TWI784008B - Reinforcing membrane - Google Patents

Reinforcing membrane Download PDF

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TWI784008B
TWI784008B TW107119768A TW107119768A TWI784008B TW I784008 B TWI784008 B TW I784008B TW 107119768 A TW107119768 A TW 107119768A TW 107119768 A TW107119768 A TW 107119768A TW I784008 B TWI784008 B TW I784008B
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仲野武史
鈴木立也
佐佐木翔悟
家田博基
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10Block or graft copolymers containing polysiloxane sequences
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    • C09J201/00Adhesives based on unspecified macromolecular compounds
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    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
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    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/401Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2433/00Presence of (meth)acrylic polymer
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    • C09J2451/00Presence of graft polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
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Abstract

本發明提供一種兼具初期之低黏著性與使用時之強黏著性且性能經改善及穩定化之補強膜。 本發明提供一種補強膜,其包含具有第一面與第二面之支持基材、及積層於該支持基材之上述第一面之黏著劑層。上述支持基材包含樹脂膜作為基底膜。上述黏著劑層之第二面固著於上述支持基材之上述第一面,該黏著劑層之第一面抵接於水接觸角100度以上之剝離性表面。上述黏著劑層含有Tg未達0℃之聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B。上述補強膜在貼附後於80℃下加熱5分鐘後於23℃下放置30分鐘後之黏著力N2為在貼附後於23℃下放置30分鐘後之黏著力N1的10倍以上。The present invention provides a reinforced film with both initial low adhesiveness and strong adhesiveness during use with improved and stabilized performance. The invention provides a reinforcing film, which comprises a support substrate having a first surface and a second surface, and an adhesive layer laminated on the first surface of the support substrate. The above-mentioned support substrate includes a resin film as a base film. The second surface of the adhesive layer is fixed to the first surface of the support substrate, and the first surface of the adhesive layer is in contact with a peelable surface with a water contact angle of 100 degrees or more. The said pressure-sensitive adhesive layer contains the polymer A whose Tg is less than 0 degreeC, and the polymer B which is a copolymer of the monomer which has a polyorganosiloxane frame|skeleton, and a (meth)acrylic-type monomer. The adhesive force N2 of the reinforcing film after being attached and heated at 80°C for 5 minutes and then placed at 23°C for 30 minutes is more than 10 times the adhesive force N1 after being placed at 23°C for 30 minutes after attaching.

Description

補強膜Reinforcing membrane

本發明係關於一種補強膜。 本申請案係主張基於2017年11月20日提出申請之日本專利申請案2017-222777號及2018年6月5日提出申請之日本專利申請案2018-107849號之優先權,且該等申請案之全部內容作為參照組入至本說明書中。The present invention relates to a reinforced membrane. This application claims priority based on Japanese Patent Application No. 2017-222777 filed on November 20, 2017 and Japanese Patent Application No. 2018-107849 filed on June 5, 2018, and these applications The entire content is incorporated into this manual as a reference.

黏著片材係藉由牢固地接著於被黏著體,而以被黏著體彼此之接著、物品對被黏著體之固定、被黏著體之補強等為目的而使用。先前,出於此種目的,使用有自貼附初期起發揮較高之黏著力之黏著片材。又,近來,如專利文獻1~3所示,提出有一種可於對被黏著體之貼附初期顯示出較低之黏著力且其後使黏著力大幅地上升之黏著片材。根據具有此種特性之黏著片材,可於黏著力上升前發揮對於抑制因黏著片材之貼錯或貼壞所導致之良率降低有用之重貼性(二次加工性),且於黏著力上升後發揮適於黏著片材之原本之使用目的之強黏著性。 [先前技術文獻] [專利文獻]The adhesive sheet is used for the purpose of bonding adherends, fixing articles to adherends, and reinforcing adherends by firmly adhering to adherends. Conventionally, for such a purpose, an adhesive sheet exhibiting high adhesive force from the initial stage of attachment has been used. Moreover, recently, as shown in patent documents 1-3, the adhesive sheet which can show low adhesive force at the initial stage of sticking to an adherend and can raise adhesive force significantly after that is proposed. According to the adhesive sheet having such characteristics, it is possible to exert the repositioning property (secondary processability) useful for suppressing the decrease in the yield rate caused by the wrong or damaged adhesive sheet before the adhesive force increases, and the adhesive After the force is increased, it will exhibit strong adhesiveness suitable for the original purpose of the adhesive sheet. [Prior Art Document] [Patent Document]

[專利文獻1]日本專利申請案公開2014-224227號公報 [專利文獻2]日本專利第5890596號公報 [專利文獻3]日本專利第5951153號公報[Patent Document 1] Japanese Patent Application Publication No. 2014-224227 [Patent Document 2] Japanese Patent No. 5890596 [Patent Document 3] Japanese Patent No. 5951153

[發明所欲解決之問題][Problem to be solved by the invention]

於專利文獻1~3中,關於兼具上述特性、即初期之低黏著性與使用時之強黏著性之黏著片材,主要從黏著劑之性質或組成之方面進行研究。另一方面,關於具備支持該黏著劑之支持基材之黏著片材(附基材之黏著片材),仍有研究之餘地。作為具有上述特性之附基材之黏著片材之一形態,本發明者著眼於為使用樹脂膜作為支持基材之構成且以補強為目的使用之補強膜,對該補強膜進行性能之改善及穩定化之研究而完成本發明。 [解決問題之技術手段]In Patent Documents 1 to 3, studies are mainly made on the properties or composition of the adhesive for an adhesive sheet having the above characteristics, ie low initial adhesiveness and strong adhesiveness during use. On the other hand, there is still room for research on an adhesive sheet provided with a support substrate for supporting the adhesive (adhesive sheet with substrate). As one form of the adhesive sheet with the base material having the above characteristics, the present inventors focused on the reinforcement film used for the purpose of reinforcement, which is composed of a resin film as the support base material, and improved the performance of the reinforcement film and The present invention has been accomplished through studies on stabilization. [Technical means to solve the problem]

根據本說明書,提供一種補強膜,其包含具有第一面與第二面之支持基材、及積層於上述支持基材之上述第一面之黏著劑層。上述支持基材包含樹脂膜作為基底膜。上述黏著劑層之第二面固著於上述支持基材之上述第一面,上述黏著劑層之第一面抵接於剝離性表面。此處,上述剝離性表面之水接觸角為100度以上。上述黏著劑層含有玻璃轉移溫度(Tg)未達0℃之聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B。關於上述補強膜,將上述黏著劑層之上述第一面貼合於不鏽鋼板後於80℃下加熱5分鐘後於23℃下放置30分鐘後之黏著力N2為將上述黏著劑層之上述第一面貼合於不鏽鋼板後於23℃下放置30分鐘後之黏著力N1的10倍以上。According to the specification, there is provided a reinforcing film comprising a support substrate having a first surface and a second surface, and an adhesive layer laminated on the first surface of the support substrate. The above-mentioned support substrate includes a resin film as a base film. The second surface of the adhesive layer is fixed on the first surface of the support substrate, and the first surface of the adhesive layer is in contact with the peelable surface. Here, the water contact angle of the peelable surface is 100 degrees or more. The said adhesive layer contains the polymer A whose glass transition temperature (Tg) is less than 0 degreeC, and the polymer B which is a copolymer of the monomer which has a polyorganosiloxane frame|skeleton, and a (meth)acrylic-type monomer. Regarding the above-mentioned reinforcing film, the adhesive force N2 after bonding the above-mentioned first surface of the above-mentioned adhesive layer to a stainless steel plate, heating at 80°C for 5 minutes, and then standing at 23°C for 30 minutes is the above-mentioned first surface of the above-mentioned adhesive layer After one side is pasted on the stainless steel plate, the adhesive force N1 is more than 10 times after being placed at 23°C for 30 minutes.

該構成之補強膜係以黏著力N2(以下亦稱為「加熱後黏著力」)成為黏著力N1(以下亦稱為「初期黏著力」)的10倍以上之方式構成,因此可兼顧利用初期之低黏著性之良好之二次加工性、與利用被黏著體之使用時之對該被黏著體之強黏著性之高補強性能。又,藉由使黏著劑層之第一面(貼附於被黏著體之側之表面,以下亦稱為「黏著面」)抵接於水接觸角100度以上之剝離性表面,可有效地減輕補強膜之保存條件對該補強膜之性能所造成之影響。例如,即便將使用前(即,貼附於被黏著體前)之補強膜保存於高於室溫之溫度區域,保存後之補強膜依然可適當地發揮初期之低黏著性及被黏著體使用時之強黏著性。而且,由於黏著劑層之上述第二面(與黏著面為相反側之表面,以下亦稱為背面)固著於支持基材之第一面,故而不易產生黏著劑層殘留於被黏著體上而支持基材自該黏著劑層剝離之現象(抓固破壞),可有效地維持被黏著體與支持基材之一體性。The reinforcing film of this structure is constructed in such a way that the adhesive force N2 (hereinafter also referred to as "adhesion after heating") becomes 10 times or more than the adhesive force N1 (hereinafter also referred to as "initial adhesive force"), so it can take care of the initial stage of use Good secondary processability with low adhesiveness, and high reinforcement performance with strong adhesion to the adherend when using the adherend. In addition, by making the first surface of the adhesive layer (the surface on the side attached to the adherend, hereinafter also referred to as "adhesive surface") contact the peelable surface with a water contact angle of 100 degrees or more, it can effectively Reduce the influence of the storage conditions of the reinforced membrane on the performance of the reinforced membrane. For example, even if the reinforced film before use (i.e., before being attached to the adherend) is stored in a temperature region higher than room temperature, the reinforced film after storage can still properly exhibit the initial low adhesiveness and the adherend can be used Strong adhesiveness of time. Moreover, since the above-mentioned second surface of the adhesive layer (the surface on the opposite side to the adhesive surface, hereinafter also referred to as the back surface) is fixed to the first surface of the supporting substrate, it is difficult for the adhesive layer to remain on the adherend. The peeling of the support substrate from the adhesive layer (grip failure) can effectively maintain the integrity of the adherend and the support substrate.

再者,以下有時將加熱後黏著力相對於初期黏著力之比、即N2/N1稱為「黏著力上升比」。又,有時將支持基材之第一面、即固著有黏著劑層之面稱為「前表面」,將支持基材之第二面稱為「背面」。又,有時將剝離性表面簡稱為「剝離面」。In addition, hereinafter, the ratio of the adhesive force after heating to the initial adhesive force, that is, N2/N1 may be referred to as "adhesive force increase ratio". In addition, the first surface of the support substrate, that is, the surface on which the adhesive layer is fixed is sometimes referred to as the "front surface", and the second surface of the support substrate is referred to as the "back surface". In addition, the releasable surface may be simply referred to as a "releasable surface".

於此處所揭示之補強膜之若干種態樣中,作為上述剝離性表面,可良好地利用含有矽(Si)之剝離層之表面。根據使黏著面抵接於此種組成之剝離性表面之構成之補強膜,可更良好地抑制因保存於高於室溫之溫度區域所導致之初期黏著力之上升。作為含有矽之剝離層之一典型例,可列舉藉由聚矽氧系剝離處理劑所形成之剝離層。In some aspects of the reinforcing film disclosed here, the surface of the release layer containing silicon (Si) can be favorably utilized as the release surface. According to the reinforcing film having the adhesive surface in contact with the peelable surface of such a composition, it is possible to better suppress the increase of the initial adhesive force caused by storage at a temperature region higher than room temperature. As a typical example of the silicon-containing release layer, a release layer formed with a silicone-based release treatment agent is mentioned.

於此處所揭示之補強膜之其他若干種態樣中,作為上述剝離性表面,可利用藉由長鏈烷基系剝離處理劑所形成之剝離層之表面。於在藉由長鏈烷基系剝離處理劑所形成之水接觸角100度以上之剝離性表面抵接有黏著面之構成之補強膜中,可有效地抑制因保存於高於室溫之溫度區域所導致之初期黏著力之上升。In some other aspects of the reinforcing film disclosed here, the surface of the peeling layer formed with a long-chain alkyl-based peeling treatment agent can be used as the peelable surface. In the reinforced film formed by the long-chain alkyl-based peeling treatment agent, the peelable surface with a water contact angle of 100 degrees or more is in contact with the adhesive surface, which can effectively inhibit the damage caused by storage at a temperature higher than room temperature. The increase in the initial adhesion force caused by the area.

上述支持基材之厚度較佳為30 μm以上。根據於此種厚度之支持基材固著有黏著劑層之構成之補強膜,容易獲得良好之補強效果。The thickness of the above-mentioned support substrate is preferably 30 μm or more. A good reinforcing effect can be easily obtained with a reinforcing film in which an adhesive layer is fixed to a supporting substrate of such thickness.

於此處所揭示之補強膜之若干種態樣中,上述支持基材之厚度可為上述黏著劑層之厚度之1.1倍以上且10倍以下。根據此種構成之補強片材,容易獲得良好之補強效果。In some aspects of the reinforcing film disclosed here, the thickness of the above-mentioned support substrate may be not less than 1.1 times and not more than 10 times the thickness of the above-mentioned adhesive layer. According to the reinforcing sheet having such a constitution, it is easy to obtain a good reinforcing effect.

於若干種態樣中,作為上述聚合物B,可良好地使用重量平均分子量(Mw)為10000以上且50000以下者。根據Mw處於上述範圍之聚合物B,容易實現黏著力上升比較高之補強膜。In some aspects, as said polymer B, what has a weight average molecular weight (Mw) of 10000 or more and 50000 or less can be used favorably. According to the polymer B whose Mw is within the above-mentioned range, it is easy to realize a reinforced film with a relatively high increase in adhesion.

於若干種態樣中,上述黏著劑層中之上述聚合物B之含量可設為相對於100重量份上述聚合物A為0.05重量份以上且20重量份以下之範圍。根據上述範圍之含量,容易實現黏著力上升比較高之補強膜。In some aspects, content of the said polymer B in the said adhesive agent layer can be made into the range of 0.05 weight part or more and 20 weight part or less with respect to 100 weight part of said polymer A. According to the content in the above range, it is easy to realize a reinforced film with a relatively high increase in adhesion.

於此處所揭示之補強膜之若干種態樣中,上述剝離性表面可為剝離襯墊之表面。該態樣之補強膜藉由將上述剝離襯墊自黏著面剝離而使上述黏著面露出,並將該黏著面貼附於被黏著體,可良好地兼顧初期之低黏著性與被黏著體之使用時之強黏著性。In some aspects of the reinforcing film disclosed herein, the releaseable surface may be the surface of a release liner. The reinforcing film of this aspect can make good balance between the initial low adhesiveness and the adherend by peeling the above-mentioned release liner from the adhesive surface to expose the above-mentioned adhesive surface, and attaching the adhesive surface to the adherend. Strong adhesiveness when used.

於此處所揭示之補強膜之其他若干種態樣中,上述剝離性表面亦可為支持基材之第二面(背面)。即,此處所揭示之補強膜可為支持基材之背面成為水接觸角100度以上之剝離性表面,且於該背面抵接有黏著面之態樣。該態樣之補強膜藉由將支持基材之背面自黏著面剝離而使上述黏著面露出,並將該黏著面貼附於被黏著體,可良好地兼顧初期之低黏著性與被黏著體使用時之強黏著性。In several other aspects of the reinforcing film disclosed here, the above-mentioned peelable surface may also be the second surface (back surface) of the supporting substrate. That is, the reinforcing film disclosed here may be a form in which the back surface of the supporting substrate is a detachable surface with a water contact angle of 100 degrees or more, and an adhesive surface is in contact with the back surface. The reinforcement film of this aspect exposes the above-mentioned adhesive surface by peeling the back of the support base material from the adhesive surface, and attaches the adhesive surface to the adherend, so that the initial low adhesiveness and the adherend can be well balanced. Strong adhesiveness when used.

再者,將上述各要素適當組合者亦可包含於藉由本日本專利申請案要求專利保護之發明之範圍內。Furthermore, an appropriate combination of the above-mentioned elements can also be included in the scope of the invention claimed in this Japanese patent application.

以下,對本發明之較佳實施形態進行說明。關於本說明書中特別言及之事項以外且本發明之實施所需要之事項,業者可基於本說明書所記載之關於發明之實施之指示及申請時之技術常識而理解。本發明可基於本說明書所揭示之內容及該領域之技術常識而實施。 再者,於以下之圖式中,有對發揮相同作用之構件、部位標註相同符號進行說明之情況,有省略或簡化重複之說明之情況。又,圖式所記載之實施形態係為了清楚地說明本發明而模式化,未必準確地表示出實際提供之製品之尺寸或比例尺。Hereinafter, preferred embodiments of the present invention will be described. Matters other than those specifically mentioned in this specification and necessary for the implementation of the present invention can be understood by the trader based on the instructions on implementation of the invention described in this specification and the technical knowledge at the time of filing. The present invention can be implemented based on the contents disclosed in this specification and common technical knowledge in this field. In addition, in the following drawings, members and parts that perform the same functions may be described with the same symbols, and overlapping descriptions may be omitted or simplified. In addition, the embodiments described in the drawings are schematic for clearly explaining the present invention, and do not necessarily represent the dimensions or scales of actually provided products accurately.

又,於本說明書中,「丙烯酸系聚合物」係指於聚合物結構中含有源自(甲基)丙烯酸系單體之單體單元之聚合物,典型而言係指以超過50重量%之比率含有源自(甲基)丙烯酸系單體之單體單元之聚合物。又,(甲基)丙烯酸系單體係指於1分子中具有至少一個(甲基)丙烯醯基之單體。此處,「(甲基)丙烯醯基」係包括丙烯醯基及甲基丙烯醯基之含義。因此,此處所謂(甲基)丙烯酸系單體之概念可包含具有丙烯醯基之單體(丙烯酸系單體)與具有甲基丙烯醯基之單體(甲基丙烯酸系單體)之兩者。同樣地,於本說明書中,「(甲基)丙烯酸」係包括丙烯酸及甲基丙烯酸之含義,「(甲基)丙烯酸酯」係包括丙烯酸酯及甲基丙烯酸酯之含義。In addition, in this specification, "acrylic polymer" refers to a polymer containing a monomer unit derived from a (meth)acrylic monomer in the polymer structure, and typically refers to a polymer containing more than 50% by weight Ratio Polymers containing monomer units derived from (meth)acrylic monomers. Moreover, a (meth)acryl-type monomer means the monomer which has at least one (meth)acryl group in 1 molecule. Here, "(meth)acryl" includes both acryl and methacryl. Therefore, the concept of the so-called (meth)acrylic monomers here may include both monomers with acryl groups (acrylic monomers) and monomers with methacryl groups (methacrylic monomers). By. Similarly, in this specification, "(meth)acrylic acid" includes the meaning of acrylic acid and methacrylic acid, and "(meth)acrylate" includes the meaning of acrylate and methacrylate.

<補強膜之構造例> 此處所揭示之補強膜至少包含具有第一面與第二面之支持基材、及積層於上述支持基材之上述第一面之黏著劑層。作為支持基材,使用包含樹脂膜作為基底膜者。以下,有時亦將支持基材簡稱為「基材」。<Structure Example of Reinforcement Film> The reinforcement film disclosed here includes at least a support substrate having a first surface and a second surface, and an adhesive layer laminated on the first surface of the support substrate. As a supporting base material, what contains a resin film as a base film is used. Hereinafter, the supporting substrate may also be simply referred to as "substrate".

將一實施形態之補強膜之構造模式性地示於圖1。該補強膜1係作為附基材之單面黏著片材而構成,該附基材之單面黏著片材具備具有第一面(前表面)10A及第二面(背面)10B之片狀之支持基材10、以及固著於該第一面10A而積層之黏著劑層21。黏著劑層21至少含有下述聚合物A及聚合物B。又,黏著劑層21具有第一面(黏著面)21A及第二面(背面)21B。The structure of the reinforcing film of one embodiment is schematically shown in FIG. 1 . The reinforcing film 1 is constituted as a single-sided adhesive sheet with a base material, and the single-sided adhesive sheet with a base material has a sheet shape having a first surface (front surface) 10A and a second surface (back surface) 10B. The support substrate 10 and the adhesive layer 21 that are fixed on the first surface 10A and laminated. The adhesive layer 21 contains at least a polymer A and a polymer B described below. In addition, the adhesive layer 21 has a first surface (adhesive surface) 21A and a second surface (back surface) 21B.

貼附於被黏著體前之補強膜1係將黏著面21A抵接於水接觸角100度以上之剝離性表面(剝離面)。作為上述剝離面,例如如圖1所示,可利用至少與黏著劑層21對向之側之表面31A成為水接觸角100度以上之剝離面的剝離襯墊31之該剝離面。如此於剝離襯墊31之剝離面31A抵接有黏著面21A之形態的補強膜1亦可作為包含補強膜1與剝離襯墊31之附剝離襯墊之補強膜100之構成要素理解。作為剝離襯墊31,例如可良好地使用藉由在片狀基材(襯墊基材)之單面設置利用剝離處理劑所形成之剝離層而以該單面成為上述剝離面之方式構成者。The reinforcement film 1 attached in front of the adherend is such that the adhesive surface 21A is in contact with a peelable surface (peelable surface) having a water contact angle of 100 degrees or more. As the release surface, for example, as shown in FIG. 1 , the release surface of release liner 31 having at least the surface 31A facing the adhesive layer 21 as a release surface with a water contact angle of 100 degrees or more can be used. The reinforcement film 1 in which the adhesive surface 21A is in contact with the release surface 31A of the release liner 31 can also be understood as a component of the release liner-attached reinforcement film 100 including the reinforcement film 1 and the release liner 31 . As the release liner 31, for example, one configured such that one side of a sheet base (liner base) is provided with a release layer formed with a release treatment agent and becomes the above-mentioned release surface can be preferably used. .

於將補強膜1貼附於被黏著體時,將剝離襯墊31自黏著面21A剝離,並將所露出之黏著面21A壓接於被黏著體。補強膜1係以黏著力上升比成為10以上之方式構成,因此可於貼附於被黏著體之初期發揮良好之二次加工性,且可於黏著力上升後藉由經由黏著劑層21將支持基材10牢固地固定於被黏著體而對該被黏著體予以補強。此處,黏著劑層21之背面21B固著於支持基材10之前表面10A,防止黏著劑層21與支持基材31之界面之剝離(抓固破壞)。藉此,能夠可靠性良好地維持被黏著體與支持基材10之一體性,發揮較高之補強效果。When attaching the reinforcing film 1 to the adherend, the release liner 31 is peeled off from the adhesive surface 21A, and the exposed adhesive surface 21A is pressure-bonded to the adherend. The reinforcement film 1 is constructed so that the adhesion increase ratio becomes 10 or more. Therefore, it can exhibit good secondary workability at the initial stage of attaching to the adherend, and can be attached through the adhesive layer 21 after the adhesion is increased. The support substrate 10 is firmly fixed to the adherend to reinforce the adherend. Here, the back surface 21B of the adhesive layer 21 is fixed to the front surface 10A of the support substrate 10 to prevent peeling (grip failure) of the interface between the adhesive layer 21 and the support substrate 31 . Thereby, the integrity of the adherend and the support base material 10 can be maintained reliably, and a high reinforcing effect can be exhibited.

再者,於圖1所示之補強膜1中,作為供黏著面21A抵接之剝離面,亦可利用支持基材10之第二面(背面)10B。例如可設為藉由將補強膜1進行捲繞而使黏著面21A抵接於支持基材10之背面10B被保護之形態(捲筒形態)、或以於一補強膜1之背面10B抵接下一補強膜1之黏著面21A之方式積層複數片補強膜1之形態等。Moreover, in the reinforcement film 1 shown in FIG. 1, the 2nd surface (back surface) 10B of the support base material 10 can also be utilized as a peeling surface with which the adhesive surface 21A abuts. For example, by winding the reinforcing film 1, the adhesive surface 21A may be in contact with the back surface 10B of the supporting base material 10 to be protected (roll form), or may be in contact with the back surface 10B of the reinforcing film 1. The form of the adhesive surface 21A of the next reinforcing film 1, and the form of laminating a plurality of reinforcing films 1, etc.

將另一實施形態之補強膜之構造模式性地示於圖2。該補強膜2係作為附基材之雙面黏著片材而構成,該附基材之雙面黏著片材具備具有第一面10A及第二面10B之片狀之支持基材10、固著於該第一面10A而積層之黏著劑層(第一黏著劑層)21、以及積層於第二面10B之黏著劑層(第二黏著劑層)22。第一黏著劑層21至少含有下述聚合物A及聚合物B。補強膜2係以第一黏著劑層21之第二面(背面)21B固著於支持基材之第一面,且第一黏著劑層21之表面(第一黏著面)21A之黏著力上升比成為10以上的方式構成。藉此,可兼顧良好之二次加工性與較高之補強效果。補強膜2係將第一黏著劑層21及第二黏著劑層22貼附於被黏著體之不同部位而使用。貼附黏著劑層21、22之部位可為不同構件各者之部位,亦可為單一之構件內之不同部位。又,第二黏著劑層22之組成、或第二黏著劑層22之表面(第二黏著面)22A之黏著力上升比並無特別限定。The structure of the reinforcing film of another embodiment is schematically shown in FIG. 2 . The reinforcing film 2 is constituted as a double-sided adhesive sheet with a base material. The double-sided adhesive sheet with a base material has a sheet-shaped support base material 10 having a first surface 10A and a second surface 10B. An adhesive layer (first adhesive layer) 21 laminated on the first surface 10A, and an adhesive layer (second adhesive layer) 22 laminated on the second surface 10B. The first adhesive layer 21 contains at least a polymer A and a polymer B described below. The reinforcing film 2 is fixed on the first surface of the support substrate with the second surface (back surface) 21B of the first adhesive layer 21, and the adhesive force of the surface (first adhesive surface) 21A of the first adhesive layer 21 increases The ratio becomes 10 or more and is comprised. In this way, both good secondary processability and high reinforcing effect can be taken into account. The reinforcement film 2 is used by attaching the first adhesive layer 21 and the second adhesive layer 22 to different parts of the adherend. The parts where the adhesive layers 21 and 22 are attached may be parts of different members, or may be different parts in a single member. Moreover, the composition of the 2nd adhesive agent layer 22, and the adhesive force raising ratio of the surface (2nd adhesive surface) 22A of the 2nd adhesive agent layer 22 are not specifically limited.

如圖2所示,貼附於被黏著體前之補強膜2可為第一黏著面21A及第二黏著面22A抵接於至少與黏著劑層21、22對向之側分別成為剝離面31A、32A之剝離襯墊31、32而被保護之形態的附剝離襯墊之補強膜200之構成要素。或者,亦可省略剝離襯墊32,使用雙面成為剝離面31A、31B之剝離襯墊31,藉由將其與補強膜2重疊並捲繞成漩渦狀而構成第二黏著面22A抵接於剝離襯墊31之背面31B而被保護之形態(捲筒形態)的附剝離襯墊之補強膜。於任一情形時,剝離面31A、32A中至少抵接於第一黏著面21A之剝離面31A係水接觸角100度以上之剝離面。As shown in FIG. 2 , the reinforcing film 2 attached in front of the adherend can be the first adhesive surface 21A and the second adhesive surface 22A abutting at least on the side opposite to the adhesive layers 21 and 22 to form the peeling surface 31A respectively. The components of the reinforcing film 200 with a release liner in a form protected by the release liners 31 and 32 of . Alternatively, the release liner 32 may also be omitted, and a release liner 31 whose both sides are the release surfaces 31A and 31B may be used, and the second adhesive surface 22A may be abutted by overlapping the reinforcing film 2 and winding it in a spiral shape. A reinforcing film with a release liner in a form (roll form) in which the back surface 31B of the liner 31 is protected. In either case, among the peeling surfaces 31A and 32A, at least the peeling surface 31A abutting against the first adhesive surface 21A is a peeling surface with a water contact angle of 100 degrees or more.

<黏著劑層> 此處所揭示之補強膜於支持基材之第一面上具備黏著劑層,該黏著劑層含有Tg未達0℃之聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B。此種黏著劑層可為由含有聚合物A或其前驅物與聚合物B之黏著劑組合物所形成者。黏著劑組合物之形態並無特別限制,例如可為水分散型、溶劑型、熱熔型、活性能量射線硬化型(例如光硬化型)等各種形態。<Adhesive Layer> The reinforcing film disclosed here has an adhesive layer on the first surface of the support substrate, and the adhesive layer contains a polymer A having a Tg of less than 0° C. and polymer A having a polyorganosiloxane skeleton. Polymer B of a copolymer of a monomer and a (meth)acrylic monomer. Such an adhesive layer may be formed from an adhesive composition containing polymer A or its precursor and polymer B. The form of the adhesive composition is not particularly limited, and may be in various forms such as water dispersion type, solvent type, hot melt type, active energy ray curing type (such as photocuring type), and the like.

(聚合物A) 作為聚合物A,可使用在黏著劑之領域公知之丙烯酸系聚合物、橡膠系聚合物、聚酯系聚合物、胺基甲酸酯系聚合物、聚醚系聚合物、聚矽氧系聚合物、聚醯胺系聚合物、氟系聚合物等於室溫區域顯示出橡膠彈性之各種聚合物之一種或兩種以上。(Polymer A) As the polymer A, acrylic polymers, rubber-based polymers, polyester-based polymers, urethane-based polymers, polyether-based polymers, Polysiloxane-based polymers, polyamide-based polymers, and fluorine-based polymers are one or more of various polymers that exhibit rubber elasticity at room temperature.

聚合物A之Tg典型而言未達0℃,較佳為未達-10℃,更佳為未達-20℃。含有Tg未達0℃之聚合物A之黏著劑顯示出適度之流動性(例如該黏著劑中所含之聚合物鏈之運動性),因此適於實現黏著力上升比較高之補強膜。於若干種態樣中,聚合物A之Tg例如可未達-30℃,可未達-40℃,可未達-50℃,亦可未達-60℃。若聚合物A之Tg變低,則有對被黏著體貼附後之黏著力上升容易化之傾向。聚合物A之Tg之下限並無特別限制。就材料之獲取容易性或黏著劑層之凝聚力提高之觀點而言,通常可良好地採用Tg為-80℃以上之聚合物A。The Tg of the polymer A is typically less than 0°C, preferably less than -10°C, more preferably less than -20°C. The adhesive containing polymer A whose Tg is less than 0° C. shows moderate fluidity (such as the mobility of polymer chains contained in the adhesive), and is therefore suitable for realizing a reinforced film with a relatively high increase in adhesive force. In some aspects, the Tg of the polymer A may be less than -30°C, less than -40°C, less than -50°C, or less than -60°C, for example. When the Tg of the polymer A becomes lower, there is a tendency that the adhesive force after sticking to the adherend is increased easily. The lower limit of Tg of the polymer A is not particularly limited. In general, polymer A having a Tg of -80° C. or higher can be favorably used from the viewpoint of the ease of acquisition of the material and the improvement of the cohesive force of the adhesive layer.

