TWI732844B - Curable composition, method of manufacturing hardened product, and hardened product - Google Patents
Curable composition, method of manufacturing hardened product, and hardened product Download PDFInfo
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- TWI732844B TWI732844B TW106111177A TW106111177A TWI732844B TW I732844 B TWI732844 B TW I732844B TW 106111177 A TW106111177 A TW 106111177A TW 106111177 A TW106111177 A TW 106111177A TW I732844 B TWI732844 B TW I732844B
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- curable composition
- polymerizable component
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- 239000000203 mixture Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- -1 glycidyl compound Chemical class 0.000 claims abstract description 168
- 150000001875 compounds Chemical class 0.000 claims abstract description 75
- 239000004593 Epoxy Substances 0.000 claims abstract description 36
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 24
- 125000003118 aryl group Chemical group 0.000 claims abstract description 23
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 14
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 11
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 10
- 125000002091 cationic group Chemical group 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 7
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 7
- 239000004615 ingredient Substances 0.000 claims abstract description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 18
- 125000002947 alkylene group Chemical group 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 229920005862 polyol Polymers 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 125000002723 alicyclic group Chemical group 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 9
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 8
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- 150000001450 anions Chemical class 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 125000005843 halogen group Chemical group 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 241000219739 Lens Species 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920002678 cellulose Polymers 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 229920000768 polyamine Polymers 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 206010070834 Sensitisation Diseases 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000001913 cellulose Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000008313 sensitization Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229960000834 vinyl ether Drugs 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 3
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 3
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 3
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 241000208340 Araliaceae Species 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- 229920002284 Cellulose triacetate Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 3
- 235000003140 Panax quinquefolius Nutrition 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 125000004185 ester group Chemical group 0.000 description 3
- 235000008434 ginseng Nutrition 0.000 description 3
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- MXHAQQVNGWIJRV-UHFFFAOYSA-N 2-methyloxolane prop-2-enoic acid Chemical compound OC(=O)C=C.CC1CCCO1 MXHAQQVNGWIJRV-UHFFFAOYSA-N 0.000 description 2
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 2
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- HVMHLMJYHBAOPL-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)propan-2-yl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1C(C)(C)C1CC2OC2CC1 HVMHLMJYHBAOPL-UHFFFAOYSA-N 0.000 description 2
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 208000028659 discharge Diseases 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 239000003759 ester based solvent Substances 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 150000002921 oxetanes Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 150000003755 zirconium compounds Chemical class 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- KQQSTPXKXXMWOJ-UHFFFAOYSA-N (3,5-difluoro-4-methoxyphenoxy)boronic acid Chemical compound FC=1C=C(C=C(C=1OC)F)OB(O)O KQQSTPXKXXMWOJ-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- SJHPCNCNNSSLPL-CSKARUKUSA-N (4e)-4-(ethoxymethylidene)-2-phenyl-1,3-oxazol-5-one Chemical compound O1C(=O)C(=C/OCC)\N=C1C1=CC=CC=C1 SJHPCNCNNSSLPL-CSKARUKUSA-N 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-M 0.000 description 1
- BCKUOWYQBYMXKE-UHFFFAOYSA-N 1,1,2,2,3,3-hexafluorooctane-1-sulfonic acid Chemical compound FC(C(C(S(=O)(=O)O)(F)F)(F)F)(CCCCC)F BCKUOWYQBYMXKE-UHFFFAOYSA-N 0.000 description 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- KOBSIMTVSKYQDD-UHFFFAOYSA-N 1,2-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1CCCCC1COC=C KOBSIMTVSKYQDD-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- KATAXDCYPGGJNJ-UHFFFAOYSA-N 1,3-bis(oxiran-2-ylmethoxy)propan-2-ol Chemical compound C1OC1COCC(O)COCC1CO1 KATAXDCYPGGJNJ-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- ITWBWJFEJCHKSN-UHFFFAOYSA-N 1,4,7-triazonane Chemical compound C1CNCCNCCN1 ITWBWJFEJCHKSN-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- UKXGGMCMWNJILJ-UHFFFAOYSA-N 1,4-dibutoxynaphthalene Chemical compound C1=CC=C2C(OCCCC)=CC=C(OCCCC)C2=C1 UKXGGMCMWNJILJ-UHFFFAOYSA-N 0.000 description 1
- LJSLYKNKVQMIJY-UHFFFAOYSA-N 1,4-diethoxynaphthalene Chemical compound C1=CC=C2C(OCC)=CC=C(OCC)C2=C1 LJSLYKNKVQMIJY-UHFFFAOYSA-N 0.000 description 1
- FWWRTYBQQDXLDD-UHFFFAOYSA-N 1,4-dimethoxynaphthalene Chemical compound C1=CC=C2C(OC)=CC=C(OC)C2=C1 FWWRTYBQQDXLDD-UHFFFAOYSA-N 0.000 description 1
- APQSQLNWAIULLK-UHFFFAOYSA-N 1,4-dimethoxynaphthalene Natural products C1=CC=C2C(C)=CC=C(C)C2=C1 APQSQLNWAIULLK-UHFFFAOYSA-N 0.000 description 1
- VEGNIXCUDMQGFZ-UHFFFAOYSA-N 1-[3-[3-[2,3-bis(oxiran-2-ylmethoxy)propoxy]-2-hydroxypropoxy]-2-(oxiran-2-ylmethoxy)propoxy]-3-(oxiran-2-ylmethoxy)propan-2-ol Chemical compound C1OC1COCC(OCC1OC1)COCC(O)COCC(OCC1OC1)COCC(O)COCC1CO1 VEGNIXCUDMQGFZ-UHFFFAOYSA-N 0.000 description 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 description 1
- KTZWVUYCTDMQJH-UHFFFAOYSA-N 1-ethoxy-4-methoxynaphthalene Chemical compound C1=CC=C2C(OCC)=CC=C(OC)C2=C1 KTZWVUYCTDMQJH-UHFFFAOYSA-N 0.000 description 1
- 125000004066 1-hydroxyethyl group Chemical group [H]OC([H])([*])C([H])([H])[H] 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- XTVNGRMJOGNDOG-UHFFFAOYSA-N 1-trimethoxysilylpropan-2-yl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CC(C)OC(=O)C(C)=C XTVNGRMJOGNDOG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- NQFUSWIGRKFAHK-UHFFFAOYSA-N 2,3-epoxypinane Chemical compound CC12OC1CC1C(C)(C)C2C1 NQFUSWIGRKFAHK-UHFFFAOYSA-N 0.000 description 1
- VRRDONHGWVSGFH-UHFFFAOYSA-N 2,5-diethylcyclohexane-1,4-diamine Chemical compound CCC1CC(N)C(CC)CC1N VRRDONHGWVSGFH-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- MTJUELTVQKBEPR-UHFFFAOYSA-N 2-(chloromethyl)oxetane Chemical compound ClCC1CCO1 MTJUELTVQKBEPR-UHFFFAOYSA-N 0.000 description 1
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- ZGHZSTWONPNWHV-UHFFFAOYSA-N 2-(oxiran-2-yl)ethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCC1CO1 ZGHZSTWONPNWHV-UHFFFAOYSA-N 0.000 description 1
- 125000003821 2-(trimethylsilyl)ethoxymethyl group Chemical group [H]C([H])([H])[Si](C([H])([H])[H])(C([H])([H])[H])C([H])([H])C(OC([H])([H])[*])([H])[H] 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- JZUMVFMLJGSMRF-UHFFFAOYSA-N 2-Methyladipic acid Chemical compound OC(=O)C(C)CCCC(O)=O JZUMVFMLJGSMRF-UHFFFAOYSA-N 0.000 description 1
- XRBWKWGATZNBFW-UHFFFAOYSA-N 2-[2-(2-ethenoxyethoxy)ethoxy]ethanol Chemical compound OCCOCCOCCOC=C XRBWKWGATZNBFW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- VSRMIIBCXRHPCC-UHFFFAOYSA-N 2-[2-[2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxy]ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCCOCCOCC1CO1 VSRMIIBCXRHPCC-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
- XAYUYBHNVNEQGZ-UHFFFAOYSA-N 2-ethyl-9,10-di(propan-2-yloxy)anthracene Chemical compound C1=CC=CC2=C(OC(C)C)C3=CC(CC)=CC=C3C(OC(C)C)=C21 XAYUYBHNVNEQGZ-UHFFFAOYSA-N 0.000 description 1
- VIIDFVJFNLYVJE-UHFFFAOYSA-N 2-ethyl-9,10-dihexoxyanthracene Chemical compound CCC1=CC=C2C(OCCCCCC)=C(C=CC=C3)C3=C(OCCCCCC)C2=C1 VIIDFVJFNLYVJE-UHFFFAOYSA-N 0.000 description 1
- SURWYRGVICLUBJ-UHFFFAOYSA-N 2-ethyl-9,10-dimethoxyanthracene Chemical compound C1=CC=CC2=C(OC)C3=CC(CC)=CC=C3C(OC)=C21 SURWYRGVICLUBJ-UHFFFAOYSA-N 0.000 description 1
- BGNGHGABCPFGLQ-UHFFFAOYSA-N 2-ethyl-9,10-dipentoxyanthracene Chemical compound CCC1=CC=C2C(OCCCCC)=C(C=CC=C3)C3=C(OCCCCC)C2=C1 BGNGHGABCPFGLQ-UHFFFAOYSA-N 0.000 description 1
- BDPJILVXUVJWBF-UHFFFAOYSA-N 2-ethyl-9,10-dipropoxyanthracene Chemical compound CCC1=CC=C2C(OCCC)=C(C=CC=C3)C3=C(OCCC)C2=C1 BDPJILVXUVJWBF-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- IKCQWKJZLSDDSS-UHFFFAOYSA-N 2-formyloxyethyl formate Chemical compound O=COCCOC=O IKCQWKJZLSDDSS-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- QXXNMRUAOIMQIV-UHFFFAOYSA-N 2-methyl-9,10-dipentoxyanthracene Chemical group CC1=CC2=C(C3=CC=CC=C3C(=C2C=C1)OCCCCC)OCCCCC QXXNMRUAOIMQIV-UHFFFAOYSA-N 0.000 description 1
- KCYSEXMGPHIRHT-UHFFFAOYSA-N 2-methyl-9,10-dipropoxyanthracene Chemical group CC1=CC2=C(C3=CC=CC=C3C(=C2C=C1)OCCC)OCCC KCYSEXMGPHIRHT-UHFFFAOYSA-N 0.000 description 1
- GYMFBYTZOGMSQJ-UHFFFAOYSA-N 2-methylanthracene Chemical group C1=CC=CC2=CC3=CC(C)=CC=C3C=C21 GYMFBYTZOGMSQJ-UHFFFAOYSA-N 0.000 description 1
- KIBVFIDMXQZCBS-UHFFFAOYSA-N 2-methyloctanedioic acid Chemical compound OC(=O)C(C)CCCCCC(O)=O KIBVFIDMXQZCBS-UHFFFAOYSA-N 0.000 description 1
- KQKSCYUVYMJMDL-UHFFFAOYSA-N 2-methyloxolane 2-methylprop-2-enoic acid Chemical compound CC1OCCC1.CC(C(=O)O)=C KQKSCYUVYMJMDL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- QEARHKZQYSYPNS-UHFFFAOYSA-N 2-methylprop-2-enoic acid 1,3,5-triazinane-2,4,6-trione Chemical class CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.O=C1NC(=O)NC(=O)N1 QEARHKZQYSYPNS-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- HYPIHGLKOQBQNW-UHFFFAOYSA-N 3,7-dimethyldecanedioic acid Chemical compound OC(=O)CCC(C)CCCC(C)CC(O)=O HYPIHGLKOQBQNW-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- MKNOYISMZFDLQP-UHFFFAOYSA-N 3-[1-[2-(oxetan-3-yl)butoxy]butan-2-yl]oxetane Chemical compound C1OCC1C(CC)COCC(CC)C1COC1 MKNOYISMZFDLQP-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- SLNCKLVYLZHRKK-UHFFFAOYSA-N 3-ethyl-3-[2-[(3-ethyloxetan-3-yl)methoxy]ethoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCOCC1(CC)COC1 SLNCKLVYLZHRKK-UHFFFAOYSA-N 0.000 description 1
