[實施發明之最佳形態] [0013] 以下，對於本發明之硬化性組成物、其硬化方法、藉其所得之硬化物進行詳細的說明。 [0014] 本發明之硬化性組成物係含有陽離子硬化性成分(A)、陽離子聚合起始劑(B)、自由基硬化性成分(C)、自由基聚合起始劑(D)與聚合抑制劑(E)(以下亦分別稱為「(A)成分」、「(B)成分」、「(C)成分」、「(D)成分」及「(E)成分」)。以下，對於(A)～(E)成分進行詳細的說明。 [0015] ＜陽離子硬化性成分(A)＞ 本發明之硬化性組成物中使用的(A)成分係藉由陽離子聚合起始劑而引起高分子化、或交聯反應的化合物，所述陽離子聚合起始劑係藉由能量線照射或加熱而活性化者。作為(A)成分，可舉出環氧化合物、氧雜環丁烷(oxetane)化合物、乙烯基醚化合物等。作為環氧化合物，可舉出脂肪族環氧化合物(A1)、芳香族環氧化合物(A2)、脂環式環氧化合物(A3)等。 [0016] 脂肪族環氧化合物(A1)係指不符合後述之芳香族環氧化合物(A2)或脂環式環氧化合物(A3)的環氧化合物，作為脂肪族環氧化合物(A1)之具體例，可舉出脂肪族醇的縮水甘油醚化物、烷基羧酸的縮水甘油酯等的單官能環氧化合物、或脂肪族多元醇或其環氧烷烴加成物的聚縮水甘油醚化物、脂肪族長鏈多元酸的聚縮水甘油酯等的多官能環氧化合物。作為代表性的化合物，可舉出烯丙基縮水甘油醚、丁基縮水甘油醚、2-乙基己基縮水甘油醚、C12～13混合烷基縮水甘油醚、1,4-丁二醇二縮水甘油醚、新戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、甘油的三縮水甘油醚、三羥甲基丙烷的三縮水甘油醚、山梨醇的四縮水甘油醚、二新戊四醇的六縮水甘油醚、聚乙二醇的二縮水甘油醚、聚丙二醇的二縮水甘油醚、二環戊二烯二甲醇二縮水甘油醚等的多元醇的縮水甘油醚，又藉由在丙二醇、三羥甲基丙烷、甘油等的脂肪族多元醇上加成1種或2種以上的環氧烷烴而得之聚醚多元醇的聚縮水甘油醚化物、脂肪族長鏈二元酸的二縮水甘油酯。進而，可舉出脂肪族高級醇的單縮水甘油醚或高級脂肪酸的縮水甘油酯、環氧化大豆油、環氧硬脂酸辛酯、環氧硬脂酸丁酯、環氧化聚丁二烯等。該等之中，以脂肪族醇的縮水甘油醚化物或者脂肪族多元醇或其環氧烷烴加成物的聚縮水甘油醚化物，由於黏度、塗佈性及反應性為提升故較佳。 [0017] 作為脂肪族環氧化合物(A1)可使用市售品，可舉例如Denacol EX-121、Denacol EX-171、Denacol EX-192、Denacol EX-211、Denacol EX-212、Denacol EX-313、Denacol EX-314、Denacol EX-321、Denacol EX-411、Denacol EX-421、Denacol EX-512、Denacol EX-521、Denacol EX-611、Denacol EX-612、Denacol EX-614、Denacol EX-622、Denacol EX-810、Denacol EX-811、Denacol EX-850、Denacol EX-851、Denacol EX-821、Denacol EX-830、Denacol EX-832、Denacol EX-841、Denacol EX-861、Denacol EX-911、Denacol EX-941、Denacol EX-920、Denacol EX-931 (Nagasechemtex(股)公司製)；Epolite M-1230、Epolite 40E、Epolite 100E、Epolite 200E、Epolite 400E、Epolite 70P、Epolite 200P、Epolite 400P、Epolite 1500NP、Epolite 1600、Epolite 80MF、Epolite 100MF(共榮社化學(股)公司製)、Adeka Glycirol ED-503、Adeka Glycirol ED-503G、Adeka Glycirol ED-506、Adeka Glycirol ED-523P、ADEKA RESIN EP-4088S((股)ADEKA公司製)等。 [0018] 芳香族環氧化合物(A2)係指包含芳香環的環氧化合物且不符合後述之脂環式環氧化合物(A3)的環氧化合物，作為芳香族環氧化合物之具體例，可舉出苯酚、甲酚、丁酚等的具有至少1個芳香族環的多元酚、或其環氧烷烴加成物的單/聚縮水甘油醚化物，例如雙酚A、雙酚F、或在該等上進而加成環氧烷烴的化合物的縮水甘油醚化物或環氧酚醛樹脂；間苯二酚或對苯二酚、鄰苯二酚等的具有2個以上的酚性羥基的芳香族化合物的單/聚縮水甘油醚化物；苯二甲醇或苯二乙醇、苯二丁醇等的具有2個以上醇性羥基的芳香族化合物的縮水甘油醚化物；鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等的具有2個以上的羧酸的多元酸芳香族化合物的聚縮水甘油酯、苯甲酸的縮水甘油酯、氧化苯乙烯或二乙烯苯的環氧化物等。 [0019] 作為芳香族環氧化合物(A2)可使用市售品，可舉例如Denacol EX-146、Denacol EX-147、Denacol EX-201、Denacol EX-203、Denacol EX-711、Denacol EX-721、On Court EX-1020、On Court EX-1030、On Court EX-1040、On Court EX-1050、On Court EX-1051、On Court EX-1010、On Court EX-1011、On Court 1012(Nagasechemtex(股)公司製)；OGSOL PG-100、OGSOL EG-200、OGSOL EG-210、OGSOL EG-250(大阪Gas Chemicals(股)公司製)；HP4032、HP4032D、HP4700(DIC(股)公司製)；ESN-475V(新日鐵住金化學(股)公司製)；Epikote YX8800(三菱化學(股)公司製)；Mar proof G-0105SA、Mar proof G-0130SP(日油(股)公司製)；Epiclon N-665、Epiclon HP-7200(DIC(股)公司製)；EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-7000L(日本化藥(股)公司製)；ADEKA RESIN EP-4000、ADEKA RESIN EP-4005、ADEKA RESIN EP-4100、ADEKA RESIN EP-4901((股)ADEKA公司製)；TECHMORE VG-3101L(PURINTEKKU公司製)等。作為該等芳香族環氧化合物，以多官能者硬化性為優異因而較佳。 [0020] 脂環式環氧化合物(A3)係指在飽和環上未介隔著間隔基而直接鍵結環氧乙烷環者，作為脂環式環氧化合物(A3)之具體例，可舉出具有至少1個的脂環式環的多元醇的聚縮水甘油醚化物或將含有環己烯或環戊烯環的化合物利用氧化劑進行環氧化而得之含有環氧環己烷或環氧環戊烷的化合物。可舉例如氫化雙酚A二縮水甘油醚、3,4-環氧基環己基-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己基羧酸酯、6-甲基-3,4-環氧基環己基-甲基-6-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-3-甲基環己基-甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基-甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧基環己烷)、丙烷-2,2-二基-雙(3,4-環氧基環己烷)、2,2-雙(3,4-環氧基環己基)丙烷、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷羧酸酯)、環氧基六氫鄰苯二甲酸二辛酯、環氧基六氫鄰苯二甲酸二-2-乙基己酯、1-環氧基乙基-3,4-環氧基環己烷、1,2-環氧基-2-環氧基乙基環己烷、α-氧化蒎烯、檸檬烯二氧化物等。該等之中，作為脂環式環氧化合物(A3)，以氫化雙酚A二縮水甘油醚、3,4-環氧基環己基-甲基-3,4-環氧基環己烷羧酸酯或3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯，就密著性提升之觀點而言為較佳。 [0021] 作為脂環式環氧化合物(A3)可使用市售品，可舉例如CELOXIDE 2021P、CELOXIDE 2081、CELOXIDE 2000、CELOXIDE 3000(DAICEL (股)公司製)等。 [0022] 作為氧雜環丁烷化合物(A4)，可舉出3,7-雙(3-氧雜環丁烷基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、三乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、四乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、1,4-雙(3-乙基-3-氧雜環丁烷基甲氧基)丁烷、1,6-雙(3-乙基-3-氧雜環丁烷基甲氧基)己烷等的二官能脂肪族氧雜環丁烷化合物、3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(羥甲基)氧雜環丁烷、3-乙基-3-(氯甲基)氧雜環丁烷等的單官能氧雜環丁烷化合物等。該等係可單獨1種或組合2種以上來使用。 [0023] 作為氧雜環丁烷化合物(A4)，可舉出ARON Oxetane OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成(股)公司製)、ETERNACOLL OXBP、OXTP(宇部興產(股)公司製)等。 [0024] 作為乙烯基醚化合物(A5)，可舉例如二乙二醇單乙烯醚、三乙二醇二乙烯醚、n-十二烷基乙烯醚、環己基乙烯醚、2-乙基己基乙烯醚、2-氯乙基乙烯醚、乙基乙烯醚、異丁基乙烯醚、三乙二醇乙烯醚、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、1,6-環己烷二甲醇單乙烯醚、乙二醇二乙烯醚、1,4-丁二醇二乙烯醚、1,6-環己烷二甲醇二乙烯醚等。 [0025] 於本發明之硬化性組成物係以(A)成分中的脂肪族環氧化合物(A1)、芳香族環氧化合物(A2)、脂環式環氧化合物(A3)、氧雜環丁烷化合物(A4)及乙烯基醚化合物(A5)的使用比例，設為脂肪族環氧化合物(A1)10～50質量%、芳香族環氧化合物(A2)0～20質量%、脂環式環氧化合物(A3)0～20質量%、氧雜環丁烷化合物(A4)0～50質量%、乙烯基醚化合物(A5)0～10質量%，由於黏度、塗佈性、反應性及硬化性為提升故較佳。 [0026] ＜陽離子聚合起始劑(B)＞ 本發明之硬化性組成物中使用的(B)成分，只要是藉由能量線照射或加熱而能夠放出開始陽離子聚合的物質的化合物，則可以是任何的化合物，但較佳為藉由能量線的照射而放出路易斯酸的鎓鹽(即，複鹽)、或其衍生物。作為上述化合物的代表性可舉出下述一般式所表示之陽離子與陰離子的鹽。 [A]r+
[B]r-
[0027] 於此，陽離子[A]r+
係以鎓鹽為較佳，其構造係可例如下述一般式所表示。 [(R2
)a
Q]r+
[0028] 進而，於此R2
係碳原子數為1～60，亦可包含幾個除碳原子以外的原子的有機基。a係1～5的整數。a個的R2
係各自獨立，可相同亦可不同。又，較佳為至少1個係具有芳香環之上述般的有機基。Q係選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成群之原子或原子團。又，將陽離子[A]r+
中的Q的原子價設為q時，必須成立r=a-q的關係(但，N=N係作為原子價0來處理)。 [0029] 又，陰離子[B]r-
係以鹵化物錯合物為較佳，其構造係可以例如下述一般式所表示。 [LYb
]r-
[0030] 進而，於此L係作為鹵化物錯合物的中心原子的金屬或半金屬(Metalloid)，為B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y係鹵素原子。b係3～7的整數。又，將陰離子[B]r-
中的L的原子價設為p時，必須成立r=b-p的關係。 [0031] 作為一般式的陰離子[LYb
]r-
之具體例，可舉出肆(五氟苯基)硼酸鹽、四(3,5-二氟-4-甲氧基苯基)硼酸鹽、四氟硼酸鹽(BF4
)-
、六氟磷酸鹽(PF6
)-
、六氟銻酸鹽(SbF6
)-
、六氟砷酸鹽(AsF6
)-
、六氯銻酸鹽(SbCl6
)-
等。 [0032] 又，陰離子[B]r-
係亦可較佳使用以下述一般式所表示之構造者。 [LYb-1
(OH)]r-
L、Y、b係與上述相同。又，作為其他可使用的陰離子，可舉出過氯酸根離子(ClO4
)-
、三氟甲基亞硫酸根離子(CF3
SO3
)-
、氟磺酸根離子(FSO3
)-
、對甲苯磺酸根陰離子、三硝基苯磺酸根陰離子、樟腦磺酸鹽、九氟丁烷磺酸鹽、十六氟辛烷磺酸鹽、四芳基硼酸鹽、肆(五氟苯基)硼酸鹽等。 [0033] 本發明中，即使是如此般的鎓鹽之中，以使用下述之(i)～(iii)的芳香族鎓鹽為特佳。本發明之硬化性組成物中，該等之中係可單獨使用1種、或亦可併用2種以上。 [0034] (i)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等的芳基重氮鎓鹽。 [0035] (ii)二苯基錪鎓六氟銻酸鹽、二(4-甲基苯基)錪鎓六氟磷酸鹽、二(4-tert-丁基苯基)錪鎓六氟磷酸鹽、甲苯基枯烯基錪鎓肆(五氟苯基)硼酸酯等的二芳基碘鎓鹽。 [0036] (iii)下述群I或群II所表示之鋶陽離子與六氟銻離子、六氟磷酸根離子、肆(五氟苯基)硼酸根離子等的鋶鎓鹽。 [0037][0038][0039] 又，作為其他較佳者，可舉出(η5
-2,4-環戊二烯-1-基)[(1,2,3,4,5,6-η)-(1-甲基乙基)苯]-鐵-六氟磷酸鹽等的鐵-芳烴錯合物、或參(乙醯丙酮)鋁、參(乙基丙酮乙酸)鋁、參(柳醛)鋁等的鋁錯合物與三苯基矽烷醇等的矽烷醇類的混合物；噻吩鎓鹽、四氫噻吩鎓鹽、苄基銨、吡啶鎓鹽、肼鎓鹽等的鹽；二伸乙基三胺、三伸乙基三胺、四伸乙基五胺等的聚烷基多胺類；1,2-二胺基環己烷、1,4二胺基-3,6-二乙基環己烷、異佛酮二胺等的脂環式多胺類；m-間苯二甲胺、二胺基二苯基甲烷、二胺基二苯基碸等的芳香族多胺類；使上述多胺類、與苯基縮水甘油醚、丁基縮水甘油醚、雙酚A-二縮水甘油醚、雙酚F-二縮水甘油醚等的縮水甘油醚類或羧酸的縮水甘油酯類等的各種環氧樹脂藉由常規方法使其反應而製造的聚環氧加成改質物；使上述有機多胺類、與鄰苯二甲酸、間苯二甲酸、二聚物酸等的羧酸類藉由常規方法使其反應而製造的醯胺化改質物；使上述多胺類與甲醛等的醛類及苯酚、甲酚、二甲酚、第三丁酚、間苯二酚等的核上具有至少一個醛化反應性部位的酚類藉由常規方法來使其反應而製造的曼尼希化(Mannich)改質物；多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚物酸、二聚物酸等的脂肪族二羧酸類；鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等的芳香族二羧酸類；環己烷二羧酸等的脂環式二羧酸類；偏苯三酸、均苯三甲酸、蓖麻油脂肪酸的三聚物等的三羧酸類；焦蜜石酸等的四羧酸類等)的酸酐；二氰二胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。 [0040] 該等之中，就實用面與光感度提升之觀點而言，以使用芳香族碘鎓鹽、芳香族鋶鎓鹽、鐵-芳烴錯合物為較佳，將具有下述構造之芳香族鋶鎓鹽，相對於陽離子聚合起始劑(B)100質量%，以至少含有0.1質量%以上為更佳。 [0041]於此，式中R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
及R20
係分別獨立表示氫原子、鹵素原子、碳原子數1～10的烷基、碳原子數1～10的烷氧基或碳原子數2～10的酯基，R21
、R22
、R23
及R24
係分別獨立表示氫原子、鹵素原子或碳原子數1～10的烷基，R25
係表示氫原子、鹵素原子、碳原子數1～10的烷基或選自下述化學式(A)～(C)中任一的取代基，Anq-
係表示q價的陰離子，p係表示將電荷保持為中性的係數。 [0042]於此，式中R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
、R20
、R21
、R22
、R23
、R24
、R26
、R27
、R28
、R29
、R35
、R36
、R37
、R38
及R39
係分別獨立表示氫原子、鹵素原子、碳原子數1～10的烷基、碳原子數1～10的烷氧基或碳原子數2～10的酯基，R30
、R31
、R32
、R33
及R34
係分別獨立表示氫原子、鹵素原子或碳原子數1～10的烷基。 [0043] 一般式(1)所表表之化合物中，作為R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
、R20
、R21
、R22
、R23
、R24
、R25
、R26
、R27
、R28
、R29
、R30
、R31
、R32
、R33
、R34
、R35
、R36
、R37
、R38
及R39
所表示之鹵素原子，可舉出氟、氯、溴、碘等。 [0044] 作為R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
、R20
、R21
、R22
、R23
、R24
、R25
、R26
、R27
、R28
、R29
、R30
、R31
、R32
、R33
、R34
、R35
、R36
、R37
、R38
及R39
所表示之碳原子數1～10的烷基，可舉出甲基、乙基、丙基、異丙基、丁基、s-丁基、t-丁基、異丁基、戊基、異戊基、t-戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧基乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、t-丁硫基甲基、4-戊烯氧基甲基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫代乙基、三甲基甲矽烷基乙基、t-丁基二甲基甲矽氧基甲基、2-(三甲基甲矽烷基)乙氧基甲基、t-丁氧基羰基甲基、乙基氧基羰基甲基、乙基羰基甲基、t-丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷基氧基羰基甲基、乙醯乙基、2-甲氧基-1-丙烯基、羥甲基、2-羥乙基、1-羥乙基、2-羥丙基、3-羥丙基、3-羥丁基、4-羥丁基、1,2-二羥乙基等。 [0045] 作為R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
、R20
、R21
、R22
、R23
、R24
、R26
、R27
、R28
、R29
、R35
、R36
、R37
、R38
及R39
所表示之碳原子數1～10的烷氧基，可舉出甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、s-丁氧基、t-丁氧基、異丁氧基、戊氧基、異戊氧基、t-戊氧基、己氧基、環己氧基、環己基甲基氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙基氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙基氧基、甲氧基乙氧基乙基氧基、甲氧基乙氧基乙氧基乙基氧基、3-甲氧基丁氧基、2-甲硫基乙基氧基、三氟甲基氧基等。 [0046] 作為R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
、R20
、R21
、R22
、R23
、R24
、R26
、R27
、R28
、R29
、R35
、R36
、R37
、R38
及R39
