TWI732891B - Curable composition, method of manufacturing hardened material, and hardened material - Google Patents

Curable composition, method of manufacturing hardened material, and hardened material Download PDF

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TWI732891B
TWI732891B TW106120786A TW106120786A TWI732891B TW I732891 B TWI732891 B TW I732891B TW 106120786 A TW106120786 A TW 106120786A TW 106120786 A TW106120786 A TW 106120786A TW I732891 B TWI732891 B TW I732891B
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compound
curable composition
mass
epoxy compound
parts
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TW201819451A (en
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松土和彦
関新之介
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日商Adeka股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/223Di-epoxy compounds together with monoepoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • C08G59/245Di-epoxy compounds carbocyclic aromatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

本發明為提供一種硬化物之密著性優異之硬化性組成物、硬化物之製造方法、以及其硬化物。 The present invention is to provide a curable composition with excellent adhesion of the cured product, a method for producing the cured product, and the cured product.

本發明為一種硬化性組成物,其係含有陽離子聚合性成分(A)100質量份、與陽離子聚合起始劑(B)1~10質量份之硬化性組成物,陽離子聚合性成分(A)係將芳香族環氧化合物(A1)、與脂肪族環氧丙基化合物(A2)、與環氧丙烷化合物(A3)、與具有陽離子聚合性取代基之重量平均分子量1,000~30,000之聚合物(A4)作為必要成分,芳香族環氧化合物(A1)為陽離子聚合性成分(A)之主成分,且含有多官能芳香族環氧化合物以及單官能芳香族環氧化合物。 The present invention is a curable composition containing 100 parts by mass of cationic polymerizable component (A), 1-10 parts by mass of cationic polymerization initiator (B), and cationic polymerizable component (A) It is a polymer of aromatic epoxy compound (A1), aliphatic epoxy propyl compound (A2), propylene oxide compound (A3), and cationically polymerizable substituent with a weight average molecular weight of 1,000 to 30,000 ( A4) As an essential component, the aromatic epoxy compound (A1) is the main component of the cationically polymerizable component (A), and contains a polyfunctional aromatic epoxy compound and a monofunctional aromatic epoxy compound.

Description

硬化性組成物、硬化物之製造方法、以及其硬化物 Curable composition, manufacturing method of cured product, and cured product

本發明為關於一種硬化性組成物、硬化物之製造方法、以及其硬化物,更詳細為關於一種硬化物之密著性優異之硬化性組成物、硬化物之製造方法、以及其硬化物。 The present invention relates to a curable composition, a method of manufacturing a cured product, and a cured product thereof, and more specifically, a curable composition having excellent adhesion of a cured product, a method of manufacturing a cured product, and a cured product thereof.

硬化性組成物被使用在油漆、塗料、各種塗布劑、接著劑、光學構件等領域當中。關於如此之硬化性組成物的改良,有各種報告。 The curable composition is used in the fields of paints, coatings, various coating agents, adhesives, and optical components. There are various reports on the improvement of such a curable composition.

例如,專利文獻1~4中有提案各種光硬化性接著劑。具體來說,專利文獻1中有提案一種光硬化型接著劑,其係將聚乙烯醇系偏光子與各種保護薄膜以相同的光硬化型接著劑能夠簡單且強固地接著,且實質上不包含有機溶劑,為低黏度且薄膜塗布性優異。且,專利文獻2中有提案一種光硬化型環氧樹脂系接著劑,其不需要照射非常強之照度的光,也不需要在光照射後加熱。且,專利文獻3中有提案一種光硬化性接著劑,其保存安定性優異,能夠抑制硬化時之接著劑本身以及接著對象物的變色,硬化速度較大且能給予良好之接著性。且,專利文獻4中, 有提案一種陽離子聚合性組成物,其硬化性、接著性以及耐水性優異,優於接著劑用途。 For example, Patent Documents 1 to 4 propose various photocurable adhesives. Specifically, Patent Document 1 proposes a photo-curing adhesive, which combines polyvinyl alcohol-based polarizers and various protective films with the same photo-curing adhesive, which can be easily and strongly adhered, and does not substantially contain Organic solvents have low viscosity and excellent film coating properties. In addition, Patent Document 2 proposes a light-curing epoxy resin adhesive that does not require irradiation with very strong illuminance and does not require heating after light irradiation. In addition, Patent Document 3 proposes a photocurable adhesive that has excellent storage stability, can suppress discoloration of the adhesive itself and the object to be adhered during curing, has a high curing speed, and can provide good adhesiveness. In addition, Patent Document 4 proposes a cationic polymerizable composition that is excellent in curability, adhesiveness, and water resistance, and is superior to adhesive applications.

先前技術文獻 Prior art literature 專利文獻 Patent literature

專利文獻1:日本特開2011-236389號公報 Patent Document 1: Japanese Patent Application Publication No. 2011-236389

專利文獻2:日本特開2012-149262號公報 Patent Document 2: JP 2012-149262 A

專利文獻3:國際公開2008/111584號公報 Patent Document 3: International Publication No. 2008/111584

專利文獻4:國際公開2015/005211號公報 Patent Document 4: International Publication No. 2015/005211

然而,即使是專利文獻1~4中所提案之接著劑,關於其硬化物之密著性,並非一定得到滿足,關於硬化物之密著性,現狀為期望更進一步探討。 However, even with the adhesives proposed in Patent Documents 1 to 4, the adhesiveness of the cured product is not necessarily satisfied, and the current situation requires further investigations regarding the adhesiveness of the cured product.

於此,本發明之目的為提供一種硬化物之密著性優異之硬化性組成物、硬化物之製造方法、以及硬化物。 Here, the object of the present invention is to provide a curable composition with excellent adhesion of the cured product, a method for producing the cured product, and the cured product.

本發明者們針對欲解決之上述課題進行縝密地探討結果發現,只要具有特定組成之硬化性組成物,即能夠解決上述課題,進一步完成本發明。 The inventors of the present invention conducted intensive studies on the above-mentioned problems to be solved, and found that as long as a curable composition having a specific composition can solve the above-mentioned problems, the present invention was further completed.

亦即本發明之硬化性組成物其特徵為含有陽 離子聚合性成分(A)100質量份、與陽離子聚合起始劑(B)1~10質量份之硬化性組成物中,前述陽離子聚合性成分(A)係將芳香族環氧化合物(A1)、與脂肪族環氧丙基化合物(A2)、與環氧丙烷化合物(A3)、與具有陽離子聚合性取代基之重量平均分子量1,000~30,000之聚合物(A4)作為必要成分,前述芳香族環氧化合物(A1)為前述陽離子聚合性成分(A)之主成分,且含有多官能芳香族環氧化合物以及單官能芳香族環氧化合物。 That is, the curable composition of the present invention is characterized by containing 100 parts by mass of the cationic polymerizable component (A) and 1-10 parts by mass of the cationic polymerization initiator (B). The aforementioned cationic polymerizable component (A) is an aromatic epoxy compound (A1), an aliphatic epoxy propyl compound (A2), a propylene oxide compound (A3), and a weight average molecular weight of 1,000 to 30,000 with cationically polymerizable substituents The polymer (A4) is an essential component, and the aromatic epoxy compound (A1) is the main component of the cationically polymerizable component (A), and contains a polyfunctional aromatic epoxy compound and a monofunctional aromatic epoxy compound.

本發明之硬化性組成物中,進一步含有脂環式環氧化合物(A5)作為前述陽離子聚合性成分(A)較佳。且,本發明之硬化性組成物中,前述環氧丙烷化合物(A3)為多官能環氧丙烷化合物較佳。 In the curable composition of the present invention, it is preferable to further contain an alicyclic epoxy compound (A5) as the cationically polymerizable component (A). In addition, in the curable composition of the present invention, the aforementioned propylene oxide compound (A3) is preferably a polyfunctional propylene oxide compound.

本發明之硬化物之製造方法之特徵為對本發明之硬化性組成物照射活性能線、或加熱。 The production method of the cured product of the present invention is characterized by irradiating the curable composition of the present invention with active energy rays or heating.

本發明之硬化物為本發明之硬化性組成物之硬化物。 The cured product of the present invention is the cured product of the curable composition of the present invention.

藉由本發明,能夠提供一種硬化物之密著性優異之硬化性組成物、硬化物之製造方法、以及其硬化物。本發明之硬化性組成物有用於接著劑、尤其是偏光板用接著劑。 According to the present invention, it is possible to provide a curable composition having excellent adhesion of the cured product, a method for manufacturing the cured product, and the cured product. The curable composition of the present invention is useful for adhesives, especially adhesives for polarizing plates.

用於實施發明之形態 The form used to implement the invention

以下,針對本發明之硬化性組成物進行詳細地說明。 Hereinafter, the curable composition of the present invention will be described in detail.

本發明之硬化性組成物藉由因能量線照射或加熱而活性化之陽離子聚合起始劑,會引起高分子化或交聯反應,且含有陽離子聚合性成分(A)100質量份、與陽離子聚合起始劑(B)1~10質量份。本發明之硬化性組成物中,陽離子聚合性成分(A)係將芳香族環氧化合物(A1)、與脂肪族環氧丙基化合物(A2)、與環氧丙烷化合物(A3)、與具有陽離子聚合性取代基之重量平均分子量1,000~30,000之聚合物(A4)作為必要成分,芳香族環氧化合物(A1)為陽離子聚合性成分(A)之主成分。另外,亦可含有脂環式環氧化合物(A5)、乙烯醚化合物(A6)等。於此,主成分意指混合複數種陽離子聚合性成分,相同種類之陽離子聚合性成分的合計最多者。 The curable composition of the present invention is polymerized or crosslinked by a cationic polymerization initiator activated by energy ray irradiation or heating, and contains 100 parts by mass of the cationic polymerizable component (A), and cationic The polymerization initiator (B) is 1 to 10 parts by mass. In the curable composition of the present invention, the cationic polymerizable component (A) is a combination of an aromatic epoxy compound (A1), an aliphatic epoxy propyl compound (A2), a propylene oxide compound (A3), and a The polymer (A4) of the weight average molecular weight of the cationically polymerizable substituent is 1,000 to 30,000 as an essential component, and the aromatic epoxy compound (A1) is the main component of the cationically polymerizable component (A). In addition, an alicyclic epoxy compound (A5), a vinyl ether compound (A6), etc. may also be contained. Here, the main component means a mixture of a plurality of cationically polymerizable components, and the total of the same type of cationically polymerizable components is the largest.

芳香族環氧化合物(A1)意指包含芳香環之環氧化合物,本發明之硬化性組成物中,含有多官能芳香族環氧化合物以及單官能芳香族環氧化合物兩者。 The aromatic epoxy compound (A1) means an epoxy compound containing an aromatic ring, and the curable composition of the present invention contains both a polyfunctional aromatic epoxy compound and a monofunctional aromatic epoxy compound.