- WUGFSEWXAWXRTM-UHFFFAOYSA-N 3-ethyl-3-[2-[2-[2-[2-[(3-ethyloxetan-3-yl)methoxy]ethoxy]ethoxy]ethoxy]ethoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCOCCOCCOCCOCC1(CC)COC1 WUGFSEWXAWXRTM-UHFFFAOYSA-N 0.000 description 1
- PKOVHAJOIYUCNH-UHFFFAOYSA-N 3-ethyl-3-[3-[(3-ethyloxetan-3-yl)methoxy]butan-2-yloxymethyl]oxetane Chemical compound C(C)C1(COC1)COC(C(C)OCC1(COC1)CC)C PKOVHAJOIYUCNH-UHFFFAOYSA-N 0.000 description 1
- UWFHYGTWXNRUDH-UHFFFAOYSA-N 3-ethyl-3-[4-[(3-ethyloxetan-3-yl)methoxy]butoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCOCC1(CC)COC1 UWFHYGTWXNRUDH-UHFFFAOYSA-N 0.000 description 1
- UXEOSBGULDWPRJ-UHFFFAOYSA-N 3-ethyl-3-[5-[(3-ethyloxetan-3-yl)methoxy]pentoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCCOCC1(CC)COC1 UXEOSBGULDWPRJ-UHFFFAOYSA-N 0.000 description 1
- GBDPVIKGIRHANI-UHFFFAOYSA-N 3-ethyl-3-[6-[(3-ethyloxetan-3-yl)methoxy]hexoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCCCOCC1(CC)COC1 GBDPVIKGIRHANI-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- ULYIFEQRRINMJQ-UHFFFAOYSA-N 3-methylbutyl 2-methylprop-2-enoate Chemical compound CC(C)CCOC(=O)C(C)=C ULYIFEQRRINMJQ-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- HYYPKCMPDGCDHE-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CC1CC2OC2CC1 HYYPKCMPDGCDHE-UHFFFAOYSA-N 0.000 description 1
- BOTGCZBEERTTDQ-UHFFFAOYSA-N 4-Methoxy-1-naphthol Chemical compound C1=CC=C2C(OC)=CC=C(O)C2=C1 BOTGCZBEERTTDQ-UHFFFAOYSA-N 0.000 description 1
- KVBPVOWVPNOMIJ-UHFFFAOYSA-N 4-butoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCCCC)=CC=C(O)C2=C1 KVBPVOWVPNOMIJ-UHFFFAOYSA-N 0.000 description 1
- XYHQAQRXVQZBQV-UHFFFAOYSA-N 4-ethoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCC)=CC=C(O)C2=C1 XYHQAQRXVQZBQV-UHFFFAOYSA-N 0.000 description 1
- INBYRLZHIQCNTL-UHFFFAOYSA-N 4-hexoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCCCCCC)=CC=C(O)C2=C1 INBYRLZHIQCNTL-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- KSGYKTRNRCPDHT-KVSWJAHQSA-N 4-n-[1-[(3-fluorophenyl)methyl]indazol-5-yl]-5-[(e)-2-methoxyethoxyiminomethyl]pyrimidine-4,6-diamine Chemical compound COCCO\N=C\C1=C(N)N=CN=C1NC1=CC=C(N(CC=2C=C(F)C=CC=2)N=C2)C2=C1 KSGYKTRNRCPDHT-KVSWJAHQSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- WDYWDYHAPSPLJO-UHFFFAOYSA-N 4-propoxynaphthalen-1-ol Chemical compound C1=CC=C2C(OCCC)=CC=C(O)C2=C1 WDYWDYHAPSPLJO-UHFFFAOYSA-N 0.000 description 1
- PBXQIKOAJLEEED-UHFFFAOYSA-N 5-methyl-3-[(5-methyl-7-oxabicyclo[4.1.0]heptan-3-yl)methyl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1C2OC2C(C)CC1CC1CC(C)C2OC2C1 PBXQIKOAJLEEED-UHFFFAOYSA-N 0.000 description 1
- GAYWCADKXYCKCG-UHFFFAOYSA-N 5-pyridin-3-yl-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound N1NC(=S)N=C1C1=CC=CN=C1 GAYWCADKXYCKCG-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- NQSLZEHVGKWKAY-UHFFFAOYSA-N 6-methylheptyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C(C)=C NQSLZEHVGKWKAY-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- BIDNFOLOHMWYGB-UHFFFAOYSA-N 9,10-bis(2-butoxyethoxy)anthracene Chemical compound C1=CC=C2C(OCCOCCCC)=C(C=CC=C3)C3=C(OCCOCCCC)C2=C1 BIDNFOLOHMWYGB-UHFFFAOYSA-N 0.000 description 1
- BEFARLHNOSBDOH-UHFFFAOYSA-N 9,10-bis(2-ethoxyethoxy)anthracene Chemical compound C1=CC=C2C(OCCOCC)=C(C=CC=C3)C3=C(OCCOCC)C2=C1 BEFARLHNOSBDOH-UHFFFAOYSA-N 0.000 description 1
- FZNZCCNCEMMYRC-UHFFFAOYSA-N 9,10-bis(2-methoxyethoxy)anthracene Chemical compound C1=CC=C2C(OCCOC)=C(C=CC=C3)C3=C(OCCOC)C2=C1 FZNZCCNCEMMYRC-UHFFFAOYSA-N 0.000 description 1
- YUSXKJPJGSZRBY-UHFFFAOYSA-N 9,10-bis(3-butoxypropoxy)anthracene Chemical compound C1=CC=C2C(OCCCOCCCC)=C(C=CC=C3)C3=C(OCCCOCCCC)C2=C1 YUSXKJPJGSZRBY-UHFFFAOYSA-N 0.000 description 1
- IXYPOJJOFMWNSH-UHFFFAOYSA-N 9,10-di(propan-2-yloxy)anthracene Chemical compound C1=CC=C2C(OC(C)C)=C(C=CC=C3)C3=C(OC(C)C)C2=C1 IXYPOJJOFMWNSH-UHFFFAOYSA-N 0.000 description 1
- NYEVBSJUVMRZNE-UHFFFAOYSA-N 9,10-dibutoxy-2-ethylanthracene Chemical compound CCC1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 NYEVBSJUVMRZNE-UHFFFAOYSA-N 0.000 description 1
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 1
- FUWFDADDJOUNDL-UHFFFAOYSA-N 9,10-diethoxy-2-ethylanthracene Chemical compound CCC1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 FUWFDADDJOUNDL-UHFFFAOYSA-N 0.000 description 1
- GJNKQJAJXSUJBO-UHFFFAOYSA-N 9,10-diethoxyanthracene Chemical compound C1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 GJNKQJAJXSUJBO-UHFFFAOYSA-N 0.000 description 1
- LWRCGYDAUMSFSM-UHFFFAOYSA-N 9,10-dihexoxyanthracene Chemical compound C1=CC=C2C(OCCCCCC)=C(C=CC=C3)C3=C(OCCCCCC)C2=C1 LWRCGYDAUMSFSM-UHFFFAOYSA-N 0.000 description 1
- JWJMBKSFTTXMLL-UHFFFAOYSA-N 9,10-dimethoxyanthracene Chemical compound C1=CC=C2C(OC)=C(C=CC=C3)C3=C(OC)C2=C1 JWJMBKSFTTXMLL-UHFFFAOYSA-N 0.000 description 1
- JELGMNFSBVSQRB-UHFFFAOYSA-N 9,10-dipentoxyanthracene Chemical compound C1=CC=C2C(OCCCCC)=C(C=CC=C3)C3=C(OCCCCC)C2=C1 JELGMNFSBVSQRB-UHFFFAOYSA-N 0.000 description 1
- LBQJFQVDEJMUTF-UHFFFAOYSA-N 9,10-dipropoxyanthracene Chemical compound C1=CC=C2C(OCCC)=C(C=CC=C3)C3=C(OCCC)C2=C1 LBQJFQVDEJMUTF-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- AJDPRSJBHBDFOZ-UHFFFAOYSA-N C1CC2OC2(C)CC1(C(O)=O)CC1CC(C)(O2)C2CC1 Chemical compound C1CC2OC2(C)CC1(C(O)=O)CC1CC(C)(O2)C2CC1 AJDPRSJBHBDFOZ-UHFFFAOYSA-N 0.000 description 1
- SXVPFHXVKDPMIY-UHFFFAOYSA-N CC(=O)C.CC(=O)C.CC(=O)C.CC(=O)C.[Zr] Chemical compound CC(=O)C.CC(=O)C.CC(=O)C.CC(=O)C.[Zr] SXVPFHXVKDPMIY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical group COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-O Thiophenium Chemical class [SH+]1C=CC=C1 YTPLMLYBLZKORZ-UHFFFAOYSA-O 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- ZDPVRXUQQGZTEY-SECBINFHSA-N [(2R)-2-phenyloxiran-2-yl]methanol Chemical compound C=1C=CC=CC=1[C@@]1(CO)CO1 ZDPVRXUQQGZTEY-SECBINFHSA-N 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- SKEKWDDNGCWASM-UHFFFAOYSA-N [2-(ethenoxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCCC1COC=C SKEKWDDNGCWASM-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- NOKSMMGULAYSTD-UHFFFAOYSA-N [SiH4].N=C=O Chemical class [SiH4].N=C=O NOKSMMGULAYSTD-UHFFFAOYSA-N 0.000 description 1
- HNXNSBNVECAGGH-UHFFFAOYSA-L [acetyloxy(ethyl)alumanyl] acetate Chemical compound C(C)(=O)[O-].C(C)(=O)[O-].C(C)[Al+2] HNXNSBNVECAGGH-UHFFFAOYSA-L 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- ZIQPQYFSSSHQBP-UHFFFAOYSA-N acetyl 2,3-dihydroxypropanoate Chemical compound CC(=O)OC(=O)C(O)CO ZIQPQYFSSSHQBP-UHFFFAOYSA-N 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- NQFUSWIGRKFAHK-BDNRQGISSA-N alpha-Pinene epoxide Natural products C([C@@H]1O[C@@]11C)[C@@H]2C(C)(C)[C@H]1C2 NQFUSWIGRKFAHK-BDNRQGISSA-N 0.000 description 1
- 229930006723 alpha-pinene oxide Natural products 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- WGQKYBSKWIADBV-UHFFFAOYSA-O benzylaminium Chemical compound [NH3+]CC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-O 0.000 description 1
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 229940063013 borate ion Drugs 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 125000005997 bromomethyl group Chemical group 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- MIOPJNTWMNEORI-UHFFFAOYSA-N camphorsulfonic acid Chemical compound C1CC2(CS(O)(=O)=O)C(=O)CC1C2(C)C MIOPJNTWMNEORI-UHFFFAOYSA-N 0.000 description 1
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 125000004772 dichloromethyl group Chemical group [H]C(Cl)(Cl)* 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- UWGJCHRFALXDAR-UHFFFAOYSA-N diethoxy-ethyl-methylsilane Chemical compound CCO[Si](C)(CC)OCC UWGJCHRFALXDAR-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 125000006001 difluoroethyl group Chemical group 0.000 description 1
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- IFDFMWBBLAUYIW-UHFFFAOYSA-N ethane-1,2-diol;ethyl acetate Chemical compound OCCO.CCOC(C)=O IFDFMWBBLAUYIW-UHFFFAOYSA-N 0.000 description 1
- DRIIOWCRDBYORK-UHFFFAOYSA-N ethane-1,2-diol;methyl acetate Chemical compound OCCO.COC(C)=O DRIIOWCRDBYORK-UHFFFAOYSA-N 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- HTSRFYSEWIPFNI-UHFFFAOYSA-N ethyl-dimethoxy-methylsilane Chemical compound CC[Si](C)(OC)OC HTSRFYSEWIPFNI-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000005817 fluorobutyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000006343 heptafluoro propyl group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229960004592 isopropanol Drugs 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- RWGFKTVRMDUZSP-UHFFFAOYSA-N isopropyl-benzene Natural products CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 1
- 125000005928 isopropyloxycarbonyl group Chemical group [H]C([H])([H])C([H])(OC(*)=O)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 125000004092 methylthiomethyl group Chemical group [H]C([H])([H])SC([H])([H])* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- IIGMITQLXAGZTL-UHFFFAOYSA-N octyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCC IIGMITQLXAGZTL-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Chemical compound [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000006678 phenoxycarbonyl group Chemical group 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- YNKIIBQOKMXIGH-UHFFFAOYSA-N propan-2-yl 3-oxohexaneperoxoate;titanium Chemical compound [Ti].CCCC(=O)CC(=O)OOC(C)C.CCCC(=O)CC(=O)OOC(C)C YNKIIBQOKMXIGH-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006239 protecting group Chemical group 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-O thiolan-1-ium Chemical class C1CC[SH+]C1 RAOIDOHSFRTOEL-UHFFFAOYSA-O 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 125000006000 trichloroethyl group Chemical group 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- GJOGTGLNIWPDPF-UHFFFAOYSA-N trifluoromethyl hydrogen sulfite Chemical compound OS(=O)OC(F)(F)F GJOGTGLNIWPDPF-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- ANEFWEBMQHRDLH-UHFFFAOYSA-N tris(2,3,4,5,6-pentafluorophenyl) borate Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1OB(OC=1C(=C(F)C(F)=C(F)C=1F)F)OC1=C(F)C(F)=C(F)C(F)=C1F ANEFWEBMQHRDLH-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N vinyl ethyl ether Natural products CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- C08F2/00—Processes of polymerisation
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
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Abstract
提供黏性及密著性優良之硬化性組成物、硬化物之製造方法、及其硬化物。 Provides a curable composition with excellent adhesion and adhesion, a method for manufacturing a cured product, and a cured product.