所表示之碳原子數2～10的酯基，可舉出甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、t-丁基羰基氧基、甲氧基乙醯氧基、苯甲醯氧基等。 [0047] 即使是該等之中，就實用面與光感度提升之觀點而言，以使用芳香族碘鎓鹽、芳香族鋶鎓鹽、鐵-芳烴錯合物為較佳，將具有上述構造之芳香族鋶鎓鹽，相對於陽離子聚合起始劑(B)100質量%，以至少含有0.1質量%以上為更佳。 [0048] 相對於(A)成分之(B)成分的使用比例並無特別限定，只要是在不阻礙本發明目的之範圍內以大概通常的使用比例來使用即可，例如相對於(A)成分100質量份，(B)成分設為0.001～15質量份，較佳為0.1～10質量份。若過少時則硬化將變得不足，若過多時，則會有對硬化物的吸水率或硬化物強度等的諸物性造成不良影響之情形。 [0049] ＜自由基硬化性成分(C)＞ 作為自由基硬化性成分(C)，可舉例如具有環氧基及乙烯性不飽和基的化合物(C1)、或碳原子數2～20之醇的丙烯酸酯或碳原子數2～20之醇的甲基丙烯酸酯(C2)。 [0050] 作為具有環氧基及乙烯性不飽和基的化合物(C1)，可舉例如環氧丙烯酸酯或環氧甲基丙烯酸酯，具體而言有將以往周知的芳香族環氧樹脂、脂環式環氧樹脂、脂肪族環氧樹脂等，與丙烯酸或甲基丙烯酸反應而得之丙烯酸酯。該等的環氧丙烯酸酯或環氧甲基丙烯酸酯之中，特佳者為醇類的縮水甘油基醚的丙烯酸酯或甲基丙烯酸酯。 [0051] 作為碳原子數2～20之醇的丙烯酸酯或碳原子數2～20之醇的甲基丙烯酸酯(C2)，可舉出使分子中至少具有1個羥基的芳香族或脂肪族醇、及其環氧烷烴加成物與丙烯酸或甲基丙烯酸反應而得之丙烯酸酯或甲基丙烯酸酯、具體而言可舉例丙烯酸2-乙基己酯、丙烯酸2-羥乙酯、丙烯酸2-羥丙酯、丙烯酸異戊酯、丙烯酸月桂酯、丙烯酸硬脂酯、丙烯酸異辛酯、丙烯酸四氫糠酯、丙烯酸異降冰片酯、丙烯酸苄酯、1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、新戊二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯、ε-己內酯改質二季戊四醇六丙烯酸酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸2-羥乙酯、甲基丙烯酸2-羥丙酯、甲基丙烯酸異戊酯、甲基丙烯酸月桂酯、甲基丙烯酸硬脂酯、甲基丙烯酸異辛酯、甲基丙烯酸四氫糠酯、甲基丙烯酸異降冰片酯、甲基丙烯酸苄酯、1,3-丁二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、新戊二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、聚丙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、二季戊四醇六甲基丙烯酸酯、ε-己內酯改質二季戊四醇六甲基丙烯酸酯等。尚，該等的丙烯酸酯或甲基丙烯酸酯之中，以多元醇的聚丙烯酸酯類或多元醇的聚甲基丙烯酸酯類為特佳。 [0052] 作為自由基硬化性成分(C)，亦可使用藉由除(C1)或(C2)以外的能量線照射或加熱而活性化的自由基聚合起始劑來引起高分子化或交聯反應的化合物，可舉例如烯丙基胺基甲酸酯化合物、不飽和聚酯化合物、苯乙烯系化合物等。 [0053] 自由基硬化性成分(C)100質量%中，具有環氧基及乙烯性不飽和基的化合物(C1)及碳原子數2～20之醇的丙烯酸酯或碳原子數2～20之醇的甲基丙烯酸酯(C2)的使用比例，係以具有環氧基及乙烯性不飽和基的化合物(C1)設為0～99.9質量%、碳原子數2～20之醇的丙烯酸酯或碳原子數2～20之醇的甲基丙烯酸酯(C2)設為0.1～100質量%為較佳。 [0054] ＜自由基聚合起始劑(D)＞ 作為自由基聚合起始劑(D)並無特別限制，可使用苯乙酮系化合物、苄系化合物、二苯基酮系化合物、噻吨酮系化合物等的酮系化合物、肟系化合物等。 [0055] 作為苯乙酮系化合物，可舉例如二乙氧基苯乙酮、2-羥基-2-甲基-1-苯丙烷-1-酮、4’-異丙基-2-羥基-2-甲基苯丙酮、2-羥基-甲基-2-甲基苯丙酮、2,2-二甲氧基-1,2-二苯乙烷-1-酮、p-二甲基胺基苯乙酮、p-叔丁基二氯苯乙酮、p-叔丁基三氯苯乙酮、p-疊氮苯亞甲基苯乙酮、1-羥基環己基苯基酮、2-甲基-1-[4-(甲基硫)苯基]-2-嗎啉基丙酮-1、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1、苯偶姻、苯偶姻甲基醚、苯偶姻乙醚、苯偶姻異丙醚、苯偶姻-n-丁醚、苯偶姻異丁醚、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮等。 [0056] 作為苄系化合物，可舉出苄等。 [0057] 作為二苯基酮系化合物，可舉例如二苯甲酮、o-苯甲醯苯甲酸甲酯、米其勒酮、4,4’-雙二乙基胺二苯甲酮、4,4’-二氯二苯甲酮、4-苯甲醯-4’-甲基二苯基硫醚等。 [0058] 作為噻吨酮系化合物，可舉出噻吨酮、2-甲硫基呫噸酮、2-乙基噻吨酮、2-氯噻吨酮、2-異丙基噻吨酮、2,4-二乙基噻吨酮等。 [0059] 作為肟系化合物，特別是以下述一般式(2)所表示之化合物就感度及耐熱性之點而言為較佳。 [0060]於此，式(2)中R60
及R61
係分別獨立表示氫原子、硝基、鹵素原子、氰基、碳原子數1～20的烷基、碳原子數6～30的芳基、碳原子數7～30的芳烷基或、碳原子數2～20的雜環基或單鍵，R62
及R63
係分別獨立表示氫原子、鹵素原子、硝基、氰基、羥基、羧基、R64
、OR65
、SR66
、NR67
R68
、COR69
、SOR70
、SO2
R71
或CONR72
R73
。R60
及R61
係亦可相互鍵結來形成環，R64
、R65
、R66
、R67
、R68
、R69
、R70
、R71
、R72
及R73
係分別獨立表示碳原子數1～20的烷基、碳原子數6～30的芳基、碳原子數7～30的芳烷基或碳原子數2～20的含有雜環的基，X1
係表示氧原子、硫原子、硒原子、CR74
R75
、CO、NR76
或PR77
，X2
係表示單鍵或CO，R74
、R75
、R76
及R77
係分別獨立表示氫原子、碳原子數1～20的烷基、碳原子數6～30的芳基或碳原子數7～30的芳烷基，前述的烷基或芳烷基中的亞甲基係亦可被鹵素原子、硝基、氰基、羥基、羧基或雜環基所取代，亦可被-O-中斷，R74
、R75
、R76
及R77
係亦可分別獨立與相鄰的任一苯環一起形成環。h係表示0～4的整數，i係表示0～5的整數。 [0061] 作為一般式(2)之各代號所表示之烷基、芳基、芳烷基、雜環基之例子，可舉出碳原子數1～20的烷基、碳原子數6～30的芳基、碳原子數7～30的芳烷基、吡咯基、吡啶基、嘧啶基、噠嗪基(pyridazyl)、吡基、哌啶基、吡喃基、吡唑基、三嗪基、吡咯啶基、喹啉基、異喹啉基、咪唑基、苯并咪唑基、三唑基、呋喃基(furyl)、喃基 (furanyl)、苯并喃基、噻吩基、苯硫基、苯并苯硫基、噻二唑基、噻唑基、苯并噻唑基、噁唑基、苯并噁唑基、異噻唑基、異噁唑基、引哚基、久洛尼定基(julolidin)、嗎咻基、硫代嗎咻基、2-吡咯酮-1-基、2-哌啶酮-1-基、2,4-二氧基咪唑啶-3-基、2,4-二氧基唑-3-基等的雜環基。 [0062] 作為其他的光自由基聚合起始劑，可舉出2,4,6-三甲基苯甲醯基二苯基氧化膦等的氧化膦系化合物、雙(環戊二烯)-雙[2,6-二氟-3-(雙-1-基)]鈦等的二茂鈦系化合物等。 [0063] 作為自由基聚合起始劑(D)係可使用市售者，可舉例如N-1414、N-1717、N-1919、PZ-808、NCI-831、NCI-930((股)ADEKA公司製)、IRGACURE184、IRGACURE369、IRGACURE651、IRGACURE907、IRGACURE OXE 01、IRGACUREOXE 02、IRGACURE784 (BASF公司製)、TR-PBG-304、TR-PBG-305、TR-PBG-309、TR-PBG-314(Tronly公司製)等。 [0064] 相對於自由基硬化性成分(C)的自由基聚合起始劑(D)的使用比例，係相對於自由基硬化性成分(C)100質量份，以自由基聚合起始劑(D)0.1～25質量份為較佳，又較佳為5～25質量份。若過少時則硬化將容易變得不足，若過多時則會有對硬化物的吸水率或硬化物強度等的諸物性造成不良影響之情形。 [0065] 陽離子硬化性成分(A)與自由基硬化性成分(C)的調配比例，就質量份換算計以(A)成分：(C)成分=95：5～5：95為較佳。 [0066] ＜聚合抑制劑(E)＞ 聚合抑制劑(E)係捕捉自由基或質子，因而可使用周知者來作為乙烯性不飽和化合物的聚合抑制劑或抗氧化劑。除了例如吩噻嗪、甲氧基吩噻嗪、苯基-α-萘胺、N,N’-二苯基-p-苯二胺、4,4-四甲基二胺基二苯胺、呱啶、2,6-二甲基呱啶、2,2,6,6-四甲基呱啶、哌啶基自由基、2,6-二甲基哌啶基自由基、2,2,6,6-四甲基哌啶基自由基等的胺類、苯酚、甲氧基酚、壬基酚、氫醌、氫醌單甲基醚、1,4-苯并醌、t-丁基鄰苯二酚、間苯二酚、丁基羥基甲苯、丁基β-羥基丙酸酯、丁基β-丁氧基丙酸酯、丁基馬來酸酯、甲酚、丁基羥基甲苯、1,1’,1’’-硝基三-2-丙醇、2,5-二-t-丁氫醌、1,2,4-三羥基苯、2,5-雙四甲基丁氫醌、醌茜隱色體(leucoquinizarin)、1,1-二苯基-2-三硝基苯肼(picrylhydrazine)等的酚類、四乙基秋蘭姆二硫化物等的有機硫系化合物、二丁基二硫代胺基甲酸鋅、二丁基二硫代胺基甲酸銅、鋁-銅鐵靈(cupferron)錯合物(銅鐵靈Al)等的金屬錯合物類等的以外，可舉出已知作為酚系抗氧化劑、磷系抗氧化劑、硫醚系抗氧化劑。該等的聚合抑制劑係可單獨或併用2種以上。聚合抑制劑之中，與磷系抗氧化劑相較下，由於酚系抗氧化劑對於陽離子硬化成分的硬化阻害少或沒有，故可維持密著性為較佳。 [0067] 作為酚系抗氧化劑，可舉例如2,6-二-t-丁基-P-甲酚、2,6-二苯基-4-十八烷氧基苯酚、二硬脂基(3,5-二第三丁基-4-羥基苄基)磷酸鹽、1,6-六亞甲基雙[(3,5-二第三丁基-4-羥基苯基)丙酸醯胺]、4,4’-硫代雙(6-第三丁基-M-甲酚)、2,2’-亞甲基雙(4-甲基-6-第三丁酚)、2,2’-亞甲基雙(4-乙基-6-第三丁酚)、4,4’-亞丁基雙(6-第三丁基-M-甲酚)、2,2’-亞乙基雙(4,6-二第三丁酚)、2,2’-亞乙基雙(4-第二丁基-6-第三丁酚)、1,1,3-參(2-甲基-4-羥基-5-第三丁基苯基)丁烷、1,3,5-參(2,6-二-甲基-3-羥基-4-第三丁基苄基)異氰脲酸酯、1,3,5-參(3,5-二第三丁基-4-羥基苄基)異氰脲酸酯、1,3,5-參(3,5-二第三丁基-4-羥基苄基)-2,4,6-三甲基苯、2-第三丁基-4-甲基-6-(2-丙烯醯氧基-3-第三丁基-5-甲基苄基)苯酚、硬脂基(3,5-二第三丁基-4-羥基苯基)丙酸酯、肆[3-(3,5-二第三丁基-4-羥基苯基)丙酸甲酯甲烷、硫代二乙二醇雙[(3,5-二第三丁基-4-羥基苯基)丙酸酯]、1,6-六亞甲基雙[(3,5-二第三丁基-4-羥基苯基)丙酸酯]、雙[3,3-雙(4-羥基-3-第三丁基苯基)丁酸]二醇酯、雙[2-第三丁基-4-甲基-6-(2-羥基-3-第三丁基-5-甲基苄基)苯基]對苯二甲酸酯、1,3,5-參[(3,5-二第三丁基-4-羥基苯基丙醯氧基乙基]異氰脲酸酯、3,9-雙[1,1-二-甲基-2-{(3-第三丁基-4-羥基-5-甲基苯基)丙醯氧基}乙基]-2,4,8,10-四螺[5,5]十一烷、三乙二醇雙[(3-第三丁基-4-羥基-5-甲基苯基)丙酸酯等。 [0068] 作為磷系抗氧化劑，可舉例如亞磷酸參壬基苯基酯、參[2-第三丁基-4-(3-第三丁基-4-羥基-5-甲基苯硫基)-5-甲基苯基]亞磷酸鹽、亞磷酸三癸酯、亞磷酸辛基二苯基酯、二(癸基)單苯基亞磷酸鹽、二(十三烷基)季戊四醇二亞磷酸鹽、二(壬基苯基)季戊四醇二亞磷酸鹽、雙(2,4-二第三丁基苯基)季戊四醇二亞磷酸鹽、雙(2,6-二第三丁基-4-甲基苯基)季戊四醇二亞磷酸鹽、雙(2,4,6-三第三丁基苯基)季戊四醇二亞磷酸鹽、雙(2,4-二異丙苯基苯基)季戊四醇二亞磷酸鹽、四(十三烷基)亞異丙基二苯酚二亞磷酸鹽、四(十三烷基)-4,4’-N-亞丁基雙(2-第三丁基-5-甲基苯酚)二亞磷酸鹽、六(十三烷基-1,1,3-參(2-甲基-4-羥基-5-第三丁基苯基)丁烷三亞磷酸鹽、肆(2,4-二第三丁基苯基)聯亞苯基二亞膦酸酯、9,10-二氫-9- 氧雜-10-磷雜菲-10-氧化物、2,2’-亞甲基雙(4,6-第三丁基苯基)-2-乙基己基亞磷酸鹽、2,2’-亞甲基雙(4,6-第三丁基苯基)-十八烷基亞磷酸鹽、2,2’-亞乙基雙(4,6-二第三丁基苯基)氟亞磷酸鹽、參(2-[(2,4,8,10-肆第三丁基二苯并[D,F][1,3,2]二磷環庚烷-6-基)氧基]乙基)胺、2-乙基-2-丁基丙二醇與2,4,6-三第三丁酚的亞磷酸鹽等。 [0069] 作為硫醚系抗氧化劑，可舉例如硫代二丙酸二月桂基酯、硫代二丙酸二肉豆蔻基酯、硫代二丙酸二硬脂基酯等的二烷基硫代二丙酸酯類、及季戊四醇四(β-烷基巰基丙酸)酯類。 [0070] 作為聚合抑制劑(E)係可使用市售者，可舉例如DIC-TBC(DIC(股)公司製)、IRGANOX1010、IRGANOX1035、IRGANOX1076、IRGANOX1098、IRGANOX1135、IRGANOX1222、IRGANOX1330、IRGANOX1726、IRGANOX1425、IRGANOX1520、IRGANOX245、IRGANOX259、IRGANOX3114、IRGANOX565、IRGANOX295、IRGANOXHP2225FF、IRGANOXHP2341、IRGANOXHP2921FF、IRGAFOS168、IRGASTABUV10、IRGASTABUV22(BASF公司製)、NONFLEX F、NONFLEX H、NONFLEX DCD、NONFLEX MBP、OZONONE 35(精工化學(股)公司製)、Q-1300、Q-1301(和光純藥工業(股)公司製)、Adekastub 2112、Adekastub PEP-8、Adekastub 260、Adekastub 3010、Adekastub HP-10、Adekastub 329K、Adekastub PEP-24G((股)ADEKA製)、SUMILIZER GM、SUMILIZER GS、SUMILIZER TPL-R、SUMILIZER TPS、SUMILIZER TPD(住友化學(股)公司製)、Genorad16(RahnAG公司製)、Antage BHT、Antage DAH、Antage DBH、Antage W-300、Antage W-400、Antage W-500、Antage CRYSTAL(川口化學工業(股)公司製)等。 [0071] 上述聚合抑制劑(E)的使用比例，相對於上述自由基硬化性成分(C)100質量份，以聚合抑制劑(E)設為5×10-3
～0.2質量份，較佳為0.05～0.1質量份。若聚合抑制劑(E)過多時，將會產生硬化阻礙而使得硬化易變得不足，若過少時則黏保存穩定性不佳而使得黏度提高，或變得無法兼具各種物性。 [0072] ＜任意的聚合物(F)＞ 本發明之硬化性組成物中進而可加入：由下式(I)所表示之單體所得之聚合物、由下述式(II)所表示之單體所得之聚合物、選自由下述式(I)所表示之單體之二種以上的單體所得之聚合物、選自由下述式(II)所表示之單體之二種以上的單體所得之聚合物、或選自由下述式(I)所表示之單體及下述式(II)所表示之單體所得之聚合物之群的重量平均分子量以聚苯乙烯換算為1000～30000的聚合物(F)(以下亦稱為聚合物(F))。 [0073]於此，式(I)中，X3
係碳原子數1～7的烷基、碳原子數1～7的烷氧基、碳原子數6～12的芳基、碳原子數6～12的芳氧基或碳原子數6～10的脂環式烴基，或該等的基中的氫原子被選自由環氧基、氧雜環丁烷基、羥基及羧基所成之群之1種以上的基所取代者。 [0074]於此，式(II)中，R1
係表示氫原子、甲基或鹵素原子，X4
係碳原子數1～7的烷基、碳原子數6～12的芳基或碳原子數6～10的脂環式烴基，或該等的基中的氫原子被選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上的基所取代者。 [0075] 作為上述式(I)中的X3
所表示之碳原子數1～7的烷基，可舉出甲基、乙基、丙基、iso-丙基、丁基、sec-丁基、tert-丁基、iso-丁基、戊基、iso-戊基、tert-戊基、己基、2-己基、3-己基、環己基、4-甲基環己基、庚基、2-庚基、3-庚基、iso-庚基、tert-庚基等。該等之中，以碳原子數1～4的烷基、或可被選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上的基進行部分取代的碳原子數1～4的烷基，就硬化性之點而言為較佳。 [0076] 作為上述式(I)中的X3
所表示之碳原子數1～7的烷氧基，可舉出甲氧基、乙氧基、丙氧基、iso-丙氧基、丁氧基、sec-丁氧基、tert-丁氧基、iso-丁氧基、戊氧基、iso-戊氧基、tert-戊氧基、己氧基、2-己氧基、3-己氧基、環己氧基、4-甲基環己氧基、庚氧基、2-庚氧基、3-庚氧基、iso-庚氧基、tert-庚氧基等。該等之中，以碳原子數1～4的烷基、或可被選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上的基進行部分取代的碳原子數1～4的烷氧基，就硬化性之點而言為較佳。 [0077] 作為上述式(I)中的X3
所表示之碳原子數6～12的芳基，可舉出苯基、甲基苯基、萘基等。 [0078] 作為上述式(I)中的X3
所表示之碳原子數6～12的芳氧基，可舉出苯氧基、甲基苯氧基、萘氧基等。 [0079] 作為上述式(I)中的X3
所表示之碳原子數6～10的脂環式烴基，可舉出環己基、甲基環己基、降冰片基、雙環戊基、雙環辛基、三甲基雙環庚基、三環辛基、三環癸基、螺辛基、旋環雙環戊基、金剛烷基、異莰基等。 [0080] 上述式(I)中，X3
的一部分若被環氧基或氧雜環丁烷基所取代之情形時，作為式(I)所表示之單體，可舉例如下述式(3)～(5)所表示之單體。 [0081]於此，式(3)中，R3
係表示氫原子或碳原子數1～6的烷基，m係1～6的整數。 [0082]於此，式(4)中，R4
係表示氫原子或碳原子數1～6的烷基，n係1～6的整數。 [0083]於此，式(5)中，R5
係表示氫原子或碳原子數1～6的烷基，s係1～6的整數。 [0084] 上述式(II)中，作為R1
所表示之鹵素原子，可舉出氟、氯、溴、碘等。 [0085] 上述式(II)中，X4
的一部分若被環氧基或氧雜環丁烷基所取代之情形時，作為式(II)所表示之單體，可舉出下述式(6)～(8)所表示者。 [0086]於此，式(6)中，R1
係與上述式(II)為相同，R6
係表示氫原子或碳原子數1～6的烷基，t係1～6的整數。 [0087]於此，式(7)中，R1
係與上述式(II)為相同，R7
係表示氫原子或碳原子數1～6的烷基，q係1～6的整數。 [0088]於此，式(8)中，R1
係與上述式(II)為相同，R8
係表示氫原子或碳原子數1～6的烷基，y係1～6的整數。 [0089] 上述聚合物(F)中，構成聚合物的單體的使用比例，若上述X為被選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上的基所取代的碳原子數1～7的烷基、碳原子數6～12的芳基或碳原子數6～10的脂環式烴基之情形時，以上述(I)或(II)所表示之單體成為10～100質量%之方式來使用者，因為接著性會提升故較佳。 [0090] 本發明之硬化性組成物中，相對於上述陽離子硬化性成分(A)及自由基硬化性成分(C)的合計量100質量份，若上述聚合物(F)設為1～20質量份時，因為硬化物的硬化性及接著性為良好故較佳。 [0091] ＜其他的成分＞ 本發明之硬化性組成物，因應所需可使用增感劑及/或增感輔助劑。對比於陽離子聚合起始劑(B)所顯示的最大吸收波長，增感劑係於更長波長處顯示出最大吸收，並為促進藉由陽離子聚合起始劑(B)之聚合起始反應的化合物。又，增感輔助劑係進一步促進增感劑之作用的化合物。 [0092] 作為增感劑及增感輔助劑，可舉出蔥系化合物、萘系化合物等。 [0093] 作為蔥系化合物，可舉例如下述式(9)所表示者。 [0094]於此，式(9)中，R101
及R102
係各自獨立表示氫原子、碳原子數1～6的烷基或碳原子數2～12的烷氧基烷基，R103
係表示氫原子或碳原子數1～6的烷基。 [0095] 若舉出上述式(9)所表示之蔥系化合物之具體例時，有如以下般的化合物。 [0096] 9,10-二甲氧基蔥、9,10-二乙氧基蔥、9,10-二丙氧基蔥、9,10-二異丙氧基蔥、9,10-二丁氧基蔥、9,10-二戊氧基蔥、9,10-二己氧基蔥、9,10-雙(2-甲氧基乙氧基)蔥、9,10-雙(2-乙氧基乙氧基)蔥、9,10-雙(2-丁氧基乙氧基)蔥、9,10-雙(3-丁氧基丙氧基)蔥、2-甲基-或2-乙基-9,10-二甲氧基蔥、2-甲基-或2-乙基-9,10-二乙氧基蔥、2-甲基-或2-乙基-9,10-二丙氧基蔥、2-甲基-或2-乙基-9,10-二異丙氧基蔥、2-甲基-或2-乙基-9,10-二丁氧基蔥、2-甲基-或2-乙基-9,10-二戊氧基蔥、2-甲基-或2-乙基-9,10-二己氧基蔥等。 [0097] 作為萘系化合物，可舉例如下述式(10)所表示者。 [0098]於此，式(10)中，R104
及R105
係各自獨立表示碳原子數1～6的烷基。 [0099] 若舉出上述式(10)所表示之萘系化合物之具體例時，有如以下般的化合物。 [0100] 4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 [0101] 增感劑及增感輔助劑的使用比例並無特別限定，只要是在不阻礙本發明目的之範圍內以大概通常的使用比例來使用即可，例如相對於陽離子硬化性成分(A)及自由基硬化性成分(C)的合計量100質量份，以增感劑及增感輔助劑分別設為0.1～3質量份者，就硬化性提升之觀點為較佳。 [0102] 本發明之硬化性組成物中，因應所需可使用矽烷偶合劑。作為矽烷偶合劑，可使用例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等的烷基官能性烷氧基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等的烯基官能性烷氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等的環氧官能性烷氧基矽烷、N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等的胺基官能性烷氧基矽烷、γ-巰基丙基三甲氧基矽烷等的巰基官能性烷氧基矽烷、四異丙醇鈦、四正丁醇鈦等的烷醇鈦類、二辛氧基雙(辛二醇)鈦、二異丙氧基雙(乙醯乙酸乙酯)鈦等的鈦螯合物類、四乙醯丙酮鋯、三丁氧基單乙醯丙酮鋯等的鋯螯合物類、三丁氧基單硬脂酸鋯等的醯化鋯類、甲基三異氰酸酯基矽烷等的異氰酸酯基矽烷類等。 [0103] 矽烷偶合劑的使用量並無特別限定，通常相對於硬化性組成物中的固形物的全量100質量份，以設為0.01～20質量份的範圍。 [0104] 本發明之硬化性組成物中，無特別限制，可使用通常能將(A)、(B)、(C)、(D)及(E)的各成分溶解或分散的溶劑，可舉例如、甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等的酮類；乙基醚、二噁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲基醚、二丙二醇二甲基醚等的醚系溶劑；乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、單異丁酸酯等的酯系溶劑；乙二醇單甲基醚、乙二醇單乙基醚等的溶纖劑系溶劑；甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等的醇系溶劑；乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲基醚-2-乙酸酯(PGMEA)、二丙二醇單甲基醚乙酸酯、3-甲氧基丁基乙酸酯、乙氧基乙基乙酸酯等的醚酯系溶劑；苯、甲苯、二甲苯等的BTX系溶劑；己烷、庚烷、辛烷、環己烷等的脂肪族烴系溶劑；松節油、D-檸檬烯、蒎烯等的萜烯系烴油；礦油精、Swasol#310(Cosmo松山石油(股))、Solvesso#100(Exxon化學(股))等的石蠟系溶劑；四氯化碳、三氯甲烷、三氯乙烯、二氯甲烷、1,2-二氯乙烷等的鹵化脂肪族烴系溶劑；氯苯等的鹵化芳香族烴系溶劑；碳酸伸丙酯、卡必醇系溶劑、苯胺、三乙基胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸、水等，該等的溶劑係可使用1種或作為2種以上的混合溶劑來使用。 [0105] 又，只要不損及本發明之效果，可因應所需添加多元醇、無機填充料、有機填充料、顏料、染料等的著色劑、消泡劑、增稠劑、界面活性劑、整平劑、耐燃劑、觸變劑、稀釋劑、可塑劑、穩定劑、聚合抑制劑、紫外線吸收劑、潛在性添加劑、抗靜電劑、流動調整劑、接著促進劑等的各種樹脂添加物等。 [0106] 本發明之硬化性組成物係因硬化性、接著性、液體保存穩定性為提升，故以水分量設為5質量份以下為較佳，以3質量份以下為更佳。若水分過多時，因為將會有白濁或成分析出之虞故為不佳。 [0107] 本發明之硬化性組成物係可藉由輥塗佈機、淋幕式塗佈機各種的印刷、浸漬等的周知的手段而被適用於支撐基體上。又，一旦於薄膜等的支撐基體上實施後，亦可轉印至其他的支撐基體上，對於其適用方法並無限制。 [0108] 作為支撐基體的材料並無特別限制，可使用通常所使用者，可舉例如玻璃等的無機材料；二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯丙醯基纖維素、硝化纖維素等的纖維素酯；聚醯胺；聚醯亞胺；聚胺基甲酸酯；環氧樹脂；聚碳酸酯；聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚對苯二甲酸-1,4-環己烷二甲酯、聚乙烯-1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚對苯二甲酸丁二酯等的聚酯；聚苯乙烯；聚乙烯、聚丙烯、聚甲基戊烯等的聚烯烴；聚乙酸乙烯酯、聚氯乙烯、聚氟乙烯等的乙烯化合物；聚甲基丙烯酸甲酯、聚丙烯酸酯等的丙烯酸系樹脂；聚碳酸酯；聚碸；聚醚碸；聚醚酮；聚醚醯亞胺；聚氧乙烯、降莰烯樹脂、環烯烴聚合物(COP)等的高分子材料。尚，亦可對支撐基體進行電暈放電處理、火炎處理、紫外線處理、高周波處理、輝光放電處理、活性等離子處理、雷射處理等的表面活性化處理。 [0109] 將本發明之硬化性組成物藉由能量線的照射來使其硬化之情形時，作為能量線可舉出紫外線、電子線、X線、放射線、高周波等，以紫外線就經濟上為最佳。作為紫外線的光源，可舉出紫外線雷射、水銀燈、氙氣雷射、金屬鹵素燈等。 [0110] 將本發明之硬化性組成物藉由加熱來使其硬化之情形時之條件為以70～250℃下1～100分。於預烘烤(PAB；Pre applied bake)後進行加壓，可進行後烘烤(PEB；Post exposure bake)、或亦可採用數個階段的溫度來進行烘烤。 [0111] 加熱條件係依據各成分的種類及調配比例而有所不同，例如以70～180℃下，若烘箱為5～15分鐘，若加熱板則為1～5分鐘。之後，為了使塗膜硬化設為180～250℃，較佳為200～250℃下，藉由若烘箱為30～90分鐘，若加熱板則為5～30分鐘來進行加熱處理從而得到硬化膜。 [0112] 作為本發明之硬化性組成物及其硬化物的具體用途，可舉出以接著劑、偏光板用接著劑、眼鏡、攝影用透鏡為代表的光學材料、塗料、塗佈劑、襯裡劑、油墨、抗蝕劑、液狀抗蝕劑、印刷版、彩色電視機、PC監控器、個人數據终端、數位相機、有機EL、觸控式面板等的顯示元件、絕緣清漆、絕緣薄片、層合板、印刷基板、半導體裝置用・LED封裝用・液晶注入口用・有機EL用・光元件用・電絕緣用・電子零件用・分離膜用等的密封劑、成形材料、油灰、玻璃纖維含浸劑、填料劑、半導體用・太陽電池用等的鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置的背光源所使用的稜鏡透鏡薄片、投影電視等的螢幕所使用的菲涅耳透鏡薄片、雙凸透鏡薄片等的透鏡薄片的透鏡部、或使用如此般的薄片的背光源等、微透鏡等的光學透鏡、光學元件、光偶合器、光導波路、光學的造形用注模劑等。 [0113] 作為本發明之顯示裝置，因應所需可於透明支撐體上設置例如底塗層、抗反射層、偏光元件層、相位差層、雙折射率層、光散射層、硬塗佈層、潤滑層、保護層等的各層者，於各層中可使用由本發明之硬化物所成的薄膜。 [實施例] [0114] 以下，關於本發明之硬化性組成物及將硬化性組成物進行硬化所得之硬化物，藉由利用實施例及比較例來更詳細地說明，但本發明並非被限定於該等的實施例中。尚，實施例及比較例中，份係指質量份之意。 [0115] [實施例1～8、比較例1～3] 依下述之[表1]～[表2]所表示的調配將各成分充分地混合來調製各硬化性組成物。對於所得之各硬化性組成物，依據下述之程序來測定黏度、接著性、玻璃轉移溫度(Tg)及於80℃下的彈性率。將所得之結果合併記載於表1、2中。 [0116] 作為陽離子硬化性成分(A)係使用下述之化合物A1-1、A1-2、A3-1及A4-1。 化合物A1-1：1,6-己二醇二縮水甘油醚 化合物A1-2：2-乙基己基縮水甘油醚 化合物A3-1：CELOXIDE 2021P(DAICEL (股)公司製) 化合物A4-1：ARON Oxetane OXT-221(氧雜環丁烷：東亞合成(股)公司製) [0117] 作為陽離子聚合起始劑(B)係使用下述之化合物B-1。 化合物B-1：下述之2化合物的混合物的碳酸伸丙酯50%溶液 [0118][0119][0120] 作為自由基硬化性成分(C)係使用下述之化合物C2-1。 化合物C2-1：1,6-己二醇二丙烯酸酯 [0121] 作為自由基聚合起始劑(D)係使用下述之化合物D1-1。 化合物D-1：Irgacure 184(BASF公司製) [0122] 作為聚合抑制劑(E)係使用下述之化合物E-1～E-4。 化合物E-1：AO-60((股)ADEKA公司製抗氧化劑) 化合物E-2：氫醌單甲基醚(MEHQ) 化合物E-3：氫醌(HQ) 化合物E-4：三苯基亞磷酸鹽 [0123] 作為聚合物(F)係使用下述之化合物F-1。 化合物F-1：甲基丙烯酸甲酯75質量份與縮水甘油甲基丙烯酸酯25質量份的共聚物(重量平均分子量8000) [0124] (黏度) 將所得之各硬化性組成物利用E型黏度計分別測定於25℃下的黏度。 [0125] (接著性) 將所得之各硬化性組成物分別塗佈至一片的PMMA薄膜(住友化學(股)製：TECNOLOY 125S001)上後，利用貼合機與另一片已施予電暈放電處理的COP(環烯烴聚合物、日本zeon(股)製：品番Zeonor Film 14-060)薄膜來進行貼合，使用無電極紫外光燈隔著COP薄膜，照射相當於1000mJ/cm2
的光來進行接著從而得到試片。對於所得之試片進行90度剝離試驗。 [0126] (Tg、80℃彈性率) 將所得之各硬化性組成物分別利用棒塗佈機以30μm的厚度塗佈至PET薄膜上，利用金屬鹵素燈照射3000mJ/cm2
的能量線。於24小時後將硬化物自薄膜取下，並利用High-Tech Science (股)製的黏彈性測定裝置(DMA7100)來測定Tg。 [0127][0128][0129] 依據[表1]、[表2]可明瞭，相較於比較例的硬化性組成物，由於本發明的硬化性組成物的聚合抑制劑(E)的含量較少而為低黏度，故其硬化物的接著性及彈性率為優異。BEST MODE FOR CARRYING OUT THE INVENTION [0013] Hereinafter, the curable composition of the present invention, the method for curing the same, and the cured product obtained therefrom will be described in detail. [0014] The curable composition of the present invention contains a cationic curable component (A), a cationic polymerization initiator (B), a radical curable component (C), a radical polymerization initiator (D), and polymerization inhibition. (E) (hereinafter also referred to as "(A) component", "(B) component", "(C) component", "(D) component" and "(E) component). Hereinafter, the components (A) to (E) will be described in detail. <Cation-hardening component (A)> The component (A) used in the curable composition of the present invention is a compound which causes a macromolecularization or a crosslinking reaction by a cationic polymerization initiator, the cation The polymerization initiator is activated by irradiation with energy rays or heating. Examples of the component (A) include an epoxy compound, an oxetane compound, and a vinyl ether compound. Examples of the epoxy compound include an aliphatic epoxy compound (A1), an aromatic epoxy compound (A2), and an alicyclic epoxy compound (A3). The aliphatic epoxy compound (A1) is an epoxy compound which does not conform to the aromatic epoxy compound (A2) or the alicyclic epoxy compound (A3) described later, and is an aliphatic epoxy compound (A1). Specific examples thereof include a monofunctional epoxy compound such as a glycidyl ether compound of an aliphatic alcohol or a glycidyl ester of an alkyl carboxylic acid, or a polyglycidyl ether compound of an aliphatic polyhydric alcohol or an alkylene oxide adduct thereof. A polyfunctional epoxy compound such as a polyglycidyl ester of an aliphatic long-chain polybasic acid. Typical examples of the compound include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12-13 mixed alkyl glycidyl ether, and 1,4-butanediol dihydrate. Glycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl ether of glycerol, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, a glycidyl ether of a polyglycol ether of dipentaerythritol, a diglycidyl ether of polyethylene glycol, a diglycidyl ether of polypropylene glycol, a dicyclopentadiene dimethanol diglycidyl ether, and the like A polyglycidyl etherate of a polyether polyol obtained by adding one or more kinds of alkylene oxides to an aliphatic polyol such as propylene glycol, trimethylolpropane or glycerin, and an aliphatic long-chain binary Acid diglycidyl ester. Further, examples thereof include monoglycidyl ether of an aliphatic higher alcohol, glycidyl ester of a higher fatty acid, epoxidized soybean oil, octyl epoxy stearate, butyl epoxy stearate, and epoxidized polybutadiene. Among these, a glycidyl ether compound of an aliphatic alcohol or a polyglycidyl ether compound of an aliphatic polyhydric alcohol or an alkylene oxide adduct thereof is preferred because the viscosity, coatability and reactivity are improved. [0017] Commercially available products can be used as the aliphatic epoxy compound (A1), and examples thereof include Denacol EX-121, Denacol EX-171, Denacol EX-192, Denacol EX-211, Denacol EX-212, and Denacol EX-313. , Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622 , Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911 , Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagasechemtex Co., Ltd.); Epolite M-1230, Epolite 40E, Epolite 100E, Epolite 200E, Epolite 400E, Epolite 70P, Epolite 200P, Epolite 400P, Epolite 1500NP, Epolite 1600, Epolite 80MF, Epolite 100MF (manufactured by Kyoeisha Chemical Co., Ltd.), Adeka Glycirol ED-503, Adeka Glycirol ED-503G, Adeka Glycirol ED-506, Adeka Glycirol ED-523P, ADEKA RESIN EP -4088S (made by ADEKA Co., Ltd.). The aromatic epoxy compound (A2) is an epoxy compound containing an epoxy compound of an aromatic ring and does not conform to the alicyclic epoxy compound (A3) described later, and specific examples of the aromatic epoxy compound may be used. A poly/polyglycidyl ether compound having at least one aromatic ring, such as phenol, cresol or butanol, or an alkylene oxide adduct thereof, such as bisphenol A or bisphenol F, or Further, a glycidyl ether compound or an epoxy novolac resin of a compound in which an alkylene oxide is further added; an aromatic compound having two or more phenolic hydroxyl groups such as resorcin or hydroquinone or catechol; Mono/polyglycidyl etherate; glycidyl etherate of an aromatic compound having two or more alcoholic hydroxyl groups such as benzenedimethanol, benzenediethanol or phenylbutanol; phthalic acid, terephthalic acid, A polyglycidyl ester of a polybasic aromatic compound having two or more carboxylic acids such as trimellitic acid, a glycidyl benzoate, an epoxide of styrene oxide or divinylbenzene, or the like. [0019] Commercially available products can be used as the aromatic epoxy compound (A2), and examples thereof include Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, and Denacol EX-721. On Court EX-1020, On Court EX-1030, On Court EX-1040, On Court EX-1050, On Court EX-1051, On Court EX-1010, On Court EX-1011, On Court 1012 (Nagasechemtex )Company system); OGSOL PG-100, OGSOL EG-200, OGSOL EG-210, OGSOL EG-250 (made by Osaka Gas Chemicals Co., Ltd.); HP4032, HP4032D, HP4700 (made by DIC); ESN -475V (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.); Epikote YX8800 (manufactured by Mitsubishi Chemical Corporation); Mar proof G-0105SA, Mar proof G-0130SP (made by Nippon Oil Co., Ltd.); Epiclon N -665, Epiclon HP-7200 (manufactured by DIC); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN- 502H, NC-7000L (manufactured by Nippon Kayaku Co., Ltd.); ADEKA RESIN EP-4000, ADEKA RESIN EP-4005, ADEKA RESIN EP-4100, ADEKA RESIN EP-4901 (made by ADEKA); TECHMORE VG -3101L (made by PURINTEKKU), etc. . As such an aromatic epoxy compound, polyfunctional hardenability is excellent, and it is preferable. [0020] The alicyclic epoxy compound (A3) is a specific example of the alicyclic epoxy compound (A3), which is directly bonded to the oxirane ring without interposing a spacer on the saturated ring. A polyglycidyl ether compound of a polyol having at least one alicyclic ring or a compound containing a cyclohexene or a cyclopentene ring epoxidized with an oxidizing agent to obtain an epoxycyclohexane or epoxy a compound of cyclopentane. For example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-lanyl Cyclohexyl-3,4-epoxy-1-methylhexylcarboxylate, 6-methyl-3,4-epoxycyclohexyl-methyl-6-methyl-3,4-epoxy Cyclohexane carboxylate, 3,4-epoxy-3-methylcyclohexyl-methyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-ring Oxy-5-methylcyclohexyl-methyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis(3,4-epoxycyclohexylmethyl)adipate , 3,4-epoxy-6-methylcyclohexanecarboxylate, methylene bis(3,4-epoxycyclohexane), propane-2,2-diyl-bis (3, 