作為單官能芳香族環氧化合物,有舉出酚、甲酚、丁基酚等之酚化合物或其伸烷基氧加成物之單環氧丙基醚;間苯二酚或氫醌、兒茶酚等具有2個以上酚性羥基之芳香族化合物之單環氧丙基醚化物;苯基二甲醇或苯基二乙醇、苯基二丁醇等之具有2個以上醇性羥基之芳香族化合物之單環氧丙基醚化物;苯二甲酸、對苯二甲酸、苯三甲酸等具有2個以上羧酸之多鹼基酸芳香族化合物之 單環氧丙基酯;安息香酸之環氧丙基酯、氧化苯乙烯或二乙烯苯之單環氧化物等。 As monofunctional aromatic epoxy compounds, there are phenol compounds such as phenol, cresol, and butylphenol or monoglycidyl ether of alkylene oxide adducts; resorcinol, hydroquinone, and Monoglycidyl etherate of aromatic compounds with two or more phenolic hydroxyl groups such as tea phenol; aromatic compounds with two or more alcoholic hydroxyl groups such as phenyldimethanol, phenyldiethanol, and phenyldibutanol Compound monoglycidyl etherate; phthalic acid, terephthalic acid, trimellitic acid and other polybasic acid aromatic compounds with more than 2 carboxylic acid monoglycidyl esters; benzoic acid epoxy Monoepoxide of propyl ester, styrene oxide or divinylbenzene, etc.

作為多官能芳香族環氧化合物,有舉出雙酚A、雙酚F等至少具有1個芳香族環之多元酚或其伸烷基氧加成物之聚環氧丙基醚化物;環氧酚醛樹脂;間苯二酚或氫醌、兒茶酚等之具有2個以上酚性羥基之芳香族化合物之聚環氧丙基醚化物;苯基二甲醇或苯基二乙醇、苯基二丁醇等之具有2個以上醇性羥基之芳香族化合物之聚環氧丙基醚化物;苯二甲酸、對苯二甲酸、苯三甲酸等之具有2個以上羧酸之多鹼基酸芳香族化合物之聚環氧丙基酯;二乙烯苯之二環氧化物等。 Examples of polyfunctional aromatic epoxy compounds include polyglycidyl etherate of polyphenols having at least one aromatic ring, such as bisphenol A and bisphenol F, or their alkylene oxide adducts; epoxy Phenolic resin; polyglycidyl etherate of aromatic compounds with more than two phenolic hydroxyl groups such as resorcinol, hydroquinone, catechol, etc.; phenyl dimethanol or phenyl diethanol, phenyl dibutyl Polyglycidyl etherate of aromatic compounds with two or more alcoholic hydroxyl groups such as alcohols; polybasic acid aromatics with two or more carboxylic acids such as phthalic acid, terephthalic acid, trimellitic acid, etc. Polyglycidyl ester of compound; Diepoxide of divinylbenzene, etc.

多官能芳香族環氧化合物與單官能芳香族環氧化合物之比例為相對於多官能芳香族環氧化合物100質量份,單官能芳香族環氧化合物為20~50質量份,尤其是30~40質量份以低黏度、塗布性以及反應性之觀點來說較佳。 The ratio of the polyfunctional aromatic epoxy compound to the monofunctional aromatic epoxy compound is relative to 100 parts by mass of the polyfunctional aromatic epoxy compound, and the monofunctional aromatic epoxy compound is 20-50 parts by mass, especially 30-40 parts by mass. The part by mass is preferable from the viewpoints of low viscosity, coatability, and reactivity.

作為芳香族環氧化合物(A1),能夠使用市售品,有舉例如Denacor EX-146、Denacor EX-147、Denacor EX-201、Denacor EX-203、Denacor EX-711、Denacor EX-721、On Court EX-1020、On Court EX-1030、On Court EX-1040、On Court EX-1050、On Court EX-1051、On Court EX-1010、On Court EX-1011、On Court 1012(Nagase ChemteX(股)公司製);Ogsol PG-100、Ogsol EG-200、Ogsol EG-210、Ogsol EG-250(大阪Gas chemical(股)公司製);HP4032、HP4032D、HP4700(DIC(股)公司製);ESN-475V(新日鐵住金化學(股)公司製);Epikote YX8800(三菱化學(股)公司製);Marproof G-0105SA、Marproof G-0130SP(日油(股)公司製);Epiclon N-665、Epiclon HP-7200(DIC(股)公司製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-7000L(日本化藥(股)公司製);Adeka Glycyrrole ED-509s、Adeka Glycyrrole ED-501、Adeka Resin EP-4000、Adeka Resin EP-4005、Adeka Resin EP-4100、Adeka Resin EP-4901((股)ADEKA公司製);TECHMORE VG-3101L((股)Printech公司製)等。作為上述芳香族環氧化合物(A1),為多官能由於硬化性優異故較佳。 As the aromatic epoxy compound (A1), commercially available products can be used, for example, Denacor EX-146, Denacor EX-147, Denacor EX-201, Denacor EX-203, Denacor EX-711, Denacor EX-721, On Court EX-1020, On Court EX-1030, On Court EX-1040, On Court EX-1050, On Court EX-1051, On Court EX-1010, On Court EX-1011, On Court 1012 (Nagase ChemteX (shares) Company system); Ogsol PG-100, Ogsol EG-200, Ogsol EG-210, Ogsol EG-250 (manufactured by Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700 (manufactured by DIC Co., Ltd.); ESN- 475V (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); Epikote YX8800 (manufactured by Mitsubishi Chemical Co., Ltd.); Marproof G-0105SA, Marproof G-0130SP (manufactured by NOF Corporation); Epiclon N-665, Epiclon HP-7200 (made by DIC Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC -7000L (manufactured by Nippon Kayaku Co., Ltd.); Adeka Glycyrrole ED-509s, Adeka Glycyrrole ED-501, Adeka Resin EP-4000, Adeka Resin EP-4005, Adeka Resin EP-4100, Adeka Resin EP-4901 (( (Stock) ADEKA Corporation); TECHMORE VG-3101L ((Stock) Printech Corporation), etc. As the above-mentioned aromatic epoxy compound (A1), it is preferable to be polyfunctional because it is excellent in curability.

相對於陽離子聚合性成分(A)100質量份,芳香族環氧化合物(A1)為20~80質量份,尤其是30~50質量份,由於黏度、塗布性、反應性以及硬化性之提升,故較佳。且,如上述,主成分意指混合複數種陽離子聚合性成分,相同種類之陽離子聚合性成分的合計最多者。 Relative to 100 parts by mass of the cationically polymerizable component (A), the aromatic epoxy compound (A1) is 20 to 80 parts by mass, especially 30 to 50 parts by mass. Due to the increase in viscosity, coatability, reactivity and curability, So better. In addition, as described above, the main component means a mixture of a plurality of cationically polymerizable components, and the total of the same type of cationically polymerizable components is the largest.

脂肪族環氧丙基化合物(A2)意指沒有被分類為前述芳香族環氧化合物(A1)或後述脂環式環氧化合物(A5)之環氧化合物,作為脂肪族環氧丙基化合物(A2)之具體例,有舉出脂肪族醇之環氧丙基醚化物、烷基羧酸之環氧丙基酯等之單官能環氧化合物、或脂肪族多元醇或其伸 烷基氧加成物之聚環氧丙基醚化物、脂肪族長鏈多鹼基酸之聚環氧丙基酯等之多官能環氧化合物。作為代表性化合物,有舉出烯丙基環氧丙基醚、丁基環氧丙基醚、2-乙基己基環氧丙基醚、C12~13混合烷基環氧丙基醚、1,4-丁二醇二環氧丙基醚、1,6-己二醇二環氧丙基醚、新戊二醇二環氧丙基醚、丙三醇之三環氧丙基醚、三羥甲基丙烷之三環氧丙基醚、山梨醇之四環氧丙基醚、二新戊四醇之六環氧丙基醚、聚乙二醇之二環氧丙基醚、聚丙二醇之二環氧丙基醚等之多元醇之環氧丙基醚、或對丙二醇、三羥甲基丙烷、丙三醇等之脂肪族多元醇加成1種或2種以上伸烷基氧所得之聚醚多醇之聚環氧丙基醚化物、脂肪族長鏈二鹼基酸之二環氧丙基酯。進而有舉出脂肪族高級醇之單環氧丙基醚或高級脂肪酸之環氧丙基酯、環氧化大豆油、環氧硬脂酸辛酯、環氧硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。 The aliphatic glycidyl compound (A2) means an epoxy compound that is not classified as the aforementioned aromatic epoxy compound (A1) or the later-mentioned alicyclic epoxy compound (A5), as an aliphatic glycidyl compound ( Specific examples of A2) include monofunctional epoxy compounds such as glycidyl etherate of aliphatic alcohols, glycidyl esters of alkyl carboxylic acids, or aliphatic polyols or their alkylene oxides. Polyfunctional epoxy compounds such as polyglycidyl etherate and polyglycidyl ester of aliphatic long-chain polybasic acid. Representative compounds include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12-13 mixed alkyl glycidyl ether, 1, 4-Butanediol Diglycidyl Ether, 1,6-Hexanediol Diglycidyl Ether, Neopentyl Glycol Diglycidyl Ether, Triglycidyl Ether of Glycerol, Trihydroxy Triglycidyl ether of methyl propane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dineopentyl erythritol, diglycidyl ether of polyethylene glycol, and two of polypropylene glycol Glycidyl ether of polyhydric alcohols such as glycidyl ether, or aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane, glycerol, etc., by adding one or more alkylene oxides Polyglycidyl etherate of ether polyol, diglycidyl ester of aliphatic long-chain dibasic acid. Furthermore, there are monoglycidyl ethers of aliphatic higher alcohols or glycidyl esters of higher fatty acids, epoxidized soybean oil, octyl epoxy stearate, butyl epoxy stearate, epoxidized soybean oil, Epoxidized polybutadiene and so on.

作為脂肪族環氧丙基化合物(A2),為脂肪族醇之環氧丙基醚化物或脂肪族多元醇或其伸烷基氧加成物之聚環氧丙基醚化物由於黏度、塗布性以及反應性會提升,故較佳。 As the aliphatic glycidyl compound (A2), it is the glycidyl etherate of aliphatic alcohol or the polyglycidyl etherate of aliphatic polyol or its alkylene oxide adduct due to viscosity and coating properties And the reactivity will be improved, so it is better.

作為脂肪族環氧丙基化合物(A2),能夠使用市售品,有舉例如Denacor EX-121、Denacor EX-171、Denacor EX-192、Denacor EX-211、Denacor EX-212、Denacor EX-313、Denacor EX-314、Denacor EX-321、Denacor EX-411、Denacor EX-421、Denacor EX-512、 Denacor EX-521、Denacor EX-611、Denacor EX-612、Denacor EX-614、Denacor EX-622、Denacor EX-810、Denacor EX-811、Denacor EX-850、Denacor EX-851、Denacor EX-821、Denacor EX-830、Denacor EX-832、Denacor EX-841、Denacor EX-861、Denacor EX-911、Denacor EX-941、Denacor EX-920、Denacor EX-931(Nagase ChemteX(股)公司製);Epolight M-1230、Epolight 40E、Epolight 100E、Epolight 200E、Epolight 400E、Epolight 70P、Epolight 200P、Epolight 400P、Epolight 1500NP、Epolight 1600、Epolight 80MF、Epolight 100MF(共榮社化學(股)公司製)、Adeka Glycyrrole ED-503、Adeka Glycyrrole ED-503G、Adeka Glycyrrole ED-506、Adeka Glycyrrole ED-523T、Adeka Resin EP-4088S、Adeka Resin EP-4080E((股)ADEKA公司製)等。 As the aliphatic glycidyl compound (A2), commercially available products can be used, for example, Denacor EX-121, Denacor EX-171, Denacor EX-192, Denacor EX-211, Denacor EX-212, Denacor EX-313 , Denacor EX-314, Denacor EX-321, Denacor EX-411, Denacor EX-421, Denacor EX-512, Denacor EX-521, Denacor EX-611, Denacor EX-612, Denacor EX-614, Denacor EX-622 , Denacor EX-810, Denacor EX-811, Denacor EX-850, Denacor EX-851, Denacor EX-821, Denacor EX-830, Denacor EX-832, Denacor EX-841, Denacor EX-861, Denacor EX-911 , Denacor EX-941, Denacor EX-920, Denacor EX-931 (manufactured by Nagase ChemteX Co., Ltd.); Epolight M-1230, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P , Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF (manufactured by Kyoeisha Chemical Co., Ltd.), Adeka Glycyrrole ED-503, Adeka Glycyrrole ED-503G, Adeka Glycyrrole ED-506, Adeka Glycyrrole ED-523T, Adeka Resin EP-4088S, Adeka Resin EP-4080E (made by ADEKA Corporation), etc.