此處,於本說明書中,聚合物之Tg係指文獻或目錄等所記載之標稱值、或基於該聚合物之製備所使用之單體成分之組成根據Fox之式所求出之Tg。Fox之式係指如以下所示,共聚物之Tg與使構成該共聚物之單體各者進行均聚所獲得之均聚物之玻璃轉移溫度Tgi之關係式。 1/Tg=Σ(Wi/Tgi) 於上述Fox之式中,Tg表示共聚物之玻璃轉移溫度(單位:K),Wi表示該共聚物中之單體i之重量分率(重量基準之共聚比率),Tgi表示單體i之均聚物之玻璃轉移溫度(單位:K)。於Tg之特定之對象之聚合物為均聚物之情形時,該均聚物之Tg與對象之聚合物之Tg一致。Here, in this specification, the Tg of a polymer refers to a nominal value described in a document or a catalog, or the Tg obtained by Fox's formula based on the composition of the monomer components used in the preparation of the polymer. The formula of Fox refers to the relationship between the Tg of the copolymer and the glass transition temperature Tgi of the homopolymer obtained by homopolymerizing the monomers constituting the copolymer, as shown below. 1/Tg=Σ(Wi/Tgi) In the above formula of Fox, Tg represents the glass transition temperature (unit: K) of the copolymer, and Wi represents the weight fraction of the monomer i in the copolymer (copolymerization based on weight Ratio), Tgi represents the glass transition temperature (unit: K) of the homopolymer of monomer i. When the target polymer of Tg is a homopolymer, the Tg of the homopolymer coincides with the Tg of the target polymer.

作為用於Tg之算出之均聚物之玻璃轉移溫度,設為使用公知資料所記載之值者。具體而言,可列舉「聚合物手冊(Polymer Handbook)」(第3版,John Wiley & Sons, Inc., 1989年)中之數值。關於上述聚合物手冊中記載有複數種值之單體,採用最高值。As the glass transition temperature of the homopolymer used for the calculation of Tg, a value described in a known data is used. Specifically, the numerical value in "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc., 1989) can be mentioned. For monomers with plural values described in the above-mentioned polymer handbook, the highest value is adopted.

作為上述聚合物手冊中無記載之單體之均聚物之玻璃轉移溫度,設為使用藉由以下之測定方法所獲得之值。 具體而言,於具備溫度計、攪拌機、氮氣導入管及回流冷卻管之反應器中投入單體100重量份、2,2'-偶氮二異丁腈0.2重量份及作為聚合溶劑之乙酸乙酯200重量份,一面使氮氣流通一面攪拌1小時。於以此方式去除聚合系內之氧後,升溫至63℃,並使其反應10小時。繼而,冷卻至室溫,獲得固形物成分濃度33重量%之均聚物溶液。繼而,將該均聚物溶液流延塗佈於剝離襯墊上並進行乾燥而製作厚度約2 mm之試驗樣品(片狀之均聚物)。將該試驗樣品沖切為直徑7.9 mm之圓盤狀並利用平行板夾入,一面使用黏彈性試驗機(TA Instruments Japan公司製造,機種名「ARES」)賦予頻率1 Hz之剪切應變,一面於溫度區域-70℃~150℃以5℃/分鐘之升溫速度藉由剪切模式測定黏彈性,將相當於tanδ之峰頂溫度之溫度設為均聚物之Tg。The glass transition temperature of the homopolymer which is a monomer which is not described in the said polymer handbook shall use the value obtained by the following measuring method. Specifically, 100 parts by weight of monomers, 0.2 parts by weight of 2,2'-azobisisobutyronitrile, and ethyl acetate as a polymerization solvent were put into a reactor equipped with a thermometer, a stirrer, a nitrogen gas introduction pipe, and a reflux cooling pipe. 200 parts by weight, stirring for 1 hour while flowing nitrogen gas. After removing oxygen in the polymerization system in this way, the temperature was raised to 63° C., and the reaction was performed for 10 hours. Then, it cooled to room temperature, and obtained the homopolymer solution of 33 weight% of solid content concentration. Next, this homopolymer solution was cast-coated on a release liner and dried to prepare a test sample (sheet-shaped homopolymer) having a thickness of about 2 mm. The test sample was punched into a disc shape with a diameter of 7.9 mm and clamped by parallel plates. While applying a shear strain at a frequency of 1 Hz using a viscoelasticity testing machine (manufactured by TA Instruments Japan, model name "ARES"), Viscoelasticity was measured in the temperature range -70°C to 150°C with a heating rate of 5°C/min by shear mode, and the temperature corresponding to the peak temperature of tanδ was defined as the Tg of the homopolymer.

聚合物A之重量平均分子量(Mw)通常適宜為約5×104 以上,但並無特別限定。根據該Mw之聚合物A,容易獲得顯示出良好之凝聚性之黏著劑。於若干種態樣中,聚合物A之Mw例如可為10×104 以上,可為20×104 以上,亦可為30×104 以上。又,聚合物A之Mw通常適宜為約500×104 以下。該Mw之聚合物A容易形成顯示出適度之流動性(聚合物鏈之運動性)之黏著劑,因此適於實現黏著力上升比較高之補強膜。The weight-average molecular weight (Mw) of the polymer A is usually preferably about 5×10 4 or more, but it is not particularly limited. According to the polymer A of this Mw, the adhesive agent which shows favorable cohesiveness can be obtained easily. In several aspects, the Mw of the polymer A may be, for example, not less than 10×10 4 , not less than 20×10 4 , or not less than 30×10 4 . In addition, the Mw of the polymer A is usually preferably about 500×10 4 or less. The polymer A of this Mw is easy to form an adhesive exhibiting moderate fluidity (mobility of the polymer chain), and thus is suitable for realizing a reinforced film with a relatively high increase in adhesive force.

再者,於本說明書中,聚合物A及聚合物B之Mw可藉由凝膠滲透層析法(GPC)進行聚苯乙烯換算而求出。更具體而言,可依據下述實施例中所記載之方法及條件而測定Mw。In addition, in this specification, Mw of polymer A and polymer B can be calculated|required by polystyrene conversion by gel permeation chromatography (GPC). More specifically, Mw can be measured according to the methods and conditions described in the following examples.

作為此處所揭示之補強膜中之聚合物A,可良好地採用丙烯酸系聚合物。若使用丙烯酸系聚合物作為聚合物A,則有容易獲得與聚合物B之良好之相容性之傾向。聚合物A與聚合物B之相容性良好可經由提高黏著劑層內之聚合物B之移動性而有助於初期黏著力之降低及加熱後黏著力之提高,因此較佳。As the polymer A in the reinforcing film disclosed here, an acrylic polymer can be suitably used. When an acrylic polymer is used as the polymer A, good compatibility with the polymer B tends to be easily obtained. Good compatibility between polymer A and polymer B can help reduce the initial adhesive force and improve the adhesive force after heating by increasing the mobility of polymer B in the adhesive layer, so it is preferable.

丙烯酸系聚合物例如可為含有50重量%以上之源自(甲基)丙烯酸烷基酯之單體單元之聚合物、即用以製備該丙烯酸系聚合物之單體成分總量中之50重量%以上為(甲基)丙烯酸烷基酯之聚合物。作為(甲基)丙烯酸烷基酯,可良好地使用具有碳數1~20之(即,C1-20 之)直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯。就容易獲得特性之平衡之方面而言,單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為50重量%以上,可為60重量%以上,亦可為70重量%以上。就相同之原因而言,單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為99.9重量%以下,可為98重量%以下,亦可為95重量%以下。於若干種態樣中,單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為90重量%以下,可為85重量%以下,亦可為80重量%以下。The acrylic polymer can be, for example, a polymer containing more than 50% by weight of monomer units derived from alkyl (meth)acrylate, that is, 50% by weight of the total amount of monomer components used to prepare the acrylic polymer. More than % is a polymer of alkyl (meth)acrylate. As the alkyl (meth)acrylate, an alkyl (meth)acrylate having a straight-chain or branched alkyl group having 1 to 20 carbon atoms (that is, C 1-20 ) can be preferably used. In terms of easily obtaining a balance of properties, the ratio of the C 1-20 alkyl (meth)acrylate in the total amount of monomer components may be, for example, 50% by weight or more, 60% by weight or more, or 50% by weight or more. More than 70% by weight. For the same reason, the ratio of C 1-20 alkyl (meth)acrylate in the total amount of monomer components may be, for example, 99.9% by weight or less, 98% by weight or less, or 95% by weight or less . In several aspects, the ratio of the C 1-20 alkyl (meth)acrylate in the total amount of monomer components may be, for example, 90% by weight or less, 85% by weight or less, or 80% by weight or less .

作為(甲基)丙烯酸C1-20 烷基酯之非限定性之具體例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等。As non-limiting specific examples of C 1-20 alkyl (meth)acrylates, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, (meth)acrylate, Base) isopropyl acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, (meth)acrylic acid Pentyl, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylate base) isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate ester, lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, (meth) cetyl acrylate, heptadecyl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, nonadecyl (meth)acrylate, (meth)acrylate base) eicosyl acrylate, etc.

於該等中,較佳為至少使用(甲基)丙烯酸C1-18 烷基酯,更佳為至少使用(甲基)丙烯酸C1-14 烷基酯。於若干種態樣中,丙烯酸系聚合物可含有選自(甲基)丙烯酸C4-12 烷基酯(較佳為丙烯酸C4-10 烷基酯,例如丙烯酸C6-10 烷基酯)中之至少一種作為單體單元。例如較佳為含有丙烯酸正丁酯(BA)及丙烯酸2-乙基己酯(2EHA)之一者或兩者之丙烯酸系聚合物,尤佳為至少含有2EHA之丙烯酸系聚合物。作為可良好地使用之其他(甲基)丙烯酸C1-18 烷基酯之例,可列舉:丙烯酸甲酯、甲基丙烯酸甲酯(MMA)、甲基丙烯酸正丁酯(BMA)、甲基丙烯酸2-乙基己酯(2EHMA)、丙烯酸異硬脂酯(ISTA)等。Among them, it is preferable to use at least C 1-18 alkyl (meth)acrylate, and it is more preferable to use at least C 1-14 alkyl (meth)acrylate. In several aspects, the acrylic polymer may contain a group selected from C 4-12 alkyl (meth)acrylates (preferably C 4-10 alkyl acrylates, such as C 6-10 alkyl acrylates) At least one of them is used as a monomer unit. For example, an acrylic polymer containing one or both of n-butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA) is preferred, and an acrylic polymer containing at least 2EHA is particularly preferred. Examples of other C 1-18 alkyl (meth)acrylates that can be used well include methyl acrylate, methyl methacrylate (MMA), n-butyl methacrylate (BMA), methyl 2-ethylhexyl acrylate (2EHMA), isostearyl acrylate (ISTA), etc.

構成丙烯酸系聚合物之單體單元亦可包含作為主成分之(甲基)丙烯酸烷基酯並且視需要包含能夠與(甲基)丙烯酸烷基酯進行共聚之其他單體(共聚性單體)。作為共聚性單體,可良好地使用具有極性基(例如羧基、羥基、含氮原子之環等)之單體。具有極性基之單體可為了對丙烯酸系聚合物導入交聯點或提高丙烯酸系聚合物之凝聚力而發揮作用。共聚性單體可單獨使用一種或將兩種以上組合而使用。The monomer unit constituting the acrylic polymer may contain alkyl (meth)acrylate as a main component and, if necessary, other monomers (copolymerizable monomers) capable of copolymerizing with alkyl (meth)acrylate . As a copolymerizable monomer, the monomer which has a polar group (for example, a carboxyl group, a hydroxyl group, a ring containing a nitrogen atom, etc.) can be used suitably. The monomer having a polar group functions to introduce crosslinking points into the acrylic polymer or to increase the cohesion of the acrylic polymer. A copolymerizable monomer can be used individually by 1 type or in combination of 2 or more types.

作為共聚性單體之非限定性之具體例,可列舉以下者。 含羧基單體:例如丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸等。 含酸酐基單體:例如順丁烯二酸酐、伊康酸酐。 含羥基單體:例如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等(甲基)丙烯酸羥基烷基酯等。 含有磺酸基或磷酸基之單體:例如苯乙烯磺酸、烯丙基磺酸、乙烯基磺酸鈉、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸、2-羥基乙基丙烯醯基磷酸酯等。 含環氧基單體:例如(甲基)丙烯酸縮水甘油酯或(甲基)丙烯酸-2-乙基縮水甘油醚等含環氧基之丙烯酸酯、烯丙基縮水甘油醚、(甲基)丙烯酸縮水甘油醚等。 含氰基單體:例如丙烯腈、甲基丙烯腈等。 含異氰酸基單體:例如(甲基)丙烯酸2-異氰酸基乙酯等。 含醯胺基單體:例如(甲基)丙烯醯胺;N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二丙基(甲基)丙烯醯胺、N,N-二異丙基(甲基)丙烯醯胺、N,N-二(正丁基)(甲基)丙烯醯胺、N,N-二(第三丁基)(甲基)丙烯醯胺等N,N-二烷基(甲基)丙烯醯胺;N-乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯胺等N-烷基(甲基)丙烯醯胺;N-乙烯基乙醯胺等N-乙烯基羧醯胺類;具有羥基與醯胺基之單體,例如N-(2-羥基乙基)(甲基)丙烯醯胺、N-(2-羥基丙基)(甲基)丙烯醯胺、N-(1-羥基丙基)(甲基)丙烯醯胺、N-(3-羥基丙基)(甲基)丙烯醯胺、N-(2-羥基丁基)(甲基)丙烯醯胺、N-(3-羥基丁基)(甲基)丙烯醯胺、N-(4-羥基丁基)(甲基)丙烯醯胺等N-羥基烷基(甲基)丙烯醯胺;具有烷氧基與醯胺基之單體,例如N-甲氧基甲基(甲基)丙烯醯胺、N-甲氧基乙基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺等N-烷氧基烷基(甲基)丙烯醯胺;此外,N,N-二甲基胺基丙基(甲基)丙烯醯胺、N-(甲基)丙烯醯基𠰌啉等。 具有含氮原子之環之單體:例如N-乙烯基-2-吡咯啶酮、N-甲基乙烯基吡咯啶酮、N-乙烯基吡啶、N-乙烯基哌啶酮、N-乙烯基嘧啶、N-乙烯基哌𠯤、N-乙烯基吡𠯤、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基㗁唑、N-(甲基)丙烯醯基-2-吡咯啶酮、N-(甲基)丙烯醯基哌啶、N-(甲基)丙烯醯基吡咯啶、N-乙烯基𠰌啉、N-乙烯基-3-𠰌啉酮、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁 𠯤-2酮、N-乙烯基-3,5-𠰌啉二酮、N-乙烯基吡唑、N-乙烯基異㗁唑、N-乙烯基噻唑、N-乙烯基異噻唑、N-乙烯基嗒𠯤等(例如N-乙烯基-2-己內醯胺等內醯胺類)。 具有丁二醯亞胺骨架之單體:例如N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基六亞甲基丁二醯亞胺等。 順丁烯二醯亞胺類:例如N-環己基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-月桂基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等。 伊康醯亞胺類:例如N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等。 (甲基)丙烯酸胺基烷基酯類:例如(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二乙基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯。 含烷氧基單體:例如(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸3-甲氧基丙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸丙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸乙氧基丙酯等(甲基)丙烯酸烷氧基烷基酯類;(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚丙二醇酯等(甲基)丙烯酸烷氧基伸烷基二醇酯類。 乙烯酯類:例如乙酸乙烯酯、丙酸乙烯酯等。 乙烯醚類:例如甲基乙烯醚或乙基乙烯醚等乙烯基烷基醚。 芳香族乙烯基化合物:例如苯乙烯、α-甲基苯乙烯、乙烯基甲苯等。 烯烴類:例如乙烯、丁二烯、異戊二烯、異丁烯等。 具有脂環式烴基之(甲基)丙烯酸酯:例如(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉酯、(甲基)丙烯酸二環戊酯等。 具有芳香族烴基之(甲基)丙烯酸酯:例如(甲基)丙烯酸苯酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯等。 此外,(甲基)丙烯酸四氫呋喃甲酯等含雜環之(甲基)丙烯酸酯、氯乙烯或含氟原子之(甲基)丙烯酸酯等含鹵素原子之(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯等含矽原子之(甲基)丙烯酸酯、由萜烯化合物衍生物醇所獲得之(甲基)丙烯酸酯等。The following are mentioned as a non-limiting specific example of a copolymerizable monomer. Carboxyl group-containing monomers: such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, and the like. Anhydride group-containing monomers: such as maleic anhydride and itaconic anhydride. Hydroxyl-containing monomers: such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-Hydroxybutyl (meth)acrylate, 6-Hydroxyhexyl (meth)acrylate, 8-Hydroxyoctyl (meth)acrylate, 10-Hydroxydecyl (meth)acrylate, 12 (meth)acrylate -Hydroxylauryl (meth)acrylate, hydroxyalkyl (meth)acrylate, such as (4-hydroxymethylcyclohexyl) methyl (meth)acrylate, etc. Monomers containing sulfonic acid groups or phosphoric acid groups: such as styrenesulfonic acid, allylsulfonic acid, sodium vinylsulfonate, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (methyl ) acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloxynaphthalenesulfonic acid, 2-hydroxyethylacryloyl phosphate, etc. Epoxy-containing monomers: epoxy-containing acrylates such as glycidyl (meth)acrylate or 2-ethyl glycidyl (meth)acrylate, allyl glycidyl ether, (methyl) Glycidyl acrylate, etc. Cyano-containing monomers: such as acrylonitrile, methacrylonitrile, etc. Isocyanato group-containing monomers: for example, 2-isocyanatoethyl (meth)acrylate and the like. Amino group-containing monomers: e.g. (meth)acrylamide; N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N- Dipropyl(meth)acrylamide, N,N-diisopropyl(meth)acrylamide, N,N-di(n-butyl)(meth)acrylamide, N,N-di (Tertiary butyl)(meth)acrylamide and other N,N-dialkyl(meth)acrylamide; N-ethyl(meth)acrylamide, N-isopropyl(methyl) Acrylamide, N-butyl(meth)acrylamide, N-n-butyl(meth)acrylamide, etc. N-alkyl(meth)acrylamide; N-vinylacetamide, etc. -Vinylcarboxamides; monomers with hydroxyl and amido groups, such as N-(2-hydroxyethyl)(meth)acrylamide, N-(2-hydroxypropyl)(meth)acrylamide Amide, N-(1-hydroxypropyl)(meth)acrylamide, N-(3-hydroxypropyl)(meth)acrylamide, N-(2-hydroxybutyl)(methyl) Acrylamide, N-(3-hydroxybutyl)(meth)acrylamide, N-(4-hydroxybutyl)(meth)acrylamide, etc. N-hydroxyalkyl(meth)acrylamide ; Monomers with alkoxy and amide groups, such as N-methoxymethyl (meth)acrylamide, N-methoxyethyl (meth)acrylamide, N-butoxymethyl N-alkoxyalkyl(meth)acrylamide such as N-alkoxyalkyl(meth)acrylamide; in addition, N,N-dimethylaminopropyl(meth)acrylamide, N-(methyl) ) Acrylyl 𠰌line, etc. Monomers with rings containing nitrogen atoms: such as N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinyl Pyrimidine, N-vinylpyrrole, N-vinylpyrrole, N-vinylpyrrole, N-vinylimidazole, N-vinylpyrazole, N-(meth)acryl-2-pyrrolidone , N-(meth)acrylpiperidine, N-(meth)acrylpyrrolidine, N-vinyl 𠰌line, N-vinyl-3-𠰌linone, N-vinyl-2- Caprolactamin, N-vinyl-1,3-㗁𠯤-2-ketone, N-vinyl-3,5-𠰌linedione, N-vinylpyrazole, N-vinylisoxazole, N - Vinylthiazole, N-vinylisothiazole, N-vinylpyrrole, etc. (for example, lactams such as N-vinyl-2-caprolactam). Monomers with succinimide skeleton: such as N-(meth)acryloxymethylene succinimide, N-(meth)acryl-6-oxyhexamethylene butane diimide, N-(meth)acryloyl-8-oxyhexamethylenesuccinimide, and the like. Maleimides: such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, N-benzene Maleic imide, etc. Iconimides: such as N-methyl iconimide, N-ethyl iconimide, N-butyl iconimide, N-octyl iconimide, N- 2-Ethylhexyl iconimide, N-cyclohexyl iconimide, N-lauryl iconimide, etc. Aminoalkyl (meth)acrylates: such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethacrylate Ethylaminoethyl ester, tert-butylaminoethyl (meth)acrylate. Alkoxy-containing monomers: e.g. 2-methoxyethyl (meth)acrylate, 3-methoxypropyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, (methyl) ) propoxy ethyl acrylate, butoxy ethyl (meth) acrylate, ethoxy propyl (meth) acrylate and other alkoxy alkyl (meth) acrylates; methoxy (meth) acrylate Alkoxyalkylene glycol (meth)acrylates such as ethylene glycol esters, methoxypolypropylene glycol (meth)acrylates, etc. Vinyl esters: such as vinyl acetate, vinyl propionate, etc. Vinyl ethers: vinyl alkyl ethers such as methyl vinyl ether or ethyl vinyl ether. Aromatic vinyl compounds: such as styrene, α-methylstyrene, vinyltoluene, etc. Olefins: such as ethylene, butadiene, isoprene, isobutylene, etc. (Meth)acrylates with alicyclic hydrocarbon groups: e.g. cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, iso(meth)acrylate, dicyclopentyl (meth)acrylate Wait. (Meth)acrylate having an aromatic hydrocarbon group: for example, phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, etc. In addition, (meth)acrylates containing heterocycles such as tetrahydrofurfuryl methyl (meth)acrylate, (meth)acrylates containing halogen atoms such as vinyl chloride or (meth)acrylates containing fluorine atoms, polysiloxane Silicon atom-containing (meth)acrylates such as (meth)acrylates, (meth)acrylates obtained from terpene compound derivative alcohols, etc.

於使用此種共聚性單體之情形時,其使用量並無特別限定,通常適宜設為單體成分總量之0.01重量%以上。就更良好地發揮由共聚性單體之使用所產生之效果之觀點而言,可將共聚性單體之使用量設為單體成分總量之0.1重量%以上,亦可設為1重量%以上。又,共聚性單體之使用量可設為單體成分總量之50重量%以下,較佳為設為40重量%以下。藉此,可防止黏著劑之凝聚力變得過高,提高常溫(25℃)下之黏著感。When such a copolymerizable monomer is used, the usage amount thereof is not particularly limited, but usually it is suitably set at 0.01% by weight or more of the total amount of the monomer components. From the viewpoint of exerting the effect produced by the use of the copolymerizable monomer better, the usage amount of the copolymerizable monomer can be set to 0.1% by weight or more of the total amount of the monomer components, and can also be set to 1% by weight above. Moreover, the usage-amount of a copolymerizable monomer can be made into 50 weight% or less of the monomer component total amount, Preferably it is made into 40 weight% or less. Thereby, the cohesive force of the adhesive can be prevented from becoming too high, and the adhesive feeling at room temperature (25° C.) can be improved.

於若干種態樣中,丙烯酸系聚合物較佳為含有選自由下述通式(M1)所表示之N-乙烯基環狀醯胺及含羥基單體(具有羥基與其他官能基之單體,例如可為具有羥基與醯胺基之單體)所組成之群中之至少一種單體作為單體單元。In several aspects, the acrylic polymer preferably contains N-vinyl cyclic amides and hydroxyl-containing monomers (monomers with hydroxyl and other functional groups) represented by the following general formula (M1) , for example, at least one monomer from the group consisting of a monomer having a hydroxyl group and an amide group) may be used as a monomer unit.

[化1]

Figure 02_image001
此處,上述通式(M1)中之R1 為二價有機基。[chemical 1]
Figure 02_image001
Here, R 1 in the above general formula (M1) is a divalent organic group.

藉由使用N-乙烯基環狀醯胺,可調整黏著劑之凝聚力或極性,提高加熱後黏著力。作為N-乙烯基環狀醯胺之具體例,可列舉:N-乙烯基-2-吡咯啶酮、N-乙烯基-2-哌啶酮、N-乙烯基-3-𠰌啉酮、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁 𠯤-2酮、N-乙烯基-3,5-𠰌啉二酮等。尤佳為N-乙烯基-2-吡咯啶酮、N-乙烯基-2-己內醯胺。By using N-vinyl cyclic amide, the cohesion or polarity of the adhesive can be adjusted, and the adhesive force after heating can be improved. Specific examples of N-vinyl cyclic amides include: N-vinyl-2-pyrrolidone, N-vinyl-2-piperidone, N-vinyl-3-alphalinone, N -Vinyl-2-caprolactam, N-vinyl-1,3-methan-2-ketone, N-vinyl-3,5-methanolactone, etc. Especially preferred are N-vinyl-2-pyrrolidone and N-vinyl-2-caprolactam.

N-乙烯基環狀醯胺之使用量並無特別限制,通常適宜設為用以製備丙烯酸系聚合物之單體成分總量之0.01重量%以上(較佳為0.1重量%以上、例如0.5重量%以上)。於若干種態樣中,N-乙烯基環狀醯胺之使用量可設為上述單體成分總量之1重量%以上,可設為5重量%以上,亦可設為10重量%以上。又,就提高常溫(25℃)下之黏著感或提高低溫下之柔軟性之觀點而言,N-乙烯基環狀醯胺之使用量通常適宜設為上述單體成分總量之40重量%以下,可設為30重量%以下,亦可設為20重量%以下。The usage amount of N-vinyl cyclic amide is not particularly limited, and it is generally suitably set at 0.01% by weight or more (preferably 0.1% by weight or more, such as 0.5% by weight) of the total amount of monomer components used to prepare acrylic polymers. %above). In several aspects, the amount of N-vinyl cyclic amide used may be 1% by weight or more, 5% by weight or more, or 10% by weight or more of the total amount of the above-mentioned monomer components. In addition, from the viewpoint of improving the stickiness at normal temperature (25°C) or improving the flexibility at low temperature, the amount of N-vinyl cyclic amide used is usually suitably set at 40% by weight of the total amount of the above-mentioned monomer components. Below, it may be 30 weight% or less, and may be 20 weight% or less.

藉由使用含羥基單體,可調整黏著劑之凝聚力或極性,提高加熱後黏著力。又,含羥基單體係提供與下述交聯劑(例如異氰酸酯系交聯劑)之反應點,可藉由交聯反應而提高黏著劑之凝聚力。By using hydroxyl-containing monomers, the cohesion or polarity of the adhesive can be adjusted, and the adhesive force after heating can be improved. In addition, the hydroxyl-containing monomer system provides a reaction point with the following crosslinking agent (such as isocyanate crosslinking agent), and the cohesion of the adhesive can be improved through the crosslinking reaction.

作為含羥基單體,可良好地使用(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、N-(2-羥基乙基)(甲基)丙烯醯胺等。其中,作為較佳例,可列舉丙烯酸2-羥基乙酯(HEA)、丙烯酸4-羥基丁酯(4HBA)、N-(2-羥基乙基)丙烯醯胺(HEAA)。As the hydroxyl group-containing monomer, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, N-(2-hydroxyethyl base) (meth)acrylamide, etc. Among them, 2-hydroxyethyl acrylate (HEA), 4-hydroxybutyl acrylate (4HBA), and N-(2-hydroxyethyl)acrylamide (HEAA) are mentioned as preferable examples.

含羥基單體之使用量並無特別限制,通常適宜設為用以製備丙烯酸系聚合物之單體成分總量之0.01重量%以上(較佳為0.1重量%以上、例如0.5重量%以上)。於若干種態樣中,含羥基單體之使用量可設為上述單體成分總量之1重量%以上,可設為5重量%以上,亦可設為10重量%以上。又,就提高常溫(25℃)下之黏著感或提高低溫下之柔軟性之觀點而言,含羥基單體之使用量通常適宜設為上述單體成分總量之40重量%以下,可設為30重量%以下,可設為20重量%以下,亦可設為10重量%以下或5重量%以下。The usage amount of the hydroxyl group-containing monomer is not particularly limited, and it is generally suitably set at 0.01% by weight or more (preferably 0.1% by weight or more, such as 0.5% by weight or more) of the total amount of monomer components used to prepare the acrylic polymer. In several aspects, the usage-amount of a hydroxyl-containing monomer can be 1 weight% or more, 5 weight% or more, or 10 weight% or more of the total amount of the said monomer component. In addition, from the viewpoint of improving the stickiness at normal temperature (25° C.) or improving the flexibility at low temperature, the usage amount of the hydroxyl group-containing monomer is usually preferably 40% by weight or less of the total amount of the above-mentioned monomer components. 30% by weight or less, may be 20% by weight or less, may be 10% by weight or less, or 5% by weight or less.

於若干種態樣中,作為共聚性單體,可將N-乙烯基環狀醯胺與含羥基單體併用。於此情形時,N-乙烯基環狀醯胺與含羥基單體之合計量例如可設為用以製備丙烯酸系聚合物之單體成分總量之0.1重量%以上,可設為1重量%以上,可設為5重量%以上,可設為10重量%以上,可設為15重量%以上,可設為20重量%以上,亦可設為25重量%以上。又,N-乙烯基環狀醯胺與含羥基單體之合計量例如可設為單體成分總量之50重量%以下,較佳為設為40重量%以下。In several aspects, N-vinyl cyclic amide and a hydroxyl group-containing monomer can be used together as a copolymerizable monomer. In this case, the total amount of the N-vinyl cyclic amide and the hydroxyl-containing monomer can be, for example, 0.1% by weight or more, or 1% by weight, of the total amount of monomer components used to prepare the acrylic polymer. The above may be 5% by weight or more, may be 10% by weight or more, may be 15% by weight or more, may be 20% by weight or more, and may be 25% by weight or more. In addition, the total amount of N-vinyl cyclic amide and hydroxyl group-containing monomer may be, for example, 50% by weight or less, preferably 40% by weight or less, of the total amount of monomer components.

獲得丙烯酸系聚合物之方法並無特別限定,可適當採用溶液聚合法、乳化聚合法、塊體聚合法、懸濁聚合法、光聚合法等作為丙烯酸系聚合物之合成方法已知之各種聚合方法。於若干種態樣中,可良好地採用溶液聚合法。進行溶液聚合時之聚合溫度可根據所使用之單體及溶劑之種類、聚合起始劑之種類等而適當選擇,例如可設為20℃~170℃左右(典型為40℃~140℃左右)。The method for obtaining the acrylic polymer is not particularly limited, and various polymerization methods known as acrylic polymer synthesis methods, such as solution polymerization, emulsion polymerization, block polymerization, suspension polymerization, and photopolymerization, can be suitably used. . In several aspects, solution polymerization can be advantageously employed. The polymerization temperature during solution polymerization can be appropriately selected according to the type of monomers and solvents used, the type of polymerization initiator, etc., for example, it can be set at about 20°C to 170°C (typically about 40°C to 140°C) .

用於聚合之起始劑可根據聚合方法而自先前公知之熱聚合起始劑或光聚合起始劑等中適當選擇。聚合起始劑可單獨使用一種或將兩種以上組合而使用。The initiator used for the polymerization can be appropriately selected from previously known thermal polymerization initiators, photopolymerization initiators, and the like according to the polymerization method. A polymerization initiator can be used individually by 1 type or in combination of 2 or more types.