4-epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, ethyl bis(3,4-epoxy group) Cyclohexane carboxylate), dioctyl octahexahydrophthalate, di-2-ethylhexyl hexahydrophthalate, 1-epoxyethyl-3,4 - epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide, and the like. Among these, as the alicyclic epoxy compound (A3), hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexanecarboxylate The acid ester or 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate is preferred from the viewpoint of adhesion improvement. [0021] Commercially available products can be used as the alicyclic epoxy compound (A3), and examples thereof include CELOXIDE 2021P, CELOXIDE 2081, CELOXIDE 2000, and CELOXIDE 3000 (manufactured by DAICEL Co., Ltd.). [0022] As the oxetane compound (A4), 3,7-bis(3-oxetanyl)-5-oxa-decane, 1,4-bis[(3- Ethyl-3-oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl) Ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, 1,4-Bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy) a difunctional aliphatic oxetane compound such as an alkane, 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl-3-(hexyloxymethyl) Oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl)oxetane, 3- A monofunctional oxetane compound such as ethyl-3-(chloromethyl)oxetane or the like. These may be used alone or in combination of two or more. [0023] Examples of the oxetane compound (A4) include ARON Oxetane OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, and OXT-212 (East Asia Synthetic Co., Ltd.) Company system), ETERNACOLL OXBP, OXTP (manufactured by Ube Hiroshi Co., Ltd.). [0024] Examples of the vinyl ether compound (A5) include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, and 2-ethylhexyl group. Vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-ring Hexane dimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexane dimethanol divinyl ether, and the like. [0025] The curable composition of the present invention is an aliphatic epoxy compound (A1), an aromatic epoxy compound (A2), an alicyclic epoxy compound (A3), or an oxygen heterocycle in the component (A). The use ratio of the butane compound (A4) and the vinyl ether compound (A5) is 10 to 50% by mass of the aliphatic epoxy compound (A1), 0 to 20% by mass of the aromatic epoxy compound (A2), and an alicyclic ring. 0 to 20% by mass of the epoxy compound (A3), 0 to 50% by mass of the oxetane compound (A4), and 0 to 10% by mass of the vinyl ether compound (A5), viscosity, coatability, and reactivity It is preferred that the hardenability is improved. <Cation polymerization initiator (B)> The component (B) used in the curable composition of the present invention may be a compound capable of releasing a substance which initiates cationic polymerization by irradiation with an energy ray or heating. It is any compound, but is preferably a sulfonium salt (i.e., a double salt) of a Lewis acid, or a derivative thereof, which is emitted by irradiation of an energy ray. Typical examples of the above compound include salts of a cation and an anion represented by the following general formula. [A] r+ [B] R- [0027] Here, the cation [A] r+ The phosphonium salt is preferred, and its structure can be represented, for example, by the following general formula. [(R 2 ) a Q] r+ [0028] Further, this R 2 The number of carbon atoms is from 1 to 60, and may also contain several organic groups other than carbon atoms. a is an integer of 1 to 5. a R 2 They are independent and can be the same or different. Further, it is preferred that at least one of the above-described organic groups having an aromatic ring is used. The Q is selected from atoms or groups of atoms grouped by S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N=N. Again, the cation [A] r+ When the valence of Q in Q is set to q, a relationship of r = aq must be established (however, N = N is treated as valence 0). [0029] Again, the anion [B] R- A halide complex is preferred, and its structure can be represented, for example, by the following general formula. [LY b ] R- Further, the L is a metal or a semimetal which is a central atom of the halide complex, and is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co, and the like. Y is a halogen atom. b is an integer from 3 to 7. Also, the anion [B] R- When the valence of L in the middle is p, it is necessary to establish a relationship of r=bp. [0031] as an anion of the general formula [LY b ] R- Specific examples thereof include hydrazine (pentafluorophenyl) borate, tetrakis(3,5-difluoro-4-methoxyphenyl)borate, and tetrafluoroborate (BF). 4 ) - Hexafluorophosphate (PF) 6 ) - Hexafluoroantimonate (SbF) 6 ) - Hexafluoroarsenate (AsF 6 ) - Hexachloroantimonate (SbCl) 6 ) - Wait. [0032] Again, an anion [B] R- It is also preferred to use a constructor represented by the following general formula. [LY B-1 (OH)] R- The L, Y, and b systems are the same as described above. Further, as another anion which can be used, perchlorate ion (ClO) 4 ) - , trifluoromethyl sulfite ion (CF 3 SO 3 ) - Fluorosulfonate ion (FSO 3 ) - , p-toluenesulfonate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecanofluorosulfonate, tetraarylborate, ruthenium (pentafluorophenyl) Borate, etc. In the present invention, even among such sulfonium salts, the aromatic sulfonium salts of the following (i) to (iii) are particularly preferred. In the curable composition of the present invention, one type of these may be used alone or two or more types may be used in combination. [0034] (i) aryl weight of phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate, etc. Nitrogen salt. (ii) diphenylphosphonium hexafluoroantimonate, bis(4-methylphenyl)phosphonium hexafluorophosphate, bis(4-tert-butylphenyl)phosphonium hexafluorophosphate a diaryliodonium salt such as tolyl cumenyl quinone (pentafluorophenyl) borate. (iii) a phosphonium salt of a phosphonium cation represented by the following Group I or Group II, a hexafluoroiridium ion, a hexafluorophosphate ion, or a quinone (pentafluorophenyl) borate ion. [0037] [0038] [0039] Further, as another preferred one, (η 5 -2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl)benzene]-iron-hexafluorophosphate Mixture of iron-aromatic hydrocarbon complex, or aluminum complex of ginseng (acetonitrile) aluminum, ginseng (ethylacetoacetate) aluminum, ginseng (alumaldehyde) aluminum, and decyl alcohol such as triphenyl stanol a salt of a thiophene sulfonium salt, a tetrahydrothiophene sulfonium salt, a benzylammonium salt, a pyridinium salt, a phosphonium salt or the like; a polyalkylene such as a diethylidene triamine, a tri-extension ethyltriamine or a tetraethylidene pentamine Isopolyamines; alicyclic polyamines such as 1,2-diaminocyclohexane, 1,4 diamino-3,6-diethylcyclohexane, isophorone diamine; m- An aromatic polyamine such as m-xylylenediamine, diaminodiphenylmethane or diaminodiphenylphosphonium; and the above polyamines, phenyl glycidyl ether, butyl glycidyl ether, bisphenol Polyepoxy resin produced by reacting various epoxy resins such as glycidyl ethers such as A-diglycidyl ether and bisphenol F-diglycidyl ether or glycidyl esters of carboxylic acid by a conventional method a modified substance; the above organic polyamines, carboxylic acids such as phthalic acid, isophthalic acid, dimer acid, etc. a method for producing a amide-modified material by reacting the above-mentioned polyamines with at least one aldehyde such as formaldehyde and nucleus such as phenol, cresol, xylenol, t-butylphenol or resorcin; a Mannich modified product produced by reacting a phenol of a hydroformylation reactive site by a conventional method; a polycarboxylic acid (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, Pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipate, 3-methyladipic acid, 3-methylpentyl Aliphatic dicarboxylic acids such as diacid, 2-methylsuberic acid, 3,8-dimethylsebacic acid, 3,7-dimethylsebacic acid, hydrogenated dimer acid, dimer acid, etc. An aromatic dicarboxylic acid such as phthalic acid, terephthalic acid, isophthalic acid or naphthalene dicarboxylic acid; an alicyclic dicarboxylic acid such as cyclohexane dicarboxylic acid; trimellitic acid or homobenzene An acid anhydride such as a tricarboxylic acid such as a trimer or a terpolymer of a castor oil fatty acid; a tetracarboxylic acid such as pyroic acid; or a dicyandiamide, an imidazole, a carboxylate, a sulfonate or an amine imine. Wait. Among these, in view of the improvement of the practical surface and the light sensitivity, it is preferred to use an aromatic iodonium salt, an aromatic sulfonium salt, or an iron-aromatic hydrocarbon complex, and have the following structure. The aromatic sulfonium salt is more preferably contained in an amount of at least 0.1% by mass based on 100% by mass of the cationic polymerization initiator (B). [0041] Here, in the formula R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 And R 20 Each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms or an ester group having 2 to 10 carbon atoms, R twenty one , R twenty two , R twenty three And R twenty four Each of which independently represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 10 carbon atoms, R 25 It is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent selected from any one of the following chemical formulas (A) to (C), An Q- It represents an anion of q valence, and p represents a coefficient that maintains the charge neutral. [0042] Here, in the formula R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R twenty one , R twenty two , R twenty three , R twenty four , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 And R 39 Each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms or an ester group having 2 to 10 carbon atoms, R 30 , R 31 , R 32 , R 33 And R 34 Each of them independently represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 