TWI771836B - Grinding mechanism and grinding apparatus - Google Patents

Abstract

The present invention enables a uniform flatness to be obtained during rough grinding and finishing grinding of a grinding object, and is provided with a plurality of tables 2 that hold planar grinding objects W, at least one rough grinding unit 4 that performs rough grinding on the grinding object W, and at least one finishing grinding unit 5 that performs finishing grinding on the grinding object W, wherein the rough grinding unit 4 and the finishing grinding unit 5 are able to be moved to each of the plurality of tables 2.

Description

Grinding mechanism and grinding device

The present invention relates to a grinding mechanism and a grinding device.

For example, when grinding an object to be ground such as a resin-sealed substrate, there is a case where fine grinding is performed after rough grinding.

Furthermore, it has been considered that rough grinding and fine grinding are performed by separate grinding devices, or in a semiconductor tape grinder including two stages as shown in Patent Document 1, rough grinding is performed on one stage, and Finish grinding on another platform. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 6181799

[Problems to be Solved by Invention] However, in either the case where rough grinding and finish grinding are performed using different grinding devices, or the case where rough grinding and finish grinding are performed on different platforms as in Patent Document 1, it is necessary to perform rough grinding after rough grinding. Transfer the grinding object to another stage. As a result, alignment needs to be performed again on the transferred platform. Even if they are aligned, the level of the table before and after the transfer is not completely the same, so the flatness of the object to be ground fixed on the table will be affected. The flatness of the grinding object changes. As a result, there is a concern that the grinding accuracy will deteriorate. Especially when the object to be ground is thin (eg, 5 mm or less, 1 mm or less), the flatness (grinding accuracy) is a serious problem.

Therefore, the main subject of this invention is to make the flatness constant in rough grinding and fine grinding of the grinding object.

[Technical means to solve the problem] That is, the grinding mechanism of the present invention includes: a plurality of stages for holding a plate-shaped object to be ground; at least one rough grinding section for rough grinding the object to be ground; and at least one fine grinding section for grinding the object The object is subjected to fine grinding, and the rough grinding portion and the fine grinding portion are configured to be movable on each of the plurality of stages. The grinding apparatus of the present invention includes the grinding mechanism.

[Effect of invention] According to this invention comprised as mentioned above, the flatness of rough grinding and finish grinding can be made constant in each of a some surface plate.

Next, the present invention will be described in more detail by way of examples. However, the present invention is not limited by the following description.

As described above, the grinding mechanism of the present invention is characterized by comprising: a plurality of stages for holding a plate-shaped grinding object; at least one rough grinding section for rough grinding the grinding object; and at least one fine grinding section, Fine grinding is performed on the object to be ground, and the rough grinding portion and the fine grinding portion are configured to be movable on each of the plurality of stages. With this type of grinding mechanism, the rough grinding section and the fine grinding section are configured to be movable on each of the plurality of stages, so that the rough grinding and the fine grinding can be performed in a state where the object to be ground is held on each stage. both. This eliminates the need to transfer the object to be ground to a different stage, and does not need to align it again on a different stage, and the flatness of rough grinding and finish grinding can be made constant for each of the plurality of stages. As a result, the throughput (processing capacity) can be increased by simultaneously grinding a plurality of objects to be ground, and the grinding accuracy of the objects to be ground in each stage can be improved.

In each stage, in order to have a structure in which both rough grinding and fine grinding are performed independently from other stages, it is desirable that a plurality of the rough grinding portion and the fine grinding portion are provided corresponding to the plurality of stages, respectively. .

When rough grinding is performed on one of the two tables and fine grinding is performed on the other table (if the two tables do not perform rough grinding or fine grinding at the same timing), there is no need for the two tables. A rough grinding section and a fine grinding section are set up corresponding to each platform. Therefore, in order to simplify the structure, at least one of the rough grinding portion or the fine grinding portion is desirably shared by at least two of the platforms.

In the grinding mechanism of the present invention, as a specific embodiment for moving the plurality of stages, it is considered that the grinding mechanism further includes a plurality of stage moving parts provided on each of the plurality of stages, and making the The stage reciprocates linearly within a predetermined range along one direction.

In this configuration, as a specific movement form of the rough grinding part and the finishing grinding part, it is considered that the rough grinding part and the finishing grinding part traverse the reciprocating movement direction of the stage by the stage moving part. move in the direction of the cut. Preferably, the rough grinding portion and the fine grinding portion move in a direction orthogonal to the reciprocating direction of the table.

In rough grinding, since the grinding amount increases, clogging of the grinding stone for rough grinding becomes a problem. Therefore, the rough grinding portion is desirably a horizontal axis-type grinding portion including a grinding stone for rough grinding. In addition, the horizontal axis type grinding part is a grinding method in which the rotation axis of the grinding stone is parallel to the table surface.

According to this structure, clogging of the grinding stone for rough grinding can be reduced.

In addition, it is preferable that the said finish grinding part is a vertical axis|shaft type grinding part including the grindstone for finish grinding. In addition, the grinding part of the vertical axis type is a grinding method in which the rotation axis of the grinding stone is perpendicular to the table surface.