相對於陽離子硬化性成分(A)100質量份,脂肪族環氧丙基化合物(A2)為1~70質量份,尤其是10~30質量份由於黏度、塗布性以及反應性會提升,故較佳。 Relative to 100 parts by mass of the cationic curable component (A), the aliphatic epoxypropyl compound (A2) is 1 to 70 parts by mass, especially 10 to 30 parts by mass. The viscosity, coating properties and reactivity will increase, so it is more good.

環氧丙烷化合物(A3)含有2個以上環氧丙烷基包含在同一分子內之多官能環氧丙烷化合物與1個環氧丙烷基包含在同一分子內之一官能環氧丙烷化合物之任一者。作為環氧丙烷化合物(A3),有舉出3,7-雙(3-環氧丙烷基)-5-氧雜-壬酮、1,4-雙[(3-乙基-3-環氧丙烷基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-環氧丙烷基甲氧基)甲基]乙烷、 1,3-雙[(3-乙基-3-環氧丙烷基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-環氧丙烷基甲基)醚、三乙二醇雙(3-乙基-3-環氧丙烷基甲基)醚、四乙二醇雙(3-乙基-3-環氧丙烷基甲基)醚、1,4-雙(3-乙基-3-環氧丙烷基甲氧基)丁烷、1,6-雙(3-乙基-3-環氧丙烷基甲氧基)己烷等之多官能環氧丙烷化合物、3-乙基-3-[(苯氧基)甲基]環氧丙烷、3-乙基-3-(己氧基甲基)環氧丙烷、3-乙基-3-(2-乙基己氧基甲基)環氧丙烷、3-乙基-3-(羥基甲基)環氧丙烷、3-乙基-3-(氯甲基)環氧丙烷等之一官能環氧丙烷化合物等。此等能夠單獨使用1種或組合2種以上來使用,多官能環氧丙烷化合物由於硬化物之硬化性以及密著性較高,故較佳。 The propylene oxide compound (A3) contains two or more propylene oxide groups contained in the same molecule, a multifunctional propylene oxide compound contained in the same molecule, and one propylene oxide group contained in the same molecule, either one functional propylene oxide compound . As the propylene oxide compound (A3), 3,7-bis(3-epoxypropylene)-5-oxa-nonanone, 1,4-bis[(3-ethyl-3-epoxy Propylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-glycidylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl -3-glycidyl methoxy) methyl) propane, ethylene glycol bis(3-ethyl-3-glycidyl methyl) ether, triethylene glycol bis(3-ethyl-3- Glycidyl methyl) ether, tetraethylene glycol bis(3-ethyl-3-glycidyl methyl) ether, 1,4-bis(3-ethyl-3-glycidyl methoxy) Multifunctional propylene oxide compounds such as 1,6-bis(3-ethyl-3-glycidylmethoxy)hexane, 3-ethyl-3-((phenoxy) Methyl) propylene oxide, 3-ethyl-3-(hexyloxymethyl) propylene oxide, 3-ethyl-3-(2-ethylhexyloxymethyl) propylene oxide, 3-ethyl Monofunctional propylene oxide compounds such as 3-(hydroxymethyl)propylene oxide and 3-ethyl-3-(chloromethyl)propylene oxide. These can be used singly or in combination of two or more, and the polyfunctional propylene oxide compound is preferred because of the high curability and adhesion of the cured product.

作為環氧丙烷化合物(A3),能夠使用市售品,有舉例如Aaron Oxetane OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成(股)公司製)、Ethanacol OXBP、OXTP(宇部興產(股)公司製)等。 As the propylene oxide compound (A3), commercially available products can be used, and for example, Aaron Oxetane OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (Toagosei Co., Ltd. ) Company system), Ethanacol OXBP, OXTP (Ube Industries Co., Ltd. system), etc.

相對於陽離子硬化性成分(A)100質量份,環氧丙烷化合物(A3)為1~70質量份,尤其是10~40質量份由於黏度、塗布性以及反應性會提升,故較佳。 The propylene oxide compound (A3) is 1 to 70 parts by mass, especially 10 to 40 parts by mass, relative to 100 parts by mass of the cationic curable component (A), because the viscosity, coatability, and reactivity are improved, so it is preferable.

具有陽離子聚合性取代基之重量平均分子量1,000~30,000之聚合物(A4)(以下亦稱作「聚合物(A4)」)只要是側鏈具有陽離子聚合性取代基即可,主鏈之骨架並無特別限制,但以將具有乙烯性不飽和鍵結之化合物單聚合或共聚合者較佳。陽離子聚合性取代基意指顯示環氧基 或環氧丙烷基。 A polymer (A4) with a weight average molecular weight of 1,000 to 30,000 (hereinafter also referred to as "polymer (A4)") having a cationically polymerizable substituent, as long as the side chain has a cationically polymerizable substituent, and the backbone of the main chain It is not particularly limited, but it is preferable to monopolymerize or copolymerize the compound having an ethylenically unsaturated bond. The cationically polymerizable substituent means an epoxy group or a propylene oxide group.

作為聚合物(A4),有舉出將下述一般式(I)所表示之單體單聚合者、將下述一般式(I)所表示之複數單體共聚合者、將下述一般式(II)所表示之單體單聚合者、將下述一般式(I)所表示之複數單體共聚合者、將下述一般式(I)所表示之單體與下述一般式(II)所表示之單體共聚合。 As the polymer (A4), there are exemplified those obtained by monopolymerizing monomers represented by the following general formula (I), those obtained by copolymerizing plural monomers represented by the following general formula (I), and those having the following general formula (I). (II) The monomer represented by the monomer is polymerized alone, the plural monomer represented by the following general formula (I) is copolymerized, and the monomer represented by the following general formula (I) is combined with the following general formula (II) ) Copolymerization of the monomers.

Figure 106120786-A0202-12-0010-1
Figure 106120786-A0202-12-0010-1

於此,式中,X為碳原子數1~7之烷基、碳原子數1~7之烷氧基、碳原子數6~12之芳基、碳原子數6~12之芳氧基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自環氧基以及環氧丙烷基所成群中1種以上之基取代者。 Here, in the formula, X is an alkyl group with 1 to 7 carbon atoms, an alkoxy group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms, an aryloxy group with 6 to 12 carbon atoms, or The alicyclic hydrocarbon group having 6 to 10 carbon atoms, or the hydrogen atom in these groups is substituted with one or more groups selected from the group consisting of epoxy groups and propylene oxide groups.

Figure 106120786-A0202-12-0010-2
Figure 106120786-A0202-12-0010-2

式中,R1表示氫原子、甲基或鹵原子,X’為碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基、或此等之基中的氫原子經選自環氧基以及環氧丙烷基所成群中1種以上之基取代者。 In the formula, R 1 represents a hydrogen atom, a methyl group or a halogen atom, X'is an alkyl group with 1 to 7 carbon atoms, an aryl group with 6 to 12 carbon atoms or an alicyclic hydrocarbon group with 6 to 10 carbon atoms, Or the hydrogen atoms in these groups are substituted with one or more groups selected from the group consisting of epoxy groups and propylene oxide groups.

作為式(I)中之X所表示之碳原子數1~7之烷 基,有舉出甲基、乙基、丙基、iso-丙基、丁基、sec-丁基、tert-丁基、iso-丁基、戊基、iso-戊基、tert-戊基、己基、2-己基、3-己基、環己基、4-甲基環己基、庚基、2-庚基、3-庚基、iso-庚基、tert-庚基等。此等之中,碳原子數1~4之烷基、或部分經選自環氧基以及環氧丙烷基所成群中1種以上之基取代之碳原子數1~4之烷基,以硬化性之觀點來說,較佳。 Examples of the alkyl group having 1 to 7 carbon atoms represented by X in the formula (I) include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl , Iso-butyl, pentyl, iso-pentyl, tert-pentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl Base, iso-heptyl, tert-heptyl, etc. Among these, an alkyl group with 1 to 4 carbon atoms, or an alkyl group with 1 to 4 carbon atoms partially substituted by one or more groups selected from the group consisting of epoxy and propylene oxide groups, From the viewpoint of hardening properties, it is preferable.

作為式(I)中之X所表示之碳原子數1~7之烷氧基,甲氧基、乙氧基、丙氧基、iso-丙氧基、丁氧基、sec-丁氧基、tert-丁氧基、iso-丁氧基、戊氧基、iso-戊氧基、tert-戊氧基、己氧基、2-己氧基、3-己氧基、環己氧基、4-甲基環己氧基、庚氧基、2-庚氧基、3-庚氧基、iso-庚氧基、tert-庚氧基等。此等之中,碳原子數1~4之烷基、或部分經選自環氧基以及環氧丙烷基所成群中1種以上之基取代之碳原子數1~4之烷氧基以硬化性之觀點來說,較佳。 As the alkoxy group having 1 to 7 carbon atoms represented by X in the formula (I), methoxy, ethoxy, propoxy, iso-propoxy, butoxy, sec-butoxy, tert-butoxy, iso-butoxy, pentoxy, iso-pentoxy, tert-pentoxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4 -Methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert-heptyloxy, etc. Among these, an alkyl group with 1 to 4 carbon atoms, or an alkoxy group with 1 to 4 carbon atoms partially substituted by one or more groups selected from the group consisting of epoxy and propylene oxide groups From the viewpoint of hardening properties, it is preferable.

作為式(I)中之X所表示之碳原子數6~12之芳基,有舉出苯基、甲基苯基、萘基等。 Examples of the aryl group having 6 to 12 carbon atoms represented by X in the formula (I) include a phenyl group, a methylphenyl group, and a naphthyl group.

作為式(I)中之X所表示之碳原子數6~12之芳氧基,有舉出苯氧基、甲基苯氧基、萘氧基等。 Examples of the aryloxy group having 6 to 12 carbon atoms represented by X in the formula (I) include a phenoxy group, a methylphenoxy group, and a naphthoxy group.

作為式(I)中之X所表示之碳原子數6~10之脂環式烴基,有舉出環己基、甲基環己基、降莰基、雙環戊基、雙環辛基、三甲基雙環庚基、三環辛基、三環癸基、旋環狀辛基、旋環狀雙環戊基、金剛烷基、異莰基等。 As the alicyclic hydrocarbon group with 6 to 10 carbon atoms represented by X in the formula (I), there are cyclohexyl, methylcyclohexyl, norbornyl, dicyclopentyl, bicyclooctyl, trimethylbicyclo Heptyl, tricyclooctyl, tricyclodecyl, cyclic octyl, cyclic bicyclopentyl, adamantyl, isobornyl, etc.