10 carbon atoms. [0043] In the compound of the formula (1), as a compound 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R twenty one , R twenty two , R twenty three , R twenty four , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 And R 39 Examples of the halogen atom include fluorine, chlorine, bromine, and iodine. [0044] as R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R twenty one , R twenty two , R twenty three , R twenty four , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 And R 39 Examples of the alkyl group having 1 to 10 carbon atoms represented by a methyl group include an ethyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an s-butyl group, a t-butyl group, an isobutyl group, a pentyl group and a different form. Pentyl, t-pentyl, hexyl, cyclohexyl, heptyl, octyl, decyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl , 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, Difluoromethyl, trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichloro Difluoroethyl, pentafluoroethyl, heptafluoropropyl, nonafluorobutyl, decafluoropentyl, decafluorohexyl, pentafluoroheptyl, heptadecafluorooctyl, methoxymethyl, 1, 2-Epoxyethyl, methoxyethyl, methoxyethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4 -pentenyloxymethyl, trichloroethoxymethyl, bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1-methyl Base-1-a Ethyl ethyl, ethyl dithioethyl, trimethylmethyl decyl ethyl, t-butyl dimethyl methoxymethyl, 2-(trimethylmethyl decyl) ethoxymethyl , t-butoxycarbonylmethyl, ethyloxycarbonylmethyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, acryloxyethyl, methacryloxyethyl, 2 -methyl-2-adamantyloxycarbonylmethyl, ethyl hydrazine, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxy Propyl, 3-hydroxypropyl, 3-hydroxybutyl, 4-hydroxybutyl, 1,2-dihydroxyethyl and the like. [0045] as R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R twenty one , R twenty two , R twenty three , R twenty four , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 And R 39 The alkoxy group having 1 to 10 carbon atoms represented by the above may, for example, be a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, an s-butoxy group or a t-butoxy group. Isobutoxy, pentyloxy, isopentyloxy, t-pentyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethyloxy, tetrahydrofuranyloxy, tetrahydropyranyloxy, 2-methyl Oxyethyloxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethyloxy, methoxyethoxyethyloxy, methoxyB Oxyethoxyethyloxy, 3-methoxybutoxy, 2-methylthioethyloxy, trifluoromethyloxy, and the like. [0046] as R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R twenty one , R twenty two , R twenty three , R twenty four , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 And R 39 Examples of the ester group having 2 to 10 carbon atoms represented include a methoxycarbonyl group, an ethoxycarbonyl group, an isopropoxycarbonyl group, a phenoxycarbonyl group, an ethyloxy group, a propoxy group, and a butoxy group. , chloroacetoxy, dichloroacetoxy, trichloroacetoxy, trifluoroacetoxy, t-butylcarbonyloxy, methoxyethoxycarbonyl, benzhydryloxy Wait. [0047] Even in such a case, it is preferable to use an aromatic iodonium salt, an aromatic sulfonium salt, or an iron-aromatic hydrocarbon complex from the viewpoint of improvement of the practical surface and the light sensitivity, and the above structure is preferable. The aromatic sulfonium salt is more preferably contained in an amount of at least 0.1% by mass based on 100% by mass of the cationic polymerization initiator (B). The ratio of use of the component (B) of the component (A) is not particularly limited as long as it is used in an approximate normal use ratio within a range not inhibiting the object of the present invention, for example, relative to (A) The component (B) is 0.001 to 15 parts by mass, preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the component. When the amount is too small, the hardening is insufficient, and if it is too large, the physical properties such as the water absorption rate of the cured product or the strength of the cured product may be adversely affected. <Free radical curable component (C)> The radical curable component (C) may, for example, be a compound (C1) having an epoxy group or an ethylenically unsaturated group, or a carbon number of 2 to 20 An acrylate of an alcohol or a methacrylate (C2) of an alcohol having 2 to 20 carbon atoms. The compound (C1) having an epoxy group and an ethylenically unsaturated group may, for example, be an epoxy acrylate or an epoxy methacrylate, and specifically, a conventionally known aromatic epoxy resin or fat. A ring epoxy resin, an aliphatic epoxy resin, or the like, which is obtained by reacting with acrylic acid or methacrylic acid. Among these epoxy acrylates or epoxy methacrylates, particularly preferred are acrylates or methacrylates of glycidyl ethers of alcohols. The methacrylate (C2) which is an acrylate of an alcohol having 2 to 20 carbon atoms or an alcohol having 2 to 20 carbon atoms may, for example, be an aromatic or aliphatic group having at least one hydroxyl group in the molecule. An acrylate or methacrylate obtained by reacting an alcohol and an alkylene oxide adduct thereof with acrylic acid or methacrylic acid, specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, acrylic acid 2 -hydroxypropyl ester, isoamyl acrylate, lauryl acrylate, stearyl acrylate, isooctyl acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, benzyl acrylate, 1,3-butanediol diacrylate , 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, neopentyl glycol diacrylate, polyethylene Alcohol diacrylate, polypropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ε-caprolactone modified dipentaerythritol hexaacrylate, 2-ethyl methacrylate Hexyl hexyl ester, 2-hydroxyethyl methacrylate, methacryl 2-hydroxypropyl acrylate, isoamyl methacrylate, lauryl methacrylate, stearyl methacrylate, isooctyl methacrylate, tetrahydrofurfuryl methacrylate, isobornyl methacrylate, Benzyl methacrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, diethylene glycol II Methacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylolpropane trimethyl A acrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexamethacrylate, ε-caprolactone modified dipentaerythritol hexamethacrylate, and the like. Among these acrylates or methacrylates, polyacrylates of polyhydric alcohols or polymethacrylates of polyhydric alcohols are particularly preferred. As the radical curable component (C), a radical polymerization initiator activated by irradiation with an energy ray other than (C1) or (C2) or heating may be used to cause macromolecularization or crosslinking. The compound to be reacted may, for example, be an allyl urethane compound, an unsaturated polyester compound or a styrene compound. Between 100% by mass of the radical curable component (C), the compound (C1) having an epoxy group and an ethylenically unsaturated group, and an acrylate having 2 to 20 carbon atoms or a carbon number of 2 to 20 The methacrylate (C2) having a ratio of the methacrylate (C2) having an epoxy group and an ethylenically unsaturated group is an acrylate having 0 to 99.9% by mass of an alcohol having 2 to 20 carbon atoms. The methacrylate (C2) of the alcohol having 2 to 20 carbon atoms is preferably 0.1 to 100% by mass. <Radical Polymerization Initiator (D)> The radical polymerization initiator (D) is not particularly limited, and an acetophenone-based compound, a benzylic compound, a diphenylketone-based compound, and a thioxanthene can be used. A ketone compound such as a ketone compound or an anthraquinone compound. [0055] Examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and 4'-isopropyl-2-hydroxy- 2-methylpropiophenone, 2-hydroxy-methyl-2-methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p-dimethylamino Acetophenone, p-tert-butyldichloroacetophenone, p-tert-butyltrichloroacetophenone, p-azidobenzylidene acetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl 1-[4-(methylthio)phenyl]-2-morpholinylacetone-1, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)- Butanone-1, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, 1-[4-( 2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one and the like. [0056] As the benzyl compound, benzyl or the like can be given. [0057] Examples of the diphenylketone-based compound include benzophenone, methyl o-benzoyl benzoate, mischrone, 4,4′-bisdiethylamine benzophenone, and 4 , 4'-dichlorobenzophenone, 4-benzylidene-4'-methyldiphenyl sulfide, and the like. [0058] Examples of the thioxanthone-based compound include thioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, and 2-isopropylthioxanthone. 