含有陽離子聚合性成分(A)20~90質量份、陽離子聚合起始劑(B)1~10質量份、自由基聚合性成分(C)1~30質量份、與自由基聚合起始劑(D)0~10質量份,使得(A)成分與(C)成分成為100質量份,且(A)成分係以芳香族環氧化合物(A1);分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2);與氧雜環丁烷化合物(A3)作為必須成分,相對於(A)成分與(C)成分之合計100質量份而言,(A1)成分為35~50質量份,(C)成分係以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20的醇之丙烯酸酯等(C2)作為必須成分。 Containing 20 to 90 parts by mass of cationic polymerizable component (A), 1 to 10 parts by mass of cationic polymerization initiator (B), 1 to 30 parts by mass of radical polymerizable component (C), and radical polymerization initiator ( D) 0-10 parts by mass, so that component (A) and component (C) become 100 parts by mass, and component (A) is an aromatic epoxy compound (A1); a glycidyl compound of a polyhydric alcohol with a molecular weight of 200 or more , Or the glycidyl compound (A2) of the polyol alkylene oxide adduct; and the oxetane compound (A3) as an essential component, relative to 100 parts by mass of the total of (A) component and (C) component In other words, the component (A1) is 35-50 parts by mass, and the component (C) is a compound having an epoxy group and an ethylenically unsaturated group (C1), or an acrylate of an alcohol with 2-20 carbon atoms, etc. (C2 ) As an essential ingredient.
Description
本發明係關於硬化性組成物、硬化物之製造方法、及其硬化物,詳細而言,係關於黏性及密著性優良之硬化性組成物、硬化物之製造方法、及其硬化物。 The present invention relates to a curable composition, a method of manufacturing a cured product, and a cured product thereof, and in detail, relates to a curable composition having excellent adhesion and adhesion, a method of manufacturing a cured product, and a cured product thereof.
硬化性組成物係使用於油墨、塗料、各種塗覆劑、接著劑、光學構件等領域。關於如此的硬化性組成物之改良,有各種的報告。 The curable composition is used in the fields of inks, paints, various coating agents, adhesives, and optical components. There are various reports on the improvement of such a curable composition.
例如,下述專利文獻1~3中,提出含有陽離子聚合性成分及自由基聚合性成分之能量線硬化性組成物及其硬化物。具體而言,專利文獻1中,提出初期硬化性及接著性優良的偏光板用接著劑組成物。又,專利文獻2中,提出製造以透濕度低之樹脂薄膜為保護膜之偏光板時,即使塗覆環境之濕度高,硬化性亦優良,且一定時間經過後對於各種力而言接著力為良好,耐久試驗後亦不發生問題,耐濕熱試驗結束後之接著力亦良好的低黏度之光硬化性接著劑。進而,專利文獻3中,提出含有不飽和脂環式環氧酯化合物之可兼具高耐熱性或高折射率化與透明 性的活性能量線聚合性樹脂組成物。 For example, in the following Patent Documents 1 to 3, an energy ray curable composition containing a cation polymerizable component and a radical polymerizable component and a cured product thereof are proposed. Specifically, Patent Document 1 proposes an adhesive composition for polarizing plates that is excellent in initial curing properties and adhesiveness. In addition, Patent Document 2 proposes that when manufacturing a polarizing plate using a resin film with low moisture permeability as a protective film, even if the humidity of the coating environment is high, the curability is excellent, and after a certain period of time, the adhesion to various forces is Good, there is no problem after the endurance test, and the adhesive force after the end of the damp heat resistance test is also good. A low-viscosity light-curing adhesive. Furthermore, in Patent Document 3, it is proposed that an unsaturated alicyclic epoxy ester compound containing an unsaturated alicyclic epoxy ester compound can have both high heat resistance or high refractive index and transparency. Active energy ray polymerizable resin composition.
[專利文獻1]日本特開2014-105218號公報 [Patent Document 1] JP 2014-105218 A
[專利文獻2]日本特開2015-143352號公報 [Patent Document 2] JP 2015-143352 A
[專利文獻3]日本特開2015-168757號公報 [Patent Document 3] JP 2015-168757 A
但是,即使為專利文獻1~3中提出之硬化性組成物,就硬化性及密著性而言亦可能有不一定能夠滿足的情況,現狀為期望能夠高度兼具黏性及密著性之新穎的硬化性組成物。 However, even for the curable compositions proposed in Patent Documents 1 to 3, there may be situations in which curability and adhesion cannot be satisfied. The current situation is that it is desired to have both high adhesion and adhesion. Novel curable composition.
因而,本發明之目的為提供黏性及密著性優良之硬化性組成物、硬化物之製造方法、及其硬化物。 Therefore, the object of the present invention is to provide a curable composition with excellent adhesiveness and adhesion, a method for producing a cured product, and a cured product thereof.
本發明者等人為了解決上述課題而努力探討的結果,發現若為具有特定組成之硬化性組成物,則可克服上述課題,而完成本發明。 The inventors of the present invention have studied diligently to solve the above-mentioned problems, and found that if a curable composition having a specific composition is used, the above-mentioned problems can be overcome, and the present invention has been completed.
亦即,本發明之硬化性組成物,其特徵為含有陽離子聚合性成分(A)20~90質量份、陽離子聚合起始劑(B)1~10質量份、自由基聚合性成分(C)1~30質量 份、與自由基聚合起始劑(D)0~10質量份,使前述陽離子聚合性成分(A)與前述自由基聚合性成分(C)之合計成為100質量份,且前述陽離子聚合性成分(A),以芳香族環氧化合物(A1);分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2);與氧雜環丁烷化合物(A3)作為必須成分,相對於前述陽離子聚合性成分(A)與前述自由基聚合性成分(C)之合計100質量份而言,前述芳香族環氧化合物(A1)為35~50質量份,前述自由基聚合性成分(C),以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20的醇之丙烯酸酯或碳原子數2~20的醇之甲基丙烯酸酯(C2)為必須成分。 That is, the curable composition of the present invention is characterized by containing 20 to 90 parts by mass of cationic polymerizable component (A), 1 to 10 parts by mass of cationic polymerization initiator (B), and radical polymerizable component (C) 1~30 quality Parts, 0-10 parts by mass with the radical polymerization initiator (D), so that the total of the aforementioned cationically polymerizable component (A) and the aforementioned radically polymerizable component (C) becomes 100 parts by mass, and the aforementioned cationically polymerizable component (A), aromatic epoxy compound (A1); glycidyl compound of polyol with a molecular weight of 200 or more, or glycidyl compound of polyol alkylene oxide adduct (A2); and oxetane The compound (A3) is an essential component, and the aromatic epoxy compound (A1) is 35-50 mass parts relative to the total 100 parts by mass of the cationic polymerizable component (A) and the radical polymerizable component (C) Parts, the aforementioned radically polymerizable component (C), a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylate of an alcohol having 2 to 20 carbon atoms or an alcohol having 2 to 20 carbon atoms The methacrylate (C2) is an essential ingredient.
本發明之硬化性組成物中,前述陽離子聚合性成分(A1),較佳為多官能芳香族環氧化合物。又,本發明之硬化性組成物中,前述氧雜環丁烷化合物(A3),較佳為多官能氧雜環丁烷化合物。進一步地,本發明之硬化性組成物中,前述碳原子數2~20的醇之丙烯酸酯或碳原子數2~20的醇之甲基丙烯酸酯(C2),較佳為具有環狀構造之丙烯酸酯或甲基丙烯酸酯。又再者,本發明之硬化性組成物中,前述環狀構造,較佳為選自下述群
本發明之硬化物之製造方法,其特徵為對本發明之硬化性組成物照射活性能量線、或加熱。 The method for producing a cured product of the present invention is characterized by irradiating the curable composition of the present invention with active energy rays or heating.
本發明之硬化物,其特徵為本發明之硬化性組成物的硬化物。 The cured product of the present invention is characterized by the cured product of the curable composition of the present invention.
依照本發明,可提供黏性及密著性優良之硬化性組成物、硬化物之製造方法、及其硬化物。本發明之硬化性組成物特別有用於接著劑。 According to the present invention, it is possible to provide a curable composition with excellent adhesiveness and adhesion, a method for producing a cured product, and a cured product thereof. The curable composition of the present invention is particularly useful for adhesives.
以下,詳細說明本發明之硬化性組成物。 Hereinafter, the curable composition of the present invention will be described in detail.
本發明之硬化性組成物,以陽離子聚合性成分(A)與自由基聚合性成分(C)之合計成為100質量份時,含有陽離子聚合性成分(A)20~90質量份、陽離子聚合起始劑 (B)1~10質量份、自由基聚合性成分(C)1~30質量份、與自由基聚合起始劑(D)0~10質量份。本發明之硬化性組成物中,陽離子聚合性成分(A),係以芳香族環氧化合物(A1);分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2);與氧雜環丁烷化合物(A3)為必須成分,且相對於陽離子聚合性成分(A)與自由基聚合性成分(C)之合計100質量份而言,芳香族環氧化合物(A1)為35~50質量份。又,自由基聚合性成分(C),係以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20的醇之丙烯酸酯或碳原子數2~20的醇之甲基丙烯酸酯(C2)為必須成分。 The curable composition of the present invention, when the total of the cationically polymerizable component (A) and the radically polymerizable component (C) is 100 parts by mass, it contains 20 to 90 parts by mass of the cationically polymerizable component (A), and cationically polymerized Starter (B) 1 to 10 parts by mass, 1 to 30 parts by mass of the radical polymerizable component (C), and 0 to 10 parts by mass of the radical polymerization initiator (D). In the curable composition of the present invention, the cationically polymerizable component (A) is an aromatic epoxy compound (A1); a glycidyl compound of a polyhydric alcohol with a molecular weight of 200 or more, or a polyhydric alcohol alkylene oxide adduct Glycidyl compound (A2); and oxetane compound (A3) are essential components, and are aromatic relative to the total 100 parts by mass of the cationic polymerizable component (A) and the radical polymerizable component (C) The group epoxy compound (A1) is 35 to 50 parts by mass. In addition, the radically polymerizable component (C) is a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an acrylate of an alcohol having 2 to 20 carbon atoms, or an alcohol having 2 to 20 carbon atoms The methacrylate (C2) is an essential ingredient.
本發明之硬化性組成物之陽離子聚合性成分(A),為藉由以能量線照射或加熱活性化之陽離子聚合起始劑,而引起高分子化或交聯反應之化合物。可列舉環氧化合物、氧雜環丁烷化合物、乙烯基醚化合物等。 The cationically polymerizable component (A) of the curable composition of the present invention is a compound that causes a polymerization or crosslinking reaction by the cationic polymerization initiator activated by energy ray irradiation or heating. Examples include epoxy compounds, oxetane compounds, vinyl ether compounds, and the like.
本發明之硬化性組成物之陽離子聚合性成分(A),陽離子聚合性成分(A)係以芳香族環氧化合物(A1);分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2);與氧雜環丁烷化合物(A3)為必須成分,但作為其他環氧化合物,亦可使用脂環式環氧化合物及乙烯基醚化合物等。 The cationically polymerizable component (A) and the cationically polymerizable component (A) of the curable composition of the present invention are aromatic epoxy compounds (A1); glycidyl compounds of polyhydric alcohols with a molecular weight of 200 or more, or polyhydric alcohol rings The glycidyl compound (A2) of the oxane adduct; and the oxetane compound (A3) are essential components, but as other epoxy compounds, alicyclic epoxy compounds and vinyl ether compounds can also be used .
