CN108884298A - Solidification compound, the manufacturing method of solidfied material and its solidfied material - Google Patents

Solidification compound, the manufacturing method of solidfied material and its solidfied material Download PDF

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CN108884298A
CN108884298A CN201780019466.8A CN201780019466A CN108884298A CN 108884298 A CN108884298 A CN 108884298A CN 201780019466 A CN201780019466 A CN 201780019466A CN 108884298 A CN108884298 A CN 108884298A
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CN108884298B (en
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松土和彦
渡边智志
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Adeka Corp
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Asahi Denka Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The present invention provides glass transition temperature height, the solidification compound of excellent adhesion, the manufacturing method of solidfied material and its solidfied material of solidfied material.By (A) ingredient and (C) ingredient add up to 100 mass parts in a manner of contain：45~90 mass parts of cationically polymerizable ingredient (A), 0.001~15 mass parts of cationic polymerization initiators (B), 1~20 mass parts of 1~15 mass parts of free-radical polymerised ingredient (C), 1~10 mass parts of radical polymerization initiator (D) and polymer (E), the polymer (E) are selected from the group being made of following polymer：The polymer etc. that polymer that the monomer as shown in following formula (I)s obtains, the monomer as shown in following formula (II)s obtain, in formula (I), X is the alkyl etc. of carbon atom number 1~7, in formula (II), R1Indicate hydrogen atom etc., X ' is the alkyl etc. of carbon atom number 1~7, (A) ingredient regard (A1) such as the glycidol compounds of polyalcohol and oxetane compound (A2) as essential component, and (C) ingredient regard the compound (C1) etc. with epoxy group and ethylenically unsaturated group as essential component.

Description

Solidification compound, the manufacturing method of solidfied material and its solidfied material
Technical field
The present invention relates to solidification compound, the manufacturing method of solidfied material and its solidfied materials, are specifically related to solidfied material Glass transition temperature height, the solidification compound of excellent adhesion, the manufacturing method of solidfied material and its solidfied material.
Background technique
In field of the solidification compound for ink, coating, various smears, bonding agent, optical component etc..It is related in this way The improvement of solidification compound carried out various reports.
For example, being proposed in following Patent Documents 1 to 3：Contain cationically polymerizable ingredient and free-radical polymerised ingredient Energy ray-curable composition or its solidfied material.Specifically, being proposed in patent document 1：Initial solidification and bonding The excellent polarizer adhesive composite of property.In addition, proposing a kind of photo-curable bonding of low viscosity in patent document 2 Agent, even if also promptly showing bonding force after light irradiation using the low resin film of moisture permeability as in the case where protective film, Relative to various power it is good by bonding force after a certain period of time, and will not goes wrong after endurance test, wet-heat resisting Bonding force after the test is also good.In turn, it is proposed in patent document 3：It can take into account comprising unsaturated lipid ring type epoxy The active energy beam polymer resin composition of the high-fire resistances of ester compounds, high index of refraction and the transparency.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2014-105218 bulletin
Patent document 2：Japanese Unexamined Patent Publication 2015-040283 bulletin
Patent document 3：Japanese Unexamined Patent Publication 2015-168757 bulletin
Summary of the invention
Problems to be solved by the invention
However, even if as the solidification compound proposed in Patent Documents 1 to 3, for curability and adaptation, Sometimes it may not necessarily also meet the requirements, status is to be desirable to highly take into account curability and adaptation, novel curability group Close object.
Therefore, high, excellent adhesion curability that the purpose of the present invention is to provide the glass transition temperatures of solidfied material Composition, the manufacturing method of solidfied material and its solidfied material.
The solution to the problem
The inventors of the present invention have made intensive studies in order to solve the above problems, if as a result, it has been found that having specific composition Solidification compound just can solve the above subject so that complete the present invention.
That is, solidification compound of the invention is characterized in that, with cationically polymerizable ingredient (A) and free radical polymerization The mode for adding up to 100 mass parts of property ingredient (C) and polymer (E) contains：Aforesaid cations polymerizable component (A) 45~90 Mass parts, 0.001~15 mass parts of cationic polymerization initiators (B), aforementioned free-radical polymerised 1~15 mass parts of ingredient (C), 1~20 mass parts of 1~10 mass parts of radical polymerization initiator (D) and aforementioned polymer (E), the weight of aforementioned polymer (E) are equal Molecular weight is 1000~30000, and aforementioned polymer (E) is selected from the group being made of following polymer：It is single as shown in following formula (I)s Polymer that polymer that body obtains, the monomer as shown in following formula (II)s obtain, as in the monomer shown in the aforementioned formula (I) Two or more monomers obtain polymer, obtained as the two or more monomers in the monomer shown in the aforementioned formula (II) it is poly- The polymer that monomer shown in object and the monomer as shown in aforementioned formula (I) and aforementioned formula (II) obtains is closed,
In formula (I), X be the alkyl of carbon atom number 1~7, the alkoxy of carbon atom number 1~7, carbon atom number 6~12 virtue Base, the alicyclic type hydrocarbon of the aryloxy group of carbon atom number 6~12 or carbon atom number 6~10 or the hydrogen atom in these groups are chosen The group that one or more of free epoxy group, the group of oxetanyl, hydroxyl and carboxyl composition group replaces,
In formula (II), R1Indicate that hydrogen atom, methyl or halogen atom, X ' are the alkyl of carbon atom number 1~7, carbon atom number 6 Hydrogen atom in~12 aryl or the alicyclic type hydrocarbon of carbon atom number 6~10 or these groups is chosen free epoxy group, oxa- The group that one or more of the group of cyclobutane base, hydroxyl and carboxyl composition group replaces,
Aforesaid cations polymerizable component (A) is by the contracting of the glycidol compound of polyalcohol or polyalcohol alkylene oxide addition product Water glyceride (A1) and oxetane compound (A2) are used as essential component,
Aforementioned free-radical polymerised ingredient (C) is by compound (C1) or carbon with epoxy group and ethylenically unsaturated group Methacrylate (C2) conduct of the polyalcohol of the acrylate or carbon atom number 2~20 of the polyalcohol of atomicity 2~20 Essential component.Herein, weight average molecular weight refers to：In tetrahydrofuran (THF) solvent, is measured using GPC and converted with styrene The weight average molecular weight found out.
For solidification compound of the invention, as aforesaid cations polymerizable component (A), preferably further containing virtue Fragrant race's epoxide (A3).In addition, aforementioned fragrance race epoxide (A3) is preferred for solidification compound of the invention For multifunctional aromatic epoxy compound.In turn, for solidification compound of the invention, preferably：Aforementioned polymer (E) be by The polymer that monomer shown in monomer shown in aforementioned formula (I) and aforementioned formula (II) obtains, the X in aforementioned formula (I) are carbon atom The aryl of number 6~12, the X ' in aforementioned formula (II) are the alkyl of carbon atom number 1~7, and aforesaid alkyl is replaced by epoxy group.
The manufacturing method of solidfied material of the invention is characterized in that, irradiates active-energy to solidification compound of the invention Ray is heated.
Solidfied material of the invention is characterized in that, is the solidfied material of solidification compound of the invention.
The effect of invention
According to the present invention it is possible to the glass transition temperature for providing solidfied material is high, the solidification compound of excellent adhesion, The manufacturing method and its solidfied material of solidfied material.Solidification compound of the invention is especially useful to bonding agent.
Specific embodiment
Solidification compound of the invention is described in detail below.