作為熱聚合起始劑,例如可列舉:偶氮系聚合起始劑(例如2,2'-偶氮二異丁腈、2,2'-偶氮雙-2-甲基丁腈、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸、偶氮二異戊腈、2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽、2,2'-偶氮雙[2-(5-甲基-2-咪唑啉-2-基)丙烷]二鹽酸鹽、2,2'-偶氮雙(2-甲基丙脒)二硫酸鹽、2,2'-偶氮雙(N,N'-二亞甲基異丁基脒)二鹽酸鹽等);過硫酸鉀等過硫酸鹽;過氧化物系聚合起始劑(例如過氧化二苯甲醯、過氧化順丁烯二酸第三丁酯、過氧化月桂醯等);氧化還原系聚合起始劑等。於若干種態樣中,可良好地採用偶氮系聚合起始劑。 熱聚合起始劑之使用量並無特別限制,例如相對於丙烯酸系聚合物之製備所使用之單體成分100重量份,可設為0.01重量份~5重量份、較佳為0.05重量份~3重量份之範圍內之量。Examples of thermal polymerization initiators include: azo-based polymerization initiators (such as 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, 2, 2'-Azobis(2-methylpropionate) dimethyl ester, 4,4'-azobis-4-cyanopentanoic acid, azobisisovaleronitrile, 2,2'-azobis( 2-amidinopropane) dihydrochloride, 2,2'-azobis[2-(5-methyl-2-imidazolin-2-yl)propane] dihydrochloride, 2,2'- Nitrobis(2-methylpropionamidine) disulfate, 2,2'-azobis(N,N'-dimethyleneisobutylamidine) dihydrochloride, etc.); potassium persulfate and other persulfates Salts; peroxide-based polymerization initiators (such as dibenzoyl peroxide, tert-butyl peroxymaleate, lauryl peroxide, etc.); redox-based polymerization initiators, etc. In several aspects, an azo-type polymerization initiator can be favorably used. The amount of the thermal polymerization initiator used is not particularly limited, for example, it can be set at 0.01 to 5 parts by weight, preferably 0.05 to The amount within the range of 3 parts by weight.

作為光聚合起始劑,並無特別限制,例如可使用安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯氯系光聚合起始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、苯偶醯系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、9-氧硫𠮿

Figure 107119768-xxxx-3
系光聚合起始劑、醯基氧化膦系光聚合起始劑等。光聚合起始劑之使用量並無特別限制,例如相對於丙烯酸系聚合物之製備所使用之單體成分100重量份,可設為0.01重量份~5重量份、較佳為0.05重量份~3重量份之範圍內之量。The photopolymerization initiator is not particularly limited, and for example, benzoin ether-based photopolymerization initiators, acetophenone-based photopolymerization initiators, α-ketol-based photopolymerization initiators, aromatic sulfonyl chlorides, Photopolymerization initiator, photoactive oxime photopolymerization initiator, benzoin photopolymerization initiator, benzoyl photopolymerization initiator, benzophenone photopolymerization initiator, ketal photopolymerization initiator Polymerization initiator, 9-oxosulfur
Figure 107119768-xxxx-3
A photopolymerization initiator, acyl phosphine oxide photopolymerization initiator, etc. The amount of the photopolymerization initiator used is not particularly limited. For example, it can be set at 0.01 to 5 parts by weight, preferably 0.05 to 5 parts by weight relative to 100 parts by weight of the monomer components used in the preparation of the acrylic polymer. The amount within the range of 3 parts by weight.

於若干種態樣中,丙烯酸系聚合物可以對在如上所述之單體成分中調配聚合起始劑所得之混合物照射紫外線(UV)而使該單體成分之一部分聚合之部分聚合物(丙烯酸系聚合物漿液)之形態含有於用以形成黏著劑層之黏著劑組合物中。可將含有該丙烯酸系聚合物漿液之黏著劑組合物塗佈於特定之被塗佈體,照射紫外線而使聚合完成。即,上述丙烯酸系聚合物漿液可作為丙烯酸系聚合物之前驅物理解。此處所揭示之黏著劑層例如可使用含有上述丙烯酸系聚合物漿液與聚合物B之黏著劑組合物而形成。In several aspects, the acrylic polymer can be a partial polymer (acrylic acid) that is obtained by irradiating ultraviolet rays (UV) to a mixture obtained by preparing a polymerization initiator in the above-mentioned monomer components to polymerize a part of the monomer components. It is contained in the adhesive composition for forming the adhesive layer in the form of polymer slurry). The adhesive composition containing the acrylic polymer slurry can be applied to a specific object to be coated, and can be irradiated with ultraviolet rays to complete polymerization. That is, the above-mentioned acrylic polymer syrup can be understood as a precursor of an acrylic polymer. The adhesive layer disclosed here can be formed using the adhesive composition containing the above-mentioned acrylic polymer slurry and the polymer B, for example.

(聚合物B) 此處所揭示之技術中之聚合物B係具有聚有機矽氧烷骨架之單體(以下亦稱為「單體S1」)與(甲基)丙烯酸系單體之共聚物。聚合物B藉由源自單體S1之聚有機矽氧烷結構之低極性及運動性,可作為有助於抑制初期黏著力且提高黏著力上升比之黏著力上升延遲劑發揮功能。作為單體S1,並無特別限定,可使用含有聚有機矽氧烷骨架之任意單體。單體S1藉由源自其結構之低極性,於使用前(貼附於被黏著體前)之補強膜中促進聚合物B於黏著劑層表面之偏集存在,表現出貼合初期之輕剝離性(低黏著性)。作為單體S1,可良好地使用於單末端具有聚合性反應基之結構者(即,單末端反應性者)。藉由此種單體S1與(甲基)丙烯酸系單體之共聚,形成於側鏈具有聚有機矽氧烷骨架之聚合物B。該結構之聚合物B藉由側鏈之運動性及移動容易性,而容易成為初期黏著力較低且黏著力上升比較高者。此處所揭示之技術可以所使用之單體S1之大部分(例如70重量%以上、85重量%以上或95重量%以上)為單末端反應性之態樣良好地實施。亦可單體S1之實質上全部(例如98~100重量%)均為單末端反應性。(Polymer B) Polymer B in the technology disclosed here is a copolymer of a monomer having a polyorganosiloxane skeleton (hereinafter also referred to as "monomer S1") and a (meth)acrylic monomer. The low polarity and mobility of the polyorganosiloxane structure derived from the monomer S1 of the polymer B can function as an adhesion increase retarder that helps to suppress the initial adhesion force and increase the increase ratio of the adhesion force. The monomer S1 is not particularly limited, and any monomer having a polyorganosiloxane skeleton can be used. Monomer S1 promotes the segregated presence of polymer B on the surface of the adhesive layer in the reinforcing film before use (before it is attached to the adherend) due to the low polarity derived from its structure, showing the lightness at the initial stage of lamination. Peelability (low adhesion). As the monomer S1, those having a structure having a polymerizable reactive group at one end (that is, one with single-end reactivity) can be favorably used. By copolymerizing such a monomer S1 and a (meth)acrylic monomer, a polymer B having a polyorganosiloxane skeleton in a side chain is formed. Polymer B with this structure tends to have a relatively low initial adhesive force and a relatively high increase in adhesive force due to the mobility and ease of movement of the side chains. The technique disclosed here can be well implemented in a state in which most of the monomer S1 used (for example, 70% by weight or more, 85% by weight or more, or 95% by weight or more) is single-terminal reactive. Substantially all (for example, 98 to 100% by weight) of the monomer S1 may be single-terminal reactive.

作為單體S1,例如可使用下述通式(1)或(2)所表示之化合物。更具體而言,作為信越化學工業股份有限公司製造之單末端反應性聚矽氧油,可列舉X-22-174ASX、X-22-2426、X-22-2475、KF-2012等。單體S1可單獨使用一種或將兩種以上組合而使用。 [化2]

Figure 02_image003
[化3]
Figure 02_image005
此處,上述通式(1)、(2)中之R3 為氫或甲基,R4 為甲基或一價有機基,m及n為0以上之整數。As the monomer S1, for example, a compound represented by the following general formula (1) or (2) can be used. More specifically, X-22-174ASX, X-22-2426, X-22-2475, KF-2012 and the like are exemplified as single-end reactive silicone oils manufactured by Shin-Etsu Chemical Co., Ltd. Monomer S1 can be used individually by 1 type or in combination of 2 or more types. [Chem 2]
Figure 02_image003
[Chem 3]
Figure 02_image005
Here, R 3 in the above general formulas (1) and (2) is hydrogen or methyl, R 4 is methyl or a monovalent organic group, and m and n are integers of 0 or more.

單體S1之官能基當量例如較佳為700 g/mol以上且未達15000 g/mol,更佳為800 g/mol以上且未達10000 g/mol,進而較佳為850 g/mol以上且未達6000 g/mol,尤佳為1500 g/mol以上且未達5000 g/mol。若單體S1之官能基當量未達700 g/mol,則可能有無法充分地抑制初期黏著力之情況。若單體S1之官能基當量為15000 g/mol以上,則可能有黏著力之上升變得不充分之情況。若單體S1之官能基當量為上述範圍內,則容易將黏著劑層內之相容性(例如與聚合物A之相容性)或移動性調節於適度之範圍內,容易實現以高水準兼具初期之低黏著性與被黏著體使用時之強黏著性之補強膜。The functional group equivalent weight of monomer S1 is, for example, preferably 700 g/mol or more and less than 15000 g/mol, more preferably 800 g/mol or more and less than 10000 g/mol, and more preferably 850 g/mol or more and It is less than 6000 g/mol, preferably more than 1500 g/mol and less than 5000 g/mol. If the functional group equivalent of the monomer S1 is less than 700 g/mol, it may not be possible to sufficiently suppress the initial adhesive force. When the functional group equivalent of monomer S1 is 15000 g/mol or more, the increase of adhesive force may become insufficient. If the functional group equivalent of monomer S1 is within the above range, it is easy to adjust the compatibility (such as compatibility with polymer A) or mobility in the adhesive layer within an appropriate range, and it is easy to achieve high-level Reinforcing film with both initial low adhesiveness and strong adhesiveness when the adherend is in use.

此處,「官能基當量」係指鍵結於每1個官能基之主骨架(例如聚二甲基矽氧烷)之重量。關於標記單位g/mol,係換算成官能基1 mol。單體S1之官能基當量例如可根據基於核磁共振(NMR)之1 H-NMR(質子NMR)之光譜強度而算出。基於1 H-NMR之光譜強度之單體S1之官能基當量(g/mol)之算出可基於有關1 H-NMR光譜解析之一般結構解析方法,視需要參照日本專利第5951153號公報之記載而進行。Here, the "functional group equivalent" means the weight of the main skeleton (for example, polydimethylsiloxane) bonded to one functional group. Regarding the marking unit g/mol, it is converted into 1 mol of functional group. The functional group equivalent of the monomer S1 can be calculated from the spectral intensity of 1 H-NMR (proton NMR) based on nuclear magnetic resonance (NMR), for example. The calculation of the functional group equivalent (g/mol) of the monomer S1 based on the spectral intensity of 1 H-NMR can be based on a general structure analysis method related to 1 H-NMR spectral analysis, referring to the records of Japanese Patent No. 5951153 as necessary. conduct.

再者,於使用官能基當量不同之兩種以上之單體作為單體S1之情形時,作為單體S1之官能基當量,可使用算術平均值。即,包含官能基當量不同之n種單體(單體S11 、單體S12 ・・・單體S1n )的單體S1之官能基當量可藉由下述式進行計算。 單體S1之官能基當量(g/mol)=(單體S11 之官能基當量×單體S11 之調配量+單體S12 之官能基當量×單體S12 之調配量+・・・+單體S1n 之官能基當量×單體S1n 之調配量)/(單體S11 之調配量+單體S12 之調配量+・・・+單體S1n 之調配量)In addition, when using two or more monomers with different functional group equivalents as monomer S1, an arithmetic mean value can be used as the functional group equivalent of monomer S1. That is, the functional group equivalent of monomer S1 including n kinds of monomers (monomer S1 1 , monomer S1 2 ... monomer S1 n ) having different functional group equivalents can be calculated by the following formula. Functional group equivalent of monomer S1 (g/mol) = (functional group equivalent of monomer S1 1 × compounding amount of monomer S1 1 + functional group equivalent of monomer S1 2 × compounding amount of monomer S1 2 +・・・+The functional group equivalent of the monomer S1 n ×the compounding amount of the monomer S1 n )/(the compounding amount of the monomer S1 1 + the compounding amount of the monomer S1 2+・・・+the compounding amount of the monomer S1 n )

單體S1之含量相對於用以製備聚合物B之全部單體成分,例如可為5重量%以上,就更良好地發揮作為黏著力上升延遲劑之效果之觀點而言,較佳為設為10重量%以上,可設為15重量%以上,亦可設為20重量%以上。又,單體S1之含量就聚合反應性或相容性之觀點而言,相對於用以製備聚合物B之全部單體成分,適宜設為60重量%以下,可設為50重量%以下,可設為40重量%以下,亦可設為30重量%以下。若單體S1之含量少於5重量%,則可能有無法充分地抑制初期黏著力之情況。若單體S1之含量多於60重量%,則可能有黏著力之上升變得不充分之情況。The content of the monomer S1 can be, for example, 5% by weight or more with respect to all the monomer components used to prepare the polymer B, and it is preferably set to 10% by weight or more, may be 15% by weight or more, or may be 20% by weight or more. In addition, the content of the monomer S1 is preferably 60% by weight or less, and may be 50% by weight or less, based on the total monomer components used to prepare the polymer B from the viewpoint of polymerization reactivity or compatibility. It may be 40 weight% or less, and may be 30 weight% or less. When content of monomer S1 is less than 5 weight%, initial stage adhesive force may not be fully suppressed. When the content of the monomer S1 is more than 60% by weight, the increase of the adhesive force may become insufficient.

聚合物B之製備所使用之單體成分除了含有單體S1以外,亦含有能夠與單體S1進行共聚之(甲基)丙烯酸系單體。藉由使一種或兩種以上之(甲基)丙烯酸系單體與單體S1進行共聚,可良好地調節黏著劑層內之聚合物B之移動性。使單體S1與(甲基)丙烯酸系單體進行共聚亦可有助於改善聚合物B與聚合物A(例如丙烯酸系聚合物)之相容性。The monomer component used in the preparation of the polymer B contains not only the monomer S1, but also a (meth)acrylic monomer that can be copolymerized with the monomer S1. By copolymerizing one or two or more (meth)acrylic monomers with the monomer S1, the mobility of the polymer B in the adhesive layer can be well adjusted. Copolymerizing the monomer S1 with the (meth)acrylic monomer can also help to improve the compatibility of the polymer B and the polymer A (such as an acrylic polymer).

作為(甲基)丙烯酸系單體,例如可列舉(甲基)丙烯酸烷基酯。例如作為於聚合物A為丙烯酸系聚合物之情形時可使用之(甲基)丙烯酸烷基酯,可使用上述所例示之單體之一種或兩種以上作為聚合物B之共聚成分。於若干種態樣中,聚合物B可含有(甲基)丙烯酸C4-12 烷基酯(較佳為(甲基)丙烯酸C4-10 烷基酯,例如(甲基)丙烯酸C6-10 烷基酯)之至少一種作為單體單元。於其他若干種態樣中,聚合物B可含有甲基丙烯酸C1-18 烷基酯(較佳為甲基丙烯酸C1-14 烷基酯,例如甲基丙烯酸C1-10 烷基酯)之至少一種作為單體單元。構成聚合物B之單體單元例如可含有選自MMA、BMA及2EHMA中之一種或兩種以上。As a (meth)acrylic-type monomer, an alkyl (meth)acrylate is mentioned, for example. For example, as an alkyl (meth)acrylate that can be used when the polymer A is an acrylic polymer, one or two or more of the monomers exemplified above can be used as a copolymerization component of the polymer B. In several aspects, polymer B may contain a C 4-12 alkyl (meth)acrylate (preferably a C 4-10 alkyl (meth)acrylate, such as a C 6- 10 alkyl esters) as a monomer unit. In several other aspects, polymer B may contain a C 1-18 alkyl methacrylate (preferably a C 1-14 alkyl methacrylate, such as a C 1-10 alkyl methacrylate) At least one of them is used as a monomer unit. The monomer unit constituting polymer B may contain, for example, one or two or more selected from MMA, BMA, and 2EHMA.

作為上述(甲基)丙烯酸系單體之其他例,可列舉具有脂環式烴基之(甲基)丙烯酸酯。例如可使用(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸1-金剛烷基酯等。於若干種態樣中,聚合物B可含有選自甲基丙烯酸二環戊酯、甲基丙烯酸異𦯉酯及甲基丙烯酸環己酯中之至少一種作為單體單元。As another example of the said (meth)acryl-type monomer, the (meth)acrylate which has an alicyclic hydrocarbon group is mentioned. For example, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, iso(meth)acrylate, dicyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, Esters etc. In several aspects, the polymer B may contain at least one selected from dicyclopentanyl methacrylate, isomethacrylate, and cyclohexyl methacrylate as a monomer unit.

上述(甲基)丙烯酸烷基酯及上述具有脂環式烴基之(甲基)丙烯酸酯之使用量相對於用以製備聚合物B之全部單體成分,例如可為10重量%以上且95重量%以下,可為20重量%以上且95重量%以下,可為30重量%以上且90重量%以下,可為40重量%以上且90重量%以下,亦可為50重量%以上且85重量%以下。就藉由加熱所引起之黏著力之上升容易性之觀點而言,使用(甲基)丙烯酸烷基酯可能變得有利。於若干種態樣中,具有脂環式烴基之(甲基)丙烯酸酯之使用量例如可未達用以製備聚合物B之單體成分中所含之(甲基)丙烯酸系單體之合計量之50重量%,可未達30重量%,可未達15重量%,可未達10重量%,亦可未達5重量%。亦可不使用具有脂環式烴基之(甲基)丙烯酸酯。The amount of the above-mentioned alkyl (meth)acrylate and the above-mentioned (meth)acrylate having an alicyclic hydrocarbon group can be, for example, 10% by weight or more and 95% by weight relative to the total monomer components used to prepare the polymer B. % or less, 20% by weight to 95% by weight, 30% by weight to 90% by weight, 40% by weight to 90% by weight, or 50% by weight to 85% by weight the following. From the viewpoint of easiness of raising the adhesive force by heating, it may become advantageous to use an alkyl (meth)acrylate. In several aspects, the amount of (meth)acrylate having an alicyclic hydrocarbon group may not reach the total amount of (meth)acrylic monomers contained in the monomer components used to prepare polymer B, for example. The amount of 50% by weight may be less than 30% by weight, less than 15% by weight, less than 10% by weight, or less than 5% by weight. A (meth)acrylate having an alicyclic hydrocarbon group may not be used.

作為構成聚合物B之單體單元中可與單體S1一起含有之單體之其他例,可列舉:作為於聚合物A為丙烯酸系聚合物之情形時可使用之單體之上述所例示之含羧基單體、含酸酐基單體、含羥基單體、含環氧基單體、含氰基單體、含異氰酸酯基單體、含醯胺基單體、具有含氮原子之環之單體、具有丁二醯亞胺骨架之單體、順丁烯二醯亞胺類、伊康醯亞胺類、(甲基)丙烯酸胺基烷基酯類、乙烯酯類、乙烯醚類、烯烴類、具有芳香族烴基之(甲基)丙烯酸酯、含有雜環之(甲基)丙烯酸酯、含有鹵素原子之(甲基)丙烯酸酯、由萜烯化合物衍生物醇所獲得之(甲基)丙烯酸酯等。As other examples of the monomer that can be contained together with the monomer S1 in the monomer unit constituting the polymer B, the above-mentioned exemplified monomers that can be used when the polymer A is an acrylic polymer can be mentioned. Carboxyl-containing monomers, acid anhydride-containing monomers, hydroxyl-containing monomers, epoxy-containing monomers, cyano-containing monomers, isocyanate-containing monomers, amide-containing monomers, monomers with rings containing nitrogen atoms Monomers, monomers having a succinimide skeleton, maleimides, itaconimides, (meth)aminoalkyl acrylates, vinyl esters, vinyl ethers, olefins (meth)acrylates with aromatic hydrocarbon groups, (meth)acrylates containing heterocycles, (meth)acrylates containing halogen atoms, (meth)acrylates obtained from terpene compound derivative alcohols Acrylic etc.

作為構成聚合物B之單體單元中可與單體S1一起含有之單體之進而其他例,可列舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯等氧伸烷基二(甲基)丙烯酸酯;具有聚氧伸烷基骨架之單體,例如於聚乙二醇或聚丙二醇等聚氧伸烷基鏈之一末端具有(甲基)丙烯醯基、乙烯基、烯丙基等聚合性官能基,於另一末端具有醚結構(烷基醚、芳醚、芳基烷基醚等)之聚合性聚氧伸烷基醚;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸乙氧基丙酯等(甲基)丙烯酸烷氧基烷基酯;(甲基)丙烯酸鹼金屬鹽等鹽;三羥甲基丙烷三(甲基)丙烯酸酯等多元(甲基)丙烯酸酯:偏二氯乙烯、(甲基)丙烯酸-2-氯乙酯等鹵化乙烯化合物;2-乙烯基-2-㗁唑啉、2-乙烯基-5-甲基-2-㗁唑啉、2-異丙烯基-2-㗁唑啉等含㗁唑啉基之單體;(甲基)丙烯醯基氮丙啶、(甲基)丙烯酸-2-氮丙啶基乙酯等含氮丙啶基之單體;(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、內酯類與(甲基)丙烯酸-2-羥基乙酯之加成物等含羥基之乙烯基單體;氟取代(甲基)丙烯酸烷基酯等含氟乙烯基單體;2-氯乙基乙烯醚、單氯乙酸乙烯酯等含有反應性鹵素之乙烯基單體;如乙烯基三甲氧基矽烷、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、烯丙基三甲氧基矽烷、三甲氧基矽烷基丙基烯丙胺、2-甲氧基乙氧基三甲氧基矽烷之含有有機矽之乙烯基單體;此外,可列舉:於使乙烯基聚合之單體末端具有自由基聚合性乙烯基之巨單體類等。該等可使單獨一種或加以組合而與單體S1共聚。Still other examples of the monomer that can be contained together with the monomer S1 in the monomer units constituting the polymer B include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate , triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate ) acrylate and other oxyalkylene di(meth)acrylates; monomers with a polyoxyalkylene skeleton, such as (methyl) at one end of a polyoxyalkylene chain such as polyethylene glycol or polypropylene glycol ) a polymerizable functional group such as acryl group, vinyl group, allyl group, etc., and a polymerizable polyoxyalkylene ether having an ether structure (alkyl ether, aryl ether, aryl alkyl ether, etc.) at the other end; ( Methoxyethyl methacrylate, Ethoxyethyl (meth)acrylate, Propoxyethyl (meth)acrylate, Butoxyethyl (meth)acrylate, Ethoxy(meth)acrylate Alkoxyalkyl (meth)acrylate such as propyl ester; salt such as alkali metal (meth)acrylate; poly(meth)acrylate such as trimethylolpropane tri(meth)acrylate: partial di Vinyl chloride, 2-chloroethyl (meth)acrylate and other halogenated vinyl compounds; 2-vinyl-2-oxazoline, 2-vinyl-5-methyl-2-oxazoline, 2-isopropene Monomers containing oxazoline groups such as 2-oxazoline; monomers containing aziridine groups such as (meth)acryl aziridine, (meth)acrylic acid-2-aziridinyl ethyl ester, etc. 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, adducts of lactones and 2-hydroxyethyl (meth)acrylate, etc. fluorine-substituted alkyl (meth)acrylate and other fluorine-containing vinyl monomers; 2-chloroethyl vinyl ether, vinyl monochloroacetate and other vinyl monomers containing reactive halogens; such as vinyl trimethyl Oxysilane, γ-(Meth)acryloxypropyltrimethoxysilane, Allyltrimethoxysilane, Trimethoxysilylpropylallylamine, 2-Methoxyethoxytrimethoxy Silicone-containing vinyl monomers of silanes; in addition, macromonomers having a radically polymerizable vinyl group at the end of a monomer that polymerizes vinyl groups, etc. may be mentioned. These can be copolymerized with the monomer S1 alone or in combination.

於若干種態樣中,藉由使與聚合物B中所含之單體單元共通之單體單元亦包含於聚合物A中,可改善黏著劑層內之聚合物B之移動性,提高黏著力上升比。共通之單體單元為佔據構成聚合物B之全部單體單元之5重量%以上的成分時有效,較佳為佔據10重量%以上(更佳為20重量%以上、例如30重量%以上)之成分。上述共通之單體單元於構成聚合物A之全部單體單元中所占之比率例如可為1重量%以上,較佳為3重量%以上,更佳為5重量%以上,亦可為7重量%以上。若共通之單體單元於構成聚合物A之全部單體單元中所占之比率變高,則有更良好地發揮改善相容性之效果之傾向。又,考慮到與其他特性之平衡,共通之單體單元於構成聚合物A之全部單體單元中所占之比率可設為50重量%以下,亦可設為30重量%以下。作為可良好地用作共通之單體單元之單體之非限定性之例,可列舉MMA、BMA、2EHMA、甲基丙烯酸酯(MA)、BA、2EHA、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉酯、(甲基)丙烯酸二環戊酯等。In several aspects, the mobility of the polymer B in the adhesive layer can be improved by making the monomer unit common to the monomer unit contained in the polymer B also contained in the polymer A, and the adhesion can be improved. Force rise ratio. The common monomer unit is effective when it occupies 5% by weight or more of all the monomer units constituting the polymer B, preferably 10% by weight or more (more preferably 20% by weight or more, for example, 30% by weight or more). Element. The ratio of the above-mentioned common monomer units in all the monomer units constituting the polymer A may be, for example, 1% by weight or more, preferably 3% by weight or more, more preferably 5% by weight or more, or 7% by weight %above. When the ratio of the common monomer unit to all the monomer units constituting the polymer A increases, the effect of improving the compatibility tends to be exhibited more favorably. In addition, considering the balance with other characteristics, the ratio of the common monomer unit to all the monomer units constituting the polymer A may be 50% by weight or less, or may be 30% by weight or less. Non-limiting examples of monomers that can be favorably used as common monomer units include MMA, BMA, 2EHMA, methacrylate (MA), BA, 2EHA, cyclohexyl (meth)acrylate, Iso(meth)acrylate, dicyclopentanyl (meth)acrylate, etc.

聚合物B之Mw並無特別限定。聚合物B之Mw例如可為1000以上,亦可為5000以上。若聚合物B之Mw過低,則可能有黏著力之上升變得不充分之情況。於若干種較佳態樣中,聚合物B之Mw例如可為10000以上,可為12000以上,可為15000以上,可為17000以上,亦可為20000以上。又,聚合物B之Mw例如可為100000以下,亦可為70000以下。若聚合物B之Mw過高,則可能有無法充分地抑制初期黏著力之情況。於若干種較佳態樣中,聚合物B之Mw例如可為50000以下,可未達50000,可未達40000,可未達35000,可為30000以下,可為28000以下,亦可為25000以下。若聚合物B之Mw為上述任一上限值及下限值之範圍內,則容易將於黏著劑層內之相容性或移動性調節為適度之範圍,容易實現以高水準兼顧初期之低黏著性與被黏著體使用時之強黏著性之補強膜。The Mw of the polymer B is not particularly limited. Mw of polymer B may be 1000 or more, for example, and may be 5000 or more. When the Mw of the polymer B is too low, the increase of the adhesive force may become insufficient. In several preferred aspects, the Mw of the polymer B may be, for example, not less than 10000, not less than 12000, not less than 15000, not less than 17000, or not less than 20000. In addition, the Mw of the polymer B may be, for example, 100,000 or less, or may be 70,000 or less. When the Mw of the polymer B is too high, it may not be possible to sufficiently suppress the initial adhesive force. In some preferred aspects, the Mw of the polymer B may be less than 50,000, may be less than 50,000, may be less than 40,000, may be less than 35,000, may be less than 30,000, may be less than 28,000, or may be less than 25,000 . If the Mw of the polymer B is within the range of any one of the above-mentioned upper limit and lower limit, it is easy to adjust the compatibility or mobility in the adhesive layer to an appropriate range, and it is easy to achieve a high level of compatibility with the initial stage. Reinforcing film with low adhesiveness and strong adhesiveness when used on adherends.

聚合物B例如可藉由利用溶液聚合法、乳化聚合法、塊體聚合法、懸濁聚合法、光聚合法等公知方法使上述單體聚合而製作。 用於聚合物B之聚合之起始劑可根據聚合方法而自先前公知之熱聚合起始劑或光聚合起始劑等中適當選擇。聚合起始劑可單獨使用一種或將兩種以上組合而使用。上述熱聚合起始劑及上述光聚合起始劑可選自與關於聚合物A之聚合所例示之材料相同者。於若干種態樣中,可良好地採用偶氮系聚合起始劑。Polymer B can be produced, for example, by polymerizing the aforementioned monomers by known methods such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and photopolymerization. The initiator used for the polymerization of the polymer B can be appropriately selected from previously known thermal polymerization initiators, photopolymerization initiators, and the like according to the polymerization method. A polymerization initiator can be used individually by 1 type or in combination of 2 or more types. The above-mentioned thermal polymerization initiator and the above-mentioned photopolymerization initiator can be selected from the same materials as those exemplified for the polymerization of the polymer A. In several aspects, an azo-type polymerization initiator can be favorably used.

為了調整聚合物B之分子量,可使用鏈轉移劑。作為所使用之鏈轉移劑之例,可列舉:辛基硫醇、月桂基硫醇、第三壬基硫醇、第三(十二烷基)硫醇、巰基乙醇、α-硫甘油等具有巰基之化合物;硫代乙醇酸;硫代乙醇酸甲酯、硫代乙醇酸乙酯、硫代乙醇酸丙酯、硫代乙醇酸丁酯、硫代乙醇酸第三丁酯、硫代乙醇酸2-乙基己酯、硫代乙醇酸辛酯、硫代乙醇酸異辛酯、硫代乙醇酸癸酯、硫代乙醇酸十二烷基酯、乙二醇之硫代乙醇酸酯、新戊二醇之硫代乙醇酸酯、季戊四醇之硫代乙醇酸酯等硫代乙醇酸酯類;α-甲基苯乙烯二聚物等。於若干種態樣中,作為鏈轉移劑,可良好地採用硫代乙醇酸酯類。In order to adjust the molecular weight of polymer B, chain transfer agents can be used. Examples of the chain transfer agent used include: octyl mercaptan, lauryl mercaptan, tertiary nonyl mercaptan, tertiary (dodecyl) mercaptan, mercaptoethanol, α-thioglycerol, etc. Mercapto compounds; thioglycolic acid; methyl thioglycolate, ethyl thioglycolate, propyl thioglycolate, butyl thioglycolate, tertiary butyl thioglycolate, thioglycolic acid 2-ethylhexyl ester, octyl thioglycolate, isooctyl thioglycolate, decyl thioglycolate, dodecyl thioglycolate, thioglycolate of ethylene glycol, neopentyl Thioglycolic acid esters such as glycol thioglycolate and pentaerythritol thioglycolic acid ester; α-methylstyrene dimer, etc. In several aspects, as chain transfer agents, thioglycolic acid esters can be favorably used.