2,4-diethylthioxanthone and the like. As the oxime compound, a compound represented by the following general formula (2) is particularly preferable in terms of sensitivity and heat resistance. [0060] Here, R in the formula (2) 60 And R 61 Each independently represents a hydrogen atom, a nitro group, a halogen atom, a cyano group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a carbon atom. a number of 2 to 20 heterocyclic groups or single bonds, R 62 And R 63 Respectively represent hydrogen atom, halogen atom, nitro group, cyano group, hydroxyl group, carboxyl group, R 64 OR 65 , SR 66 NR 67 R 68 , COR 69 , SOR 70 , SO 2 R 71 Or CONR 72 R 73 . R 60 And R 61 The systems can also be bonded to each other to form a ring, R 64 , R 65 , R 66 , R 67 , R 68 , R 69 , R 70 , R 71 , R 72 And R 73 Each independently represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms, and X. 1 Is an oxygen atom, a sulfur atom, a selenium atom, or a CR 74 R 75 , CO, NR 76 Or PR 77 ,X 2 Is a single bond or CO, R 74 , R 75 , R 76 And R 77 Each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an aralkyl group having 7 to 30 carbon atoms, and a methylene group in the above alkyl group or aralkyl group. The base system may also be substituted by a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group or a heterocyclic group, or may be interrupted by -O-, R 74 , R 75 , R 76 And R 77 The system may also independently form a ring together with any adjacent benzene ring. h represents an integer of 0 to 4, and i represents an integer of 0 to 5. Examples of the alkyl group, the aryl group, the arylalkyl group and the heterocyclic group represented by the respective symbols of the general formula (2) include an alkyl group having 1 to 20 carbon atoms and 6 to 30 carbon atoms. Aryl group, aralkyl group having 7 to 30 carbon atoms, pyrrolyl group, pyridyl group, pyrimidinyl group, pyridazyl group, pyridyl group , piperidinyl, pyranyl, pyrazolyl, triazinyl, pyrrolidinyl, quinolyl, isoquinolyl, imidazolyl, benzimidazolyl, triazolyl, furyl, furan Furanyl, benzopyranyl, thienyl, phenylthio, benzophenylthio, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, Isoxazolyl, sulfhydryl, julolidin, decyl, thio-indenyl, 2-pyrrolidone-1-yl, 2-piperidin-1-yl, 2,4- Dioxyimidazolidine-3-yl, 2,4-dioxy a heterocyclic group such as oxazol-3-yl. [0062] Examples of other photoradical polymerization initiators include phosphine oxide compounds such as 2,4,6-trimethylbenzimidyldiphenylphosphine oxide and bis(cyclopentadiene)- A titanocene compound such as bis[2,6-difluoro-3-(di-1-yl)]titanium or the like. [0063] As the radical polymerization initiator (D), commercially available ones can be used, and examples thereof include N-1414, N-1717, N-1919, PZ-808, NCI-831, and NCI-930 ((shares). ADEKA Corporation, IRGACURE 184, IRGACURE 369, IRGACURE 651, IRGACURE 907, IRGACURE OXE 01, IRGACUREOXE 02, IRGACURE 784 (manufactured by BASF Corporation), TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-314 (Tronly company), etc. The ratio of use of the radical polymerization initiator (D) to the radical curable component (C) is a radical polymerization initiator (100 parts by mass) based on 100 parts by mass of the radical curable component (C). D) is preferably 0.1 to 25 parts by mass, more preferably 5 to 25 parts by mass. When the amount is too small, the hardening tends to be insufficient, and if it is too large, the physical properties such as the water absorption rate of the cured product and the strength of the cured product may be adversely affected. The ratio of the cationically curable component (A) to the radical curable component (C) is preferably (A) component: (C) component = 95:5 to 5:95 in terms of mass parts. <Polymerization Inhibitor (E)> The polymerization inhibitor (E) captures a radical or a proton, and thus a known polymerization inhibitor or an antioxidant of an ethylenically unsaturated compound can be used. In addition to, for example, phenothiazine, methoxyphenothiazine, phenyl-α-naphthylamine, N,N'-diphenyl-p-phenylenediamine, 4,4-tetramethyldiaminodiphenylamine, hydrazine Pyridine, 2,6-dimethylacridine, 2,2,6,6-tetramethylacridine, piperidinyl radical, 2,6-dimethylpiperidinyl radical, 2,2,6 An amine such as 6-tetramethylpiperidinyl radical, phenol, methoxyphenol, nonylphenol, hydroquinone, hydroquinone monomethyl ether, 1,4-benzopyrene, t-butyl ortho Hydroquinone, resorcinol, butylhydroxytoluene, butyl β-hydroxypropionate, butyl β-butoxypropionate, butyl maleate, cresol, butylhydroxytoluene, 1 ,1',1''-nitrotri-2-propanol, 2,5-di-t-butylhydroquinone, 1,2,4-trihydroxybenzene, 2,5-bistetramethylbutanehydroquinone , leucoquinizarin, 1,1-diphenyl-2-trinitrophenylhydrazone (picrylhydrazine), phenols, tetraethyl thiuram disulfide, and other organic sulfur compounds, Other than metal complexes such as zinc butyl dithiocarbamate, copper dibutyl dithiocarbamate, and cup-ferron complex (copper iron), etc. Known as phenolic antioxidants, phosphorus Antioxidants, thioether-based antioxidants. These polymerization inhibitors may be used alone or in combination of two or more. Among the polymerization inhibitors, compared with the phosphorus-based antioxidant, since the phenol-based antioxidant has little or no hardening resistance to the cation-curing component, it is preferable to maintain the adhesion. [0067] Examples of the phenolic antioxidant include 2,6-di-t-butyl-P-cresol, 2,6-diphenyl-4-octadecyloxyphenol, and distearyl ( 3,5-di-t-butyl-4-hydroxybenzyl)phosphate, 1,6-hexamethylenebis[(3,5-di-t-butyl-4-hydroxyphenyl)propanoic acid decylamine ], 4,4'-thiobis(6-t-butyl-M-cresol), 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2 '-Methylene bis(4-ethyl-6-tert-butylphenol), 4,4'-butylene bis(6-tert-butyl-M-cresol), 2,2'-ethylene Bis(4,6-di-t-butylphenol), 2,2'-ethylenebis(4-secondbutyl-6-tert-butylphenol), 1,1,3-parade (2-methyl) 4-hydroxy-5-t-butylphenyl)butane, 1,3,5-gin (2,6-di-methyl-3-hydroxy-4-tributylbenzyl)isocyanuril Acid ester, 1,3,5-gin (3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, 1,3,5-paran (3,5-di-t-butyl 4-hydroxybenzyl)-2,4,6-trimethylbenzene, 2-tert-butyl-4-methyl-6-(2-propenyloxy-3-tert-butyl-5- Methylbenzyl)phenol, stearyl (3,5-di-t-butyl-4-hydroxyphenyl)propionate, 肆[3-(3,5-di-t-butyl-4-hydroxybenzene) Methyl propionate methane, thiodiethylene glycol [(3,5-Di-t-butyl-4-hydroxyphenyl)propionate], 1,6-hexamethylenebis[(3,5-di-t-butyl-4-hydroxyphenyl) Propionate], bis[3,3-bis(4-hydroxy-3-t-butylphenyl)butanoic acid]diol, bis[2-t-butyl-4-methyl-6-( 2-hydroxy-3-t-butyl-5-methylbenzyl)phenyl]terephthalate, 1,3,5-gin[(3,5-di-t-butyl-4-hydroxyl) Phenylpropoxyethyl]isocyanurate, 3,9-bis[1,1-di-methyl-2-{(3-tert-butyl-4-hydroxy-5-methylbenzene Base) propionyloxy}ethyl]-2,4,8,10-four Spiro[5,5]undecane, triethylene glycol bis[(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, and the like. [0068] As the phosphorus-based antioxidant, for example, decylphenyl phosphite, ginseng [2-tert-butyl-4-(3-tert-butyl-4-hydroxy-5-methylphenylsulfuric acid) 5-methylphenyl]phosphite, tridecyl phosphite, octyl diphenyl phosphite, bis(indenyl)monophenylphosphite, di(tridecyl)pentaerythritol II Phosphite, bis(nonylphenyl)pentaerythritol diphosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4 -methylphenyl)pentaerythritol diphosphite, bis(2,4,6-tri-t-butylphenyl)pentaerythritol diphosphite, bis(2,4-diisopropylphenylphenyl)pentaerythritol II Phosphite, tetrakis(tridecyl)isopropylidene diphenol diphosphite, tetrakis(tridecyl)-4,4'-N-butylene bis(2-tert-butyl-5- Methyl phenol) diphosphite, hexatridecyl-1,1,3-glycol(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, hydrazine 2,4-di-t-butylphenyl)biphenylene diphosphinate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 2,2'- Methylene bis(4,6-tert-butylphenyl)-2-ethylhexyl Phosphite, 2,2'-methylenebis(4,6-tert-butylphenyl)-octadecyl phosphite, 2,2'-ethylene bis (4,6-di Tributylphenyl)fluorophosphite, ginseng (2-[(2,4,8,10-肆t-butyldibenzo[D,F][1,3,2] Phosphocycloheptan-6-yl)oxy]ethyl)amine, 2-ethyl-2-butylpropanediol, and phosphite of 2,4,6-tris-tert-butylphenol. [0069] Examples of the thioether-based antioxidant include dialkyl sulfide such as dilauryl thiodipropionate, dimyristyl thiodipropionate, and distearyl thiodipropionate. Disubstituted propionates, and pentaerythritol tetrakis (β-alkylmercaptopropionic acid) esters. [0070] As the polymerization inhibitor (E), commercially available ones can be used, and examples thereof include DIC-TBC (manufactured by DIC Corporation), IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1098, IRGANOX 1135, IRGANOX 1222, IRGANOX 1330, IRGANOX 1726, and IRGANOX 1425. IRGANOX1520, IRGANOX245, IRGANOX259, IRGANOX3114, IRGANOX565, IRGANOX295, IRGANOXHP2225FF, IRGANOXHP2341, IRGANOXHP2921FF, IRGAFOS168, IRGASTABUV10, IRGASTABUV22 (manufactured by BASF), NONFLEX F, NONFLEX H, NONFLEX DCD, NONFLEX MBP, OZONONE 35 (Seiko) System), Q-1300, Q-1301 (made by Wako Pure Chemical Industries Co., Ltd.), Adekastub 2112, Adekastub PEP-8, Adekastub 260, Adekastub 3010, Adekastub HP-10, Adekastub 329K, Adekastub PEP-24G (( Manufactured by ADEKA), SUMILIZER GM, SUMILIZER GS, SUMILIZER TPL-R, SUMILIZER TPS, SUMILIZER TPD (manufactured by Sumitomo Chemical Co., Ltd.), Genorad16 (made by Rahn AG), Antage BHT, Antage DAH, Antage DBH, Antage W -300, Antage W-400, Antage W-500, Antage CRYSTAL (manufactured by Kawaguchi Chemical Industry Co., Ltd.), etc. The use ratio of the polymerization inhibitor (E) is set to 5 × 10 as the polymerization inhibitor (E) based on 100 parts by mass of the radical curable component (C). -3 ～0.2 parts by mass, preferably 0.05 to 0.1 parts by mass. When the polymerization inhibitor (E) is too large, hardening inhibition occurs, and hardening tends to be insufficient. When the amount is too small, the viscosity retention stability is poor, the viscosity is improved, and various physical properties are not obtained. [Any polymer (F)] The curable composition of the present invention may further contain a polymer obtained from a monomer represented by the following formula (I), represented by the following formula (II). a polymer obtained from a monomer, a polymer obtained from two or more monomers selected from the group represented by the following formula (I), or a polymer selected from two or more monomers represented by the following formula (II) The weight average molecular weight of the polymer obtained by the monomer or the polymer obtained from the monomer represented by the following formula (I) and the monomer represented by the following formula (II) is 1000 in terms of polystyrene. ～30000 polymer (F) (hereinafter also referred to as polymer (F)). [0073] Here, in the formula (I), X 3 An alkyl group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, an aryloxy group having 6 to 12 carbon atoms or a carbon number of 6 to 10; The alicyclic hydrocarbon group or the hydrogen