TWI796798B - 放熱裝置、蒸氣腔及電子機器 - Google Patents

放熱裝置、蒸氣腔及電子機器 Download PDF

Info

Publication number
TWI796798B
TWI796798B TW110135997A TW110135997A TWI796798B TW I796798 B TWI796798 B TW I796798B TW 110135997 A TW110135997 A TW 110135997A TW 110135997 A TW110135997 A TW 110135997A TW I796798 B TWI796798 B TW I796798B
Authority
TW
Taiwan
Prior art keywords
flow path
liquid flow
liquid
aforementioned
mentioned
Prior art date
Application number
TW110135997A
Other languages
English (en)
Chinese (zh)
Other versions
TW202223323A (zh
Inventor
小島慶次郎
沼本竜宏
Original Assignee
日商村田製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商村田製作所股份有限公司 filed Critical 日商村田製作所股份有限公司
Publication of TW202223323A publication Critical patent/TW202223323A/zh
Application granted granted Critical
Publication of TWI796798B publication Critical patent/TWI796798B/zh

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electrophonic Musical Instruments (AREA)
TW110135997A 2020-10-06 2021-09-28 放熱裝置、蒸氣腔及電子機器 TWI796798B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020169337 2020-10-06
JP2020-169337 2020-10-06

Publications (2)

Publication Number Publication Date
TW202223323A TW202223323A (zh) 2022-06-16
TWI796798B true TWI796798B (zh) 2023-03-21

Family

ID=81126003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110135997A TWI796798B (zh) 2020-10-06 2021-09-28 放熱裝置、蒸氣腔及電子機器

Country Status (4)

Country Link
JP (1) JP7103549B1 (https=)
CN (1) CN220750894U (https=)
TW (1) TWI796798B (https=)
WO (1) WO2022075175A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201827781A (zh) * 2016-12-20 2018-08-01 日商藤倉股份有限公司 散熱模組
TW201930810A (zh) * 2017-12-25 2019-08-01 日商藤倉股份有限公司 散熱模組
TW201932780A (zh) * 2017-12-25 2019-08-16 日商藤倉股份有限公司 散熱模組

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6191561B2 (ja) * 2014-08-28 2017-09-06 東芝ホームテクノ株式会社 シート型ヒートパイプ
US20190021188A1 (en) * 2015-12-18 2019-01-17 Fujikura Ltd. Vapor chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201827781A (zh) * 2016-12-20 2018-08-01 日商藤倉股份有限公司 散熱模組
TW201930810A (zh) * 2017-12-25 2019-08-01 日商藤倉股份有限公司 散熱模組
TW201932780A (zh) * 2017-12-25 2019-08-16 日商藤倉股份有限公司 散熱模組

Also Published As

Publication number Publication date
WO2022075175A1 (ja) 2022-04-14
JP7103549B1 (ja) 2022-07-20
JPWO2022075175A1 (https=) 2022-04-14
CN220750894U (zh) 2024-04-09
TW202223323A (zh) 2022-06-16

Similar Documents

Publication Publication Date Title
JP6597892B2 (ja) ループヒートパイプ及びその製造方法並びに電子機器
EP3392593A1 (en) Vapor chamber
WO2017203574A1 (ja) ループヒートパイプ及びその製造方法並びに電子機器
WO2014115839A1 (ja) ヒートパイプ
US20240353182A1 (en) Vapor chamber, wick sheet for vapor chamber, and electronic apparatus
TWI827944B (zh) 蒸氣腔及電子機器
JP2021188890A (ja) 伝熱部材および伝熱部材を有する冷却デバイス
TWI796798B (zh) 放熱裝置、蒸氣腔及電子機器
CN220187504U (zh) 热扩散器件以及电子设备
CN221527444U (zh) 热扩散器件
CN220187502U (zh) 热扩散器件以及电子设备
JP7222448B2 (ja) 熱拡散デバイス
TW202403256A (zh) 熱擴散裝置及電子機器
JP7120494B1 (ja) 熱拡散デバイス
TWI839928B (zh) 熱擴散器件及電子機器
TWI801160B (zh) 熱擴散裝置及電子機器
WO2023112616A1 (ja) 熱拡散デバイス及び電子機器
CN223023264U (zh) 热扩散器件以及电子设备
TWI828352B (zh) 熱擴散裝置及電子機器
JP7311057B2 (ja) 熱拡散デバイスおよび電子機器
JP2024107734A (ja) ヒートシンク
WO2023182033A1 (ja) 熱拡散デバイス及び電子機器
WO2024219131A1 (ja) 熱拡散デバイス及び電子機器
WO2022230295A1 (ja) 熱拡散デバイス
WO2023026896A1 (ja) 熱拡散デバイス