That is, solidification compound of the invention is characterized in that, contain：45~90 matter of cationically polymerizable ingredient (A) Measure part, 0.001~15 mass parts of cationic polymerization initiators (B), 1~15 mass parts of free-radical polymerised ingredient (C), free radical 1~20 mass parts of 1~10 mass parts of polymerization initiator (D) and polymer (E), the weight average molecular weight of the polymer (E) are 1000~30000, the polymer (E) is selected from the group being made of following polymer：What the monomer as shown in following formula (I)s obtained Polymer that polymer, the monomer as shown in following formula (II)s obtain, as two kinds in the monomer shown in the aforementioned formula (I) with Polymer that upper monomer obtains, the polymer obtained as the two or more monomers in the monomer shown in the aforementioned formula (II), with And the polymer that monomer shown in the monomer as shown in aforementioned formula (I) and aforementioned formula (II) obtains.For curability of the invention Composition, cationically polymerizable ingredient (A) are sweet by the shrink of the glycidol compound of polyalcohol or polyalcohol alkylene oxide addition product Oiling object (A1) and oxetane compound (A2) are used as essential component, and free-radical polymerised ingredient (C) will have epoxy group With the acrylate or carbon atom number 2 of the polyalcohol of the compound (C1) or carbon atom number 2~20 of ethylenically unsaturated group~ The methacrylate (C2) of 20 polyalcohol is used as essential component.
Herein, in formula (I), X is the alkyl of carbon atom number 1~7, the alkoxy of carbon atom number 1~7, carbon atom number 6~12 Aryl, the hydrogen atom in the aryloxy group of carbon atom number 6~12 or the alicyclic type hydrocarbon of carbon atom number 6~10 or these groups The group that one or more of selected free epoxy group, the group of oxetanyl, hydroxyl and carboxyl composition group replaces.
Herein, in formula (II), R1Indicate that hydrogen atom, methyl or halogen atom, X ' are the alkyl of carbon atom number 1~7, carbon original Hydrogen atom in the aryl of subnumber 6~12 or the alicyclic type hydrocarbon of carbon atom number 6~10 or these groups is chosen free epoxy The group that one or more of the group of base, oxetanyl, hydroxyl and carboxyl composition group replaces.
The cationically polymerizable ingredient (A) of solidification compound of the invention is by being irradiated or being heated using energy-ray And the compound of producing high-molecular or cross-linking reaction occurs for the cationic polymerization initiators activated.It can enumerate：Epoxide, Oxetane compound, vinyl ether compound etc..
The cationically polymerizable ingredient (A) of solidification compound of the invention is by the glycidol compound of polyalcohol or polynary The glycidol compound (A1) and oxetane compound (A2) of alcohol alkylene oxide addition product are used as essential component, as other Aromatic epoxy compound (A3) and cycloaliphatic epoxy (A4) etc. can be used in epoxide.
It, can as the glycidol compound of above-mentioned polyalcohol or the glycidol compound (A1) of polyalcohol alkylene oxide addition product Enumerate substance made of polyalcohol or polyalcohol alkylene oxide addition product glycidyl of sening as an envoy to, preferably point of glycidol compound Son amount is 250 or more.
It, can as the glycidol compound of above-mentioned polyalcohol or the glycidol compound (A1) of polyalcohol alkylene oxide addition product It enumerates：It is 1,4- butanediol diglycidyl ether, 1,6 hexanediol diglycidylether, neopentylglycol diglycidyl ether, sweet The triglycidyl ether of oil, the triglycidyl ether of trimethylolpropane, four glycidol ethers of sorbierite, dipentaerythritol Six glycidol ethers, the diglycidyl ether of polyethylene glycol, the diglycidyl ether of polypropylene glycol, bicyclopentadiene dimethanol two The glycidol ether of the polyalcohols such as glycidol ether, additionally by aliphatic polybasics such as propylene glycol, trimethylolpropane, glycerol The polyglycidyl ether compound of polyether polyol obtained from the one kind or two or more alkylene oxide of addition, aliphatic long-chain two in alcohol The 2-glycidyl ester of first acid.
As the glycidol compound of polyalcohol or the glycidol compound (A1) of polyalcohol alkylene oxide addition product, Jin Erke It enumerates：The monoglycidyl ether of aliphatic higher alcohol, the ethylene oxidic ester of higher fatty acids, epoxidised soybean oil, epoxy are hard Resin acid monooctyl ester, butyl epoxy stearate, epoxidised soybean oil, epoxidized polybutadiene etc..
As the glycidol compound of polyalcohol or the glycidol compound (A1) of polyalcohol alkylene oxide addition product, have full And the case where condensed ring, improves the curability of solidfied material and adaptation, so it is preferred that.
It, can as the glycidol compound of above-mentioned polyalcohol or the glycidol compound (A1) of polyalcohol alkylene oxide addition product To use commercially available product, such as can enumerate：DENACOL EX-121,DENACOL EX-171,DENACOL EX-192, DENACOL EX-211、DENACOL EX-212、DENACOL EX-313、DENACOL EX-314、DENACOL EX-321、 DENACOL EX-411、DENACOL EX-421、DENACOL EX-512、DENACOL EX-521、DENACOL EX-611、 DENACOL EX-612、DENACOL EX-614、DENACOL EX-622、DENACOL EX-810、DENACOL EX-811、 DENACOL EX-850、DENACOL EX-851、DENACOL EX-821、DENACOL EX-830、DENACOL EX-832、 DENACOL EX-841、DENACOL EX-861、DENACOL EX-911、DENACOL EX-941、DENACOL EX-920、 DENACOL EX-931 (Nagase ChemteX Corporation system)；Epolight M-1230,Epolight 40E, Epolight 100E、Epolight 200E、Epolight 400E、Epolight 70P、Epolight 200P、Epolight 400P, Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF (common prosperity society chemistry strain Formula commercial firm system), ADEKA Glycirol ED-503, ADEKA Glycirol ED-503G, ADEKA Glycirol ED-506, ADEKA Glycirol ED-523T, ADEKA RESIN EP-4088S, ADEKA RESIN EP-4080E (ADEKA plants of formula meetings Society's system) etc..
As above-mentioned oxetane compound (A2), can enumerate：Bis- (3- the oxetanylmethoxy) -5- oxo-nonyls of 3,7- Bis- [(3- ethyl -3- oxetanylmethoxy methoxyl group) methyl] benzene of alkane, 1,4-, the bis- [(3- ethyl -3- oxetanylmethoxy methoxies of 1,2- Base) methyl] ethane, 1,3- bis- [(3- ethyl -3- oxetanylmethoxy methoxyl group) methyl] propane, the bis- (3- ethyl -3- oxygen of ethylene glycol Heterocycle butyl methyl) ether, bis- (3- ethyl -3- oxetanyl methyl) ethers of triethylene glycol, the bis- (3- ethyl -3- oxygen of tetraethylene glycol Heterocycle butyl methyl) ether, bis- (3- ethyl -3- oxetanylmethoxy methoxyl group) butane of 1,4-, the bis- (3- ethyl -3- oxa- rings of 1,6- Butylmethoxy) two functional aliphatic's oxetane compounds, 3- ethyl -3- [(phenoxy group) methyl] oxa- ring fourth such as hexane Alkane, 3- ethyl -3- (hexoxymethyl) oxetanes, 3- ethyl -3- (2- Ethylhexoxymethyl) oxetanes, 3- second The simple functions oxetane compounds such as base -3- (hydroxymethyl) oxetanes, 3- ethyl -3- (chloromethyl) oxetanes Deng.Wherein the adaptation of two functional aliphatic's oxetane compounds improves, so it is preferred that.They can be used alone Or two or more is applied in combination.
As above-mentioned oxetane compound (A2), commercially available product can be used, such as can enumerate：2- hydroxyethyl vinyl Base ether, diethylene glycol monovinyl base ether, 4- hydroxy butyl vinyl ether (Maruzen Petrochemical Co., Ltd.'s system)；ARON OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (Toagosei Co., Ltd's system), ETERNACOLL OXBP, OXTP (Ube Industries, Ltd's system) etc..
