TWI793004B - A film peeling module (1) - Google Patents
A film peeling module (1) Download PDFInfo
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- TWI793004B TWI793004B TW111117147A TW111117147A TWI793004B TW I793004 B TWI793004 B TW I793004B TW 111117147 A TW111117147 A TW 111117147A TW 111117147 A TW111117147 A TW 111117147A TW I793004 B TWI793004 B TW I793004B
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本創作係有關一種薄膜剝離模組,尤指一種可將薄膜有效且全面性剝離者。 This creation is about a film stripping module, especially one that can effectively and comprehensively strip the film.
在印刷電路板的製造過程中,基板在曝光之前,皆會在基板之上、下表面分別形成光阻層及黏附於光阻層表面之薄膜,在曝光之後,再將薄膜剝離以使光阻層外露,以進行後續之顯影及蝕刻程序。而現有剝膜機剝離薄膜之方式,主要是藉由一前輸送段以輸送上述印刷電路板之類的薄板,使沿著由前朝後的輸送方向移動,薄板經由一阻擋單元之阻擋定位,再經由一組壓花輪在薄膜之前端緣表面上滾壓之後,即會讓薄板繼續延著一後輸送段向後輸送,並以一組黏輪將產生皺摺之薄膜逐步剝離。 In the manufacturing process of printed circuit boards, before the substrate is exposed, a photoresist layer and a film adhered to the surface of the photoresist layer are formed on the upper and lower surfaces of the substrate, and after exposure, the film is peeled off to make the photoresist Layers are exposed for subsequent development and etching procedures. The way of peeling the film of the existing film peeling machine is mainly to transport the thin plate such as the above-mentioned printed circuit board through a front conveying section, so that it moves along the conveying direction from front to back, and the thin plate is blocked and positioned by a blocking unit. After a set of embossing wheels is rolled on the front edge surface of the film, the thin plate will continue to be conveyed backward along a rear conveying section, and the wrinkled film will be peeled off gradually by a set of sticking wheels.
藉由上述剝膜機結構,確實可以提升剝離薄膜之效率。惟在實際剝離薄膜的過程中發現,當基板本身之厚度不大,尤其是對於厚度在0.1mm以下,甚至於0.04mm的薄板或是軟板而言,其容易會有彎曲不平的現象。當外徑一致的長直筒形黏輪黏著薄膜之前端緣時,由於各個黏著位置之黏著力不會完全相同,即無法先讓薄膜之前端緣與基板分離,再順暢且有效的讓薄膜全面性的剝離;且由於薄膜之厚度很薄且脆弱,在薄膜剝離之後,仍舊會有部份的薄膜脆片黏附於光阻層之表面上,並由於薄膜脆片之面積太小而無法被偵測到,此種現象在整個印刷電路板的製造過程中,將會讓基板面臨報廢的結果,甚至於讓剝膜機之機件損壞。With the above film stripping machine structure, the efficiency of stripping the film can indeed be improved. However, in the process of actually peeling off the film, it is found that when the thickness of the substrate itself is not large, especially for thin or flexible boards with a thickness of less than 0.1mm, or even 0.04mm, it is easy to have unevenness. When the long straight cylindrical adhesive roller with the same outer diameter sticks to the front edge of the film, since the adhesion force of each sticking position will not be exactly the same, that is, it is impossible to separate the front edge of the film from the substrate first, and then smoothly and effectively make the film comprehensive. and because the thickness of the film is very thin and fragile, after the film is peeled off, some film chips will still adhere to the surface of the photoresist layer, and cannot be detected because the area of the film chips is too small It is known that this kind of phenomenon will cause the substrate to be scrapped during the entire manufacturing process of the printed circuit board, and even damage the parts of the film stripping machine.
有鑑於此,為了提供一種有別於習用技術之結構,並改善上述之缺點,創作人積多年的經驗及不斷的研發改進,遂有本創作之產生。In view of this, in order to provide a structure different from the conventional technology and improve the above-mentioned shortcomings, the author has accumulated many years of experience and continuous research and development, so this creation is produced.
