TW202126429A - Grinding mechanism and grinding apparatus - Google Patents

Abstract

The present invention enables a uniform flatness to be obtained during rough grinding and finishing grinding of a grinding object, and is provided with a plurality of tables 2 that hold planar grinding objects W, at least one rough grinding unit 4 that performs rough grinding on the grinding object W, and at least one finishing grinding unit 5 that performs finishing grinding on the grinding object W, wherein the rough grinding unit 4 and the finishing grinding unit 5 are able to be moved to each of the plurality of tables 2.

Description

Grinding mechanism and grinding device

The invention relates to a grinding mechanism and a grinding device.

In the case of grinding an object to be ground, such as a resin-sealed substrate, there is a case in which finish grinding is performed after rough grinding.

Moreover, it has been considered that rough grinding and fine grinding are performed using separate grinding devices, or in a semiconductor belt grinder including two stages as shown in Patent Document 1, rough grinding is performed on one of the stages, and Fine grinding is carried out on another platform. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 6181799

[The problem to be solved by the invention] However, in either the case of using different grinding devices to perform rough grinding and fine grinding, and the case of performing rough grinding and fine grinding on different platforms as in Patent Document 1, it is necessary to perform the rough grinding after the rough grinding. Transfer the grinding object to another platform. As a result, the alignment needs to be performed again on the platform after the transfer. Even if it is aligned, the levelness of the platform is not exactly the same before and after the transfer, so it affects the flatness of the grinding object fixed on the platform for grinding, resulting in the flatness of the grinding object during rough grinding and that during fine grinding. The flatness of the grinding object changes. As a result, there is a concern that the grinding accuracy will deteriorate. Especially when the grinding object is thin (for example, 5 mm or less, 1 mm or less), the problem of flatness (grinding accuracy) is serious.

Therefore, the main subject of the present invention is to make the flatness constant in the rough grinding and the fine grinding of the grinding object.

[Technical means to solve the problem] That is, the grinding mechanism of the present invention includes: a plurality of platforms for holding a plate-shaped grinding object; at least one rough grinding portion for rough grinding the grinding object; and at least one fine grinding portion for grinding the object The object is subjected to fine grinding; and on each of the plurality of platforms, the rough grinding portion and the fine grinding portion are configured to be movable. The grinding device of the present invention includes the grinding mechanism.

[Effects of the invention] According to the present invention configured as described above, the flatness of rough grinding and fine grinding can be constant in each of the plurality of platforms.

Next, the present invention will be described in further detail with an example. However, the present invention is not limited by the following description.

As described above, the grinding mechanism of the present invention is characterized by including: a plurality of platforms for holding a plate-shaped grinding object; at least one rough grinding portion for rough grinding the grinding object; and at least one fine grinding portion, The grinding target is subjected to fine grinding; and on each of the plurality of platforms, the rough grinding portion and the fine grinding portion are configured to be movable. With this type of grinding mechanism, the rough grinding section and the fine grinding section are configured to be movable on each of the multiple platforms, so that rough grinding and fine grinding can be performed while holding the grinding target on each platform Both. Therefore, there is no need to transfer the grinding object to a different platform, and there is no need to realign it on a different platform, and the flatness of rough grinding and fine grinding can be kept constant in each of a plurality of platforms. As a result, it is possible to increase the throughput (processing capacity) by grinding a plurality of grinding objects at the same time, and it is possible to improve the grinding accuracy of the grinding objects on each platform.

In each platform, in order to be configured to perform both rough grinding and fine grinding independently from other platforms, it is desirable that the rough grinding part and the fine grinding part are provided in plural corresponding to the plural platforms. .

In the two platforms, when rough grinding is performed on one of the platforms, and fine grinding is performed on the other platform (in the case that rough grinding or fine grinding is not performed on the two platforms at the same timing), there is no need to compare with the two platforms. Each platform is provided with a rough grinding and cutting part corresponding to each other. Therefore, in order to simplify the structure, at least one of the rough grinding part or the fine grinding part is desirably shared in at least two of the platforms.

In the grinding mechanism of the present invention, as a specific embodiment of moving multiple platforms, it is considered that the grinding mechanism further includes a plurality of platform moving parts, the platform moving parts are provided on each of the multiple platforms, and the The platform reciprocates linearly within a prescribed range in one direction. In this structure, as the specific movement form of the rough grinding portion and the fine grinding portion, it is considered that the rough grinding portion and the fine grinding portion are horizontally in the reciprocating direction of the platform using the platform moving portion. Move in the direction of cut. It is preferable to consider that the rough grinding part and the fine grinding part move in a direction orthogonal to the reciprocating movement direction of the platform.

As the amount of rough grinding increases, clogging of the grindstone for rough grinding becomes a problem. Therefore, the rough grinding part is desirably a horizontal axis type grinding part including a grinding stone for rough grinding. In addition, the horizontal axis type grinding part is a grinding method in which the rotation axis of the grinding stone is parallel to the table surface. With this structure, clogging of the grindstone for rough grinding can be reduced.

In addition, the fine grinding part is desirably a longitudinal axis type grinding part including a grinding stone for fine grinding. In addition, the vertical axis type grinding part is a grinding method in which the rotation axis of the grinding stone is perpendicular to the table surface. With this structure, high-precision grinding can be performed, the grinding area is large, and productivity can be improved.