Above-mentioned aromatic epoxy compound (A3) refers to the epoxide comprising aromatic rings, as aromatic epoxies chemical combination The specific example of object (A3), can enumerate：Phenol, cresols, butylphenol etc. have at least one aromatic ring polyphenol or its The mono-/multi- glycidol ether compound of alkylene oxide addition product, such as：Bisphenol-A, Bisphenol F or in them and then addition alkylene oxide The glycidol ether compound of compound, phenolic resin varnish；Resorcinol, hydroquinone, catechol etc. have 2 The mono-/multi- glycidol ether compound of the aromatic compound of the above phenolic hydroxyl group；Phenyl dimethanol, diethylamino phenyl alcohol, two fourth of phenyl Alcohol etc. has the glycidol ether compound of the aromatic compound of 2 or more alcoholic extract hydroxyl groups；Phthalic acid, terephthalic acid (TPA), partially Benzenetricarboxylic acid etc. has the ethylene oxidic ester of polyacid aromatic compound, the ethylene oxidic ester of benzoic acid, the benzene of 2 or more carboxylic acids Ethylene oxide or the epoxides of divinylbenzene etc..
As above-mentioned aromatic epoxy compound (A3), commercially available product can be used, such as can enumerate：DENACOL EX- 146、DENACOL EX-147、DENACOL EX-201、DENACOL EX-203、DENACOL EX-711、DENACOL EX- 721、ONCOAT EX-1020、ONCOAT EX-1030、ONCOAT EX-1040、ONCOAT EX-1050、ONCOAT EX- 1051, ONCOAT EX-1010, ONCOAT EX-1011, ONCOAT 1012 (Nagase ChemteX Corporation system)； OGSOL PG-100、OGSOL EG-200、OGSOL EG-210、OGSOL EG-250(Osaka Gas Chemicals Co., Ltd. it makes)；HP4032, HP4032D, HP4700 (Dainippon Ink Chemicals's system)；ESN-475V (Nippon Steel & Sumitomo Metal Corporation System)；EPIKOTE YX8800 (Mitsubishi chemical Co., Ltd's system)；MARPROOF G-0105SA, MARPROOF G-0130SP (day Oily Co. Ltd. system)；EPICLON N-665, EPICLON HP-7200 (Dainippon Ink Chemicals's system)；EOCN-1020,EOCN- 102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC- 7000L (Nippon Kayaku K. K's system)；ADEKA RESIN EP-4000,ADEKA RESIN EP-4005,ADEKA RESIN EP-4100, ADEKA RESIN EP-4901 (ADEKA Corp.'s system)；TECHMORE VG-3101L(Printech Co., Ltd. make) etc..As above-mentioned aromatic epoxy compound (A3), the curability of multifunctional aromatic epoxy compound is excellent, therefore And it is preferred that.
Above-mentioned cycloaliphatic epoxy (A4) refers to that oxirane ring is not connected directly between saturation by binding groups On ring.As the specific example of cycloaliphatic epoxy (A4), can enumerate：By being made using oxidant at least one Obtained from the polyglycidyl ether compound or cyclohexene of the polyalcohol of ester ring, the compound epoxidation containing cyclopentene ring Cyclohexene oxide, the compound containing cyclopentene oxide.Such as it can enumerate：3,4- epoxycyclohexyl-methyl -3,4- ring Oxygen hexahydrobenzoid acid ester, 3,4- epoxy -1- methylcyclohexyl -3,4- epoxy -1- methylhexyl formic acid esters, 6- methyl -3,4- ring Oxygen cyclohexyl methyl -6- methyl -3,4- epoxycyclohexyl formic acid esters, 3,4- epoxy -3- methylcyclohexylmethyl -3,4- epoxy - It is 3- methyl cyclohexane carbamate, 3,4- epoxy -5- methylcyclohexylmethyl -3,4- epoxy -5- methyl cyclohexane carbamate, double (3,4- epoxycyclohexyl-methyl) adipate ester, 3,4- epoxy -6- methyl cyclohexane carbamate, di-2-ethylhexylphosphine oxide (3,4- epoxide ring Hexane), propane -2,2- diyl-bis- (3,4- 7-oxa-bicyclo[4.1.0), 2,2- bis- (3,4- epoxycyclohexyl) propane, dicyclopentadiene Dicyclic oxide, ethylenebis (3,4- epoxycyclohexyl formic acid esters), epoxy hexahydro-phthalic acid dioctyl ester, epoxy hexahydro Change di-2-ethylhexyl phthalate, 1- epoxy ethyl -3,4- 7-oxa-bicyclo[4.1.0,1,2- epoxy -2- epoxy ethyl hexamethylene Alkane, australene olefinic oxide, limonene dioxide etc..As cycloaliphatic epoxy (A4), 3,4- epoxycyclohexyl-methyls- 3,4- epoxycyclohexyl formic acid esters or 3,4- epoxy -1- methylcyclohexyl -3,4- epoxy -1- methylhexyl formic acid esters are from adaptation From the perspective of raising and it is preferred that.
As above-mentioned cycloaliphatic epoxy (A4), commercially available product can be used, such as can enumerate：CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2000, CELLOXIDE 3000 (Daicel Corporation system) etc..
As above-mentioned vinyl ether compound, such as can enumerate：Diethylene glycol monovinyl base ether, glycol divinyl Base ether, dodecyl vinyl ethers, cyclohexyl vinyl ether, 2- ethylhexyl vinyl ether, 2- chloroethyl vinyl ether, second Base vinyl ethers, isobutyl vinyl ether, triethylene glycol vinyl ethers, 2- hydroxyethyl vinylethers, 4- hydroxy butyl vinyl ether, 1,6- cyclohexane dimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4- butanediol divinyl ether, 1,6- hexamethylene two Methanol divinyl ether etc..
In above-mentioned cationically polymerizable ingredient (A), for the glycidol compound or polyalcohol alkylene oxide of above-mentioned polyalcohol The glycidol compound (A1) of addition product, oxetane compound (A2), aromatic epoxy compound (A3), ester ring type epoxy The use ratio of compound (A4) and vinyl ether compound is relative to 100 mass parts of cationically polymerizable ingredient (A)：It is more The glycidol compound of first alcohol or 50~80 mass parts of glycidol compound (A1), the oxa- ring fourth of polyalcohol alkylene oxide addition product 20~50 mass parts of hydride compounds (A2), 0~50 mass parts of aromatic epoxy compound (A3), cycloaliphatic epoxy (A4) 0~30 mass parts, 0~20 mass parts of vinyl ether compound, make viscosity, coating, reactivity and curability in the case It improves, so it is preferred that.
The cationic polymerization initiators (B) of solidification compound of the invention as long as can irradiate or add using energy-ray The compound of substance that is hot and releasing initiation cationic polymerization can be any polymerization initiator, penetrate preferably by energy The irradiation of line and release lewis acidic salt i.e. double salt, or derivatives thereof.Representative object as above compound Matter can enumerate the salt of the cation and anion that are indicated by the following general formula.
[A]r+[B]r-
Cationic [A] hereinr+Preferably, structure can for example be indicated by the following general formula.
[(R2)aQ]r+
In turn, herein, R2It is that carbon atom number is 1~60, may include the organic of atom in addition to several carbon atoms Group.A is 1~5 integer.A R2It can be the same or different each independently.In addition, at least one preferably has virtue The organic group as described above of fragrant ring.Q S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N=N selected from being made of Atom or atomic group in group.In addition, by cationic [A]r+In the valence of Q when being set as q, need to make the relationship of r=a-q at Vertical (wherein, N=N is considered as valence 0).
In addition, anion [B]r-Preferably halide complex, structure can for example be indicated by the following general formula.
[LYb]r-
In turn, herein, L is the metal or semimetal (Metalloid) of the central atom as halide complex, B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co etc..Y is halogen atom.The integer that b is 3~7.In addition, By anion [B]r-In the valence of L when being set as p, need to make the relationship of r=b-p to set up.
Anion [LYb] as above-mentioned general formular-Specific example, can enumerate：Four (pentafluorophenyl group) borates, four (the fluoro- 4- methoxyphenyl of 3,5- bis-) borate, tetrafluoroborate (BF4)-, hexafluoro-phosphate radical (PF6)-, hexafluoroantimonic anion (SbF6)-, hexafluoroarsenate root (AsF6)-, chlordene metaantimmonic acid root (SbCl6)-Deng.
In addition, anion [B]r-It can also it is preferable to use structures shown in the following general formula.