式(I)中,X之一部分經環氧基或環氧丙烷基取代時,作為式(I)所表示之單體,有舉例如下述式(1)~(3)所表示之單體。 In the formula (I), when a part of X is substituted with an epoxy group or a propylene oxide group, examples of the monomer represented by the formula (I) include monomers represented by the following formulas (1) to (3).

Figure 106120786-A0202-12-0012-3
Figure 106120786-A0202-12-0012-3

式中,R2表示氫原子或碳原子數1~6之烷基,m為1~6之整數。 In the formula, R 2 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and m is an integer of 1 to 6.

Figure 106120786-A0202-12-0012-4
Figure 106120786-A0202-12-0012-4

式中,R3表示氫原子或碳原子數1~6之烷基,n為1~6之整數。 In the formula, R 3 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 6.

Figure 106120786-A0202-12-0012-5
Figure 106120786-A0202-12-0012-5

式中,R4表示氫原子或碳原子數1~6之烷基,s為1~6之整數。 In the formula, R 4 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and s is an integer of 1 to 6.

式(II)中,作為R1所表示之鹵原子,有舉出氟、氯、溴、碘等。 In the formula (II), examples of the halogen atom represented by R 1 include fluorine, chlorine, bromine, and iodine.

式(II)中,X’之一部分經環氧基或環氧丙烷基 取代時,作為式(II)所表示之單體,有舉出下述式(4)~(6)所表示者。 In the formula (II), when a part of X'is substituted with an epoxy group or a propylene oxide group, examples of the monomer represented by the formula (II) include those represented by the following formulas (4) to (6).

Figure 106120786-A0202-12-0013-6
Figure 106120786-A0202-12-0013-6

式中,R1與上述式(II)相同,R5表示氫原子或碳原子數1~6之烷基,t為1~6之整數。 In the formula, R 1 is the same as the above formula (II), R 5 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and t is an integer of 1 to 6.

Figure 106120786-A0202-12-0013-7
Figure 106120786-A0202-12-0013-7

式中,R1與上述式(II)相同,R6表示氫原子或碳原子數1~6之烷基,q為1~6之整數。 In the formula, R 1 is the same as the above formula (II), R 6 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and q is an integer of 1 to 6.

Figure 106120786-A0202-12-0013-8
Figure 106120786-A0202-12-0013-8

式中,R1與上述式(II)相同,R7表示氫原子或碳原子數1~6之烷基,y為1~6之整數。 In the formula, R 1 is the same as the above formula (II), R 7 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and y is an integer of 1 to 6.

聚合物(A4)中,構成該聚合物之單體的使用比例係,上述X為經選自環氧基以及環氧丙烷基所成群中1種以上之基取代之碳原子數1~7之烷基、碳原子數6~12之 芳基或碳原子數6~10之脂環式烴基時,上述(I)或(II)所表示之單體相對於構成該聚合物之單體的合計100質量%,以成為10~100質量%來使用,由於密著性會提升,故較佳。 In the polymer (A4), the ratio of the monomers constituting the polymer is used. The above X is the number of carbon atoms of 1-7 substituted by one or more groups selected from the group consisting of epoxy groups and propylene oxide groups When the alkyl group, the aryl group with 6 to 12 carbon atoms, or the alicyclic hydrocarbon group with 6 to 10 carbon atoms, the monomer represented by (I) or (II) above is relative to the monomer constituting the polymer The total amount is 100% by mass, and it is used as 10-100% by mass. Since the adhesion improves, it is preferable.

作為構成聚合物(A4)之單體,能夠將具有羥基或羧基之乙烯性不飽和化合物與(I)或(II)所表示之單體併用,由於密著性會提升,故較佳。 As a monomer constituting the polymer (A4), an ethylenically unsaturated compound having a hydroxyl group or a carboxyl group can be used in combination with the monomer represented by (I) or (II), and the adhesion is improved, which is preferable.

相對於陽離子硬化性成分(A)100質量份,上述聚合物(A4)為1~20質量份,尤其是3~10質量份,由於黏度、塗布性以及反應性會提升,故較佳。 The amount of the polymer (A4) is 1-20 parts by mass, especially 3-10 parts by mass, relative to 100 parts by mass of the cationic curable component (A), since viscosity, coatability, and reactivity are improved, so it is preferable.

脂環式環氧化合物(A5)意指不介隔鍵結基直接於飽和環上鍵結環氧乙烷環者,作為該脂環式環氧化合物之具體例,有舉出藉由將至少具有1個脂環式環之多元醇之聚環氧丙基醚化物或含環己烯或環戊烯環之化合物以氧化劑進行環氧化所得之含氧化環己烯或氧化環戊烯之化合物。有舉例如3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯、3,4-環氧-1-甲基環己基-3,4-環氧-1-甲基己烷羧酸酯、6-甲基-3,4-環氧環己基甲基-6-甲基-3,4-環氧環己烷羧酸酯、3,4-環氧-3-甲基環己基甲基-3,4-環氧-3-甲基環己烷羧酸酯、3,4-環氧-5-甲基環己基甲基-3,4-環氧-5-甲基環己烷羧酸酯、雙(3,4-環氧環己基甲基)己二酸酯、3,4-環氧-6-甲基環己烷羧酸酯、伸甲基雙(3,4-環氧環己烷)、丙烷-2,2-二基-雙(3,4-環氧環己烷)、2,2-雙(3,4-環氧環己基)丙烷、二環氧化二環戊二烯、乙烯雙(3,4-環氧環己烷 羧酸酯)、環氧六氫苯二甲酸二辛酯、環氧六氫苯二甲酸二-2-乙基己酯、1-環氧乙基-3,4-環氧環己烷、1,2-環氧-2-環氧乙基環己烷、α-氧化蒎烯、二氧化檸檬烯等。作為脂環式環氧化合物,3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯或3,4-環氧-1-甲基環己基-3,4-環氧-1-甲基己烷羧酸酯以密著性提升之觀點來看,故較佳。 The alicyclic epoxy compound (A5) means one that directly bonds an oxirane ring to a saturated ring without interposing a bonding group. As a specific example of the alicyclic epoxy compound, there are Polyglycidyl etherate of a polyhydric alcohol with one alicyclic ring or cyclohexene or cyclopentene ring-containing compound obtained by epoxidizing cyclohexene oxide or cyclopentene oxide-containing compound with an oxidizing agent. For example, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1- Methyl hexane carboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexane carboxylate, 3,4-epoxy-3 -Methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexane carboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5 -Methylcyclohexane carboxylate, bis(3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexane carboxylate, ethylene bis (3,4-epoxycyclohexane), propane-2,2-diyl-bis(3,4-epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane , Diepoxydicyclopentadiene, ethylene bis(3,4-epoxycyclohexane carboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethyl epoxyhexahydrophthalate Base hexyl ester, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide, etc. As an alicyclic epoxy compound, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate or 3,4-epoxy-1-methylcyclohexyl-3,4- Epoxy-1-methylhexane carboxylate is preferable from the viewpoint of improving adhesion.

作為脂環式環氧化合物(A5),能夠使用市售品,有舉例如Celloxide 2021P、Celloxide 2081、Celloxide 2000、Celloxide 3000((股)Daicel公司製)等。 As an alicyclic epoxy compound (A5), a commercially available product can be used, for example, Celloxide 2021P, Celloxide 2081, Celloxide 2000, Celloxide 3000 (made by Daicel Corporation) etc. are mentioned.

相對於陽離子硬化性成分(A)100質量份,上述脂環式環氧化合物(A5)為0~30質量份,尤其是0~20質量份由於黏度、塗布性以及反應性會提升,故較佳。 Relative to 100 parts by mass of the cationic curable component (A), the above-mentioned alicyclic epoxy compound (A5) is 0-30 parts by mass, especially 0-20 parts by mass. The viscosity, coating properties and reactivity will increase, so it is more good.

作為乙烯醚化合物(A6),有舉例如二乙二醇單乙烯醚、三乙二醇二乙烯醚、n-十二基乙烯醚、環己基乙烯醚、2-乙基己基乙烯醚、2-氯乙基乙烯醚、乙基乙烯醚、異丁基乙烯醚、三乙二醇乙烯醚、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、1,6-環己烷二甲醇單乙烯醚、乙二醇二乙烯醚、1,4-丁二醇二乙烯醚、1,6-環己烷二甲醇二乙烯醚等。 As the vinyl ether compound (A6), there are, for example, diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2- Chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol mono Vinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexanedimethanol divinyl ether, etc.

本發明硬化性組成物相關之陽離子聚合起始劑(B)意指只要是藉由能量線照射或加熱能夠放出使陽離子聚合起始之物質的化合物,其中任一者皆可,較佳為藉由能量線之照射放出路易斯酸之鎓鹽之複鹽、或其衍生物。作為相關之化合物的代表,能夠舉出下述一般式 [A]r+[B]r- The cationic polymerization initiator (B) related to the curable composition of the present invention means a compound that can release a substance that initiates cationic polymerization by energy ray irradiation or heating, any of them may be used, preferably by The irradiation of energy rays releases the double salt of the onium salt of Lewis acid or its derivative. As a representative of related compounds, the following general formula [A] r+ [B] r-

所表示之陽離子與陰離子之鹽。 The cation and anion salts shown.

於此,陽離子[A]r+為鎓較佳,其構造能夠以例如下述一般式[(R8)aQ]r+ Here, the cation [A] r+ is preferably onium, and its structure can be, for example, the following general formula [(R 8 ) a Q] r+

所表示。 Represented.

進而,於此,R8為碳原子數1~60,且亦可含有數個碳原子以外之原子之有機基。a為1~5之整數。a個R8亦可各自獨立且亦可相同或相異。且,至少1個為具有芳香環之如上述之有機基較佳。Q為選自S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成群中之原子或原子團。且,將陽離子[A]r+中之Q的原子價設為q時,必需要滿足成為r=a-q之關係(惟,N=N當作原子價為0)。 Furthermore, here, R 8 is an organic group having 1 to 60 carbon atoms and several atoms other than carbon atoms. a is an integer from 1 to 5. A R 8 may be independent of each other and may be the same or different. In addition, at least one of them is preferably an organic group as described above having an aromatic ring. Q is an atom or group of atoms selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N=N. Moreover, when the valence of Q in the cation [A] r+ is set to q, the relationship of r=aq must be satisfied (however, N=N is regarded as the valence of 0).

且,陰離子[B]r-為鹵化物錯體較佳,其構造能夠以例如下述一般式[LYb]r- In addition, the anion [B] r- is preferably a halide complex, and its structure can be, for example, the following general formula [LY b ] r-

所表示。 Represented.

進而,L為鹵化物錯體之中心原子之金屬或半金屬(Metalloid),為B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y為鹵原子。b為3~7之整數。且,將陰離子[B]r-中之L的原子價設為p時,必須要滿足成為r=b-p之關係。 Furthermore, L is the metal or semimetal (Metalloid) of the central atom of the halide complex, which is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr , Mn, Co, etc. Y is a halogen atom. b is an integer of 3-7. Moreover, when the valence of L in the anion [B] r- is set to p, the relationship of r=bp must be satisfied.

作為一般式之陰離子[LYb]r-之具體例,能夠舉出肆(五氟苯基)硼酸鹽、四(3,5-二氟-4-甲氧基苯基)硼 酸鹽、四氟硼酸鹽(BF4)-、六氟膦酸鹽(PF6)-、六氟銻酸鹽(SbF6)-、六氟砷酸鹽(AsF6)-、六氯銻酸鹽(SbCl6)-等。 As specific examples of the general formula of the anion [LYb] r- , four (pentafluorophenyl) borate, tetra(3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroborate Salt (BF 4 ) - , hexafluorophosphonate (PF 6 ) - , hexafluoroantimonate (SbF 6 ) - , hexafluoroarsenate (AsF 6 ) - , hexachloroantimonate (SbCl 6 ) - Wait.