作為鏈轉移劑之使用量,並無特別限制,通常相對於單體100重量份,含有鏈轉移劑0.05重量份~20重量份,較佳為0.1重量份~15重量份,進而較佳為0.2重量份~10重量份。藉由如此調整鏈轉移劑之添加量,可獲得較佳之分子量之聚合物B。再者,鏈轉移劑可單獨使用一種或將兩種以上組合而使用。There is no particular limitation on the amount of the chain transfer agent used. Generally, 0.05 to 20 parts by weight of the chain transfer agent is contained relative to 100 parts by weight of the monomer, preferably 0.1 to 15 parts by weight, and more preferably 0.2 parts by weight. Parts by weight to 10 parts by weight. By adjusting the addition amount of the chain transfer agent in this way, polymer B with a better molecular weight can be obtained. In addition, a chain transfer agent can be used individually by 1 type or in combination of 2 or more types.

聚合物B之使用量相對於聚合物A之使用量100重量份,例如可設為0.1重量份以上,就獲得更高之效果之觀點而言,可設為0.3重量份以上,可設為0.4重量份以上,亦可設為0.5重量份以上,但並無特別限定。於若干種態樣中,相對於100重量份聚合物A之聚合物B之使用量可設為1重量份以上,可設為2重量份以上,亦可設為3重量份以上。又,相對於100重量份聚合物A之聚合物B之使用量例如可為75重量份以下,可為60重量份以下,亦可為50重量份以下。就避免黏著劑層之凝聚力過度降低之觀點而言,於若干種態樣中,相對於100重量份聚合物A之聚合物B之使用量例如可設為40重量份以下,亦可設為35重量份以下、30重量份以下或25重量份以下。就獲得更高之加熱後黏著力之觀點而言,於若干種態樣中,可將上述聚合物B之使用量設為20重量份以下,可設為17重量份以下,可設為15重量份以下,亦可設為10重量份以下。於此處所揭示之補強膜之若干種態樣中,相對於100重量份聚合物A之聚合物B之使用量例如可未達10重量份,可為8重量份以下,可為5重量份以下或未達5重量份,可為4重量份以下,亦可為3重量份以下。The usage-amount of polymer B is 0.1 weight part or more with respect to the usage-amount of polymer A of 100 weight part, for example, and can be 0.3 weight part or more from a viewpoint of obtaining a higher effect, and can be 0.4 weight part or more. It may be at least 0.5 parts by weight, but it is not particularly limited. In several aspects, the usage-amount of the polymer B with respect to 100 weight part of polymer A may be 1 weight part or more, 2 weight part or more, or 3 weight part or more. Moreover, the usage-amount of the polymer B with respect to 100 weight part of polymer A may be 75 weight part or less, 60 weight part or less, or 50 weight part or less, for example. From the viewpoint of avoiding an excessive decrease in the cohesive force of the adhesive layer, in several aspects, the amount of polymer B used relative to 100 parts by weight of polymer A can be set to 40 parts by weight or less, and can also be set to 35 parts by weight. Parts by weight or less, 30 parts by weight or less, or 25 parts by weight or less. From the viewpoint of obtaining a higher adhesive force after heating, in some aspects, the amount of the polymer B used may be 20 parts by weight or less, may be 17 parts by weight or less, or may be 15 parts by weight 10 parts by weight or less, or 10 parts by weight or less. In several aspects of the reinforced film disclosed here, the amount of polymer B used relative to 100 parts by weight of polymer A may be less than 10 parts by weight, but may be less than 8 parts by weight, or less than 5 parts by weight. Or less than 5 parts by weight, may be 4 parts by weight or less, or may be 3 parts by weight or less.

黏著劑層於不會較大地損及此處所揭示之補強膜之性能之範圍內,可視需要含有聚合物A及聚合物B以外之聚合物(任意聚合物)。此種任意聚合物之使用量通常適宜設為黏著劑層中所含之聚合物成分整體之20重量%以下,可為15重量%以下,可為10重量%以下。於若干種態樣中,上述任意聚合物之使用量可為上述聚合物成分整體之5重量%以下,可為3重量%以下,亦可為1重量%以下。亦可為實質上不含有聚合物A及聚合物B以外之聚合物之黏著劑層。The adhesive layer may contain polymers (arbitrary polymers) other than polymer A and polymer B as needed within the range that does not greatly impair the performance of the reinforced film disclosed herein. The usage-amount of such an arbitrary polymer is normally suitably made into 20 weight% or less of the whole polymer component contained in an adhesive layer, and may be 15 weight% or less, and may be 10 weight% or less. In some aspects, the amount of the above-mentioned optional polymer used may be 5% by weight or less, 3% by weight or less, or 1% by weight or less of the entire polymer component. An adhesive layer that does not substantially contain polymers other than polymer A and polymer B may also be used.

(交聯劑) 於黏著劑層中,可以調整凝聚力等為目的視需要使用交聯劑。作為交聯劑,可使用黏著劑之領域中公知之交聯劑,例如可列舉:環氧系交聯劑、異氰酸酯系交聯劑、聚矽氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、矽烷系交聯劑、烷基醚化三聚氰胺系交聯劑、金屬螯合物系交聯劑等。尤其可良好地使用異氰酸酯系交聯劑、環氧系交聯劑、金屬螯合物系交聯劑。交聯劑可單獨使用一種或將兩種以上組合而使用。(Crosslinking agent) In the adhesive layer, a crosslinking agent may be used as necessary for the purpose of adjusting cohesive force or the like. As the cross-linking agent, known cross-linking agents in the field of adhesives can be used, for example, epoxy-based cross-linking agents, isocyanate-based cross-linking agents, polysiloxane-based cross-linking agents, oxazoline-based cross-linking agents, Aziridine-based cross-linking agents, silane-based cross-linking agents, alkyl etherified melamine-based cross-linking agents, metal chelate-based cross-linking agents, etc. In particular, isocyanate-based crosslinking agents, epoxy-based crosslinking agents, and metal chelate-based crosslinking agents can be used favorably. A crosslinking agent can be used individually by 1 type or in combination of 2 or more types.

具體而言,作為異氰酸酯系交聯劑之例,可列舉:甲苯二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、苯二甲基二異氰酸酯、氫化苯二甲基二異氰酸酯、二苯基(甲烷)二異氰酸酯、氫化二苯基(甲烷)二異氰酸酯、四甲基苯二甲基二異氰酸酯、萘二異氰酸酯、三苯基(甲烷)三異氰酸酯、聚亞甲基聚苯基異氰酸酯、及該等與三羥甲基丙烷等多元醇之加成物。或者,於1分子中具有至少1個以上之異氰酸酯基與1個以上之不飽和鍵之化合物、具體而言(甲基)丙烯酸2-異氰酸基乙酯等亦可用作異氰酸酯系交聯劑。該等可單獨使用一種或將兩種以上組合而使用。Specifically, examples of isocyanate-based crosslinking agents include toluene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, diisocyanate, Phenyl (methane) diisocyanate, hydrogenated diphenyl (methane) diisocyanate, tetramethylxylylene diisocyanate, naphthalene diisocyanate, triphenyl (methane) triisocyanate, polymethylene polyphenyl isocyanate, And these adducts with trimethylolpropane and other polyols. Alternatively, compounds having at least one isocyanate group and one or more unsaturated bonds in one molecule, specifically, 2-isocyanatoethyl (meth)acrylate, etc., can also be used as isocyanate-based crosslinkers. agent. These can be used individually by 1 type or in combination of 2 or more types.

作為環氧系交聯劑,可列舉:雙酚A、表氯醇型環氧系樹脂、伸乙基縮水甘油醚、聚乙二醇二縮水甘油醚、甘油二縮水甘油醚、甘油三縮水甘油醚、1,6-己二醇縮水甘油醚、三羥甲基丙烷三縮水甘油醚、二縮水甘油基苯胺、二胺縮水甘油胺、N,N,N',N'-四縮水甘油基間苯二甲胺及1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷等。該等可單獨使用一種或將兩種以上組合而使用。Examples of epoxy-based crosslinking agents include bisphenol A, epichlorohydrin-type epoxy-based resins, ethylidene glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, and glycerin triglycidyl ether. ether, 1,6-hexanediol glycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl aniline, diamine glycidylamine, N,N,N',N'-tetraglycidyl meta Xylylenediamine and 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, etc. These can be used individually by 1 type or in combination of 2 or more types.

作為金屬螯合物化合物,可列舉作為金屬成分之鋁、鐵、錫、鈦、鎳等,作為螯合物成分之乙炔、乙醯乙酸甲酯、乳酸乙酯等。該等可單獨使用一種或將兩種以上組合而使用。Examples of metal chelate compounds include aluminum, iron, tin, titanium, nickel, etc. as metal components, and acetylene, acetyl methyl acetate, ethyl lactate, etc., as chelate components. These can be used individually by 1 type or in combination of 2 or more types.

使用交聯劑之情形時之使用量並無特別限定,例如相對於100重量份聚合物A可設為超過0重量份之量。又,交聯劑之使用量相對於100重量份聚合物A,例如可設為0.01重量份以上,較佳為設為0.05重量份以上。藉由增大交聯劑之使用量,有獲得更高之凝聚力之傾向。於若干種態樣中,相對於100重量份聚合物A之交聯劑之使用量可為0.1重量份以上,可為0.5重量份以上,亦可為1重量份以上。另一方面,就避免因過度之凝聚力提高所致之黏性降低之觀點而言,交聯劑之使用量相對於100重量份聚合物A通常適宜設為15重量份以下,可設為10重量份以下,亦可設為5重量份以下。交聯劑之使用量不過多就利用黏著劑之流動性而更良好地表現出聚合物B之使用效果之觀點而言亦可能變得有利。The usage-amount in the case of using a crosslinking agent is not specifically limited, For example, it can be made into the quantity exceeding 0 weight part with respect to 100 weight part of polymer A. Moreover, the usage-amount of a crosslinking agent can be made into 0.01 weight part or more with respect to 100 weight part of polymer A, for example, Preferably it is 0.05 weight part or more. By increasing the amount of cross-linking agent used, there is a tendency to obtain higher cohesion. In several aspects, the usage-amount of the crosslinking agent with respect to 100 weight part of polymer A may be 0.1 weight part or more, 0.5 weight part or more, and may be 1 weight part or more. On the other hand, from the viewpoint of avoiding a decrease in viscosity due to an excessive increase in cohesion, the amount of the crosslinking agent used is usually preferably 15 parts by weight or less per 100 parts by weight of polymer A, and may be 10 parts by weight. 5 parts by weight or less, or 5 parts by weight or less. It may also be advantageous from the viewpoint of expressing the use effect of the polymer B better by utilizing the fluidity of the adhesive that the usage-amount of the crosslinking agent is not too much.

此處所揭示之技術可以至少使用異氰酸酯系交聯劑作為交聯劑之態樣良好地實施。就容易實現加熱後凝聚力較高且黏著力上升比較大之補強膜之觀點而言,於若干種態樣中,異氰酸酯系交聯劑之使用量相對於100重量份聚合物A例如可設為5重量份以下,可設為4重量份以下,可設為3重量份以下,可設為未達1重量份,可設為0.7重量份以下,亦可設為0.5重量份以下。又,於若干種對應中,上述異氰酸酯系交聯劑之使用量例如可為0.1重量份以上,可為0.3重量份以上,可為0.5重量份以上,亦可為1.0重量份以上。The technique disclosed here can be implemented favorably in the form of using at least an isocyanate-based crosslinking agent as a crosslinking agent. From the point of view of easy realization of a reinforced film with high cohesive force after heating and a relatively large increase in adhesion force, in several aspects, the usage amount of the isocyanate crosslinking agent can be set to 5, for example, relative to 100 parts by weight of polymer A. The weight part or less may be 4 weight parts or less, may be 3 weight parts or less, may be less than 1 weight part, may be 0.7 weight part or less, and may be 0.5 weight part or less. Moreover, in some correspondences, the usage-amount of the said isocyanate crosslinking agent may be 0.1 weight part or more, 0.3 weight part or more, 0.5 weight part or more, or 1.0 weight part or more.

於在黏著劑層含有含羥基單體作為單體單元之構成中使用異氰酸酯系交聯劑之情形時,含羥基單體之使用量WOH 相對於異氰酸酯系交聯劑之使用量WNCO 以重量基準計,可設為WOH /WNCO 成為2以上之量,但並無特別限定。藉由如此使含羥基單體相對於異氰酸酯系交聯劑之使用量變多,可形成適於黏著力上升比之提高之交聯結構。於若干種態樣中,WOH /WNCO 可為3以上,可為5以上,可為10以上,可為20以上,可為30以上,亦可為50以上。WOH /WNCO 之上限並無特別限制。WOH /WNCO 例如可為500以下,可為200以下,亦可為100以下。When an isocyanate-based cross-linking agent is used in the adhesive layer containing a hydroxyl-containing monomer as a monomer unit, the amount of the hydroxyl-containing monomer W OH relative to the amount of the isocyanate-based cross-linking agent W NCO is by weight On the basis of the basis, W OH /W NCO may be set to an amount of 2 or more, but it is not particularly limited. Thus, by increasing the usage-amount of a hydroxyl-containing monomer with respect to an isocyanate type crosslinking agent, the crosslinking structure suitable for the improvement of an adhesive force increase ratio can be formed. In some aspects, W OH /W NCO may be 3 or more, 5 or more, 10 or more, 20 or more, 30 or more, or 50 or more. The upper limit of W OH /W NCO is not particularly limited. W OH /W NCO may be, for example, 500 or less, 200 or less, or 100 or less.

為了使上述任一交聯反應更有效地進行,亦可使用交聯觸媒。作為交聯觸媒,例如可良好地使用錫系觸媒(尤其是二月桂酸二辛基錫)。交聯觸媒之使用量並無特別限制,例如相對於100重量份聚合物A可設為約0.0001重量份~1重量份。A crosslinking catalyst may also be used in order to carry out any of the above crosslinking reactions more efficiently. As a crosslinking catalyst, a tin-based catalyst (especially dioctyltin dilaurate) can be used suitably, for example. The usage-amount of a crosslinking catalyst is not specifically limited, For example, it can set it as about 0.0001-1 weight part with respect to 100 weight part of polymer A.

於黏著劑層中可視需要使用多官能性單體。多官能性單體藉由代替如上所述之交聯劑、或與該交聯劑組合使用,可有助於實現凝聚力之調整等目的。例如於由光硬化型黏著劑組合物所形成之黏著劑層中,可良好地使用多官能性單體。 作為多官能性單體,例如可列舉:乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯苯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯、丁二醇(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯等。其中,可良好地使用三羥甲基丙烷三(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯。多官能性單體可單獨使用一種或將兩種以上組合而使用。A polyfunctional monomer may be used in an adhesive layer as needed. By using the multifunctional monomer instead of the above-mentioned crosslinking agent or in combination with the crosslinking agent, it can contribute to the adjustment of cohesive force and the like. For example, a polyfunctional monomer can be favorably used in an adhesive layer formed from a photocurable adhesive composition. Examples of polyfunctional monomers include ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate Acrylates, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethylene glycol di(meth)acrylate ) acrylate, 1,6-hexanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, four Methylolmethane tri(meth)acrylate, Allyl (meth)acrylate, Vinyl (meth)acrylate, Divinylbenzene, Epoxy acrylate, Polyester acrylate, Urethane acrylate, Butanediol (meth)acrylate, hexanediol di(meth)acrylate, etc. Among them, trimethylolpropane tri(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and dipentaerythritol hexa(meth)acrylate can be preferably used. A polyfunctional monomer can be used individually by 1 type or in combination of 2 or more types.

多官能性單體之使用量根據其分子量或官能基數等而不同,通常相對於100重量份聚合物A適宜設為0.01重量份~3.0重量份左右之範圍。於若干種態樣中,多官能性單體之使用量相對於100重量份聚合物A,例如可為0.02重量份以上,亦可為0.03重量份以上。藉由增大多官能性單體之使用量,有獲得更高之凝聚力之傾向。另一方面,就避免因過度之凝聚力提高所致之黏性降低之觀點而言,多官能性單體之使用量相對於100重量份聚合物A可為2.0重量份以下,可為1.0重量份以下,亦可為0.5重量份以下。多官能性單體之使用量不過多就利用黏著劑之流動性而更良好地表現聚合物B之使用效果之觀點而言亦可能變得有利。The usage-amount of a polyfunctional monomer changes with its molecular weight, the number of functional groups, etc., Usually, it is suitable to set it as the range of about 0.01-3.0 weight part with respect to 100 weight part of polymer A. In several aspects, the usage-amount of a polyfunctional monomer may be 0.02 weight part or more with respect to 100 weight part of polymer A, and may be 0.03 weight part or more, for example. By increasing the amount of polyfunctional monomer used, there is a tendency to obtain higher cohesion. On the other hand, from the viewpoint of avoiding a decrease in viscosity due to an excessive increase in cohesive force, the amount of the polyfunctional monomer used may be 2.0 parts by weight or less, or 1.0 parts by weight with respect to 100 parts by weight of Polymer A. It may be less than or equal to 0.5 parts by weight. It may also be advantageous from the viewpoint of expressing the use effect of the polymer B better by utilizing the fluidity of the adhesive that the usage-amount of the polyfunctional monomer is not too much.

(黏著賦予樹脂) 黏著劑層中可視需要含有黏著賦予樹脂。作為黏著賦予樹脂,並無特別限制,例如可列舉:松香系黏著賦予樹脂、萜烯系黏著賦予樹脂、酚系黏著賦予樹脂、烴系黏著賦予樹脂、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。黏著賦予樹脂可單獨使用一種或將兩種以上組合而使用。(Adhesive Imparting Resin) The adhesive agent layer may contain an adhesive agent resin as needed. The tackifying resin is not particularly limited, and examples thereof include rosin-based tackifying resins, terpene-based tackifying resins, phenol-based tackifying resins, hydrocarbon-based tackifying resins, ketone-based tackifying resins, and polyamide-based tackifying resins. Imparting resins, epoxy-based adhesion-imparting resins, elastic-based adhesion-imparting resins, etc. The tack-imparting resin may be used alone or in combination of two or more.

作為松香系黏著賦予樹脂,例如可列舉:松脂膠、木松香、妥爾油松香等未改性松香(生松香)、或藉由聚合、歧化、氫化等將該等未改性松香改性之改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香、或其他經化學改質之松香等),此外亦可列舉各種松香衍生物等。 作為上述松香衍生物,例如可列舉: 藉由使酚與松香類(未改性松香、改性松香或各種松香衍生物等)於酸觸媒下進行加成並進行熱聚合所獲得之松香酚系樹脂; 利用醇類使未改性松香酯化之松香之酯化合物(未改性松香酯)、或利用醇類使聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等改性松香酯化之改性松香之酯化合物(聚合松香酯、穩定化松香酯、歧化松香酯、完全氫化松香酯、部分氫化松香酯等)等松香酯系樹脂; 利用不飽和脂肪酸將未改性松香或改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等)改性之不飽和脂肪酸改性松香系樹脂; 利用不飽和脂肪酸將松香酯系樹脂改性之不飽和脂肪酸改性松香酯系樹脂; 將未改性松香、改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等)、不飽和脂肪酸改性松香系樹脂或不飽和脂肪酸改性松香酯系樹脂中之羧基進行還原處理之松香醇系樹脂; 未改性松香、改性松香、或各種松香衍生物等松香系樹脂(尤其是松香酯系樹脂)之金屬鹽等。Examples of rosin-based tackifying resins include unmodified rosins (raw rosins) such as rosin gum, wood rosin, and tall oil rosin, or those modified by polymerization, disproportionation, hydrogenation, and the like. Modified rosins (polymerized rosins, stabilized rosins, disproportionated rosins, fully hydrogenated rosins, partially hydrogenated rosins, or other chemically modified rosins, etc.), and various rosin derivatives are also listed. Examples of the aforementioned rosin derivatives include: abietol obtained by adding phenol to rosins (unmodified rosin, modified rosin, or various rosin derivatives, etc.) under an acid catalyst and thermally polymerizing rosin ester compound (unmodified rosin ester), or polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, etc. Rosin ester resins such as modified rosin ester compounds (polymerized rosin esters, stabilized rosin esters, disproportionated rosin esters, fully hydrogenated rosin esters, partially hydrogenated rosin esters, etc.) that are esterified with permanent rosin; Rosin or modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, etc.) Saturated fatty acid modified rosin ester resin; unmodified rosin, modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, etc.), unsaturated fatty acid modified rosin resin or unsaturated Fatty acid-modified rosin ester-based resins in which carboxyl groups have been reduced; metal salts of rosin-based resins (especially rosin-based resins) such as unmodified rosin, modified rosin, or various rosin derivatives.

作為萜烯系黏著賦予樹脂,例如可列舉:α-蒎烯聚合物、β-蒎烯聚合物、雙戊烯聚合物等萜烯系樹脂、或將該等萜烯系樹脂改性(酚改性、芳香族改性、氫化改性、烴改性等)之改性萜烯系樹脂(例如萜烯酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂等)等。Examples of terpene-based tackifier resins include terpene-based resins such as α-pinene polymers, β-pinene polymers, and dipentene polymers, or modified (phenol-modified) terpene-based resins. properties, aromatic modification, hydrogenation modification, hydrocarbon modification, etc.) of modified terpene resins (such as terpene phenolic resins, styrene terpene-based resins, etc.), etc.

作為酚系黏著賦予樹脂,例如可列舉:各種酚類(例如苯酚、間甲酚、3,5-二甲苯酚、對烷基苯酚、間苯二酚等)與甲醛之縮合物(例如烷基酚系樹脂、二甲苯甲醛系樹脂等)、利用鹼性觸媒使上述酚類與甲醛進行加成反應所獲得之可溶酚醛樹脂、或利用酸觸媒使上述酚類與甲醛進行縮合反應所獲得之酚醛清漆樹脂等。Examples of phenolic tackifying resins include condensates of various phenols (such as phenol, m-cresol, 3,5-xylenol, p-alkylphenol, resorcinol, etc.) and formaldehyde (such as alkyl phenolic resins, xylene formaldehyde resins, etc.), resole resins obtained by addition reaction of the above-mentioned phenols and formaldehyde with an alkaline catalyst, or condensation reactions of the above-mentioned phenols and formaldehyde with an acid catalyst The obtained novolac resin and the like.

作為烴系黏著賦予樹脂之例,可列舉:脂肪族系烴樹脂、芳香族系烴樹脂、脂肪族系環狀烴樹脂、脂肪族-芳香族系石油樹脂(苯乙烯-烯烴系共聚物等)、脂肪族-脂環族系石油樹脂、氫化烴樹脂、薰草咔系樹脂、薰草咔茚系樹脂等各種烴系樹脂。Examples of hydrocarbon-based tackifying resins include: aliphatic hydrocarbon resins, aromatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, aliphatic-aromatic petroleum resins (styrene-olefin copolymers, etc.) Various hydrocarbon resins such as aliphatic-alicyclic petroleum resins, hydrogenated hydrocarbon resins, lavender-based resins, and lavender-based resins.

作為可良好地使用之聚合松香酯之市售品,可例示:荒川化學工業股份有限公司製造之商品名「Pensel D-125」、「Pensel D-135」、「Pensel D-160」、「Pensel KK」、「Pensel C」等,但並不限定於該等。Examples of commercially available polymerized rosin esters that can be favorably used include: "Pensel D-125", "Pensel D-135", "Pensel D-160", "Pensel KK", "Pensel C", etc., but not limited to these.

作為可良好地使用之萜烯酚系樹脂之市售品,可例示:Yasuhara Chemical股份有限公司製造之商品名「YS Polystar S-145」、「YS Polystar G-125」、「YS Polystar N125」、「YS Polystar U-115」、荒川化學工業股份有限公司製造之商品名「Tamanol 803L」、「Tamanol 901」、Sumitomo Bakelite股份有限公司製造之商品名「Sumilite resin PR-12603」等,但並不限定於該等。Examples of commercially available terpene phenolic resins that can be favorably used include: Yasuhara Chemical Co., Ltd. product names "YS Polystar S-145", "YS Polystar G-125", "YS Polystar N125", "YS Polystar U-115", trade name "Tamanol 803L" manufactured by Arakawa Chemical Industry Co., Ltd., "Tamanol 901", trade name "Sumilite resin PR-12603" manufactured by Sumitomo Bakelite Co., Ltd., etc., but not limited for such.

黏著賦予樹脂之含量並無特別限定,可以根據目的或用途而發揮適當之黏著性能之方式設定。相對於100重量份聚合物A之黏著賦予樹脂之含量(於含有兩種以上之黏著賦予樹脂之情形時為其等之合計量)例如可設為5~500重量份左右。The content of the tack-imparting resin is not particularly limited, and can be set so as to exhibit appropriate tack performance according to the purpose or use. The content of the tackifier resin relative to 100 parts by weight of the polymer A (when two or more kinds of tackifier resins are contained, the total amount thereof) can be, for example, about 5 to 500 parts by weight.

作為黏著賦予樹脂,可良好地使用軟化點(軟化溫度)約80℃以上(較佳為約100℃以上、例如約120℃以上)者。根據具有上述下限值以上之軟化點之黏著賦予樹脂,有可有效地改善初期之低黏著性及被黏著體使用時之強黏著性之傾向。軟化點之上限並無特別限制,例如可為約200℃以下(典型而言為180℃以下)。再者,黏著賦予樹脂之軟化點可基於JIS K2207所規定之軟化點試驗方法(環球法)進行測定。As the tackifying resin, one having a softening point (softening temperature) of about 80° C. or higher (preferably about 100° C. or higher, for example, about 120° C. or higher) can be preferably used. The tack-imparting resin having a softening point equal to or higher than the above-mentioned lower limit tends to be effective in improving initial low tack and strong tack at the time of use of an adherend. The upper limit of the softening point is not particularly limited, and may be, for example, about 200°C or lower (typically, 180°C or lower). In addition, the softening point of the tack-providing resin can be measured based on the softening point test method (ring and ball method) stipulated in JIS K2207.

此外,此處所揭示之技術中之黏著劑層亦可於不明顯妨礙本發明之效果之範圍內,視需要含有調平劑、塑化劑、軟化劑、著色劑(染料、顏料等)、填充劑、抗靜電劑、抗老化劑、紫外線吸收劑、抗氧化劑、光穩定劑、防腐劑等可用於黏著劑之公知添加劑。In addition, the adhesive layer in the technology disclosed here may also contain leveling agents, plasticizers, softeners, colorants (dyes, pigments, etc.), fillers, etc. Known additives that can be used in adhesives such as antistatic agents, antiaging agents, ultraviolet absorbers, antioxidants, light stabilizers, and preservatives.

構成此處所揭示之補強膜之黏著劑層可為黏著劑組合物之硬化層。即,該黏著劑層可藉由將水分散型、溶劑型、光硬化型、熱熔型等黏著劑組合物賦予(例如塗佈)至適當之表面後適當實施硬化處理而形成。於進行兩種以上之硬化處理(乾燥、交聯、聚合、冷卻等)之情形時,該等可同時、或多階段地進行。於使用單體成分之部分聚合物(丙烯酸系聚合物漿液)之黏著劑組合物中,典型而言,作為上述硬化處理,進行最終之共聚反應。即,將部分聚合物供於進一步之共聚反應而形成完全聚合物。例如,若為光硬化性黏著劑組合物,則實施光照射。視需要亦可實施交聯、乾燥等硬化處理。例如於必須以光硬化性黏著劑組合物進行乾燥之情形時,於乾燥後進行光硬化即可。於使用完全聚合物之黏著劑組合物中,典型而言,作為上述硬化處理,視需要實施乾燥(加熱乾燥)、交聯等處理。The adhesive layer constituting the reinforced film disclosed herein may be the hardened layer of the adhesive composition. That is, the adhesive layer can be formed by applying (for example, coating) an adhesive composition such as a water dispersion type, solvent type, photocurable type, or hot melt type to an appropriate surface, and then appropriately performing a hardening treatment. When two or more hardening treatments (drying, crosslinking, polymerization, cooling, etc.) are performed, these can be performed simultaneously or in multiple stages. In an adhesive composition using a partial polymer (acrylic polymer syrup) of a monomer component, typically, the final copolymerization reaction is performed as the curing treatment described above. That is, a part of the polymer is subjected to further copolymerization to form a complete polymer. For example, in the case of a photocurable adhesive composition, light irradiation is performed. Hardening treatments such as crosslinking and drying may be performed as necessary. For example, when it is necessary to dry with a photocurable adhesive composition, photocuring may be performed after drying. In an adhesive composition using a complete polymer, typically, drying (heat drying), crosslinking, and other treatments are performed as the above-mentioned hardening treatment, if necessary.

黏著劑組合物之塗佈例如可使用凹版輥式塗佈機、逆輥塗佈機、接觸輥塗佈機、浸漬輥塗機、棒式塗佈機、刮刀塗佈機、噴霧塗佈機等常用之塗佈機而實施。For the coating of the adhesive composition, for example, a gravure roll coater, reverse roll coater, touch roll coater, dip roll coater, rod coater, knife coater, spray coater, etc. can be used It is carried out with commonly used coating machines.

黏著劑層之厚度並無特別限定,例如可設為1 μm以上。於若干種態樣中,黏著劑層之厚度例如可為3 μm以上,可為5 μm以上,可為8 μm以上,可為10 μm以上,可為15 μm以上,亦可為20 μm以上或超過20 μm。藉由增大黏著劑層之厚度,有加熱後黏著力上升之傾向。該情況就使被黏著體與支持基材牢固地一體化而發揮較高之補強功能之觀點而言可能變得有利。又,於若干種態樣中,黏著劑層之厚度例如可為300 μm以下,可為200 μm以下,可為150 μm以下,可為100 μm以下,可為70 μm以下,可為50 μm以下,亦可為40 μm以下。黏著劑層之厚度不過大就補強膜之薄型化或防止黏著劑層之凝聚破壞等觀點而言可能變得有利。再者,於在基材之第一面及第二面具有第一黏著劑層及第二黏著劑層之補強膜之情形時,上述黏著劑層之厚度至少可應用於第一黏著劑層之厚度。第二黏著劑層之厚度亦可選自相同之範圍。The thickness of the adhesive layer is not particularly limited, and may be, for example, 1 μm or more. In some aspects, the thickness of the adhesive layer can be, for example, 3 μm or more, 5 μm or more, 8 μm or more, 10 μm or more, 15 μm or more, or 20 μm or more. More than 20 μm. By increasing the thickness of the adhesive layer, the adhesive force tends to increase after heating. This may be advantageous from the viewpoint of firmly integrating the adherend and the support base to exhibit a high reinforcing function. Also, in several aspects, the thickness of the adhesive layer may be, for example, 300 μm or less, 200 μm or less, 150 μm or less, 100 μm or less, 70 μm or less, or 50 μm or less , can also be 40 μm or less. The thickness of the adhesive layer is not too large, which may be advantageous from the viewpoints of reducing the thickness of the reinforcing film and preventing coagulation failure of the adhesive layer. Furthermore, in the case where the reinforcing film of the first adhesive layer and the second adhesive layer is provided on the first surface and the second surface of the base material, the thickness of the above-mentioned adhesive layer can be applied at least to the first adhesive layer. thickness. The thickness of the second adhesive layer can also be selected from the same range.