Depending on the type of the grinding object, the problem of clogging of the grinding stone for rough grinding or the grinding stone for fine grinding becomes greater. In addition, there are also objects to be polished, such as objects that only expose copper wiring portions or soldered portions, and the like that do not require a high degree of accuracy in polishing. In the case of the grinding object as described above, if the grinding stone for rough grinding or the grinding stone for fine grinding is used, the running cost increases. In order to appropriately solve this problem, the rough grinding part or the fine grinding part is desirably a belt grinding type grinding part using an endless belt-shaped grinding belt. Compared with grinding stones for rough grinding or grinding stones for fine grinding, grinding belts are inexpensive and can achieve a significant cost reduction. In addition, the grinding belt is easier to exchange than a grinding stone for rough grinding or a grinding stone for fine grinding.

In order to be able to select a grinding form corresponding to the type of object to be ground, and to improve the versatility of the grinding mechanism, the rough grinding part is ideally configured to be able to use a horizontal shaft type grinding part including a grinding stone for rough grinding and an endless belt shape. The form of the belt grinding type grinding part of the grinding belt is changed. The finishing grinding part is ideally configured to be able to use a longitudinal axis type grinding part including a grinding stone for finishing grinding and an endless belt-shaped grinding belt. The form of the belt grinding type grinding section is changed.

In order to improve the grinding accuracy by stably supporting the rough grinding portion and the fine grinding portion, it is desirable to further include a pair of legs provided to sandwich the plurality of platforms, and a connecting beam portion erected on the pair of legs And the rough grinding part and the fine grinding part are movably supported by the connecting beam part.

Here, in the connecting beam portion, it is desirable to support one of the rough grinding portion or the fine grinding portion on the near side, and to support the rough grinding portion or the fine grinding portion on the deep side The other one. With this structure, the unevenness of the rough grinding due to the deflection of the connecting beam can be made uniform for each platform, and the unevenness of the fine grinding due to the deflection of the connecting beam can be reduced. All the same.

In addition, in order to improve the versatility of the grinding mechanism, it is desirable that in addition to the rough grinding part and the fine grinding part, a belt-type grinding part using an endless belt-shaped grinding belt is also included, and the multiple platforms On each of the above, the belt grinding part is configured to be movable.

In order to suppress grinding defects caused by burrs or improve the quality of the grinding object, it is desirable that the grinding mechanism further includes a deburring part that performs deburring of the grinding object, and on each of the plurality of platforms, The deburring part is configured to be movable.

In addition, a grinding device including the grinding mechanism is also an aspect of the present invention.

<One embodiment of the present invention> Hereinafter, an embodiment of the grinding apparatus of the present invention will be described with reference to the drawings. In addition, in order to facilitate understanding of any of the drawings shown below, it is appropriately omitted or exaggerated and schematically depicted. Regarding the same constituent elements, the same reference numerals are attached, and the description is appropriately omitted.

In the following description, as a plate-shaped object to be ground, a resin-sealed substrate (sealed substrate) will be described as an example. Examples of the substrate include general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, lead frames, and the like. In addition, the plate-shaped grinding object may be an object other than the substrate.

<The overall structure of the grinding device 100> The grinding apparatus 100 of the present embodiment performs planar grinding of the surface of the sealed substrate W (hereinafter referred to as "substrate W") to adjust the height (thickness adjustment) of the substrate W, or perform adjustment of the electronic components mounted on the substrate W. Improvement of substrates such as improved heat dissipation.

Specifically, as shown in FIG. 1, the grinding apparatus 100 includes a substrate supply module 100A that supplies a substrate W, a substrate grinding module 100B that grinds the substrate W, a substrate cleaning module 100C that cleans the ground substrate W, and The substrate storage modules 100D in which the ground substrate W is stored are used as constituent elements. The respective constituent elements 100A to 100D can be detached from and detached from other constituent elements, and can be replaced. In addition, the movement of the substrate W between the respective modules 100A to 100D is performed by the substrate transport mechanism 100E and/or a robot arm (not shown). The overall operation of the grinding apparatus 100 of the present embodiment is controlled by a control device CTL including a control unit 9 described later.

The substrate supply module 100A supplies the substrate W before grinding (substrate before grinding). Specifically, the substrate supply module 100A includes a pre-grinding substrate supply unit 11 that supplies the substrate W.

The substrate grinding module 100B performs planar grinding on the surface of the substrate W conveyed by the substrate conveying mechanism 100E and/or the robot arm (not shown). Specifically, the substrate grinding module 100B performs both rough grinding and fine grinding. The details will be described later.

The substrate cleaning module 100C cleans the substrate W (grounded substrate) ground by the substrate grinding module 100B. Specifically, the substrate washing module 100C includes a rotary washing unit 13 for washing the ground substrate W with a washing liquid such as water, and a drying unit 14 for drying the washed substrate W. In addition to this, the substrate cleaning module 100C may be provided with an inspection unit 15 including a camera for judging the quality of the substrate W. In addition, the inspection unit 15 may be separated from the substrate washing module 100C and provided as an inspection module.