上述芳香族環氧化合物(A1),係指包含芳香環之環氧化合物,芳香族環氧化合物之具體例子,可列舉酚、甲酚、丁基酚等具有至少1個芳香族環之多元酚或其 環氧烷加成物之單/聚縮水甘油醚化物,例如雙酚A、雙酚F、或於此等進一步加成環氧烷的化合物之縮水甘油醚化物或環氧酚醛清漆樹脂;間苯二酚或氫醌、兒茶酚等之具有2個以上之酚性羥基的芳香族化合物之單/聚縮水甘油醚化物;苯基二甲醇或苯基二乙醇、苯基二丁醇等之具有2個以上之醇性羥基的芳香族化合物之縮水甘油醚化物;鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等之具有2個以上之羧酸的多元酸芳香族化合物之縮水甘油酯、安息香酸之縮水甘油酯、氧化苯乙烯或二乙烯基苯之環氧化物等。 The above-mentioned aromatic epoxy compound (A1) refers to an epoxy compound containing an aromatic ring. Specific examples of the aromatic epoxy compound include polyphenols having at least one aromatic ring such as phenol, cresol, and butylphenol. Or Mono/polyglycidyl etherate of alkylene oxide adducts, such as bisphenol A, bisphenol F, or the glycidyl etherate or epoxy novolak resin of these compounds further added with alkylene oxide; m-phenylene Mono/polyglycidyl etherate of aromatic compounds with two or more phenolic hydroxyl groups, such as diphenol, hydroquinone, catechol, etc.; phenyl dimethanol, phenyl diethanol, phenyl dibutanol, etc. Glycidyl etherate of aromatic compounds with two or more alcoholic hydroxyl groups; glycidyl esters of polybasic aromatic compounds with two or more carboxylic acids such as phthalic acid, terephthalic acid, trimellitic acid, etc. , Glycidyl ester of benzoic acid, epoxide of styrene oxide or divinylbenzene, etc.
上述芳香族環氧化合物(A1),可使用市售品,可列舉例如Denacol EX-146、Denacol EX-147、Denacol EX-201、Denacol EX-203、Denacol EX-711、Denacol EX-721、Oncoat EX-1020、Oncoat EX-1030、Oncoat EX-1040、Oncoat EX-1050、Oncoat EX-1051、Oncoat EX-1010、Oncoat EX-1011、Oncoat 1012(Nagase ChemteX(股)公司製);Ogsol PG-100、Ogsol EG-200、Ogsol EG-210、Ogsol EG-250(大阪瓦斯化學(股)公司製);HP4032、HP4032D、HP4700(DIC(股)公司製);ESN-475V(新日鐵住金化學(股)公司製);Epicoat YX8800(三菱化學(股)公司製);Marproof G-0105SA、Marproof G-0130SP(日油(股)公司製);Epiclon N-665、Epiclon HP-7200(DIC(股)公司製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、 EPPN-501HY、EPPN-502H、NC-7000L(日本化藥(股)公司製);ADEKA Resin EP-4000、ADEKA Resin EP-4005、ADEKA Resin EP-4100、ADEKA Resin EP-4901((股)ADEKA公司製);TECHMORE VG-3101L((股)Printec公司製)等。就上述芳香族環氧化合物(A1)而言,多官能者由於硬化性優良故較佳。 The above-mentioned aromatic epoxy compound (A1), commercially available products can be used, for example, Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX-1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat 1012 (manufactured by Nagase ChemteX Co., Ltd.); Ogsol PG-100 , Ogsol EG-200, Ogsol EG-210, Ogsol EG-250 (manufactured by Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700 (manufactured by DIC Co., Ltd.); ESN-475V (Nippon Steel & Sumikin Chemical Co., Ltd.) Co., Ltd.); Epicoat YX8800 (manufactured by Mitsubishi Chemical Corporation); Marproof G-0105SA, Marproof G-0130SP (manufactured by NOF Corporation); Epiclon N-665, Epiclon HP-7200 (DIC (shares) ) Company system); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (manufactured by Nippon Kayaku Co., Ltd.); ADEKA Resin EP-4000, ADEKA Resin EP-4005, ADEKA Resin EP-4100, ADEKA Resin EP-4901 ((share) ADEKA Company system); TECHMORE VG-3101L ((share) Printec company system), etc. With regard to the aromatic epoxy compound (A1), a polyfunctional one is preferred because of its excellent curability.
上述分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2),可列舉將多元醇或多元醇環氧烷加成物予以縮水甘油基化者,縮水甘油基化合物之分子量為200以上。 The glycidyl compound (A2) of the polyhydric alcohol with a molecular weight of 200 or more or the glycidyl compound (A2) of the polyhydric alcohol alkylene oxide adduct includes the glycidylization of the polyhydric alcohol or the polyhydric alcohol alkylene oxide adduct Furthermore, the molecular weight of the glycidyl compound is 200 or more.
上述分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2),可列舉1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、甘油之三縮水甘油醚、三羥甲基丙烷之三縮水甘油醚、山梨醇之四縮水甘油醚、二季戊四醇之六縮水甘油醚、聚乙二醇之二縮水甘油醚、聚丙二醇之二縮水甘油醚、二環戊二烯二甲醇二縮水甘油醚等之多元醇之縮水甘油醚、還有藉由於丙二醇、三羥甲基丙烷、甘油等之脂肪族多元醇加成1種或2種以上之環氧烷所得到之聚醚多元醇之聚縮水甘油醚化物、脂肪族長鏈二元酸之二縮水甘油酯。 The glycidyl compound (A2) of the polyhydric alcohol with a molecular weight of 200 or more or the glycidyl compound (A2) of the polyhydric alcohol alkylene oxide adduct includes 1,4-butanediol diglycidyl ether, 1,6-hexane Glycol diglycidyl ether, neopentyl glycol diglycidyl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, Diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, glycidyl ether of polyhydric alcohols such as dicyclopentadiene dimethanol diglycidyl ether, and glycidyl ether of polyhydric alcohols such as propylene glycol, trimethylolpropane, A polyglycidyl etherate of a polyether polyol obtained by adding aliphatic polyols such as glycerin to one or more alkylene oxides, and diglycidyl esters of aliphatic long-chain dibasic acids.
多元醇之縮水甘油基化合物或多元醇環氧烷加成物之縮水甘油基化合物(A1),可進一步列舉脂肪族高級醇之單縮水甘油醚或高級脂肪酸之縮水甘油酯、環氧化 大豆油、環氧基硬脂酸辛酯、環氧基硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。 The glycidyl compound of polyhydric alcohol or the glycidyl compound (A1) of the polyhydric alcohol alkylene oxide adduct can further include the monoglycidyl ether of aliphatic higher alcohol or the glycidyl ester of higher fatty acid, and epoxidation Soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized soybean oil, epoxidized polybutadiene, etc.
就分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2)而言,具有飽和縮合環者,由於會提高硬化物之硬化性及密著性,故較佳。 For glycidyl compounds of polyols with a molecular weight of 200 or more, or glycidyl compounds (A2) of polyol alkylene oxide adducts, those with saturated condensed rings will improve the curability and adhesion of the cured product Sex, so better.
上述分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2),可使用市售品者,可列舉例如Denacol EX-121、Denacol EX-171、Denacol EX-192、Denacol EX-211、Denacol EX-212、Denacol EX-313、Denacol EX-314、Denacol EX-321、Denacol EX-411、Denacol EX-421、Denacol EX-512、Denacol EX-521、Denacol EX-611、Denacol EX-612、Denacol EX-614、Denacol EX-622、Denacol EX-810、Denacol EX-811、Denacol EX-850、Denacol EX-851、Denacol EX-821、Denacol EX-830、Denacol EX-832、Denacol EX-841、Denacol EX-861、Denacol EX-911、Denacol EX-941、Denacol EX-920、Denacol EX-931(Nagase ChemteX(股)公司製);Epolight M-1230、Epolight 40E、Epolight 100E、Epolight 200E、Epolight 400E、Epolight 70P、Epolight 200P、Epolight 400P、Epolight 1500NP、Epolight 1600、Epolight 80MF、Epolight 100MF(共榮社化學(股)公司製)、ADEKA Glycirol ED-503、ADEKA Glycirol ED-503G、ADEKA Glycirol ED-506、ADEKA Glycirol ED-523T、ADEKA Resin EP-4088S、ADEKA Resin EP-4080E((股)ADEKA公司製)等。 The glycidyl compound of a polyhydric alcohol with a molecular weight of 200 or more, or the glycidyl compound (A2) of a polyhydric alcohol alkylene oxide adduct can be used commercially, such as Denacol EX-121, Denacol EX-171 , Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521 , Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830 , Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagase ChemteX Co., Ltd.); Epolight M-1230, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P, Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF (manufactured by Kyoeisha Chemical Co., Ltd.), ADEKA Glycirol ED-503, ADEKA Glycirol ED-503G, ADEKA Glycirol ED-506, ADEKA Glycirol ED-523T, ADEKA Resin EP-4088S, ADEKA Resin EP-4080E (made by ADEKA Corporation), etc.
上述氧雜環丁烷化合物(A3),可列舉3,7-雙(3-氧雜環丁烷基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、三乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、四乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、1,4-雙(3-乙基-3-氧雜環丁烷基甲氧基)丁烷、1,6-雙(3-乙基-3-氧雜環丁烷基甲氧基)己烷等之二官能脂肪族氧雜環丁烷化合物;3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、3-乙基-3-(氯甲基)氧雜環丁烷等之一官能氧雜環丁烷化合物等。此等可1種單獨或組合2種以上使用,多官能氧雜環丁烷化合物,由於硬化物之硬化性及密著性增高,故較佳。 The above-mentioned oxetane compound (A3) includes 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,4-bis[(3-ethyl-3 -Oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3- Bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, triethyl Glycol bis(3-ethyl-3-oxetanyl methyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetanyl methyl) ether, 1,4- Two of bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, etc. Functional aliphatic oxetane compound; 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl-3-(hexyloxymethyl)oxetane Alkyl, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl)oxetane, 3-ethyl-3 -Monofunctional oxetane compounds such as (chloromethyl)oxetane, etc. These can be used singly or in combination of two or more. The polyfunctional oxetane compound is preferred because the hardenability and adhesion of the cured product are increased.
上述氧雜環丁烷化合物(A3),可使用市售品者,可列舉例如2-羥基乙基乙烯基醚、二乙二醇單乙烯基醚、4-羥基丁基乙烯基醚(丸善石油化學(股)公司製);Aron Oxetane OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成(股)公司製)、Eternacoll OXBP、OXTP(宇部興產(股)公司製)等。 For the oxetane compound (A3), commercially available products can be used, and examples include 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, and 4-hydroxybutyl vinyl ether (Maruzen Petroleum Chemical Co., Ltd.); Aron Oxetane OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (manufactured by Toagosei Co., Ltd.), Eternacoll OXBP, OXTP ( Ube Industries (stock) company system) and so on.
上述脂環式環氧化合物,係指於飽和環不透過結合基而直接鍵結環氧乙烷環者。脂環式環氧化合物之具體例子,可列舉將具有至少1個脂環式環之多元醇的聚縮水甘油醚化物或含有環己烯或環戊烯環之化合物以氧化劑環氧化藉此所得的含有氧化環己烯或氧化環戊烯之化合物。例如,可列舉氫化雙酚A二縮水甘油醚、3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯、6-甲基-3,4-環氧基環己基甲基-6-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-3-甲基環己基甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧基環己烷)、丙烷-2,2-二基-雙(3,4-環氧基環己烷)、2,2-雙(3,4-環氧基環己基)丙烷、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷羧酸酯)、環氧基六氫鄰苯二甲酸二辛酯、環氧基六氫鄰苯二甲酸二-2-乙基己酯、1-環氧基乙基-3,4-環氧基環己烷、1,2-環氧基-2-環氧基乙基環己烷、α-蒎烯氧化物、檸檬烯二氧化物等。就脂環式環氧化合物而言,氫化雙酚A二縮水甘油醚、3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯或3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯,由密著性提高之觀點而言較佳。 The aforementioned alicyclic epoxy compound refers to a saturated ring that is directly bonded to an oxirane ring without passing through a bonding group. Specific examples of alicyclic epoxy compounds include those obtained by epoxidizing a polyglycidyl etherate of a polyol having at least one alicyclic ring or a compound containing a cyclohexene or cyclopentene ring with an oxidizing agent. Compounds containing cyclohexene oxide or cyclopentene oxide. For example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, 3,4-epoxy-1-methyl Cyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxy Cyclohexane carboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexane carboxylate, 3,4-epoxy 5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexane carboxylate, bis(3,4-epoxycyclohexylmethyl) adipate, 3 ,4-Epoxy-6-methylcyclohexane carboxylate, methylene bis(3,4-epoxycyclohexane), propane-2,2-diyl-bis(3,4- Epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, ethylenebis(3,4-epoxycyclohexyl) Alkyl carboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-ring Oxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide, etc. For alicyclic epoxy compounds, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate or 3,4-cyclic Oxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate is preferable from the viewpoint of improving adhesion.
上述脂環式環氧化合物,可使用市售品者,可列舉例如Celloxide 2021P、Celloxide 2081、Celloxide 2000、Celloxide 3000((股)Daicel公司製)等。 The above-mentioned alicyclic epoxy compound can be a commercially available one, for example, Celloxide 2021P, Celloxide 2081, Celloxide 2000, Celloxide 3000 (made by Daicel Corporation), etc.