本創作之一目的在提供一種薄膜剝離模組,俾能解決習用剝膜機無法有效的讓薄膜之前端緣與基板分離、容易黏附薄膜脆片,且無法順暢的讓薄膜全面性剝離的問題,而能讓薄膜之前端緣與基板有效的分離,以利於後續之整體薄膜剝離作業,讓薄膜能順暢且全面性的與基板分離,並可避免在基板上殘留薄膜脆片以提高作業品質。One of the purposes of this creation is to provide a film peeling module, so as to solve the problem that the conventional film peeling machine cannot effectively separate the front edge of the film from the substrate, easily adheres to the film, and cannot completely peel off the film smoothly. It can effectively separate the front edge of the film from the substrate to facilitate the subsequent overall film peeling operation, so that the film can be separated from the substrate smoothly and comprehensively, and can avoid leaving film chips on the substrate to improve the operation quality.
為達上述創作之目的,本創作所設之薄膜剝離模組係連接於一機架上,機架之前端具有一前輸送段,供輸送一薄板使沿著由前端朝向後端之輸送方向移動,並在該薄板之一基板上表面之一上薄膜剝離之後,讓基板經由一後輸送段向後輸送,其主要之技術特點在於:薄膜剝離模組包括至少一前薄膜剝離單元以及一上剝膜單元,其中之至少一前薄膜剝離單元係定位於前輸送段之後端,前薄膜剝離單元包括一下勾部以及一上驅動件,上驅動件連接下勾部,上驅動件帶動下勾部以向下抵壓基板之上表面,供薄板移動時以剝離上薄膜之前端緣;而上剝膜單元係定位於至少一前薄膜剝離單元之後端,上剝膜單元包括橫向設置並平行薄板前端緣之一上滾筒,上滾筒之筒身具有複數個第一吸氣孔,複數個第一吸氣孔連通一吸氣裝置,藉以在上滾筒轉動時,逐漸吸附以完全剝離上薄膜。In order to achieve the purpose of the above creation, the film peeling module set up in this creation is connected to a frame. The front end of the frame has a front conveying section for conveying a thin plate to move along the conveying direction from the front end to the rear end , and after the film is peeled off on one of the upper surfaces of the substrate of the thin plate, the substrate is conveyed backward through a rear conveying section. Unit, wherein at least one front film peeling unit is positioned at the rear end of the front conveying section, the front film peeling unit includes a lower hook part and an upper driving part, the upper driving part connects the lower hook part, and the upper driving part drives the lower hook part to The upper surface of the substrate is pressed against the upper surface of the substrate to peel off the front edge of the upper film when the thin plate moves; the upper film peeling unit is positioned at the rear end of at least one front film peeling unit, and the upper film peeling unit includes a horizontally arranged and parallel to the front edge of the thin plate. An upper roller, the cylinder body of the upper roller has a plurality of first air suction holes, and the plurality of first air suction holes are connected to an air suction device, so that when the upper roller rotates, it is gradually sucked to completely peel off the upper film.
實施時,本創作更包括一上吹氣單元,上吹氣單元連接機架,供朝向下勾部之方向吹出空氣。During implementation, the invention further includes an upper air blowing unit connected to the frame for blowing air toward the lower hook portion.
實施時,本創作更包括一上勾部以及一下驅動件,下驅動件連接上勾部,下驅動件帶動上勾部以向上抵壓基板之下表面,供薄板移動時以剝離基板下表面之一下薄膜之前端緣。When implemented, the invention further includes an upper hook part and a lower driving part, the lower driving part is connected to the upper hook part, and the lower driving part drives the upper hook part to press upward against the lower surface of the substrate for peeling off the lower surface of the substrate when the thin plate moves. Touch the front edge of the film.
實施時,本創作更包括一下吹氣單元,下吹氣單元連接機架,供以朝向上勾部之方向吹出空氣。During implementation, the invention further includes a lower air blowing unit, which is connected to the frame for blowing air towards the direction of the upper hook.
實施時,本創作更包括一下剝膜單元,下剝膜單元具有一下滾筒,下滾筒對應定位於上滾筒之下方,下滾筒橫向設置並平行薄板之前端緣,下滾筒之筒身具有複數個第二吸氣孔,複數個第二吸氣孔連通吸氣裝置,藉以在下滾筒轉動時,逐漸吸附基板下表面之一下薄膜於下滾筒之筒身上。When implemented, the invention further includes a lower film peeling unit, the lower film peeling unit has a lower roller, the lower roller is positioned below the upper roller correspondingly, the lower roller is arranged horizontally and parallel to the front edge of the thin plate, and the body of the lower roller has multiple first rollers. Two air suction holes, a plurality of second air suction holes are connected to the air suction device, so that when the lower roller rotates, the lower film on the lower surface of the substrate is gradually adsorbed on the body of the lower roller.