The substrate storage module 100D stores the substrate W that is cleaned by the substrate cleaning module 100C and is transported by the substrate transport mechanism 100E and/or the robot arm (not shown). Specifically, the substrate storage module 100D includes a ground substrate storage portion 12 that stores the substrate W. In addition, the substrate storage module 100D may be the same module as the substrate supply module 100A by installing the ground substrate storage section 12 in the substrate supply module 100A.

<Substrate grinding module 100B (grinding mechanism)> Next, the substrate grinding module 100B (grinding mechanism) will be described in detail.

Specifically, as shown in FIGS. 1 to 3, the substrate grinding module 100B includes: a plurality of stages for holding the substrate W; At least one rough grinding part 4 for rough grinding and at least one fine grinding part 5 for finishing the substrate W; and on each of the plurality of platforms 2, the rough grinding part 4 and the fine grinding part 5 are configured to be able to move. In addition, in this embodiment, it is a structure including two platforms 2 and two platform moving parts 3.

Each platform 2 sucks and holds the substrate W, and a plurality of suction holes (not shown) for sucking the substrate W are formed on the upper surface thereof. In addition, a plurality of adsorption holes are connected to the suction pump VP. The stage 2 of the present embodiment is formed in a rectangular shape in a plan view corresponding to a substrate W having a rectangular shape in a plan view.

Each stage moving part 3 makes the stage 2 linearly reciprocate within a predetermined range along one direction (Y direction). In addition, each platform moving part 3 can make the platform 2 linearly reciprocate independently of the other platform moving parts 3. Specifically, each stage moving portion 3 linearly reciprocates the stage 2 between a first position P set on the near side in the Y direction and a second position Q set on the deep side in the Y direction. Here, the first position P is a position where the substrate W is received and delivered, but it may be set to a position different from the position where the substrate W is received and delivered.

Each platform moving part 3 of this embodiment is a structure which moves the platform 2 so that the longitudinal direction of the platform 2 and the reciprocating direction (Y direction) of the platform 2 may correspond. In addition, in order to achieve high grinding accuracy, each stage moving part 3 preferably does not include a mechanism for rotating the stage 2. The two platform moving parts 3 are arranged side by side in the X direction, and each platform moving part 3 includes: a Y-direction rail arranged along the Y-direction, a Y-direction slider that slides on the Y-direction rail and is fixed with the platform 2, and The Y-direction drive unit (for example, ball screw and servo motor) driven by the Y-direction slider. In addition, the Y-direction drive unit is controlled by the control unit 9 described later so that the stage 2 linearly reciprocates along the Y-direction rail.

In this embodiment, at least one of the rough grinding part 4 and the fine grinding part 5 is provided with respect to each of a some stage 2 (a plurality of stage moving parts 3). Specifically, in this embodiment, one rough grinding part 4 and one fine grinding part 5 are provided corresponding to one of the platforms 2, and one rough grinding part 4 and one fine grinding part are provided corresponding to the other platform 2. 5.

Each rough grinding part 4 moves within the movement range of the substrate W by the corresponding stage moving part 3 to roughly grind the upper surface of the substrate W. This rough grinding part 4 is a horizontal axis type grinding part including the grinding stone 41 for rough grinding, and is set so that the rotation axis of the main shaft 42 which rotates the grinding stone 41 for rough grinding may be parallel with respect to a table surface. This grindstone 41 for rough grinding is formed in the shape of a disc, and the outer peripheral surface becomes a use surface for grinding.

Each fine grinding part 5 moves within the movement range of the substrate W by the corresponding stage moving part 3 to perform fine grinding of the substrate W. This lapping part 5 is a longitudinal-axis type lapping part including the grindstone 51 for lapping, and it is set so that the rotation axis of the main shaft 52 which rotates the grindstone 51 for lapping may be perpendicular|vertical with respect to a table surface. Here, the grinding stone 51 for fine grinding is a grinding stone with a finer hole than the grinding stone 41 for rough grinding. In addition, the grindstone 51 for lapping is formed in a ring shape or a disc shape, and one end surface in the axial direction becomes a use surface for grinding. Furthermore, the grindstone 51 for lapping has a diameter larger than the width dimension of the board|substrate W. As shown in FIG.

Specifically, each rough grinding portion 4 and each fine grinding portion 5 are configured to move in a direction transverse to the reciprocating movement direction (Y direction) of the stage 2 using the stage moving portion 3. In the present embodiment, each rough grinding part 4 and each fine grinding part 5 are configured to move between the first position P and the second position Q in the X direction orthogonal to the Y direction.

In addition, the substrate grinding module 100B of the present embodiment includes a gate-shaped support portion 6 to support each rough grinding portion 4 and each fine grinding portion 5 in a movable manner. As shown in Figures 2 and 3, the supporting part 6 includes: a pair of legs 61 arranged on both sides of the two platforms 2 (two platform moving parts 3), and a connecting beam erected on the pair of legs 61 Section 62; and each rough grinding portion 4 and each fine grinding portion 5 are movably supported by this connecting beam portion 62. The connecting beam portion 62 is provided along the X direction between the first position P and the second position Q. The present embodiment has a structure in which the two rough grinding parts 4 are supported on the near side of the connecting beam part 62 and the two fine grinding parts 5 are supported on the deep side of the connecting beam part 62. With this structure, the positions in the Y direction at which the two substrates W are subjected to rough grinding or fine grinding become the same position. As a result, the unevenness of rough grinding due to the deflection of the connecting beam portion 62 and the like can be made uniform for each platform 2, and the fine grinding due to the deflection and the like of the connecting beam portion 62 can be made uniform. Not all the same.