With this structure, high-precision grinding can be performed, the grinding area is large, and productivity can be improved.

The problem of clogging of the grinding stone for rough grinding or the grinding stone for fine grinding increases depending on the type of the object to be ground. In addition, there are also objects to be ground that do not require too much grinding accuracy, such as objects to be ground such as those in which only copper wiring portions or soldered portions are exposed. In the case of the object to be ground as described above, if the grinding stone for rough grinding or the grinding stone for fine grinding is used, the running cost increases. In order to appropriately solve this problem, the rough grinding part or the fine grinding part is preferably a belt grinding type grinding part using an endless belt-shaped grinding belt. Compared with the grinding stone for rough grinding or the grinding stone for fine grinding, the grinding belt is inexpensive and can achieve significant cost reduction. In addition, the replacement work of the grinding belt is also easier than that of the grinding stone for rough grinding or the grinding stone for fine grinding.

In order to be able to select the grinding form according to the type of the object to be ground, and to improve the versatility of the grinding mechanism, the rough grinding section is desirably configured to be a horizontal axis type grinding section including a rough grinding stone or an endless belt-shaped grinding section. The form of the belt grinding type grinding part of the grinding belt is changed, and the finishing grinding part is ideally constituted so as to be able to use a vertical axis type grinding part including a grinding stone for finishing grinding and a grinding belt using an endless belt. The form of the grinding section of the belt grinding type is changed.

In order to improve the grinding accuracy by stably supporting the rough grinding part and the finishing grinding part, it is desirable to further include a pair of leg parts provided to sandwich the plurality of platforms, and a connecting beam part spanning the pair of leg parts. , and the rough grinding portion and the fine grinding portion are movably supported by the connecting beam portion.

Here, in the connection beam portion, it is desirable to support either the rough grinding portion or the fine grinding portion on the near side, and support the rough grinding portion or the fine grinding portion on the deep side. of the other. According to this structure, the unevenness of rough grinding due to the deflection of the connecting beam portion and the like can be made the same for each stage, and the difference of the fine grinding due to the deflection of the connecting beam portion, etc. can be made uniform. are the same.

In addition, in order to improve the versatility of the grinding mechanism, it is desirable to include a belt grinding section using an endless belt-shaped grinding belt in addition to the rough grinding section and the finishing grinding section, and the plurality of stage On each of the above, the belt grinding section is configured to be movable.

In order to suppress poor grinding caused by burrs or to improve the quality of the object to be ground, it is desirable that the grinding mechanism further includes a deburring section for deburring the object to be ground, and on each of the plurality of stages, The deburring portion is configured to be movable.

In addition, a grinding device including the above-mentioned grinding mechanism is also one aspect of the present invention.

<One Embodiment of the Present Invention> Hereinafter, an embodiment of the grinding apparatus of the present invention will be described with reference to the drawings. In addition, about any figure shown below, in order to understand easily, it is abbreviate|omitted or exaggerated and a schematic drawing is shown suitably. About the same component, the same code|symbol is attached|subjected, and description is abbreviate|omitted suitably.

In the following description, as a plate-shaped grinding object, a resin-sealed substrate (sealed substrate) will be described as an example. Examples of the substrate include general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, and lead frames. In addition to this, the plate-shaped grinding object may be an object other than a substrate.

<Overall Structure of Grinding Device 100 > The grinding apparatus 100 of the present embodiment performs the height adjustment (thickness adjustment) of the substrate W or the grinding of the electronic components mounted on the substrate W by plane-grinding the surface of the sealed substrate W (hereinafter simply referred to as the “substrate W”). Improvements in substrates such as improved heat dissipation.

Specifically, as shown in FIG. 1 , the grinding apparatus 100 includes a substrate supply module 100A for supplying the substrate W, a substrate grinding module 100B for grinding the substrate W, a substrate cleaning module 100C for cleaning the ground substrate W, and The substrate storage modules 100D in which the ground substrates W are accommodated are used as constituent elements, respectively. Each of the constituent elements 100A to 100D is mutually detachable and replaceable with respect to the other constituent elements, respectively. In addition, the movement of the substrate W between the modules 100A to 100D is performed by the substrate transfer mechanism 100E and/or a robot arm (not shown). The entire operation of the grinding apparatus 100 of the present embodiment is controlled by a control device CTL including a control unit 9 to be described later.

The substrate supply module 100A supplies the substrate W before grinding (substrate before grinding). Specifically, the substrate supply module 100A includes a pre-grinding substrate supply unit 11 that supplies the substrate W.

The substrate grinding module 100B performs plane grinding on the surface of the substrate W conveyed by the substrate conveying mechanism 100E and/or the robot arm (not shown). Specifically, the substrate grinding module 100B performs both rough grinding and fine grinding. Details will be described later.

The substrate cleaning module 100C cleans the substrate W (ground substrate) ground by the substrate grinding module 100B. Specifically, the substrate cleaning module 100C includes a rotary cleaning unit 13 that cleans the ground substrate W with a cleaning liquid such as water, and a drying unit 14 that dries the cleaned substrate W. In addition to this, the substrate cleaning module 100C may be provided with an inspection unit 15 including a camera for determining the quality of the substrate W. In addition, this inspection part 15 may be provided as an inspection module separately from the substrate cleaning module 100C.