為進一步了解本創作,以下舉較佳之實施例,配合圖式、圖號,將本創作之具體構成內容及其所達成的功效詳細說明如下:In order to further understand this creation, the following is a preferred embodiment, with the diagram and figure number, the specific composition and effect of this creation are described in detail as follows:
請參閱圖1~圖5所示,其為本創作薄膜剝離模組1之較佳實施例,係供連接於一機架11上。機架11輸入薄板12之一端界定為機架11之前端,輸出薄板12之一端界定為機架11之後端,機架11之前端具有一前輸送段13,機架11之後端具有一後輸送段14,前輸送段13與後輸送段14分別由複數水平間隔排列之滾筒所組成,供輸送薄板12使沿著機架11之前端朝向後端之方向移動。實施時,該薄板12為印刷電路板之類的平板,主要包括一基板121,基板121之上表面具有一上薄膜122,基板121之下表面具有一下薄膜123。Please refer to Fig. 1 ~ Fig. 5, which is a preferred embodiment of the
本創作之薄膜剝離模組1主要包括一前薄膜剝離單元2、一上剝膜單元3以及一下剝膜單元4。實施時,前薄膜剝離單元2亦可設有複數個,複數個前薄膜剝離單元2在同一水平面上橫向間隔排列,且複數個前薄膜剝離單元2之排列方向垂直薄板12之輸送方向。The
前薄膜剝離單元2包括一上驅動件20、一下勾部221、一下驅動件20’ 以及一上勾部262。其中之上驅動件20包括一上支軸21、一上懸臂22、一第一驅動件23以及一上吹氣單元24。上支軸21連接機架11;上懸臂22之一端樞接上支軸21,上懸臂22之另一端具有一下勾部221,下勾部221之一尖角以遠離上懸臂22之方向向下凸出;第一驅動件23為一活塞組,第一驅動件23之下端連接上懸臂22之中段位置,藉以上、下移動上懸臂22之下勾部221;而上吹氣單元24係連接機架11,且上吹氣單元24之吹氣口朝向下勾部221之方向。藉此,當下勾部221向下抵壓基板121之上表面,薄板12向後移動,且上吹氣單元24朝向下勾部221吹出空氣時,即可剝離上薄膜122之前端緣。實施時,上驅動件20亦可為一氣壓缸或是一油壓缸,並在活塞桿之一端連接下勾部221,同樣可以帶動下勾部221以向下抵壓基板121之上表面,在薄板12向後移動時,剝離上薄膜122之前端緣。The front
下驅動件20’包括一下支軸25、一下懸臂26、一第二驅動件27以及一下吹氣單元28。下支軸25連接機架11,並對應設置於上支軸21之下方;下懸臂26之一端樞接下支軸25,下懸臂26之中段位置具有一凸塊,凸塊具有底部開放之一凹槽,該凸塊做為限位部261,供定位一壓縮彈簧之頂端,該壓縮彈簧做為彈性件29;下懸臂26之另一端具有一上勾部262,上勾部262之一尖角以遠離下懸臂26之方向向上凸出;第二驅動件27為一活塞組,第二驅動件27之上端具有一推壓部271,推壓部271向上連接彈性件29之底端,藉以向上推壓移動下懸臂26之上勾部262;而下吹氣單元28係連接於機架11上,且下吹氣單元28之吹氣口朝向上勾部262之方向。藉此,當上勾部262之尖角向上抵壓基板121之下表面,且下吹氣單元28朝向上勾部262吹出空氣時,即可剝離下薄膜123之前端緣。實施時,下驅動件20’亦可為一氣壓缸或是一油壓缸,並在活塞桿之一端連接上勾部262,同樣可以帶動上勾部262以向上抵壓基板121之下表面,在薄板12向後移動時,剝離下薄膜123之前端緣。
The lower driving part 20' includes a lower supporting