Here, between the connecting beam portion 62 and each rough grinding portion 4, as shown in FIG. 2, a rough grinding portion moving portion 7 is provided, and between the connecting beam portion 62 and each fine grinding portion 5, as shown in FIG. As shown, a fine grinding and cutting part moving part 8 is provided. In addition, in FIG. 1, the rough grinding part moving part 7 and the fine grinding part moving part 8 are not shown in figure.

The rough grinding portion moving portion 7 moves each rough grinding portion 4 in the X direction. For example, the connecting beam portion 62 includes an X direction rail provided along the X direction, and an X direction moving along the X direction rail. A slider, and an X-direction drive unit that drives the X-direction slider. The X-direction slider and the X-direction drive part are provided corresponding to the two rough grinding parts 4, respectively. In addition, the X-direction rails are common to the two rough grinding parts 4, but they may be provided in correspondence with each other. Each X-direction drive unit is controlled by a control unit 9 described later, and each rough grinding unit 4 moves in the X direction independently of each other.

In addition, the rough grinding portion moving portion 7 is configured to be capable of moving each rough grinding portion 4 in the Z direction, and the connecting beam portion 62 includes a Z direction rail provided along the Z direction, and a rail along the Z direction. The moving Z-direction slider and the Z-direction drive unit that drives the Z-direction slider. The Z-direction rail, the Z-direction slider, and the Z-direction drive part are provided corresponding to the two rough grinding parts 4, respectively. Each Z direction drive unit is controlled by a control unit 9 described later, and each rough grinding unit 4 moves in the Z direction independently of each other.

The lapping section moving section 8 moves each lapping section 5 in the X direction. For example, the connecting beam section 62 includes an X-direction rail provided along the X-direction, and an X-direction slide that moves along the X-direction rail. And an X-direction drive unit that drives this X-direction slider. The X-direction slider and the X-direction drive unit are provided in correspondence with the two lapping parts 5, respectively. In addition, the X-direction rails are common to the two lapping parts 5, but they may be provided in correspondence with each other. Each X-direction drive unit is controlled by a control unit 9 described later, and each fine grinding unit 5 moves in the X direction independently of each other.

In addition, the lapping section moving section 8 is configured to move each lapping section 5 in the Z direction, and the connecting beam section 62 includes a Z-direction rail provided along the Z direction and moving along the Z-direction rail. The Z-direction slider and the Z-direction drive unit that drives the Z-direction slider. The Z-direction rail, the Z-direction slider, and the Z-direction drive part are provided corresponding to the two fine grinding parts 5, respectively. Each Z-direction drive unit is controlled by a control unit 9 described later, and each fine grinding unit 5 moves in the Z direction independently of each other.

In the above configuration, the control unit 9 controls each unit, and the substrates W held on the plurality of stages 2 are respectively subjected to rough grinding and fine grinding.

Hereinafter, focusing on one stage 2, the rough grinding and finishing grinding of the substrate W held on this stage 2 will be described.

When performing rough grinding on each substrate W, the control unit 9 moves the rough grinding portion 4 within the movement range of the substrate W as shown in FIG. 4(A) to perform rough grinding in a predetermined order.

The control unit 9 controls the stage moving unit 3 to linearly reciprocate the substrate W, and controls the rough grinding unit moving unit 7 to move the rough grinding unit 4 in the X direction, thereby affecting the entire upper surface of the substrate W. Perform rough grinding. For example, the control unit 9 moves the stage 2 linearly at least once, and rough-grinds the desired part of the substrate W along the longitudinal direction, and then staggers the rough-grinding portion 4 in the X direction, and the rough-grinding portion 4 is aligned with the For the grinding part, the stage 2 is moved linearly at least once, and the required part of the substrate W is rough-cut along the longitudinal direction. By repeating the above operation, the entire upper surface of the substrate W is rough-ground.

In the rough grinding, the control unit 9 performs feedback control on the position of the rough grinding unit 4 in the Z direction to adjust the rough grinding amount of the substrate W.

Specifically, based on the detection signal from one or more touch sensors 10 (see FIG. 1) in contact with the substrate W, the control unit 9 performs the rough grinding on the rough grinding unit 4 so that the thickness of the substrate W reaches a predetermined target value. The position in the Z direction is feedback controlled. The touch sensor 10 is provided corresponding to each platform 2. Here, the thickness of the substrate W can be obtained from the difference between the position in the Z direction on the upper surface of the stage and the position in the Z direction on the upper surface of the substrate, or it can be based on the difference between the position in the Z direction on the upper surface of the substrate before grinding and the position after grinding The position of the upper surface of the substrate in the Z direction is obtained by the obtained grinding amount. In addition, the sensor for detecting the thickness or the grinding amount of the substrate W may be a displacement sensor of other types such as an optical sensor, in addition to a contact sensor.

