TW202124093A - Grinding mechanism and grinding apparatus - Google Patents

Abstract

The present invention enables a uniform flatness to be obtained during rough grinding and finishing grinding of a grinding object, and is provided with a table 2 that holds a planar grinding object W, a table moving unit 3 that moves the table 2 reciprocatingly in a straight line within a predetermined range in one direction, a rough grinding unit 4 that is moved to within a range of movement within which the grinding object W can be moved by the table moving unit 3, and performs rough grinding on the grinding object W, and a finishing grinding unit 5 that is moved to within the range of movement within which the grinding object W can be moved by the table moving unit 3, and performs finishing grinding on the grinding object W.

Description

Grinding mechanism and grinding device

The invention relates to a grinding mechanism and a grinding device.

In the case of grinding an object to be ground, such as a resin-sealed substrate, there is a case in which finish grinding is performed after rough grinding.

Moreover, it has been considered that rough grinding and fine grinding are performed using separate grinding devices, or in a semiconductor belt grinder including two stages as shown in Patent Document 1, rough grinding is performed on one of the stages, and Fine grinding is carried out on another platform. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 6181799

[The problem to be solved by the invention] However, in either the case of using different grinding devices to perform rough grinding and fine grinding, and the case of performing rough grinding and fine grinding on different platforms as in Patent Document 1, it is necessary to perform the rough grinding after the rough grinding. Transfer the grinding object to another platform. As a result, the alignment needs to be performed again on the platform after the transfer. Even if it is aligned, the levelness of the platform is not exactly the same before and after the transfer, so it affects the flatness of the grinding object fixed on the platform for grinding, resulting in the flatness of the grinding object during rough grinding and that during fine grinding. The flatness of the grinding object changes. As a result, there is a concern that the grinding accuracy will deteriorate. Especially when the grinding object is thin (for example, 5 mm or less, 1 mm or less), the problem of flatness (grinding accuracy) is serious.

Therefore, the main subject of the present invention is to make the flatness constant in the rough grinding and the fine grinding of the grinding object.

[Technical means to solve the problem] That is, the grinding mechanism of the present invention includes: a platform for holding a plate-shaped grinding object; a platform moving part for making the platform linearly reciprocate within a predetermined range in one direction; and a rough grinding part for using The stage moving part moves within the moving range of the grinding target to perform rough grinding on the grinding target; and the fine grinding part moves within the moving range of the grinding target using the stage moving part , Perform fine grinding on the grinding object. The grinding device of the present invention includes the grinding mechanism.

[Effects of the invention] According to the present invention constituted as described above, it is possible to make the flatness constant in the rough grinding and the fine grinding of the grinding object.

Next, the present invention will be described in further detail with an example. However, the present invention is not limited by the following description.

As described above, the grinding mechanism of the present invention is characterized by including: a platform for holding a plate-shaped grinding object; a platform moving part for causing the platform to linearly reciprocate within a predetermined range in one direction; and rough grinding Part, which moves within the range of movement of the grinding object using the platform moving part to perform rough grinding on the grinding object; Move within the moving range to perform fine grinding on the grinding object. With this type of grinding mechanism, the rough grinding part and the fine grinding part respectively move within the moving range of the grinding target using the platform moving part to grind the grinding target. Therefore, the grinding target can be held on one platform. In the state of rough grinding and fine grinding. Therefore, there is no need to transfer the grinding target to a different platform, and there is no need to re-align on a different platform, and it is possible to make the flatness constant in the rough grinding and fine grinding of the grinding target. As a result, the grinding accuracy of the grinding object can be improved. In addition, in the rough grinding part and the fine grinding part, since the moving range of the platform is common, the coverage area (installation area) of the grinding mechanism can be reduced.

As a specific movement form of the rough grinding portion and the fine grinding portion, it is considered that the rough grinding portion and the fine grinding portion are in a direction transverse to the reciprocating movement direction of the platform using the platform moving portion move. It is preferable to consider that the rough grinding part and the fine grinding part move in a direction orthogonal to the reciprocating movement direction of the platform.

As the amount of rough grinding increases, clogging of the grindstone for rough grinding becomes a problem. Therefore, the rough grinding part is desirably a horizontal axis type grinding part including a grinding stone for rough grinding. In addition, the horizontal axis type grinding part is a grinding method in which the rotation axis of the grinding stone is parallel to the table surface. With this structure, clogging of the grindstone for rough grinding can be reduced.