[LYb-1(OH)]r-
L, Y, b are same as described above.In addition, can be enumerated as other anion that can be used：Perchlorate (ClO4)-, trifluoromethyl sulfite ion (CF3SO3)-, fluosulfonic acid radical ion (FSO3)-, toluenesulfonate anion, three Nitrobenzene-sulfonic acid root anion, camphorsulfonic acid root, nine fluorine butane sulfonate radicals, ten hexafluoro perfluoroetane sulfonic acid roots, four aryl boric acid roots, four (pentafluorophenyl group) borate etc..
In solidification compound of the invention, in such salt, the aromatic series salt using following (i)~(iii) is It is particularly effective.Wherein it is possible to be used alone its a kind or be mixed with two or more.
(i) phenyldiazonium hexafluorophosphate, 4- methoxyphenyl diazonium hexafluoro antimonate, 4- aminomethyl phenyl diazonium The aryl diazonium salts such as hexafluorophosphate
(ii) diphenyl iodine hexafluoro antimonate, two (4- aminomethyl phenyl) iodine hexafluorophosphates, two (4- tert-butyl benzenes Base) diaryl iodonium salts such as iodine hexafluorophosphate, tolylcumyl iodine four (pentafluorophenyl group) borate
(iii) sulfonium cation and hexafluoro antimony ion, hexafluorophosphoricacid acid ions, four (phenyl-pentafluorides shown in following groups of I or group II Base) borate ion etc. sulfonium salt < group I >
< group II >
In addition, can be enumerated as other preferred substances：(η5- 2,4- cyclopentadiene -1- base) ((1,2,3,4,5, 6- η)-(1- Methylethyl) benzene) iron-arene complexes, aluminium tris(acetylacetonate), the three (ethyl acetones such as-iron-hexafluorophosphate Acetic acid) the silane alcohols such as aluminium complexs and tri-phenyl-silane alcohol such as aluminium, three (salicylide) aluminium mixture；Thiophene salt, tetrahydro The salt such as thiophene salt, hexadecyldimethyl benzyl ammonium, pyridiniujm, hydrazonium salt；More alkane such as diethylenetriamines, diethylenetriamine, tetren Quito amine；The ester ring types such as 1,2- diaminocyclohexane, 1,4- diamino -3,6- diethyl cyclohexane, isophorone diamine are more Amine；The aromatic polyamines class such as m-xylene diamine, diaminodiphenyl-methane, diamino diphenyl sulfone；By utilizing routine side Method makes above-mentioned polyamines class, contracts with phenyl glycidyl ether, butyl glycidyl ether, bisphenol-A-diglycidyl ether, Bisphenol F-two The polycyclic oxygen that the various epoxy resin such as the glycidol ethers such as water glycerin ether or the glycidol esters of carboxylic acid are reacted and manufactured adds At modifier；By making the carboxylics such as above-mentioned organic polyamine class and phthalic acid, M-phthalic acid, dimeric dibasic acid using conventional method The amidation modifier of acids reaction and manufacture；By making the aldehydes such as above-mentioned polyamines class and formaldehyde using conventional method and in benzene At least the phenols with an aldehyde reaction position is anti-in the cores such as phenol, cresols, dimethlbenzene, tert-butyl phenol, resorcinol The Mannich modifier answered and manufactured；Polybasic carboxylic acid is (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, pungent Diacid, azelaic acid, decanedioic acid, lauric acid/dodecanoic acid, 2- methylsuccinic acid, 2- methyl adipic acid, 3- methyl adipic acid, 3- methylpent two The aliphatic two such as acid, 2- methyl suberic acid, 3,8- dimethyl decanedioic acid, 3,7- dimethyl decanedioic acid, hydrogenated dimer acids, dimeric dibasic acid Carboxylic acids；The aromatic dicarboxylic acids class such as phthalic acid, terephthalic acid (TPA), M-phthalic acid, naphthalene dicarboxylic acids；Cyclohexane dicarboxylic acid Equal ester ring types omega-dicarboxylic acids；Trimellitic acid, trimesic acid, Castor Oil Fatty Acid the tricarboxylics acids such as tripolymer；Pyromellitic Acid Equal tetracarboxylic acids acids etc.) acid anhydrides；Dicyandiamide, imidazoles, carboxylate, sulphonic acid ester, amine acid imide etc..
Wherein, from the viewpoint of improving use aspect and luminous sensitivity, it is preferable to use：Aromatic iodonium salts, aromatic series Sulfonium salt, iron-arene complex, further preferably：Relative to 100 mass % of cationic polymerization initiators (B), at least contain 0.1 The aromatic series sulfonium salt with following structures of quality % or more.
Herein, in formula, R11、R12、R13、R14、R15、R16、R17、R18、R19And R20Separately indicate hydrogen atom, halogen Atom, the alkyl of carbon atom number 1~10, the alkoxy of carbon atom number 1~10 or carbon atom number 2~10 ester group, R21、R22、R23 And R24Separately indicate the alkyl of hydrogen atom, halogen atom or carbon atom number 1~10, R25Indicate that hydrogen atom, halogen are former The alkyl or any substituent group in following chemical formula (A)~(C) of son, carbon atom number 1~10, Anq-Indicate the yin of q valence Ion, p indicate the coefficient for making charge neutrality.
Herein, in formula, R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、 R29、R35、R36、R37、R38And R39Separately indicate hydrogen atom, halogen atom, the alkyl of carbon atom number 1~10, carbon atom The alkoxy of number 1~10 or the ester group of carbon atom number 2~10, R30、R31、R32、R33And R34Separately indicate hydrogen atom, halogen The alkyl of plain atom or carbon atom number 1~10.
In above-mentioned general formula (1) compound represented, as R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、 R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38And R39Shown in halogen atom, can It enumerates：Fluorine, chlorine, bromine, iodine etc..
As R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、 R30、R31、R32、R33、R34、R35、R36、R37、R38And R39Shown in carbon atom number 1~10 alkyl, can enumerate：Methyl, second Base, propyl, isopropyl, butyl, sec-butyl, tert-butyl, isobutyl group, amyl, isopentyl, tertiary pentyl, hexyl, cyclohexyl, heptyl, Octyl, nonyl, ethyloctanyl, 2- methoxy ethyl, 3- methoxy-propyl, 4- methoxybutyl, 2- butoxyethyl group, methoxyl group Ethoxyethyl group, methoxyethoxyethoxyethyl, 3- methoxybutyl, 2-methylmercaptoethyl, methyl fluoride, difluoromethyl, Trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, two bromomethyls, trisbromomethyl, bis-fluoro ethyls, trichloroethyl, Dichlorodifluoro ethyl, pentafluoroethyl group, heptafluoropropyl, nona-fluoro butyl group, ten fluorine amyl groups, ten trifluoro hexyls, 15 fluorine heptyl, 17 fluorine Octyl, methoxy, 1,2- epoxy ethyl, methoxy ethyl, methoxvethoxvmethvl, methylthiomethyl, ethyoxyl second Base, butoxymethyl, tertiary butylthio methyl, 4- pentenyl oxygroup methyl, tri-chloroethoxy ylmethyl, bis- (2- chloroethoxy) first Base, methoxycyclohexyl, 1- (2- chloroethoxy) ethyl, 1- methyl-1-methoxy ethyl, two sulphur ethyl of ethyl, trimethyl first Silylation ethyl, t-butyldimethylsilyl oxygroup methyl, 2- (trimethyl silyl) ethoxyl methyl, tert-butoxy Carbonvlmethyl, ethyloxycarbonyl methyl, ethylcarbonyl group methyl, tert-Butoxycarbonyl-methyl, acryloyl-oxyethyl, methyl-prop Alkene trimethylammonium, 2- methyl -2- adamantyloxycarbonyl methyl, acetyl ethyl, 2- methoxyl group -1- acrylic, hydroxyl first Base, 2- ethoxy, 1- ethoxy, 2- hydroxypropyl, 3- hydroxypropyl, 3- hydroxyl butyl, 4- hydroxyl butyl, 1,2- dihydroxy ethyl etc..