構成黏著劑層之黏著劑之凝膠分率通常適宜處於20.0%~99.0%之範圍,較理想為處於30.0%~90.0%之範圍,但並無特別限定。藉由將凝膠分率設為上述範圍,容易實現以高水準兼顧初期之低黏著性與被黏著體使用時之強黏著性之補強膜。凝膠分率係藉由以下之方法進行測定。The gel fraction of the adhesive constituting the adhesive layer is usually suitably in the range of 20.0% to 99.0%, more preferably in the range of 30.0% to 90.0%, but it is not particularly limited. By setting the gel fraction within the above-mentioned range, it is easy to realize a reinforced film that satisfies both initial low adhesiveness and strong adhesiveness when the adherend is used at a high level. The gel fraction was measured by the following method.

[凝膠分率之測定] 將約0.1 g之黏著劑樣品(重量Wg1 )利用平均孔徑0.2 μm之多孔質聚四氟乙烯膜(重量Wg2 )包裹成荷包狀,並利用風箏線(重量Wg3 )將口紮緊。作為上述多孔質聚四氟乙烯膜,使用商品名「Nitoflon(註冊商標)NTF1122」(日東電工股份有限公司,平均孔徑0.2 μm,氣孔率75%,厚度85 μm)或其相當品。將該包裹物浸漬於乙酸乙酯50 mL中,於室溫(典型為23℃)下保持7天而使黏著劑中之溶膠成分(乙酸乙酯可溶分)溶出至上述膜外。繼而,取出上述包裹物,擦去附著於外表面之乙酸乙酯後,使該包裹物於130℃下乾燥2小時,測定該包裹物之重量(Wg4 )。藉由將各值代入以下之式中,可算出黏著劑之凝膠分率GC 。 凝膠分率GC (%)=[(Wg4 -Wg2 -Wg3 )/Wg1 ]×100[Measurement of Gel Fraction] About 0.1 g of the adhesive sample (weight Wg 1 ) was wrapped into a purse with a porous polytetrafluoroethylene membrane (weight Wg 2 ) with an average pore size of 0.2 μm, and was wrapped with a kite string (weight Wg Wg 3 ) Tighten the mouth. As the porous polytetrafluoroethylene membrane, the trade name "Nitoflon (registered trademark) NTF1122" (Nitto Denko Co., Ltd., average pore diameter 0.2 μm, porosity 75%, thickness 85 μm) or its equivalent was used. The package was immersed in 50 mL of ethyl acetate, and kept at room temperature (typically 23° C.) for 7 days to dissolve the sol component (soluble in ethyl acetate) in the adhesive to the outside of the film. Then, the above-mentioned package was taken out, and after wiping off the ethyl acetate adhering to the outer surface, the package was dried at 130° C. for 2 hours, and the weight (Wg 4 ) of the package was measured. By substituting each value into the following formula, the gel fraction G C of the adhesive can be calculated. Gel fraction G C (%)=[(Wg 4 -Wg 2 -Wg 3 )/Wg 1 ]×100

此處所揭示之補強膜例如可藉由依序包括如下步驟之方法而良好地製造:使液狀之黏著劑組合物與基材之第一面接觸;及於該第一面上使上述黏著劑組合物硬化而形成黏著劑層。上述黏著劑組合物之硬化可伴有該黏著劑組合物之乾燥、交聯、聚合、冷卻等之一種或兩種以上。根據如此使液狀之黏著劑組合物於基材之第一面上硬化而形成黏著劑層之方法,與藉由將硬化後之黏著劑層貼合於基材之第一面而於該第一面上配置黏著劑層之方法相比,可提高黏著劑層對基材之抓固性。利用該情況,可良好地製造於基材之第一面固著有黏著劑層之補強膜。The reinforcing film disclosed here can be favorably produced, for example, by a method comprising the steps of: bringing a liquid adhesive composition into contact with a first surface of a substrate; and combining the above-mentioned adhesive on the first surface. The substance hardens to form an adhesive layer. The hardening of the above-mentioned adhesive composition may be accompanied by one or more of drying, cross-linking, polymerization, cooling, etc. of the adhesive composition. According to the method of forming the adhesive layer by hardening the liquid adhesive composition on the first surface of the base material in this way, and attaching the hardened adhesive layer to the first surface of the base material to form the adhesive layer on the first surface of the base material Compared with the method of arranging an adhesive layer on one side, the gripping property of the adhesive layer to the substrate can be improved. Utilizing this fact, it is possible to favorably manufacture a reinforcing film in which an adhesive layer is fixed to the first surface of the base material.

於若干種態樣中,作為使液狀之黏著劑組合物與基材之第一面接觸之方法,可採用將上述黏著劑組合物直接塗佈於基材之第一面之方法。藉由使於基材之第一面上硬化之黏著劑層之第一面(黏著面)抵接於剝離面,可獲得該黏著劑層之第二面固著於基材之第一面且該黏著劑層之第一面抵接於剝離面之構成之補強膜。作為上述剝離面,可利用剝離襯墊之表面或經剝離處理之基材背面等。In several aspects, as a method of bringing the liquid adhesive composition into contact with the first surface of the substrate, a method of directly coating the above-mentioned adhesive composition on the first surface of the substrate may be used. By making the first side (adhesive side) of the adhesive layer hardened on the first side of the substrate abut against the peeling side, the second side of the adhesive layer can be fixed to the first side of the substrate and The first surface of the adhesive layer abuts against the reinforcing film formed by the peeling surface. As the above-mentioned release surface, the surface of a release liner, the back surface of a base material subjected to release treatment, or the like can be used.

又,例如於使用單體成分之部分聚合物(丙烯酸系聚合物漿液)之光硬化型之黏著劑組合物之情形時,例如亦可於將該黏著劑組合物塗佈於剝離面後,於該塗佈之黏著劑組合物被覆基材之第一面,藉此使未硬化之上述黏著劑組合物與基材之第一面接觸,於該狀態下,對夾於基材之第一面與剝離面之間的黏著劑組合物進行光照射而使其硬化,藉此形成黏著劑層。Also, for example, in the case of using a light-curable adhesive composition of a partial polymer (acrylic polymer syrup) of the monomer component, for example, after applying the adhesive composition on the peeling surface, the The coated adhesive composition coats the first surface of the substrate, whereby the uncured adhesive composition is in contact with the first surface of the substrate, and in this state, it is sandwiched between the first surface of the substrate The adhesive composition between the release surface and the peeling surface is irradiated with light to harden, thereby forming an adhesive layer.

再者,上述所例示之方法並非限定此處所揭示之補強膜之製造方法。於此處所揭示之補強膜之製造時,可將能夠使黏著劑層之第二面固著於基材之第一面之適當方法單獨使用一種或組合兩種以上而使用。例如於可藉由在基材之第一面設置底塗層等方法而充分地提高黏著劑層對基材之抓固性之情形時,亦可藉由將硬化後之黏著劑層貼合於基材之第一面之方法而製造補強膜。Furthermore, the methods exemplified above do not limit the method of manufacturing the reinforcing film disclosed here. In the manufacture of the reinforcement film disclosed here, one kind of appropriate method capable of fixing the second surface of the adhesive layer to the first surface of the substrate can be used alone or in combination of two or more. For example, when the grip of the adhesive layer to the substrate can be sufficiently improved by providing a primer layer on the first surface of the substrate, the hardened adhesive layer can also be bonded to the substrate. The reinforcement film is manufactured by the method of the first surface of the base material.

<支持基材> 作為此處所揭示之補強膜之支持基材,可使用包含各種樹脂膜作為基底膜者。此處所謂「樹脂膜」係指非多孔質之結構,且典型而言係指實質上不含氣泡之(無孔隙之)樹脂膜。因此,上述樹脂膜之概念區別於發泡體膜或不織布。作為上述樹脂膜,可良好地使用能夠獨立地維持形狀之(自立型、或非依存性)者。上述樹脂膜可為單層構造,亦可為兩層以上之多層構造(例如三層構造)。<Support base material> As a support base material of the reinforcement film disclosed here, what contains various resin films as a base film can be used. The term "resin film" here refers to a non-porous structure, and typically refers to a resin film substantially free of bubbles (non-porous). Therefore, the concept of the above-mentioned resin film is different from that of a foam film or a nonwoven fabric. As said resin film, what can maintain a shape independently (self-supporting type, or non-dependency) can be used favorably. The above-mentioned resin film may have a single-layer structure, or may have a multi-layer structure of two or more layers (for example, a three-layer structure).

作為構成樹脂膜之樹脂材料,例如可列舉:聚酯、聚烯烴、尼龍6、尼龍66、部分芳香族聚醯胺等聚醯胺(PA)、聚醯亞胺(PI)、聚醯胺醯亞胺(PAI)、聚醚醚酮(PEEK)、聚醚碸(PES)、聚苯硫醚(PPS)、聚碳酸酯(PC)、聚胺基甲酸酯(PU)、乙烯-乙酸乙烯酯共聚物(EVA)、聚四氟乙烯(PTFE)等氟樹脂、丙烯酸系樹脂、聚丙烯酸酯、聚苯乙烯、聚氯乙烯、聚偏二氯乙烯等樹脂。上述樹脂膜可為使用單獨含有此種樹脂之一種之樹脂材料所形成者,亦可為使用摻合有兩種以上之樹脂材料所形成者。上述樹脂膜可未經延伸,亦可為經延伸(例如單軸延伸或雙軸延伸)者。As the resin material constituting the resin film, for example, polyester, polyolefin, nylon 6, nylon 66, polyamide (PA), polyimide (PI), polyamide amide, etc. Imine (PAI), polyetheretherketone (PEEK), polyethersulfide (PES), polyphenylene sulfide (PPS), polycarbonate (PC), polyurethane (PU), ethylene-vinyl acetate Ester copolymer (EVA), polytetrafluoroethylene (PTFE) and other fluorine resins, acrylic resins, polyacrylates, polystyrene, polyvinyl chloride, polyvinylidene chloride and other resins. The above-mentioned resin film may be formed using a resin material containing one of such resins alone, or may be formed using a resin material in which two or more types are blended. The aforementioned resin film may be unstretched or stretched (for example, uniaxially stretched or biaxially stretched).

作為構成樹脂膜之樹脂材料之較佳例,可列舉聚酯系樹脂、聚醯亞胺系樹脂、PPS樹脂及聚烯烴系樹脂。此處,聚酯系樹脂係指以超過50重量%之比率含有聚酯之樹脂。同樣地,聚醯亞胺系樹脂係指以超過50重量%之比率含有聚醯亞胺之樹脂,PPS樹脂係指以超過50重量%之比率含有PPS之樹脂,聚烯烴系樹脂係指以超過50重量%之比率含有聚烯烴之樹脂。Preferred examples of the resin material constituting the resin film include polyester-based resins, polyimide-based resins, PPS resins, and polyolefin-based resins. Here, the polyester-based resin refers to a resin containing polyester in a ratio of more than 50% by weight. Similarly, a polyimide-based resin refers to a resin containing polyimide in a ratio exceeding 50% by weight, a PPS resin refers to a resin containing PPS in a ratio exceeding 50% by weight, and a polyolefin-based resin refers to a resin containing polyimide in a ratio exceeding 50% by weight. A resin containing polyolefin in a ratio of 50% by weight.

作為聚酯系樹脂,典型而言,使用含有將二羧酸與二醇進行縮聚所獲得之聚酯作為主成分之聚酯系樹脂。As the polyester-based resin, typically, a polyester-based resin containing, as a main component, a polyester obtained by polycondensing a dicarboxylic acid and a diol is used.

作為構成上述聚酯之二羧酸,例如可列舉:鄰苯二甲酸、間苯二甲酸、對苯二甲酸、2-甲基對苯二甲酸、5-磺基間苯二甲酸、4,4'-二苯基二羧酸、4,4'-二苯基醚二羧酸、4,4'-二苯基酮二羧酸、4,4'-二苯氧基乙烷二羧酸、4,4'-二苯基碸二羧酸、1,4-萘二羧酸、1,5-萘二羧酸、2,6-萘二羧酸、2,7-萘二羧酸等芳香族二羧酸;1,2-環己烷二羧酸、1,3-環己烷二羧酸、1,4-環己烷二羧酸等脂環式二羧酸;丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷酸等脂肪族二羧酸;順丁烯二酸、順丁烯二酸酐、反丁烯二酸等不飽和二羧酸;該等之衍生物(例如對苯二甲酸等上述二羧酸之低級烷基酯等)等。該等可單獨使用一種或將兩種以上組合而使用。就強度等觀點而言,較佳為芳香族二羧酸。其中,作為較佳之二羧酸,可列舉對苯二甲酸及2,6-萘二羧酸。例如較佳為構成上述聚酯之二羧酸中之50重量%以上(例如80重量%以上、典型為95重量%以上)為對苯二甲酸、2,6-萘二羧酸或該等之併用。上述二羧酸亦可實質上僅由對苯二甲酸構成、實質上僅由2,6-萘二羧酸構成、或實質上僅由對苯二甲酸及2,6-萘二羧酸構成。Examples of the dicarboxylic acid constituting the polyester include: phthalic acid, isophthalic acid, terephthalic acid, 2-methylterephthalic acid, 5-sulfoisophthalic acid, 4,4 '-Diphenyl dicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, 4,4'-diphenyl ketone dicarboxylic acid, 4,4'-diphenoxyethane dicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 1,4-naphthalene dicarboxylic acid, 1,5-naphthalene dicarboxylic acid, 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid and other aromatic Alicyclic dicarboxylic acids; 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid and other alicyclic dicarboxylic acids; malonic acid, succinate aliphatic dicarboxylic acids such as glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanoic acid; maleic acid, maleic anhydride, trans Unsaturated dicarboxylic acids such as butenedioic acid; their derivatives (for example, lower alkyl esters of the above-mentioned dicarboxylic acids such as terephthalic acid, etc.), etc. These can be used individually by 1 type or in combination of 2 or more types. From the viewpoints of strength and the like, aromatic dicarboxylic acids are preferred. Among these, terephthalic acid and 2,6-naphthalene dicarboxylic acid are mentioned as preferable dicarboxylic acid. For example, it is preferable that 50% by weight or more (for example, 80% by weight or more, typically 95% by weight or more) of the dicarboxylic acids constituting the polyester is terephthalic acid, 2,6-naphthalene dicarboxylic acid, or a combination thereof. and use. The above-mentioned dicarboxylic acid may consist substantially only of terephthalic acid, substantially only of 2,6-naphthalene dicarboxylic acid, or substantially only of terephthalic acid and 2,6-naphthalene dicarboxylic acid.

作為構成上述聚酯之二醇,例如可列舉:乙二醇、二乙二醇、聚乙二醇、丙二醇、聚丙二醇、1,3-丙烷二醇、1,5-戊二醇、新戊二醇、1,4-丁二醇、1,6-己二醇、1,8-辛二醇、聚氧四亞甲基二醇等脂肪族二醇;1,2-環己二醇、1,4-環己二醇、1,1-環己烷二羥甲基、1,4-環己烷二羥甲基等脂環式二醇、苯二甲醇、4,4'-二羥基聯苯、2,2-雙(4'-羥基苯基)丙烷、雙(4-羥基苯基)碸等芳香族二醇等。該等可單獨使用一種或將兩種以上組合而使用。其中,就透明性等觀點而言,較佳為脂肪族二醇,尤佳為乙二醇。脂肪族二醇(較佳為乙二醇)於構成上述聚酯之二醇中所占之比率較佳為50重量%以上(例如80重量%以上、典型為95重量%以上)。上述二醇亦可實質上僅由乙二醇構成。Examples of diols constituting the polyester include ethylene glycol, diethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, 1,3-propanediol, 1,5-pentanediol, neopentyl glycol, Diol, 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol, polyoxytetramethylene glycol and other aliphatic diols; 1,2-cyclohexanediol, 1,4-cyclohexanediol, 1,1-cyclohexanedimethylol, 1,4-cyclohexanedimethylol and other alicyclic diols, benzenedimethanol, 4,4'-dihydroxy Aromatic diols such as biphenyl, 2,2-bis(4'-hydroxyphenyl)propane, bis(4-hydroxyphenyl)pyridine, etc. These can be used individually by 1 type or in combination of 2 or more types. Among these, aliphatic diols are preferred, and ethylene glycol is particularly preferred from the viewpoint of transparency and the like. The ratio of the aliphatic diol (preferably ethylene glycol) to the diol constituting the polyester is preferably 50% by weight or more (for example, 80% by weight or more, typically 95% by weight or more). The above-mentioned diol may consist essentially only of ethylene glycol.

作為聚酯系樹脂之具體例,可列舉:聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、聚萘二甲酸乙二酯(PEN)、聚萘二甲酸丁二酯等。Specific examples of polyester-based resins include: polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyethylene naphthalate Butylene formate, etc.

作為聚烯烴樹脂,可單獨使用一種聚烯烴、或將兩種以上之聚烯烴組合而使用。該聚烯烴例如可為α-烯烴之均聚物、兩種以上之α-烯烴之共聚物、一種或兩種以上之α-烯烴與其他乙烯基單體之共聚物等。作為具體例,可列舉:聚乙烯(PE)、聚丙烯(PP)、聚-1-丁烯、聚-4-甲基-1-戊烯、乙烯丙烯橡膠(EPR)等乙烯-丙烯共聚物、乙烯-丙烯-丁烯共聚物、乙烯-丁烯共聚物、乙烯-乙烯醇共聚物、乙烯-丙烯酸乙酯共聚物等。可使用低密度(LD)聚烯烴及高密度(HD)聚烯烴之任一者。作為聚烯烴樹脂膜之例,可列舉:未延伸聚丙烯(CPP)膜、雙軸延伸聚丙烯(OPP)膜、低密度聚乙烯(LDPE)膜、直鏈狀低密度聚乙烯(LLDPE)膜、中密度聚乙烯(MDPE)膜、高密度聚乙烯(HDPE)膜、摻合有兩種以上之聚乙烯(PE)之聚乙烯(PE)膜、摻合有聚丙烯(PP)與聚乙烯(PE)之PP/PE摻合膜等。As the polyolefin resin, one kind of polyolefin may be used alone, or two or more kinds of polyolefins may be used in combination. The polyolefin can be, for example, a homopolymer of α-olefin, a copolymer of two or more α-olefins, a copolymer of one or more α-olefins and other vinyl monomers, and the like. Specific examples include ethylene-propylene copolymers such as polyethylene (PE), polypropylene (PP), poly-1-butene, poly-4-methyl-1-pentene, and ethylene-propylene rubber (EPR). , Ethylene-propylene-butene copolymer, ethylene-butene copolymer, ethylene-vinyl alcohol copolymer, ethylene-ethyl acrylate copolymer, etc. Either low density (LD) polyolefins or high density (HD) polyolefins may be used. Examples of polyolefin resin films include unstretched polypropylene (CPP) films, biaxially stretched polypropylene (OPP) films, low-density polyethylene (LDPE) films, and linear low-density polyethylene (LLDPE) films. , medium density polyethylene (MDPE) film, high density polyethylene (HDPE) film, polyethylene (PE) film blended with two or more polyethylene (PE), blended with polypropylene (PP) and polyethylene (PE) PP/PE blended film, etc.

作為聚醯亞胺樹脂膜之市售品,例如可列舉:Mitsubishi Gas Chemical公司製造之商品名「Neopulim」(S級、H級、R級等)、Toray-Dupont公司製造之商品名「Kapton」(H型、V型、VN型等)、宇部興產公司製造之商品名「Upilex」(S型、RN型等)、Kaneka公司製造之商品名「Apical」(AH型、NPH型等)、Toray公司製造之商品名「Kapton 100H」等。Examples of commercially available polyimide resin films include: Mitsubishi Gas Chemical Co., Ltd.'s product name "Neopulim" (S grade, H grade, R grade, etc.), Toray-Dupont company's product name "Kapton" (H type, V type, VN type, etc.), Ube Industries' trade name "Upilex" (S type, RN type, etc.), Kaneka's trade name "Apical" (AH type, NPH type, etc.), The trade name "Kapton 100H" manufactured by Toray Co., Ltd. and the like.

作為可良好地用作此處所揭示之補強膜之基底膜的樹脂膜之具體例,可列舉PET膜、PEN膜、PPS膜、PEEK膜、CPP膜及OPP膜。作為就強度或尺寸穩定性之觀點而言較佳之基底膜之例,可列舉PET膜、PEN膜、PPS膜及PEEK膜。就基材之獲取容易性等觀點而言,尤佳為PET膜及PPS膜,其中較佳為PET膜。Specific examples of the resin film that can be favorably used as the base film of the reinforcing film disclosed here include PET films, PEN films, PPS films, PEEK films, CPP films, and OPP films. Examples of preferred base films from the viewpoint of strength and dimensional stability include PET films, PEN films, PPS films, and PEEK films. From the viewpoint of the ease of acquisition of the substrate, etc., PET films and PPS films are particularly preferred, and PET films are particularly preferred.

於樹脂膜中,可於不明顯妨礙本發明之效果之範圍內,視需要調配光穩定劑、抗氧化劑、抗靜電劑、著色劑(染料、顏料等)、填充材、滑澤劑、抗黏連劑等公知之添加劑。添加劑之調配量並無特別限定,可根據補強膜之用途等而適當設定。In the resin film, light stabilizers, antioxidants, antistatic agents, colorants (dyes, pigments, etc.), fillers, slip agents, antisticking agents, etc. Known additives such as linking agents. The compounding quantity of an additive is not specifically limited, It can set suitably according to the use etc. of a reinforcement film.

樹脂膜之製造方法並無特別限定。例如可適當採用擠出成形、吹脹成形、T模壓鑄成形、砑光輥成形等先前公知之一般之樹脂膜成形方法。The manufacturing method of a resin film is not specifically limited. For example, conventionally known general resin film molding methods such as extrusion molding, inflation molding, T-die die casting molding, and calender roll molding can be suitably used.

上述基材可為實質上包含此種基底膜者。或者,上述基材亦可為除了包含上述基底膜以外,亦包含輔助層者。作為上述輔助層之例,可列舉:光學特性調整層(例如著色層、抗反射層)、用以對基材賦予所需之外觀之印刷層或層壓層、抗靜電層、底塗層、剝離層等表面處理層。The aforementioned base material may substantially include such a base film. Alternatively, the base material may also include an auxiliary layer in addition to the base film. Examples of the above-mentioned auxiliary layer include: an optical characteristic adjustment layer (such as a colored layer, an antireflection layer), a printing layer or a laminated layer for imparting a desired appearance to a base material, an antistatic layer, a primer layer, Surface treatment layer such as peeling layer.

構成此處所揭示之補強膜之基材之厚度例如可超過25 μm,典型為30 μm以上。基材之厚度較佳為35 μm以上,可為40 μm以上,可為50 μm以上(例如超過50 μm),可為60 μm以上,亦可為70 μm以上。根據更厚之基材,有發揮更高之補強性能之傾向。此處所揭示之補強膜亦可以基材之厚度為90 μm以上、或100 μm以上、或120 μm以上之態樣良好地實施。基材之厚度之上限並無特別限定。於若干種態樣中,就補強膜之操作性或加工性之觀點而言,基材之厚度例如可為500 μm以下,可為300 μm以下,可為250 μm以下,亦可為200 μm以下。就應用補強膜之製品之小型化或輕量化之觀點而言,於若干種態樣中,基材之厚度例如可為160 μm以下,可為130 μm以下,可為100 μm以下,可為90 μm以下,可為75 μm以下,亦可為60 μm以下。The thickness of the base material constituting the reinforcing film disclosed herein may exceed 25 μm, typically 30 μm or more. The thickness of the base material is preferably more than 35 μm, can be more than 40 μm, can be more than 50 μm (for example, more than 50 μm), can be more than 60 μm, or can be more than 70 μm. According to the thicker base material, there is a tendency to exert higher reinforcing performance. The reinforcing film disclosed here can also be implemented well in the form that the thickness of the base material is 90 μm or more, or 100 μm or more, or 120 μm or more. The upper limit of the thickness of the substrate is not particularly limited. In some aspects, the thickness of the base material may be, for example, 500 μm or less, 300 μm or less, 250 μm or less, or 200 μm or less from the viewpoint of the handleability or processability of the reinforcement film . From the viewpoint of miniaturization or weight reduction of products to which the reinforcing film is applied, in some aspects, the thickness of the base material may be, for example, 160 μm or less, 130 μm or less, 100 μm or less, or 90 μm. μm or less, may be 75 μm or less, or may be 60 μm or less.

視需要亦可對基材之第一面實施電暈放電處理、電漿處理、紫外線照射處理、酸處理、鹼處理、利用底塗劑(primer)之塗佈形成底塗層等先前公知之表面處理。此種表面處理可為用於提高黏著劑層對基材之抓固性之處理。即,上述表面處理可有助於容易獲得於基材之第一面固著有黏著劑層之第二面之補強膜。上述表面處理可單獨應用或組合應用。底塗層之形成所使用之底塗劑之組成並無特別限定,可自公知者中適當選擇。底塗層之厚度並無特別限制,通常適宜為0.01 μm~1 μm左右,較佳為0.1 μm~1 μm左右。作為視需要可對基材之第一面實施之其他處理,可列舉抗靜電層形成處理、著色層形成處理、印刷處理等。If necessary, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, primer coating and other previously known surfaces can be applied to the first surface of the substrate. deal with. Such surface treatment can be used to improve the grip of the adhesive layer on the substrate. That is, the above-mentioned surface treatment can help to easily obtain the reinforcing film on the second surface of the adhesive layer fixed on the first surface of the base material. The above surface treatments may be applied alone or in combination. The composition of the primer used for the formation of the primer layer is not particularly limited, and can be appropriately selected from known ones. The thickness of the undercoat layer is not particularly limited, and it is generally suitable to be about 0.01 μm to 1 μm, preferably about 0.1 μm to 1 μm. Examples of other treatments that may be performed on the first surface of the substrate as necessary include antistatic layer forming treatment, colored layer forming treatment, printing treatment, and the like.

於此處所揭示之補強膜為僅於基材之第一面具有黏著劑層之單面黏著片材之形態之情形時,亦可視需要對基材之第二面實施剝離處理或抗靜電處理等先前公知之表面處理。例如,於利用基材之第二面作為抵接於黏著面之剝離面之形態(捲筒形態、積層形態等)之補強膜中,為了將該第二面之水接觸角調整為100度以上、或本說明書所揭示之更佳範圍,可對上述第二面實施剝離處理。作為上述剝離處理之典型例,可列舉於基材之第二面形成利用剝離處理劑所獲得之剝離層之處理。又,於利用與基材不同之剝離襯墊之剝離面作為抵接於黏著面之剝離面之形態的補強膜中,亦可以提高對該第二面之印字性、降低光反射性、提高重疊貼合性等為目的對基材之第二面實施電暈放電處理、電漿處理、紫外線照射處理、酸處理、鹼處理等處理。When the reinforcing film disclosed here is in the form of a single-sided adhesive sheet with an adhesive layer only on the first side of the base material, the second side of the base material can also be subjected to peeling treatment or antistatic treatment if necessary. Previously known surface treatments. For example, in a reinforcing film in a form (roll form, laminated form, etc.) that uses the second surface of the substrate as the peeling surface that is in contact with the adhesive surface, in order to adjust the water contact angle of the second surface to 100 degrees or more , or in a more preferred range disclosed in this specification, the above-mentioned second surface may be subjected to a peeling treatment. As a typical example of the above-mentioned release treatment, a process of forming a release layer obtained by using a release treatment agent on the second surface of the base material is mentioned. In addition, in the form of a reinforcing film in which the release surface of the release liner different from the base material is used as the release surface abutting against the adhesive surface, the printing property to the second surface can be improved, the light reflectivity can be reduced, and the overlap can be improved. For the purpose of adhesion, etc., corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment and other treatments are carried out on the second surface of the substrate.

於此處所揭示之補強膜為於基材之第一面具有第一黏著劑層且於該基材之第二面具有第二黏著劑層的雙面黏著片材之形態之情形時,亦可視需要對基材之第二面實施與作為可對基材之第一面實施之表面處理而於上文中所例示者相同之表面處理。該表面處理可為用以提高第二黏著劑層對基材之抓固性之表面處理。再者,對基材之第一面實施之表面處理與對第二面實施之表面處理可相同亦可不同。When the reinforcing film disclosed here is in the form of a double-sided adhesive sheet having a first adhesive layer on the first surface of the substrate and a second adhesive layer on the second surface of the substrate, it can also be viewed as The second surface of the substrate needs to be subjected to the same surface treatment as that exemplified above as the surface treatment that can be applied to the first surface of the substrate. The surface treatment may be a surface treatment for improving the grip of the second adhesive layer on the substrate. Furthermore, the surface treatment performed on the first surface of the substrate may be the same as or different from the surface treatment performed on the second surface.

<補強膜> 此處所揭示之補強膜將黏著劑層之第二面固著於基材之第一面。上述固著係指於貼附於被黏著體後黏著力上升之補強膜中,黏著劑層對支持基材以不會因黏著劑層與支持基材之界面上之剝離而損及利用上述補強膜所獲得之補強功能之程度顯示出充分之抓固性。即便於補強膜貼附於被黏著體後,黏著面對被黏著體之黏著力上升,於黏著劑層對支持基材之抓固性不充分之補強膜中,亦無法使被黏著體與支持基材牢固地一體化,容易損及利用該補強膜所獲得之被黏著體之補強性能。於基材之第一面固著有黏著劑層之第二面的補強膜可有效地有助於被黏著體之補強。作為於基材之第一面固著有黏著劑層之第二面之補強膜之一較佳例,可列舉如下補強膜,即,於貼附於被黏著體後,表現出至少5 N/25 mm、較佳為10 N/25 mm以上、更佳為15 N/25 mm以上之黏著力(於剝離角度180度、拉伸速度300 mm/min之條件下測定之180°剝離黏著力),並且自上述被黏著體剝離時不會產生黏著劑層之第二面與支持基材之第一面之間的剝離(抓固破壞)。例如,加熱後黏著力為15 N/25 mm以上且於該加熱後黏著力之測定時不會產生抓固破壞的補強膜係屬於在基材之第一面固著有黏著劑層之第二面之補強膜之較佳例。<Reinforcing Film> The reinforcing film disclosed here fixes the second surface of the adhesive layer to the first surface of the substrate. The above-mentioned fixation means that in the reinforced film whose adhesive force increases after being attached to the adherend, the adhesive layer will not damage the use of the above-mentioned reinforcement due to the peeling of the interface between the adhesive layer and the supporting substrate. The degree of reinforcing function acquired by the film shows sufficient grip. Even if the adhesive strength of the adhesive surface to the adherend increases after the reinforcing film is attached to the adherend, in the reinforcing film with insufficient grip of the adhesive layer to the support substrate, the adherend cannot be connected to the support. The base material is firmly integrated, and it is easy to damage the reinforcing performance of the adherend obtained by using the reinforcing film. The reinforcement film on the second surface of the adhesive layer fixed on the first surface of the base material can effectively contribute to the reinforcement of the adherend. As one of the preferred examples of the reinforcement film on the second surface with the adhesive layer fixed on the first surface of the base material, the following reinforcement film can be cited, that is, after being attached to the adherend, it exhibits at least 5 N/ 25 mm, preferably 10 N/25 mm or more, more preferably 15 N/25 mm or more (180° peel adhesion measured at a peel angle of 180 degrees and a tensile speed of 300 mm/min) , and no peeling (grip failure) between the second surface of the adhesive layer and the first surface of the support substrate occurs when peeling from the above-mentioned adherend. For example, a reinforced film with an adhesive force of 15 N/25 mm or more after heating and which does not cause grasping failure during the measurement of the adhesive force after heating belongs to the second film with an adhesive layer fixed on the first surface of the substrate. A better example of the reinforcement film on the surface.