且,陰離子[B]r-能夠使用下述一般式[LYb-1(OH)]r- In addition, the anion [B] r- can use the following general formula [LY b-1 (OH)] r-

所表示之構造者較佳。L、Y、b與上述相同。且,作為其他能夠使用之陰離子,能夠舉出過氯酸離子(ClO4)-、三氟甲基亞硫酸離子(CF3SO3)-、氟磺酸離子(FSO3)-、甲苯磺酸陰離子、三硝苯磺酸陰離子、樟腦磺酸磺酸鹽、壬氟丁烷磺酸鹽、六十氯辛烷磺酸鹽、四芳基硼酸鹽、肆(五氟苯基)硼酸鹽等。 The structure shown is better. L, Y, and b are the same as above. And, as other anions that can be used, perchlorate ion (ClO 4 ) - , trifluoromethyl sulfite ion (CF 3 SO 3 ) - , fluorosulfonic acid ion (FSO 3 ) - , toluene sulfonic acid ion Anion, trinitrobenzene sulfonic acid anion, camphor sulfonate, nonfluorobutane sulfonate, hexachlorooctane sulfonate, tetraaryl borate, tetrakis (pentafluorophenyl) borate, etc.

本發明之硬化性組成物中,在如此之鎓鹽中,使用下述(甲)~(丙)之芳香族鎓鹽特別有效。此等之中,能夠單獨使用其1種,或混合2種以上來使用。 In the curable composition of the present invention, among such onium salts, it is particularly effective to use the following aromatic onium salts (A) to (C). Among these, one kind can be used alone, or two or more kinds can be mixed and used.

(甲)苯基重氮六氟磷酸鹽、4-甲氧基苯基重氮六氟銻酸鹽、4-甲基苯基重氮六氟磷酸鹽等之芳基重氮鹽 (A) Phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate and other aryl diazonium salts

(乙)二苯基錪鎓六氟銻酸鹽、二(4-甲基苯基)錪鎓六氟磷酸鹽、二(4-tert-丁基苯基)錪鎓六氟磷酸鹽、甲苯基異丙苯基錪鎓肆(五氟苯基)硼酸鹽等之二芳基錪鎓鹽 (B) Diphenyl iodonium hexafluoroantimonate, bis(4-methylphenyl) iodonium hexafluorophosphate, bis(4-tert-butylphenyl) iodonium hexafluorophosphate, tolyl Diaryl phosphonium salts such as cumyl phosphonium (pentafluorophenyl) borate

(丙)下述群I或群II所表示之鋶陽離子與六氟銻離子、六氟膦酸鹽離子、肆(五氟苯基)硼酸鹽離子等之鋶鹽 (C) The sulfonium cation represented by the following group I or group II, hexafluoroantimony ion, hexafluorophosphonate ion, tetrakis (pentafluorophenyl) borate ion, etc.

Figure 106120786-A0202-12-0018-9
Figure 106120786-A0202-12-0018-9

Figure 106120786-A0202-12-0019-10
Figure 106120786-A0202-12-0019-10

且,作為其他較佳者,能夠舉出(η5-2,4-環戊二烯-1-基)〔(1,2,3,4,5,6-η)-(1-甲基乙基)苯〕-鐵-六氟磷酸鹽等之鐵-芳烴錯體、或參(乙醯丙酮酸鹽)鋁、參(乙基丙酮酸根乙酸鹽)鋁、參(柳醛甲醚)鋁等之鋁錯體與三苯基矽醇等之矽醇類之混合物;噻吩鎓鹽、四氫噻吩鎓鹽、苯苄基銨、吡啶鹽、肼酸鹽等之鹽;二乙烯三胺、三乙烯三胺、四乙烯五胺等之聚烷基聚胺類;1,2-二胺環己烷、1,4-二胺-3,6-二乙基環己烷、異佛爾酮二胺等之脂環式聚胺類;m-二甲苯撐基二胺、二胺二苯甲烷、二胺二苯碸等之芳香族聚胺類;將上述聚胺類、與苯基環氧丙基醚、丁基環氧丙基醚、雙酚A-二環氧丙基醚、雙酚F-二環氧丙基醚等之環氧丙基醚類或羧酸之環氧丙基酯類等各種環氧樹 脂藉由常法使其反應所製造之聚環氧加成改質物;將上述有機聚胺類、與苯二甲酸、異苯二甲酸、二體酸等之羧酸類藉由常法使其反應所製造之醯胺化改質物;將上述聚胺類、與甲醛等之醛類以及酚、甲酚、二甲酚、第三丁基酚、間苯二酚等之核具有至少一個醛化反應性之處之酚類藉由常法使其反應所製造之曼尼斯化(Mannich reaction)改質物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊烷二酸、2-甲基辛烷二酸、3,8-二甲基癸烷二酸、3,7-二甲基癸烷二酸、加氫二體酸、二體酸等之脂肪族二羧酸類;苯二甲酸、對苯二甲酸、異苯二甲酸、萘二羧酸等之芳香族二羧酸類;環己烷二羧酸等之脂環式二羧酸類;偏苯三甲酸、對稱苯三甲酸、蓖麻油脂肪酸之三聚物等之三羧酸類;苯均四酸等之四羧酸類等)之酸酐;二氰二胺、咪唑類、羧酸酯、磺酸酯、胺基亞胺等。 And, as another preferable one, (η 5 -2,4-cyclopentadien-1-yl) [(1,2,3,4,5,6-η)-(1-methyl (Ethyl)benzene]-iron-hexafluorophosphate and other iron-arene complexes, or ginseng (acetylpyruvate) aluminum, ginseng (ethylpyruvate acetate) aluminum, ginseng (salaldehyde methyl ether) aluminum A mixture of aluminum complexes such as triphenylsilanol and silanols such as triphenylsilanol; thiophenium salt, tetrahydrothiophenium salt, phenylbenzylammonium, pyridinium, hydrazine, etc.; diethylenetriamine, triphenylsilanol Polyalkyl polyamines such as ethylene triamine and tetraethylene pentamine; 1,2-diamine cyclohexane, 1,4-diamine-3,6-diethyl cyclohexane, isophorone two Alicyclic polyamines such as amines; aromatic polyamines such as m-xylylene diamine, diamine diphenylmethane, and diamine diphenyl benzene; combining the above polyamines with phenyl glycidyl Glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether, etc. or glycidyl esters of carboxylic acid Polyepoxy adduct modified products made by reacting various epoxy resins by conventional methods; combining the above-mentioned organic polyamines with carboxylic acids such as phthalic acid, isophthalic acid, and diacids by conventional methods. Method to make the aminated modified product produced by the reaction; the above-mentioned polyamines, aldehydes such as formaldehyde, and phenol, cresol, xylenol, tertiary butylphenol, resorcinol, etc. have at least the core A Mannich reaction modifier produced by the reaction of phenols in a formaldehyde-reactive place by conventional methods; polycarboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid) , Pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methyl Fats such as pentanedioic acid, 2-methyloctanedioic acid, 3,8-dimethyldecanedioic acid, 3,7-dimethyldecanedioic acid, hydrogenated dimer acid, dimer acid, etc. Aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; trimellitic acid , Tricarboxylic acid, tricarboxylic acid, trimer of castor oil fatty acid; tetracarboxylic acid, pyromellitic acid, etc.) anhydride; dicyandiamine, imidazole, carboxylic acid ester, sulfonic acid ester, amine Base imine and so on.

此等之中,以實用面與光感度提升之觀點來看,使用芳香族錪鎓鹽、芳香族鋶鹽、鐵-芳烴錯體較佳,相對於陽離子聚合起始劑(B)100質量%,至少含有0.1質量%以上之具有下述構造之芳香族鋶鹽再較佳。 Among these, from the viewpoint of practicality and light sensitivity improvement, it is preferable to use aromatic phosphonium salts, aromatic sulfonium salts, and iron-arene complexes, which are 100% by mass relative to the cationic polymerization initiator (B) It is more preferable to contain at least 0.1% by mass or more of an aromatic sulfonium salt having the following structure.

Figure 106120786-A0202-12-0021-11
Figure 106120786-A0202-12-0021-11

於此,式中、R11、R12、R13、R14、R15、R16、R17、R18、R19以及R20分別獨立表示氫原子、鹵原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R21、R22、R23以及R24各自獨立表示氫原子、鹵原子或碳原子數1~10之烷基,R25表示氫原子、鹵原子、碳原子數1~10之烷基或選自下述化學式(A)~(C)中任一者之取代基,Anq-表示q價之陰離子,p表示將電荷成為中性之係數。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 and R 20 each independently represent a hydrogen atom, a halogen atom, and the number of carbon atoms is 1-10 The alkyl group, the alkoxy group with 1 to 10 carbon atoms or the ester group with 2 to 10 carbon atoms, R 21 , R 22 , R 23 and R 24 each independently represent a hydrogen atom, a halogen atom or a carbon atom number of 1~ An alkyl group of 10, R 25 represents a hydrogen atom, a halogen atom, an alkyl group with 1 to 10 carbon atoms, or a substituent selected from any one of the following chemical formulas (A) to (C), An q- represents a valence of q The anion, p represents the coefficient of making the charge neutral.

Figure 106120786-A0202-12-0021-12
Figure 106120786-A0202-12-0021-12

於此,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38以及R39各自獨立表示氫原子、鹵原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳 原子數2~10之酯基,R30、R31、R32、R33以及R34各自獨立表示氫原子、鹵原子或碳原子數1~10之烷基,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38以及R39所表示之基的氫原子亦可經鹵原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、巰基、異氰酸酯基、含雜環之基取代,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38以及R39所表示之基中的伸甲基亦可經-O-、-CO-、-COO-、-OCO-、-S-、-SO2-、-SCO-或-COS-取代。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 each independently represent a hydrogen atom, a halogen atom, an alkyl group with 1 to 10 carbon atoms, and one with 1 to 10 carbon atoms An alkoxy group or an ester group with 2 to 10 carbon atoms, R 30 , R 31 , R 32 , R 33 and R 34 each independently represent a hydrogen atom, a halogen atom or an alkyl group with 1 to 10 carbon atoms, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 The hydrogen atoms of the groups represented by, R 35 , R 36 , R 37 , R 38 and R 39 can also pass through halogen atoms, nitro groups, cyano groups, hydroxyl groups, amino groups, carboxyl groups, methacrylic groups, and acrylic groups , Epoxy, vinyl, mercapto, isocyanate, heterocyclic-containing group substitution, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38, and R 39 in the group represented by the methylene group may also be -O-, -CO-, -COO-, -OCO-, -S-, -SO 2 -, -SCO- or -COS- substitution.

一般式(1)所表示之化合物中,作為R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38以及R39所表示之鹵原子,有舉出氟、氯、溴、碘等。 In the compound represented by general formula (1), as R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 The halogen atom includes fluorine, chlorine, bromine, iodine and the like.

