TWI785795B - Substrate for light source, substrate array for light source, substrate array lower plate for light source and manufacturing method thereof - Google Patents

Abstract

Disclosed is a light source substrate, a light source substrate array, and a light source substrate array Lower plate and its manufacturing method. According to an aspect of this embodiment, there is provided a substrate for a light source. The substrate for a light source is characterized by comprising: a lower plate comprising two metal plates and an adhesive between the two metal plates; an upper plate configured on the The upper part of the lower board includes a step and a reflective surface formed on the lower part of the step; and an adhesive for adhering the upper surface of the lower board to the lower surface of the upper board.

Description

Substrate for light source, substrate array for light source, substrate array for light source Lower plate and its manufacturing method

The invention relates to a substrate array for a light source and a method for manufacturing the substrate array for a light source.

The contents in this section merely provide background information about an embodiment of the present invention and do not constitute prior art.

FIG. 14 is a diagram showing a conventional light source substrate.

Referring to FIG. 14 , in a conventional light source substrate 1400 , a plurality of metal frames 1410 , 1430 are adhered and positioned by an adhesive 1420 . Here, the metal frame and the adhesive have the shape before being cut, and have the shapes of the solid line part and the dotted line part as shown in FIG. 14 . Afterwards, each metal frame 1410, 1430 is cut to form a resting surface on the step 1440, the reflective surface 1444, the upper surface (+y-axis direction) of the metal frame 1410, 1430 and the adhesive 1420, which can be used to arrange the light source or electrode, etc. 1448. The conventional light source substrate 1400 is manufactured by cutting.

However, in order to manufacture the conventional light source substrate 1400 , the metal frames 1410 , 1430 and the adhesive 1420 must be precisely cut before cutting. Precise cutting leads to a problem of increasing the manufacturing cost and manufacturing time of the light source substrate 1400 . In addition, in order to form the resting surface 1448 , the metal frames 1410 , 1430 and the adhesive 1420 must be cut at the same depth. However, it is not easy to cut the metal frames 1410 , 1430 with different components and the adhesive 1420 to the same depth, and it is not easy to cut the adhesive 1420 with a relatively narrow width, so there are difficulties in manufacturing.

An object of an embodiment of the present invention is to provide a lower plate of a light source substrate array, a manufacturing method thereof, and a light source substrate array that can be manufactured inexpensively and quickly.

According to one aspect of the present invention, there is provided a substrate for a light source. The substrate for a light source is characterized by comprising: a lower plate comprising two metal plates and an adhesive between the two metal plates; an upper plate configured on the The upper part of the lower plate includes a step and a reflective surface formed on the lower part of the step; and an adhesive for adhering the upper surface of the lower plate to the lower surface of the upper plate.

According to one aspect of the invention, it is characterized in that said upper plate is formed of two parts having corresponding shapes, and each part is located on each metal plate of said lower plate.

According to one aspect of the present invention, it is characterized in that the adhesive is photo solder resist (PSR), Epoxy Molding Compound (EMC) or Silicon Molding Compound (SMC).

According to one aspect of the present invention, there is provided a substrate array lower plate for a light source, which is a lower plate of a substrate array for a light source manufactured from a plurality of substrates for a light source. Through hole for adhesive injection.

According to one aspect of the present invention, it is characterized in that the lower plate of the substrate array for light source includes a plated layer coated with a predetermined metal on the surface opposite to the surface in contact with the upper plate of the substrate array for light source.

According to one aspect of the present invention, it is characterized in that the predetermined metal includes part or all of nickel and silver.

According to an aspect of the present invention, it is characterized in that the plated layer is formed on the remaining portion except the through hole.

According to one aspect of the present invention, it is characterized in that the through hole has a predetermined width and a predetermined length.

According to one aspect of the present invention, there is provided a method for manufacturing a lower plate of a substrate array for a light source, which is a method for manufacturing a lower plate of a substrate array for a light source manufactured from a plurality of substrates for a light source, and is characterized in that it includes: a configuration process, disposing the frame made of the lower plate of the light source substrate array on a die plate; and a pressing process, using a punch with a predetermined width and a predetermined length to press the frame.