atom in the group is substituted with one or more groups selected from the group consisting of an epoxy group, an oxetanyl group, a hydroxyl group, and a carboxyl group. [0074] Here, in the formula (II), R 1 Is a hydrogen atom, a methyl group or a halogen atom, X 4 An alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, or a hydrogen atom in the group selected from an epoxy group and an oxygen group. One or more groups in which a heterocyclic butane group, a hydroxyl group, and a carboxyl group are substituted are substituted. [0075] as X in the above formula (I) 3 Examples of the alkyl group having 1 to 7 carbon atoms represented by a methyl group include a methyl group, an ethyl group, a propyl group, an iso-propyl group, a butyl group, a sec-butyl group, a tert-butyl group, an iso-butyl group, and a pentyl group. , iso-pentyl, tert-pentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert - Heptyl and the like. Among these, an alkyl group having 1 to 4 carbon atoms or a carbon atom partially substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group; The alkyl group having 1 to 4 is preferred in terms of hardenability. [0076] as X in the above formula (I) 3 Examples of the alkoxy group having 1 to 7 carbon atoms represented by the formula include a methoxy group, an ethoxy group, a propoxy group, an iso-propoxy group, a butoxy group, a sec-butoxy group, and a tert-butoxy group. , iso-butoxy, pentyloxy, iso-pentyloxy, tert-pentyloxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4-methylcyclohexane Oxyl, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert-heptyloxy and the like. Among these, an alkyl group having 1 to 4 carbon atoms or a carbon atom partially substituted with one or more groups selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a carboxyl group; The alkoxy group having 1 to 4 is preferred in terms of hardenability. [0077] as X in the above formula (I) 3 Examples of the aryl group having 6 to 12 carbon atoms represented by a group include a phenyl group, a methylphenyl group, and a naphthyl group. [0078] as X in the above formula (I) 3 The aryloxy group having 6 to 12 carbon atoms represented by the above may, for example, be a phenoxy group, a methylphenoxy group or a naphthyloxy group. [0079] as X in the above formula (I) 3 Examples of the alicyclic hydrocarbon group having 6 to 10 carbon atoms represented include a cyclohexyl group, a methylcyclohexyl group, a norbornyl group, a dicyclopentyl group, a bicyclooctyl group, a trimethylbicycloheptyl group, and a tricyclooctyl group. Tricyclic fluorenyl, spirooctyl, cyclohexacyclopentyl, adamantyl, isodecyl and the like. [0080] In the above formula (I), X 3 When a part of the monomer represented by the formula (I) is substituted with an epoxy group or an oxetanyl group, for example, a monomer represented by the following formulas (3) to (5) may be mentioned. [0081] Here, in the formula (3), R 3 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and m is an integer of 1 to 6. [0082] Here, in the formula (4), R 4 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 6. [0083] Here, in the formula (5), R 5 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and s is an integer of 1 to 6. In the above formula (II), as R 1 Examples of the halogen atom include fluorine, chlorine, bromine, and iodine. In the above formula (II), X 4 When a part of the monomer represented by the formula (II) is substituted by an epoxy group or an oxetanyl group, the following formulas (6) to (8) are exemplified. [0086] Here, in the formula (6), R 1 Is the same as the above formula (II), R 6 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and t is an integer of 1 to 6. [0087] Here, in the formula (7), R 1 Is the same as the above formula (II), R 7 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and q is an integer of 1 to 6. [0088] Here, in the formula (8), R 1 Is the same as the above formula (II), R 8 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and y is an integer of 1 to 6. In the polymer (F), the use ratio of the monomer constituting the polymer is one or more selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group, and a carboxyl group. When the alkyl group having 1 to 7 carbon atoms, the aryl group having 6 to 12 carbon atoms or the alicyclic hydrocarbon group having 6 to 10 carbon atoms substituted by a group is represented by the above (I) or (II) The amount of the monomer is from 10 to 100% by mass, which is preferable because the adhesion is improved. In the curable composition of the present invention, the polymer (F) is set to 1 to 20 based on 100 parts by mass of the total of the cationically curable component (A) and the radical curable component (C). In the case of a part by mass, it is preferred because the hardenability and adhesion of the cured product are good. <Other Components> The curable composition of the present invention can be used with a sensitizer and/or a sensitizing aid as needed. The sensitizer exhibits maximum absorption at a longer wavelength than the maximum absorption wavelength shown by the cationic polymerization initiator (B), and promotes the initiation reaction by polymerization of the cationic polymerization initiator (B). Compound. Further, the sensitizing aid is a compound which further promotes the action of the sensitizer. Examples of the sensitizer and the sensitizing aid include an onion compound and a naphthalene compound. The onion-based compound may, for example, be represented by the following formula (9). [0094] Here, in the formula (9), R 101 And R 102 Each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or an alkoxyalkyl group having 2 to 12 carbon atoms, R 103 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. When a specific example of the onion compound represented by the above formula (9) is given, there are the following compounds. [1096] 9,10-dimethoxy onion, 9,10-diethoxy onion, 9,10-dipropoxy onion, 9,10-diisopropoxy onion, 9,10-dibutyl Oxygen onion, 9,10-dipentyloxy onion, 9,10-dihexyloxy onion, 9,10-bis(2-methoxyethoxy) onion, 9,10-double (2-B Oxyethoxy) onion, 9,10-bis(2-butoxyethoxy) onion, 9,10-bis(3-butoxypropoxy) onion, 2-methyl- or 2- Ethyl-9,10-dimethoxy onion, 2-methyl- or 2-ethyl-9,10-diethoxy onion, 2-methyl- or 2-ethyl-9,10-di Propoxy onion, 2-methyl- or 2-ethyl-9,10-diisopropoxy onion, 2-methyl- or 2-ethyl-9,10-dibutoxy onion, 2- Methyl- or 2-ethyl-9,10-dipentyloxy onion, 2-methyl- or 2-ethyl-9,10-dihexyloxy onion, and the like. The naphthalene compound is, for example, represented by the following formula (10). [0098] Here, in the formula (10), R 104 And R 105 Each independently represents an alkyl group having 1 to 6 carbon atoms. When a specific example of the naphthalene compound represented by the above formula (10) is given, there are the following compounds. 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyl Oxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene , 1,4-dibutoxynaphthalene, and the like. The ratio of use of the sensitizer and the sensitizing aid is not particularly limited, and may be used in an approximate usual use ratio within a range not inhibiting the object of the present invention, for example, relative to a cationic hardening component (A). And 100 parts by mass of the total amount of the radical curable component (C) is preferably 0.1 to 3 parts by mass in terms of the sensitizer and the sensitizing aid, and it is preferable from the viewpoint of improving the hardenability. In the curable composition of the present invention, a decane coupling agent can be used as needed. As the decane coupling agent, for example, dimethyldimethoxydecane, dimethyldiethoxydecane, methylethyldimethoxydecane, methylethyldiethoxydecane, methyltrimethoxy can be used. Alkyl functional alkoxy decane, vinyl trichloro decane, vinyl trimethoxy decane, vinyl such as decane, methyl triethoxy decane, ethyl trimethoxy decane, ethyl trimethoxy decane Alkenyl functional alkoxydecane, 3-methylpropenyloxypropyltriethoxydecane, 3-methylpropenyloxypropyl, triethoxydecane, allyltrimethoxydecane, etc. Trimethoxydecane, 3-methacryloxypropylmethyldiethoxydecane, 3-methylpropenyloxypropylmethyldimethoxydecane, 2-methylpropenyloxypropane Trimethoxy decane, γ-glycidoxypropyltrimethoxy decane, γ-glycidoxypropylmethyldiethoxy decane, β-(3,4-epoxycyclohexyl)ethyl Epoxy-functional alkoxydecane such as trimethoxydecane, N-β(aminoethyl)-γ-aminopropyltrimethoxydecane, γ-aminopropyltriethoxysulfonium a mercapto-functional alkoxydecane such as N-phenyl-γ-aminopropyltrimethoxydecane or a mercapto-functional alkoxydecane such as γ-mercaptopropyltrimethoxydecane or tetraisopropanol Titanium chelates such as titanium, titanium tetrabutoxide, titanium, dioctyloxybis(octanediol) titanium, diisopropoxy bis(acetic acid ethyl acetate) titanium, etc. a zirconium chelate compound such as zirconium acetonide or zirconium acetoacetate or zirconium hydride such as zirconium trioxide or zirconium monostearate or an isocyanate decane such as methyl triisocyanate decane. . The amount of the decane coupling agent to be used is not particularly limited, and is usually in the range of 0.01 to 20 parts by mass based on 100 parts by mass of the total amount of the solid matter in the curable composition. The curable composition of the present invention is not particularly limited, and a solvent which can usually dissolve or disperse each component of (A), (B), (C), (D) and (E) can be used. For example, ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone, etc.; An ether solvent such as an ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether or dipropylene glycol dimethyl ether; Ester solvent of methyl ester, ethyl acetate, -n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, monoisobutyrate, etc. a cellosolve solvent such as