In addition, the fine grinding part is desirably a longitudinal axis type grinding part including a grinding stone for fine grinding. In addition, the vertical axis type grinding part is a grinding method in which the rotation axis of the grinding stone is perpendicular to the table surface. With this structure, high-precision grinding can be performed, the grinding area is large, and productivity can be improved.

Depending on the type of the grinding object, the problem of clogging of the grinding stone for rough grinding or the grinding stone for fine grinding becomes greater. In addition, there are also objects to be polished, such as objects that only expose copper wiring portions or soldered portions, and the like that do not require a high degree of accuracy in polishing. In the case of the grinding object as described above, if the grinding stone for rough grinding or the grinding stone for fine grinding is used, the running cost increases. In order to appropriately solve this problem, the rough grinding part or the fine grinding part is desirably a belt grinding type grinding part using an endless belt-shaped grinding belt. Compared with grinding stones for rough grinding or grinding stones for fine grinding, grinding belts are inexpensive and can achieve a significant cost reduction. In addition, the grinding belt is easier to exchange than a grinding stone for rough grinding or a grinding stone for fine grinding.

In order to be able to select a grinding form corresponding to the type of object to be ground, and to improve the versatility of the grinding mechanism, the rough grinding part is ideally configured to be able to use a horizontal shaft type grinding part including a grinding stone for rough grinding and an endless belt shape. The form of the belt grinding type grinding part of the grinding belt is changed. The finishing grinding part is ideally configured to be able to use a longitudinal axis type grinding part including a grinding stone for finishing grinding and an endless belt-shaped grinding belt. The form of the belt grinding type grinding section is changed.

Specifically, the grinding mechanism includes: a rough grinding part moving part to move the rough grinding part; a fine grinding part moving part to move the fine grinding part; and a control part to control the rough grinding part moving part and the The moving part of the fine grinding and cutting part is controlled. In this structure, in order to prevent the two grinding parts from interfering with each other in a controlled manner, the control part is desirably: when one of the rough grinding part or the fine grinding part grinds the grinding object At this time, the other of the rough grinding part or the fine grinding part is retracted to the outside of the movement range of the grinding object.

In order to improve the grinding accuracy by stably supporting the rough grinding part and the fine grinding part, the grinding mechanism desirably further includes: a pair of legs arranged on both sides of the platform moving part; and a connecting beam part erected on the A pair of legs; and the rough grinding portion and the fine grinding portion are movably supported by the connecting beam portion.

Here, in order to prevent the rough grinding portion and the fine grinding portion from interfering with each other structurally, it is desirable to support one of the rough grinding portion or the fine grinding portion on the near side at the connecting beam portion, and The other of the rough grinding part or the fine grinding part is supported on the deep side.

In addition, in order to improve the versatility of the grinding mechanism, in addition to the rough grinding part and the fine grinding part, it is desirable to include a belt grinding part using an endless belt-shaped grinding belt. Move within the moving range of the grinding target by the platform moving part.

In order to suppress grinding defects caused by burrs, or to improve the quality of the grinding object, the grinding mechanism preferably further includes a deburring part that moves within the movement range of the grinding target by the platform moving part , Deburring of the grinding object is performed.

In addition, a grinding device including the grinding mechanism is also an aspect of the present invention.

<One embodiment of the present invention> Hereinafter, an embodiment of the grinding apparatus of the present invention will be described with reference to the drawings. In addition, with regard to any of the drawings shown below, for ease of understanding, the schematic drawing is appropriately omitted or exaggerated. Regarding the same constituent elements, the same reference numerals are attached, and the description is appropriately omitted.

In the following description, as a plate-shaped object to be ground, a resin-sealed substrate (sealed substrate) will be described as an example. Examples of the substrate include general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, lead frames, and the like. In addition, the plate-shaped grinding object may be an object other than the substrate.

<The overall structure of the grinding device 100> The grinding apparatus 100 of the present embodiment performs planar grinding of the surface of the sealed substrate W (hereinafter referred to as "substrate W") to adjust the height (thickness adjustment) of the substrate W, or perform adjustment of the electronic components mounted on the substrate W. Improvement of substrates such as improved heat dissipation.

Specifically, as shown in FIG. 1, the grinding apparatus 100 includes a substrate storage module 100A that stores a substrate W, a substrate grinding module 100B that grinds the substrate W, and a substrate cleaning module 100C that cleans the ground substrate W. Respectively as constituent elements. The respective constituent elements 100A to 100C can be detached from and detached from other constituent elements, and can be replaced. In addition, the movement of the substrate W between the respective modules 100A to 100C is performed by the substrate transport mechanism 100D and/or the robot arm (not shown). The overall operation of the grinding apparatus 100 of the present embodiment is controlled by a control device CTL including a control unit 9 described later.