According to one aspect of the present invention, it is characterized in that under the substrate array for light source The manufacturing method of the board further includes: a forming process, forming an adhesive film on the surface of the frame that has passed the pressing process and the upper plate of the substrate array for the light source, and forming an adhesive film on the surface of the frame that has passed the pressing process and the light source Plating layers are formed on the opposite surfaces that are in contact with the upper plate of the substrate array.

According to one aspect of the present invention, it is characterized in that the manufacturing method of the substrate array lower plate for light source further includes: an injecting process, injecting an adhesive into the through holes formed through the pressing process.

According to an aspect of the present invention, it is characterized in that the adhesive is injected into the frame along the direction of forming the plating layer.

According to one aspect of the present invention, there is provided a substrate array for a light source, which is a substrate array for a light source manufactured from a plurality of substrates for a light source. A through hole for injecting the adhesive is formed; and an upper plate is disposed on the upper portion of the lower plate, steps are formed at predetermined intervals at positions that do not overlap with positions of the through holes, and are formed on the lower portion of the steps. reflective surface.

As shown in the above description, according to one aspect of the present invention, it has the following advantages: it can be manufactured by a pressing process, and thus can be manufactured at a lower cost and in a faster time than the prior art.

100: substrate array for light source

110: upper board/board/metal frame

115: Interval

120: Lower plate/plate/metal frame

125, 1010: through hole

310, 1440: steps

320, 1444: reflective surface

330: Adhesive

340, 1420: Adhesive

410, 910, 1110: punch

420, 920: template

430, 930: punch holder or punch guide

610: Adhesive glue

620: plating layer

810: Blank

1020: Sawing marks

1400: Substrate for light source

1410, 1430: metal frame

1448: shelving surface

h: height

w: width

x, y, z: axes

Figure 1 and Figure 2 are the upper part of the substrate array for light source according to one embodiment of the present invention Perspective view and lower perspective view.

3 is a cross-sectional view of a substrate for a light source according to an embodiment of the present invention.

4 to 7 are diagrams illustrating a process of manufacturing a lower plate of a substrate array for a light source according to an embodiment of the present invention.

FIG. 8 is a diagram illustrating a lower plate of a substrate array for a light source manufactured according to an embodiment of the present invention.

9 to 13 are diagrams illustrating a process of manufacturing an upper plate of a light source substrate array according to an embodiment of the present invention.

FIG. 14 is a diagram showing a conventional light source substrate.

The present invention can be modified variously and has various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, it should be understood that the present invention is not limited to specific embodiments, but includes all changes, equivalents, and replacements included in the spirit and technical scope of the present invention. Similar reference symbols are used for similar components in describing the respective drawings.

Terms such as first, second, A, B, etc. may be used to describe various constituent elements, but the constituent elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from another constituent element. For example, without departing from the patent scope of the present invention, a first constituent element may be named a second constituent element, and similarly, a second constituent element may also be named a first constituent element. The term "and/or" includes a combination of a plurality of related description items or any one of a plurality of related description items.

When an element is referred to as being "connected" or "linked" to another element, it should be understood that it may be directly connected or connected to the other element, although other elements may also be present in between. Conversely, when a constituent element is referred to as being "directly connected" or "directly connected" to another constituent element, it should be understood that there is no intervening constituent element.

The terms used in this application are used to describe specific embodiments only, and are not intended to limit the present invention. A singular expression includes a plural expression unless the context clearly dictates otherwise. It should be understood that terms such as "comprising" or "having" in the present application do not preclude the possibility of existing or adding the features, numbers, steps, actions, constituent elements, parts or combinations thereof described in the specification.

Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms as defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings they have in the context of the related art, and should not be interpreted as ideal or formal meanings unless clearly defined in the present application.

In addition, the various components, processes, processes or methods included in the various embodiments of the present invention may be shared within the scope that does not contradict each other technically.