上剝膜單元3係定位於前薄膜剝離單元2之後端,上剝膜單元3包括橫向設置並平行薄板12前端緣之一上滾筒31,上滾筒31之筒身上具有複數個陣列狀排列之第一吸氣孔311,且複數個第一吸氣孔311連通一鼓風機,該鼓風機做為吸氣裝置32。藉以在鼓風機吸氣時,能經由複數個第一吸氣孔311,將上滾筒31外部之空氣吸入筒身之內部以形成負壓狀態;並經由一驅動裝置33之驅動,在上滾筒31轉動時,由上薄膜122之前端緣開始以逐漸吸起整片上薄膜122於上滾筒31之筒身上,進而讓上薄膜122與基板121之上表面完全分離。
The
而下剝膜單元4具有一下滾筒41,下滾筒41對應定位於上滾筒31之下方,且下滾筒41橫向設置並平行薄板12之前端緣。下滾筒41之筒身具有複
數個陣列狀排列之第二吸氣孔411,複數個第二吸氣孔411連通吸氣裝置32,藉以在經由一驅動裝置之驅動而讓下滾筒41原地轉動時,能逐漸吸起基板121下表面之下薄膜123於下滾筒41之筒身上,讓下薄膜123與基板121之下表面完全分離。
The
藉此,當一薄板12由前輸送段13朝向後輸送段14向後輸送,在經由下勾部221之尖角剝離上薄膜122之前端緣,同時上勾部262之尖角剝離下薄膜123之前端緣之後,薄板12會繼續向後移動。而當上剝膜單元3與下剝膜單元4分別形成負壓狀態以分別吸附上薄膜122與下薄膜123時,則可以逐漸的將上薄膜122與下薄膜123完全剝離,並讓基板121經由後輸送段14向後輸出。
Thereby, when a
綜上所述,本創作能經由下勾部與上勾部分別剝離上薄膜與下薄膜之前端緣,以利於後續之整體薄膜剝離作業;並能經由上剝膜單元與下剝膜單元之同時作動,讓上薄膜與下薄膜能夠更順暢且全面性的與基板分離,而不會殘留薄膜脆片,不但可以有效提高作業品質,且能避免機件損壞。 To sum up, this invention can peel off the front edges of the upper film and the lower film respectively through the lower hook part and the upper hook part, so as to facilitate the subsequent overall film peeling operation; The action allows the upper film and the lower film to be separated from the substrate more smoothly and comprehensively without leaving film chips, which can not only effectively improve the working quality, but also avoid damage to the machine parts.
本創作雖為實現上述目的而揭露了較佳的具體實施例,惟其並非用以限制本創作之構造特徵,任何該技術領域之通常知識者應知,在本創作的技術精神下,任何輕易思及之變化或修飾皆是可能的,且皆為本創作之申請專利範圍所涵蓋。 Although this creation discloses preferred specific embodiments to achieve the above purpose, it is not intended to limit the structural features of this creation. Anyone with ordinary knowledge in this technical field should know that under the technical spirit of this creation, All changes or modifications are possible, and all are covered by the scope of the patent application for this creation.