The substrate storage module 100A supplies the substrate W before grinding (substrate before grinding), and stores the substrate W after grinding (substrate after grinding). Specifically, the substrate storage module 100A includes a pre-grinding substrate supply unit 11 that supplies the pre-grinding substrate W, and a ground-completed substrate storage unit 12 that stores the ground substrate W. In addition, general-purpose parts (for example, magazine racks) may be used to configure the pre-grinding substrate supply unit 11 and the ground-finished substrate storage unit 12.

The substrate grinding module 100B performs planar grinding on the surface of the substrate W conveyed by the substrate conveying mechanism 100D. Specifically, the substrate grinding module 100B performs both rough grinding and fine grinding. The details will be described later.

The substrate cleaning module 100C cleans the ground substrate W that has been ground by the substrate grinding module 100B. In the grinding apparatus 100 of this embodiment, the substrate W is transported from the platform 2 of the substrate grinding module 100B to the substrate washing module 100C by a robot arm (not shown), and is washed. Specifically, the substrate washing module 100C includes a washing unit 13 for spraying a washing liquid such as water on the ground substrate W to wash the substrate, and a drying unit 14 for drying the washed and ground substrate. In addition to this, the substrate cleaning module 100C may be provided with an inspection unit 15 for judging the quality of the substrate W after grinding. In addition, the inspection unit 15 may be separated from the substrate washing module 100C and provided as an inspection module.

The polished substrate W cleaned by this substrate cleaning module 100C is transported to the substrate storage module 100A by a robot arm (not shown) and the substrate transport mechanism 100D, and is stored in the polished substrate storage section 12.

<Substrate grinding module 100B (grinding mechanism)> Next, the substrate grinding module 100B (grinding mechanism) will be described in detail.

Specifically, the substrate grinding module 100B, as shown in FIGS. 1 and 2, includes: a platform 2 to hold the substrate W; a platform moving part 3 to make the platform 2 perform linear reciprocating movement; a rough grinding part 4 to perform a linear reciprocating movement on the substrate W Rough grinding;

The platform 2 sucks and holds the substrate W, and a plurality of suction holes (not shown) for sucking the substrate W are formed on the upper surface thereof. In addition, a plurality of adsorption holes are connected to the suction pump VP. The stage 2 of the present embodiment is formed into a rectangular shape in a plan view corresponding to a substrate W having a rectangular shape in a plan view.

The stage moving part 3 makes the stage 2 linearly reciprocate within a predetermined range along one direction (Y direction). Specifically, the stage moving unit 3 linearly reciprocates the stage 2 between a first position P set on the near side in the Y direction and a second position Q set on the deep side in the Y direction. Here, the first position P is a position where the substrate W is received and delivered, but it may be set to a position different from the position where the substrate W is received and delivered. In order to achieve high grinding accuracy, the platform moving part 3 preferably does not include a mechanism for rotating the platform 2. In this case, the grinding apparatus 100 includes an arrangement mechanism to match the orientation of the substrate W of the substrate transport mechanism 100D with the orientation of the substrate W of the stage moving part 3 (refer to FIG. 1 ). The arrangement mechanism may be, for example, a rotation mechanism included in the substrate transport mechanism 100D, or a transport mechanism such as a robot arm that moves the substrate W from the substrate transport mechanism 100D to the stage 2 while appropriately rotating the orientation of the substrate W.

The platform moving part 3 of this embodiment is a structure which moves the platform 2 so that the longitudinal direction of the platform 2 and the reciprocating direction (Y direction) of the platform 2 may correspond. For example, the platform moving part 3 includes: a Y-direction rail provided along the Y-direction, a Y-direction slider that slides on the Y-direction rail and the platform 2 is fixed, and a Y-direction drive unit that drives the Y-direction slider. . In addition, the Y-direction drive unit is controlled by a control unit 9 described later, so that the stage 2 linearly reciprocates along the Y-direction track.

The rough grinding part 4 moves within the movement range of the substrate W by the stage moving part 3, and rough-grinds the upper surface of the substrate W. This rough grinding part 4 is a horizontal axis type grinding part including the grinding stone 41 for rough grinding, and is set so that the rotation axis of the main shaft 42 which rotates the grinding stone 41 for rough grinding may be parallel with respect to a table surface. This grindstone 41 for rough grinding is formed in the shape of a disc, and the outer peripheral surface becomes a use surface for grinding.

