TWI785642B - 異向性導電膜及連接構造體 - Google Patents

異向性導電膜及連接構造體 Download PDF

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Publication number
TWI785642B
TWI785642B TW110121248A TW110121248A TWI785642B TW I785642 B TWI785642 B TW I785642B TW 110121248 A TW110121248 A TW 110121248A TW 110121248 A TW110121248 A TW 110121248A TW I785642 B TWI785642 B TW I785642B
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TW
Taiwan
Prior art keywords
conductive particles
conductive
anisotropic conductive
conductive film
film
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TW110121248A
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English (en)
Chinese (zh)
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TW202137244A (zh
Inventor
阿久津恭志
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日商迪睿合股份有限公司
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Publication of TW202137244A publication Critical patent/TW202137244A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
TW110121248A 2014-11-17 2015-11-17 異向性導電膜及連接構造體 TWI785642B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014232934 2014-11-17
JPJP2014-232934 2014-11-17

Publications (2)

Publication Number Publication Date
TW202137244A TW202137244A (zh) 2021-10-01
TWI785642B true TWI785642B (zh) 2022-12-01

Family

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Family Applications (5)

Application Number Title Priority Date Filing Date
TW110121248A TWI785642B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW111104942A TWI862897B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW109121589A TWI733504B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW104137995A TWI732746B (zh) 2014-11-17 2015-11-17 異向性導電膜之製造方法
TW111144850A TWI863031B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體

Family Applications After (4)

Application Number Title Priority Date Filing Date
TW111104942A TWI862897B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW109121589A TWI733504B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW104137995A TWI732746B (zh) 2014-11-17 2015-11-17 異向性導電膜之製造方法
TW111144850A TWI863031B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體

Country Status (6)

Country Link
US (4) US10026709B2 (enExample)
JP (3) JP6746898B2 (enExample)
KR (3) KR102677632B1 (enExample)
CN (5) CN112421263B (enExample)
TW (5) TWI785642B (enExample)
WO (1) WO2016080379A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550652B (zh) 2012-08-01 2016-09-21 迪睿合股份有限公司 An anisotropic conductive film, an anisotropic conductive film, and a connecting structure
KR20170081295A (ko) * 2012-08-29 2017-07-11 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
KR102240963B1 (ko) * 2014-10-28 2021-04-16 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 그 제조 방법, 및 접속 구조체
TWI785642B (zh) 2014-11-17 2022-12-01 日商迪睿合股份有限公司 異向性導電膜及連接構造體
JP7274810B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
WO2017191779A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
CN116003858A (zh) * 2016-09-13 2023-04-25 迪睿合株式会社 含填料膜
JP7081097B2 (ja) 2016-09-13 2022-06-07 デクセリアルズ株式会社 フィラー含有フィルム
KR20210158875A (ko) * 2016-10-18 2021-12-31 데쿠세리아루즈 가부시키가이샤 필러 함유 필름
JP7087305B2 (ja) * 2017-04-23 2022-06-21 デクセリアルズ株式会社 フィラー含有フィルム
KR102478199B1 (ko) * 2016-10-18 2022-12-15 데쿠세리아루즈 가부시키가이샤 필러 함유 필름
JP7035370B2 (ja) * 2016-10-31 2022-03-15 デクセリアルズ株式会社 フィラー含有フィルム
JP7319578B2 (ja) * 2017-04-23 2023-08-02 デクセリアルズ株式会社 フィラー含有フィルム
US20190100663A1 (en) * 2017-10-03 2019-04-04 Shin-Etsu Chemical Co., Ltd. Anisotropic conductive film and method for manufacturing anisotropic conductive film
CN109801888A (zh) 2017-11-16 2019-05-24 群创光电股份有限公司 第一电子元件及包含第一电子元件的显示设备
FR3080427B1 (fr) 2018-04-24 2020-04-03 Faurecia Systemes D'echappement Vanne pour une ligne d'echappement
US20200156291A1 (en) * 2018-11-21 2020-05-21 Shin-Etsu Chemical Co., Ltd. Anisotropic film and method for manufacturing anisotropic film
TWI846756B (zh) 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
JP2024146277A (ja) 2023-03-31 2024-10-15 デクセリアルズ株式会社 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
KR102985482B1 (ko) * 2024-04-25 2026-07-02 에이치엔에스하이텍(주) 패턴 얼라인 정밀성을 향상시킨 이방도전성 접착필름 롤체

