JP2005117065A - Sealing method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing method of an electronic component which is excellent in cost, productivity and dimensional precision. <P>SOLUTION: An IC chip 7 which is an electronic component is mounted on a substrate 1 for mounting the electronic component. The whole IC chip 7 is coated by printing a resin 26 for sealing to the substrate 1 using a metal mask 5. Then, printed resin 26 for sealing is heat-cured. Then, the surface grinding of the top surface of the cured resin 26 for sealing with a surface grinding equipment 8 reduces the thickness of the resin 26 for sealing down to a predetermined thickness. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component sealing method.

  Conventionally, in the process of manufacturing a semiconductor package with severe restrictions on the total thickness, resin sealing is used to protect electronic components such as IC chips and LSI chips mounted on electronic component mounting boards from external moisture. May be performed.

  As a method for sealing with resin, for example, a method in which a substrate on which an IC chip is mounted is set in a mold and a sealing resin is injected therein and the resin is molded into a predetermined shape (transfer mold) Law) is known.

There is also known a method (potting method) in which a sealing frame having a constant thickness is provided on a substrate on which an IC chip is mounted, and a sealing resin is poured into the frame by a dispenser or the like.
Furthermore, a sealing method of controlling the sealing thickness by cutting the upper surface of the resin formed by the potting method without using a sealing frame with a planer or the like having a metal cutting blade is also performed. ing.

However, the above transfer molding method has a drawback that the equipment cost is increased because a dedicated die or a large-sized apparatus for performing molding is required.
Since the potting method requires a sealing frame, there is a drawback in that the material cost of the substrate becomes high. Moreover, since it is application | coating by a dispenser, there are also a fault that the number of sheets which can be processed at a time is small and production efficiency is bad.

  In addition to the poor production efficiency caused by the dispenser, the method of cutting after potting does not use a sealing frame, so the thickness control and range control of the sealing resin cannot be sufficiently performed, and the dimensional accuracy of the product is high. There is a drawback of getting worse. In addition, if the potting method does not use a sealing frame, the resin is sagged, and the thickness variation of the resin inevitably increases (usually about ± 400 μm to ± 600 μm). Therefore, in the case of a large number of substrates, etc., the amount to be cut differs individually, and sufficient cutting accuracy cannot be obtained. As a result, there is a drawback that the resin cannot be made to a predetermined thickness.

  The present invention has been made to solve the above problems, and a first object of the invention is to provide a method for sealing an electronic component that is excellent in cost, productivity, and dimensional accuracy.

  In order to solve the above-described problems, in the invention according to claim 1, a sealing resin is printed on the substrate so that the electronic component mounted on the substrate is covered, and the sealing resin The gist of the method is to seal the electronic component by grinding the upper surface of the cured sealing resin.

  In particular, in claim 1, a metal mask having a supply port larger than the projected area of the electronic component to be sealed is disposed on the substrate, and the sealing resin is printed on the electronic component mounting region by moving the squeegee. You can also. Further, for grinding, the upper surface of the cured sealing resin can be ground using a surface grinding apparatus.

  After grinding using a polishing member having a 180th to 240th abrasive fixed to the surface, grinding can also be performed using a 320th to 500th abrasive fixed to the surface. There is also a method for manufacturing a semiconductor package in which an electronic component is mounted on an electronic component mounting substrate, and then the electronic component is resin-sealed and ground by the sealing method according to claim 1.

According to a second aspect of the present invention, the gist of the first aspect is a sealing method of an electronic component performed by an abrasive fixed to the surface of a rotating polishing belt.
According to a third aspect of the present invention, the gist of the first aspect of the present invention is based on a sealing method for electronic components performed by rough grinding or finish grinding.

  According to a fourth aspect of the present invention, in the first aspect, the grinding is based on a method for encapsulating an electronic component that is performed after a substrate on which a sealing resin is cured is brought into close contact with a vacuum.

  According to the first aspect of the present invention, since the sealing resin is formed by a printing method having excellent formation accuracy in the thickness direction and the planar direction, variations in the thickness of the sealing resin are reduced. Therefore, surface grinding can be easily and highly accurately performed in the subsequent process.