The substrate storage module 100D accommodates the substrates W that are cleaned by the substrate cleaning module 100C and transported by the substrate transport mechanism 100E and/or a robot arm (not shown). Specifically, the substrate storage module 100D includes a ground substrate storage portion 12 in which the substrates W are stored. In addition, the substrate storage module 100D may be the same module as the substrate supply module 100A by providing the ground substrate storage portion 12 in the substrate supply module 100A.

<Substrate grinding module 100B (grinding mechanism)> Next, the substrate grinding module 100B (grinding mechanism) will be described in detail.

Specifically, as shown in FIGS. 1 to 3 , the substrate grinding module 100B includes a plurality of stages 2 for holding the substrate W, a plurality of stage moving parts 3 for linearly reciprocating the plurality of stages 2, At least one rough grinding portion 4 for performing rough grinding and at least one fine grinding portion 5 for performing fine grinding on the substrate W; and on each of the plurality of stages 2, the rough grinding portion 4 and the fine grinding portion 5 are configured to be capable of move. In addition, in this embodiment, it is a structure which includes two stages 2 and two stage moving parts 3 .

Each stage 2 holds the substrate W by suction, and a plurality of suction holes (not shown) for suctioning the substrate W are formed on the upper surface thereof. In addition, a plurality of adsorption holes are connected to the suction pump VP. The stage 2 of the present embodiment is formed into a rectangular shape in plan view corresponding to the substrate W having a rectangular shape in plan view.

Each stage moving part 3 linearly reciprocates the stage 2 within a predetermined range along one direction (Y direction). In addition, each stage moving part 3 can linearly reciprocate the stage 2 independently of the other stage moving parts 3 . Specifically, each stage moving part 3 linearly reciprocates the stage 2 between a first position P set on the near side in the Y direction and a second position Q set on the deep side in the Y direction. Here, the first position P is a position where the substrate W is received and delivered, but may be set to a position different from the position where the substrate W is received and delivered.

Each stage moving part 3 of the present embodiment is configured to move the stage 2 so that the longitudinal direction of the stage 2 matches the reciprocating movement direction (Y direction) of the stage 2 . In addition, it is desirable that each stage moving part 3 does not include a mechanism for rotating the stage 2 in order to achieve high grinding accuracy. Two stage moving parts 3 are arranged side by side in the X direction, and each stage moving part 3 includes a Y-direction rail provided along the Y-direction, a Y-direction slider on which the Y-direction rail is slid and the stage 2 is fixed, and The Y-direction drive unit (eg, ball screw and servo motor) driven by this Y-direction slider. In addition, the Y-direction drive part is controlled by the control part 9 mentioned later, and the stage 2 linearly reciprocates along the Y-direction rail.

In the present embodiment, at least one of the rough grinding unit 4 and the fine grinding unit 5 is provided for each of the plurality of stages 2 (the plurality of stage moving parts 3 ). Specifically, in this embodiment, one rough grinding part 4 and one fine grinding part 5 are provided corresponding to one of the table 2 , and one rough grinding part 4 and one fine grinding part are provided corresponding to the other table 2 . 5.

Each rough grinding part 4 moves within the movement range of the board|substrate W by the corresponding stage moving part 3, and rough-grinds the upper surface of the board|substrate W. This rough grinding part 4 is a horizontal axis type grinding part including the grinding stone 41 for rough grinding, and is set so that the rotation axis of the main shaft 42 which rotates the grinding stone 41 for rough grinding is parallel to the table surface. The grinding stone 41 for rough grinding is formed in a disk shape, and the outer peripheral surface thereof is a usable surface for grinding.

Each fine grinding unit 5 moves within the moving range of the substrate W by the corresponding stage moving unit 3 to perform fine grinding on the substrate W. As shown in FIG. The finish grinding part 5 is a vertical axis type grinding part including the finish grinding stone 51 , and is set so that the rotation axis of the main shaft 52 that rotates the finish grinding stone 51 is perpendicular to the table surface. Here, the grinding stone 51 for fine grinding is a grinding stone with finer pores than the grinding stone 41 for rough grinding. In addition, the grinding stone 51 for fine grinding is formed in an annular shape or a disk shape, and one end surface in the axial direction is a use surface for grinding. Furthermore, the grinding stone 51 for finish grinding has a diameter larger than the width dimension of the substrate W. As shown in FIG.

Specifically, each rough grinding part 4 and each fine grinding part 5 are configured to move in a direction transverse to the reciprocating movement direction (Y direction) of the table 2 by the table moving part 3 . In this embodiment, each rough grinding part 4 and each fine grinding part 5 are configured to move in the X direction orthogonal to the Y direction between the first position P and the second position Q.