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201435919A (zh) * 2012-08-29 2014-09-16 Dexerials Corp 異向性導電膜及其製造方法
TWI732746B (zh) * 2014-11-17 2021-07-11 日商迪睿合股份有限公司 異向性導電膜之製造方法

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1512525A (en) * 1921-01-25 1924-10-21 George W Davis Valve for internal-combustion engines
DE3486101T2 (de) * 1983-10-14 1993-07-01 Hitachi Chemical Co Ltd Anisotrop elektrisch leitender klebefilm und verfahren zum verbinden von schaltungen unter dessen anwendung.
JPH0582199A (ja) 1991-05-28 1993-04-02 Minato Electron Kk 異方導電性コネクタを有するコネクタ配置構造および異方導電性コネクタ
JPH0513119A (ja) 1991-07-04 1993-01-22 Sharp Corp 電子部品接続用テープコネクタ
JPH0645024A (ja) * 1992-07-22 1994-02-18 Hitachi Chem Co Ltd 異方導電性接着フィルム
US5372750A (en) * 1992-09-11 1994-12-13 Johnson Service Company Electrically conductive screen printable compositions and method of making the same
JP3472987B2 (ja) * 1993-01-29 2003-12-02 日立化成工業株式会社 接続部材の製造法及びその製造装置
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
JP3103956B2 (ja) * 1993-06-03 2000-10-30 ソニーケミカル株式会社 異方性導電膜
TW277152B (enExample) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
JPH09320345A (ja) 1996-05-31 1997-12-12 Whitaker Corp:The 異方導電性フィルム
US20010008169A1 (en) * 1998-06-30 2001-07-19 3M Innovative Properties Company Fine pitch anisotropic conductive adhesive
JP2000129218A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
CN100360597C (zh) * 2000-12-08 2008-01-09 积水化学工业株式会社 绝缘基材的原料及由其生产的制品
WO2002065588A1 (en) * 2001-02-09 2002-08-22 Jsr Corporation Anisotropic conductive connector, its manufacture method and probe member
JP2002270099A (ja) * 2001-03-07 2002-09-20 Sony Corp 平面型表示装置におけるノッキング処理方法、及び、平面型表示装置用基板におけるノッキング処理方法
JP3847227B2 (ja) * 2001-10-02 2006-11-22 日本碍子株式会社 コンタクトシート
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
JP4130747B2 (ja) * 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 異方導電性接着シートおよびその製造方法
JP3994335B2 (ja) * 2002-10-04 2007-10-17 日立化成工業株式会社 接続部材の製造方法
DE60335074D1 (de) * 2002-12-27 2011-01-05 Panasonic Corp Kondensator und Verfahren zu dessen Herstellung, und Leiterplatte mit einem eingebauten Kondensator und Verfahren zu deren Herstellung
JP3753145B2 (ja) * 2003-04-21 2006-03-08 Ｊｓｒ株式会社 異方導電性シートおよびその製造方法、アダプター装置およびその製造方法並びに回路装置の電気的検査装置
JP2004335663A (ja) * 2003-05-06 2004-11-25 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
KR101051217B1 (ko) * 2003-06-12 2011-07-21 제이에스알 가부시끼가이샤 이방 도전성 커넥터 장치 및 그 제조 방법 및 회로 장치의검사 장치
JP2005019274A (ja) * 2003-06-27 2005-01-20 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
WO2005054388A1 (ja) 2003-12-04 2005-06-16 Asahi Kasei Emd Corporation 異方導電性接着シート及び接続構造体
JP2005209454A (ja) * 2004-01-21 2005-08-04 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
US20060024551A1 (en) * 2004-02-20 2006-02-02 Nuvant Systems, Inc. Array fuel cell reactors with a switching system
JP2006024551A (ja) * 2004-06-11 2006-01-26 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
JP2006049783A (ja) 2004-06-29 2006-02-16 Yuji Suda 異方性導電接着フィルムの製造方法と電極接続方法
TWI445178B (zh) * 2005-01-28 2014-07-11 半導體能源研究所股份有限公司 半導體裝置，電子裝置，和半導體裝置的製造方法
