KR102407322B1 - 보호막 형성용 필름 및 보호막 형성용 복합 시트 - Google Patents

보호막 형성용 필름 및 보호막 형성용 복합 시트 Download PDF

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Publication number
KR102407322B1
KR102407322B1 KR1020187030754A KR20187030754A KR102407322B1 KR 102407322 B1 KR102407322 B1 KR 102407322B1 KR 1020187030754 A KR1020187030754 A KR 1020187030754A KR 20187030754 A KR20187030754 A KR 20187030754A KR 102407322 B1 KR102407322 B1 KR 102407322B1
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KR
South Korea
Prior art keywords
protective film
forming
film
meth
group
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KR1020187030754A
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English (en)
Korean (ko)
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KR20190002471A (ko
Inventor
다이스케 야마모토
요이치 이나오
Original Assignee
린텍 가부시키가이샤
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Publication of KR20190002471A publication Critical patent/KR20190002471A/ko
Application granted granted Critical
Publication of KR102407322B1 publication Critical patent/KR102407322B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
KR1020187030754A 2016-04-28 2017-04-25 보호막 형성용 필름 및 보호막 형성용 복합 시트 KR102407322B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016092013 2016-04-28
JPJP-P-2016-092013 2016-04-28
PCT/JP2017/016335 WO2017188231A1 (ja) 2016-04-28 2017-04-25 保護膜形成用フィルム及び保護膜形成用複合シート

Publications (2)

Publication Number Publication Date
KR20190002471A KR20190002471A (ko) 2019-01-08
KR102407322B1 true KR102407322B1 (ko) 2022-06-10

Family

ID=60161658

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187030754A KR102407322B1 (ko) 2016-04-28 2017-04-25 보호막 형성용 필름 및 보호막 형성용 복합 시트

Country Status (5)

Country Link
JP (1) JP6971977B2 (ja)
KR (1) KR102407322B1 (ja)
CN (1) CN109071845A (ja)
TW (1) TWI781099B (ja)
WO (1) WO2017188231A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019186990A1 (ja) * 2018-03-30 2019-10-03 リンテック株式会社 支持シート及び保護膜形成用複合シート
KR20200133288A (ko) * 2019-05-16 2020-11-27 삼성디스플레이 주식회사 고분자 수지, 이를 포함하는 윈도우 모듈, 및 이를 포함하는 표시 장치
JP7288200B2 (ja) * 2020-07-30 2023-06-07 日亜化学工業株式会社 発光装置および梱包体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100815383B1 (ko) 2006-12-28 2008-03-20 제일모직주식회사 점착필름 형성용 광경화성 조성물 및 이를 포함하는 다이싱다이본딩 필름
JP2010056328A (ja) * 2008-08-28 2010-03-11 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2013181109A (ja) * 2012-03-02 2013-09-12 Nitto Denko Corp 粘着シート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144433B1 (ja) 1970-02-02 1976-11-29
JP4991348B2 (ja) * 2006-04-06 2012-08-01 リンテック株式会社 粘着シート
JP2010031183A (ja) 2008-07-30 2010-02-12 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5491049B2 (ja) * 2009-03-11 2014-05-14 日東電工株式会社 半導体ウエハ保護用基材レス粘着シート、その粘着シートを用いた半導体ウエハ裏面研削方法及びその粘着シートの製造方法
JP5048815B2 (ja) * 2010-07-20 2012-10-17 日東電工株式会社 フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
WO2014092200A1 (ja) * 2012-12-14 2014-06-19 リンテック株式会社 保護膜形成用フィルム
KR102377100B1 (ko) * 2013-03-22 2022-03-21 린텍 가부시키가이샤 보호막 형성용 필름 및 보호막 형성용 복합 시트
SG11201701270QA (en) * 2014-08-22 2017-03-30 Lintec Corp Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100815383B1 (ko) 2006-12-28 2008-03-20 제일모직주식회사 점착필름 형성용 광경화성 조성물 및 이를 포함하는 다이싱다이본딩 필름
JP2010056328A (ja) * 2008-08-28 2010-03-11 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2013181109A (ja) * 2012-03-02 2013-09-12 Nitto Denko Corp 粘着シート

Also Published As

Publication number Publication date
JP6971977B2 (ja) 2021-11-24
KR20190002471A (ko) 2019-01-08
TW201806767A (zh) 2018-03-01
WO2017188231A1 (ja) 2017-11-02
TWI781099B (zh) 2022-10-21
CN109071845A (zh) 2018-12-21
JPWO2017188231A1 (ja) 2019-03-07

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