Moreover, the board|substrate grinding module 100B of this embodiment includes the support part 6 of a portal type, and supports each rough grinding part 4 and each fine grinding part 5 so that a movement is possible. As shown in FIGS. 2 and 3 , the support portion 6 includes a pair of leg portions 61 provided on both sides of the two platforms 2 (the two platform moving portions 3 ), and a connecting beam spanning the pair of leg portions 61 . and each rough grinding part 4 and each fine grinding part 5 are supported on this connecting beam part 62 in a movable manner. The connecting beam portion 62 is provided along the X direction between the first position P and the second position Q. In the present embodiment, the two rough grinding parts 4 are supported on the front side of the connecting beam part 62 , and the two fine grinding parts 5 are supported on the deep side of the connecting beam part 62 . With this configuration, the positions in the Y direction for rough grinding or fine grinding of the two substrates W are the same. As a result, the unevenness of rough grinding due to the deflection of the connecting beam portion 62 and the like can be made the same for each stage 2, and the fine grinding due to the deflection of the connecting beam portion 62 and the like can be made uniform. Not all the same.

Here, between the connecting beam portion 62 and each rough grinding portion 4, as shown in FIG. 2, a rough grinding portion moving portion 7 is provided, and between the connecting beam portion 62 and each fine grinding portion 5, as shown in FIG. 3 As shown, a finish grinding part moving part 8 is provided. In addition, in FIG. 1, the rough grinding part moving part 7 and the fine grinding part moving part 8 are not shown in figure.

The rough grinding part moving part 7 moves each rough grinding part 4 in the X direction. For example, the connecting beam part 62 includes an X direction rail provided along the X direction, and an X direction moving along the X direction rail. A slider, and an X-direction drive unit that drives the X-direction slider. The X-direction slider and the X-direction drive part are provided corresponding to the two rough grinding parts 4 , respectively. In addition, the X-direction track is common to the two rough grinding parts 4, but may be provided in correspondence with each other. Each X-direction drive unit is controlled by a control unit 9 to be described later, and each rough grinding unit 4 moves along the X direction independently of each other.

In addition, the rough grinding portion moving portion 7 is configured to be capable of moving each rough grinding portion 4 in the Z direction, and the connecting beam portion 62 includes a Z direction rail provided along the Z direction, and a Z direction rail along the Z direction. The Z-direction slider that moves, and the Z-direction drive unit that drives the Z-direction slider. The Z-direction rail, the Z-direction slider, and the Z-direction drive part are provided corresponding to the two rough grinding parts 4 , respectively. The respective Z-direction drive units are controlled by a control unit 9 to be described later, and the respective rough grinding units 4 move along the Z-direction independently of each other.

The fine-grinding portion moving portion 8 moves each fine-grinding portion 5 in the X direction. For example, the connecting beam portion 62 includes an X-direction rail provided along the X-direction, and an X-direction slide that moves along the X-direction rail. and an X-direction drive unit that drives the X-direction slider. The X-direction slider and the X-direction drive part are provided corresponding to the two fine grinding parts 5, respectively. In addition, the X-direction track is common to the two finish grinding parts 5, but may be provided in correspondence with each other. Each X-direction drive unit is controlled by a control unit 9 to be described later, and each finish grinding unit 5 moves along the X direction independently of each other.

In addition, the fine grinding part moving part 8 is configured to move each fine grinding part 5 in the Z direction, and the connecting beam part 62 includes a Z direction rail provided along the Z direction, and moves along the Z direction rail The Z-direction slider, and the Z-direction drive unit that drives the Z-direction slider. The Z-direction rail, the Z-direction slider, and the Z-direction drive part are provided corresponding to the two finish grinding parts 5 , respectively. The respective Z-direction drive units are controlled by a control unit 9 to be described later, and the respective finish grinding units 5 move along the Z-direction independently of each other.

In the above-described configuration, each part is controlled by the control unit 9 to perform rough grinding and fine grinding on the substrates W held by the plurality of stages 2 , respectively.

Hereinafter, focusing on one stage 2, rough grinding and fine grinding of the substrate W held on this stage 2 will be described.

When performing rough grinding on each substrate W, the control unit 9 moves the rough grinding unit 4 within the moving range of the substrate W as shown in FIG. 4(A) to perform rough grinding in a predetermined order.

The control unit 9 controls the stage moving unit 3 to linearly reciprocate the substrate W, and controls the rough grinding unit moving unit 7 to move the rough grinding unit 4 in the X direction, thereby controlling the entire upper surface of the substrate W. Perform rough grinding. For example, the control unit 9 linearly moves the stage 2 at least once to perform rough grinding on a desired portion of the substrate W along the longitudinal direction, and then shifts the rough grinding portion 4 in the X direction so that the rough grinding portion 4 is misaligned. In the grinding part, the table 2 is moved linearly at least once, and a desired portion of the substrate W is roughly ground in the longitudinal direction. By repeating these operations, the entire upper surface of the substrate W is roughly ground.

In the rough grinding, the control unit 9 adjusts the rough grinding amount of the substrate W by performing feedback control on the position of the rough grinding section 4 in the Z direction.