The lapping part 5 moves within the movement range of the substrate W by the stage moving part 3 to perform lapping and lapping of the substrate W. This lapping part 5 is a longitudinal axis type lapping part including the grindstone 51 for lapping, and it is set so that the rotation axis of the main shaft 52 which rotates the grindstone 51 for lapping may be perpendicular|vertical with respect to a table surface. Here, the grinding stone 51 for fine grinding is a grinding stone with a finer hole than the grinding stone 41 for rough grinding. In addition, the grindstone 51 for lapping is formed in a ring shape or a disc shape, and one end surface in the axial direction becomes a use surface for grinding. Furthermore, the grindstone 51 for lapping has a diameter larger than the width dimension of the board|substrate W. As shown in FIG.

Specifically, the rough grinding section 4 and the fine grinding section 5 are configured to move in a direction transverse to the reciprocating movement direction (Y direction) of the stage 2 using the stage moving section 3. In the present embodiment, the rough grinding portion 4 and the fine grinding portion 5 are configured to move between the first position P and the second position Q in the X direction orthogonal to the Y direction.

Furthermore, the substrate grinding module 100B of the present embodiment includes a gate-shaped support portion 6 to support the rough grinding portion 4 and the fine grinding portion 5 in a movable manner. This supporting part 6 as shown in FIG. 2 includes: a pair of legs 61 provided on both sides of the platform moving part 3, a connecting beam part 62 erected on the pair of legs 61, and a rough grinding part 4 and a fine grinding part. The part 5 is movably supported by this connecting beam part 62. The connecting beam portion 62 is provided along the X direction between the first position P and the second position Q. In this embodiment, it is a structure in which both the rough grinding part 4 and the fine grinding part 5 are supported on the deep side of the connection beam part 62. As shown in FIG.

Here, between the connecting beam portion 62 and the rough grinding portion 4, as shown in FIG. 2, a rough grinding portion moving portion 7 is provided, and a fine grinding portion moving portion is provided between the connecting beam portion 62 and the fine grinding portion 5. Section 8. In addition, in FIG. 1, the rough grinding part moving part 7 and the fine grinding part moving part 8 are not shown in figure.

The rough grinding part moving part 7 moves the rough grinding part 4 in the X direction. For example, the connecting beam 62 includes an X-direction rail provided along the X-direction, and an X-direction slide moving along the X-direction rail. And an X-direction drive unit that drives this X-direction slider. This X-direction drive unit is controlled by a control unit 9 described later, and the rough grinding unit 4 moves in the X direction.

In addition, the rough grinding portion moving portion 7 is configured to be capable of moving the rough grinding portion 4 in the Z direction, and the connecting beam portion 62 includes a Z-direction rail provided along the Z direction and moving along the Z-direction rail The Z-direction slider and the Z-direction drive unit that drives the Z-direction slider. This Z-direction drive unit is controlled by a control unit 9 described later, and the rough grinding unit 4 moves in the Z direction.

The lapping part moving part 8 moves the lapping part 5 in the X direction. For example, the connecting beam part 62 includes an X-direction rail provided along the X-direction, and an X-direction slider that moves along the X-direction rail. , And an X-direction drive unit that drives this X-direction slider. This X-direction drive part is controlled by the control part 9 mentioned later, and the lapping part 5 moves along the X direction. In addition, the X-direction rails of the rough grinding part moving part 7 and the fine grinding part moving part 8 can also be made common.

In addition, the lapping section moving section 8 is configured to move the lapping section 5 in the Z direction, and the connecting beam section 62 includes a Z-direction rail provided along the Z-direction, and a Z-direction rail that moves along the Z-direction rail. A Z-direction slider and a Z-direction drive unit that drives the Z-direction slider. This Z-direction drive unit is controlled by a control unit 9 described later, and the lapping unit 5 moves in the Z direction.

In the above configuration, the control unit 9 controls each unit to perform rough grinding and fine grinding of the substrate W.

Specifically, when rough grinding the substrate W, the control unit 9 moves the rough grinding unit 4 within the movement range of the substrate W as shown in FIG. 3(A) to perform rough grinding in a predetermined order.