上述乙烯基醚化合物,可列舉例如二乙二醇單乙烯基醚、三乙二醇二乙烯基醚、n-十二烷基乙烯基醚、環己基乙烯基醚、2-乙基己基乙烯基醚、2-氯乙基乙烯基醚、乙基乙烯基醚、異丁基乙烯基醚、三乙二醇乙烯基醚、2-羥基乙基乙烯基醚、4-羥基丁基乙烯基醚、1,6-環己烷二甲醇單乙烯基醚、乙二醇二乙烯基醚、1,4-丁二醇二乙烯基醚、1,6-環己烷二甲醇二乙烯基醚等。 The above-mentioned vinyl ether compounds include, for example, diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, and 2-ethylhexyl vinyl ether. Ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether, etc.
上述陽離子聚合性成分(A)中,芳香族環氧化合物(A1)、分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2)及氧雜環丁烷化合物(A3)、脂環式環氧化合物及乙烯基醚化合物之使用比例,由於會提高黏度、塗覆性、反應性及硬化性,故相對於陽離子聚合性成分(A)與自由基聚合性成分(C)之合計100質量份而言,以芳香族環氧化合物(A1)30~80質量份;分子量200以上之多元醇的縮水甘油基化合物、或多元醇環氧烷加成物之縮水甘油基化合物(A2)10~30質量份;氧雜環丁烷化合物(A3)10~30質量份;脂環式環氧化合物0~20質量份;乙烯基醚化合物0~20質量份為佳。 Among the above-mentioned cationically polymerizable components (A), aromatic epoxy compounds (A1), glycidyl compounds of polyhydric alcohols with a molecular weight of 200 or more, or glycidyl compounds of polyhydric alcohol alkylene oxide adducts (A2), and oxygen The use ratio of ethidium compound (A3), alicyclic epoxy compound and vinyl ether compound increases viscosity, coatability, reactivity and curability, so it is relative to cationic polymerizable component (A) and The total 100 parts by mass of the radical polymerizable component (C) is based on 30~80 parts by mass of the aromatic epoxy compound (A1); the glycidyl compound of the polyol with a molecular weight of 200 or more, or the polyol alkylene oxide 10-30 parts by mass of glycidyl compound (A2); 10-30 parts by mass of oxetane compound (A3); 0-20 parts by mass of alicyclic epoxy compound; 0-20 parts by mass of vinyl ether compound The mass part is better.
本發明之硬化性組成物之陽離子聚合起始劑(B),只要係可藉由能量線照射或加熱而釋出使陽離子聚合起始之物質的化合物,則不管何者均可,較佳為藉由能量線之照射而釋出路易士酸之鎓鹽的複鹽、或其衍生物。 該化合物之具代表性者,可列舉下述通式[A]r+[B]r-表示之陽離子與陰離子的鹽。 The cationic polymerization initiator (B) of the curable composition of the present invention can be used as long as it is a compound that can release a substance that initiates cationic polymerization by energy ray irradiation or heating. The double salt of the onium salt of Lewis acid or its derivative is released by the irradiation of energy rays. Representative examples of this compound include salts of cations and anions represented by the following general formula [A] r+ [B] r-.
此處陽離子[A]r+較佳為鎓類,其構造例如能夠以下述通式[(R1)aQ]r+表示。 Here, the cation [A] r+ is preferably an onium, and its structure can be represented by the following general formula [(R 1 ) a Q] r+, for example.
再者,此處R1為碳原子數1~60,且不管含有幾個碳原子以外之原子均可的有機基。a為1~5之整數。a個之R1可各自獨立地相同或相異。又,較佳為至少1者為具有芳香環之如上述的有機基。Q為選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成之群的原子或原子團。又,陽離子[A]r+中之Q的原子價為q時,必須成立r=a-q之關係(惟,N=N視為原子價0)。 In addition, R 1 here is an organic group having 1 to 60 carbon atoms and no matter how many atoms other than carbon atoms are contained. a is an integer from 1 to 5. R 1 of a may be the same or different independently. Furthermore, it is preferable that at least one of them is an organic group as described above having an aromatic ring. Q is an atom or group of atoms selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N=N. In addition, when the valence of Q in the cation [A] r+ is q, the relationship r=aq must be established (however, N=N is regarded as the valence 0).
又,陰離子[B]r-較佳為鹵化物錯合物,其構造例如能夠以下述通式[LYb]r-表示。 In addition, the anion [B] r- is preferably a halide complex, and its structure can be represented by the following general formula [LY b ] r-, for example.
進而此處,L為鹵化物錯合物之中心原子的金屬或半金屬(Metalloid),其係B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y為鹵素原子。b為3~7之整數。又,以陰離子[B]r-中之L的原子價為p時,必須成立r=b-p之關係。 Furthermore, here, L is the metal or metalloid of the central atom of the halide complex, which is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc , V, Cr, Mn, Co, etc. Y is a halogen atom. b is an integer of 3-7. In addition, when the valence of L in the anion [B] r- is p, the relationship r=bp must be established.
上述通式之陰離子[LYb]r-的具體例子,可列舉肆(五氟苯基)硼酸根、四(3,5-二氟-4-甲氧基苯基)硼酸根、四氟硼酸根(BF4)-、六氟磷酸根(PF6)-、六氟銻酸根(SbF6)-、六氟砷酸根(AsF6)-、六氯銻酸根(SbCl6)-等。 Specific examples of the anion [LY b ] r- of the above general formula include tetrakis (pentafluorophenyl) borate, tetrakis (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroboric acid root (BF 4) -, hexafluorophosphate (PF 6) -, hexafluoroantimonate (SbF 6) -, hexafluoroarsenate (AsF 6) -, hexachloro antimonate (SbCl 6) - and the like.
又,陰離子[B]r-,較佳亦可使用下述通式[LYb-1(OH)]r-表示之構造者。L、Y、b係與上述相同。又,其他可使用之陰離子,可列舉過氯酸離子(ClO4)-、三氟甲基亞硫酸離子(CF3SO3)-、氟磺酸離子(FSO3)-、甲苯磺酸陰離子、三硝基苯磺酸陰離子、樟腦磺酸根、九氟丁烷磺酸根、十六氟辛烷磺酸根、四芳基硼酸根、肆(五氟苯基)硼酸根等。 In addition, the anion [B] r- may preferably also use a structure represented by the following general formula [LY b-1 (OH)] r-. L, Y, and b are the same as above. In addition, other usable anions include perchlorate ion (ClO 4 ) - , trifluoromethyl sulfite ion (CF 3 SO 3 ) - , fluorosulfonic acid ion (FSO 3 ) - , toluenesulfonic acid anion, Trinitrobenzene sulfonate anion, camphor sulfonate, nonafluorobutane sulfonate, hexafluorooctane sulfonate, tetraaryl borate, tetrakis (pentafluorophenyl) borate, etc.
本發明之硬化性組成物中,於如此之鎓鹽之中,尤以使用下述(一)~(三)之芳香族鎓鹽特別有效。可由此等之中以其1種單獨、或混合2種以上使用。 In the curable composition of the present invention, among such onium salts, it is particularly effective to use the following aromatic onium salts (1) to (3). Among these, one kind can be used alone, or two or more kinds can be mixed and used.
(一)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等之芳基重氮鎓鹽 (1) Phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate and other aryl diazonium salts
(二)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-tert-丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪肆(五氟苯基)硼酸鹽等之二芳基錪鹽 (2) Diphenyl hexafluoroantimonate, bis(4-methylphenyl) hexafluorophosphate, bis(4-tert-butylphenyl) hexafluorophosphate, tolyl cumene Diaryl iodonium salts such as pentafluorophenyl borate
(三)下述群I或群II表示之鋶陽離子與六氟銻離子、六氟磷酸根離子、肆(五氟苯基)硼酸根離子等之鋶鹽 (3) The sulfonium cation represented by the following group I or group II and the hexafluoroantimony ion, hexafluorophosphate ion, tetrakis (pentafluorophenyl) borate ion, etc.
<群II>
又,其他較佳者,可列舉(η5-2,4-環戊二烯-1-基)〔(1,2,3,4,5,6-η)-(1-甲基乙基)苯〕-鐵-六氟磷酸鹽等之鐵-芳烴錯合物、或參(乙醯丙酮)鋁、參(乙醯乙酸乙酯)鋁、參(水楊醛)鋁等之鋁錯合物與三苯基矽醇等之矽醇類的混合物;噻吩鎓鹽、thiolanium鹽、苄基銨、吡啶鎓鹽、(金井)鹽等之鹽;二乙三胺、三乙三胺、四伸乙五胺等之聚烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛酮二胺等之脂環式多胺類;m-二甲苯二胺、二胺基二苯基甲烷、二胺基二苯基碸等之芳香族多胺類;藉由一般方法使上述多胺類與苯基縮水甘油醚、丁基縮水甘油醚、雙酚A-二縮水甘油醚、雙酚F-二縮水甘油醚等之縮水甘油醚類或羧酸之縮水甘油酯類等之各種環 氧樹脂反應藉以製造之聚環氧基加成改質物;藉由一般方法使上述有機多胺類與鄰苯二甲酸、間苯二甲酸、二聚酸等之羧酸類反應藉以製造之醯胺化改質物;藉由一般方法使上述多胺類與甲醛等之醛類及酚、甲酚、二甲酚、第三丁基酚、間苯二酚等之於核具有至少一個醛化反應性場所的酚類反應藉以製造之曼尼斯(Mannich)化改質物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、二聚酸等之脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等之芳香族二羧酸類;環己烷二羧酸等之脂環式二羧酸類;偏苯三甲酸、對稱苯三甲酸、蓖麻油脂肪酸之三聚體等之三羧酸類;苯均四酸等之四羧酸類等)之酸酐;二氰二胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。 Moreover, other preferable ones include (η 5 -2,4-cyclopentadien-1-yl) [(1,2,3,4,5,6-η)-(1-methylethyl ) Benzene]-iron-hexafluorophosphate and other iron-arene complexes, or ginseng (acetone) aluminum, ginseng (acetate ethyl) aluminum, ginseng (salicylic aldehyde) aluminum and other aluminum complexes Mixtures of silanol and triphenylsilanol; thiophenium salt, thiolanium salt, benzylammonium, pyridinium salt, (jinjing) salt, etc.; diethylenetriamine, triethylenetriamine, tetrazinc Polyalkyl polyamines such as ethylenepentamine; esters of 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophoronediamine, etc. Cyclic polyamines; aromatic polyamines such as m-xylene diamine, diaminodiphenylmethane, diaminodiphenyl sulfonate, etc.; the above-mentioned polyamines and phenylglycidol are combined by ordinary methods Polyether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether and other glycidyl ethers, or glycidyl esters of carboxylic acids, etc., are produced by the reaction of various epoxy resins. Epoxy group addition modifiers; the above-mentioned organic polyamines and carboxylic acids such as phthalic acid, isophthalic acid, and dimer acids are reacted to produce an aminated modifiers by general methods; by general methods It is produced by reacting the above-mentioned polyamines with aldehydes such as formaldehyde and phenols, cresols, xylenol, tertiary butylphenol, resorcinol, etc. in the nucleus with at least one aldehyde-reactive site Mannich chemical modification; polycarboxylic acid (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecane Acid, 2-methyl succinic acid, 2-methyl adipic acid, 3-methyl adipic acid, 3-methyl glutaric acid, 2-methyl suberic acid, 3,8-dimethyl sebacic acid Aliphatic dicarboxylic acids such as acid, 3,7-dimethyl sebacic acid, hydrogenated dimer acid, dimer acid, etc.; of phthalic acid, terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid, etc. Aromatic dicarboxylic acids; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; tricarboxylic acids such as trimellitic acid, trimellitic acid, and trimer of castor oil fatty acid; pyromellitic acid, etc. Tetracarboxylic acids, etc.) anhydrides; dicyandiamide, imidazoles, carboxylic acid esters, sulfonic acid esters, amine imines, etc.