Specifically, the control unit 9 controls the rough grinding unit 4 so that the thickness of the substrate W reaches a predetermined target value based on detection signals from one or a plurality of contact sensors 10 (see FIG. 1 ) that are in contact with the substrate W. The position in the Z direction is feedback controlled. The touch sensor 10 is provided corresponding to each stage 2 . Here, the thickness of the substrate W may be obtained from the difference between the position of the upper surface of the stage in the Z direction and the position of the upper surface of the substrate in the Z direction, or may be obtained from the position of the upper surface of the substrate before grinding in the Z direction and after grinding The grinding amount obtained from the position in the Z direction of the upper surface of the substrate is obtained. In addition, the sensor for detecting the thickness or the grinding amount of the substrate W may be a displacement sensor other than a contact sensor, such as an optical sensor.

When performing fine grinding on the substrate W after rough grinding, the control unit 9 moves the fine grinding unit 5 within the movement range of the substrate W as shown in FIG.

The control unit 9 controls the finish grinding unit moving unit 8, arranges the finish grinding stone 51 of the finish grinding unit 5 at a position in contact with the substrate W, and controls the stage moving unit 3 to move the substrate W linearly, thereby The entire upper surface of the substrate W is finely ground. For example, the control unit 9 controls the finish grinding unit moving unit 8 to control the stage moving unit 3 to move the substrate W linearly at least after the finish grinding stone 51 is arranged at a position in contact with the entire width direction of the substrate W. Once, the substrate W is finely ground along the longitudinal direction.

In the above-mentioned fine grinding, the control unit 9 performs feedback control of the position of the fine grinding unit 5 in the Z direction, and adjusts the fine grinding amount of the substrate W. As shown in FIG. Specifically, based on the detection signal from the touch sensor 10 in contact with the substrate W, the control unit 9 feedback-controls the position of the finishing portion 5 in the Z direction so that the thickness of the substrate W reaches a predetermined target value. Here, the thickness of the substrate W may be obtained from the difference between the position of the upper surface of the stage in the Z direction and the position of the upper surface of the substrate in the Z direction, or may be obtained from the position of the upper surface of the substrate before grinding in the Z direction and after grinding The grinding amount obtained from the position in the Z direction of the upper surface of the substrate is obtained.

Here, when rough grinding and fine grinding are performed on the substrates W held by the two stages 2 , the rough grinding parts 4 and the fine grinding parts 5 are configured not to interfere with each other. In this embodiment, as shown in FIG. 2 , the grinding stones 41 for rough grinding provided as two rough grinding parts 4 (horizontal-axis type grinding parts) face each other on the inside and the main shaft 42 is located on the outside.

In addition, in each stage 2, when one of the rough grinding part 4 and the fine grinding part 5 grinds the substrate W, the control part 9 retracts the other of the rough grinding part 4 or the fine grinding part 5 to a position similar to that of the rough grinding part 4 or the fine grinding part 5. The opposite side (outside) of the other platforms 2. Thereby, the movement of the grinding part 4 and the grinding part 5 which perform grinding on the other table 2 is not hindered. In addition to this, when either the rough grinding part 4 or the fine grinding part 5 grinds the substrate W, the other of the rough grinding part 4 or the fine grinding part 5 may be The Z direction rises and retreats.

＜Grinding method＞ Next, an example of a grinding method using the grinding apparatus 100 of the present embodiment will be described. In this example, it is assumed that rough grinding is performed simultaneously in both platforms 2, and then finishing is performed simultaneously.

First, the substrate transfer mechanism 100E receives the substrates W from the pre-grinding substrate supply unit 11 of the substrate storage module 100A, and sequentially transfers the substrates to the two stages 2 of the substrate grinding module 100B. Here, the stage 2 attracts and holds the transferred substrate W. In this embodiment, in order to achieve high grinding accuracy, the stage moving part 3 does not include a mechanism for rotating the stage 2 . Therefore, the grinding apparatus 100 includes an alignment mechanism for aligning the orientation of the substrates W of the substrate conveyance mechanism 100E with the orientation of the substrates W of the stage moving unit 3 (see FIG. 1 ). The alignment mechanism may be, for example, a rotation mechanism included in the substrate transfer mechanism 100E, or a transfer mechanism such as a robot arm that moves the substrate W from the substrate transfer mechanism 100E to the stage 2 while appropriately rotating the substrate W.

Then, the rough grinding section 4 corresponding to each stage 2 is moved to a predetermined grinding position, and the stage moving section 3 performs the rough grinding of the substrate W by linearly reciprocating the stage 2 . In this rough grinding, based on the detection signal of the touch sensor 10 , the position of the rough grinding portion 4 in the Z direction is feedback-controlled so that the thickness of the substrate W reaches a predetermined target value.

After the rough grinding is completed, the rough grinding part 4 is withdrawn to the outside of the moving range of the table 2 . Then, the fine grinding part 5 corresponding to each stage 2 moves to a predetermined grinding position, and the stage moving part 3 linearly reciprocates the stage 2 to perform fine grinding of the roughly ground substrate W. In this fine grinding, based on the detection signal of the touch sensor 10 , the position of the fine grinding portion 5 in the Z direction is feedback-controlled so that the thickness of the substrate W reaches a predetermined target value.