The control unit 9 controls the stage moving unit 3 to linearly reciprocate the substrate W, and controls the rough grinding unit moving unit 7 to move the rough grinding unit 4 in the X direction, thereby affecting the entire upper surface of the substrate W. Perform rough grinding. For example, the control unit 9 moves the stage 2 linearly at least once, and rough-grinds the desired part of the substrate W along the longitudinal direction, and then staggers the rough-grinding portion 4 in the X direction, and the rough-grinding portion 4 is aligned with the For the grinding part, the stage 2 is moved linearly at least once, and the required part of the substrate W is rough-cut along the longitudinal direction. By repeating the above operation, the entire upper surface of the substrate W is rough-ground.

In the rough grinding, the control unit 9 performs feedback control on the position of the rough grinding unit 4 in the Z direction to adjust the rough grinding amount of the substrate W.

Specifically, based on the detection signals from one or more touch sensors 10 (refer to FIG. 1) in contact with the substrate W, the control unit 9 performs rough grinding so that the thickness of the substrate W reaches a predetermined target value. The position of the part 4 in the Z direction is feedback controlled. Here, the thickness of the substrate W can be obtained from the difference between the position in the Z direction on the upper surface of the stage and the position in the Z direction on the upper surface of the substrate, or it can be based on the difference between the position in the Z direction on the upper surface of the substrate before grinding and the position after grinding The position of the upper surface of the substrate in the Z direction is obtained by the obtained grinding amount. In addition, the sensor for detecting the thickness or the grinding amount of the substrate W may be a displacement sensor of other types such as an optical sensor, in addition to a contact sensor.

On the other hand, when the control unit 9 performs fine grinding on the substrate W after rough grinding, as shown in FIG. Fine grinding.

The control unit 9 controls the lapping section moving section 8, arranges the lapping stone 51 of the lapping section 5 at a position in contact with the substrate W, and controls the stage moving section 3 to move the substrate W linearly, thereby The entire upper surface of the substrate W is rough-ground. For example, the control unit 9 controls the lapping part moving part 8, and after the lapping stone 51 is set to a position in contact with the entire width direction of the substrate W, the stage moving part 3 is controlled to move the substrate W linearly at least Once, the substrate W is polished along the longitudinal direction.

In the finishing grinding, the control unit 9 performs feedback control on the position of the finishing grinding unit 5 in the Z direction to adjust the finishing grinding amount of the substrate W. Specifically, based on the detection signal from the touch sensor 10 in contact with the substrate W, the control unit 9 feedbacks the position of the lapping section 5 in the Z direction so that the thickness of the substrate W reaches a predetermined target value. control. Here, the thickness of the substrate W can be obtained from the difference between the position in the Z direction on the upper surface of the stage and the position in the Z direction on the upper surface of the substrate, or it can be based on the difference between the position in the Z direction on the upper surface of the substrate before grinding and the position after grinding The position of the upper surface of the substrate in the Z direction is obtained by the obtained grinding amount.

Here, in the above-mentioned control, when one of the rough grinding portion 4 or the fine grinding portion 5 is grinding the substrate W, the control portion 9 retracts the other of the rough grinding portion 4 or the fine grinding portion 5 to the substrate. W outside the moving range (refer to Figure 3). Here, in order to retract to the outside of the moving range, in addition to stopping at a predetermined retracted position, it also includes a position that does not hinder the movement of the rough grinding portion 4 or the fine grinding portion 5 that performs grinding within the moving range. For example, the control unit 9 moves one of the rough grinding portion 4 or the fine grinding portion 5 to a retracted position outside the moving range and stops, and then moves the other of the rough grinding portion 4 or the fine grinding portion 5 to the moving range Inside and began to research.

<Effects of this embodiment> According to the grinding apparatus 100 of this embodiment, the rough grinding part 4 and the fine grinding part 5 respectively move within the movement range of the substrate W by the stage moving part 3 to grind the substrate W. Therefore, it is possible to hold the substrate W on one platform 2. In the state of the substrate W, rough grinding and fine grinding are performed. This eliminates the need to transfer the substrate W to a different platform, and does not need to re-align on a different platform, and the flatness can be kept constant during the rough grinding and fine grinding of the substrate W. As a result, the grinding accuracy of the substrate W can be improved.

In addition, in the rough grinding part 4 and the fine grinding part 5, since the moving range of the stage 2 is common, the footprint of the substrate grinding module 100B (grinding mechanism) can be reduced. In this embodiment, since the reciprocating direction of the platform 2 forming the rectangular shape in plan view coincides with the longitudinal direction of the platform 2, it is possible to reduce the size of the coverage area in the width direction of the grinding mechanism.