When the control unit 9 performs fine grinding on the substrate W after rough grinding, as shown in FIG. 4(B), the fine grinding unit 5 moves within the movement range of the substrate W and performs fine grinding in a predetermined order.

The control unit 9 controls the lapping section moving section 8, arranges the lapping stone 51 of the lapping section 5 at a position in contact with the substrate W, and controls the stage moving section 3 to move the substrate W linearly, thereby The entire upper surface of the substrate W is polished. For example, the control unit 9 controls the lapping part moving part 8, and after the lapping stone 51 for lapping and grinding is placed in contact with the entire width direction of the substrate W, it controls the stage moving part 3 to move the substrate W linearly at least Once, the substrate W is polished along the longitudinal direction.

In the finishing grinding, the control unit 9 performs feedback control on the position of the finishing grinding unit 5 in the Z direction to adjust the finishing grinding amount of the substrate W. Specifically, based on the detection signal from the touch sensor 10 in contact with the substrate W, the control unit 9 performs feedback control on the Z direction position of the lapping section 5 so that the thickness of the substrate W reaches a predetermined target value. Here, the thickness of the substrate W can be obtained from the difference between the position in the Z direction on the upper surface of the stage and the position in the Z direction on the upper surface of the substrate, or it can be based on the difference between the position in the Z direction on the upper surface of the substrate before grinding and the position after grinding The position of the upper surface of the substrate in the Z direction is obtained by the obtained grinding amount.

Here, when the substrates W held on the two stages 2 are subjected to rough grinding and finish grinding, each rough grinding portion 4 and each fine grinding portion 5 are configured so as not to interfere with each other. In this embodiment, as shown in FIG. 2, the grinding stones 41 for rough grinding, which are provided as two rough grinding parts 4 (horizontal-shaft type grinding parts), face each other on the inside and the main shaft 42 is located on the outside.

In addition, the control unit 9 in each platform 2, when one of the rough grinding portion 4 or the fine grinding portion 5 grinds the substrate W, the other one of the rough grinding portion 4 or the fine grinding portion 5 is retracted to and The opposite side (outside) of the other platform 2. Thereby, the movement of the grinding part 4 and the grinding part 5 which grind on the other platform 2 is not hindered. In addition to this, it is also possible to set the structure as follows: when one of the rough grinding portion 4 or the fine grinding portion 5 grinds the substrate W, the other of the rough grinding portion 4 or the fine grinding portion 5 is Ascend in the Z direction and retreat.

＜Grinding method＞ Next, an example of a grinding method using the grinding device 100 of this embodiment will be described. In this example, it is assumed that the rough grinding is performed on the two platforms 2 at the same time, and then the fine grinding is performed at the same time.

First, the substrate conveying mechanism 100E receives the substrate W from the pre-grinding substrate supply unit 11 of the substrate storage module 100A, and sequentially conveys the substrate W to the two stages 2 of the substrate grinding module 100B. Here, the platform 2 sucks and holds the transferred substrate W. In this embodiment, in order to achieve high grinding accuracy, the stage moving part 3 does not include a mechanism for rotating the stage 2. Therefore, the grinding apparatus 100 includes an arranging mechanism to match the orientation of the substrate W of the substrate transport mechanism 100E with the orientation of the substrate W of the stage moving part 3 (refer to FIG. 1 ). The arrangement mechanism may be, for example, a rotation mechanism included in the substrate transport mechanism 100E, or a transport mechanism such as a robot arm that moves the substrate W from the substrate transport mechanism 100E to the stage 2 while appropriately rotating the orientation of the substrate W.

Then, the rough grinding part 4 corresponding to each stage 2 moves to a predetermined grinding position, and the stage moving part 3 linearly reciprocates the stage 2 to perform rough grinding of the substrate W. In this rough grinding, based on the detection signal of the touch sensor 10, the position of the rough grinding part 4 in the Z direction is feedback controlled so that the thickness of the substrate W reaches a predetermined target value.

After the rough grinding is finished, the rough grinding part 4 is retracted to the outside of the moving range of the platform 2. Then, the fine grinding part 5 corresponding to each stage 2 moves to a predetermined grinding position, and the stage moving part 3 linearly reciprocates the stage 2 to perform fine grinding of the rough-ground substrate W. In this lapping, based on the detection signal of the touch sensor 10, the position of the lapping section 5 in the Z direction is feedback controlled so that the thickness of the substrate W reaches a predetermined target value.

After finishing grinding, the substrate transport mechanism 100E and/or the robot arm (not shown) sequentially transports the substrate W to the substrate washing module 100C. The substrate W cleaned and inspected by the substrate cleaning module 100C is transported to the ground substrate storage section 12 of the substrate storage module 100D by the substrate transport mechanism 100E and/or the robot arm (not shown).

As another grinding method, it is also considered: when rough grinding is performed on one of the platforms 2, fine grinding is performed on the other platform 2, and rough grinding and fine grinding are alternately performed on the two platforms 2. The grinding timing is staggered on each platform 2. In addition, as another grinding method, it is also considered to perform rough grinding and fine grinding independently on each platform 2.

In these cases, the order of rough grinding and fine grinding on each platform 2 is the same as described above, but the substrate transfer mechanism 100E and/or the robot arm (not shown) will perform the fine grinding every time the finishing grinding is finished. The ground substrate W is conveyed to the substrate washing module 100C, and the pre-grinding substrate W is conveyed from the pre-grinding substrate supply unit 11 to the stage 2 on which the substrate W is not held.

<Effects of this embodiment> According to the grinding apparatus 100 of the present embodiment, the rough grinding portion 4 and the fine grinding portion 5 are configured to be movable on each of the plurality of stages 2, so that rough grinding can be performed while the substrate W is held on each stage 2. And intensive grinding of both. Therefore, there is no need to transfer the substrate W to a different platform, and there is no need to realign it on a different platform, and the flatness of rough grinding and fine grinding can be kept constant on each of the plurality of platforms 2. As a result, by grinding a plurality of substrates W at the same time, the throughput (processing capacity) can be improved, and the grinding accuracy of the substrate W on each stage 2 can be improved.

<Other modified embodiments> In addition, this invention is not limited to the said embodiment.

For example, as shown in FIG. 5(A) and FIG. 5(B), at least one of the rough grinding part 4 or the fine grinding part 5 may be a structure in which at least two platforms 2 are shared. For example, as shown in (A) of FIG. 5, a rough grinding part 4 may be provided on each of the two platforms 2, and one fine grinding part 5 may be shared on the two platforms 2. In addition, as shown in FIG. 5(B), a structure in which one rough grinding part 4 and one fine grinding part 5 are shared on two platforms 2 can also be used, so that rough grinding and grinding are alternately performed on the two platforms 2 Fine grinding. Furthermore, although not shown in the figure, it is also possible to provide a structure in which the fine grinding part 5 is provided on each of the two platforms 2 and one rough grinding part 4 is shared on the two platforms 2.

In addition, in the connecting beam portion 62, one of the two rough grinding portions 4 may be provided on the near side and the other may be provided on the deep side, and one of the two fine grinding portions may be provided on the near side. And set the other one on the deep side. With this structure, when rough grinding is performed on the two platforms 2 at the same time or when fine grinding is performed simultaneously, it is possible to prevent the rough grinding parts 4 or the fine grinding parts 5 from interfering with each other structurally.

Furthermore, in addition to the above-mentioned embodiment, as shown in FIG. 6, a deburring part 16 may be provided that moves within the moving range of the substrate W by the platform moving part 3 to perform deburring of the substrate W. . Regarding this deburring part 16, it is considered that, like the rough grinding part 4 and the fine grinding part 5, it is movably supported by the connection beam part 62. As the deburring part 16, it is considered to include, for example, bristles. Here, when the deburring part 16 is provided, it can be easily arranged by combining it with a structure in which the rough grinding part 4 or the fine grinding part 5 is shared on the two platforms 2. In addition, the deburring part 16 can be shared on the two platforms 2.

The rough grinding part 4 of the above embodiment uses the grind stone 41 for rough grinding, and the fine grinding part 5 uses the grind stone 51 for fine grinding. However, as shown in FIG. The belt grinding type grinding part of the belt grinding belt 171 (hereinafter referred to as the belt grinding part 17). In addition, the grinding belt 171 joins both ends of a belt-shaped abrasive cloth paper with abrasive grains attached to the surface to form a belt shape. Compared with the grinding stone 41 for rough grinding or the grinding stone 51 for fine grinding, the grinding belt 171 is inexpensive, and can achieve a significant cost reduction. In addition, compared with the grinding stone 41 for rough grinding or the grinding stone 51 for fine grinding, the grinding belt 171 is easy to replace|exchange. Furthermore, the belt-type grinding section 17 is effective in the case of grinding the following grinding object, or removing burrs formed by the grinding object, such as the grinding stone 41 for rough grinding or When the grinding stone 51 for polishing is polished, the problem of clogging becomes significant, or, for example, the substrate W in which only the copper wiring portion or the soldering portion is exposed, the grinding accuracy is not too high.

This belt-type grinding unit 17 includes a driving wheel 174 rotatably driven by a driving shaft 173 of a main shaft 172, a contact wheel 175, and an endless belt-shaped grinding belt 171 that is looped around these wheels 174 and 175. In addition, a tension wheel 176 for applying tension to the grinding belt 171 may also be included. These parts 172 to 176 are supported by the base member 170.

In addition, as shown in FIG. 8, this belt-type grinding section 17 includes a covering body 177 that covers the grinding belt 171 so that a part of the grinding belt 171 is exposed. The lower wall portion 177 a (the wall surface facing the substrate W) of the covering body 177 is formed in a planar shape, and the lower wall portion 177 a here is formed with an opening 177H for exposing the grinding tape 171. Here, since the lower wall portion 177a of the covering body 177 is formed in a planar shape facing the substrate W, the grinding fluid such as water supplied from the outside is formed in the space between the lower surface of the lower wall portion 177a and the upper surface of the substrate W. Medium flow, efficiently supplied to the grinding part.

In addition, the lower wall portion 177a of the covering body 177 or the lower side portion of the side wall portion 177b connected to the lower wall portion 177a is formed with a discharge hole 177c for discharging the grinding liquid that has entered the covering body 177 to the outside. In addition, in the rough grinding part 4 and the fine grinding part 5, similarly to the belt grinding part 17, a covering body which covers so that a part of these grindstones 41 and 51 may be exposed may be provided.