作為獲得於基材之第一面固著有黏著劑層之第二面的補強膜之方法,可列舉:如上所述使液狀之黏著劑組合物於基材之第一面上硬化而形成黏著劑層之方法、或對基材之第一面實施提高黏著劑層之抓固性之表面處理之方法等。藉由基材之材質之選擇、或黏著劑之組成之選擇,亦可提高黏著劑層對基材之抓固性。又,藉由對在基材之第一面上具有黏著劑層之補強膜應用高於室溫之溫度,可提高該黏著劑層對基材之抓固性。用於提高抓固性之溫度例如可為35℃~80℃左右,可為40℃~70℃以上左右,亦可為45℃~60℃左右。As a method of obtaining a reinforcing film on the second surface of the substrate with the adhesive layer fixed on the first surface, it is possible to cite the formation of a liquid adhesive composition that is hardened on the first surface of the substrate as described above. The method of the adhesive layer, or the method of applying surface treatment to the first surface of the base material to improve the grip of the adhesive layer, etc. By selecting the material of the base material or the composition of the adhesive, the gripping property of the adhesive layer on the base material can also be improved. Also, by applying a temperature higher than room temperature to the reinforcing film having the adhesive layer on the first surface of the substrate, the grip of the adhesive layer to the substrate can be improved. The temperature for improving the grip property may be, for example, about 35°C to 80°C, about 40°C to 70°C or higher, or about 45°C to 60°C.

此處所揭示之補強膜具有黏著劑層之第一面(黏著面)抵接於水接觸角100度以上之剝離面之形態。藉此,可有效地降低補強膜之保存條件對該補強膜之性能所造成之影響。認為,由於水接觸角100度以上之剝離面為低極性,故而藉由在使該剝離面抵接於黏著面之狀態下保存補強膜,無論保存條件如何(例如即便於貼附於被黏著體之狀態下保存於黏著力會上升之溫度區域),亦良好地促進或維持聚合物B偏靠於黏著劑層表面,表現出貼合初期之輕剝離性(低黏著性)。而且,認為於將補強膜之黏著面自上述剝離面分離而貼附於被黏著體後,即於黏著面抵接於被黏著體之狀態下,一般由於被黏著體之極性高於上述剝離面,故而藉由熱或隨著時間經過之黏著劑層內之物質移動或分子運動,黏著劑表面之聚合物B之存在量減少,藉此黏著力大幅地上升。但是,本發明之範圍並不限定於此。The reinforcing film disclosed here has a form in which the first surface (adhesive surface) of the adhesive layer abuts against the peeling surface with a water contact angle of 100 degrees or more. In this way, the influence of the preservation conditions of the reinforced membrane on the performance of the reinforced membrane can be effectively reduced. It is considered that since the peeling surface with a water contact angle of 100 degrees or more has low polarity, by storing the reinforcing film in a state where the peeling surface is in contact with the adhesive surface, no matter what the storage conditions are (for example, even when it is attached to an adherend Stored in a temperature region where the adhesive force will rise in the state of the adhesive), it also promotes or maintains the bias of the polymer B on the surface of the adhesive layer, showing the light peeling property (low adhesiveness) at the initial stage of lamination. In addition, it is considered that after the adhesive surface of the reinforcing film is separated from the above-mentioned peeling surface and attached to the adherend, that is, in the state where the adhesive surface is in contact with the adherend, the polarity of the adherend is generally higher than that of the above-mentioned peeling surface. Therefore, the presence of polymer B on the surface of the adhesive decreases due to heat or material movement or molecular movement in the adhesive layer over time, thereby greatly increasing the adhesive force. However, the scope of the present invention is not limited thereto.

上述水接觸角只要使用市售之接觸角測定裝置,依據JIS R 3257:1999進行測定即可(液滴法)。例如可於下述條件下測定水接觸角。測定較佳為進行5次,並採用其平均值(n=5)。關於下述實施例亦採用相同之方法。 [水接觸角測定條件] 測定裝置:接觸角測定器 DropMaster DM700(協和界面科學公司製造) 測定環境:23℃、50%RH 測定液體 :蒸餾水 測定時間:著滴1500 ms後The above-mentioned water contact angle may be measured in accordance with JIS R 3257: 1999 using a commercially available contact angle measuring device (drop method). For example, the water contact angle can be measured under the following conditions. The measurement is preferably carried out 5 times, and the average value (n=5) is used. The same method was also adopted for the following examples. [Water contact angle measurement conditions] Measuring device: Contact angle measuring device DropMaster DM700 (manufactured by Kyowa Interface Science Co., Ltd.) Measuring environment: 23°C, 50%RH Measuring liquid: Distilled water Measuring time: 1500 ms after the drop

於若干種態樣中,抵接於黏著面之剝離面之水接觸角例如可超過100度,可為102度以上,亦可為105度以上。剝離面之水接觸角之上限並無特別限制,就材料之獲取容易性等觀點而言,例如可為130度以下,可為120度以下,可為115度以下,亦可為110度以下。例如可良好地採用水接觸角為100度以上且110度以下之剝離面。In some aspects, the water contact angle of the peeling surface abutting against the adhesive surface may exceed 100 degrees, 102 degrees or more, or 105 degrees or more. The upper limit of the water contact angle of the peeling surface is not particularly limited, but from the viewpoint of the availability of materials, for example, it may be 130 degrees or less, 120 degrees or less, 115 degrees or less, or 110 degrees or less. For example, a peeling surface having a water contact angle of not less than 100° and not more than 110° can be preferably used.

於此處所揭示之補強膜之若干種態樣中,上述剝離面可為與支持基材不同之剝離襯墊之表面。作為剝離襯墊,並無特別限定,例如可使用於樹脂膜或紙(可為層壓有聚乙烯等樹脂之紙)等襯墊基材之表面具有剝離層之剝離襯墊、或包含由如氟系聚合物(聚四氟乙烯等)或聚烯烴系樹脂(聚乙烯、聚丙烯等)之低接著性材料所形成之樹脂膜之剝離襯墊等。就容易獲得水接觸角較大之剝離面之方面而言,較佳為於襯墊基材之表面具有剝離層之剝離襯墊。就表面平滑性優異而言,作為上述襯墊基材,較佳為樹脂膜。例如可良好地採用於聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚酯膜(PET膜、PBT膜等)、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯共聚物膜等樹脂膜之表面具有剝離層之剝離襯墊。In some aspects of the reinforcing film disclosed herein, the release surface may be the surface of a release liner different from the support substrate. The release liner is not particularly limited, and for example, a release liner having a release layer on the surface of a liner substrate such as a resin film or paper (it may be paper laminated with a resin such as polyethylene), or a release liner containing a material such as Fluoropolymer (PTFE, etc.) or polyolefin-based resin (polyethylene, polypropylene, etc.) low-adhesion materials for the release liner of the resin film, etc. A release liner having a release layer on the surface of the liner base is preferred in terms of easily obtaining a release surface with a large water contact angle. In terms of excellent surface smoothness, a resin film is preferable as the spacer base material. For example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyester film (PET film, PBT film, etc.), polyurethane film, ethylene-vinyl acetate copolymer film and other resin films have a release liner with a release layer on the surface.

抵接於黏著面之剝離面為剝離襯墊之表面的補強膜可作為包含該補強膜與提供上述剝離性表面之剝離襯墊的附剝離襯墊之補強膜之構成要素理解。因此,藉由本說明書,可提供一種包含此處所揭示之任一補強膜、與具有抵接於該補強膜之黏著面之剝離面之剝離襯墊的附剝離襯墊之補強膜。The reinforcement film whose release surface abutting against the adhesive surface is the surface of the release liner can be understood as a constituent element of a release liner-attached reinforcement film including this reinforcement film and a release liner providing the above-mentioned releasable surface. Therefore, according to the present specification, it is possible to provide a reinforcing film with a release liner comprising any of the reinforcing films disclosed herein, and a release liner having a release surface abutting against the adhesive surface of the reinforcing film.

剝離襯墊之厚度並無特別限定,通常適宜為5 μm~200 μm左右。若剝離襯墊之厚度處於上述範圍內,則對黏著劑層之貼合作業性與自黏著劑層之剝離作業性優異,故而較佳。於若干種態樣中,剝離襯墊之厚度例如可為10 μm以上,可為20 μm以上,可為30 μm以上,亦可為40 μm以上。又,就使自黏著劑層之剝離容易化之觀點而言,剝離襯墊之厚度例如可為100 μm以下,亦可為80 μm以下。對於剝離襯墊,視需要亦可實施塗佈型、混練型、蒸鍍型等公知之抗靜電處理。The thickness of the release liner is not particularly limited, but usually it is suitably about 5 μm to 200 μm. When the thickness of the release liner is within the above-mentioned range, it is preferable because the bonding workability to the adhesive layer and the peeling workability from the adhesive layer are excellent. In several aspects, the thickness of the release liner may be, for example, more than 10 μm, more than 20 μm, more than 30 μm, or more than 40 μm. In addition, the thickness of the release liner may be, for example, 100 μm or less, or may be 80 μm or less from the viewpoint of facilitating peeling from the adhesive layer. The release liner may be subjected to known antistatic treatment such as coating type, kneading type, vapor deposition type, etc. if necessary.

於此處所揭示之補強膜之若干種態樣中,上述剝離面可為支持基材之第二面。例如可利用藉由在上述基底膜之表面設置剝離層而將水接觸角調整為100度以上之支持基材之第二面作為抵接於黏著面之剝離面。In several aspects of the reinforcement film disclosed herein, the above-mentioned peeling surface may be the second surface of the supporting substrate. For example, the second surface of the supporting substrate whose water contact angle is adjusted to be 100 degrees or more by providing a release layer on the surface of the above-mentioned base film can be used as the release surface that abuts on the adhesive surface.

上述剝離層之形成例如可使用聚矽氧系剝離處理劑、長鏈烷基系剝離處理劑、烯烴系剝離處理劑、氟系剝離處理劑、脂肪酸醯胺系剝離處理劑等公知之剝離處理劑。其中較佳為聚矽氧系剝離處理劑。根據利用聚矽氧系剝離處理劑所形成之剝離層,與利用其他剝離處理劑所形成之剝離層相比,可以更高度之水準抑制因將使用前(貼附於被黏著體前)之補強膜保存於高於室溫之溫度區域所導致之初期黏著力之上升。例如即便將使用前之補強膜保存於更高溫度及/或以更長時間保存於高於室溫之溫度區域,亦可將初期黏著力抑制為較低。For the formation of the peeling layer, for example, known peeling agents such as silicone-based peeling agents, long-chain alkyl-based peeling agents, olefin-based peeling agents, fluorine-based peeling agents, and fatty acid amide-based peeling agents can be used. . Among them, a silicone-based peeling treatment agent is preferable. According to the peeling layer formed by the silicone-based peeling agent, compared with the peeling layer formed by other peeling agents, it is possible to suppress the reinforcement before use (before sticking to the adherend) at a higher level The increase of initial adhesion caused by the film being stored in a temperature region higher than room temperature. For example, even if the reinforced film before use is stored at a higher temperature and/or at a temperature region higher than room temperature for a longer period of time, the initial adhesive force can be suppressed to be low.

藉由利用X射線光電子光譜法(ESCA)對利用聚矽氧系剝離處理劑所形成之剝離層之表面進行測定,可算出關於該剝離層表面之矽原子(Si)之元素比率(atomic%)。於若干種態樣中,剝離層表面之Si之元素比率例如可為10 atomic%以上,可為15 atomic%以上,亦可為20 atomic%以上。又,上述Si之元素比率通常適宜為40 atomic%以下,可為30 atomic%以下,亦可為25 atomic%以下。於此處所揭示之補強膜中,作為使黏著面抵接之剝離面,可良好地採用具有表面之Si之元素比率(atomic%)為20 atomic%以上且25 atomic%以下之剝離層之剝離面。基於ESCA之剝離層表面之Si之元素比率之測定可藉由下述實施例所記載之方法進行。The elemental ratio (atomic%) of silicon atoms (Si) on the surface of the release layer can be calculated by measuring the surface of the release layer formed with a polysiloxane release treatment agent by X-ray photoelectron spectroscopy (ESCA) . In several aspects, the element ratio of Si on the surface of the release layer may be, for example, 10 atomic% or more, 15 atomic% or more, or 20 atomic% or more. In addition, the element ratio of the above-mentioned Si is usually suitably 40 atomic% or less, may be 30 atomic% or less, and may be 25 atomic% or less. In the reinforcing film disclosed here, as the peeling surface to be brought into contact with the adhesive surface, a peeling surface having a peeling layer having a surface Si element ratio (atomic%) of 20 atomic% or more and 25 atomic% or less can be preferably used. . The measurement of the elemental ratio of Si on the surface of the peeling layer by ESCA can be performed by the method described in the following examples.

又,於若干種態樣中,上述剝離層可為利用非聚矽氧系剝離處理劑所形成之剝離層。具有此種剝離層之剝離面例如可良好地用作抵接於在擔心未硬化之聚矽氧系剝離處理劑對被黏著體之附著之領域可使用之補強膜之黏著面的剝離面。非聚矽氧系剝離處理劑之具體例包含長鏈烷基系剝離處理劑、烯烴系剝離處理劑及氟系剝離處理劑。作為較佳之非聚矽氧系剝離處理劑,可例示長鏈烷基系剝離處理劑及烯烴系剝離處理劑。其中較佳為長鏈烷基系剝離處理劑。In addition, in some aspects, the above-mentioned release layer may be a release layer formed using a non-polysiloxane-based release treatment agent. The peeling surface having such a peeling layer can be favorably used as, for example, a peeling surface abutting against an adhesive surface of a reinforcing film used in a field where adhesion of an uncured silicone-based peeling treatment agent to an adherend is concerned. Specific examples of the non-silicone-based release treatment agent include long-chain alkyl-based release treatment agents, olefin-based release treatment agents, and fluorine-based release treatment agents. Examples of preferable non-silicone-based release treatment agents include long-chain alkyl-based release treatment agents and olefin-based release treatment agents. Among them, long-chain alkyl-based peeling treatment agents are preferred.

此處所揭示之補強膜藉由將其黏著面抵接於水接觸角為100度以上之剝離面,無論該補強膜之保存條件如何,例如即便保存於高於室溫之溫度區域,亦可將上述黏著面自上述剝離面之剝離力(以下亦稱為「襯墊剝離力」或簡稱為「剝離力」)維持為較低。若上述剝離力變得過高,則可能產生補強膜對被黏著體貼附時之作業負擔增加、或因將黏著面自剝離面剝離所導致之該黏著面之表面粗糙度降低等不良情況。藉由使水接觸角100度以上之剝離面抵接於黏著面,可有效地抑制補強膜之保存中之剝離力之上升。根據具有利用聚矽氧系剝離處理劑所形成之剝離層之剝離面,有發揮特別優異之剝離力上升抑制效果之傾向。The reinforced film disclosed here can be used regardless of the storage conditions of the reinforced film by abutting its adhesive surface on the peeling surface with a water contact angle of 100 degrees or more, for example, even if it is stored in a temperature region higher than room temperature. The peeling force of the above-mentioned adhesive surface from the above-mentioned peeling surface (hereinafter also referred to as "liner peeling force" or simply "peeling force") is kept low. If the above-mentioned peeling force becomes too high, there may be problems such as an increase in the workload when the reinforcing film is attached to the adherend, or a decrease in the surface roughness of the adhesive surface due to peeling the adhesive surface from the peeling surface. By bringing the peeling surface with a water contact angle of 100 degrees or more into contact with the adhesive surface, the increase in the peeling force during storage of the reinforced film can be effectively suppressed. Depending on the peeling surface having a peeling layer formed with a silicone-based peeling treatment agent, there is a tendency to exhibit a particularly excellent effect of suppressing an increase in peeling force.

剝離層之厚度並無特別限制,通常適宜為0.01 μm~1 μm左右,較佳為0.1 μm~1 μm左右。剝離層之形成方法並無特別限定,可適當採用與所使用之剝離處理劑之種類等對應之公知方法。The thickness of the peeling layer is not particularly limited, and it is usually suitably about 0.01 μm to 1 μm, preferably about 0.1 μm to 1 μm. The method for forming the release layer is not particularly limited, and a known method corresponding to the type of the release treatment agent to be used can be appropriately employed.

此處所揭示之補強膜之厚度例如可超過30 μm。就提高補強效果之觀點而言,於若干種態樣中,補強膜之厚度例如可為50 μm以上,可為60 μm以上,可為80 μm以上,可為100 μm以上,亦可為130 μm以上。補強膜之厚度之上限並無特別限定。補強膜之厚度例如可為1000 μm以下,可為600 μm以下,可為350 μm以下,亦可為250 μm以下。就應用補強膜之製品之小型化、輕量化、薄型化等觀點而言,於若干種態樣中,補強膜之厚度例如可為200 μm以下,可為175 μm以下,可為140 μm以下,可為120 μm以下,可為100 μm以下(例如未達100 μm),亦可為80 μm以下。 再者,補強膜之厚度係指貼附於被黏著體之部分之厚度。例如於圖1所示之構成之補強膜1中,係指自補強膜1之黏著面21A至基材10之第二面10B為止之厚度,不包含剝離襯墊31之厚度。The thickness of the reinforcing film disclosed herein may exceed 30 μm, for example. From the viewpoint of enhancing the reinforcing effect, in some aspects, the thickness of the reinforcing film can be, for example, 50 μm or more, 60 μm or more, 80 μm or more, 100 μm or more, or 130 μm above. The upper limit of the thickness of the reinforcing film is not particularly limited. The thickness of the reinforcing film may be, for example, 1000 μm or less, 600 μm or less, 350 μm or less, or 250 μm or less. From the perspective of miniaturization, weight reduction, and thinning of products to which the reinforcing film is applied, the thickness of the reinforcing film may be, for example, 200 μm or less, 175 μm or less, or 140 μm or less in several forms. It may be 120 μm or less, may be 100 μm or less (for example, less than 100 μm), or may be 80 μm or less. Furthermore, the thickness of the reinforcing film refers to the thickness of the part attached to the adherend. For example, in the reinforcement film 1 having the structure shown in FIG. 1 , it refers to the thickness from the adhesive surface 21A of the reinforcement film 1 to the second surface 10B of the substrate 10 , excluding the thickness of the release liner 31 .

此處所揭示之補強膜可以支持基材之厚度Ts大於黏著劑層之厚度Ta之態樣良好地實施。即,較佳為Ts/Ta大於1。Ts/Ta例如可為1.1以上,可為1.2以上,可為1.5以上,亦可為1.7以上,但並無特別限定。藉由增大Ts/Ta,有即便將補強膜薄型化亦容易發揮良好之補強性能之傾向。於若干種態樣中,Ts/Ta可為2以上(例如大於2),可為3以上,亦可為4以上。又,Ts/Ta例如可設為50以下,亦可設為20以下。就即便將補強膜薄型化亦容易發揮較高之加熱後黏著力之觀點而言,Ts/Ta例如可為10以下,亦可為8以下。The reinforcing film disclosed here can be well implemented in a state where the thickness Ts of the support substrate is greater than the thickness Ta of the adhesive layer. That is, Ts/Ta is preferably larger than 1. Ts/Ta may be, for example, 1.1 or more, 1.2 or more, 1.5 or more, or 1.7 or more, but it is not particularly limited. By increasing Ts/Ta, it tends to be easy to exhibit good reinforcing performance even if the reinforcing film is thinned. In several aspects, Ts/Ta may be 2 or more (for example, greater than 2), may be 3 or more, or may be 4 or more. Moreover, Ts/Ta may be set to 50 or less, for example, and may be set to 20 or less. Ts/Ta may be, for example, 10 or less, or may be 8 or less from the viewpoint of easily exhibiting high post-heating adhesive force even if the reinforcing film is thinned.

<補強膜之特性> 此處所揭示之補強膜由於黏著力N2(加熱後黏著力)相對於黏著力N1(初期黏著力)之比、即黏著力上升比(N2/N1)為10以上,故而可於初期發揮低黏著性,於被黏著體之使用時發揮對該被黏著體之強黏著性。藉此,可良好地兼顧良好之二次加工性與較高之補強性能。就獲得更高之效果之觀點而言,於若干種態樣中,黏著力上升比較佳為15以上,可為18以上,可為20以上,亦可為25以上。黏著力上升比之上限並無特別限制,就補強膜之製造容易性或經濟性之觀點而言,例如可為100以下,可為80以下,亦可為60以下。此處所揭示之補強膜可以黏著力上升比例如為10以上且80以下、或15以上且60以下之態樣良好地實施。<Characteristics of the reinforced film> The reinforced film disclosed here has a ratio of the adhesive force N2 (adhesion after heating) to the adhesive force N1 (initial adhesive force), that is, the increase ratio of the adhesive force (N2/N1), which is 10 or more. It can exhibit low adhesiveness at the initial stage, and exert strong adhesiveness to the adherend when the adherend is used. In this way, good secondary processability and high reinforcement performance can be well balanced. From the viewpoint of obtaining a higher effect, in some aspects, the adhesion strength increase ratio is preferably 15 or more, may be 18 or more, may be 20 or more, and may be 25 or more. The upper limit of the adhesion increase ratio is not particularly limited, and may be, for example, 100 or less, 80 or less, or 60 or less from the viewpoint of ease of manufacture of the reinforcing film or economical efficiency. The reinforcing film disclosed here can be implemented favorably in the form of an adhesive strength increase ratio of, for example, 10 to 80, or 15 to 60.

上述黏著力上升比係以加熱後黏著力[N/25 mm]相對於初期黏著力[N/25 mm]之比之形式定義,初期黏著力係藉由如下方式獲得,即,於壓接於作為被黏著體之不鏽鋼(SUS)板並於23℃、50%RH之環境下放置30分鐘後,於剝離角度180度、拉伸速度300 mm/min之條件下測定180°剝離黏著力。又,加熱後黏著力[N/25 mm]係藉由如下方式獲得,即,壓接於作為被黏著體之SUS板並於80℃下加熱5分鐘,繼而於23℃、50%RH之環境下放置30分鐘後,於剝離角度180度、拉伸速度300 mm/min之條件下測定180°剝離黏著力。作為被黏著體,初期黏著力、加熱後黏著力均使用SUS304BA板。上述初期黏著力及加熱後黏著力之測定方法可應用於第一黏著面及第二黏著面之任一者。初期黏著力及加熱後黏著力更具體而言可依據下述實施例所記載之方法進行測定。The above adhesion increase ratio is defined in the form of the ratio of the adhesion after heating [N/25 mm] to the initial adhesion [N/25 mm]. The initial adhesion is obtained by The stainless steel (SUS) plate as the adherend was placed in an environment of 23°C and 50% RH for 30 minutes, and the 180° peel adhesion was measured under the conditions of a peeling angle of 180° and a tensile speed of 300 mm/min. Also, the adhesive force after heating [N/25 mm] was obtained by crimping the SUS plate as the adherend and heating at 80°C for 5 minutes, and then in an environment of 23°C and 50%RH After standing in the air for 30 minutes, measure the 180° peel adhesion under the conditions of a peel angle of 180° and a tensile speed of 300 mm/min. As the adherend, SUS304BA board is used for both the initial adhesion and the adhesion after heating. The methods for measuring the initial adhesive force and the adhesive force after heating can be applied to any one of the first adhesive surface and the second adhesive surface. More specifically, the initial adhesive force and the adhesive force after heating can be measured according to the method described in the following examples.

於此處所揭示之補強膜之若干種態樣中,該補強膜之初期黏著力例如可為2.0 N/25 mm以下,可未達1.5 N/25 mm,可為1.2 N/25 mm以下,可為1.0 N/25 mm以下,亦可為0.8 N/25 mm以下,但並無特別限定。初期黏著力較低就二次加工性之觀點而言亦較佳。初期黏著力之下限並無特別限制,例如可為0.01 N/25 mm以上。就對被黏著體之貼附作業性、或防止黏著力上升前之位置偏移等觀點而言,初期黏著力通常適宜為0.1 N/25 mm以上。於若干種態樣中,初期黏著力例如可為0.2 N/25 mm以上,可為0.3 N/25 mm以上,可為0.4 N/25 mm以上,亦可為0.5 N/25 mm以上。In several forms of the reinforced film disclosed here, the initial adhesive force of the reinforced film may be, for example, less than 2.0 N/25 mm, less than 1.5 N/25 mm, less than 1.2 N/25 mm, or less than 1.2 N/25 mm. It may be 1.0 N/25 mm or less, and may be 0.8 N/25 mm or less, but it is not particularly limited. Lower initial adhesion is also preferable from the viewpoint of secondary processability. The lower limit of the initial adhesion force is not particularly limited, for example, it may be 0.01 N/25 mm or more. From the standpoint of attaching workability to the adherend or preventing positional shift before the adhesive force increases, the initial adhesive force is usually more than 0.1 N/25 mm. In some aspects, the initial adhesion force may be, for example, not less than 0.2 N/25 mm, not less than 0.3 N/25 mm, not less than 0.4 N/25 mm, or not less than 0.5 N/25 mm.

於此處所揭示之補強膜之若干種態樣中,該補強膜之加熱後黏著力例如可為5.0 N/25 mm以上,可為7.0 N/25 mm以上,可為10 N/25 mm以上,可為13 N/25 mm以上,可為15 N/25 mm以上,亦可為17 N/25 mm以上,但並無特別限定。顯示出更高之加熱後黏著力就提高補強性能之觀點而言較佳。加熱後黏著力之上限並無特別限制。就補強膜之製造容易性或經濟性之觀點而言,於若干種態樣中,加熱後黏著力例如可為50 N/25 mm以下,可為40 N/25 mm以下,可為35 N/25 mm以下,亦可為30 N/25 mm以下。In several aspects of the reinforced film disclosed here, the adhesive force of the reinforced film after heating may be, for example, not less than 5.0 N/25 mm, not less than 7.0 N/25 mm, or not less than 10 N/25 mm, It may be 13 N/25 mm or more, 15 N/25 mm or more, or 17 N/25 mm or more, but it is not particularly limited. It is preferable to exhibit higher adhesive force after heating from the viewpoint of improving reinforcing performance. The upper limit of the adhesive force after heating is not particularly limited. From the standpoint of ease of manufacture or economical efficiency of the reinforcing film, in some aspects, the adhesive force after heating can be, for example, 50 N/25 mm or less, 40 N/25 mm or less, and 35 N/25 mm or less. 25 mm or less, or 30 N/25 mm or less.

再者,此處所揭示之補強膜之加熱後黏著力係表示該補強膜之一特性者,且並不限定該補強膜之使用態樣。換言之,此處所揭示之補強膜之使用態樣並不限定於在80℃下進行5分鐘加熱之態樣,例如亦可用於未特別進行加熱至室溫區域(通常為20℃~30℃、典型為23℃~25℃)之處理之態樣。於該使用態樣中,亦可使黏著力長期地上升,實現牢固之接合。又,此處所揭示之補強膜可藉由在貼附後之任意時刻進行加熱處理而促進黏著力之上升。該加熱處理中之加熱溫度並無特別限定,可考慮作業性、經濟性、補強膜之基材或被黏著體之耐熱性等而設定。上述加熱溫度例如可未達150℃,可為120℃以下,可為100℃以下,可為80℃以下,亦可為70℃以下。又,上述加熱溫度例如可設為35℃以上、50℃以上或60℃以上,可設為80℃以上,亦可設為100℃以上。基於更高之加熱溫度,可藉由更短時間之處理而使黏著力上升。加熱時間並無特別限定,例如可為1小時以下,可為30分鐘以下,可為10分鐘以下,亦可為5分鐘以下。或者,亦可於補強膜或被黏著體不產生顯著之熱劣化之限度內,進行更長時間之加熱處理。再者,加熱處理可一次進行,亦可分為複數次進行。Furthermore, the adhesive force after heating of the reinforced film disclosed here is a characteristic of the reinforced film, and does not limit the usage of the reinforced film. In other words, the use of the reinforced film disclosed here is not limited to the state of heating at 80°C for 5 minutes, for example, it can also be used in a region where it is not specially heated to room temperature (usually 20°C to 30°C, typically It is a state of treatment at 23°C to 25°C). In this mode of use, the adhesive force can also be increased for a long time to achieve a firm joint. In addition, the reinforcing film disclosed here can promote the increase of adhesive force by performing heat treatment at any time after attachment. The heating temperature in this heat treatment is not particularly limited, and can be set in consideration of workability, economical efficiency, the heat resistance of the substrate of the reinforcing film, the adherend, and the like. The above-mentioned heating temperature may be, for example, less than 150°C, may be 120°C or lower, may be 100°C or lower, may be 80°C or lower, and may be 70°C or lower. In addition, the above heating temperature may be, for example, 35°C or higher, 50°C or higher, or 60°C or higher, may be 80°C or higher, or may be 100°C or higher. Based on the higher heating temperature, the adhesion can be increased by shorter treatment time. The heating time is not particularly limited, and may be, for example, 1 hour or less, 30 minutes or less, 10 minutes or less, or 5 minutes or less. Alternatively, the heat treatment may be performed for a longer time within the limit that the reinforcing film or the adherend does not undergo significant thermal deterioration. In addition, heat processing may be performed once, and may be divided into plural times and performed.