<Other modified embodiments> In addition, this invention is not limited to the said embodiment.

For example, as shown in FIG. 4, the connecting beam portion 62 may also be configured as follows: one of the rough grinding portion 4 or the fine grinding portion 5 is supported on the near side, and the rough grinding portion 4 or 4 is supported on the deep side The other one in the fine grinding section 5. With this structure, it can be configured so that the rough grinding portion 4 and the fine grinding portion 5 do not physically interfere with each other. Moreover, the rough grinding part moving part 7 and the fine grinding part moving part 8 are arrange|positioned on both sides of the connection beam part 62, and the freedom degree of these design can be enlarged.

In addition, in addition to the above-mentioned embodiment, as shown in FIG. 5, a deburring part 16 may be provided that moves within the moving range of the substrate W by the platform moving part 3 to perform deburring of the substrate W. The deburring department 16. Regarding this deburring part 16, it is considered that, like the rough grinding part 4 and the fine grinding part 5, it is movably supported by the connection beam part 62. As the deburring part 16, it is considered to include, for example, bristles. In addition, in FIG. 5, the deburring part 16 is supported on the near side of the connecting beam part 62, but it may be supported on the deep side.

The rough grinding part 4 of the above-mentioned embodiment uses the grind stone 41 for rough grinding, and the fine grinding part 5 uses the grind stone 51 for fine grinding. However, as shown in FIG. The belt grinding type grinding part of the belt grinding belt 171 (hereinafter referred to as the belt grinding part 17). In addition, the grinding belt 171 joins both ends of a belt-shaped abrasive cloth paper with abrasive grains attached to the surface to form a belt shape. Compared with the grinding stone 41 for rough grinding or the grinding stone 51 for fine grinding, the grinding belt 171 is inexpensive, and can achieve a significant cost reduction. In addition, compared with the grinding stone 41 for rough grinding or the grinding stone 51 for fine grinding, the grinding belt 171 is easy to replace|exchange. Furthermore, the belt-type grinding section 17 is effective in the case of grinding the following grinding object, or removing burrs formed by the grinding object, such as the grinding stone 41 for rough grinding or When the grinding stone 51 for polishing is polished, the problem of clogging becomes significant, or, for example, the substrate W in which only the copper wiring portion or the soldering portion is exposed, the grinding accuracy is not too high.

This belt-type grinding unit 17 includes a driving wheel 174 rotatably driven by a driving shaft 173 of a main shaft 172, a contact wheel 175, and an endless belt-shaped grinding belt 171 that is looped around these wheels 174 and 175. In addition, a tension wheel 176 for applying tension to the grinding belt 171 may also be included. These parts 172 to 176 are supported by the base member 170.

In addition, as shown in FIG. 7, this belt-type grinding portion 17 includes a covering body 177 that covers the grinding belt 171 so that a part of the grinding belt 171 is exposed. The lower wall portion 177 a (the wall surface facing the substrate W) of the covering body 177 is formed in a planar shape, and the lower wall portion 177 a here is formed with an opening 177H for exposing the grinding tape 171. Here, since the lower wall portion 177a of the covering body 177 is formed in a planar shape facing the substrate W, the grinding fluid such as water supplied from the outside is formed in the space between the lower surface of the lower wall portion 177a and the upper surface of the substrate W. Medium flow, efficiently supplied to the grinding part.

In addition, the lower wall portion 177a of the covering body 177 or the lower side portion of the side wall portion 177b connected to the lower wall portion 177a is formed with a discharge hole 177c for discharging the grinding liquid that has entered the covering body 177 to the outside. In addition, in the rough grinding part 4 and the fine grinding part 5, similarly to the belt grinding part 17, a covering body which covers so that a part of these grindstones 41 and 51 may be exposed may be provided.

In addition, in addition to the structure in which the rough grinding section 4 or the fine grinding section 5 is configured as the belt type grinding section 17, the substrate grinding module 100B (grinding mechanism) may include the rough grinding section 4 and the fine grinding section 5, and may also include the use of The belt-type grinding portion 17 of the endless belt-shaped grinding belt 171. This belt grinding part 17 is configured to be movable within the movement range of the substrate W by the stage moving part 3, and it is considered that the belt grinding part 17 is movably supported by the connecting beam part 62 like the rough grinding part 4 and the fine grinding part 5.

