CN109071845A - 保护膜形成用膜以及保护膜形成用复合片 - Google Patents

保护膜形成用膜以及保护膜形成用复合片 Download PDF

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Publication number
CN109071845A
CN109071845A CN201780025032.9A CN201780025032A CN109071845A CN 109071845 A CN109071845 A CN 109071845A CN 201780025032 A CN201780025032 A CN 201780025032A CN 109071845 A CN109071845 A CN 109071845A
Authority
CN
China
Prior art keywords
protective film
film formation
methyl
film
energy ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780025032.9A
Other languages
English (en)
Chinese (zh)
Inventor
山本大辅
稻男洋
稻男洋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN109071845A publication Critical patent/CN109071845A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
CN201780025032.9A 2016-04-28 2017-04-25 保护膜形成用膜以及保护膜形成用复合片 Pending CN109071845A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-092013 2016-04-28
JP2016092013 2016-04-28
PCT/JP2017/016335 WO2017188231A1 (ja) 2016-04-28 2017-04-25 保護膜形成用フィルム及び保護膜形成用複合シート

Publications (1)

Publication Number Publication Date
CN109071845A true CN109071845A (zh) 2018-12-21

Family

ID=60161658

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780025032.9A Pending CN109071845A (zh) 2016-04-28 2017-04-25 保护膜形成用膜以及保护膜形成用复合片

Country Status (5)

Country Link
JP (1) JP6971977B2 (ja)
KR (1) KR102407322B1 (ja)
CN (1) CN109071845A (ja)
TW (1) TWI781099B (ja)
WO (1) WO2017188231A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111951694A (zh) * 2019-05-16 2020-11-17 三星显示有限公司 高分子树脂、包含其的窗口模组以及包括其窗口模组的显示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019186990A1 (ja) * 2018-03-30 2019-10-03 リンテック株式会社 支持シート及び保護膜形成用複合シート
JP7288200B2 (ja) * 2020-07-30 2023-06-07 日亜化学工業株式会社 発光装置および梱包体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007297591A (ja) * 2006-04-06 2007-11-15 Lintec Corp 粘着シート
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
JP2013181109A (ja) * 2012-03-02 2013-09-12 Nitto Denko Corp 粘着シート
CN104937712A (zh) * 2013-03-22 2015-09-23 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144433B1 (ja) 1970-02-02 1976-11-29
KR100815383B1 (ko) * 2006-12-28 2008-03-20 제일모직주식회사 점착필름 형성용 광경화성 조성물 및 이를 포함하는 다이싱다이본딩 필름
JP2010031183A (ja) 2008-07-30 2010-02-12 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5144433B2 (ja) * 2008-08-28 2013-02-13 古河電気工業株式会社 チップ保護用フィルム
JP5048815B2 (ja) * 2010-07-20 2012-10-17 日東電工株式会社 フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
WO2014092200A1 (ja) * 2012-12-14 2014-06-19 リンテック株式会社 保護膜形成用フィルム
SG11201701270QA (en) * 2014-08-22 2017-03-30 Lintec Corp Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007297591A (ja) * 2006-04-06 2007-11-15 Lintec Corp 粘着シート
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
JP2010212474A (ja) * 2009-03-11 2010-09-24 Nitto Denko Corp 半導体ウエハ保護用基材レス粘着シート、その粘着シートを用いた半導体ウエハ裏面研削方法及びその粘着シートの製造方法
JP2013181109A (ja) * 2012-03-02 2013-09-12 Nitto Denko Corp 粘着シート
CN104937712A (zh) * 2013-03-22 2015-09-23 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111951694A (zh) * 2019-05-16 2020-11-17 三星显示有限公司 高分子树脂、包含其的窗口模组以及包括其窗口模组的显示装置

Also Published As

Publication number Publication date
JP6971977B2 (ja) 2021-11-24
KR20190002471A (ko) 2019-01-08
TW201806767A (zh) 2018-03-01
WO2017188231A1 (ja) 2017-11-02
TWI781099B (zh) 2022-10-21
JPWO2017188231A1 (ja) 2019-03-07
KR102407322B1 (ko) 2022-06-10

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