In addition, in addition to the structure in which the rough grinding section 4 or the fine grinding section 5 is configured as the belt type grinding section 17, the substrate grinding module 100B (grinding mechanism) may include the rough grinding section 4 and the fine grinding section 5, and may also include the use of The belt-type grinding portion 17 of the endless belt-shaped grinding belt 171. This belt grinding part 17 is configured to be movable on each of the plurality of platforms 2, and it is considered that it is movably supported by the connecting beam part 62 in the same way as the rough grinding part 4 and the fine grinding part 5.

In addition, the rough grinding part 4 may be configured to be able to be modified in the form of a horizontal axis type grinding part including a grinding stone 41 for rough grinding and a belt type grinding part using an endless belt-shaped grinding belt 171. The fine grinding part 5 may be configured to be capable of being modified in the form of a longitudinal axis type grinding part including the grinding stone 51 for fine grinding and a belt type grinding part using an endless belt-shaped grinding belt 171. By enabling them to be changed, a grinding form corresponding to the type of substrate W can be selected, and the versatility of the substrate grinding module 100B (grinding mechanism) can be improved.

In this case, as shown in FIG. 9, it may be configured such that the Z-direction slider 18 of the Z-direction moving part in the rough grinding part 4 and the fine grinding part 5 is mounted using the accessory member 19a and the accessory member 19b. . For example, the rough grinding part 4 is attached to the Z-direction slider via an accessory member 19a for the rough grinding part 4. In addition, the fine grinding part 5 is attached to the Z-direction slider 18 via an accessory member 19 b for the fine grinding part 5. In addition, in FIG. 9, an example in which the belt-type grinding part 17 is attached to the Z-direction slider 18 without using an accessory member has been shown, but an accessory member for the belt-type grinding part may also be used to be attached to the Z-direction slider 18. As described above, by using the auxiliary members 19a and 19b corresponding to the respective grinding parts 4, 5, the rough grinding part 4 (horizontal axis type) and the belt grinding part 17 can be changed mutually, and the fine grinding part 5 (longitudinal) Shaft type) and belt grinding part 17 are mutually changeable. In FIG. 9, since the rough grinding part 4, the fine grinding part 5, and the Z-direction slider 18 of the Z-direction moving part are made common, the rough grinding part 4 (horizontal axis type) and the fine grinding part 5 (vertical axis) Type) and belt grinding section 17 are mutually changed. In addition to this, the horizontal axis type main shaft 42 and the main shaft 172 of the belt grinding unit 17 may be used in common, and the grinding stone 41 for rough grinding and the grinding belt 171 may be mutually changed with respect to this common main shaft.

Furthermore, in addition to the above-mentioned embodiment, a grinding and grinding part including a grinding stone for grinding having a finer hole than the grinding stone 51 for grinding and grinding of the grinding part 5 may be provided. This grinding and grinding part is configured to be movable on each of the plurality of platforms 2, and it is considered that it is supported by the connecting beam part 62 in a movable manner like the rough grinding part 4 and the fine grinding part 5.

In the above-described embodiment, the two platforms 2 are arranged in parallel, but it may be a structure in which three or more platforms 2 are arranged in parallel.

In the above-mentioned embodiment, it is a structure in which a plurality of stages 2 are used to grind one kind of grinding object W. However, it is also possible to use different types of grinding targets W to be ground on each of the plural stages 2 , And set it as a structure in which a plurality of types of grinding objects W are ground. In this case, the rough grinding part 4 and the fine grinding part 5 provided corresponding to each stage 2 are selected according to the type of each grinding target W. As shown in FIG.

In addition, the rough grinding part 4 of the said embodiment is a horizontal axis type grinding part, but it can also be set as a vertical axis type grinding part. On the other hand, the fine grinding part 5 of the above-mentioned embodiment is a vertical axis type grinding part, but it may be a horizontal axis type grinding part. In addition, by replacing the grind stone attached to the spindle of the grinding part with a grind stone for rough grinding and a grind stone for fine grinding, the rough grinding part and the fine grinding part can be arranged in various configurations.

In addition, a rotating part that rotates the grinding part may be provided between each grinding part and the grinding part moving part. This rotation part rotates the rotation axis of the grinding part by 90 degrees, and can be switched between the vertical axis type and the horizontal axis type.

In addition to this, the support portion 6 of the above-described embodiment is a door type, but it may also be a cantilever type including one leg and a beam extending from the leg.

In addition to this, the present invention is not limited to the above-mentioned embodiments, and of course various modifications can be made without departing from the spirit thereof.