In addition, the rough grinding part 4 may be configured to be able to be modified in the form of a horizontal axis type grinding part including a grinding stone 41 for rough grinding and a belt type grinding part using an endless belt-shaped grinding belt 171. The fine grinding part 5 may be configured to be capable of being modified in the form of a longitudinal axis type grinding part including the grinding stone 51 for fine grinding and a belt type grinding part using an endless belt-shaped grinding belt 171. By enabling them to be changed, a grinding form corresponding to the type of substrate W can be selected, and the versatility of the substrate grinding module 100B (grinding mechanism) can be improved.

In this case, as shown in FIG. 8, it may be configured such that the Z-direction slider 18 of the Z-direction moving part in the rough grinding part 4 and the fine grinding part 5 is mounted using the accessory member 19a and the accessory member 19b. . For example, the rough grinding part 4 is attached to the Z-direction slider via an accessory member 19a for the rough grinding part 4. In addition, the fine grinding part 5 is attached to the Z-direction slider 18 via an accessory member 19 b for the fine grinding part 5. In addition, in FIG. 8, an example in which the belt-type grinding part 17 is attached to the Z-direction slider 18 without using an accessory member has been shown, but an accessory member for the belt-type grinding part may also be used to be attached to the Z-direction slider 18. By using the accessory member 19a and the accessory member 19b corresponding to each grinding part 4, 5 as described above, the rough grinding part 4 (horizontal axis type) and the belt grinding part 17 can be changed mutually, and the fine grinding part 5 ( (Vertical axis type) and the belt grinding part 17 are mutually changeable. In FIG. 8, since the rough grinding part 4, the fine grinding part 5, and the Z-direction slider 18 of the Z-direction moving part are common, the rough grinding part 4 (horizontal axis type) and the fine grinding part 5 (vertical axis) Type) and belt grinding section 17 are mutually changed. In addition to this, the horizontal axis type main shaft 42 and the main shaft 172 of the belt grinding unit 17 may be used in common, and the grinding stone 41 for rough grinding and the grinding belt 171 may be mutually changed with respect to this common main shaft.

Furthermore, in addition to the above-mentioned embodiment, a grinding and grinding part including a grinding stone for grinding having a finer hole than the grinding stone 51 for grinding and grinding of the grinding part 5 may be provided. This grinding and grinding part is configured to be able to move within the movement range of the substrate W by the stage moving part 3, and it is considered that, like the rough grinding part 4 and the fine grinding part 5, it is movably supported by the connecting beam part 62.

Moreover, in addition to the above-mentioned embodiment, a polishing part including a polishing grindstone having a finer hole than the polishing stone 51 of the polishing part 5 may be provided. It is considered that this grinding part is supported by the connecting beam part 62 in a movable manner similarly to the rough grinding part 4 and the fine grinding part 5.

In addition, the rough grinding part 4 of the said embodiment is a horizontal axis type grinding part, but it can also be set as a vertical axis type grinding part. On the other hand, the fine grinding part 5 of the above-mentioned embodiment is a vertical axis type grinding part, but it may be a horizontal axis type grinding part.

In addition, a rotating part that rotates the grinding part may be provided between each grinding part and the grinding part moving part. This rotation part rotates the rotation axis of the grinding part by 90 degrees, and can be switched between the vertical axis type and the horizontal axis type.

In addition to this, the support portion 6 of the above-described embodiment is a door type, but it may also be a cantilever type including one leg and a beam extending from the leg.

In the above embodiment, the substrate W is supplied from the substrate storage module 100A, and is again stored in the substrate storage module 100A after grinding and washing. Module) can also be installed separately, for example, the supply module and the storage module can also be installed in opposite positions.

In addition to this, the present invention is not limited to the above-mentioned embodiments, and of course various modifications can be made without departing from the spirit thereof.

2: platform 3: Platform Mobile Department 4: Rough grinding department 5: Fine grinding and cutting department 6: Support 7: Rough grinding part moving part 8: Fine grinding and cutting department moving department 9: Control Department 10: Touch sensor 11: Substrate supply department before grinding 12: After grinding, the substrate storage section 13: Washing part 14: Dry part 15: Inspection Department 16: Deburring Department 17: Belt grinding department 18: Slider in Z direction 19a, 19b: accessory components 41: Grinding stone for rough grinding 42: Spindle 51: Grinding stone for fine grinding 52: Spindle 61: A pair of feet 62: connecting beam 100: Grinding device 100A: substrate storage module 100B: Substrate grinding module (grinding mechanism) 100C: Substrate washing module 100D: substrate transport mechanism 170: base member 171: Grinding Belt 172: Spindle 173: drive shaft 174: drive wheel 175: Contact Wheel 176: Tension Wheel 177: Cover Body 177a: Lower wall 177b: Side wall 177c: discharge hole 177H: opening CTL: control the machine P: First position Q: Second position VP: Suction pump W: Plate-shaped grinding object (sealed substrate, substrate)