TWI505473B (zh) * 2005-01-28 2015-10-21 半導體能源研究所股份有限公司 半導體裝置，電子裝置，和半導體裝置的製造方法
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
JP2007115560A (ja) * 2005-10-21 2007-05-10 Sumitomo Bakelite Co Ltd 異方導電フィルム及びその製造方法
JP2008153626A (ja) * 2006-11-21 2008-07-03 Fujifilm Corp 光導電体および放射線検出器並びに放射線撮像パネル
KR101087344B1 (ko) * 2007-03-23 2011-11-25 파나소닉 주식회사 도전성 범프와 그 제조 방법 및 전자 부품 실장 구조체
JP4880533B2 (ja) * 2007-07-03 2012-02-22 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜及びその製造方法、並びに接合体
JP2009152160A (ja) * 2007-12-25 2009-07-09 Tokai Rubber Ind Ltd 粒子転写型およびその製造方法、粒子転写膜の製造方法ならびに異方性導電膜
JP2010033793A (ja) 2008-07-28 2010-02-12 Tokai Rubber Ind Ltd 粒子転写膜の製造方法
CN102144432B (zh) * 2008-09-05 2015-09-30 住友电木株式会社 导电连接材料、使用该导电连接材料的端子之间的连接方法以及连接端子的制造方法
US9036915B2 (en) * 2010-01-29 2015-05-19 The Hong Kong University Of Science And Technology Architectural pattern detection and modeling in images
TWM393834U (en) * 2010-03-18 2010-12-01 Hon Hai Prec Ind Co Ltd Electrical connector and assembly thereof
US20120295098A1 (en) 2011-05-19 2012-11-22 Trillion Science, Inc. Fixed-array anisotropic conductive film using surface modified conductive particles
WO2013005831A1 (ja) * 2011-07-07 2013-01-10 日立化成工業株式会社 回路接続材料及び回路基板の接続構造体
CN104541416B (zh) 2012-08-24 2017-07-04 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
JP5972844B2 (ja) * 2012-09-18 2016-08-17 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
JP2014065765A (ja) * 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤
CN103903683A (zh) * 2012-12-28 2014-07-02 鸿富锦精密工业（深圳）有限公司 各向异性导电膜及其制备方法
JP2015018209A (ja) * 2013-04-12 2015-01-29 株式会社リコー 記録媒体、画像記録装置、画像記録セット
CN105143923B (zh) * 2013-04-17 2018-03-09 国立研究开发法人科学技术振兴机构 光子晶体以及利用该光子晶体的光学功能设备
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
JP6581331B2 (ja) * 2013-07-29 2019-09-25 デクセリアルズ株式会社 導電性接着フィルムの製造方法、接続体の製造方法
JP2015149451A (ja) * 2014-02-07 2015-08-20 デクセリアルズ株式会社 アライメント方法、電子部品の接続方法、接続体の製造方法、接続体、異方性導電フィルム
US9556640B2 (en) * 2014-04-25 2017-01-31 Designer Direct, Inc. Cantilevered watercraft canopy
CN105013119A (zh) 2014-05-01 2015-11-04 白希安 可盘卷输送管
JP2016029698A (ja) * 2014-07-22 2016-03-03 デクセリアルズ株式会社 接続体、及び接続体の製造方法
JP6661969B2 (ja) * 2014-10-28 2020-03-11 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
KR102240963B1 (ko) * 2014-10-28 2021-04-16 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 그 제조 방법, 및 접속 구조체
JP6476747B2 (ja) * 2014-10-28 2019-03-06 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
WO2016068083A1 (ja) * 2014-10-31 2016-05-06 デクセリアルズ株式会社 異方性導電フィルム
DE112016001195T5 (de) * 2015-03-13 2017-11-23 Hamamatsu Photonics K.K. Lichtemittierendes halbleiterelement
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201435919A (zh) * 2012-08-29 2014-09-16 Dexerials Corp 異向性導電膜及其製造方法
TWI732746B (zh) * 2014-11-17 2021-07-11 日商迪睿合股份有限公司 異向性導電膜之製造方法

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CN112421263B (zh) 2022-10-25
US20170317047A1 (en) 2017-11-02
CN107078420B (zh) 2022-04-08
JP2020188018A (ja) 2020-11-19
KR20220025194A (ko) 2022-03-03
JP7440789B2 (ja) 2024-02-29
CN111029875B (zh) 2022-05-10
TW201638970A (zh) 2016-11-01
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