TWI793693B - 超音波檢查裝置及超音波檢查方法 - Google Patents

超音波檢查裝置及超音波檢查方法 Download PDF

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Publication number
TWI793693B
TWI793693B TW110128354A TW110128354A TWI793693B TW I793693 B TWI793693 B TW I793693B TW 110128354 A TW110128354 A TW 110128354A TW 110128354 A TW110128354 A TW 110128354A TW I793693 B TWI793693 B TW I793693B
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TW
Taiwan
Prior art keywords
probe
mentioned
receiving
ultrasonic
receiving probe
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TW110128354A
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English (en)
Chinese (zh)
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TW202208848A (zh
Inventor
鈴木睦三
高麗友輔
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日商日立電力解決方案股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/262—Arrangements for orientation or scanning by relative movement of the head and the sensor by electronic orientation or focusing, e.g. with phased arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609—Display arrangements, e.g. colour displays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/01—Indexing codes associated with the measuring variable
    • G01N2291/015—Attenuation, scattering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
TW110128354A 2020-08-27 2021-08-02 超音波檢查裝置及超音波檢查方法 TWI793693B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-143278 2020-08-27
JP2020143278A JP7428616B2 (ja) 2020-08-27 2020-08-27 超音波検査装置及び超音波検査方法

Publications (2)

Publication Number Publication Date
TW202208848A TW202208848A (zh) 2022-03-01
TWI793693B true TWI793693B (zh) 2023-02-21

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TW110128354A TWI793693B (zh) 2020-08-27 2021-08-02 超音波檢查裝置及超音波檢查方法

Country Status (5)

Country Link
JP (1) JP7428616B2 (ja)
KR (1) KR20230035669A (ja)
CN (1) CN116097092A (ja)
TW (1) TWI793693B (ja)
WO (1) WO2022044467A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024120595A (ja) * 2023-02-24 2024-09-05 株式会社日立パワーソリューションズ 超音波検査装置及び超音波検査方法
JP2024143210A (ja) * 2023-03-30 2024-10-11 株式会社日立パワーソリューションズ 超音波検査装置及び超音波検査方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013447A (ja) * 2010-06-29 2012-01-19 Hitachi Cable Ltd 半導体単結晶中の欠陥検査方法
US20140216158A1 (en) * 2011-08-17 2014-08-07 Sergio José Sanabria Martin Air coupled ultrasonic contactless method for non-destructive determination of defects in laminated structures
TW201534902A (zh) * 2014-02-12 2015-09-16 Kla Tencor Corp 用於組合式明場、暗場及光熱檢測之裝置及方法
TW201713946A (zh) * 2015-10-08 2017-04-16 Hitachi Power Solutions Co Ltd 缺陷檢查方法及其裝置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4903032B2 (ja) 2006-11-24 2012-03-21 ジャパンプローブ株式会社 空中超音波探傷システム
JP2009097942A (ja) * 2007-10-16 2009-05-07 Ihi Aerospace Co Ltd 非接触式アレイ探触子とこれを用いた超音波探傷装置及び方法
US10928362B2 (en) * 2018-05-04 2021-02-23 Raytheon Technologies Corporation Nondestructive inspection using dual pulse-echo ultrasonics and method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013447A (ja) * 2010-06-29 2012-01-19 Hitachi Cable Ltd 半導体単結晶中の欠陥検査方法
US20140216158A1 (en) * 2011-08-17 2014-08-07 Sergio José Sanabria Martin Air coupled ultrasonic contactless method for non-destructive determination of defects in laminated structures
TW201534902A (zh) * 2014-02-12 2015-09-16 Kla Tencor Corp 用於組合式明場、暗場及光熱檢測之裝置及方法
TW201713946A (zh) * 2015-10-08 2017-04-16 Hitachi Power Solutions Co Ltd 缺陷檢查方法及其裝置

Also Published As

Publication number Publication date
CN116097092A (zh) 2023-05-09
TW202208848A (zh) 2022-03-01
WO2022044467A1 (ja) 2022-03-03
JP7428616B2 (ja) 2024-02-06
JP2022038664A (ja) 2022-03-10
KR20230035669A (ko) 2023-03-14

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