1 and 2 are upper perspective views and lower perspective views of a substrate array for a light source according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a substrate for a light source according to an embodiment of the present invention.

Referring to FIG. 3 , a substrate for a light source according to an embodiment of the present invention includes an upper plate 110 and the lower plate 120. The light source substrate shown in FIG. 3 corresponds to the cross section of AA' in FIG. 1 .

A plurality of members having the same or corresponding shapes in the upper plate 110 are arranged at predetermined intervals. The components of the upper plate 110 are arranged at regular intervals and include steps 310 , whereby covers (not shown) having sizes at regular intervals can be seated on the steps 310 . In the case of finally manufacturing the substrate for the light source, when the light source is placed on the upper surface of the lower plate 120 , it is necessary to configure a cover for protecting the light source from external force. In order to arrange the cover stably, the components of the upper plate 110 are arranged at intervals (according to the length of the cover).

Each part of the upper board 110 includes a reflective surface 320 to completely output light irradiated from a light source (not shown) disposed on the substrate to the outside. Each part of the upper plate 110 includes a reflective surface 320 formed continuously at an end portion of the step 310 . The reflective surface 320 has an inclined surface in a direction in which light is reflected upward (a direction in which the upper plate is viewed from the lower plate), and outputs light irradiated from a light source (not shown) to the upper portion.

The lower plate 120 includes two metal plates and an adhesive 340 between the metal plates. The adhesive 340 includes components having an insulating function. The adhesive 340 is solidified after being injected between the metal plates, so as to prevent the two metal plates from conducting and make them stick together. The adhesive 340 can be implemented by any one of photo solder resist (Photo Solder Resist, PSR), epoxy molding compound (Epoxy Molding Compound, EMC) or silicon molding compound (Silicon Mold Compound, SMC).

Referring to Fig. 1 and Fig. 2, in order to have the structure of the upper plate in the light source substrate of Fig. 3, the upper plate 110 of the light source substrate array is processed into a tool according to the predetermined interval The lower plate 120 of the light source substrate array has a shape with steps and an inclined surface formed by the reflective surface, and through holes for injecting the adhesive 340 are formed at the same interval as the upper plate 110 .

The two boards 110, 120 are aligned at corresponding positions and adhered by an adhesive 330, and are cut according to various shapes to manufacture the light source substrate shown in FIG. 3 . Same as the adhesive 340 , the adhesive 330 also includes components with insulation function.

In the following, the manufacturing process of the upper plate 110 and the lower plate of the light source substrate array will be described.

4 to 7 are diagrams illustrating a process of manufacturing a lower plate of a substrate array for a light source according to an embodiment of the present invention.

Referring to FIG. 4 , the metal frame 120 manufactured as the lower plate of the light source substrate array is disposed on the template 420 . The metal frame 120 is made of metal such as aluminum, and constitutes a lower plate of the substrate array for light sources. The template 420 supports the metal frame 120 with a gap corresponding to the width w (length in the x-axis direction) and length (length in the y-axis direction) of the through-hole to be formed in the metal frame 120 .

When the metal frame 120 is placed on the template 420 , the metal frame 120 is pressed by a punch (punch) 410 having a width and a length of a through hole to be formed on the metal frame 120 . In the process of pressing the metal frame 120, in order to prevent the punch 410 having a predetermined length from bending or deviating from a fixed position, a punch holder or a punch guide 430 may be arranged on both sides (width direction) of the punch 410 and connected with the punch 410. The punches 410 move together.