As R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、 R36、R37、R38And R39Shown in carbon atom number 1~10 alkoxy, can enumerate：Methoxyl group, ethyoxyl, propyl oxygroup, isopropyl Base oxygroup, butyl oxygroup, sec-butyl oxygroup, tert-butyl oxygroup, isobutyl group oxygroup, amyl oxygroup, isopentyl oxygroup, tertiary pentyl oxygen Base, hexyl oxygroup, cyclohexyl oxygroup, cyclohexyl methyl oxygroup, tetrahydrofuran base oxygroup, THP trtrahydropyranyl oxygroup, 2- methoxyl group Ethyl oxygroup, 3- methoxy-propyl oxygroup, 4- methoxybutyl oxygroup, 2- butoxyethyl group oxygroup, methoxyethoxyethyl Oxygroup, methoxyethoxyethoxyethyl oxygroup, 3- methoxybutyl oxygroup, 2-methylmercaptoethyl oxygroup, trifluoromethyl oxygen Base etc..
As R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、 R36、R37、R38And R39Shown in carbon atom number 2~10 ester group, can enumerate：Methoxycarbonyl, ethoxy carbonyl, isopropyl Epoxide carbonyl, phenyloxycarbonyl, acetoxyl group, propiono oxygroup, bytyry oxygroup, chloroethene acyloxy, dichloro-acetoxy, three Chloroethene acyloxy, trifluoroacetyl oxygroup, tert-butyl carbonyl oxygroup, methoxyl group acetoxyl group, benzoyl oxygroup etc..
For the cationic polymerization initiators of 100 mass parts of total relative to (A) ingredient and (B) ingredient and (C) ingredient (B) use ratio, cationic polymerization initiators (B) are 0.001~15 mass parts, preferably 0.1~10 mass parts.When very few Sometimes solidification is easy to become inadequate, and generates sometimes to each physical property such as the water absorption rate of solidfied material, solidfied material intensity when excessive bad It influences.
The free-radical polymerised ingredient (C) of solidification compound of the invention is with epoxy group and ethylenically unsaturated group Compound (C1) or carbon atom number 2~20 alcohol acrylate or carbon atom number 2~20 alcohol methacrylate (C2) it is used as essential component.
As the compound (C1) with above-mentioned epoxy group and ethylenically unsaturated group, such as can enumerate：Epoxy third Olefin(e) acid ester or epoxy methacrylates, specifically, be conventionally known aromatic epoxy resin, alicyclic epoxy resin, Acrylate obtained from aliphatic epoxy resin etc. is reacted with acrylic or methacrylic acid.These epoxy acrylates or ring In oxygen methacrylate, the particularly preferably acrylate or methacrylate of the glycidol ether of alcohols.
The methacrylic acid of the alcohol of the acrylate or carbon atom number 2~20 of alcohol as above-mentioned carbon atom number 2~20 Ester (C2), can enumerate：In the molecule the aromatic series at least one hydroxyl or aliphatic alcohol and its alkylene oxide addition body with Acrylate or methacrylate obtained from acrylic or methacrylic acid reaction.Specifically, can enumerate：Propylene Acid -2- ethylhexyl, 2-Hydroxy ethyl acrylate, 2-hydroxypropyl acrylate, isoamyl acrylate, lauryl base Ester, stearyl acrylate base ester, Isooctyl acrylate monomer, tetrahydrofurfuryl acrylate, isobornyl acrylate, acrylic acid benzyl Ester, 1,3 butyleneglycol diacrylate, 1,4 butanediol diacrylate, 1,6 hexanediol diacrylate, diethylene glycol two Acrylate, triethylene glycol diacrylate, neopentylglycol diacrylate, polyethyleneglycol diacrylate, polypropylene glycol two Acrylate, trimethylolpropane trimethacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ε-oneself Lactone-modified dipentaerythritol hexaacrylate, methacrylic acid -2- ethylhexyl, methacrylic acid -2- hydroxy methacrylate, methyl 2-hydroxypropyl acrylate, isopentyl methacrylate, lauryl methacrylate, stearyl methacrylate, methyl Isooctyl acrylate monomer, methacrylic acid tetrahydro furfuryl ester, isobornyl methacrylate, benzyl methacrylate, 1,3- Butanediol dimethylacrylate, 1,4- butanediol dimethylacrylate, 1,6-HD dimethylacrylate, diethyl two Alcohol dimethylacrylate, triethylene glycol dimethacrylate, neopentylglycol dimethacrylate, polyethylene glycol dimethyl Acrylate, polypropylene glycol dimethacrylate, trimethylol-propane trimethacrylate, pentaerythrite tetramethyl propylene Modified dipentaerythritol hexamethacrylate of acid esters, dipentaerythritol hexamethacrylate, 6-caprolactone etc..It needs to illustrate , in these acrylate or methacrylate, the polyacrylate of particularly preferred polyalcohol or the poly- first of polyalcohol Base esters of acrylic acid.
As above-mentioned free-radical polymerised ingredient (C), can be used in addition to (C1) or (C2) by being penetrated using energy Line irradiation or heating and the radical polymerization initiator activated carries out the compound of producing high-molecular or cross-linking reaction, such as can arrange It enumerates：Allyl urethane compound, unsaturated polyester compound, styrenic etc..In free-radical polymerised ingredient (C) Above-mentioned (C1) ingredient and (C2) ingredient ratio preferably 50 mass % or more.
As the radical initiator (D) in solidification compound of the invention, it is not particularly limited, can be used known Radical initiator.It can be used for example：Acetophenone based compound, benzil based compound, benzophenone based compound, thiophene Ketone based compound, the oxime compounds such as ton ketone based compound etc..
Polymer (E) in solidification compound of the invention is selected from the group and Weight-average molecular being made of following polymer Amount is scaled 1000~30000 with polystyrene：Polymer that the monomer as shown in above-mentioned formula (I) obtains, by above-mentioned formula (II) Shown in monomer obtain polymer, obtained as the two or more monomers in the monomer shown in above-mentioned formula (I) polymer, The polymer and the list as shown in above-mentioned formula (I) obtained as the two or more monomers being selected from monomer shown in above-mentioned formula (II) The polymer that monomer shown in body and above-mentioned formula (II) obtains.
As the alkyl of carbon atom number 1~7 shown in the X in above-mentioned formula (I), can enumerate：It is methyl, ethyl, propyl, different Propyl, butyl, sec-butyl, tert-butyl, isobutyl group, amyl, isopentyl, tertiary pentyl, hexyl, 2- hexyl, 3- hexyl, cyclohexyl, 4- methylcyclohexyl, heptyl, 2- heptyl, 3- heptyl, different heptyl, tertiary heptyl etc..Wherein, the alkyl of carbon atom number 1~4 or by The partially substituted carbon atom of group selected from one or more of the group being made of epoxy group, oxetanyl, hydroxyl and carboxyl The alkyl of number 1~4 from the aspect of curability and it is preferred that.
As the alkoxy of carbon atom number 1~7 shown in the X in above-mentioned formula (I), can enumerate：Methoxyl group, ethyoxyl, Propyl oxygroup, isopropyl oxygroup, butyl oxygroup, sec-butyl oxygroup, tert-butyl oxygroup, isobutyl group oxygroup, amyl oxygroup, isopentyl Oxygroup, tertiary pentyl oxygroup, hexyl oxygroup, 2- hexyl oxygroup, 3- hexyl oxygroup, cyclohexyl oxygroup, 4- methylcyclohexyl oxygroup, heptan Base oxygroup, 2- heptyl oxygroup, 3- heptyl oxygroup, different heptyl oxygroup, tertiary heptyl oxygroup etc..Wherein, the alcoxyl of carbon atom number 1~4 The group part of one or more of the group that base or selected free epoxy group, oxetanyl, hydroxyl and carboxyl form replaces Carbon atom number 1~4 alkoxy from the aspect of curability and it is preferred that.