作為R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38以及R39所表示之碳原子數1~10之烷基,有舉出甲基、乙基、丙基、異丙基、丁基、異丁基、s-丁基、t-丁基、戊基、異戊基、t-戊基、己基、庚基、辛基、異辛基、2-乙基己基、t-辛基、壬基、異壬基、癸基以及異癸基等。 As R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 represent an alkyl group with 1-10 carbon atoms, There are methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, t-butyl, pentyl, isopentyl, t-pentyl, hexyl, heptyl, Octyl, isooctyl, 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl and isodecyl, etc.

作為R11、R12、R13、R14、R15、R16、R17、 R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38以及R39所表示之碳原子數1~10之烷氧基,有舉出甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、s-丁氧基、t-丁氧基、異丁氧基、戊氧基、異戊氧基、t-戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃基氧基、四氫哌喃基氧基、2-甲氧基乙基氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲基硫基乙氧基、三氟甲氧基等。 As R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent alkoxy groups with 1 to 10 carbon atoms. Examples include methoxy, ethoxy, propoxy, and isopropoxy. Oxy, butoxy, s-butoxy, t-butoxy, isobutoxy, pentoxy, isopentoxy, t-pentoxy, hexyloxy, cyclohexyloxy, cyclohexyl Methoxy, tetrahydrofuranyloxy, tetrahydropiperanyloxy, 2-methoxyethyloxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxy Ethoxy, methoxyethoxyethoxy, methoxyethoxyethoxyethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy Base and so on.

作為R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38以及R39所表示之碳原子數2~10之酯基,有舉出甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、t-丁基羰基氧基、甲氧基乙醯基氧基、苯甲醯氧基等。 As R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 represent ester groups with 2 to 10 carbon atoms, including methoxycarbonyl, ethoxycarbonyl, and isopropoxycarbonyl , Phenoxycarbonyl, acetoxy, propoxy, butoxy, chloroacetoxy, dichloroacetoxy, trichloroacetoxy, trifluoroacetoxy, t- Butylcarbonyloxy, methoxyacetoxy, benzyloxy and the like.

相對於上述陽離子聚合性成分(A)之陽離子聚合起始劑(B)的使用比例相對於陽離子聚合性成分(A)100質量份,陽離子聚合起始劑(B)為1~10質量份,較佳為2~8質量份。若過少,則硬化容易變得較不充分,若過多,則有時會對硬化物之吸水率或硬化物強度等各種物性帶來不良影響。 The use ratio of the cationic polymerization initiator (B) relative to the cationic polymerizable component (A) is 1 to 10 parts by mass relative to 100 parts by mass of the cationic polymerizable component (A), and the cationic polymerization initiator (B) is 1 to 10 parts by mass, Preferably it is 2-8 mass parts. If it is too small, the hardening is likely to be insufficient. If it is too large, it may adversely affect various physical properties such as the water absorption rate and the strength of the hardened product.

本發明之硬化性組成物中,因應必要,能夠進一步使用增感劑以及/或增感助劑。增感劑會對比陽離 子聚合起始劑(B)所表示之極大吸收波長更長之波長顯示極大吸收,是促進陽離子聚合起始劑(B)所引起之聚合起始反應之化合物。且,增感助劑是進一步促進增感劑之作用之化合物。 In the curable composition of the present invention, a sensitizer and/or a sensitization aid can be further used as necessary. The sensitizer exhibits maximum absorption at longer wavelengths than the maximum absorption wavelength indicated by the cationic polymerization initiator (B), and is a compound that promotes the polymerization initiation reaction caused by the cationic polymerization initiator (B). In addition, the sensitizer is a compound that further promotes the effect of the sensitizer.

作為增感劑以及增感助劑,有舉出蔥系化合物、萘系化合物等。 As the sensitizer and the sensitization aid, there are scallion-based compounds, naphthalene-based compounds and the like.

作為蔥系化合物,有舉例如下述式(7)所表示者。 Examples of the onion-based compound include those represented by the following formula (7).

Figure 106120786-A0202-12-0024-13
Figure 106120786-A0202-12-0024-13

於此,式(7)中,R50以及R51各自獨立表示氫原子、碳原子數1~6之烷基或碳原子數2~12之烷氧基烷基,R52表示氫原子或碳原子數1~6之烷基。 Here, in formula (7), R 50 and R 51 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxyalkyl group having 2 to 12 carbon atoms, and R 52 represents a hydrogen atom or carbon Alkyl group with 1 to 6 atoms.

舉出式(7)所表示之蔥系化合物之具體例,有如下述之化合物。 Specific examples of the onion-based compound represented by the formula (7) include the following compounds.

有舉例如9,10-二甲氧基蔥、9,10-二乙氧基蔥、9,10-二丙氧基蔥、9,10-二異丙氧基蔥、9,10-二丁氧基蔥、9,10-二戊氧基蔥、9,10-二己氧基蔥、9,10-雙(2-甲氧基乙氧基)蔥、9,10-雙(2-乙氧基乙氧基)蔥、9,10-雙(2-丁氧基乙氧基)蔥、9,10-雙(3-丁氧基丙氧基)蔥、2-甲基-或2-乙基-9,10-二甲氧基蔥、2-甲基-或2-乙基-9,10-二乙氧基蔥、2-甲基-或2-乙基-9,10-二丙氧基蔥、2-甲基-或2-乙 基-9,10-二異丙氧基蔥、2-甲基-或2-乙基-9,10-二丁氧基蔥、2-甲基-或2-乙基-9,10-二戊氧基蔥、2-甲基-或2-乙基-9,10-二己氧基蔥等。 For example, 9,10-dimethoxy onion, 9,10-diethoxy onion, 9,10-dipropoxy onion, 9,10-diisopropoxy onion, 9,10-dibutyl onion Onion, 9,10-dipentyloxy onion, 9,10-dihexoxy onion, 9,10-bis(2-methoxyethoxy) onion, 9,10-bis(2-ethyl Oxyethoxy) shallot, 9,10-bis(2-butoxyethoxy) shallot, 9,10-bis(3-butoxypropoxy) shallot, 2-methyl- or 2- Ethyl-9,10-dimethoxy onion, 2-methyl- or 2-ethyl-9,10-diethoxy onion, 2-methyl- or 2-ethyl-9,10-di Propoxy onions, 2-methyl- or 2-ethyl-9,10-diisopropoxy onions, 2-methyl- or 2-ethyl-9,10-dibutoxy onions, 2- Methyl-or 2-ethyl-9,10-dipentyloxy onion, 2-methyl-or 2-ethyl-9,10-dihexyloxy onion, etc.

作為萘系化合物,有舉例如下述式(8)所表者。 Examples of the naphthalene-based compound include those represented by the following formula (8).

Figure 106120786-A0202-12-0025-14
Figure 106120786-A0202-12-0025-14

於此,式(8)中,R53以及R54各自獨立表示碳原子數1~6之烷基。 Here, in formula (8), R 53 and R 54 each independently represent an alkyl group having 1 to 6 carbon atoms.

舉出式(8)所表示之萘系化合物之具體例,有舉出如下述之化合物。 Specific examples of the naphthalene-based compound represented by the formula (8) include the following compounds.

有舉例如4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 Examples include 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyl Oxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene , 1,4-Dibutoxynaphthalene, etc.

相對於陽離子聚合性成分(A),增感劑以及增感助劑之使用比例並無特別限定,在不阻礙本發明目的之範圍內,只要以往一般的使用比例來使用即可,例如,相對於陽離子聚合性成分(A)之100重量份,增感劑以及增感助劑分別為0.1~3質量份,以硬化性提升之觀點來看,故較佳。 Relative to the cationic polymerizable component (A), the use ratio of the sensitizer and the sensitization aid is not particularly limited. As long as it does not hinder the purpose of the present invention, it can be used in a conventional general use ratio, for example, relatively Based on 100 parts by weight of the cationically polymerizable component (A), the sensitizer and the sensitizer auxiliary are each 0.1 to 3 parts by mass, which is preferable from the viewpoint of improving the hardenability.

本發明之硬化性組成物中,能夠因應必要使 用矽烷偶合劑。作為矽烷偶合劑,能夠使用例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等之烷基官能性烷氧基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等之烯基官能性烷氧基矽烷、3-甲丙烯氧基丙基三乙氧基矽烷、3-甲丙烯氧基丙基三甲氧基矽烷、3-甲丙烯氧基丙基甲基二乙氧基矽烷、3-甲丙烯氧基丙基甲基二甲氧基矽烷、2-甲丙烯氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等之環氧官能性烷氧基矽烷、N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等之胺基官能性烷氧基矽烷、γ-巰基丙基三甲氧基矽烷等之巰基官能性烷氧基矽烷、四異丙氧化鈦、四正丁氧化鈦等之烷氧化鈦類、鈦二辛氧基雙(伸辛基甘醇酸酯)、鈦二異丙氧基雙(乙基乙醯乙酸酯)等之鈦鉗合物類、鋯四乙醯丙酮酸酯、鋯三丁氧基單乙醯丙酮酸酯等之鋯鉗合物類、鋯三丁氧基單硬脂酸酯等之鋯乙醯酯類、甲基三異氰酸酯矽烷等之異氰酸酯矽烷類等。 In the curable composition of the present invention, a silane coupling agent can be used as necessary. As the silane coupling agent, for example, dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, and methyltrimethoxysilane can be used. Alkyl functional alkoxysilanes such as methyl silane, methyl triethoxy silane, ethyl trimethoxy silane, ethyl trimethoxy silane, etc., vinyl trichlorosilane, vinyl trimethoxy silane, vinyl Alkenyl functional alkoxysilanes such as triethoxysilane, allyltrimethoxysilane, etc., 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane , 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane, γ-epoxy Epoxy function of propoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc. Alkoxysilane, N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyl Amino-functional alkoxysilanes such as trimethoxysilane, mercapto-functional alkoxysilanes such as γ-mercaptopropyl trimethoxysilane, titanium alkoxides such as titanium tetraisopropoxide, titanium tetra-n-butoxide, etc. Type, titanium dioctyl oxy bis (octyl glycolate), titanium diisopropoxy bis (ethyl acetyl acetate) and other titanium clamp compounds, zirconium tetraacetyl pyruvate, Zirconium clamp compounds such as zirconium tributoxy monoacetate pyruvate, zirconium acetyl esters such as zirconium tributoxy monostearate, isocyanate silanes such as methyl triisocyanate silane, etc.

矽烷偶合劑之使用量並無特別限定,一般相對於硬化性組成物中之固形物之全量100質量份,為0.01~20質量份之範圍。 The amount of the silane coupling agent used is not particularly limited, and it is generally in the range of 0.01 to 20 parts by mass relative to 100 parts by mass of the total amount of solids in the curable composition.

本發明之硬化性組成物,能夠因應必要,藉由使用熱可塑性有機聚合物來改善硬化物之特性。作為熱可塑性有機聚合物,有舉例如聚苯乙烯、聚甲基甲基丙烯酸酯、甲基甲基丙烯酸酯乙基丙烯酸酯共聚合物、甲基甲基丙烯酸酯環氧丙基甲基丙烯酸酯共聚合物、聚(甲基)丙烯酸、苯乙烯-(甲基)丙烯酸共聚合物、(甲基)丙烯酸-甲基甲基丙烯酸酯共聚合物、環氧丙基(甲基)丙烯酸酯-聚甲基(甲基)丙烯酸酯共聚合物、聚乙烯基丁醛、纖維素酯、聚丙烯醯基醯胺、飽和聚酯等。 The curable composition of the present invention can improve the characteristics of the cured product by using a thermoplastic organic polymer as necessary. As the thermoplastic organic polymer, there are, for example, polystyrene, polymethmethacrylate, methacrylate ethyl acrylate copolymer, methacrylate glycidyl methacrylate Copolymer, poly(meth)acrylic acid, styrene-(meth)acrylic acid copolymer, (meth)acrylic acid-methmethacrylate copolymer, glycidyl (meth)acrylate- Polymethyl (meth)acrylate copolymer, polyvinyl butyral, cellulose ester, polyacrylamide, saturated polyester, etc.