At this time, even if punch holders or punch guides are arranged on both sides of the punch 410, When the relationship between the guide 430 and the height h (length in the z-axis direction) of the metal frame 120 is taken into consideration, the width and length of the punch 410 are limited. Generally speaking, it is preferable that the width of the punch 410 should be about 50% of the height of the metal frame 120 , and the length of the punch 410 should be about 20 times of the height of the metal frame 120 . When the above range is exceeded, even if the punch holders or the punch guides 430 are disposed on both sides of the punch 410 , it is difficult for the punch 410 to press to form a complete through-hole in the metal frame 120 . In contrast, the punches 410 have a predetermined width and length and are formed at predetermined intervals, thereby forming through holes in the metal frame 120 at predetermined intervals. The punches 410 can also be formed according to the number of all the through holes to be formed on the lower plate of the light source substrate array, and can be formed according to a part number and pressed multiple times to form all the through holes, and one punch 410 can also form all the through holes. number of through-holes.

Referring to FIG. 5 , the punch 410 moves away from the metal frame 120 after pressing the metal frame 120 . The punch 410 is separated, and a through hole 125 having a predetermined width and a predetermined length is formed in the metal frame 120 .

Referring to FIG. 6 , an adhesive 610 is pasted on the upper surface of the metal frame 120 formed with the through hole 125 (+y-axis direction, the surface in contact with the upper plate of the substrate array for the light source), and the lower surface of the metal frame 120 is The plated layer 620 is formed on (-y-axis direction, the surface opposite to the upper plate of the light source substrate array). The plated layer 620 is formed including a part or all of nickel (Ni) and silver (Ag), and is formed on the remaining portion except the portion where the through hole 125 is formed.

Referring to FIG. 7( a ) and FIG. 7( b ), the adhesive 340 is injected into the through hole 125 along the direction of forming the plating layer 620 . As shown in Figure 7(a), it is also possible to follow and connect The adhesive 340 is injected into the same width (length in the x-axis direction) of the hole 125 as shown in FIG. Since the adhesive 610 is applied in a direction opposite to the direction in which the plating layer 620 is formed, the adhesive 340 can be completely injected into the through hole 125 . The adhesive 340 is cured after being injected into the through hole 125 .

As shown in FIG. 7( b ), when more adhesive 340 is injected and cured, the adhesiveness and insulation can be improved, and the upper surface and the lower surface can be easily distinguished for the final lower plate.

Instead of cutting the metal frame and adhesive to form the lower plate as in the prior art, the lower plate is manufactured by pressing the metal frame and injecting the adhesive, so that the lower plate can be manufactured quickly and cheaply. In addition, since the lower plate is only pressed and cut, and only the adhesive is injected, there is no difficulty in cutting. Accordingly, the lower plate 120 of the light source substrate array can be manufactured quickly and simply.

FIG. 8 is a diagram illustrating a lower plate of a substrate array for a light source manufactured according to an embodiment of the present invention.

As described above, the through hole 125 is formed by pressing with the punch 410 having a predetermined width and a predetermined length. In addition, since the width and length of the punch 410 are limited by the height of the metal frame, the through-holes 340 for injecting the adhesive are formed at predetermined intervals, and there are gaps between the through-holes where no through-holes are formed. Blank 810. Dicing is performed on the blank 810 to manufacture the light source substrate array 100 as a light source substrate.

9 to 13 are diagrams illustrating the manufacturing of substrates for light sources according to an embodiment of the present invention. Diagram of the fabrication process for the upper plate of the plate array.

Referring to FIG. 9 and FIG. 10 , similar to the manufacturing process of the lower plate of the light source substrate array, the metal frame 110 to be manufactured as the upper plate is also disposed on the template 920 . Here, the metal frame 110 may be made of metal such as aluminum or the like in the same manner as the lower plate. The template 920 has a blank according to the width of the through hole 1010 to be formed on the metal frame 110 and supports the metal frame 110 . The punch 910 presses the metal frame 110 supported by the template 920 to form the through hole 1010 . Also, in order to prevent the punch 910 from bending or coming out of a fixed position, punch holders or punch guides 930 may be arranged on both sides (width direction) of the punch 910 and move together with the punch 910 .