As the aryl of carbon atom number 6~12 shown in the X in above-mentioned formula (I), can enumerate：Phenyl, aminomethyl phenyl, naphthalene Base etc..
As the aryloxy group of carbon atom number 6~12 shown in the X in above-mentioned formula (I), can enumerate：Phenyl oxygroup, methyl Phenyl oxygroup, naphthalene oxygroup etc..
As the alicyclic type hydrocarbon of carbon atom number 6~10 shown in the X in above-mentioned formula (I), can enumerate：Cyclohexyl, first Butylcyclohexyl, norborny, bicyclopentyl, bicyclooctyl, trimethyl bicyclic heptyl, three cyclooctyls, tricyclodecyl, spiral shell octyl, Spiral shell bicyclopentyl, adamantyl, isobornyl etc..
For these alkyl, alkoxy, aryl, aryloxy group and alicyclic type hydrocarbon, hydrogen atom in these groups can be with The group of one or more of selected free epoxy group, the group of oxetanyl, hydroxyl and carboxyl composition replaces.
In above-mentioned formula (I), when a part of X is taken by epoxy group or oxetanyl, as monomer shown in formula (I), Such as monomer shown in following formula (1)~(3) can be enumerated.
Herein, in formula (1), R3Indicate the alkyl of hydrogen atom or carbon atom number 1~6, the integer that m is 1~6.
Herein, in formula (2), R4Indicate the alkyl of hydrogen atom or carbon atom number 1~6, the integer that n is 1~6.
Herein, in formula (3), R5Indicate the alkyl of hydrogen atom or carbon atom number 1~6, the integer that s is 1~6.
In above-mentioned formula (II), as R1Shown in halogen atom, can enumerate：Fluorine, chlorine, bromine, iodine etc..
In above-mentioned formula (II), the aryl or carbon atom number of the alkyl of the carbon atom number 1~7 as X ', carbon atom number 6~12 6~10 alicyclic type hydrocarbon can enumerate the identical group with above-mentioned formula (I).
In above-mentioned formula (II), when a part of X ' is replaced by epoxy group or oxetanyl, as shown in formula (II) Monomer can enumerate substance shown in following formula (4)~(6).
Herein, in formula (4), R1It is identical as above-mentioned formula (II), R6Indicate the alkyl of hydrogen atom or carbon atom number 1~6, t 1 ~6 integer.
Herein, in formula (5), R1It is identical as above-mentioned formula (II), R7Indicate the alkyl of hydrogen atom or carbon atom number 1~6, q 1 ~6 integer.
Herein, in formula (6), R1It is identical as above-mentioned formula (II), R8Indicate the alkyl of hydrogen atom or carbon atom number 1~6, y 1 ~6 integer.
In above-mentioned polymer (E), constitute the monomer of polymer use ratio it is following when cementability improve so it is preferred that：On State the carbon that the group that X is one or more of selected free epoxy group, the group of oxetanyl, hydroxyl and carboxyl composition replaces When the alicyclic type hydrocarbon of the alkyl of atomicity 1~7, the aryl of carbon atom number 6~12 or carbon atom number 6~10, above-mentioned (I) or (II) monomer shown in is 10~100 mass %.
For solidification compound of the invention, relative to cationically polymerizable ingredient (A) and free-radical polymerised ingredient (C) and polymer (E) adds up to 100 mass parts, and above-mentioned cationically polymerizable ingredient (A) is 45~90 mass parts, above-mentioned sun Cation polymerization initiator (B) is 0.001~15 mass parts, above-mentioned free-radical polymerised ingredient (C) is 1~15 mass parts, above-mentioned Radical polymerization initiator (D) is 1~10 mass parts, above-mentioned polymer (E) is 1~20 mass parts.It is not above-mentioned mix ratio When example, there are the curability of solidfied material and the worry of adaptation variation.
In solidification compound of the invention, sensitizer and/or sensitization auxiliary agent can also be further used as needed.It is quick Agent is to show absorption maximum at wavelength longer than maximum absorption wavelength shown by cationic polymerization initiators (B), Promote the compound of the polymerization initiation reaction based on cationic polymerization initiators (B).In addition sensitization auxiliary agent is further to promote The compound of the effect of sensitizer.
As sensitizer and sensitization auxiliary agent, can enumerate：Anthracene based compound, naphthalene series compound etc..
As anthracene based compound, such as substance shown in following formula (7) can be enumerated.
Herein, in formula (7), R50And R51Each independently represent hydrogen atom, the alkyl of carbon atom number 1~6 or carbon atom number 2~12 alkoxyalkyl, R52Indicate the alkyl of hydrogen atom or carbon atom number 1~6.
When enumerating the specific example of anthracene based compound shown in above-mentioned formula (7), there is following such compound.
Such as it can enumerate：9,10- dimethoxy anthracene, 9,10- diethoxy anthracene, 9,10- dipropoxy anthracene, 9,10- bis- Isopropoxy anthracene, 9,10- dibutoxy anthracene, 9,10- diamyl oxygroup anthracene, 9,10- dihexyl oxygroup anthracene, bis- (the 2- methoxies of 9,10- Base oxethyl) anthracene, bis- (2- ethoxy ethoxy) anthracenes of 9,10-, bis- (2- Butoxyethoxy) anthracenes of 9,10-, bis- (the 3- fourths of 9,10- Oxygroup propoxyl group) anthracene, 2- methyl-or 2- ethyl -9,10- dimethoxy anthracene, 2- methyl-or 2- ethyl -9,10- diethoxy Anthracene, 2- methyl-or 2- ethyl -9,10- dipropoxy anthracene, 2- methyl-or 2- ethyl -9,10- diisopropoxy anthracene, 2- methyl - Or 2- ethyl -9,10- dibutoxy anthracene, 2- methyl-or 2- ethyl -9,10- diamyl oxygroup anthracene, 2- methyl-or ethyl -9 2-, 10- dihexyl oxygroup anthracene etc..
As naphthalene series compound, such as substance shown in following formula (8) can be enumerated.
Herein, in formula (8), R53And R54Each independently represent the alkyl of carbon atom number 1~6.
When enumerating the specific example of naphthalene series compound shown in above-mentioned formula (8), there is following such compound.
Such as it can enumerate：4- methoxyl group -1- naphthols, 4- ethyoxyl -1- naphthols, 4- propoxyl group -1- naphthols, 4- fourth oxygen Base-1- naphthols, 4- hexyl Oxy-1-naphthols, 1,4- dimethoxy-naphthalene, 1- ethyoxyl-4- methoxynaphthalene, 1,4- diethoxy Naphthalene, 1,4- dipropoxy naphthalene, 1,4- dibutoxy naphthalene etc..
Sensitizer and sensitization auxiliary agent are not particularly limited relative to the use ratio of above-mentioned cationically polymerizable ingredient (A), Show common use ratio use greatly in the range of not hindering the purpose of the present invention, for example, relative to it is above-mentioned sun from 100 mass parts of sub- polymerizable component (A), sensitizer and sensitization auxiliary agent are respectively 0.1~3 mass parts, are improved from curability Viewpoint set out and it is preferred that.