本發明之硬化性組成物中並沒有特別限制,能夠使用一般所使用之能夠將上述(A)以及(B)各成分溶解或分散之溶媒。作為溶媒,有舉例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等之酮類;乙基醚、二氧陸圜、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲基醚、二丙二醇二甲基醚等之醚系溶媒;乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、單異丁酸酯等之酯系溶媒;乙二醇單甲基醚、乙二醇單乙基醚等之賽珞蘇系溶媒;甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等之醇系溶媒;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲基醚-2-乙酸酯(PGMEA)、二丙二醇單甲基醚乙酸酯、3-甲氧基丁基乙酸酯、乙氧基乙基丙酸酯等之醚酯系溶媒;苯、甲苯、二甲苯等之BTX系溶媒;己烷、 庚烷、辛烷、環己烷等之脂肪族烴系溶媒;松節油、D-檸檬烯、蒎烯等之萜烯系烴油;礦油精、Swazole#310(Cosmo松山石油(股)公司製)、Solvesso#100(Exxon化學社)等之石蠟系溶媒;四氯化碳、氯仿、三氯乙烯、氯化甲烷、1,2-二氯乙烷等之鹵化脂肪族烴系溶媒;氯苯等之鹵化芳香族烴系溶媒;丙烯碳酸酯、卡必醇系溶媒、苯胺、三乙基胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮、二甲基亞碸、水等。此等之溶媒能夠作為1種或2種以上之混合溶媒來使用。 The curable composition of the present invention is not particularly limited, and a generally used solvent capable of dissolving or dispersing the above-mentioned (A) and (B) components can be used. Examples of solvents include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone. Class; Ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether, etc. System solvent; methyl acetate, ethyl acetate, -n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, monoisobutyrate, etc. Ester solvents of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, etc. Celosine solvents; methanol, ethanol, iso- or n-propanol, iso- or n-butanol, pentanol Alcohol solvents such as ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether Ether ester solvents such as acetate, 3-methoxybutyl acetate, and ethoxyethyl propionate; BTX solvents such as benzene, toluene, xylene, etc.; hexane, heptane, octane Aliphatic hydrocarbon solvents such as, cyclohexane; terpene hydrocarbon oils such as turpentine, D-limonene and pinene; mineral spirits, Swazole#310 (manufactured by Cosmo Songshan Petroleum Co., Ltd.), Solvesso#100( Exxon Chemical Corporation) and other paraffin-based solvents; halogenated aliphatic hydrocarbon solvents such as carbon tetrachloride, chloroform, trichloroethylene, chlorinated methane, 1,2-dichloroethane, etc.; halogenated aromatic hydrocarbons such as chlorobenzene Solvents; acrylic carbonate, carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, water, etc. These solvents can be used as a mixed solvent of one type or two or more types.

本發明之硬化性組成物由於硬化性、密著性、液保存安定性會提升,故水分量為5質量份以下較佳,為3質量份以下再較佳。若水分過多,會有白濁或成分析出之虞,故較不佳。 Since the curable composition of the present invention has improved curability, adhesion, and liquid storage stability, the water content is preferably 5 parts by mass or less, and more preferably 3 parts by mass or less. If there is too much water, it may become cloudy or may be out of components, so it is not good.

本發明之硬化性組成物中,能夠因應必要,進一步使用紫外線吸收劑、或常溫下為惰性且藉由特定溫度的加熱.光照射.酸等會使保護基脫離並被活性化而表現紫外線吸收能之化合物。 In the curable composition of the present invention, an ultraviolet absorber can be further used as necessary, or it is inert at room temperature and heated by a specific temperature. Light exposure. Acids, etc., will detach the protective group and be activated to exhibit ultraviolet absorbing energy.

且,只要不損及本發明效果,能夠因應必要添加自由基聚合性單、自由基聚合起始劑、多元醇、無機填料、有機填料、顏料、染料等之著色劑、消泡劑、增黏劑、界面活性劑、平整劑、難燃劑、觸變劑、稀釋劑、可塑劑、安定劑、聚合禁止劑、紫外線吸收劑、抗氧化劑、抗靜電劑、流動調整劑、接著促進劑等之各種樹脂添加物 等。 Moreover, as long as the effect of the present invention is not impaired, coloring agents such as radical polymerizable monomers, radical polymerization initiators, polyols, inorganic fillers, organic fillers, pigments, dyes, etc., antifoaming agents, and thickening agents can be added as necessary. Among other agents, surfactants, leveling agents, flame retardants, thixotropic agents, thinners, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, adhesion promoters, etc. Various resin additives, etc.

本發明之硬化性組成物以軋輥塗布、帷幕塗布、各種印刷、浸漬等之公知之手段適用於支持基體上。且,一旦實施於薄膜等之支持基體上後,也能夠轉印在其他支持基體上,其適用方法並無限制。 The curable composition of the present invention is applied to a supporting substrate by known means such as roll coating, curtain coating, various printing, and dipping. Moreover, once it is applied to a supporting substrate such as a film, it can also be transferred to other supporting substrates, and the method of application is not limited.

作為上述支持基體之材料,並無特別限制,能夠使用一般所使用者,有舉例如玻璃等之無機材料;二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯基丙醯基纖維素、硝化纖維素等之纖維素酯;聚醯胺;聚亞胺;聚氨基甲酸酯;環氧樹脂;聚碳酸酯;聚乙烯對苯二甲酸酯、聚乙烯萘二甲酸酯、聚丁烯對苯二甲酸酯、聚-1,4-環己烷二伸甲基對苯二甲酸酯、聚乙烯-1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚丁烯對苯二甲酸酯等之聚酯;聚苯乙烯;聚乙烯、聚丙烯、聚甲基戊烯等之聚烯烴;聚乙酸乙烯酯、聚氯化乙烯酯、聚氟化乙烯酯等之乙烯化合物;聚甲基甲基丙烯酸酯、聚丙烯酸酯等之丙烯酸系樹脂;聚碳酸酯;聚碸;聚醚碸;聚醚酮;聚醚亞胺;聚氧基乙烯、降莰烯樹脂、環烯烴聚合物(COP)等之高分子材料。且,亦可對上述支持基體進行電暈放電處理、火炎處理、紫外線處理、高頻率處理、輝光放電處理、活性電漿處理、雷射處理等之表面活性化處理。 There are no particular restrictions on the material of the above-mentioned support matrix, and general users can be used, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), propyl cellulose , Butyl cellulose, acetyl propyl cellulose, nitrocellulose and other cellulose esters; Polyamide; Polyimine; Polyurethane; Epoxy resin; Polycarbonate; Polyethylene terephthalate Formate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexane dimethylene terephthalate, polyethylene-1,2-di Polyesters such as phenoxyethane-4,4'-dicarboxylate and polybutylene terephthalate; Polystyrene; Polyolefins such as polyethylene, polypropylene, and polymethylpentene; Vinyl compounds such as polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; acrylic resins such as polymethylmethacrylate, polyacrylate, etc.; polycarbonate; Ether ketone; polyether imine; polyoxyethylene, norbornene resin, cyclic olefin polymer (COP) and other polymer materials. Furthermore, surface activation treatments such as corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, and laser treatment may also be performed on the above-mentioned support substrate.

藉由能量線之照射使本發明硬化性組成物硬化之方法中,作為能量線,能夠舉出紫外線、電子線、X 線、放射線、高頻率等,紫外線在經濟上最佳。作為紫外線之光源,有舉出紫外線雷射、水銀燈、氙雷射、金屬鹵化物燈等。 In the method of curing the curable composition of the present invention by irradiation of energy rays, examples of the energy rays include ultraviolet rays, electron rays, X-rays, radiation rays, high frequency, etc., and ultraviolet rays are economically optimal. As the light source of ultraviolet rays, there are ultraviolet lasers, mercury lamps, xenon lasers, metal halide lamps, and the like.

藉由加熱使本發明硬化性組成物硬化之方法中的條件為於70~250℃下1~100分鐘。預烘焙(PAB;Pre applied bake)後,亦可加壓再後烘焙(PEB;Postexposure bake),亦可以相異數個階段之溫度來烘焙。加熱條件會因各成分之種類以及摻混比例而異,但例如於70~180℃下,若是烤箱為5~15分鐘,若是熱盤為1~5分鐘。之後,為了使塗膜硬化,於180~250℃下,較佳於200~250℃下,若是烤箱為30~90分鐘,若是熱盤為5~30分鐘藉由加熱處理,能夠得到硬化膜。 The conditions in the method of hardening the curable composition of the present invention by heating are at 70 to 250°C for 1 to 100 minutes. After pre-bake (PAB; Pre applied bake), it can also be pressurized and then post-bake (PEB; Postexposure bake), or it can be bake at different temperatures in several stages. The heating conditions will vary depending on the types of ingredients and the mixing ratios, but for example, at 70-180°C, it takes 5 to 15 minutes for the oven, and 1 to 5 minutes for the hot plate. After that, in order to harden the coating film, the cured film can be obtained by heat treatment at 180-250°C, preferably 200-250°C, 30-90 minutes in the oven, and 5-30 minutes in the hot plate.

作為本發明之硬化性組成物或其硬化物的具體用途,能夠舉出接著劑、偏光板用接著劑、眼鏡、拍攝用鏡頭所代表之光學材料、塗料、塗布劑、襯料劑、油漆、光阻、液狀光阻、印刷版、彩色電視、PC監測器、行動資訊終端機、數位相機、有機EL、觸控式面板等之顯示元件、絕緣清漆、絕緣薄片、積層板、印刷基盤、半導體裝置用.LED封裝用.液晶注入口用.有機EL用.光元件用.電氣絕緣用.電子零件用.分離膜用等之封止劑、成形材料、黏結劑、玻璃纖維含浸劑、填加劑、半導體用.太陽電池用等之鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置之背光所使用之稜鏡鏡片薄片、投影式電視等之螢幕所使用之菲涅爾鏡片薄片、雙凸鏡片薄片等之鏡片薄片之鏡片 部分、或使用如此之薄片之背光等、微透鏡等之光學鏡片、光學元件、光連接器、光波導管、光學性造形用注型劑等。 Specific uses of the curable composition of the present invention or its cured product include adhesives, adhesives for polarizing plates, glasses, optical materials represented by lenses for photographing, paints, coating agents, lining agents, paints, Photoresist, liquid photoresist, printing plates, color TVs, PC monitors, mobile information terminals, digital cameras, organic EL, touch panels and other display components, insulating varnishes, insulating sheets, laminates, printing substrates, For semiconductor devices. For LED packaging. For liquid crystal injection port. For organic EL. For optical components. For electrical insulation. For electronic parts. Sealants, molding materials, adhesives, glass fiber impregnation agents, fillers, and semiconductors for separation membranes. Passivation films, interlayer insulating films, protective films for solar cells, etc., lens sheets used in backlights of liquid crystal display devices, Fresnel lens sheets used in screens of projection TVs, etc., lenticular lens sheets, etc. The lens part of the sheet, or the backlight, etc. using such a sheet, the optical lens such as the micro lens, optical element, optical connector, optical waveguide, optical molding injection, etc.