此等之中,就實用面與光感度提高之觀點而言,尤以使用芳香族錪鹽、芳香族鋶鹽、鐵-芳烴錯合物為佳;更佳為相對於陽離子聚合起始劑(B)100質量%而言,含有至少0.1質量%以上之具有下述構造之芳香族鋶鹽。 Among these, in terms of practicality and improvement in light sensitivity, it is particularly preferable to use aromatic iodonium salts, aromatic sulphur salts, and iron-arene complexes; more preferably, it is more preferable than cationic polymerization initiators ( B) For 100% by mass, it contains at least 0.1% by mass or more of the aromatic sulfonium salt having the following structure.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19及R20,係分別獨立地表示氫原子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R21、R22、R23及R24,係分別獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基,R25表示由氫原子、鹵素原子、碳原子數1~10之烷基或下述化學式(A)~(C)中選擇的任一取代基,Anq-表示q價之陰離子,p表示使電荷為中性之係數。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 each independently represent a hydrogen atom, a halogen atom, and the number of carbon atoms 1~10 alkyl, 1~10 alkoxy or 2~10 ester group, R 21 , R 22 , R 23 and R 24 each independently represent a hydrogen atom and a halogen atom Or an alkyl group with 1 to 10 carbon atoms, R 25 represents a hydrogen atom, a halogen atom, an alkyl group with 1 to 10 carbon atoms, or any substituent selected from the following chemical formulas (A) to (C), An q- represents an anion of q valence, and p represents a coefficient that makes the charge neutral.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39,係分別獨立地表示氫原 子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R30、R31、R32、R33及R34,係分別獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 each independently represent a hydrogen atom, a halogen atom, an alkyl group with 1 to 10 carbon atoms, and a carbon atom number of 1 ~10 alkoxy group or ester group with 2~10 carbon atoms, R 30 , R 31 , R 32 , R 33 and R 34 each independently represent a hydrogen atom, a halogen atom or a carbon atom number of 1-10 alkyl.
上述通式表示之化合物中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之鹵素原子,可列舉氟、氯、溴、碘等。 Among the compounds represented by the above general formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , The halogen atoms represented by R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 can be Examples include fluorine, chlorine, bromine, and iodine.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之碳原子數1~10之烷基,可列舉甲基、乙基、丙基、異丙基、丁基、s-丁基、t-丁基、異丁基、戊基、異戊基、t-戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧基乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、t-丁硫基甲基、4-戊烯氧基甲 基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫乙基、三甲基矽烷基乙基、t-丁基二甲基矽烷氧基甲基、2-(三甲基矽烷基)乙氧基甲基、t-丁氧基羰基甲基、乙氧基羰基甲基、乙基羰基甲基、t-丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥基甲基、2-羥基乙基、1-羥基乙基、2-羥基丙基、3-羥基丙基、3-羥基丁基、4-羥基丁基、1,2-二羥基乙基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkyl groups with 1 to 10 carbon atoms, including Methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, pentyl, isopentyl, t-pentyl, hexyl, cyclohexyl, heptyl, Octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl Group, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoromethyl, trifluoromethyl, chloromethyl, dichloro Methyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nine Fluorobutyl, decafluoropentyl, tridecafluorohexyl, pentafluoroheptyl, heptafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, methoxy Ethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4-pentenoxymethyl, trichloroethoxymethyl, Bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1-methyl-1-methoxyethyl, ethyldithioethyl , Trimethylsilylethyl, t-butyldimethylsilyloxymethyl, 2-(trimethylsilyl)ethoxymethyl, t-butoxycarbonylmethyl, ethoxycarbonyl Methyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, acryloxyethyl, methacryloxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl, ethyl Acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl, 4-hydroxybutyl, 1,2-dihydroxyethyl, etc.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數1~10之烷氧基,可列舉甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、s-丁氧基、t-丁氧基、異丁氧基、戊氧基、異戊氧基、t-戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲硫基乙氧基、三氟甲氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkoxy groups having 1 to 10 carbon atoms, including methoxy, ethoxy, propoxy, isopropoxy, Butoxy, s-butoxy, t-butoxy, isobutoxy, pentoxy, isopentoxy, t-pentoxy, hexyloxy, cyclohexyloxy, cyclohexylmethoxy , Tetrahydrofuranoxy, tetrahydropyranoxy, 2-methoxyethoxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethoxy, methoxy Group ethoxyethoxy, methoxyethoxyethoxyethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy and the like.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數2~10之酯基,可列舉甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧 基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、t-丁基羰氧基、甲氧基乙醯氧基、苄醯氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent ester groups with 2 to 10 carbon atoms, including methoxycarbonyl, ethoxycarbonyl, isopropoxycarbonyl, and phenoxy Carbonyl, acetoxy, propoxy, butoxy, chloroacetoxy, dichloroacetoxy, trichloroacetoxy, trifluoroacetoxy, t-butylcarbonyl Oxy, methoxyacetoxy, benzyloxy and the like.
本發明之硬化性組成物之自由基聚合性成分(C),係以具有環氧基及乙烯性不飽和基之化合物(C1)或碳原子數2~20的醇之丙烯酸酯或碳原子數2~20的醇之甲基丙烯酸酯(C2)作為必須成分。(C2)之中,尤以具有環狀構造之丙烯酸酯或甲基丙烯酸酯為佳;更佳為,環狀構造為由下述群中選出之一種以上。 The radically polymerizable component (C) of the curable composition of the present invention is a compound having an epoxy group and an ethylenically unsaturated group (C1) or an acrylate or carbon number of an alcohol having 2 to 20 carbon atoms 2-20 alcohol methacrylate (C2) as an essential ingredient. Among (C2), acrylate or methacrylate having a cyclic structure is particularly preferred; more preferably, the cyclic structure is one or more selected from the following group.
上述具有環氧基及乙烯性不飽和基之化合物(C1),可列舉例如丙烯酸環氧酯或甲基丙烯酸環氧酯,具體而言,為使以往公知之芳香族環氧樹脂、脂環式環氧樹脂、脂肪族環氧樹脂等,與丙烯酸或甲基丙烯酸反應而得之丙烯酸酯。此等丙烯酸環氧酯或甲基丙烯酸環氧酯當中,特佳者為醇類之縮水甘油醚的丙烯酸酯或甲基丙烯酸酯。 The compound (C1) having an epoxy group and an ethylenically unsaturated group includes, for example, epoxy acrylate or epoxy methacrylate. Specifically, it is a conventionally known aromatic epoxy resin and alicyclic epoxy resin. Epoxy resins, aliphatic epoxy resins, etc., are acrylates obtained by reacting with acrylic acid or methacrylic acid. Among these epoxy acrylates or epoxy methacrylates, particularly preferred ones are acrylates or methacrylates of glycidyl ethers of alcohols.
上述碳原子數2~20的醇之丙烯酸酯或碳原子數2~20的醇之甲基丙烯酸酯(C2),可列舉分子中具有至少1個羥基之芳香族或脂肪族醇、及使其環氧烷加成體與丙烯酸或甲基丙烯酸反應而得之丙烯酸酯或甲基丙烯酸酯。具體而言,可列舉丙烯酸2-乙基己酯、丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、丙烯酸4-羥基丁酯、丙烯酸異戊酯、丙烯酸月桂酯、丙烯酸硬脂酯、丙烯酸異辛酯、丙烯酸四氫呋喃甲酯、丙烯酸異莰酯、丙烯酸苄酯、1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、新戊二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯、ε-己內酯改質二季戊四醇六丙烯酸酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基丙酯、甲基丙烯酸異戊酯、甲基丙烯酸月桂酯、甲基丙烯酸硬脂酯、甲基丙烯酸異辛酯、甲基丙烯酸四氫呋喃甲酯、甲基丙烯酸異莰酯、甲基丙烯酸苄酯、1,3-丁二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、新戊二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、聚丙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、二季戊四醇六甲基丙烯酸酯、ε-己內酯改質二季戊四醇六甲基丙烯酸酯、乙氧基化異三聚氰酸三丙烯 酸酯、乙氧基化異三聚氰酸三甲基丙烯酸酯、ε-己內酯改質參-(2-丙烯醯氧基乙基)異三聚氰酸酯、ε-己內酯改質參-(2-甲基丙烯醯氧基乙基)異三聚氰酸酯等。再者,此等丙烯酸酯或甲基丙烯酸酯當中,特佳為多元醇之聚丙烯酸酯類或多元醇之聚甲基丙烯酸酯類。 The above-mentioned acrylates of alcohols with 2 to 20 carbon atoms or methacrylates (C2) of alcohols with 2 to 20 carbon atoms include aromatic or aliphatic alcohols having at least one hydroxyl group in the molecule, and Acrylate or methacrylate obtained by reacting alkylene oxide adduct with acrylic acid or methacrylic acid. Specifically, examples include 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, isoamyl acrylate, lauryl acrylate, stearyl acrylate, acrylic acid Isooctyl ester, methyl tetrahydrofuran acrylate, isobornyl acrylate, benzyl acrylate, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate , Diethylene glycol diacrylate, triethylene glycol diacrylate, neopentyl glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol four Acrylate, dipentaerythritol hexaacrylate, ε-caprolactone modified dipentaerythritol hexaacrylate, 2-ethylhexyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, Isoamyl methacrylate, lauryl methacrylate, stearyl methacrylate, isooctyl methacrylate, methyl tetrahydrofuran methacrylate, isocamyl methacrylate, benzyl methacrylate, 1,3 -Butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol Dimethacrylate, neopentyl glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol tetramethacrylate Ester, dipentaerythritol hexamethacrylate, ε-caprolactone modified dipentaerythritol hexamethacrylate, ethoxylated tripropylene isocyanurate Acid ester, ethoxylated isocyanuric acid trimethacrylate, ε-caprolactone modified ginseng-(2-acryloyloxyethyl) isocyanurate, ε-caprolactone modified Quality parameters-(2-methacryloyloxyethyl) isocyanurate and the like. Furthermore, among these acrylates or methacrylates, polyacrylates of polyols or polymethacrylates of polyols are particularly preferred.
上述自由基聚合性成分(C),亦可使用(C1)或(C2)以外之藉由以能量線照射或加熱活性化之自由基聚合起始劑進行高分子化或交聯反應之化合物,可列舉例如胺基甲酸烯丙酯化合物、不飽和聚酯化合物、苯乙烯系化合物等。自由基聚合性成分(C)中,上述(C1)成分及(C2)成分之比例,較佳為50質量%以上。 The above-mentioned radically polymerizable component (C) may also be a compound other than (C1) or (C2) that undergoes polymerization or cross-linking reaction by a radical polymerization initiator activated by energy ray irradiation or heating. For example, an allyl carbamate compound, an unsaturated polyester compound, a styrene compound, etc. are mentioned. In the radically polymerizable component (C), the ratio of the above-mentioned (C1) component and (C2) component is preferably 50% by mass or more.
本發明之硬化性組成物之自由基起始劑(D)並無特殊限制,可使用公知者。例如,可使用苯乙酮系化合物、二苯基乙二酮系化合物、二苯甲酮系化合物、噻噸酮系化合物等之酮系化合物、肟系化合物等。 The free radical initiator (D) of the curable composition of the present invention is not particularly limited, and known ones can be used. For example, ketone-based compounds such as acetophenone-based compounds, diphenylethylenedione-based compounds, benzophenone-based compounds, thioxanthone-based compounds, and oxime-based compounds can be used.
本發明之硬化性組成物中,上述陽離子聚合性成分(A)為20~90質量份;上述陽離子聚合起始劑(B)為1~10質量份、較佳為1~6質量份;上述自由基聚合性成分(C)為1~30質量份;上述自由基聚合起始劑(D)為0~10質量份。若為上述之摻合比例以外,硬化物之硬化性及密著性有惡化之虞。再者,陽離子聚合性成分(A)與自由基聚合性成分(C)之合計為100質量份。又,相對於陽離子聚合性成分(A)與自由基聚合性成分(C)之合計100質量份而言,(A1)成分為35~50質量份。 In the curable composition of the present invention, the cationic polymerizable component (A) is 20 to 90 parts by mass; the cationic polymerization initiator (B) is 1 to 10 parts by mass, preferably 1 to 6 parts by mass; The radical polymerizable component (C) is 1-30 parts by mass; the above-mentioned radical polymerization initiator (D) is 0-10 parts by mass. If it is other than the above-mentioned blending ratio, the curability and adhesion of the cured product may deteriorate. In addition, the total of the cation polymerizable component (A) and the radical polymerizable component (C) is 100 parts by mass. Moreover, (A1) component is 35-50 mass parts with respect to the total of 100 mass parts of cationic polymerizable component (A) and radical polymerizable component (C).
本發明之硬化性組成物中,可依需要進一步使用增感劑及/或增感助劑。增感劑係於較陽離子聚合起始劑(B)所顯示之極大吸收波長更長的波長顯示出極大吸收,而促進陽離子聚合起始劑(B)所致之聚合起始反應的化合物。又,增感助劑係更加促進增感劑之作用的化合物。 In the curable composition of the present invention, a sensitizer and/or a sensitizer auxiliary may be further used as needed. The sensitizer is a compound that exhibits a maximum absorption at a wavelength longer than the maximum absorption wavelength shown by the cationic polymerization initiator (B), and promotes the polymerization initiation reaction caused by the cationic polymerization initiator (B). In addition, the sensitization aid is a compound that further promotes the action of the sensitizer.