In solidification compound of the invention, it can according to need using silane coupling agent.As silane coupling agent, such as It can be used：Dimethyldimethoxysil,ne, dimethyl diethoxysilane, Methylethyl dimethoxysilane, Methylethyl Diethoxy silane, methyltrimethoxysilane, methyltriethoxysilane, ethyl trimethoxy silane, ethyl trimethoxy The alkyl functionals such as silane alkoxy silane, vinyl trichlorosilane, vinyltrimethoxysilane, vinyl triethoxyl silicon The alkenyl functionals such as alkane, allyltrimethoxysilanis alkoxy silane, 3- methacryloxypropyl, 3- methacryloxypropyl trimethoxy silane, 3- methacryloxypropyl methyl diethoxysilane, 3- methyl Acryloxypropyl dimethoxysilane, 2- methacryloxypropyl trimethoxy silane, γ-glycidol ether Oxygen propyl trimethoxy silicane, γ-glycidyl ether oxygen propyl methyldiethoxysilane, β-(3,4- epoxycyclohexyl) ethyl The epoxy functionals such as trimethoxy silane alkoxy silane, N- β (amino-ethyl)-gamma-amino propyl trimethoxy silicane, γ- The amino functionals alkoxy silanes, γ-such as aminopropyltriethoxywerene werene, N- phenyl-gamma-amino propyl trimethoxy silicane The alkoxies such as the Mercaptofunctionals such as mercaptopropyi trimethoxy silane alkoxy silane, tetraisopropoxy titanium, four titanium n-butoxides Titanium class, bis- two octyloxy esters of (Glycolic acid monooctyl ester) metatitanic acid, the titanium chelates such as bis- (ethyl acetoacetate) metatitanic acid diisopropoxy esters The zirconiums acylates such as zirconium chelates class, the three butoxy monostearate zirconiums such as class, four acetylacetone,2,4-pentanedione zirconiums, three butoxy single acetyl acetone zirconiums Isocynate silanes classes such as class, methyl triisocyanate silane etc..
The dosage of above-mentioned silane coupling agent is not particularly limited, usually relative to the total of the solids in solidification compound 100 mass parts are measured, are the range of 0.01~20 mass parts.
In solidification compound of the invention, by using thermoplastic organic polymer as needed, to can also improve The characteristic of solidfied material.As thermoplastic organic polymer, such as can enumerate：Polystyrene, polymethyl methacrylate, methyl Methyl acrylate-acrylic acid methacrylate copolymers, methyl methacrylate-glycidyl methacrylate copolymer, poly- (first Base) acrylic acid, styrene-(methyl) acrylic copolymer, (methyl) acryl acid-methyl methacrylate copolymer, (methyl) Poly- (methyl) methyl acrylate copolymer of glycidyl acrylate-, polyvinyl butyral, cellulose esters, polyacrylamide, Saturated polyester etc..
In solidification compound of the invention, it can further use as needed：Ultraviolet absorbing agent；It is at normal temperature It is nonactive, blocking group is detached from by being heated to predetermined temperature/light irradiation/acid etc., activated to show that ultraviolet light is inhaled The compound of receipts ability.
In addition, can according to need addition polyalcohol, inorganic filler, organic within the scope of the effect of the invention The colorants such as filler, pigment, dyestuff, defoaming agent, thickener, surfactant, levelling agent, fire retardant, thixotropic agent, diluent, Plasticizer, stabilizer, polymerization inhibitor, ultraviolet absorbing agent, antioxidant, antistatic agent, flowing regulator, adhesion promoters etc. are each Kind resin additive etc..
It in solidification compound of the invention, is not particularly limited, can be used usually used can dissolve or disperse State the solvent of (A), (B), (C), (D) and (E) each ingredient.As solvent, such as can enumerate：Methyl ethyl ketone, methyl amylketone, diethyl The ketones such as ketone, acetone, methyl isopropyl Ketone, methyl iso-butyl ketone (MIBK), cyclohexanone, 2-HEPTANONE；Ether, dioxane, tetrahydro The ethers systems such as furans, 1,2- dimethoxy-ethane, 1,2- diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether are molten Agent；Methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, amber The ester series solvents such as amber dimethyl phthalate, Texanol；The cellosolves series solvent such as glycol monoethyl ether, ethylene glycol monoethyl ether；Methanol, second The alcohol series solvents such as alcohol, isopropanol or normal propyl alcohol, isobutanol or n-butanol, amylalcohol；Ethylene glycol monomethyl ether acetate, ethylene glycol list second Ether acetic acid ester, propylene glycol -1- monomethyl ether -2- acetic acid esters (PGMEA), dipropylene glycol monomethyl ether acetic acid esters, 3- methoxybutyl second The ether-ethers series solvent such as acid esters, ethoxy ethyl propionate；The BTX series solvent such as benzene,toluene,xylene；Hexane, heptane, octane, ring The aliphatic hydrocarbons series solvent such as hexane；The terpenic series hydrocarbon ils such as turpentine oil, D- limonene, firpene；Mineral spirits, Swasol#310 (Cosmo Matsuyama Oil Co., Ltd. system), the alkanes hydrocarbon system such as SOLVESSO#100 (Exxon Mobil Corporation) is molten Agent；The halogenated aliphatics hydrocarbon system solvents such as carbon tetrachloride, chloroform, trichloro ethylene, methylene chloride, 1,2- dichloroethanes；The halogen such as chlorobenzene For aromatic hydrocarbon series solvent；Propylene carbonate, carbitol series solvent, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, DMAC N,N' dimethyl acetamide, N-Methyl pyrrolidone, dimethyl sulfoxide, water etc..These solvents can be with Use one kind or two or more mixed solvent.
Solidification compound of the invention improves curability, cementability, fluid preservation stability, therefore amount of moisture is preferred For 5 below the mass, further preferably 3 below the mass.Excess moisture happens occasionally gonorrhoea or at the worry analyzed, therefore Without preferred.
Solidification compound of the invention can utilize means well known to roll coater, curtain coater, various printings, impregnating It is coated in support substrate.It is transferred in other support substrates later in the support substrates such as film alternatively, it is also possible to temporarily impose on, Its application method is not particularly limited.
It as the material of above-mentioned support substrate, is not particularly limited, commonly used material can be used, such as can enumerate Out：The inorganic material such as glass；Diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, bytyry cellulose, second The cellulose esters such as acyl propionyl cellulose, NC Nitroncellulose；Polyamide；Polyimides；Polyurethane；Epoxy resin；Polycarbonate； Polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate (PBT), poly terephthalic acid -1, 4- cyclohexanedimethanoester ester, poly- ethylidene -1,2- biphenoxyl ethane -4,4 '-dicarboxylic ester, polybutylene terephthalate (PBT) Equal polyester；Polystyrene；The polyolefin such as polyethylene, polypropylene, polymethylpentene；Polyvinyl acetate, polyvinyl chloride, poly- fluorine second The vinyl compounds such as alkene；The acrylic resins such as polymethyl methacrylate, polyacrylate；Polycarbonate；Polysulfones；Polyethers Sulfone；Polyether-ketone；Polyetherimide；The high molecular materials such as polyoxyethylene, norbornene resin, cyclic olefin polymer (COP).It needs Illustrate, above-mentioned support substrate can also be carried out Corona discharge Treatment, flame treatment, UV treatment, at high-frequency ray The surface activation process such as reason, glow discharge process, reactive plasma treatment, laser treatment.
Made in the cured method of solidification compound of the invention using the irradiation of energy-ray, it, can as energy-ray To enumerate：Ultraviolet light, electron ray, X-ray, emitting radiation, high-frequency ray etc., economically, most preferably ultraviolet light.As The light source of ultraviolet light can enumerate：Ultraviolet laser, mercury lamp, xenon laser, metal halide lamp etc..
The condition in the cured method of solidification compound of the invention is set to be 1~100 at 70~250 DEG C using heating Minute.It can be in prebake (PAB；Pre applied bake) pressurize and carry out afterwards after bake (PEB；Post exposure Bake), or can also be baked at different multistage temperature.Heating condition is according to the type and mix ratio of each ingredient Example and it is different, such as at 70~180 DEG C with drying machine when be 5~15 minutes, with hot plate when be 1~5 minute.Then, in order to Make curing of coating, can by 180~250 DEG C, preferably at 200~250 DEG C, with drying machine when carry out 30~90 minutes, Cured film is obtained with carrying out heating for 5~30 minutes when hot plate.
As the specific purposes of solidification compound of the invention or its solidfied material, can enumerate：Bonding agent, eye Optical material representated by mirror, imaging lens, coating, smears, lining agent, ink, resist, liquid resist, galley, The display elements such as colour TV, PC monitor, portable information terminal, digital camera, organic EL, touch screen, insulating varnish, insulating trip, Plywood, printed base plate, semiconductor device are packed for/liquid crystal injecting port use/organic EL use/optical element use/electrical isolation with/LED With/electronic component-use/seperation film with etc. sealants, moulding material, putty, glass fibre impregnant, calking agent, semiconductor use/ Prismatic lens used in the backlight used for solar batteries for waiting passivating films, interlayer dielectric, protective film, liquid crystal display device are thin The lens sections of lenticular sheets such as Fresnel Lenses thin slice, cylindrical lenses thin slice used in the screen of piece, projection TV etc. make The optical lenses such as back light with such piece etc., lenticule, optical element, optical connector, optical waveguide, optical appearance casting Mould agent etc..
