TWI774805B - 晶圓加工方法 - Google Patents

晶圓加工方法 Download PDF

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Publication number
TWI774805B
TWI774805B TW107125158A TW107125158A TWI774805B TW I774805 B TWI774805 B TW I774805B TW 107125158 A TW107125158 A TW 107125158A TW 107125158 A TW107125158 A TW 107125158A TW I774805 B TWI774805 B TW I774805B
Authority
TW
Taiwan
Prior art keywords
wafer
grinding
polishing
inclination
chuck table
Prior art date
Application number
TW107125158A
Other languages
English (en)
Chinese (zh)
Other versions
TW201909270A (zh
Inventor
竹川真弘
森竜彥
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201909270A publication Critical patent/TW201909270A/zh
Application granted granted Critical
Publication of TWI774805B publication Critical patent/TWI774805B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW107125158A 2017-07-25 2018-07-20 晶圓加工方法 TWI774805B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017143698A JP6917233B2 (ja) 2017-07-25 2017-07-25 ウエーハの加工方法
JP2017-143698 2017-07-25

Publications (2)

Publication Number Publication Date
TW201909270A TW201909270A (zh) 2019-03-01
TWI774805B true TWI774805B (zh) 2022-08-21

Family

ID=65172588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107125158A TWI774805B (zh) 2017-07-25 2018-07-20 晶圓加工方法

Country Status (4)

Country Link
JP (1) JP6917233B2 (ja)
KR (1) KR102507675B1 (ja)
CN (1) CN109290876B (ja)
TW (1) TWI774805B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7273568B2 (ja) * 2019-03-19 2023-05-15 株式会社ディスコ 加工装置
CN110116340A (zh) * 2019-06-05 2019-08-13 湖南大合新材料有限公司 一种碲锌镉晶片的抛光工艺
JP7431048B2 (ja) * 2020-01-27 2024-02-14 株式会社ディスコ 加工装置、及び加工装置に用いる支持部
WO2021166668A1 (ja) * 2020-02-17 2021-08-26 東京エレクトロン株式会社 加工方法及び加工装置
CN111730430B (zh) * 2020-07-30 2021-10-15 华海清科(北京)科技有限公司 具有可调节的吸盘转台的磨削设备
CN111823084B (zh) * 2020-07-30 2021-11-26 华海清科(北京)科技有限公司 具有差动螺纹结构的磨削设备
CN114454086B (zh) * 2022-02-17 2023-04-07 北京通美晶体技术股份有限公司 一种GaAs晶片的加工工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200949921A (en) * 2008-03-31 2009-12-01 Tokyo Seimitsu Co Ltd Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
JP2015150642A (ja) * 2014-02-14 2015-08-24 株式会社ディスコ 研削研磨装置
TW201714213A (zh) * 2009-12-15 2017-04-16 國立大學法人大阪大學 拋光裝置及拋光工具

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2636383B2 (ja) * 1988-11-18 1997-07-30 富士通株式会社 ウェーハの加工方法
JP3006249B2 (ja) * 1991-12-24 2000-02-07 信越半導体株式会社 半導体ウェーハの研磨装置
JPH11309653A (ja) * 1998-04-27 1999-11-09 Tokyo Seimitsu Co Ltd ウェーハの平面加工装置
KR101715024B1 (ko) * 2006-12-28 2017-03-10 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 사파이어 기판
JP2008258554A (ja) * 2007-03-12 2008-10-23 Disco Abrasive Syst Ltd ウェーハの研削加工装置
DE102009030294B4 (de) * 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
JP2013004726A (ja) * 2011-06-16 2013-01-07 Disco Abrasive Syst Ltd 板状物の加工方法
US9120194B2 (en) * 2011-07-21 2015-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for wafer grinding
JP5788304B2 (ja) 2011-12-06 2015-09-30 株式会社ディスコ 研削装置
JP6271339B2 (ja) * 2014-05-26 2018-01-31 株式会社ディスコ 研削研磨装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200949921A (en) * 2008-03-31 2009-12-01 Tokyo Seimitsu Co Ltd Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
TW201714213A (zh) * 2009-12-15 2017-04-16 國立大學法人大阪大學 拋光裝置及拋光工具
JP2015150642A (ja) * 2014-02-14 2015-08-24 株式会社ディスコ 研削研磨装置

Also Published As

Publication number Publication date
JP6917233B2 (ja) 2021-08-11
TW201909270A (zh) 2019-03-01
KR20190011677A (ko) 2019-02-07
JP2019029374A (ja) 2019-02-21
CN109290876A (zh) 2019-02-01
KR102507675B1 (ko) 2023-03-07
CN109290876B (zh) 2022-03-11

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