增感劑及增感助劑可列舉蒽系化合物、萘系化合物等。 Examples of sensitizers and sensitization aids include anthracene-based compounds and naphthalene-based compounds.
蒽系化合物可列舉例如下述式(1)表示者。 Examples of the anthracene compound include those represented by the following formula (1).
列舉上述式(1)表示之蒽系化合物之具體例子時,係有如下之化合物。 When specific examples of the anthracene compound represented by the above formula (1) are given, there are the following compounds.
例如,可列舉9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽、9,10-二異丙氧基蒽、9,10-二丁氧基蒽、9,10-二戊氧基蒽、9,10-二己氧基蒽、9,10-雙(2-甲氧基乙氧基)蒽、9,10-雙(2-乙氧基乙氧基)蒽、9,10-雙(2-丁氧基乙氧基)蒽、9,10-雙(3-丁氧基丙氧基)蒽、2-甲基-或2-乙基-9,10-二甲氧基蒽、2-甲基-或2-乙基-9,10-二 乙氧基蒽、2-甲基-或2-乙基-9,10-二丙氧基蒽、2-甲基-或2-乙基-9,10-二異丙氧基蒽、2-甲基-或2-乙基-9,10-二丁氧基蒽、2-甲基-或2-乙基-9,10-二戊氧基蒽、2-甲基-或2-乙基-9,10-二己氧基蒽等。 For example, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diisopropoxyanthracene, 9,10-di Butoxyanthracene, 9,10-dipentyloxyanthracene, 9,10-dihexoxyanthracene, 9,10-bis(2-methoxyethoxy)anthracene, 9,10-bis(2- Ethoxyethoxy)anthracene, 9,10-bis(2-butoxyethoxy)anthracene, 9,10-bis(3-butoxypropoxy)anthracene, 2-methyl- or 2 -Ethyl-9,10-dimethoxyanthracene, 2-methyl- or 2-ethyl-9,10-di Ethoxyanthracene, 2-methyl- or 2-ethyl-9,10-dipropoxyanthracene, 2-methyl- or 2-ethyl-9,10-diisopropoxyanthracene, 2- Methyl- or 2-ethyl-9,10-dibutoxyanthracene, 2-methyl- or 2-ethyl-9,10-dipentoxyanthracene, 2-methyl- or 2-ethyl -9,10-Dihexyloxyanthracene and so on.
萘系化合物可列舉例如下述式(2)表示者。 Examples of the naphthalene-based compound include those represented by the following formula (2).
列舉上述式(2)表示之萘系化合物之具體例子時,係有如下之化合物。 When specific examples of the naphthalene compound represented by the above formula (2) are given, there are the following compounds.
例如,可列舉4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 For example, 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4- Hexyloxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene Naphthalene, 1,4-dibutoxynaphthalene, etc.
相對於上述陽離子聚合性成分(A)而言,增感劑及增感助劑之使用比例並無特殊限定,只要於不阻礙本發明之目的的範圍內大致以通常之使用比例使用即可,例如,相對於上述陽離子聚合性成分(A)100質量份而言,由硬化性提高的觀點,增感劑及增感助劑較佳分別為0.1~3質量份。 With respect to the above-mentioned cationically polymerizable component (A), the use ratio of the sensitizer and the sensitization aid is not particularly limited, as long as it is used in a general use ratio within a range that does not hinder the purpose of the present invention. For example, with respect to 100 parts by mass of the above-mentioned cationically polymerizable component (A), from the viewpoint of improving the curability, the sensitizer and the sensitization aid are preferably 0.1 to 3 parts by mass, respectively.
本發明之硬化性組成物中,可依需要使用矽 烷偶合劑。矽烷偶合劑,例如可使用二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等之烷基官能性烷氧基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等之烯基官能性烷氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧基官能性烷氧基矽烷、N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等之胺基官能性烷氧基矽烷、γ-巰基丙基三甲氧基矽烷等之巰基官能性烷氧基矽烷、四異丙氧化鈦、四正丁氧化鈦等之烷氧化鈦類、鈦二辛氧基雙(伸辛基甘醇酸鹽)、鈦二異丙氧基雙(乙基乙醯乙酸鹽)等之鈦鉗合物類、四乙醯丙酮鋯、三丁氧基單乙醯丙酮鋯等之鋯鉗合物類、三丁氧基硬脂酸鋯等之鋯醯化物類、甲基三異氰酸酯矽烷等之異氰酸酯矽烷類等。 In the curable composition of the present invention, silicon can be used as needed Alkyl coupling agent. Silane coupling agent, for example, dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane can be used Alkyl functional alkoxysilanes such as silane, methyl triethoxy silane, ethyl trimethoxy silane, ethyl trimethoxy silane, vinyl trichlorosilane, vinyl trimethoxy silane, vinyl tris Alkenyl functional alkoxysilanes such as ethoxysilane and allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethyl Oxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyl Trimethoxysilane, γ-glycidoxypropyl trimethoxysilane, γ-glycidoxypropylmethyl diethoxysilane, β-(3,4-epoxycyclohexyl)ethyl Epoxy functional alkoxysilanes such as trimethoxysilane, N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyl trimethoxysilane, such as amino functional alkoxysilane, γ-mercaptopropyl trimethoxysilane, and other mercapto functional alkoxysilane, titanium tetraisopropoxide Titanium alkoxides such as tetra-n-butoxide titanium, titanium dioctyl bis (octyl glycolate), titanium diisopropoxy bis (ethyl acetyl acetate), etc. Zirconium compounds such as zirconium tetraacetone, zirconium tributoxy monoacetone, zirconium compounds such as zirconium tributoxy stearate, isocyanate silanes such as methyl triisocyanate silane, etc. Wait.
上述矽烷偶合劑之使用量並無特殊限定,通常,相對於硬化性組成物中之固形物全部量100質量份而言,為0.01~20質量份之範圍。 The amount of the silane coupling agent used is not particularly limited, but it is usually in the range of 0.01 to 20 parts by mass relative to 100 parts by mass of the total solid content in the curable composition.
於本發明之硬化性組成物,藉由依需要使用熱可塑性有機聚合物,亦可改善硬化物之特性。熱可塑性有機聚合物,可列舉例如聚苯乙烯、聚甲基丙烯酸甲酯、甲基丙烯酸甲酯丙烯酸乙酯共聚物、甲基丙烯酸甲酯甲基丙烯酸縮水甘油酯共聚物、聚(甲基)丙烯酸、苯乙烯-(甲基)丙烯酸共聚物、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、(甲基)丙烯酸縮水甘油酯-聚甲基(甲基)丙烯酸酯共聚物、聚乙烯基縮丁醛、纖維素酯、聚丙烯醯胺、飽和聚酯等。 In the curable composition of the present invention, by using a thermoplastic organic polymer as needed, the properties of the cured product can also be improved. Thermoplastic organic polymers, for example, polystyrene, polymethyl methacrylate, methyl methacrylate ethyl acrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, poly(methyl) Acrylic acid, styrene-(meth)acrylic acid copolymer, (meth)acrylic acid-methyl methacrylate copolymer, glycidyl (meth)acrylate-polymethyl(meth)acrylate copolymer, polyethylene Butyral, cellulose ester, polyacrylamide, saturated polyester, etc.
本發明之硬化性組成物中,亦可依需要進一步使用紫外線吸收劑、或於常溫為不活性但藉由加熱至特定溫度/光照射/酸等會使保護基脫離而活性化以展現紫外線吸收能力的化合物。 In the curable composition of the present invention, a UV absorber may be further used as needed, or it may be inactive at room temperature, but by heating to a specific temperature/light irradiation/acid, etc., the protective group will be detached and activated to exhibit UV absorption. Ability compound.
又,只要不損及本發明之效果,可依需要添加多元醇、無機填料、有機填料、顏料、染料等之著色劑、消泡劑、增黏劑、界面活性劑、調平劑、難燃劑、搖變劑、稀釋劑、可塑劑、安定劑、聚合禁止劑、紫外線吸收劑、抗氧化劑、抗靜電劑、流動調整劑、接著促進劑等之各種樹脂添加物等。 Moreover, as long as the effect of the present invention is not impaired, coloring agents such as polyols, inorganic fillers, organic fillers, pigments, dyes, defoamers, tackifiers, surfactants, leveling agents, flame retardants, etc. can be added as needed Various resin additives such as additives, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, adhesion promoters, etc.
本發明之硬化性組成物中,可使用通常所用之可將上述(A)、(B)、(C)及(D)之各成分溶解或分散的溶劑,無特別限制。溶劑可列舉例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等之酮類;乙基醚、二噁烷、四氫呋喃、 1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲基醚、二丙二醇二甲基醚等之醚系溶劑;乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、Texanol等之酯系溶劑;乙二醇單甲基醚、乙二醇單乙基醚等之賽璐索芙系溶劑;甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等之醇系溶劑;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲基醚-2-乙酸酯(PGMEA)、二丙二醇單甲基醚乙酸酯、乙酸3-甲氧基丁酯、丙酸乙氧基乙酯等之醚酯系溶劑;苯、甲苯、二甲苯等之BTX系溶劑;己烷、庚烷、辛烷、環己烷等之脂肪族烴系溶劑;松節油、D-檸檬烯、蒎烯等之萜烯系烴油;礦油精、Swasol#310(Cosmo松山石油(股)公司製)、Solvesso#100(Exxon化學公司)等之石蠟系溶劑;四氯化碳、氯仿、三氯乙烯、二氯甲烷、1,2-二氯乙烷等之鹵化脂肪族烴系溶劑;氯苯等之鹵化芳香族烴系溶劑;碳酸伸丙酯、卡必醇系溶劑、苯胺、三乙胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸、水等。此等溶劑可使用1種或以2種以上之混合溶劑使用。 In the curable composition of the present invention, commonly used solvents that can dissolve or disperse the above-mentioned (A), (B), (C) and (D) components can be used, and there is no particular limitation. Examples of the solvent include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone; Ethyl ether, dioxane, tetrahydrofuran, Ether solvents such as 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether, etc.; methyl acetate, ethyl acetate, acetic acid- Ester solvents such as n-propyl ester, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, Texanol, etc.; ethylene glycol monomethyl ether, ethylene glycol mono Cellulose series solvents such as ethyl ether; alcohol solvents such as methanol, ethanol, iso- or n-propanol, iso- or n-butanol, pentanol, etc.; ethylene glycol monomethyl acetate, Ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethyl propionate Ether ester solvents such as oxyethyl; BTX solvents such as benzene, toluene, xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, cyclohexane, etc.; turpentine, D-limonene, pinium Terpene-based hydrocarbon oils such as olefins; mineral spirits, Swasol#310 (manufactured by Cosmo Songshan Petroleum Co., Ltd.), Solvesso#100 (Exxon Chemical Company) and other paraffin-based solvents; carbon tetrachloride, chloroform, trichloro Halogenated aliphatic hydrocarbon solvents such as ethylene, dichloromethane, 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; propylene carbonate, carbitol solvents, aniline, triethylamine , Pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, water, etc. These solvents can be used singly or as a mixed solvent of two or more kinds.
因為會提高硬化性、接著性、液體保存安定性,故本發明之硬化性組成物,水分量較佳為5質量份以下、更佳為3質量份以下。水分過多時,有白濁或成分析出之虞,故不佳。 Since the curability, adhesiveness, and liquid storage stability are improved, the curable composition of the present invention preferably has a water content of 5 parts by mass or less, and more preferably 3 parts by mass or less. When the moisture is too much, it may become cloudy or may be out of the composition, so it is not good.
本發明之硬化性組成物,係以輥塗佈器、淋 幕塗佈器、各種之印刷、浸漬等之公知手段,而施用於支持基體上。又,亦可一時施用於薄膜等之支持基體上後,轉印於其他支持基體上,其應用方法並無限制。 The curable composition of the present invention is a roll coater, shower The curtain coater, various printing, dipping and other well-known means are applied to the support substrate. In addition, it can also be applied to a supporting substrate such as a film at a time, and then transferred to other supporting substrates. The application method is not limited.