作為本發明之顯示裝置,因應必要能在透明支持體上設置底塗層、反射防止層、偏光元件層、位相差層、雙折射率層、光散射層、硬塗層、潤滑層、保護層等之各層者,能夠於各層使用本發明硬化物而成之薄膜。 As the display device of the present invention, a primer layer, a reflection prevention layer, a polarizing element layer, a retardation layer, a birefringence layer, a light scattering layer, a hard coating layer, a lubricating layer, and a protective layer can be provided on the transparent support as necessary. For each layer, a film made of the cured product of the present invention can be used for each layer.

以下,舉出實施例等進一步詳細地說明本發明,但本發明不限定於此等之實施例。 Hereinafter, the present invention will be explained in further detail with examples and the like, but the present invention is not limited to these examples.

[實施例1~16、比較例1~7] [Examples 1 to 16, Comparative Examples 1 to 7]

以下述[表1]~[表3]所示之摻混量充分混合各成分,得到各實施例1~16之硬化性組成物以及比較例1~7之硬化性組成物。且,實施例以及比較例之單位為質量份。 The components were thoroughly mixed in the blending amounts shown in the following [Table 1] to [Table 3] to obtain the curable composition of each of Examples 1 to 16 and the curable composition of Comparative Examples 1 to 7. In addition, the units of Examples and Comparative Examples are parts by mass.

作為陽離子聚合性成分(A),使用下述化合物A1-1~A1-5、A2-1~A2-2、A3-1、A4-1以及A5-1。 As the cationically polymerizable component (A), the following compounds A1-1 to A1-5, A2-1 to A2-2, A3-1, A4-1, and A5-1 were used.

化合物A1-1:雙酚型二環氧丙基醚 Compound A1-1: Bisphenol type diglycidyl ether

化合物A1-2:Adeka Glycyrrole ED-509S((股)ADEKA公司製單官能芳香族環氧化合物) Compound A1-2: Adeka Glycyrrole ED-509S (monofunctional aromatic epoxy compound manufactured by ADEKA)

化合物A1-3:Adeka Glycyrrole ED-501((股)ADEKA公司製單官能芳香族環氧化合物) Compound A1-3: Adeka Glycyrrole ED-501 (monofunctional aromatic epoxy compound manufactured by ADEKA)

化合物A1-4:鄰烯丙基苯基環氧丙基醚 Compound A1-4: o-allyl phenyl glycidyl ether

化合物A1-5:鄰苯基酚環氧丙基醚 Compound A1-5: o-phenylphenol glycidyl ether

化合物A2-1:新戊二醇二環氧丙基醚 Compound A2-1: Neopentyl glycol diglycidyl ether

化合物A2-2:1,4-丁二醇二環氧丙基醚 Compound A2-2: 1,4-Butanediol Diglycidyl Ether

化合物A3-1:Aaron Oxetane OXT-221(東亞合成(股)公司製) Compound A3-1: Aaron Oxetane OXT-221 (manufactured by Toagosei Co., Ltd.)

化合物A4-1:甲基甲基丙烯酸酯75質量份與環氧丙基甲基丙烯酸酯25質量份之共聚合物(重量平均分子量7,000) Compound A4-1: Copolymer of 75 parts by mass of methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 7,000)

化合物A5-1:Celloxide 2021P((股)Daicel公司製脂環式環氧化合物) Compound A5-1: Celloxide 2021P (alicyclic epoxy compound manufactured by Daicel)

化合物A5-2:二氧化檸檬烯 Compound A5-2: Limonene Dioxide

作為陽離子聚合起始劑(B),使用下述化合物(B-1)。 As the cationic polymerization initiator (B), the following compound (B-1) was used.

化合物B-1:下述式(9)所表示之化合物以及下述式(10)所表示之化合物之混合物之丙烯碳酸酯50%溶液 Compound B-1: Propylene carbonate 50% solution of a mixture of the compound represented by the following formula (9) and the compound represented by the following formula (10)

Figure 106120786-A0202-12-0032-15
Figure 106120786-A0202-12-0032-15

Figure 106120786-A0202-12-0032-16
Figure 106120786-A0202-12-0032-16

(密著性) (Adhesion)

將上述所得之實施例1~16以及比較例1~7之硬化性組成物分別塗布於一片PMMA薄膜(住友化學(股):Technology 125S001)上之後,再與另一片之施予電暈放電處理之COP(環烯烴聚合物、日本Zeon(股)製:產品編號Zeonor film 14-060)薄膜使用貼合機來貼合,使用無電極紫外光燈,照射相當於1000mJ/cm2之光穿越COP薄膜來接著,得到試驗片。進行所得之試驗片之90度剝離試驗。只要是密著性為1.0N/cm以上之硬化性組成物,能夠作為偏光板用接著劑來使用,較佳為密著性為2.0N/cm以上,再較佳之密著性為3.0N/cm以上。將所得之結果一併記載於表1~3。 The curable compositions of Examples 1 to 16 and Comparative Examples 1 to 7 obtained above were respectively coated on a piece of PMMA film (Sumitomo Chemical Co., Ltd.: Technology 125S001), and then subjected to corona discharge treatment with the other piece of PMMA film (Sumitomo Chemical Co., Ltd.: Technology 125S001). COP (Cyclic Olefin Polymer, Japan Zeon Co., Ltd.: Product Code Zeonor film 14-060) film is laminated using a laminating machine, using an electrodeless UV lamp, irradiating the equivalent of 1000mJ/cm 2 of light through the COP The film is attached to obtain a test piece. A 90-degree peel test of the obtained test piece was performed. As long as it is a curable composition with an adhesion of 1.0 N/cm or more, it can be used as an adhesive for polarizing plates. Preferably, the adhesion is 2.0 N/cm or more, and the adhesion is more preferably 3.0 N/cm. cm above. Record the results obtained in Tables 1 to 3.

(硬化性) (Hardening)

製作上述試驗片時,配合硬化性進行確認。將照射後塗布面馬上成為無黏性者評價為++,將5分鐘後成為無黏性者評價為+,將15分鐘後殘留黏性者評價為-。硬化性為++或+之硬化性組成物能夠作為偏光板用接著劑來使用,硬化性為++之硬化性組成物能夠作為偏光板用接著劑來使用特別佳,硬化性為-之硬化性組成物無法作為偏光板用接著劑來使用。將所得之結果一併記載於表1~3。 When preparing the above test piece, it was confirmed with the curability. It was evaluated as ++ if the coated surface became tack-free immediately after irradiation, + was evaluated as being non-sticky after 5 minutes, and-was evaluated as remaining sticky after 15 minutes. The curable composition with curability of ++ or + can be used as an adhesive for polarizing plates, and the curable composition with curability of ++ can be used as an adhesive for polarizing plates. The curable composition is particularly good for curing with- The sexual composition cannot be used as an adhesive for polarizing plates. Record the results obtained in Tables 1 to 3.

(塗布性) (Coatability)

將實施例1~16以及比較例1~7之硬化性組成物分別塗布於1片PMMA薄膜(住友化學(股):Technology 125S001)後,再與另一片之施予電暈放電處理之COP(環烯烴聚合物,日本Zeon(股)製:產品編號Zeonor film 14-060)薄膜使用貼合機來貼合,使用無電極紫外光燈,照射相當於1000mJ/cm2之光穿越COP薄膜來接著,得到試驗片。觀察所得之樣本外觀,將沒有凹凸或氣泡者設為○,將有凹凸或氣泡者設為×。塗布性為○之硬化性組成物能夠作為偏光板用接著劑來使用,塗布性為×之硬化性組成物無法作為偏光板用接著劑來使用。 The curable compositions of Examples 1 to 16 and Comparative Examples 1 to 7 were respectively coated on one sheet of PMMA film (Sumitomo Chemical Co., Ltd.: Technology 125S001), and then combined with another sheet of COP( Cycloolefin polymer, manufactured by Zeon (Japan): Product No. Zeonor film 14-060) The film is laminated using a laminating machine, using an electrodeless UV lamp, irradiating the equivalent of 1000mJ/cm 2 of light through the COP film for bonding , Get the test piece. Observe the appearance of the obtained sample, and set the ones with no unevenness or bubbles as ○, and the ones with unevenness or bubbles as ×. The curable composition whose coatability is ○ can be used as an adhesive for polarizing plates, and the curable composition whose coatability is × cannot be used as an adhesive for polarizing plates.

由[表1]~[表3]可明確得知本發明之硬化性組成物之硬化物之密著性較優異。 From [Table 1] to [Table 3], it is clear that the hardened product of the curable composition of the present invention has excellent adhesion.

Claims (7)

一種硬化性組成物,其特徵為含有陽離子聚合性成分(A)100質量份、與陽離子聚合起始劑(B)1~10質量份之硬化性組成物中,前述陽離子聚合性成分(A)係將芳香族環氧化合物(A1),與脂肪族環氧丙基化合物(A2),與環氧丙烷化合物(A3),與具有陽離子聚合性取代基之重量平均分子量1,000~30,000之聚合物(A4)作為必要成分,前述芳香族環氧化合物(A1)為前述陽離子聚合性成分(A)之主成分,且含有多官能芳香族環氧化合物以及單官能芳香族環氧化合物,相對於前述多官能芳香族環氧化合物100質量份,前述單官能芳香族環氧化合物為30~50質量份。 A curable composition characterized by containing 100 parts by mass of a cationic polymerizable component (A) and 1-10 parts by mass of a cationic polymerization initiator (B), the aforementioned cationic polymerizable component (A) The aromatic epoxy compound (A1), the aliphatic epoxy propyl compound (A2), and the propylene oxide compound (A3), and a polymer with a weight average molecular weight of 1,000 to 30,000 ( A4) As an essential component, the aromatic epoxy compound (A1) is the main component of the cationically polymerizable component (A), and contains a polyfunctional aromatic epoxy compound and a monofunctional aromatic epoxy compound, which is more than the aforementioned 100 parts by mass of the functional aromatic epoxy compound, and 30 to 50 parts by mass of the aforementioned monofunctional aromatic epoxy compound. 如請求項1之硬化性組成物,其中,進一步含有脂環式環氧化合物(A5)作為前述陽離子聚合性成分(A)。 The curable composition according to claim 1, which further contains an alicyclic epoxy compound (A5) as the cationically polymerizable component (A). 如請求項1之硬化性組成物,其中,前述環氧丙烷化合物(A3)為多官能環氧丙烷化合物。 The curable composition according to claim 1, wherein the propylene oxide compound (A3) is a polyfunctional propylene oxide compound. 如請求項2之硬化性組成物,其中,前述環氧丙烷化合物(A3)為多官能環氧丙烷化合物。 The curable composition according to claim 2, wherein the propylene oxide compound (A3) is a polyfunctional propylene oxide compound. 一種硬化性組成物之硬化方法,其特徵為對如請求項 1~4中任一項之硬化性組成物照射活性能線。 A hardening method of hardening composition, which is characterized by The curable composition of any one of 1 to 4 is irradiated with active energy rays. 一種硬化性組成物之硬化方法,其特徵為加熱如請求項1~4中任一項之硬化性組成物。 A method for hardening a hardening composition, which is characterized by heating the hardening composition as in any one of Claims 1 to 4. 一種硬化物,其係如請求項1~4中任一項之硬化性組成物之硬化物。 A hardened product, which is a hardened product of the hardenable composition according to any one of claims 1 to 4.
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