2: platform 3: Platform Mobile Department 4: Rough grinding department 5: Fine grinding and cutting department 6: Support 7: Rough grinding part moving part 8: Fine grinding and cutting department moving department 9: Control Department 10: Touch sensor 11: Substrate supply department before grinding 12: After grinding, the substrate storage section 13: Washing part 14: Dry part 15: Inspection Department 16: Deburring Department 17: Belt grinding department 18: Slider in Z direction 19a, 19b: accessory components 41: Grinding stone for rough grinding 42: Spindle 51: Grinding stone for fine grinding 52: Spindle 61: A pair of feet 62: connecting beam 100: Grinding device 100A: Substrate supply module 100B: Substrate grinding module (grinding mechanism) 100C: Substrate washing module 100D: substrate storage module 100E: substrate transport mechanism 170: base member 171: Grinding Belt 172: Spindle 173: drive shaft 174: drive wheel 175: Contact Wheel 176: Tension Wheel 177: Cover Body 177a: Lower wall 177b: Side wall 177c: discharge hole 177H: opening CTL: control the machine P: First position Q: Second position VP: Suction pump W: Plate-shaped grinding object (sealed substrate, substrate)

FIG. 1 is a plan view schematically showing the structure of an embodiment of the grinding apparatus of the present invention. Fig. 2 is a front view (a view seen from the near side) schematically showing the structure of the grinding mechanism of the embodiment. Fig. 3 is a rear view (a view viewed from the deep side) schematically showing the structure of the grinding mechanism of the embodiment. 4 is a plan view schematically showing (A) a state where rough grinding is performed and (B) a state where fine grinding is performed in the embodiment. 5 is a plan view schematically showing the structure of the grinding device of the present invention (A) when the fine grinding part is shared, and (B) when the rough grinding part and the fine grinding part are shared. Fig. 6 is a plan view schematically showing the configuration of a modified embodiment of the grinding apparatus of the present invention. Fig. 7 is a front view and a side view schematically showing the structure of a belt grinding part of a modified embodiment. Fig. 8 is a schematic diagram showing the structure of the sleeve in the belt grinding section. Fig. 9 is a diagram schematically showing the mounting structure of the rough grinding portion, the fine grinding portion, and the belt grinding portion on the Z-direction slider.

2: platform

3: Platform Mobile Department

4: Rough grinding department

5: Fine grinding and cutting department

6: Support

9: Control Department

10: Touch sensor

11: Substrate supply department before grinding

12: After grinding, the substrate storage section

13: Washing part

14: Dry part

15: Inspection Department

41: Grinding stone for rough grinding

42: Spindle

51: Grinding stone for fine grinding

52: Spindle

100: Grinding device

100A: Substrate supply module

100B: Substrate grinding module (grinding mechanism)

100C: Substrate washing module

100D: substrate storage module

100E: substrate transport mechanism

CTL: control the machine

P: First position

Q: Second position

VP: Suction pump

W: Plate-shaped grinding object (sealed substrate, substrate)

Claims (12)

A kind of research institute, including: Multiple platforms to hold plate-shaped grinding objects; At least one rough grinding part for rough grinding the grinding object; and At least one fine grinding and grinding part for fine grinding and grinding the object to be ground; and On each of the plurality of platforms, the rough grinding portion and the fine grinding portion are configured to be movable. The research institution described in claim 1, wherein At least one of the rough grinding part and the fine grinding part is provided on each of the plurality of platforms. The research institution described in claim 1, wherein At least one of the rough grinding part or the fine grinding part is shared in at least two of the platforms. The research institutes as described in claim 1, further including: A plurality of platform moving parts are provided on each of the plurality of platforms, so that the platform moves linearly reciprocatingly within a prescribed range along a direction; and The rough grinding part and the fine grinding part move in a direction transverse to the reciprocating movement direction of the platform using the platform moving part. The research institution according to any one of claims 1 to 4, wherein The rough grinding part is a horizontal axis type grinding part including a grinding stone for rough grinding, and The lapping part is a longitudinal axis type lapping part including a grinding stone for lapping. The research institution according to any one of claims 1 to 4, wherein The rough grinding part or the fine grinding part is a belt grinding type grinding part using an endless belt-shaped grinding belt. The research institution according to any one of claims 1 to 4, wherein The rough grinding part is configured to be able to be changed in the form of a horizontal shaft type grinding part including a grinding stone for rough grinding and a belt grinding type grinding part using an endless belt-shaped grinding belt, and The configuration of the fine grinding part can be changed in the form of a longitudinal axis type grinding part including a grinding stone for fine grinding and a belt grinding part using an endless belt-shaped grinding belt. The research institution described in any one of claim 1 to claim 4, further including: A pair of feet are arranged to clamp the plurality of platforms; and The connecting beam is erected on the pair of legs; and The rough grinding part and the fine grinding part are movably supported by the connecting beam part. The research institution described in any one of claim 1 to claim 4, further including: A pair of feet are arranged to clamp the plurality of platforms; and The connecting beam part is erected on the pair of feet; The rough grinding portion and the fine grinding portion are movably supported by the connecting beam portion, and In the connecting beam portion, one of the rough grinding portion or the fine grinding portion is supported on the near side, and the other of the rough grinding portion or the fine grinding portion is supported on the deep side. The research institution according to any one of claims 1 to 4, wherein In addition to the rough grinding part and the fine grinding part, it also includes a belt-type grinding part using an endless belt-shaped grinding belt; and On each of the plurality of platforms, the belt grinding part is configured to be movable. The research institution described in any one of claim 1 to claim 4, further including: The deburring part performs deburring of the grinding object; and On each of the plurality of platforms, the deburring part is configured to be movable. A grinding device includes the grinding mechanism according to any one of claim 1 to claim 11.

Images