上述支持基體之材料,可使用通常所使用者,無特別限制,可列舉例如玻璃等之無機材料;二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯基丙醯基纖維素、硝基纖維素等之纖維素酯;聚醯胺;聚醯亞胺;聚胺基甲酸酯;環氧樹脂;聚碳酸酯;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚-1,4-環己烷二亞甲基聚對苯二甲酸酯、聚乙烯-1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚對苯二甲酸丁二酯等之聚酯;聚苯乙烯;聚乙烯、聚丙烯、聚甲基戊烯等之聚烯烴;聚乙酸乙烯酯、聚氯乙烯、聚氟乙烯等之乙烯基化合物;聚甲基丙烯酸甲酯、聚丙烯酸酯等之丙烯酸系樹脂;聚碳酸酯;聚碸;聚醚碸;聚醚酮;聚醚醯亞胺;聚氧乙烯、降莰烯樹脂、環烯烴聚合物(COP)等之高分子材料。再者,亦可對上述支持基體進行電暈放電處理、火焰處理、紫外線處理、高頻處理、輝光放電處理、活性電漿處理、雷射處理等之表面活性化處理。 The material of the above-mentioned support matrix can be used by ordinary users without any special limitation. Examples include inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), acetyl cellulose, butyric cellulose Cellulose esters of cellulose, acetyl propyl cellulose, nitrocellulose, etc.; polyamide; polyimide; polyurethane; epoxy resin; polycarbonate; polyterephthalate Ethylene formate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene polyterephthalate, polyethylene-1,2- Polyesters such as diphenoxyethane-4,4'-dicarboxylate and polybutylene terephthalate; polystyrene; polyolefins such as polyethylene, polypropylene, and polymethylpentene; Vinyl compounds such as polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; acrylic resins such as polymethyl methacrylate and polyacrylate; polycarbonate; polyether; polyether ketone; polyether ketone; poly Ether imine; polyoxyethylene, norbornene resin, cyclic olefin polymer (COP) and other polymer materials. Furthermore, surface activation treatments such as corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, and laser treatment may also be performed on the above-mentioned support substrate.
將本發明之硬化性組成物藉由能量線照射而硬化的方法中,能量線可列舉紫外線、電子線、X射線、放射線、高頻波等,紫外線在經濟上最佳。紫外線之光源可列舉紫外線雷射、水銀燈、氙雷射、金屬鹵化物燈等。 In the method of curing the curable composition of the present invention by irradiation with energy rays, the energy rays include ultraviolet rays, electron rays, X-rays, radiation rays, high-frequency waves, etc., and ultraviolet rays are economically optimal. The light source of ultraviolet light can include ultraviolet laser, mercury lamp, xenon laser, metal halide lamp and so on.
將本發明之硬化性組成物藉由加熱而硬化的 方法中之條件,為70~250℃、1~100分鐘。可於預烘烤(PAB;Pre applied bake)之後來加壓,而進行後烘烤(PEB;Post exposure bake);亦能夠以不同的數階段之溫度烘烤。加熱條件雖依各成分之種類及摻合比例而異,但例如為70~180℃、於烘箱為5~15分鐘、於加熱板則為1~5分鐘。之後,為了使塗膜硬化,藉由於180~250℃、較佳為200~250℃,於烘箱為30~90分鐘、於加熱板則為5~30分鐘進行加熱處理,可得到硬化膜。 The curable composition of the present invention is cured by heating The conditions in the method are 70~250℃, 1~100 minutes. Pressure can be applied after pre-bake (PAB; Pre applied bake), and post-bake (PEB; Post exposure bake); it can also be baked at different temperatures in several stages. Although the heating conditions vary depending on the types and blending ratios of the ingredients, for example, they are 70 to 180°C, 5 to 15 minutes in an oven, and 1 to 5 minutes on a hot plate. After that, in order to harden the coating film, a cured film can be obtained by heating at 180 to 250°C, preferably 200 to 250°C, in an oven for 30 to 90 minutes, and on a hot plate for 5 to 30 minutes.
本發明之硬化性組成物或其硬化物之具體的用途,可列舉接著劑、眼鏡、以攝影用透鏡為代表之光學材料、塗料、塗覆劑、襯墊劑、油墨、光阻、液狀光阻、印刷版、彩色電視、PC顯示器、行動資訊終端、數位相機、有機EL、觸控面板等之顯示元件、絕緣塗漆、絕緣薄片、層合板、印刷基板、半導體裝置用/LED封裝用/液晶注入口用/有機EL用/光元件用/電絕緣用/電子零件用/分離膜用等之密封劑、成形材料、油灰、玻璃纖維含浸劑、木粉填料、半導體用/太陽電池用等之鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置之背光所使用之稜鏡透鏡薄片、投影電視等之螢幕所使用之菲涅耳透鏡薄片、扁豆狀透鏡薄片等之透鏡薄片之透鏡部、或使用如此薄片之背光等、微透鏡等之光學透鏡、光學元件、光連接器、光波導、光學成形用鑄造劑等。 Specific uses of the curable composition of the present invention or its cured product include adhesives, glasses, optical materials represented by photographic lenses, paints, coating agents, spacers, inks, photoresists, and liquids. Display components such as photoresist, printing plate, color TV, PC monitor, mobile information terminal, digital camera, organic EL, touch panel, etc., insulating paint, insulating sheet, laminate, printed circuit board, semiconductor device/LED packaging /For liquid crystal injection ports/for organic EL/for optical components/for electrical insulation/for electronic parts/for separation membranes, etc. Sealants, molding materials, putty, glass fiber impregnants, wood powder fillers, semiconductors/solar cells Passivation films, interlayer insulating films, protective films, lens parts of lens sheets used in backlights of liquid crystal display devices, Fresnel lens sheets used in screens such as projection TVs, and lentil lens sheets , Or use such thin sheets such as backlights, microlenses and other optical lenses, optical elements, optical connectors, optical waveguides, casting agents for optical molding, etc.
顯示裝置可列舉於透明支持體上依需要設置有底塗層、抗反射層、偏光元件層、相位差層、雙折射率 層、光散射層、硬塗層、潤滑層、保護層等之各層者,於各層可使用由本發明之硬化物所成的薄膜。 The display device can be enumerated on a transparent support provided with a primer layer, an anti-reflection layer, a polarizing element layer, a retardation layer, and a birefringence layer as required. For each layer, light scattering layer, hard coat layer, lubricating layer, protective layer, etc., a thin film made of the hardened substance of the present invention can be used for each layer.
以下列舉實施例等以更詳細說明本發明,但本發明不限定於此等實施例。 Examples and the like are listed below to explain the present invention in more detail, but the present invention is not limited to these examples.
以下述之[表1]、[表2]所示之摻合比充分混合各成分,各得到實施例1~9之硬化性組成物及比較例1~5之硬化性組成物。再者,實施例及比較例之摻合量單位為質量份。 The components were thoroughly mixed at the blending ratios shown in the following [Table 1] and [Table 2] to obtain the curable composition of Examples 1 to 9 and the curable composition of Comparative Examples 1 to 5, respectively. Furthermore, the unit of the blending amount of the examples and comparative examples is parts by mass.
陽離子聚合性成分(A)係使用下述之化合物(A1-1)、(A2-1)及(A3-1)。 The following compounds (A1-1), (A2-1) and (A3-1) are used as the cationically polymerizable component (A).
化合物(A1-1):雙酚型二縮水甘油醚 Compound (A1-1): Bisphenol type diglycidyl ether
化合物(A2-1):新戊二醇二縮水甘油醚 Compound (A2-1): neopentyl glycol diglycidyl ether
化合物(A3-1):Aron Oxetane OXT-221(東亞合成(股)公司製) Compound (A3-1): Aron Oxetane OXT-221 (manufactured by Toagosei Co., Ltd.)
陽離子聚合起始劑(B)係使用下述之化合物(B-1)。 As the cationic polymerization initiator (B), the following compound (B-1) was used.
化合物B-1:下述式(3)表示之化合物及下述式(4)表示之化合物的混合物之碳酸伸丙酯50%溶液 Compound B-1: Propylene carbonate 50% solution of a mixture of the compound represented by the following formula (3) and the compound represented by the following formula (4)
自由基聚合性成分(C)係使用下述之化合物。 The radical polymerizable component (C) uses the following compound.
化合物(C1-1):Epoxy Ester M-600A(共榮社化學(股)公司製) Compound (C1-1): Epoxy Ester M-600A (manufactured by Kyoeisha Chemical Co., Ltd.)
化合物(C1-2):Epoxy Ester 70PA(共榮社化學(股)公司製) Compound (C1-2): Epoxy Ester 70PA (manufactured by Kyoeisha Chemical Co., Ltd.)
化合物(C1-3):Epoxy Ester 200PA(共榮社化學(股)公司製) Compound (C1-3): Epoxy Ester 200PA (manufactured by Kyoeisha Chemical Co., Ltd.)
化合物(C2-1):1,6-己二醇二丙烯酸酯 Compound (C2-1): 1,6-hexanediol diacrylate
化合物(C2-2):丙烯酸4-羥基丁酯 Compound (C2-2): 4-hydroxybutyl acrylate
化合物(C2-3):A-9300S(多官能丙烯酸酯;新中村化學工業(股)公司製) Compound (C2-3): A-9300S (multifunctional acrylate; manufactured by Shinnakamura Chemical Industry Co., Ltd.)
化合物(C2-4):Viscoat#150(丙烯酸四氫呋喃甲酯;大阪有機化學工業(股)公司製) Compound (C2-4): Viscoat#150 (methyl tetrahydrofuran acrylate; manufactured by Osaka Organic Chemical Industry Co., Ltd.)
自由基聚合起始劑(D)係使用下述之化合物(D-1)。 As the radical polymerization initiator (D), the following compound (D-1) was used.
化合物(D-1):Irgacure 184(BASF公司製) Compound (D-1): Irgacure 184 (manufactured by BASF Corporation)
對於所得之實施例1~9及比較例1~5之各硬化性組成物,遵照下述順序,進行黏度、密著性及硬化性之評估。結果一併記載於[表1]及[表2]。 For the obtained curable compositions of Examples 1 to 9 and Comparative Examples 1 to 5, the viscosity, adhesion, and curability were evaluated in accordance with the following procedures. The results are recorded in [Table 1] and [Table 2].
對於所得之實施例1~9及比較例1~5之各硬化性組成物,以E型黏度計測定於25℃之黏度。結果一併記載於[表1]及[表2]。 For the obtained curable compositions of Examples 1 to 9 and Comparative Examples 1 to 5, the viscosity at 25° C. was measured with an E-type viscometer. The results are recorded in [Table 1] and [Table 2].
將上述所得之實施例1~9及比較例1~5之硬化性組成物,各自塗佈於一片之電暈處理PMMA薄膜(住友化學股份有限公司:Technolloy 125S001)後,使用貼合機(laminator)與另一片經電暈放電處理的COP(環烯烴聚合物、日本Zeon製:型號ZeonorFilm 14-060)薄膜貼合,使用無電極紫外光燈透過COP薄膜照射相當於1000mJ/cm2之光進行接著,以得到試驗片。進行所得之試驗片的90度剝離試驗。 The curable compositions of Examples 1 to 9 and Comparative Examples 1 to 5 obtained above were each coated on a corona treated PMMA film (Sumitomo Chemical Co., Ltd.: Technolloy 125S001), and then a laminator was used. ) Is bonded to another COP (cycloolefin polymer, Japan Zeon product: model ZeonorFilm 14-060) film treated by corona discharge, using an electrodeless ultraviolet lamp to irradiate the COP film with light equivalent to 1000mJ/cm 2 Next, to obtain a test piece. A 90-degree peel test of the obtained test piece was performed.
將上述所得之實施例1~9及比較例1~5之硬化性組成物,塗佈於一片TAC薄膜(富士軟片:型號FT-TD60ULP)後,使用貼合機與另一片經電暈放電處理的 COP(環烯烴聚合物、日本Zeon製:型號ZeonorFilm 14-060)薄膜貼合,使用無電極紫外光燈透過COP薄膜照射相當於150mJ/cm2之光進行接著,以評估硬化速度。照射未達30秒,剝離時感到阻力時評估為○、即使30秒以上亦可容易剝離時評估為×。硬化時間越短,意指硬化性越良好。 Coat the curable compositions of Examples 1 to 9 and Comparative Examples 1 to 5 obtained above on a sheet of TAC film (Fuji Film: Model FT-TD60ULP), and then use a laminating machine and another sheet to undergo corona discharge treatment COP (Cycloolefin polymer, manufactured by Zeon, Japan: model ZeonorFilm 14-060) film was laminated, and then an electrodeless ultraviolet lamp was used to irradiate the COP film with light equivalent to 150mJ/cm 2 for bonding to evaluate the curing speed. When the irradiation was less than 30 seconds, the resistance was evaluated as ○ when resistance was felt during peeling, and the evaluation was × when the peeling was easy even for 30 seconds or more. The shorter the hardening time, the better the hardening.
由[表1]及[表2]可知,本發明之硬化性組成物黏性及密著性優良。 It can be seen from [Table 1] and [Table 2] that the curable composition of the present invention is excellent in viscosity and adhesion.
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EP1728826B1 (en) * | 2004-03-26 | 2011-04-20 | Kaneka Corporation | Composition curable by both free-radical photocuring and cationic photocuring |
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