TWI784008B - 補強膜 - Google Patents

補強膜 Download PDF

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Publication number
TWI784008B
TWI784008B TW107119768A TW107119768A TWI784008B TW I784008 B TWI784008 B TW I784008B TW 107119768 A TW107119768 A TW 107119768A TW 107119768 A TW107119768 A TW 107119768A TW I784008 B TWI784008 B TW I784008B
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TW
Taiwan
Prior art keywords
meth
adhesive
less
polymer
weight
Prior art date
Application number
TW107119768A
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English (en)
Chinese (zh)
Other versions
TW201923005A (zh
Inventor
仲野武史
鈴木立也
佐佐木翔悟
家田博基
Original Assignee
日商日東電工股份有限公司
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Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201923005A publication Critical patent/TW201923005A/zh
Application granted granted Critical
Publication of TWI784008B publication Critical patent/TWI784008B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00—Presence of graft polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Materials For Medical Uses (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
TW107119768A 2017-11-20 2018-06-08 補強膜 TWI784008B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-222777 2017-11-20
JP2017222777 2017-11-20
JP2018107849A JP6496066B1 (ja) 2017-11-20 2018-06-05 補強フィルム
JP2018-107849 2018-06-05

Publications (2)

Publication Number Publication Date
TW201923005A TW201923005A (zh) 2019-06-16
TWI784008B true TWI784008B (zh) 2022-11-21

Family

ID=65999502

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107119768A TWI784008B (zh) 2017-11-20 2018-06-08 補強膜

Country Status (4)

Country Link
JP (2) JP6496066B1 (OSRAM)
KR (2) KR102294736B1 (OSRAM)
CN (1) CN110003806B (OSRAM)
TW (1) TWI784008B (OSRAM)

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KR102290640B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102293935B1 (ko) * 2018-07-27 2021-08-24 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102293551B1 (ko) * 2018-07-27 2021-08-24 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102290643B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102290629B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102293550B1 (ko) * 2018-07-27 2021-08-24 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102290639B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
JP7268278B2 (ja) * 2019-11-08 2023-05-08 日本カーバイド工業株式会社 粘着剤組成物、粘着シート、及び光学部材
JP7268277B2 (ja) * 2019-11-08 2023-05-08 日本カーバイド工業株式会社 粘着剤組成物、粘着シート、及び光学部材
KR102306997B1 (ko) * 2019-11-11 2021-09-29 도레이첨단소재 주식회사 초경박리 이형필름
US12312510B2 (en) * 2019-12-02 2025-05-27 Mektec Corporation Adhesive film and flexible printed circuit board
JP6893576B2 (ja) * 2019-12-02 2021-06-23 日本メクトロン株式会社 接着フィルム及びフレキシブルプリント基板
KR102430601B1 (ko) * 2020-03-03 2022-08-08 삼성에스디아이 주식회사 점착 필름, 이를 포함하는 광학 부재 및 이를 포함하는 광학표시장치
KR102881921B1 (ko) * 2020-03-27 2025-11-06 현대모비스 주식회사 차량 램프용 통기부재 및 이의 제조방법
JP7638639B2 (ja) * 2020-08-06 2025-03-04 日東電工株式会社 補強用フィルム、光学部材および電子部材
JP7733976B2 (ja) * 2020-08-06 2025-09-04 日東電工株式会社 補強用フィルム、光学部材および電子部材
JP7645057B2 (ja) * 2020-08-06 2025-03-13 日東電工株式会社 補強用フィルム、光学部材および電子部材
JP7638640B2 (ja) * 2020-08-06 2025-03-04 日東電工株式会社 補強用フィルム、光学部材および電子部材
CN114015385A (zh) * 2021-10-08 2022-02-08 常州都铂高分子有限公司 一种初粘性低的胶水
JPWO2024106155A1 (OSRAM) * 2022-11-16 2024-05-23

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TW201728661A (zh) * 2015-10-14 2017-08-16 Ajinomoto Kk 樹脂組成物、接著薄膜及無芯基板的製造方法
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CN106459692A (zh) * 2014-06-11 2017-02-22 日东电工株式会社 粘合片
TW201728661A (zh) * 2015-10-14 2017-08-16 Ajinomoto Kk 樹脂組成物、接著薄膜及無芯基板的製造方法
TW201730300A (zh) * 2015-10-28 2017-09-01 味之素股份有限公司 接著薄膜

Also Published As

Publication number Publication date
KR20190058277A (ko) 2019-05-29
TW201923005A (zh) 2019-06-16
KR20210011045A (ko) 2021-01-29
JP7171473B2 (ja) 2022-11-15
JP2019094476A (ja) 2019-06-20
CN110003806B (zh) 2022-10-25
JP6496066B1 (ja) 2019-04-03
CN110003806A (zh) 2019-07-12
JP2019094508A (ja) 2019-06-20
KR102294736B1 (ko) 2021-08-30

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