TWI776021B - 加工裝置 - Google Patents

加工裝置 Download PDF

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Publication number
TWI776021B
TWI776021B TW108105372A TW108105372A TWI776021B TW I776021 B TWI776021 B TW I776021B TW 108105372 A TW108105372 A TW 108105372A TW 108105372 A TW108105372 A TW 108105372A TW I776021 B TWI776021 B TW I776021B
Authority
TW
Taiwan
Prior art keywords
cutting
groove
processing
axis
reference line
Prior art date
Application number
TW108105372A
Other languages
English (en)
Chinese (zh)
Other versions
TW201935551A (zh
Inventor
宮田諭
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201935551A publication Critical patent/TW201935551A/zh
Application granted granted Critical
Publication of TWI776021B publication Critical patent/TWI776021B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW108105372A 2018-02-20 2019-02-19 加工裝置 TWI776021B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-027609 2018-02-20
JP2018027609A JP6998232B2 (ja) 2018-02-20 2018-02-20 加工装置

Publications (2)

Publication Number Publication Date
TW201935551A TW201935551A (zh) 2019-09-01
TWI776021B true TWI776021B (zh) 2022-09-01

Family

ID=67689034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108105372A TWI776021B (zh) 2018-02-20 2019-02-19 加工裝置

Country Status (4)

Country Link
JP (1) JP6998232B2 (ko)
KR (1) KR102595400B1 (ko)
CN (1) CN110176410B (ko)
TW (1) TWI776021B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6998231B2 (ja) * 2018-02-20 2022-01-18 株式会社ディスコ 加工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141310A (ja) * 2000-11-06 2002-05-17 Tokyo Seimitsu Co Ltd ダイシング装置
TW200833447A (en) * 2006-10-19 2008-08-16 Disco Corp Laser processing device
JP2015046541A (ja) * 2013-08-29 2015-03-12 株式会社ディスコ 切削溝の検出方法
TW201736070A (zh) * 2016-03-15 2017-10-16 Disco Corp 被加工物的切割方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501970B2 (ja) * 1991-05-14 1996-05-29 株式会社東京精密 ダイシング装置の溝切制御装置
JP2955937B2 (ja) * 1998-03-16 1999-10-04 株式会社東京精密 ダイシングマシンの溝切制御方法及び装置
JPH11283938A (ja) * 1998-03-31 1999-10-15 Disco Abrasive Syst Ltd ダイシング方法
JP2001297999A (ja) * 2000-04-12 2001-10-26 Disco Abrasive Syst Ltd 切削装置
JP4462717B2 (ja) * 2000-05-22 2010-05-12 株式会社ディスコ 回転ブレードの位置検出装置
JP5198203B2 (ja) * 2008-09-30 2013-05-15 株式会社ディスコ 加工装置
JP5389580B2 (ja) * 2009-09-17 2014-01-15 株式会社ディスコ 切削装置
JP5762005B2 (ja) * 2011-01-13 2015-08-12 株式会社ディスコ 加工位置調製方法及び加工装置
JP2012256794A (ja) * 2011-06-10 2012-12-27 Disco Abrasive Syst Ltd 加工装置
JP6013166B2 (ja) 2012-12-11 2016-10-25 株式会社ディスコ 切削装置
JP6196884B2 (ja) * 2013-11-13 2017-09-13 株式会社ディスコ レーザ加工装置
JP2016025224A (ja) * 2014-07-22 2016-02-08 株式会社ディスコ パッケージウェーハの加工方法
JP6604715B2 (ja) * 2014-09-12 2019-11-13 株式会社ディスコ レーザー加工装置
JP6498073B2 (ja) * 2015-08-14 2019-04-10 株式会社ディスコ 切削ブレードの位置ずれ検出方法
JP6559074B2 (ja) * 2016-01-28 2019-08-14 株式会社ディスコ パッケージウェーハの加工方法
JP6935168B2 (ja) * 2016-02-12 2021-09-15 株式会社ディスコ 加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141310A (ja) * 2000-11-06 2002-05-17 Tokyo Seimitsu Co Ltd ダイシング装置
TW200833447A (en) * 2006-10-19 2008-08-16 Disco Corp Laser processing device
JP2015046541A (ja) * 2013-08-29 2015-03-12 株式会社ディスコ 切削溝の検出方法
TW201736070A (zh) * 2016-03-15 2017-10-16 Disco Corp 被加工物的切割方法

Also Published As

Publication number Publication date
CN110176410B (zh) 2023-08-18
JP6998232B2 (ja) 2022-01-18
TW201935551A (zh) 2019-09-01
CN110176410A (zh) 2019-08-27
KR102595400B1 (ko) 2023-10-27
KR20190100022A (ko) 2019-08-28
JP2019145637A (ja) 2019-08-29

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