After finishing grinding, the substrate transfer mechanism 100E and/or the robot arm (not shown) sequentially transfers the substrates W to the substrate cleaning module 100C. The substrate W cleaned and inspected by the substrate cleaning module 100C is transferred to the ground substrate storage unit 12 of the substrate storage module 100D by the substrate transfer mechanism 100E and/or a robot arm (not shown).

As another grinding method, it is also considered that rough grinding is performed on one table 2 and fine grinding is performed on the other table 2, and rough grinding and fine grinding are alternately performed on both tables 2, and the two tables 2 are used for rough grinding. The grinding timing is staggered on each platform 2. In addition, as another grinding method, it is also conceivable to perform rough grinding and fine grinding independently on each stage 2 .

In these cases, the sequence of rough grinding and fine grinding on each stage 2 is the same as that described above, but the substrate transfer mechanism 100E and/or the robot arm (not shown) performs the fine grinding at the end of each fine grinding. The ground substrate W is transferred to the substrate cleaning module 100C, and the unground substrate W is transferred from the unground substrate supply unit 11 to the stage 2 on which the substrate W is not held.

<Effects of the present embodiment> According to the grinding apparatus 100 of the present embodiment, since the rough grinding unit 4 and the fine grinding unit 5 are configured to be movable on each of the plurality of stages 2 , rough grinding can be performed with the substrate W held on each stage 2 . and fine grinding. Accordingly, it is not necessary to transfer the substrate W to a different stage, and it is not necessary to align again on a different stage, and the flatness of rough grinding and finish grinding can be made constant on each of the plurality of stages 2 . As a result, by simultaneously grinding a plurality of substrates W, the throughput (processing capacity) can be increased, and the grinding accuracy of the substrates W on each stage 2 can be improved.

<Other variant embodiments> In addition, this invention is not limited to the said embodiment.

For example, as shown in FIGS. 5(A) and 5(B) , at least one of the rough grinding portion 4 and the fine grinding portion 5 may be shared by at least two stages 2 . For example, as shown in FIG. 5(A) , the rough grinding portion 4 may be provided on each of the two tables 2 , and a single fine grinding portion 5 may be shared by the two tables 2 . In addition, as shown in FIG. 5(B) , one rough grinding part 4 and one fine grinding part 5 may be shared on two tables 2 , and the rough grinding and the rough grinding may be alternately performed on the two tables 2 . Fine grinding. Furthermore, although not shown in the figure, the fine grinding part 5 may be provided on each of the two tables 2 , and the one rough grinding part 4 may be shared by the two tables 2 .

In addition, in the connecting beam portion 62, one of the two rough grinding portions 4 may be provided on the near side, the other may be provided on the deep side, and one of the two fine grinding portions may be provided on the near side. And the other is provided in the deep side. With this structure, when rough grinding or fine grinding is performed simultaneously on both tables 2, the rough grinding parts 4 or the fine grinding parts 5 can be structurally not interfered with each other.

Furthermore, in addition to the above-described embodiment, as shown in FIG. 6 , a deburring unit 16 may be provided that moves within the moving range of the substrate W by the stage moving unit 3 to deburr the substrate W . As with the rough grinding part 4 and the fine grinding part 5 , the deburring part 16 is considered to be movably supported by the connecting beam part 62 . As the deburring portion 16, for example, it is considered to include bristles. Here, when providing the deburring part 16, it can arrange|position easily by combining with the structure which shares the rough grinding part 4 or the fine grinding part 5 on the two stages 2. In addition, the deburring part 16 can be shared by both platforms 2 .

In the above-described embodiment, the rough grinding part 4 uses the grinding stone 41 for rough grinding, and the fine grinding part 5 uses the grinding stone 51 for fine grinding. However, as shown in FIG. 7 , the rough grinding part 4 or the finishing grinding part 5 may use endless A belt-type grinding section of the belt-shaped grinding belt 171 (hereinafter referred to as the belt-type grinding section 17 ). In addition, the grinding belt 171 is formed into a belt shape by joining both ends of a belt-shaped polishing cloth having abrasive grains adhered to the surface thereof. Compared with the grinding stone 41 for rough grinding or the grinding stone 51 for fine grinding, the grinding belt 171 is inexpensive, and a significant cost reduction can be achieved. In addition, the replacement work of the grinding belt 171 is also easier than that of the grinding stone 41 for rough grinding or the grinding stone 51 for finishing grinding. Furthermore, the belt grinding section 17 is effective when grinding an object to be ground, for example, by using the grinding stone 41 for rough grinding or when removing burrs formed on the object to be ground. The substrate W in which the problem of clogging of the grinding stone 51 for fine grinding becomes significant, or the substrate W in which only the copper wiring portion or the soldering portion is exposed, for example, does not require high grinding accuracy.

The belt grinding unit 17 includes a drive pulley 174 rotatably driven by the drive shaft 173 of the main shaft 172 , a contact pulley 175 , and an endless belt-shaped grinding belt 171 looped around the pulleys 174 and 175 . Moreover, the tension roller 176 which applies tension to the grinding belt 171 may be included. Each of these parts 172 to 176 is supported by the base member 170 .