於若干種態樣中,補強膜之黏著面自剝離面之剝離力通常適宜為1.5 N/25 mm以下,較佳為1.0 N/25 mm以下,更佳為0.5 N/25 mm以下,進而較佳為0.3 N/25 mm以下。剝離力較低就減輕自黏著面剝離剝離面時之作業負擔、或維持黏著面之平滑性之觀點而言較佳。於若干種態樣中,上述剝離力例如可為0.2 N/25 mm以下,可為0.1 N/25 mm以下,亦可為0.08 N/25 mm以下或0.06 N/25 mm以下。又,就抑制於補強膜貼附於被黏著體前黏著面自剝離面非意圖性地隆起之現象之觀點而言,上述剝離力例如可為0.005 N/25 mm以上,可為0.01 N/25 mm,亦可為0.015 N/25 mm以上。In several aspects, the peeling force of the adhesive surface of the reinforcing film from the peeling surface is generally suitable to be 1.5 N/25 mm or less, preferably 1.0 N/25 mm or less, more preferably 0.5 N/25 mm or less, and even more preferably Preferably it is less than 0.3 N/25 mm. A low peeling force is preferable from the viewpoint of reducing the workload when peeling the peeling surface from the adhesive surface or maintaining the smoothness of the adhesive surface. In several aspects, the above-mentioned peeling force may be, for example, less than 0.2 N/25 mm, less than 0.1 N/25 mm, less than 0.08 N/25 mm, or less than 0.06 N/25 mm. In addition, from the viewpoint of suppressing the phenomenon that the adhesive surface unintentionally bulges from the peeling surface before the reinforcing film is attached to the adherend, the above-mentioned peeling force may be, for example, 0.005 N/25 mm or more, and may be 0.01 N/25 mm or more. mm, or more than 0.015 N/25 mm.

根據此處所揭示之技術,可提供一種補強膜,其於在60℃、90%RH之條件下保存7天(以下亦稱為「基於條件1之保存」)後,黏著面自剝離面之剝離力為2.0 N/25 mm以下。於若干種態樣中,上述基於條件1之保存後之剝離力例如可為1.5 N/25 mm以下,可為1.0 N/25 mm以下,可為0.5 N/25 mm以下,可為0.3 N/25 mm以下,可為0.1 N/25 mm以下,亦可為0.08 N/25 mm以下。又,上述基於條件1之保存後之剝離力例如可為0.005 N/25 mm以上,可為0.01 N/25 mm,亦可為0.015 N/25 mm以上。上述基於條件1之保存後之剝離力相對於保存前之剝離力的比較小之補強膜由於因保存所產生之剝離性能之變動較少,故而較佳。According to the technology disclosed here, it is possible to provide a reinforced film which, after being stored at 60°C and 90%RH for 7 days (hereinafter also referred to as "storage based on condition 1"), has no peeling of the adhesive surface from the peeling surface. The force is 2.0 N/25 mm or less. In several aspects, the peeling force after storage based on the above condition 1 may be, for example, 1.5 N/25 mm or less, 1.0 N/25 mm or less, 0.5 N/25 mm or less, or 0.3 N/25 mm or less. 25 mm or less, may be 0.1 N/25 mm or less, or 0.08 N/25 mm or less. In addition, the peel force after storage based on the above condition 1 may be, for example, 0.005 N/25 mm or more, 0.01 N/25 mm, or 0.015 N/25 mm or more. The reinforcing film whose peeling force after storage based on condition 1 is relatively small compared to the peeling force before storage is preferable because there is little change in peeling performance due to storage.

上述基於條件1之保存後之剝離力較佳為保存前之剝離力之5倍以下(例如0.5倍以上且5倍以下),更佳為3倍以下。於若干種態樣中,上述基於條件1之保存後之剝離力可為保存前之剝離力之3倍以下、2倍以下、1.5倍以下或1.3倍以下。又,上述基於條件1之保存後之剝離力與保存前之剝離力之差較佳為1.0 N/25 mm以下,亦可為0.5 N/25 mm以下、0.1 N/25 mm以下、0.05 N/25 mm或0.03 N/25 mm以下。上述基於條件1之保存後之剝離力與保存前之剝離力的差較小之補強膜由於因保存所產生之剝離性能之變動較少,故而較佳。The peeling force after storage based on the above-mentioned condition 1 is preferably 5 times or less (for example, 0.5 times or more and 5 times or less) of the peeling force before storage, more preferably 3 times or less. In several aspects, the peeling force after storage based on the above condition 1 may be 3 times or less, 2 times or less, 1.5 times or less, or 1.3 times or less the peeling force before storage. In addition, the difference between the peel force after storage and the peel force before storage based on the above-mentioned condition 1 is preferably 1.0 N/25 mm or less, and may be 0.5 N/25 mm or less, 0.1 N/25 mm or less, 0.05 N/25 mm or less, or 0.05 N/25 mm or less. 25 mm or less than 0.03 N/25 mm. The reinforcing film having a small difference between the peeling force after storage and the peeling force before storage based on the above-mentioned condition 1 is preferable because there is little change in peeling performance due to storage.

根據此處所揭示之技術,可提供一種補強膜,其於在85℃之條件下保存7天(以下亦稱為「基於條件2之保存」)後,剝離面自黏著面之剝離力為2.0 N/25 mm以下。於若干種態樣中,上述基於條件2之保存後之剝離力例如可為1.5 N/25 mm以下,可為1.0 N/25 mm以下,可為0.5 N/25 mm以下,可為0.3 N/25 mm以下,可為0.1 N/25 mm以下,亦可為0.08 N/25 mm以下。又,上述基於條件2之保存後之剝離力例如可為0.005 N/25 mm以上,可為0.01 N/25 mm,亦可為0.015 N/25 mm以上。上述基於條件2之保存後之剝離力相對於保存前之剝離力的比較小之補強膜由於因保存所產生之剝離性能之變動較少,故而較佳。According to the technology disclosed here, it is possible to provide a reinforced film whose peeling force from the adhesive surface is 2.0 N after being stored at 85°C for 7 days (hereinafter also referred to as "storage based on condition 2") /25 mm or less. In several aspects, the peeling force after storage based on the above condition 2 may be, for example, 1.5 N/25 mm or less, 1.0 N/25 mm or less, 0.5 N/25 mm or less, or 0.3 N/25 mm or less. 25 mm or less, may be 0.1 N/25 mm or less, or 0.08 N/25 mm or less. In addition, the peeling force after storage based on the above condition 2 may be, for example, 0.005 N/25 mm or more, 0.01 N/25 mm, or 0.015 N/25 mm or more. The reinforcing film whose peeling force after storage based on condition 2 is relatively small compared to the peeling force before storage is preferable because there is little change in peeling performance due to storage.

上述基於條件2之保存後之剝離力較佳為保存前之剝離力之5倍以下(例如為0.5倍以上且5倍以下),更佳為3倍以下。於若干種態樣中,上述基於條件2之保存後之剝離力可為保存前之剝離力之3倍以下、2倍以下、1.5倍以下或1.3倍以下。又,上述基於條件2之保存後之剝離力與保存前之剝離力之差較佳為1.0 N/25 mm以下,可為0.5 N/25 mm以下,可為0.1 N/25 mm以下,亦可為0.05 N/25 mm或0.03 N/25 mm以下。上述基於條件2之保存後之剝離力與保存前之剝離力的差較小之補強膜由於因保存所產生之剝離性能之變動較少,故而較佳。The peeling force after storage based on the above condition 2 is preferably 5 times or less (for example, 0.5 times or more and 5 times or less) of the peeling force before storage, more preferably 3 times or less. In several aspects, the peeling force after storage based on the above condition 2 may be 3 times or less, 2 times or less, 1.5 times or less, or 1.3 times or less the peeling force before storage. In addition, the difference between the peeling force after storage and the peeling force before storage based on the above-mentioned condition 2 is preferably 1.0 N/25 mm or less, may be 0.5 N/25 mm or less, may be 0.1 N/25 mm or less, or may be 0.05 N/25 mm or less than 0.03 N/25 mm. The reinforcing film having a small difference between the peeling force after storage and the peeling force before storage based on the above-mentioned condition 2 is preferable because there is little change in peeling performance due to storage.

根據此處所揭示之技術之若干種態樣,可提供一種補強膜,其於上述基於條件1之保存後,黏著力上升比為10倍以上、或滿足上述其他任一較佳之黏著力上升比。上述基於條件1之保存後之補強膜之黏著力上升比例如可為保存前之黏著力上升比之0.8倍~3倍左右,可為1.0倍~2.5倍左右,可為1.1倍~2.5倍左右,亦可為1.2倍~2.0倍左右。According to several aspects of the technology disclosed here, a reinforced film can be provided which, after storage based on the above-mentioned condition 1, has an increase ratio of adhesion force of 10 times or more, or satisfies any other preferred increase ratio of adhesion force mentioned above. The adhesion increase ratio of the reinforced film after storage based on the above-mentioned condition 1 may be, for example, about 0.8 to 3 times, about 1.0 to 2.5 times, or about 1.1 to 2.5 times the increase ratio of the adhesion before storage. , It can also be about 1.2 times to 2.0 times.

根據此處所揭示之技術之若干種態樣,可提供一種補強膜,其於上述基於條件2之保存後,黏著力上升比為10倍以上、或滿足上述其他任一較佳之黏著力上升比。上述基於條件2之保存後之補強膜之黏著力上升比例如可為保存前之黏著力上升比之0.8倍~3倍左右,可為1.0倍~2.5倍左右,可為1.1倍~2.5倍左右,亦可為1.2倍~2.0倍左右。According to several aspects of the technology disclosed here, a reinforced film can be provided, which, after storage based on the above-mentioned condition 2, has an increase ratio of adhesion force of 10 times or more, or satisfies any other preferred increase ratio of adhesion force mentioned above. The adhesion increase ratio of the reinforced film after storage based on the above-mentioned condition 2 may be, for example, about 0.8 to 3 times, about 1.0 to 2.5 times, or about 1.1 to 2.5 times the increase ratio of the adhesion before storage. , It can also be about 1.2 times to 2.0 times.

於此處所揭示之補強膜為具有設置於基材之第一面之第一黏著劑層與設置於該基材之第二面之第二黏著劑層之補強膜(即雙面接著性之補強膜)的形態之情形時,第一黏著劑層與第二黏著劑層可為相同之構成,亦可為不同之構成。於第一黏著劑層與第二黏著劑層之構成不同之情形時,該不同例如可為組成之不同或結構(厚度、表面粗糙度、形成範圍、形成圖案等)之不同。上述雙面接著性補強膜只要至少第一黏著劑層之第二面固著於支持基材之第一面,該第一黏著劑層之第一面(第一黏著面)抵接於水接觸角100度以上之剝離面,且上述第一黏著面之黏著力上升比為10以上即可,第二黏著劑層側之特性並無特別限定。例如,第二黏著劑層亦可為不含聚合物B之黏著劑層。又,第二黏著劑層之表面(第二黏著面)之黏著力上升比可未達10,可未達5,亦可未達2。The reinforcing film disclosed here is a reinforcing film having a first adhesive layer disposed on a first surface of a substrate and a second adhesive layer disposed on a second surface of the substrate (i.e. double-sided adhesive reinforcement) In the case of the form of a film), the first adhesive layer and the second adhesive layer may have the same configuration or different configurations. When the composition of the first adhesive layer and the second adhesive layer are different, the difference may be, for example, a difference in composition or a difference in structure (thickness, surface roughness, formation range, formation pattern, etc.). As long as at least the second side of the first adhesive layer is fixed on the first side of the support substrate, the first side (first adhesive side) of the first adhesive layer is in contact with water. The peeling surface with an angle of 100 degrees or more, and the adhesive strength increase ratio of the above-mentioned first adhesive surface is 10 or more, and the characteristics of the second adhesive layer side are not particularly limited. For example, the second adhesive layer may also be an adhesive layer not containing the polymer B. In addition, the adhesive strength increase ratio of the surface of the second adhesive layer (second adhesive surface) may be less than 10, may be less than 5, or may be less than 2.

<用途> 由本說明書提供之補強膜例如於貼合於被黏著體後,於室溫區域(例如20℃~30℃)在短時間內將黏著力抑制為較低,其間可發揮良好之二次加工性,因此可有助於良率之抑制或包含該補強膜之製品之高品質化。而且,上述補強膜藉由熟化(可為加熱、經時、該等之組合等)可使黏著力大幅地上升,其後藉由使支持基材與被黏著體牢固地一體化而可發揮良好之補強效果。例如藉由在期望之時刻進行加熱,可使補強膜牢固地接著於被黏著體,而使支持基材與被黏著體牢固地一體化。又,上述補強膜之保存穩定性優異,例如即便保存於高於室溫之溫度區域,亦可穩定地發揮所需之性能。利用此種特徵,此處所揭示之補強膜可於各種領域用於各種製品中所含之構件之補強。<Applications> For example, after the reinforced film provided by this manual is pasted on the adherend, the adhesive force can be suppressed to be low in a short period of time in the room temperature region (such as 20°C to 30°C), and a good secondary performance can be exerted during the period. Processability, therefore, can contribute to the suppression of yield and the improvement of the quality of products including the reinforced film. Moreover, the above-mentioned reinforcing film can greatly increase the adhesive force by curing (heating, time, a combination of these, etc.), and then can perform well by firmly integrating the support base material and the adherend. The reinforcing effect. For example, by heating at a desired timing, the reinforcing film can be firmly attached to the adherend, and the support base and the adherend can be firmly integrated. In addition, the above-mentioned reinforced film is excellent in storage stability, for example, it can stably exhibit desired performance even if it is stored in a temperature region higher than room temperature. Utilizing such characteristics, the reinforcing film disclosed herein can be used in various fields to reinforce components contained in various products.

例如關於用於光學製品之光學構件、或用於電子製品之電子構件,高度之積體化、小型輕量化、薄型化不斷發展,可積層線膨脹係數或厚度不同之複數個較薄之光學構件/電子構件。藉由在此種構件貼附補強膜,可對上述光學構件/電子構件賦予適度之剛性。藉此,於製造製程及/或製造後之製品中,可抑制因於上述線膨脹係數或厚度不同之複數個構件間可能產生之應力所導致之捲曲或彎曲。For example, with regard to optical components used in optical products, or electronic components used in electronic products, a high degree of integration, miniaturization, light weight, and thinning continue to develop, and multiple thinner optical components with different linear expansion coefficients or thicknesses can be laminated. /Electronic components. Appropriate rigidity can be imparted to the above-mentioned optical member/electronic member by affixing a reinforcing film to such a member. Thereby, in the manufacturing process and/or the manufactured product, it is possible to suppress curling or bending caused by stress that may be generated between the above-mentioned plural members having different coefficients of linear expansion or different thicknesses.

又,於光學製品/電子製品之製造製程中,於如上所述對較薄之光學構件/電子構件進行切斷加工等形狀加工處理之情形時,藉由對該構件貼附補強膜而進行處理,可緩和伴隨加工之向光學構件/電子構件之局部之應力集中,可減少龜裂、破裂、積層構件之剝離等風險。對光學構件/電子構件貼附補強構件而進行操作亦可有助於該構件之搬送、積層、旋轉等時之局部之應力集中之緩和、或因該構件之自重所導致之彎折或彎曲之抑制等。Also, in the manufacturing process of optical products/electronic products, when performing shape processing such as cutting processing on thin optical members/electronic members as described above, it is processed by attaching a reinforcing film to the member , can alleviate the local stress concentration of optical components/electronic components accompanying processing, and can reduce the risk of cracks, cracks, and peeling off of laminated components. The operation of attaching a reinforcing member to an optical member/electronic member can also help alleviate the local stress concentration during the transfer, lamination, rotation, etc. of the member, or the bending or bending caused by the member's own weight. Inhibition etc.

進而,包含上述補強膜之光學製品或電子製品等器件於在市場上供消費者使用之階段,即便於該器件掉落之情形、置於重量物之下之情形、飛來物碰撞之情形等被施加意外之應力之情形時,亦可藉由使該器件包含補強膜而緩和施加於器件之應力。因此,藉由使上述器件包含補強膜,可提高該器件之耐久性。Furthermore, when devices such as optical products or electronic products including the above-mentioned reinforcing film are put on the market for consumer use, even if the device is dropped, placed under a heavy object, or hit by a flying object, etc. When an unexpected stress is applied, the stress applied to the device can also be relaxed by including a reinforcing film in the device. Therefore, by including the reinforcing film in the above-mentioned device, the durability of the device can be improved.

此處所揭示之補強膜例如可以貼附於構成各種攜帶型設備(可攜式設備)之構件之態樣良好地使用。此處所謂「攜帶」,並不單指能夠攜帶,而係指具有個人(標準成人)能夠相對容易地搬運之程度之攜帶性。又,此處所謂攜帶型設備之例可包括:行動電話、智慧型手機、平板型個人電腦、筆記型個人電腦、各種隨身設備、數位相機、數位攝錄影機、音響設備(攜帶音樂播放器、錄音筆等)、計算機(計算器等)、攜帶型遊戲設備、電子辭典、電子記事本、電子書籍、車載用資訊設備、攜帶型收音機、攜帶型電視、攜帶型印表機、攜帶型掃描儀、攜帶型數據機等攜帶電子設備,此外,亦可包括機械式手錶或懷錶、手電筒、放大鏡等。構成上述攜帶電子設備之構件之例可包括用於液晶顯示器等薄層顯示器或膜型顯示器等之類之圖像顯示裝置的光學膜或顯示面板等。此處所揭示之補強膜亦可以貼附於汽車、家電製品等中之各種構件之態樣良好地使用。The reinforcement film disclosed here can be used favorably, for example, in the form of being attached to members constituting various portable devices (portable devices). The so-called "carrying" here does not only refer to being able to carry, but refers to the degree of portability that can be carried relatively easily by an individual (standard adult). Also, examples of the so-called portable devices here may include: mobile phones, smart phones, tablet personal computers, notebook personal computers, various portable devices, digital cameras, digital video cameras, audio equipment (portable music players) , recorder, etc.), computers (calculators, etc.), portable game devices, electronic dictionaries, electronic notebooks, electronic books, information equipment for vehicles, portable radios, portable TVs, portable printers, portable scanners Portable electronic equipment such as instruments, portable modems, etc. In addition, it may also include mechanical watches or pocket watches, flashlights, magnifying glasses, etc. Examples of members constituting the aforementioned portable electronic equipment include optical films or display panels used in image display devices such as thin-layer displays such as liquid crystal displays or film-type displays. The reinforcing film disclosed here can also be used well in the form of being attached to various components in automobiles, home appliances, and the like.

由本說明書所揭示之事項包含以下者。 (1)一種補強膜,其包含: 支持基材,其具有第一面及第二面;及 黏著劑層,其積層於上述支持基材之上述第一面; 上述支持基材包含樹脂膜作為基底膜; 上述黏著劑層之上述第二面固著於上述支持基材之上述第一面; 上述黏著劑層之上述第一面抵接於剝離性表面; 上述剝離性表面之水接觸角為100度以上; 上述黏著劑層含有玻璃轉移溫度(Tg)未達0℃之聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B;且 將上述黏著劑層之上述第一面貼合於不鏽鋼板後於80℃下加熱5分鐘後於23℃下放置30分鐘後之黏著力N2為將上述黏著劑層之上述第一面貼合於不鏽鋼板後於23℃下放置30分鐘後之黏著力N1的10倍以上。 (2)如上述(1)所記載之補強膜,其中上述剝離性表面係含有矽(Si)之剝離層之表面。 (3)如上述(2)所記載之補強膜,其中上述剝離性表面之Si之原子比率為15 atomic%以上且30 atomic%以下。 (4)如上述(1)所記載之補強膜,其中上述剝離性表面係藉由長鏈烷基系剝離處理劑所形成之剝離層之表面。 (5)如上述(1)至(4)中任一項所記載之補強膜,其中上述支持基材之厚度為30 μm以上。 (6)如上述(1)至(5)中任一項所記載之補強膜,其中上述支持基材之厚度為上述黏著劑層之厚度之1.1倍以上且10倍以下。 (7)如上述(1)至(6)中任一項所記載之補強膜,其中上述聚合物B之重量平均分子量為1000以上且30000以下。 (8)如上述(1)至(7)中任一項所記載之補強膜,其中上述黏著劑層中之上述聚合物B之含量相對於100重量份上述聚合物A為0.05重量份以上且20重量份以下。 (9)如上述(1)至(8)中任一項所記載之補強膜,其中上述剝離性表面係剝離襯墊之表面。 (10)如上述(1)至(9)中任一項所記載之補強膜,其中上述剝離襯墊之厚度為30 μm以上且100 μm以下。 (11)如上述(1)至(10)中任一項所記載之補強膜,其中上述黏著劑層之厚度為3 μm以上且100 μm以下(例如20 μm以上且50 μm以下)。 (12)如上述(1)至(11)中任一項所記載之補強膜,其中上述基底膜係厚度35 μm以上(例如厚度35 μm以上且500 μm以下)之聚酯膜。 (13)如上述(12)所記載之補強膜,其中上述基底膜係厚度50 μm以上(例如厚度50 μm以上且200 μm以下)之PET膜。 (14)如上述(1)至(13)中任一項所記載之補強膜,其中上述聚合物A為丙烯酸系聚合物。 (15)如上述(14)所記載之補強膜,其中上述丙烯酸系聚合物含有N-乙烯基環狀醯胺及含羥基單體作為單體單元。 (16)如上述(1)至(15)中任一項所記載之補強膜,其中上述黏著劑層含有異氰酸酯系交聯劑。 (17)如上述(1)至(16)中任一項所記載之補強膜,其中上述黏著力N2為15 N/25 mm以上。 (18)如上述(1)至(17)中任一項所記載之補強膜,其中於在60℃、90%RH之條件下保存7天後,將上述黏著劑層之上述第一面貼合於不鏽鋼板後於80℃下加熱5分鐘後於23℃下放置30分鐘後之黏著力N2為將上述黏著劑層之上述第一面貼合於不鏽鋼板後於23℃下放置30分鐘後之黏著力N1的10倍以上。 (19)一種附剝離襯墊之補強膜,其包含如上述(1)至(18)中任一項所記載之補強膜、與具有上述剝離性表面之剝離襯墊。 (20)一種附補強膜之構件,其包含構件、與上述黏著面貼附於上述構件之如上述(1)至(18)中任一項所記載之補強膜。 (21)如上述(20)所記載之附補強膜之構件,其中上述構件為光學構件或電子構件。 (22)一種器件,其包含如上述(20)或(21)所記載之附補強膜之構件。 (23)一種補強膜製造方法,其係製造如上述(1)至(18)中任一項所記載之補強膜之方法,且依序包括: 使液狀之黏著劑組合物與支持基材之第一面接觸;及 於上述第一面上使上述黏著劑組合物硬化而形成上述黏著劑層。 [實施例]Matters disclosed in this specification include the following. (1) A reinforcing film comprising: a supporting substrate having a first surface and a second surface; and an adhesive layer laminated on the first surface of the supporting substrate; the supporting substrate comprising a resin film as The base film; the above-mentioned second surface of the above-mentioned adhesive layer is fixed on the above-mentioned first surface of the above-mentioned support substrate; the above-mentioned first surface of the above-mentioned adhesive layer is abutted against the peelable surface; the water contact angle of the above-mentioned peelable surface is 100 degrees or more; the above-mentioned adhesive layer contains polymer A whose glass transition temperature (Tg) is less than 0 ℃, and polymerized as a copolymer of a monomer having a polyorganosiloxane skeleton and a (meth)acrylic monomer Object B; and the adhesive force N2 after attaching the first surface of the above-mentioned adhesive layer to the stainless steel plate, heating at 80°C for 5 minutes and then placing it at 23°C for 30 minutes is the above-mentioned first surface of the above-mentioned adhesive layer The adhesive strength N1 is more than 10 times of the adhesive force N1 after the surface is pasted on the stainless steel plate and placed at 23°C for 30 minutes. (2) The reinforcing film as described in (1) above, wherein the peelable surface is a surface of a peeling layer containing silicon (Si). (3) The reinforcing film as described in said (2) whose atomic ratio of Si of the said peelable surface is 15 atomic% or more and 30 atomic% or less. (4) The reinforcing film as described in said (1) whose said peelable surface is the surface of the peeling layer formed with the long-chain alkyl system peeling agent. (5) The reinforcing film described in any one of (1) to (4) above, wherein the thickness of the supporting base material is 30 μm or more. (6) The reinforcing film described in any one of (1) to (5) above, wherein the thickness of the support substrate is 1.1 times to 10 times the thickness of the adhesive layer. (7) The reinforced film as described in any one of said (1)-(6) whose weight average molecular weight of the said polymer B is 1000-30000. (8) The reinforcing film described in any one of the above (1) to (7), wherein the content of the polymer B in the adhesive layer is 0.05 parts by weight or more based on 100 parts by weight of the polymer A and 20 parts by weight or less. (9) The reinforcing film according to any one of (1) to (8) above, wherein the releaseable surface is the surface of a release liner. (10) The reinforcing film according to any one of (1) to (9) above, wherein the release liner has a thickness of 30 μm or more and 100 μm or less. (11) The reinforced film described in any one of (1) to (10) above, wherein the adhesive layer has a thickness of 3 μm to 100 μm (for example, 20 μm to 50 μm). (12) The reinforcing film described in any one of (1) to (11) above, wherein the base film is a polyester film having a thickness of 35 μm or more (for example, a thickness of 35 μm or more and 500 μm or less). (13) The reinforcing film described in the above (12), wherein the base film is a PET film having a thickness of 50 μm or more (for example, a thickness of 50 μm or more and 200 μm or less). (14) The reinforced film according to any one of (1) to (13) above, wherein the polymer A is an acrylic polymer. (15) The reinforcing film according to the above (14), wherein the acrylic polymer contains N-vinyl cyclic amide and a hydroxyl group-containing monomer as monomer units. (16) The reinforced film according to any one of (1) to (15) above, wherein the adhesive layer contains an isocyanate-based crosslinking agent. (17) The reinforcing film according to any one of (1) to (16) above, wherein the adhesive force N2 is 15 N/25 mm or more. (18) The reinforcing film described in any one of the above (1) to (17), wherein after storing for 7 days under the conditions of 60°C and 90%RH, the above-mentioned first side of the above-mentioned adhesive layer is pasted Adhesive force N2 after being bonded to a stainless steel plate, heated at 80°C for 5 minutes, and then placed at 23°C for 30 minutes is after the above-mentioned first side of the above-mentioned adhesive layer is attached to a stainless steel plate and placed at 23°C for 30 minutes The adhesive force of N1 is more than 10 times. (19) A reinforcing film with a release liner, comprising the reinforcing film described in any one of (1) to (18) above, and a release liner having the above-mentioned release liner. (20) A member with a reinforcing film, which includes a member, and the reinforcing film as described in any one of the above (1) to (18) attached to the member with the above-mentioned adhesive surface. (21) The member with a reinforcing film as described in the above (20), wherein the member is an optical member or an electronic member. (22) A device comprising the member with a reinforcing film as described in (20) or (21) above. (23) A method for producing a reinforced film, which is a method for producing the reinforced film described in any one of (1) to (18) above, and sequentially includes: making a liquid adhesive composition and a support substrate contacting the first surface; and hardening the adhesive composition on the first surface to form the adhesive layer. [Example]

以下,對關於本發明之若干種實施例進行說明,但並非意圖將本發明限定於該具體例所示者。再者,以下之說明中之「份」及「%」若無特別說明,則為重量基準。Hereinafter, some examples of the present invention will be described, but the present invention is not intended to be limited to those shown in the specific examples. In addition, "part" and "%" in the following description are based on weight unless otherwise specified.

(聚合物A1之製備) 於具備攪拌翼、溫度計、氮氣導入管及冷卻器之四口燒瓶中,添加2EHA60份、N-乙烯基-2-吡咯啶酮(NVP)15份、甲基丙烯酸甲酯(MMA)10份、丙烯酸2-羥基乙酯(HEA)15份、及作為聚合溶劑之乙酸乙酯200份,於60℃下於氮氣環境下攪拌2小時後,投入作為熱聚合起始劑之AIBN0.2份,於60℃下進行6小時反應而獲得聚合物A1之溶液。該聚合物A1之Mw為110萬。(Preparation of Polymer A1) In a four-neck flask equipped with a stirring blade, a thermometer, a nitrogen inlet tube and a cooler, add 60 parts of 2EHA, 15 parts of N-vinyl-2-pyrrolidone (NVP), methyl methacrylate 10 parts of ester (MMA), 15 parts of 2-hydroxyethyl acrylate (HEA), and 200 parts of ethyl acetate as a polymerization solvent, stirred at 60°C for 2 hours under a nitrogen atmosphere, and then put in as a thermal polymerization initiator 0.2 part of AIBN was reacted at 60° C. for 6 hours to obtain a solution of polymer A1. The Mw of the polymer A1 was 1.1 million.

(聚合物B1之製備) 於具備攪拌翼、溫度計、氮氣導入管、冷卻器、滴液漏斗之四口燒瓶中,投入甲苯100份、MMA40份、甲基丙烯酸正丁酯(BMA)20份、甲基丙烯酸2-乙基己酯(2EHMA)20份、官能基當量為900 g/mol之含有聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:X-22-174ASX,信越化學工業股份有限公司製造)8.7份、官能基當量為4600 g/mol之含有聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:KF-2012,信越化學工業股份有限公司製造)11.3份及作為鏈轉移劑之硫代乙醇酸甲酯0.51份。繼而,於70℃下於氮氣環境下攪拌1小時後,投入作為熱聚合起始劑之AIBN0.2份,於70℃下反應2小時後,投入作為熱聚合起始劑之AIBN0.1重量份,繼而使其於80℃下反應5小時。如此獲得聚合物B1之溶液。該聚合物B1之Mw為22000。(Preparation of Polymer B1) In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet tube, a cooler, and a dropping funnel, 100 parts of toluene, 40 parts of MMA, 20 parts of n-butyl methacrylate (BMA), 20 parts of 20 parts of 2-ethylhexyl methacrylate (2EHMA), a methacrylate monomer containing a polyorganosiloxane skeleton with a functional group equivalent of 900 g/mol (trade name: X-22-174ASX, Shin-Etsu Chemical Industrial Co., Ltd.) 8.7 parts, methacrylate monomer having a polyorganosiloxane skeleton with a functional group equivalent of 4600 g/mol (trade name: KF-2012, manufactured by Shin-Etsu Chemical Co., Ltd.) 11.3 parts And 0.51 parts of methyl thioglycolate as a chain transfer agent. Then, after stirring for 1 hour at 70°C under a nitrogen atmosphere, put in 0.2 parts of AIBN as a thermal polymerization initiator, and after reacting at 70°C for 2 hours, put in 0.1 part by weight of AIBN as a thermal polymerization initiator , and then allowed to react at 80° C. for 5 hours. A solution of polymer B1 is thus obtained. The polymer B1 has a Mw of 22,000.