As display device of the invention, can enumerate：Priming coat, counnter attack have been set as needed on transparent supporting body Penetrate the dress of each layers such as layer, polarization element layer, phase separation layer, birefringent films, light scattering layer, hard conating, lubricant layer, protective layer It sets, the film being made of solidfied material of the invention can be used in each layer.
Embodiment
The present invention is illustrated in further detail hereinafter, enumerating embodiment etc., but the present invention is not by these embodiments Restriction.
[Examples 1 to 20, comparative example 1~7]
It is sufficiently mixed each ingredient with compounding shown in following [tables 1]~[table 5], respectively obtains consolidating for Examples 1 to 20 The solidification compound of the property changed composition and comparative example 1~7.It should be noted that embodiment and the unit of comparative example are quality Part.
As cationically polymerizable ingredient (A), following compounds are used.
Compound (A1-1)：Neopentylglycol diglycidyl ether
Compound (A1-2)：1,4- butanediol diglycidyl ether
Compound (A2-1)：ARON OXETANE OXT-221 (Toagosei Co., Ltd's system)
Compound (A3-1)：Bisphenol type diglycidyl ether
Compound (A3-2)：TECHMORE VG3101 (3 functional epoxy of aromatic series：Printech Co., Ltd. system)
As cationic polymerization initiators (B), use following compounds (B-1).
Compound B-1：The carbonic acid of the mixture of following formula (9) compound represented and following formula (10) compound represented Sub- 50% solution of propyl ester
As free-radical polymerised ingredient (C), following compounds are used.
Compound (C1-1)：Epoxy-ester M-600A (Kyoeisha Chemical Co., Ltd.'s system)
Compound (C1-2)：Epoxy-ester 70PA (Kyoeisha Chemical Co., Ltd.'s system)
Compound (C2-1)：1,6 hexanediol diacrylate
As radical polymerization initiator (D), use following compounds (D-1).
Compound (D-1)：IRGACURE 184 (BASF AG's system)
As polymer (E), use following compounds (E-1).
Polymer (E-1)：Copolymer (the weight of 75 mass parts of methyl methacrylate and glycidyl methacrylate 25 Average molecular weight 7000)
As polymer (E '), following compounds (E ' -1) and (E ' -2) are used.
Compound (E ' -1)：The copolymer of methyl methacrylate 75 mass parts and glycidyl methacrylate 25 (weight average molecular weight 800)
Compound (E ' -2：Copolymer (the weight of 75 mass parts of methyl methacrylate and glycidyl methacrylate 25 Average molecular weight 35000)
For each solidification compound of obtained Examples 1 to 20 and comparative example 1~7, carried out according to following step Glass transition temperature (Tg), the evaluation of elasticity modulus, viscosity and adaptation.Result is shown in [table 1]~[table 5] together.
(glass transition temperature and elasticity modulus)
For each solidification compound of obtained Examples 1 to 20 and comparative example 1~7, it is utilized respectively bar coater coating At 30 μm of thickness on polyethylene terephthalate (PET) film, metal halide light irradiation 3000mJ/cm is used2 Energy.Bonding agent solidfied material is taken out after 24 hours from film, uses Hitachi High-Technologies The determination of viscoelasticity device (DMA7100) of Corporation determines Tg and the elasticity modulus at 80 DEG C.
For each solidification compound of obtained Examples 1 to 20 and comparative example 1~7, it is utilized respectively the measurement of E type viscosity The viscosity at 25 DEG C is determined.Result is shown in [table 1]~[table 5] together.
(adaptation)
The composition of Examples 1 to 20 obtained above and comparative example 1~7 is coated on a sided corona treatment PMMA respectively Film (Sumitomo Chemical Co's system：Technology 125S001) on, then electricity is implemented with another using laminating machine COP (cyclic olefin polymer, Zeon Corporation Co. Ltd. system of corona processing：Model Zeonor Film 14- 060) film adhered, 1000mJ/cm is equivalent to across the irradiation of COP film using electrodeless ultraviolet lamp2Light be bonded and Obtain test film.90 degree of disbonded tests have been carried out to obtained test film.
[table 1]
[table 2]
[table 3]
[table 4]
[table 5]
By [table 1]~[table 5] it is found that the curability and excellent adhesion of the solidfied material of solidification compound of the invention.

Claims (7)

1. a kind of solidification compound, which is characterized in that it is with cationically polymerizable ingredient (A) and free-radical polymerised ingredient (C) contain with the mode for adding up to 100 mass parts of polymer (E)：45~90 mass of cationically polymerizable ingredient (A) Part, 0.001~15 mass parts of cationic polymerization initiators (B), free-radical polymerised 1~15 mass parts of ingredient (C), freedom 1~20 mass parts of 1~10 mass parts of base polymerization initiator (D) and the polymer (E), the Weight-average molecular of the polymer (E) Amount is 1000~30000, and the polymer (E) is selected from the group being made of following polymer：The monomer as shown in following formula (I)s obtains To polymer, the monomer as shown in following formula (II)s obtain polymer, as two in the monomer shown in the formula (I) Kind or more the obtained polymer of monomer, the polymerization that is obtained as the two or more monomers in the monomer shown in the formula (II) The polymer that monomer shown in object and the monomer as shown in the formula (I) and the formula (II) obtains,
In formula (I), X is the alkyl of carbon atom number 1~7, the alkoxy of carbon atom number 1~7, the aryl of carbon atom number 6~12, carbon Hydrogen atom in the aryloxy group of atomicity 6~12 or the alicyclic type hydrocarbon of carbon atom number 6~10 or these groups is chosen free ring The group that one or more of oxygroup, the group of oxetanyl, hydroxyl and carboxyl composition group replaces,
In formula (II), R1Indicate that hydrogen atom, methyl or halogen atom, X ' are the alkyl of carbon atom number 1~7, carbon atom number 6~12 Aryl or carbon atom number 6~10 alicyclic type hydrocarbon or hydrogen atom in these groups be chosen free epoxy group, oxa- ring fourth The group that one or more of the group of alkyl, hydroxyl and carboxyl composition group replaces,
The cationically polymerizable ingredient (A) is sweet by the shrink of the glycidol compound of polyalcohol or polyalcohol alkylene oxide addition product Oiling object (A1) and oxetane compound (A2) are used as essential component,
The free-radical polymerised ingredient (C) is by compound (C1) or carbon atom with epoxy group and ethylenically unsaturated group The methacrylate (C2) of the polyalcohol of the acrylate or carbon atom number 2~20 of the polyalcohol of number 2~20 is as necessary Ingredient.
2. solidification compound according to claim 1, wherein as the cationically polymerizable ingredient (A), also contain Aromatic epoxy compound (A3).
3. solidification compound according to claim 2, wherein the aromatic epoxy compound (A3) is multifunctional virtue Fragrant race's epoxide.
4. solidification compound according to claim 1, wherein the polymer (E) is single as shown in the formula (I) The polymer that monomer shown in body and the formula (II) obtains, the X in the formula (I) is the aryl of carbon atom number 6~12, described X ' in formula (II) is the alkyl of carbon atom number 1~7, and the alkyl is replaced by epoxy group.
5. a kind of curing method of solidification compound, which is characterized in that solidification according to any one of claims 1 to 4 Property composition irradiate active energy beam.
6. a kind of curing method of solidification compound, which is characterized in that solidification according to any one of claims 1 to 4 Property composition is heated.
7. a kind of solidfied material, which is characterized in that it is the solidification of solidification compound according to any one of claims 1 to 4 Object.
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