In addition, as shown in FIG. 8 , this belt grinding section 17 includes a covering body 177 that covers the grinding belt 171 so as to expose a part of the grinding belt 171 . The lower wall portion 177a (the wall surface facing the substrate W) of the cover body 177 is formed in a planar shape, and the lower wall portion 177a is formed with an opening portion 177H for exposing the grinding tape 171 . Here, since the lower wall portion 177a of the cover body 177 has a planar shape facing the substrate W, a grinding fluid such as water supplied from the outside is formed in the space between the lower surface of the lower wall portion 177a and the upper surface of the substrate W. It flows in the middle and is efficiently supplied to the grinding section.

Further, in the lower wall portion 177a of the cover body 177 or the lower side portion of the side wall portion 177b connected to the lower wall portion 177a, a discharge hole 177c for discharging the grinding fluid entering the inside of the cover body 177 to the outside is formed. Moreover, in the rough grinding part 4 and the fine grinding part 5, similarly to the belt grinding part 17, you may provide the cover body which covers so that a part of these grinding stones 41 and 51 may be exposed.

In addition to the configuration in which the rough grinding section 4 or the fine grinding section 5 is the belt grinding section 17 , the substrate grinding module 100B (grinding mechanism) may include, in addition to the rough grinding section 4 and the fine grinding section 5 , the use of The belt grinding part 17 of the endless belt-shaped grinding belt 171 . The belt grinding section 17 is configured to be movable on each of the plurality of stages 2 , and similarly to the rough grinding section 4 and the fine grinding section 5 , is considered to be movably supported by the connecting beam section 62 .

In addition to this, the rough grinding unit 4 may be configured to be changeable in the form of a horizontal axis type grinding unit including a rough grinding stone 41 and a belt grinding type grinding unit using an endless belt-shaped grinding belt 171 . The fine grinding section 5 may be configured to be changeable in the form of a vertical axis type grinding section including a fine grinding stone 51 and a belt grinding type grinding section using an endless belt-shaped grinding belt 171 . By making them changeable, the grinding form according to the type of the substrate W can be selected, and the versatility of the substrate grinding module 100B (grinding mechanism) can be improved.

In this case, as shown in FIG. 9 , the Z-direction slider 18 of the Z-direction moving part in the rough grinding part 4 and the fine grinding part 5 may be configured to be attached using the attachment member 19a and the attachment member 19b . For example, the rough grinding portion 4 is attached to the Z-direction slider via the attachment member 19 a for the rough grinding portion 4 . Moreover, the fine grinding part 5 is attached to the Z-direction slider 18 via the attachment member 19b for the fine grinding part 5. As shown in FIG. In addition, in FIG. 9, although the example in which the belt grinding part 17 is attached to the Z direction slider 18 without using an attachment member is shown, you may attach it to the Z direction slider 18 using the attachment member for a belt grinding part. By using the attachment members 19a and 19b corresponding to the grinding sections 4 and 5 as described above, the rough grinding section 4 (horizontal axis type) and the belt grinding section 17 can be changed with each other, and the fine grinding section 5 (vertical grinding section 5 (vertical) can be changed. Shaft type) and the belt grinding section 17 can be mutually changed. In FIG. 9 , since the rough grinding part 4, the finishing grinding part 5, and the Z-direction slider 18 of the Z-direction moving part are used in common, the rough grinding part 4 (horizontal axis type), the finishing grinding part 5 (vertical axis type) can be type) and the belt grinding section 17 are mutually changed. In addition, the horizontal axis type main shaft 42 and the main shaft 172 of the belt grinding unit 17 may be used in common, and the grinding stone 41 for rough grinding and the grinding belt 171 may be changed to each other with respect to the common main shaft.

Furthermore, in addition to the said embodiment, the grinding|polishing grinding part which consists of the grinding|polishing grindstone with a finer hole than the grinding|polishing grindstone 51 for fine grinding part 5 may be provided. This grinding and grinding portion is configured to be movable on each of the plurality of stages 2 , and is considered to be movably supported by the connecting beam portion 62 in the same manner as the rough grinding portion 4 and the fine grinding portion 5 .

In the above-described embodiment, two platforms 2 are arranged in parallel, but three or more platforms 2 may be arranged in parallel.

In the above-described embodiment, the plurality of stages 2 are used to grind one type of grinding object W, but the types of the grinding objects W to be ground on each of the plurality of stages 2 may be different. , and a structure in which a plurality of types of grinding objects W are ground. In this case, the rough grinding part 4 and the fine grinding part 5 provided corresponding to each stage 2 are selected according to the type of each grinding object W. FIG.

In addition, although the rough grinding part 4 of the said embodiment is a horizontal axis|shaft type grinding|polishing part, it can also be set as a vertical axis|shaft type grinding part. On the other hand, although the finishing grinding part 5 of the said embodiment is a vertical axis|shaft type grinding|polishing part, it can also be set as a horizontal axis|shaft type grinding part. Moreover, by replacing the grindstone attached to the main shaft of the grinding part with, for example, a grinding stone for rough grinding and a grinding stone for finishing grinding, the rough grinding part and the finishing grinding part can be arranged in various ways.