ethylene glycol monomethyl ether or ethylene glycol monoethyl ether; an alcohol system such as methanol, ethanol, iso- or n-propanol, iso- or n-butanol or pentanol Solvent; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, Ether ester solvent such as 3-methoxybutyl acetate or ethoxyethyl acetate a BTX solvent such as benzene, toluene or xylene; an aliphatic hydrocarbon solvent such as hexane, heptane, octane or cyclohexane; a terpene hydrocarbon oil such as turpentine, D-limonene or decene; Paraffin solvent such as oil essence, Swasol #310 (Cosmo Matsuyama Oil Co., Ltd.), Solvesso #100 (Exxon Chemical Co., Ltd.); carbon tetrachloride, chloroform, trichloroethylene, dichloromethane, 1, Halogenated aliphatic hydrocarbon solvent such as 2-dichloroethane; halogenated aromatic hydrocarbon solvent such as chlorobenzene; propyl carbonate, carbitol solvent, aniline, triethylamine, pyridine, acetic acid, acetonitrile, Carbon disulfide, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylhydrazine, water, etc., one of which can be used as the solvent Or it can be used as a mixed solvent of 2 or more types. Further, as long as the effects of the present invention are not impaired, a coloring agent such as a polyol, an inorganic filler, an organic filler, a pigment, or a dye, an antifoaming agent, a thickener, a surfactant, or the like may be added as needed. Leveling agent, flame retardant, thixotropic agent, diluent, plasticizer, stabilizer, polymerization inhibitor, ultraviolet absorber, latent additive, antistatic agent, flow regulator, adhesion promoter, etc. . The curable composition of the present invention is improved in curability, adhesion, and liquid storage stability. Therefore, the amount of water is preferably 5 parts by mass or less, more preferably 3 parts by mass or less. If there is too much water, it will be poor because it will be cloudy or analyzed. The curable composition of the present invention can be applied to a support substrate by well-known means such as various coating, immersion, etc. by a roll coater or a curtain coater. Further, once it is applied to a support substrate such as a film, it may be transferred to another support substrate, and there is no limitation on the method of application. The material of the support substrate is not particularly limited, and a general material can be used, for example, an inorganic material such as glass; diethyl hydrazide cellulose, triethylene fluorenyl cellulose (TAC), acrylonitrile-based fiber Cellulose esters of cellulose, butyl phthalocyanine, nitrocellulose, nitrocellulose, polyamine, polyimine, polyurethane, epoxy resin, polycarbonate, polyphenylene Ethylene dicarboxylate, polyethylene naphthalate, polybutylene terephthalate, poly(1,4-cyclohexanedimethylene terephthalate), polyethylene-1,2-diphenyloxy Polyesters such as ethane-4,4'-dicarboxylate, polybutylene terephthalate, polystyrene; polyolefins such as polyethylene, polypropylene, polymethylpentene, etc.; polyvinyl acetate Ethylene compound such as ester, polyvinyl chloride or polyvinyl fluoride; acrylic resin such as polymethyl methacrylate or polyacrylate; polycarbonate; polyfluorene; polyether oxime; polyether ketone; A polymer material such as polyoxyethylene, norbornene resin or cycloolefin polymer (COP). Further, the support substrate may be subjected to surface activation treatment such as corona discharge treatment, flame treatment, ultraviolet treatment, high-frequency treatment, glow discharge treatment, active plasma treatment, or laser treatment. When the curable composition of the present invention is cured by irradiation with an energy ray, ultraviolet rays, electron beams, X-rays, radiation, high-frequency waves, and the like are exemplified as the energy rays, and ultraviolet rays are economically optimal. Examples of the light source of the ultraviolet light include an ultraviolet laser, a mercury lamp, a xenon laser, and a metal halide lamp. The condition in which the curable composition of the present invention is cured by heating is 1 to 100 minutes at 70 to 250 °C. After prebaking (PAB; Pre applied bake), pressurization may be performed, post-baking (PEB; Post exposure bake), or baking may be performed at several stages of temperature. The heating conditions vary depending on the type of each component and the blending ratio. For example, in the case of 70 to 180 ° C, the oven is 5 to 15 minutes, and the heating plate is 1 to 5 minutes. Thereafter, in order to cure the coating film to 180 to 250 ° C, preferably 200 to 250 ° C, if the oven is 30 to 90 minutes, if the heating plate is 5 to 30 minutes, heat treatment is performed to obtain a cured film. . Specific examples of the curable composition of the present invention and the cured product thereof include an adhesive, an adhesive for a polarizing plate, an optical material typified by a lens, a photographic lens, a coating material, a coating agent, and a lining. Display components such as agents, inks, resists, liquid resists, printing plates, color televisions, PC monitors, personal data terminals, digital cameras, organic EL, touch panels, insulating varnishes, insulating sheets, Laminates, printed circuit boards, semiconductor devices, LED packages, liquid crystal injection ports, organic ELs, optical components, electrical insulation, electronic components, sealants, molding materials, etc. A Fresnel lens for use in a passivation film, a filler, a passivation film for a semiconductor or a solar cell, an interlayer insulating film, a protective film, a holland lens sheet used for a backlight of a liquid crystal display device, or a projection television a lens portion of a lens sheet such as a sheet or a lenticular lens sheet, or a backlight such as a backlight using such a sheet, an optical lens such as a microlens, an optical element, an optical coupler, or light Guide wave path, optical molding agent, etc. [0113] As the display device of the present invention, for example, an undercoat layer, an antireflection layer, a polarizing element layer, a retardation layer, a birefringence layer, a light scattering layer, a hard coating layer may be provided on the transparent support as needed. For each layer such as a lubricating layer or a protective layer, a film made of the cured product of the present invention can be used for each layer. [Examples] Hereinafter, the curable composition of the present invention and the cured product obtained by curing the curable composition will be described in more detail by way of examples and comparative examples, but the present invention is not limited thereto. In these embodiments. In the examples and comparative examples, the parts mean the parts by mass. [Examples 1 to 8 and Comparative Examples 1 to 3] Each of the components was sufficiently mixed according to the formulation shown in the following [Table 1] to [Table 2] to prepare each curable composition. For each of the obtained curable compositions, the viscosity, the adhesion, the glass transition temperature (Tg), and the modulus at 80 ° C were measured according to the following procedure. The results obtained are combined and described in Tables 1 and 2. As the cation curable component (A), the following compounds A1-1, A1-2, A3-1 and A4-1 were used. Compound A1-1: 1,6-hexanediol diglycidyl ether compound A1-2: 2-ethylhexyl glycidyl ether compound A3-1: CELOXIDE 2021P (manufactured by DAICEL Co., Ltd.) Compound A4-1: ARON Oxetane OXT-221 (oxetane: manufactured by Toagosei Co., Ltd.) As the cationic polymerization initiator (B), the following compound B-1 was used. Compound B-1: a propylene carbonate 50% solution of a mixture of the following 2 compounds [0118] [0119] The following compound C2-1 was used as the radical curable component (C). Compound C2-1:1,6-hexanediol diacrylate [0121] As the radical polymerization initiator (D), the following compound D1-1 was used. Compound D-1: Irgacure 184 (manufactured by BASF Corporation) The following compounds E-1 to E-4 were used as the polymerization inhibitor (E). Compound E-1: AO-60 (antioxidant manufactured by ADEKA CORPORATION) Compound E-2: Hydroquinone monomethyl ether (MEHQ) Compound E-3: Hydroquinone (HQ) Compound E-4: Triphenyl Phosphite [0123] As the polymer (F), the following compound F-1 was used. Compound F-1: copolymer of 75 parts by mass of methyl methacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 8000) [Viscosity] E-type viscosity was obtained for each of the obtained curable compositions The viscosity at 25 ° C was measured separately. (Adhesiveness) After each of the obtained curable compositions was applied to a sheet of PMMA film (manufactured by Sumitomo Chemical Co., Ltd.: TECNOLOY 125S001), a corona discharge was applied to the other sheet by a bonding machine. The treated COP (cycloolefin polymer, manufactured by Zeon Co., Ltd., Japan: Zeonor Film 14-060) film was bonded, and the electrode was irradiated with a COP film by an electrodeless ultraviolet lamp, and the irradiation was equivalent to 1000 mJ/cm. 2 The light is then passed to obtain a test piece. The obtained test piece was subjected to a 90 degree peel test. (Tg, 80 ° C modulus) Each of the obtained curable compositions was applied to a PET film at a thickness of 30 μm by a bar coater, and irradiated with a metal halide lamp at 3000 mJ/cm. 2 Energy line. The cured product was taken out from the film after 24 hours, and the Tg was measured using a viscoelasticity measuring device (DMA7100) manufactured by High-Tech Science Co., Ltd. [0127] [0128] According to [Table 1] and [Table 2], the curable composition of the comparative example has a low viscosity because the content of the polymerization inhibitor (E) of the curable composition of the present invention is small. Therefore, the cured product has excellent adhesion and modulus of elasticity.