However, the through hole 1010 formed in the metal frame 110 does not have the width of the space 115 between the steps or the space between the reflection surfaces in the upper plate 110 manufactured finally, but has a width much narrower than that. width. In order to machine the metal frame 110 at one time into the same shape as the upper plate 110 of the light source substrate described with reference to FIG. 3 , considerable pressure must be applied to the metal frame and the punch. On the contrary, when the through hole 1010 is formed on the metal frame 110 , when the metal frame 110 is machined into the same shape as the upper plate 110 of the light source substrate, the metal frame and the punch can be performed with relatively much smaller pressure.

Therefore, first, the through-hole 1010 having a width narrower than the interval 115 between steps is formed in the metal frame 110 .

Additional marks may be formed on the metal frame 110 together with the through hole 1010 . On one side of the metal frame 110, a sawing mark (Sawing Marker) 1020 indicating the cutting point of the substrate array for the light source to be manufactured, and a marking (Sawing Marker) 1020 indicating that the cathode electrode will be arranged later. A cathode mark (not shown) of a position, or a heat discharge port mark (not shown) indicating a position where a heat discharge port is to be formed, etc. may be formed in the metal frame 110 together with the through hole 1010 .

Referring to FIGS. 11 and 12 , the metal frame 110 formed with the through hole 1010 is machined by a punch 1110 having a shape complementary to that of the upper plate 110 of the light source substrate. The punch 1110 descends and presses the metal frame 110 , whereby the metal frame 110 can form the step 310 and the reflective surface 320 separated by a predetermined interval 115 . As mentioned above, after forming the through hole 1010 in the metal frame 110, machining is performed to form the step 310 and the reflective surface 320, so the upper plate of the light source substrate array can also be manufactured quickly and at low cost.

Referring to FIG. 13 , an adhesive 330 for contacting the lower plate of the light source substrate array is coated on the lower surface of the metal frame 110 (the surface in contact with the lower plate of the light source substrate array).

The adhesive 610 attached to the lower plate of the light source substrate array manufactured through the processes of FIGS. 4 to 7 is removed, and the upper plate of the light source substrate array and the lower plate of the light source substrate array are adhered by the adhesive 330 . After the two boards are bonded, the bonding is accomplished by applying heat or ultrasonic waves, or by applying a certain amount of pressure.

According to an embodiment of the present invention, the upper plate and the lower plate of the light source substrate array do not need to be precisely cut as in the prior art, and it is not necessary to perform cutting on materials (metals and insulating materials) with different components at the same time, so it can be cheap and fast. The light source substrate array 100 is manufactured within a short period of time.

The above description only exemplifies the technical idea of this embodiment, and those with ordinary knowledge in the technical field to which this embodiment belongs will not depart from this embodiment. Various modifications and variations are possible within the scope of the essential characteristics. Therefore, this embodiment is not intended to limit the technical idea of this embodiment for illustration, and does not limit the scope of the technical idea of this embodiment by such means. The scope of protection of this embodiment should be interpreted by the scope of the following patent applications, and all technical ideas within the scope equivalent to it should be interpreted as being included in the scope of rights of this embodiment.

110: upper board/board/metal frame

115: Interval

120: Lower plate/plate/metal frame

310: steps

320: reflective surface

330: Adhesive

340: Adhesive

Claims (4)

A method for manufacturing a lower plate of a substrate array for a light source is a method for manufacturing a lower plate of a substrate array for a light source manufactured from a plurality of substrates for a light source. The frame manufactured by the lower plate is arranged on the template; and the pressing process uses a punch with a predetermined width and a predetermined length to press the frame. The method for manufacturing the lower plate of the substrate array for light sources as described in Claim 1 further includes: a forming process, forming an adhesive on the surface of the frame that is in contact with the upper plate of the substrate array for light source after the pressing process film, and a plated layer is formed on the opposite surface of the frame that passes through the pressing process to the upper plate of the light source substrate array. The method for manufacturing the lower plate of the substrate array for light sources as described in Claim 2 further includes: an injecting process, injecting an adhesive into the through-holes formed through the pressing process. The method for manufacturing the lower plate of the substrate array for light source according to claim 3, wherein the adhesive is injected into the frame along the direction of forming the plating layer.

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