1:薄膜剝離模組 1: Film peeling module
11:機架 11: Rack
12:薄板 12: thin plate
121:基板 121: Substrate
122:上薄膜 122: Upper film
123:下薄膜 123: lower film
13:前輸送段 13: Front conveying section
14:後輸送段 14: rear conveying section
2:前薄膜剝離單元 2: Front film peeling unit
20:上驅動件 20: Upper driver
20’:下驅動件 20': Lower driver
21:上支軸 21: upper support shaft
22:上懸臂 22: Upper cantilever
221:下勾部 221: Lower hook
23:第一驅動件 23: The first driver
24:上吹氣單元 24: Upper blowing unit
25:下支軸 25: Lower support shaft
26:下懸臂 26: lower cantilever
261:限位部 261: limit part
262:上勾部 262: Upper hook
27:第二驅動件 27: The second driving member
271:推壓部 271: Pushing part
28:下吹氣單元 28: Down blowing unit
29:彈性件 29: Elastic parts
3:上剝膜單元 3: Upper peeling unit
31:上滾筒 31: Upper roller
311:第一吸氣孔 311: the first suction hole
32:吸氣裝置 32: suction device
33:驅動裝置 33: Drive device
4:下剝膜單元 4: Lower peeling unit
41:下滾筒 41: Lower roller
411:第二吸氣孔 411: Second suction hole
﹝圖1﹞為本創作之較佳實施例安裝於機架上之立體外觀示意圖。 ﹝圖2﹞為圖1之A-A’剖面圖。 ﹝圖3﹞為本創作之較佳實施例之前薄膜剝離單元之立體外觀圖。 ﹝圖4﹞為本創作之較佳實施例之前薄膜剝離單元之使用狀態示意圖。 ﹝圖5﹞為本創作之較佳實施例之上剝膜單元與下剝膜單元之使用狀態示意圖。 (Fig. 1) is a three-dimensional appearance schematic diagram of a preferred embodiment of the invention installed on a rack. [Fig. 2] is the A-A' section view of Fig. 1. [Fig. 3] is the three-dimensional appearance view of the film peeling unit before the preferred embodiment of the invention. [Figure 4] is a schematic diagram of the use state of the film peeling unit before the preferred embodiment of the present invention. [Fig. 5] is a schematic diagram of the use state of the upper peeling unit and the lower peeling unit of the preferred embodiment of this invention.
1:薄膜剝離模組 1: Film peeling module
11:機架 11: Rack
13:前輸送段 13: Front conveying section
14:後輸送段 14: rear conveying section
2:前薄膜剝離單元 2: Front film peeling unit
20:上驅動件 20: Upper driver
20’:下驅動件 20': Lower driver
21:上支軸 21: upper support shaft
22:上懸臂 22: Upper cantilever
23:第一驅動件 23: The first driver
24:上吹氣單元 24: Upper blowing unit
25:下支軸 25: Lower support shaft
26:下懸臂 26: lower cantilever
27:第二驅動件 27: The second driving member
28:下吹氣單元 28: Down blowing unit
3:上剝膜單元 3: Upper peeling unit
31:上滾筒 31: Upper roller
311:第一吸氣孔 311: the first suction hole
4:下剝膜單元 4: Lower peeling unit
41:下滾筒 41: Lower roller
411:第二吸氣孔 411: Second suction hole
Claims (5)
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TW111117147A TWI793004B (en) | 2022-05-06 | 2022-05-06 | A film peeling module (1) |
Country Status (1)
Country | Link |
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TW (1) | TWI793004B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631103A (en) * | 1984-04-10 | 1986-12-23 | Nitto Electric Industrial Co., Ltd. | Process for peeling protective film off a thin article |
TW201838492A (en) * | 2017-04-07 | 2018-10-16 | 廣武自動機械股份有限公司 | Automatic stripping machine and stripping method thereof capable of peeling a thin film from a photoresist layer of a printed circuit board |
TWM600516U (en) * | 2020-01-08 | 2020-08-21 | 鴻鉑科技有限公司 | Film peeling device |
TWM604711U (en) * | 2020-07-24 | 2020-12-01 | 鴻鉑科技有限公司 | Adjustable film peel-off structure |
TW202127969A (en) * | 2020-01-08 | 2021-07-16 | 鴻鉑科技有限公司 | Film suction structure which is adapted to a film peeling machine for sucking or separating the film |
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2022
- 2022-05-06 TW TW111117147A patent/TWI793004B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631103A (en) * | 1984-04-10 | 1986-12-23 | Nitto Electric Industrial Co., Ltd. | Process for peeling protective film off a thin article |
TW201838492A (en) * | 2017-04-07 | 2018-10-16 | 廣武自動機械股份有限公司 | Automatic stripping machine and stripping method thereof capable of peeling a thin film from a photoresist layer of a printed circuit board |
TWM600516U (en) * | 2020-01-08 | 2020-08-21 | 鴻鉑科技有限公司 | Film peeling device |
TW202127969A (en) * | 2020-01-08 | 2021-07-16 | 鴻鉑科技有限公司 | Film suction structure which is adapted to a film peeling machine for sucking or separating the film |
TWM604711U (en) * | 2020-07-24 | 2020-12-01 | 鴻鉑科技有限公司 | Adjustable film peel-off structure |
Also Published As
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TW202344407A (en) | 2023-11-16 |
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