再者,上述各聚合物之重量平均分子量係使用GPC裝置(Tosoh公司製造,HLC-8220GPC)於下述條件下進行測定,藉由聚苯乙烯換算而求出。 ・樣品濃度:0.2 wt%(四氫呋喃(THF)溶液) ・樣品注入量:10 μl ・溶析液:THF、流速:0.6 ml/min ・測定溫度:40℃ ・管柱: 樣品管柱;TSKguardcolumn SuperHZ-H(1根)+TSKgel SuperHZM-H(2根) 參考管柱;TSKgel SuperH-RC(1根) ・檢測器:示差折射計(RI)In addition, the weight average molecular weight of each said polymer was measured using the GPC apparatus (manufactured by Tosoh, HLC-8220GPC) under the following conditions, and was calculated|required by polystyrene conversion.・Sample concentration: 0.2 wt% (tetrahydrofuran (THF) solution) ・Sample injection volume: 10 μl ・Eluent: THF, flow rate: 0.6 ml/min ・Measurement temperature: 40℃ ・Column: Sample column; TSKguardcolumn SuperHZ -H (1 piece) + TSKgel SuperHZM-H (2 pieces) Reference column; TSKgel SuperH-RC (1 piece) ・Detector: Differential refractometer (RI)

(黏著劑組合物C1之製備) 於上述聚合物A1之溶液中,相對於該溶液中所含之聚合物A1之100份,添加2.5份之聚合物B1、2.5份之異氰酸酯系交聯劑(商品名:Takenate D110N,三羥甲基丙烷苯二甲基二異氰酸酯,三井化學公司製造),均勻地混合而製備黏著劑組合物C1。(Preparation of Adhesive Composition C1) To the above polymer A1 solution, 2.5 parts of polymer B1 and 2.5 parts of isocyanate-based crosslinking agent ( Trade name: Takenate D110N, trimethylolpropane xylylene diisocyanate, manufactured by Mitsui Chemicals Corporation), were uniformly mixed to prepare adhesive composition C1.

<附剝離襯墊之補強膜之製作> (例1) 於作為支持基材之厚度125 μm之聚對苯二甲酸乙二酯(PET)膜(Toray公司製造,商品名「Lumirror」;以下亦稱為「支持基材A」)之第一面直接塗佈黏著劑組合物C1,於110℃下加熱2分鐘使其乾燥,藉此形成厚度25 μm之黏著劑層。藉由在該黏著劑層之表面(黏著面)貼合剝離襯墊R1之剝離面,而獲得於上述剝離面抵接有該黏著面之形態之附剝離襯墊之補強膜。作為剝離襯墊R1,使用Mitsubishi Chemical公司製造之MRQ50T100(於聚酯膜之單面具有利用聚矽氧系剝離處理劑所形成之剝離層之剝離襯墊,厚度50 μm)。<Preparation of a reinforcing film with a release liner> (Example 1) A polyethylene terephthalate (PET) film (manufactured by Toray, trade name "Lumirror"; The adhesive composition C1 was directly coated on the first surface called "support substrate A", and dried by heating at 110° C. for 2 minutes, thereby forming an adhesive layer with a thickness of 25 μm. By bonding the peeling surface of the peeling liner R1 to the surface (adhesive surface) of the adhesive layer, a reinforcing film with a peeling liner in a form in which the peeling surface is in contact with the peeling surface is obtained. As the release liner R1, MRQ50T100 (a release liner having a release layer formed of a silicone-based release treatment agent on one side of a polyester film, thickness 50 μm) manufactured by Mitsubishi Chemical Co., Ltd. was used.

(例2~6) 分別使用剝離襯墊R2~R6代替剝離襯墊R1,除此以外,藉由與例1相同之方式製作例2~6之附剝離襯墊之補強膜。作為剝離襯墊R2~R6,使用以下者。 [剝離襯墊R2] 將聚矽氧系剝離劑(信越化學工業製造,KS-847H)100份及聚矽氧硬化觸媒(信越化學工業製造,CAT-PL-50T)3.3份利用包含甲苯(出光石油化學製造)、正己烷(丸善石油化學製造)及甲基乙基酮(出光興產製造)之重量比1:2:1之混合溶劑稀釋至0.3%,而製備聚矽氧系剝離處理劑。將該剝離處理劑塗佈於厚度50 μm之PET膜(三菱樹脂製造,Diafoil T100C50)之單面,於130℃下使其乾燥1分鐘,而製作剝離襯墊R2。[剝離襯墊R3] 將含有乙烯基之聚矽氧系剝離劑(信越化學工業製造,KS-3703)92份、剝離控制劑(信越化學工業製造,KS-3800)8份及鉑觸媒(信越化學工業製造,CAT-PL-50T)3份、與作為稀釋溶劑之甲苯680份及正己烷680份進行混合,而製備聚矽氧系剝離處理劑。將該剝離處理劑塗佈於厚度50 μm之PET膜(三菱樹脂製造,Diafoil T100C50)之單面,於130℃下使其乾燥1分鐘,而製作剝離襯墊R3。 [剝離襯墊R4] 將含有乙烯基之聚矽氧系剝離劑(信越化學工業製造,KS-3703)80份、剝離控制劑(信越化學工業製造,KS-3800)20份及鉑觸媒(信越化學工業製造,CAT-PL-50T)3份、與作為稀釋溶劑之甲苯680份及正己烷680份進行混合,而製備聚矽氧系剝離處理劑。將該剝離處理劑塗佈於厚度50 μm之PET膜(三菱樹脂製造,Diafoil T100C50)之單面,使其於130℃下乾燥1分鐘,而製作剝離襯墊R4。[剝離襯墊R5] 於具備冷卻器之反應容器中加入二甲苯(太陽化學製造,Xylol)200份、異氰酸十八烷基酯(Ohara paragium chemical股份有限公司製造,R-NCO)600份,一面攪拌一面加熱。自二甲苯開始回流之時間點起,逐次少量地添加聚乙烯醇(Kuraray製造,Kuraray Poval 205)100份,以10分鐘為間隔持續添加2小時。於添加聚乙烯醇完成後,進而進行2小時回流,結束反應。於將反應混合物冷卻至約80℃後添加至甲醇中,結果反應產物作為白色沈澱析出。將該沈澱進行過濾分離,添加二甲苯140份,進行加熱使其完全溶解後,再次添加甲醇使其沈澱,將該操作重複進行數次後,將沈澱利用甲醇洗淨並進行乾燥粉碎,將所獲得之粉末利用水稀釋至0.3%,而製備長鏈烷基系剝離處理劑。將該剝離處理劑塗佈於厚度50 μm之PET膜(三菱樹脂製造,Diafoil T100C50)之單面,於130℃下使其乾燥1分鐘,而製作剝離襯墊R5。 [剝離襯墊R6] 於具備冷卻器之反應容器中,添加丙烯腈(昭和電工股份有限公司製造)100份、甲基丙烯酸硬脂酯(Mitsubishi Gas Chemical股份有限公司製造,SMA)62.5份、甲基丙烯酸(Mitsubishi Rayon股份有限公司製造)18份、1-十二烷硫醇(和光純藥股份有限公司製造,1-十二烷硫醇)1.8份、過氧化苯甲醯(日油股份有限公司製造,Nyper BW)0.55份,利用甲苯(出光石油化學製造)稀釋至24%,於氮氣氣流下於70℃下反應7小時。將所獲得之液體利用甲苯稀釋至0.3%,製備長鏈烷基系剝離處理劑。將該剝離處理劑塗佈於厚度50 μm之PET膜(三菱樹脂製造,Diafoil T100C50)之單面,於130℃下使其乾燥1分鐘,而製作剝離襯墊R6。(Examples 2-6) Except having used release liner R2-R6 instead of release liner R1, the reinforcement film with the release liner of Examples 2-6 was produced in the same manner as Example 1, respectively. As the release liners R2 to R6, the following were used. [Release liner R2] 100 parts of a silicone-based release agent (manufactured by Shin-Etsu Chemical, KS-847H) and 3.3 parts of a silicone curing catalyst (manufactured by Shin-Etsu Chemical, CAT-PL-50T) were prepared using toluene ( Idemitsu Petrochemical), n-hexane (Maruzen Petrochemical) and methyl ethyl ketone (Idemitsu Kosan) with a weight ratio of 1:2:1 was diluted to 0.3% to prepare silicone-based peeling treatment agent. This release treatment agent was applied to one side of a 50 μm-thick PET film (Mitsubishi Plastics, Diafoil T100C50) and dried at 130° C. for 1 minute to prepare a release liner R2. [Release liner R3] 92 parts of a polysiloxane-based release agent containing vinyl (manufactured by Shin-Etsu Chemical, KS-3703), 8 parts of a release control agent (manufactured by Shin-Etsu Chemical, KS-3800) and a platinum catalyst ( Shin-Etsu Chemical Co., Ltd., CAT-PL-50T) 3 parts were mixed with 680 parts of toluene and 680 parts of n-hexane as a diluting solvent to prepare a silicone-based release treatment agent. This release treatment agent was applied to one side of a 50 μm-thick PET film (Mitsubishi Plastics, Diafoil T100C50) and dried at 130° C. for 1 minute to prepare a release liner R3. [Release liner R4] 80 parts of a polysiloxane-based release agent containing vinyl (manufactured by Shin-Etsu Chemical, KS-3703), 20 parts of a release control agent (manufactured by Shin-Etsu Chemical, KS-3800) and a platinum catalyst ( Shin-Etsu Chemical Co., Ltd., CAT-PL-50T) 3 parts were mixed with 680 parts of toluene and 680 parts of n-hexane as a diluting solvent to prepare a silicone-based release treatment agent. This release treatment agent was applied to one side of a PET film (Mitsubishi Plastics, Diafoil T100C50) having a thickness of 50 μm, and dried at 130° C. for 1 minute to prepare a release liner R4. [Peel-off liner R5] 200 parts of xylene (manufactured by Sun Chemical Co., Ltd., Xylol) and 600 parts of octadecyl isocyanate (manufactured by Ohara paragium chemical Co., Ltd., R-NCO) were added to a reaction vessel equipped with a cooler , stirring while heating. From the time when xylene started to reflux, 100 parts of polyvinyl alcohol (manufactured by Kuraray, Kuraray Poval 205) was gradually added in small amounts, and the addition was continued for 2 hours at intervals of 10 minutes. After the addition of polyvinyl alcohol was completed, the reaction was further refluxed for 2 hours to complete the reaction. After cooling the reaction mixture to about 80°C, it was added to methanol, and the reaction product was precipitated as a white precipitate. The precipitate was separated by filtration, 140 parts of xylene was added, heated to dissolve it completely, and methanol was added again to precipitate. After repeating this operation several times, the precipitate was washed with methanol and dried and pulverized. The obtained powder was diluted to 0.3% with water to prepare a long-chain alkyl-based peeling treatment agent. This release treatment agent was applied to one side of a PET film (Mitsubishi Plastics, Diafoil T100C50) having a thickness of 50 μm, and dried at 130° C. for 1 minute to prepare a release liner R5. [Release liner R6] In a reaction container equipped with a cooler, 100 parts of acrylonitrile (manufactured by Showa Denko Co., Ltd.), 62.5 parts of stearyl methacrylate (manufactured by Mitsubishi Gas Chemical Co., Ltd., SMA), methacrylate Acrylic acid (manufactured by Mitsubishi Rayon Co., Ltd.) 18 parts, 1-dodecanethiol (manufactured by Wako Pure Chemical Industries, Ltd., 1-dodecanethiol) 1.8 parts, benzoyl peroxide (NOF Co., Ltd. Manufactured by the company, Nyper BW) 0.55 parts, diluted to 24% with toluene (manufactured by Idemitsu Petrochemical), and reacted at 70° C. for 7 hours under a nitrogen stream. The obtained liquid was diluted to 0.3% with toluene to prepare a long-chain alkyl-based peeling treatment agent. This release treatment agent was applied to one side of a PET film (Mitsubishi Plastics, Diafoil T100C50) having a thickness of 50 μm, and dried at 130° C. for 1 minute to prepare a release liner R6.

藉由上述方法測定上述剝離襯墊R1~R6之水接觸角。將結果示於表1。The water contact angles of the release liners R1 to R6 were measured by the above method. The results are shown in Table 1.

又,針對上述剝離襯墊R1~R6之剝離面(剝離層之表面),於以下之條件下進行利用X射線光電子光譜法(ESCA)之測定,測定Si之元素比率。將結果示於表1。 裝置:ULVAC PHI製 PHI Quantera SXM X射線源:單色AlKα X射線設定(XRay Setting):100 μm

Figure 02_image007
[15 kV,25 W] 光電子掠出角:相對於試樣表面為45°In addition, measurement by X-ray photoelectron spectroscopy (ESCA) was performed on the release surfaces (surfaces of the release layers) of the release liners R1 to R6 above under the following conditions to measure the elemental ratio of Si. The results are shown in Table 1. Device: PHI Quantera SXM manufactured by ULVAC PHI X-ray source: Monochromatic AlKα X-ray setting (XRay Setting): 100 μm
Figure 02_image007
[15 kV, 25 W] Photoelectron grazing angle: 45° relative to the sample surface

(保存條件) 將各例之附剝離襯墊之補強膜於23℃、50%RH之環境下靜置4天者作為該附剝離襯墊之補強膜之初期狀態(保存前)之樣品。 將上述初期狀態之附剝離襯墊之補強膜進而於60℃、90%RH之條件下保存7天者作為基於條件1之保存後之樣品。 將上述初期狀態之附剝離襯墊之補強膜進而於85℃之條件下保存7天者作為基於條件2之保存後之樣品。 針對上述保存前、基於條件1之保存後、基於條件2之保存後之樣品之各者,進行以下之評價試驗。再者,基於條件1、2之保存後之樣品係於自各條件之環境恢復至23℃、50%RH之環境下靜置30分鐘後用於各評價試驗。(Storage conditions) The reinforcement film with a release liner of each example was left to stand for 4 days in an environment of 23° C. and 50% RH as a sample of the initial state (before storage) of the reinforcement film with a release liner. The reinforcement film with release liner in the above initial state was further preserved for 7 days under conditions of 60° C. and 90% RH as samples after preservation based on Condition 1. The reinforcement film with a release liner in the above initial state was further stored at 85° C. for 7 days as a sample after storage based on Condition 2. The following evaluation tests were performed on each of the samples before storage, after storage under Condition 1, and after storage under Condition 2. In addition, the samples after storage based on conditions 1 and 2 were used for each evaluation test after returning to the environment of 23 degreeC and 50%RH from the environment of each condition and leaving it still for 30 minutes.

<襯墊剝離力之測定> 將各例之附剝離襯墊之補強膜連同剝離襯墊一起裁斷為25 mm寬度,將其等作為試片。於23℃、50%RH之環境下,將上述試片設置於萬能拉伸壓縮試驗機(裝置名「拉伸壓縮試驗機,TCM-1kNB」Minebea公司製造),於剝離角度180度、拉伸速度300 mm/min之條件下將剝離襯墊自黏著面剝離,測定此時之180°剝離黏著力(相對於上述拉伸之阻力)。測定係進行3次,將其等之平均值作為襯墊剝離力(N0)[N/25 mm]示於表1。<Measurement of Liner Peeling Force> The reinforcing film with release liner of each example was cut into a width of 25 mm together with the release liner, and these were used as test pieces. Under the environment of 23°C and 50%RH, the above-mentioned test piece was set in a universal tensile compression testing machine (device name "tensile compression testing machine, TCM-1kNB" manufactured by Minebea Co., Ltd.), and stretched at a peeling angle of 180 degrees. Peel the release liner from the adhesive surface at a speed of 300 mm/min, and measure the 180° peel adhesive force at this time (relative to the above tensile resistance). The measurement was performed three times, and the average value thereof is shown in Table 1 as the liner peeling force (N0) [N/25 mm].

<對於SUS之黏著力之測定> 將各例之補強膜連同剝離襯墊一起裁斷為25 mm寬度,將其等作為試片,將利用甲苯潔淨化之SUS板(SUS304BA板)作為被黏著體,按照以下順序測定初期黏著力N1及加熱後黏著力N2。 (初期黏著力之測定) 於23℃、50%RH之標準環境下,將覆蓋各試片之黏著面之剝離襯墊剝離,使2 kg之輥往返1次而將所露出之黏著面壓接於被黏著體。將如此壓接於被黏著體之試片於上述標準環境下放置30分鐘後,使用萬能拉伸壓縮試驗機(裝置名「拉伸壓縮試驗機,TCM-1kNB」Minebea公司製造),依據JIS Z0237,於剝離角度180度、拉伸速度300 mm/min之條件下,測定180°剝離黏著力(相對於上述拉伸之阻力)。測定係進行3次,將其等之平均值作為初期黏著力(N1)[N/25 mm]示於表1。 (加熱後黏著力之測定) 將藉由與初期黏著力之測定相同之方式壓接於被黏著體之試片於80℃下加熱5分鐘,繼而於上述標準環境下放置30分鐘後,同樣地測定180°剝離黏著力。測定係進行3次,將其等之平均值作為加熱後黏著力(N2)[N/25 mm]示於表1。再者,確認到例1~6之補強膜於保存前、基於條件1之保存後、基於條件2之保存後之樣品之任一者中,均未於加熱後黏著力之測定時產生抓固破壞。<Measurement of Adhesion to SUS> The reinforcement film of each example was cut into 25 mm width together with the release liner, and these were used as test pieces, and the SUS board (SUS304BA board) cleaned with toluene was used as the adherend, The initial adhesive force N1 and the post-heating adhesive force N2 were measured in the following procedure. (Measurement of Initial Adhesion) Under the standard environment of 23°C and 50%RH, the release liner covering the adhesive surface of each test piece was peeled off, and the exposed adhesive surface was bonded by making a 2 kg roller reciprocate once. on the adherend. Put the test piece crimped on the adherend in the above-mentioned standard environment for 30 minutes, and use a universal tensile compression testing machine (device name "tensile compression testing machine, TCM-1kNB" manufactured by Minebea Co., Ltd.), according to JIS Z0237 , under the conditions of a peeling angle of 180 degrees and a tensile speed of 300 mm/min, the 180° peeling adhesion (relative to the resistance of the above stretching) was measured. The measurement was performed three times, and the average value thereof is shown in Table 1 as the initial adhesion force (N1) [N/25 mm]. (Measurement of Adhesive Force after Heating) Heat the test piece bonded to the adherend by the same method as the initial adhesive force measurement at 80°C for 5 minutes, and then leave it in the above-mentioned standard environment for 30 minutes, similarly Measure the 180° peel adhesion. The measurement was carried out three times, and the average value thereof is shown in Table 1 as the adhesive force after heating (N2) [N/25 mm]. In addition, it was confirmed that the reinforced films of Examples 1 to 6 were not seized in the measurement of the adhesive force after heating in any of the samples before storage, after storage under condition 1, and after storage under condition 2. destroy.

[表1]

Figure 107119768-A0304-0001
[Table 1]
Figure 107119768-A0304-0001

如表1所示,以黏著面抵接於水接觸角100度以上之剝離面的附剝離襯墊之補強膜之形態製備之例1~5之補強膜即便於基於條件1之保存後,亦良好地發揮與保存前同等或其以上之初期之低黏著性及使用時之強黏著性。根據上述剝離面為利用聚矽氧系剝離處理劑所形成之剝離面的例1~4之補強膜,獲得更良好之結果。即,確認到例1~4之補強膜即便於基於更嚴酷之條件2之保存後,亦良好地發揮初期之低黏著性及使用時之強黏著性。又,例1~5之補強膜均可於基於條件1、2之保存後自剝離面容易地剝離。例1~4之補強膜之基於條件1、2之保存後與保存前之襯墊剝離力之差尤其小,襯墊剝離力之穩定性優異。As shown in Table 1, the reinforced films of Examples 1 to 5 prepared in the form of a reinforced film with a release liner whose adhesive surface is in contact with the peeling surface with a water contact angle of 100 degrees or more, even after storage based on Condition 1, Good performance of the initial low adhesiveness and strong adhesiveness during use that are equal to or higher than those before storage. According to the reinforcing films of Examples 1 to 4 in which the above-mentioned peeling surface is a peeling surface formed by using a silicone-based peeling treatment agent, better results were obtained. That is, it was confirmed that the reinforced films of Examples 1 to 4 exhibited good initial low adhesiveness and strong adhesiveness during use even after storage under the more severe condition 2. In addition, the reinforcing films of Examples 1 to 5 were all easily peeled from the peeling surface after storage based on Conditions 1 and 2. In the reinforced films of Examples 1 to 4, the difference between the liner peeling force after storage and before storage based on conditions 1 and 2 was particularly small, and the stability of the liner peeling force was excellent.

與此相對,以黏著面抵接於水接觸角未達100度之剝離面的附剝離襯墊之補強膜之形態製備之例6之補強膜於基於條件1之保存後,與保存前相比,初期黏著力明顯變高。又,例6之補強膜之襯墊剝離力因基於條件1之保存而大幅地上升。於基於條件2之保存後,襯墊剝離力進一步大幅地上升,剝離襯墊之去除容易性降低。On the other hand, the reinforcement film of Example 6 prepared in the form of a reinforcement film with a release liner in which the adhesive surface is in contact with the release surface with a water contact angle of less than 100 degrees is compared with that before storage after storage based on condition 1. , the initial adhesion was significantly higher. Also, the liner peeling force of the reinforcing film of Example 6 was greatly increased by storage under Condition 1. After storage under Condition 2, the release force of the liner increased significantly, and the ease of removal of the release liner decreased.

(例7~8) 於例1、6中,使用Mitsubishi Gas Chemical公司製造之聚醯亞胺樹脂膜(厚度50 μm,商品名「Neopulim S-100」;以下亦稱為支持基材B)代替支持基材A。關於其他方面,藉由與例1、6分別相同之方式獲得例7、8之附剝離襯墊之補強膜。(Examples 7-8) In Examples 1 and 6, a polyimide resin film manufactured by Mitsubishi Gas Chemical Co., Ltd. (thickness 50 μm, trade name "Neopulim S-100"; hereinafter also referred to as support substrate B) was used instead Support Substrate A. Regarding other aspects, the reinforcing films with release liners of Examples 7 and 8 were obtained in the same manner as in Examples 1 and 6, respectively.

針對例7、8之附剝離襯墊之補強膜進行與例1~6相同之評價。將結果示於表2。The same evaluation as Examples 1-6 was performed about the reinforcement film with a release liner of Examples 7 and 8. The results are shown in Table 2.

[表2]

Figure 107119768-A0304-0002
[Table 2]
Figure 107119768-A0304-0002

如表2所示,使用剝離襯墊R1之例7即便於基於條件1、2之保存後,襯墊剝離力亦較低,且良好地發揮初期之低黏著性及使用時之強黏著性。另一方面,使用剝離襯墊R6之例8有初期黏著力及襯墊剝離力因保存而上升之傾向。如此,於使用支持基材B之構成中,亦確認到與使用支持基材A之構成相同之傾向。As shown in Table 2, in Example 7 using the release liner R1, even after storage under conditions 1 and 2, the release force of the liner was low, and the initial low adhesiveness and the strong adhesiveness during use were well exhibited. On the other hand, in Example 8 using the release liner R6, the initial adhesive force and liner peeling force tended to increase due to storage. Thus, also in the structure using the support base material B, the same tendency as the structure using the support base material A was confirmed.

(例9~12) 於例7、8中,使用Kaneka公司製造之聚醯亞胺樹脂膜(厚度50 μm,商品名「Kapton 200H」;以下亦稱為支持基材C)代替支持基材B。關於其他方面,藉由與例7、8分別相同之方式獲得例9、10之附剝離襯墊之補強膜。(Examples 9-12) In Examples 7 and 8, a polyimide resin film manufactured by Kaneka Co., Ltd. (thickness: 50 μm, trade name "Kapton 200H"; hereinafter also referred to as support substrate C) was used instead of support substrate B . Regarding other aspects, the reinforcing films with release liners of Examples 9 and 10 were obtained in the same manner as in Examples 7 and 8, respectively.

(例11~12) 於例7、8中,使用宇部興產公司製造之聚醯亞胺樹脂膜(厚度50 μm,商品名「Upilex 50S」;以下亦稱為支持基材D)代替支持基材B。關於其他方面,藉由與例7、8分別相同之方式獲得例11、12之附剝離襯墊之補強膜。(Examples 11-12) In Examples 7 and 8, a polyimide resin film manufactured by Ube Industries (thickness 50 μm, trade name "Upilex 50S"; hereinafter also referred to as support substrate D) was used instead of the support base Material B. Regarding other points, the reinforcing films with release liners of Examples 11 and 12 were obtained in the same manner as in Examples 7 and 8, respectively.

針對例9~12之附剝離襯墊之補強膜,與例1~6同樣地對因保存所產生之剝離性能之變化進行評價。將結果示於表3。Regarding the reinforcing film with a release liner of Examples 9 to 12, changes in release performance due to storage were evaluated in the same manner as in Examples 1 to 6. The results are shown in Table 3.

[表3]

Figure 107119768-A0304-0003
[table 3]
Figure 107119768-A0304-0003

如表3所示,於使用支持基材C、D之構成中,亦確認到與使用支持基材B之構成相同之傾向。即,使用剝離襯墊R1之例9、11與使用剝離襯墊R6之例10、12相比,襯墊剝離力之穩定性優異。As shown in Table 3, the same tendency as that of the configuration using the supporting base material B was also confirmed in the configurations using the supporting base materials C and D. That is, in Examples 9 and 11 using the release liner R1, the stability of the liner peeling force was excellent compared with Examples 10 and 12 using the release liner R6.

以上,對本發明之具體例進行了詳細說明,但該等僅為例示,並非限定申請專利範圍。申請專利範圍所記載之技術包含將以上所例示之具體例進行各種變化、變更者。As mentioned above, although the specific example of this invention was demonstrated in detail, these are only illustrations, and do not limit the scope of claims. The technologies described in the claims include various modifications and changes of the specific examples exemplified above.

1‧‧‧補強膜2‧‧‧補強膜10‧‧‧支持基材10A‧‧‧第一面10B‧‧‧第二面21‧‧‧黏著劑層(第一黏著劑層)21A‧‧‧第一面(黏著面、第一黏著面)21B‧‧‧第二面(背面)22‧‧‧黏著劑層(第二黏著劑層)22A‧‧‧黏著面(第二黏著面)31‧‧‧剝離襯墊31A‧‧‧剝離性表面(剝離面)31B‧‧‧剝離面32‧‧‧剝離襯墊32A‧‧‧剝離性表面(剝離面)100‧‧‧附剝離襯墊之補強膜200‧‧‧附剝離襯墊之補強膜1‧‧‧Reinforcing film 2‧‧‧Reinforcing film 10‧‧‧Supporting substrate 10A‧‧‧First surface 10B‧‧‧Second surface 21‧‧‧Adhesive layer (first adhesive layer) 21A‧‧ ‧First side (adhesive surface, first adhesive surface) 21B ‧‧‧Release liner 31A‧‧‧Releasable surface (release surface) 31B‧‧‧Releasable surface 32‧‧‧Release liner 32A‧‧‧Releasable surface (release surface) 100‧‧‧with release liner Reinforcement film 200‧‧‧Reinforcement film with release liner

圖1係模式性地表示一實施形態之補強膜之構成之剖視圖。 圖2係模式性地表示另一實施形態之補強膜之構成之剖視圖。Fig. 1 is a cross-sectional view schematically showing the configuration of a reinforcing film according to an embodiment. Fig. 2 is a cross-sectional view schematically showing the configuration of a reinforcing film according to another embodiment.

1‧‧‧補強膜 1‧‧‧Reinforcing film

10‧‧‧支持基材 10‧‧‧Support substrate

10A‧‧‧第一面 10A‧‧‧first side

10B‧‧‧第二面 10B‧‧‧Second side

21‧‧‧黏著劑層(第一黏著劑層) 21‧‧‧adhesive layer (first adhesive layer)

21A‧‧‧第一面(黏著面、第一黏著面) 21A‧‧‧first side (adhesive surface, first adhesive surface)

21B‧‧‧第二面(背面) 21B‧‧‧Second side (back)

31‧‧‧剝離襯墊 31‧‧‧Release liner

31A‧‧‧剝離性表面(剝離面) 31A‧‧‧Releasable Surface (Releasable Surface)

100‧‧‧附剝離襯墊之補強膜 100‧‧‧Reinforcing film with release liner

Claims (8)

一種補強膜,其包含:支持基材,其具有第一面及第二面;及黏著劑層,其積層於上述支持基材之上述第一面;上述支持基材包含樹脂膜作為基底膜;上述黏著劑層之第二面固著於上述支持基材之上述第一面;上述黏著劑層之第一面抵接於剝離性表面;上述剝離性表面之水接觸角為100度以上;上述黏著劑層含有玻璃轉移溫度未達0℃之聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B;且將上述黏著劑層之上述第一面貼合於不鏽鋼板後於80℃下加熱5分鐘後於23℃下放置30分鐘後之黏著力N2為將上述黏著劑層之上述第一面貼合於不鏽鋼板後於23℃下放置30分鐘後之黏著力N1的10倍以上。 A reinforcing film, comprising: a supporting substrate having a first surface and a second surface; and an adhesive layer laminated on the first surface of the supporting substrate; the supporting substrate includes a resin film as a base film; The second surface of the above-mentioned adhesive layer is fixed on the above-mentioned first surface of the above-mentioned support substrate; the first surface of the above-mentioned adhesive layer is in contact with the peelable surface; the water contact angle of the above-mentioned peelable surface is 100 degrees or more; the above-mentioned The adhesive layer contains a polymer A having a glass transition temperature of less than 0°C, and a polymer B which is a copolymer of a monomer having a polyorganosiloxane skeleton and a (meth)acrylic monomer; and the above adhesive The above-mentioned first surface of the layer is pasted on the stainless steel plate, and the adhesive force N2 after heating at 80°C for 5 minutes and then standing at 23°C for 30 minutes is the adhesive force N2 after the above-mentioned first surface of the above-mentioned adhesive layer is pasted on the stainless steel plate. The adhesive force after being placed at 23°C for 30 minutes is more than 10 times that of N1. 如請求項1之補強膜,其中上述剝離性表面係含有矽(Si)之剝離層之表面。 The reinforcing film according to claim 1, wherein the peelable surface is the surface of a peeling layer containing silicon (Si). 如請求項1之補強膜,其中上述剝離性表面係藉由長鏈烷基系剝離處理劑所形成之剝離層之表面。 The reinforced film according to claim 1, wherein the peelable surface is the surface of a peeling layer formed by a long-chain alkyl-based peeling treatment agent. 如請求項1至3中任一項之補強膜,其中上述支持基材之厚度為30μm以上。 The reinforced film according to any one of claims 1 to 3, wherein the thickness of the above-mentioned support substrate is 30 μm or more. 如請求項1至3中任一項之補強膜,其中上述支持基材之厚度為上述黏著劑層之厚度之1.1倍以上且10倍以下。 The reinforced film according to any one of claims 1 to 3, wherein the thickness of the above-mentioned supporting substrate is 1.1 times or more and 10 times or less of the thickness of the above-mentioned adhesive layer. 如請求項1至3中任一項之補強膜,其中上述聚合物B之重量平均分子量為10000以上且50000以下。 The reinforced film according to any one of claims 1 to 3, wherein the polymer B has a weight average molecular weight of 10,000 to 50,000. 如請求項1至3中任一項之補強膜,其中上述黏著劑層中之上述聚合物B之含量相對於100重量份上述聚合物A為0.05重量份以上且20重量份以下。 The reinforced film according to any one of claims 1 to 3, wherein the content of the polymer B in the adhesive layer is 0.05 parts by weight to 20 parts by weight relative to 100 parts by weight of the polymer A. 如請求項1至3中任一項之補強膜,其中上述剝離性表面係剝離襯墊之表面。 The reinforcing film according to any one of claims 1 to 3, wherein the above-mentioned releasable surface is a surface of a release liner.
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