In addition, a rotating part that rotates the grinding part may be provided between each grinding part and the grinding part moving part. This rotating part rotates the rotation axis of the grinding part by 90 degrees, and can be switched between the vertical axis type and the horizontal axis type.

In addition to this, the support portion 6 in the above-described embodiment is a gate type, but may be a cantilever type including one leg portion and a beam portion extending from the leg portion.

In addition to this, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made within a range that does not deviate from the gist.

2: Platform 3: Platform Moving Department 4: Rough grinding department 5: Fine grinding department 6: Support part 7: Rough grinding part moving part 8: Fine grinding part moving part 9: Control Department 10: Touch sensor 11: Substrate supply section before grinding 12: Grinding completed board storage part 13: Washing Department 14: Drying section 15: Inspection Department 16: Deburring Department 17: Belt Grinding Department 18: Z-direction slider 19a, 19b: Auxiliary components 41: Grinding stone for rough grinding 42: Spindle 51: Grinding stone for fine grinding 52: Spindle 61: A pair of feet 62: Connecting beam 100: Grinding device 100A: Substrate supply module 100B: Substrate grinding module (grinding mechanism) 100C: Substrate cleaning module 100D: Substrate storage module 100E: Substrate transfer mechanism 170: Base member 171: Grinding belt 172: Spindle 173: Drive shaft 174: Drive Wheel 175: Contact Wheel 176: Tension Wheel 177: Overlay 177a: lower wall 177b: side wall 177c: drain hole 177H: Opening CTL: Control Machine P: first position Q: The second position VP: suction pump W: Plate-shaped grinding object (sealed substrate, substrate)

FIG. 1 is a plan view schematically showing the configuration of one embodiment of the grinding apparatus of the present invention. FIG. 2 is a front view (viewed from the front side) schematically showing the structure of the grinding mechanism of the embodiment. 3 is a rear view (viewed from the deep side) schematically showing the structure of the grinding mechanism of the embodiment. 4 is a plan view schematically showing (A) a state in which rough grinding is performed and (B) a state in which fine grinding is performed in the embodiment. 5 is a plan view schematically showing the configuration of the grinding apparatus according to the present invention (A) in a case where a fine grinding part is used in common, and (B) a case in which a rough grinding part and a fine grinding part are used in common. 6 is a plan view schematically showing the configuration of a modified embodiment of the grinding apparatus of the present invention. 7 is a front view and a side view schematically showing the structure of a belt grinding section according to a modified embodiment. FIG. 8 is a schematic diagram showing the structure of a sleeve in the belt grinding section. FIG. 9 is a diagram schematically showing a mounting structure of a rough grinding part, a finishing grinding part, and a belt grinding part on a slider in the Z direction.

2: Platform

3: Platform Moving Department

4: Rough grinding department

5: Fine grinding department

6: Support part

9: Control Department

10: Touch sensor

11: Substrate supply section before grinding

12: Grinding completed board storage part

13: Washing Department

14: Drying section

15: Inspection Department

41: Grinding stone for rough grinding

42: Spindle

51: Grinding stone for fine grinding

52: Spindle

100: Grinding device

100A: Substrate supply module

100B: Substrate grinding module (grinding mechanism)

100C: Substrate cleaning module

100D: Substrate storage module

100E: Substrate transfer mechanism

CTL: Control Machine

P: first position

Q: The second position

VP: suction pump

W: Plate-shaped grinding object (sealed substrate, substrate)

Claims (5)

A grinding mechanism comprising: two platforms for holding a plate-shaped grinding object in which a metal substrate is sealed with resin; two rough grinding parts for rough grinding the grinding object; and one fine grinding part for The object to be ground is subjected to fine grinding; one deburring part is used for deburring the object to be ground; two stage moving parts are provided on each of the two stages, so that the stage is moved along one direction. Linear reciprocating movement is performed within a predetermined range; a pair of leg portions are provided to sandwich the two platforms; and a connecting beam portion is spanned over the pair of legs and is moved along and using the two platforms. the direction perpendicular to the direction of the linear reciprocating movement; and the rough grinding part, the fine grinding part and the deburring part are in the direction perpendicular to the direction of the linear reciprocating movement using the two platform moving parts, so as to be able to The two platforms are supported by the connecting beam portion in a way that both of them move, the two rough grinding portions are arranged on one side of the connecting beam portion, and the fine grinding portion and the deburring portion are arranged on the same side as the connecting beam portion. The one side is the other side of the connecting beam portion on the opposite side. The grinding mechanism of claim 1, wherein the fine grinding portion is shared by the two platforms. The grinding mechanism according to claim 1 or claim 2, further comprising using an endless belt in addition to the rough grinding part and the fine grinding part and on each of the two platforms, the belt grinding portion is configured to be movable. The grinding mechanism according to claim 1 or claim 2, wherein the deburring portion is configured to be movable on each of the two platforms. A grinding device, comprising the grinding mechanism according to any one of claim 1 to claim 4.

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