FIG. 1 is a plan view schematically showing the structure of an embodiment of the grinding apparatus of the present invention. Fig. 2 is a rear view schematically showing the structure of the grinding mechanism of the embodiment. 3 is a plan view schematically showing (A) a state where rough grinding is performed and (B) a state where fine grinding is performed in the embodiment. Fig. 4 is a plan view schematically showing the configuration of a modified embodiment of the grinding apparatus of the present invention. Fig. 5 is a plan view schematically showing the configuration of a modified embodiment of the grinding apparatus of the present invention. Fig. 6 is a front view and a side view schematically showing the structure of a belt grinding part of a modified embodiment. Fig. 7 is a schematic diagram showing the structure of the sleeve in the belt grinding section. Fig. 8 is a diagram schematically showing the mounting structure of the rough grinding portion, the fine grinding portion, and the belt grinding portion on the Z-direction slider.

2: platform

3: Platform Mobile Department

4: Rough grinding department

5: Fine grinding and cutting department

6: Support

41: Grinding stone for rough grinding

42: Spindle

51: Grinding stone for fine grinding

52: Spindle

P: First position

Q: Second position

W: Plate-shaped grinding object (sealed substrate, substrate)

Claims (11)

A kind of research institute, including: Platform to hold the plate-shaped grinding object; The platform moving part enables the platform to move linearly reciprocatingly within a prescribed range along a direction; A rough grinding part, which moves within the moving range of the grinding target by the platform moving part, and performs rough grinding on the grinding target; and The fine grinding part moves within the movement range of the grinding target by the stage moving part, and performs fine grinding on the grinding target. The research institution described in claim 1, wherein The rough grinding part and the fine grinding part move in a direction transverse to the reciprocating movement direction of the platform using the platform moving part. The research institution described in claim 1 or claim 2, wherein The rough grinding part is a horizontal axis type grinding part including a grinding stone for rough grinding, The fine grinding part is a longitudinal axis type grinding part including a grinding stone for fine grinding. The research institution described in claim 1 or claim 2, wherein The rough grinding part or the fine grinding part is a belt grinding type grinding part using an endless belt-shaped grinding belt. The research institution described in claim 1 or claim 2, wherein The configuration of the rough grinding portion can be changed in the form of a horizontal shaft type grinding portion including a grinding stone for rough grinding and a belt grinding type grinding portion using an endless belt-shaped grinding belt. The configuration of the fine grinding part can be changed in the form of a longitudinal axis type grinding part including a grinding stone for fine grinding and a belt grinding part using an endless belt-shaped grinding belt. The research institutions described in claim 1 or claim 2, including: The moving part of the rough grinding part to move the rough grinding part; The fine grinding and cutting part moving part to move the fine grinding and cutting part; and A control unit, which controls the rough grinding and cutting unit moving unit and the fine grinding and grinding unit moving unit; and When one of the rough grinding portion or the fine grinding portion is grinding the object to be ground, the control unit retracts the other of the rough grinding portion or the fine grinding portion to the position It is out of the moving range of the grinding object. The research institutions described in claim 1 or claim 2 also include: A pair of feet are arranged on both sides of the platform moving part; and The connecting beam is erected on the pair of legs; and The rough grinding part and the fine grinding part are movably supported by the connecting beam part. The research institutions described in claim 1 or claim 2 also include: A pair of feet are arranged on both sides of the platform moving part; and The connecting beam part is erected on the pair of feet; The rough grinding portion and the fine grinding portion are supported by the connecting beam portion in a movable manner; and In the connecting beam portion, one of the rough grinding portion or the fine grinding portion is supported on the near side, and the other of the rough grinding portion or the fine grinding portion is supported on the deep side. The research institution described in claim 1 or claim 2, wherein In addition to the rough grinding part and the fine grinding part, it also includes a belt grinding part using an endless belt-shaped grinding belt. Move within range. The research institutions described in claim 1 or claim 2 also include: The deburring part moves within the moving range of the grinding target by the stage moving part, and performs deburring of the grinding target. A grinding device includes the grinding mechanism according to any one of Claim 1 to Claim 10.

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