TWI781099B - 保護膜形成用膜、保護膜形成用複合片、以及能量線硬化性膜的用途 - Google Patents

保護膜形成用膜、保護膜形成用複合片、以及能量線硬化性膜的用途 Download PDF

Info

Publication number
TWI781099B
TWI781099B TW106113974A TW106113974A TWI781099B TW I781099 B TWI781099 B TW I781099B TW 106113974 A TW106113974 A TW 106113974A TW 106113974 A TW106113974 A TW 106113974A TW I781099 B TWI781099 B TW I781099B
Authority
TW
Taiwan
Prior art keywords
protective film
film
forming
mass
meth
Prior art date
Application number
TW106113974A
Other languages
English (en)
Chinese (zh)
Other versions
TW201806767A (zh
Inventor
山本大輔
稻男洋一
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201806767A publication Critical patent/TW201806767A/zh
Application granted granted Critical
Publication of TWI781099B publication Critical patent/TWI781099B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW106113974A 2016-04-28 2017-04-26 保護膜形成用膜、保護膜形成用複合片、以及能量線硬化性膜的用途 TWI781099B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016092013 2016-04-28
JP2016-092013 2016-04-28

Publications (2)

Publication Number Publication Date
TW201806767A TW201806767A (zh) 2018-03-01
TWI781099B true TWI781099B (zh) 2022-10-21

Family

ID=60161658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106113974A TWI781099B (zh) 2016-04-28 2017-04-26 保護膜形成用膜、保護膜形成用複合片、以及能量線硬化性膜的用途

Country Status (5)

Country Link
JP (1) JP6971977B2 (ja)
KR (1) KR102407322B1 (ja)
CN (1) CN109071845B (ja)
TW (1) TWI781099B (ja)
WO (1) WO2017188231A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102519799B1 (ko) * 2018-03-30 2023-04-10 린텍 가부시키가이샤 지지 시트 및 보호막 형성용 복합 시트
KR20200133288A (ko) * 2019-05-16 2020-11-27 삼성디스플레이 주식회사 고분자 수지, 이를 포함하는 윈도우 모듈, 및 이를 포함하는 표시 장치
JP7288200B2 (ja) * 2020-07-30 2023-06-07 日亜化学工業株式会社 発光装置および梱包体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
CN103289588A (zh) * 2012-03-02 2013-09-11 日东电工株式会社 粘合片

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144433B1 (ja) 1970-02-02 1976-11-29
JP4991348B2 (ja) * 2006-04-06 2012-08-01 リンテック株式会社 粘着シート
KR100815383B1 (ko) 2006-12-28 2008-03-20 제일모직주식회사 점착필름 형성용 광경화성 조성물 및 이를 포함하는 다이싱다이본딩 필름
JP2010031183A (ja) 2008-07-30 2010-02-12 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5144433B2 (ja) * 2008-08-28 2013-02-13 古河電気工業株式会社 チップ保護用フィルム
JP5048815B2 (ja) * 2010-07-20 2012-10-17 日東電工株式会社 フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
TWI637439B (zh) * 2012-12-14 2018-10-01 琳得科股份有限公司 Protective film forming film
KR20220035981A (ko) * 2013-03-22 2022-03-22 린텍 가부시키가이샤 보호막 형성용 필름 및 보호막 형성용 복합 시트
WO2016027883A1 (ja) * 2014-08-22 2016-02-25 リンテック株式会社 保護膜形成用シートおよび保護膜付き半導体チップの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
CN103289588A (zh) * 2012-03-02 2013-09-11 日东电工株式会社 粘合片

Also Published As

Publication number Publication date
WO2017188231A1 (ja) 2017-11-02
KR20190002471A (ko) 2019-01-08
JP6971977B2 (ja) 2021-11-24
KR102407322B1 (ko) 2022-06-10
TW201806767A (zh) 2018-03-01
JPWO2017188231A1 (ja) 2019-03-07
CN109071845A (zh) 2018-12-21
CN109071845B (zh) 2024-08-09

Similar Documents

Publication Publication Date Title
TWI783931B (zh) 能量線硬化性膜的用途以及保護膜形成用複合片的用途
JP6854811B2 (ja) 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法
JP6963024B2 (ja) 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法
TWI782910B (zh) 保護膜形成用膜以及保護膜形成用複合片
JP7071916B2 (ja) 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
TWI781099B (zh) 保護膜形成用膜、保護膜形成用複合片、以及能量線硬化性膜的用途
WO2019082974A1 (ja) 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法
JP7086986B2 (ja) 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法
JP6837057B2 (ja) 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
JP7290771B2 (ja) 保護膜形成用フィルム及び保護膜形成用複合シート
TWI778960B (zh) 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法
TWI796297B (zh) 保護膜形成用複合片
JP6929835B2 (ja) 保護膜形成用複合シート
JP6438173B2 (ja) 保護膜形成用フィルム及び保護膜形成用複合シート
JP6938477B2 (ja) 保護膜形成用複合シート
TW202239923A (zh) 保護膜形成膜、保護膜形成用複合片、以及具保護膜之晶片的製造方法
TW202239924A (zh) 保護膜形成膜、保護膜形成用複合片、以及具保護膜之晶片的製造方法
TW202239895A (zh) 保護膜形成膜、保護膜形成用複合片、以及具保護膜之晶片的製造方法
JP2024008899A (ja) 保護膜形成フィルム、保護膜形成用複合シート、キット、及び、保護膜形成フィルムの使用

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent