JPWO2023022046A1 - - Google Patents

Info

Publication number
JPWO2023022046A1
JPWO2023022046A1 JP2023542348A JP2023542348A JPWO2023022046A1 JP WO2023022046 A1 JPWO2023022046 A1 JP WO2023022046A1 JP 2023542348 A JP2023542348 A JP 2023542348A JP 2023542348 A JP2023542348 A JP 2023542348A JP WO2023022046 A1 JPWO2023022046 A1 JP WO2023022046A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023542348A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023022046A1 publication Critical patent/JPWO2023022046A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
JP2023542348A 2021-08-18 2022-08-08 Pending JPWO2023022046A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021133181 2021-08-18
PCT/JP2022/030287 WO2023022046A1 (en) 2021-08-18 2022-08-08 Composition

Publications (1)

Publication Number Publication Date
JPWO2023022046A1 true JPWO2023022046A1 (en) 2023-02-23

Family

ID=85240643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023542348A Pending JPWO2023022046A1 (en) 2021-08-18 2022-08-08

Country Status (2)

Country Link
JP (1) JPWO2023022046A1 (en)
WO (1) WO2023022046A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181482A (en) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd Resin paste composition and semi-conductor device using the same
JP2004168906A (en) * 2002-11-20 2004-06-17 Sumitomo Bakelite Co Ltd Die attach paste and semiconductor device
JP2010018778A (en) * 2008-06-11 2010-01-28 Panasonic Electric Works Co Ltd Liquid thermosetting resin composition and copper-clad laminated plate using the same
CN102471458B (en) * 2009-08-17 2014-03-12 Dic株式会社 Resin composition for fiber-reinforced composite materials, cured product thereof, fiber-reinforced composite materials, moldings of fiber-reinforced resin, and process for production thereof
JP6726452B2 (en) * 2015-11-19 2020-07-22 株式会社日本触媒 Curable resin composition for optics
JP7216470B2 (en) * 2016-03-30 2023-02-01 株式会社Adeka Curable composition, method for producing cured product, and cured product thereof
JP7230447B2 (en) * 2018-11-14 2023-03-01 味の素株式会社 magnetic paste

Also Published As

Publication number Publication date
WO2023022046A1 (en) 2023-02-23

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230901