식 탄화 수소기, 또는 이들 기 중의 수소 원자가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환된 것임),
하기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머:
(상기 식(II) 중에서, R1은, 수소 원자, 메틸기 또는 할로겐 원자를 나타내고, X'는, 탄소 원자수 1∼7의 알킬기, 탄소 원자수 6∼12의 아릴기 혹은 탄소 원자수 6∼10의 지환식 탄화 수소기, 또는 이들 기 중의 수소 원자가, 에폭시기, 옥세탄기, 수산기 및 카르복실기로 이루어지는 군으로부터 선택되는 1종 이상의 기로 치환된 것임), 상기 식(I)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 상기 식(II)으로 표시되는 단량체로부터 선택되는 2종 이상의 단량체로부터 얻어지는 폴리머, 또는 상기 식(I)으로 표시되는 단량체 및 상기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머로 이루어지는 군으로부터 선택되는 중량 평균 분자량 1,000∼30,000인 폴리머(E) 1∼30 질량부를, 상기 양이온 중합성 성분(A)과 상기 라디칼 중합성 성분(C)과 상기 폴리머(E)의 합계가 100질량부가 되도록 함유하고,
상기 양이온 중합성 성분(A)이, 분자량 200 이상인, 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)과, 지환식 에폭시 화합물(A2)을 필수 성분으로 하고, 여기서 상기 분자량 200 이상인 다가 알코올의 글리시딜화물, 또는 다가 알코올알킬렌옥사이드 부가물의 글리시딜화물(A1)에서의 다가 알코올이, 축합환을 가지는 다가 알코올이며,
상기 라디칼 중합성 성분(C)이, 에폭시기 및 에틸렌성 불포화기를 가지는 화합물(C1), 또는 탄소 원자수가 2∼20인 알코올의 아크릴산 에스테르 혹은 탄소 원자수가 2∼20인 알코올의 메타크릴산 에스테르(C2)를 필수 성분으로 하는, 경화성 조성물.30-99 mass parts of a cationically polymerizable component (A), 0.1-10 mass parts of a cation polymerization initiator (B), 0-55 mass parts of a radically polymerizable component (C), and 0-10 mass parts of a radical polymerization initiator (D) mass and
A polymer obtained from a monomer represented by the following formula (I):
(In the formula (I), X is an alkyl group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aryloxy group having 6 to 12 carbon atoms. or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, or a hydrogen atom in these groups is substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group);
A polymer obtained from a monomer represented by the following formula (II):
(In the formula (II), R 1 represents a hydrogen atom, a methyl group or a halogen atom, and X' represents an alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aryl group having 6 to carbon atoms. The alicyclic hydrocarbon group of 10, or a hydrogen atom in these groups is substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group), selected from the monomers represented by the above formula (I) A polymer obtained from two or more monomers, a polymer obtained from two or more monomers selected from the monomers represented by the formula (II), or a monomer represented by the formula (I) and a monomer represented by the formula (II). 1 to 30 parts by mass of a polymer (E) having a weight average molecular weight of 1,000 to 30,000 selected from the group consisting of obtained polymers, the sum of the cationically polymerizable component (A), the radically polymerizable component (C), and the polymer (E) contains so that it becomes 100 parts by mass,
The cationically polymerizable component (A) contains, as essential components, a glycidylated product of a polyhydric alcohol having a molecular weight of 200 or more, or a glycidylated product of a polyhydric alcohol alkylene oxide adduct (A1) and an alicyclic epoxy compound (A2) and wherein the polyhydric alcohol in the glycidylated product of the polyhydric alcohol having a molecular weight of 200 or more or the glycidylated product (A1) of the polyhydric alcohol alkylene oxide adduct is a polyhydric alcohol having a condensed ring,
The radically polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylic acid ester of an alcohol having 2 to 20 carbon atoms or a methacrylic ester of an alcohol having 2 to 20 carbon atoms (C2 ) as an essential component, the curable composition.
상기 지환식 에폭시 화합물(A2)이, 3',4'-에폭시시클로헥실에틸-3,4-에폭시시클로헥산카르복실레이트, 7-옥사비시클로[4.1.0]헵탄, 폴리[옥시-(1-옥소-1,6-헥산디일)] 유도체, 헥산이산 비스[(7-옥사비시클로[4.1.0]헵탄-3-일)메틸], 1,2-에폭시-4-비닐시클로헥산, 3,4-에폭시시클로헥실메틸메타크릴레이트 및 리모넨디옥시드로 이루어지는 군으로부터 선택되는 1종 이상인, 경화성 조성물.According to claim 1,
The alicyclic epoxy compound (A2) is 3',4'-epoxycyclohexylethyl-3,4-epoxycyclohexanecarboxylate, 7-oxabicyclo[4.1.0]heptane, poly[oxy-(1) -oxo-1,6-hexanediyl)] derivative, hexanedioic acid bis[(7-oxabicyclo[4.1.0]heptan-3-yl)methyl], 1,2-epoxy-4-vinylcyclohexane, 3 , At least one selected from the group consisting of 4-epoxycyclohexylmethyl methacrylate and limonene dioxide, the curable composition.
상기 폴리머(E)가, 상기 식(I)으로 표시되는 단량체 및 상기 식(II)으로 표시되는 단량체로부터 얻어지는 폴리머이며, 상기 식(I) 중의 X가 탄소 원자수 6∼12의 아릴기이며, 상기 식(II) 중의 X'가 탄소 원자수 1∼7의 알킬기이며, 상기 알킬기가 에폭시기로 치환되어 있는, 경화성 조성물.According to claim 1,
The polymer (E) is a polymer obtained from the monomer represented by the formula (I) and the monomer represented by the formula (II), wherein X in the formula (I) is an aryl group having 6 to 12 carbon atoms; The curable composition in which X' in the said formula (II) is a C1-C7 alkyl group, and the said alkyl group is substituted by the epoxy group.
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