  The printing method can be improved so that a predetermined amount of the sealing resin is transferred to the electronic component mounting region on the substrate by pushing the sealing resin from the supply port by the movement of the squeegee. At this time, by setting the thickness of the metal mask and the size of the supply port in advance, the printing thickness and printing range of the sealing resin can be controlled.

  Further, with respect to grinding, when the rotating polishing belt is brought into contact with the substrate, an improvement can be made such that the upper surface of the sealing resin is scraped flat by the abrasive fixed to the surface of the polishing belt. As a result, the sealing resin is controlled to a predetermined thickness. In addition, since the grinding is a dry grinding method that does not use a grinding fluid, there is no need for equipment for supplying and circulating the grinding fluid, and there is no contamination of the substrate due to the grinding fluid.

  In addition, it is possible to improve such that rough grinding is first performed with a coarse abrasive having a small count, and then finish grinding is performed with a fine abrasive having a greater count. Such grinding not only improves the grinding accuracy but also improves the grinding efficiency.

  Moreover, the substrate is brought into close contact with the plate-shaped jig by being evacuated through the suction hole and the communication hole, and as a result, the substrate is securely fixed to the upper surface of the table. Therefore, high grinding accuracy is ensured when grinding with the rotating abrasive belt. In addition, since the plate-shaped jig is disposed between the substrate and the table, the substrate does not directly touch the upper surface of the table.

  As described above in detail, according to the electronic component sealing method of the present invention, since surface grinding is performed on the sealing resin formed by the printing method, cost, productivity, and dimensional accuracy are reduced. Can be improved. In particular, according to the invention of (Example 2) described as an improvement plan, since the substrate is not exposed to the grinding liquid, the influence on the constituent material of the substrate in the surface grinding step can be reduced.

[Example 1]
Hereinafter, an embodiment in which the present invention is embodied in a method for manufacturing a semiconductor package for an IC card will be described in detail with reference to FIGS.

  In this embodiment, the semiconductor package 2 is manufactured by performing a die bonding process, a wire bonding process, and a resin sealing process (resin printing process, resin curing process, and surface grinding process) on the electronic component mounting substrate 1. . Before describing each process in detail, first, the configuration of instruments, devices, etc. used in the resin sealing process will be described.

The resin sealing process of this embodiment mainly includes three processes such as a resin printing process, a resin curing process, and a surface grinding process.
As shown in FIG. 3, in the resin printing process, a general screen printer 3 is used as a means for printing the resin. The screen printing machine 3 includes a table 4, a metal mask 5, a squeegee 6, and the like for fixing the electronic component mounting substrate 1 during printing. A plurality of supply ports 5 a are formed at predetermined locations on the metal mask 5 (that is, locations corresponding to the electronic component mounting region R of the substrate 1). Each supply port 5a is larger than the projected area (5 mm × 5 mm = 25 mm ² ) of the IC chip 7 which is an electronic component to be sealed. The thickness of the metal mask 5 is set to be somewhat larger than the height of the wire loop when the IC chip 7 is wire bonded. In this embodiment, the thickness of the metal mask 5 is set to 500 μm. Here, by setting the thickness of the metal mask 5 and the size of the supply port 5a in advance, the printing thickness and printing range of the resin are controlled.

  FIG. 7 schematically shows a wet grinding wheel type surface grinding apparatus 8 used in the surface grinding process. This surface grinding apparatus 8 includes a grinding wheel head 10 provided with a grinding wheel 9, a belt conveyor 11, a grinding wheel head driving means (not shown), a table 13 having an iron plate 12 on its upper surface, a vacuum pump (not shown), and a grinding fluid circulation pipe 14. And a magnet sheet 15 as a plate-like jig.

  A table 13 is placed on the belt conveyor 11 so as to be horizontally movable. A evacuation passage 13 a communicating with a vacuum pump provided outside the table 13 is formed inside the table 13. An iron plate 12 having excellent flatness is fixed to the upper surface of the table 13. As shown in FIG. 6, a plurality of suction holes 16 having a substantially circular cross section are regularly formed in the iron plate 12. On the upper surface of the iron plate 12, a flexible magnet sheet (thickness of about 1 mm) 15 as a plate-like jig is adsorbed by a magnetic force. The magnet sheet 15 is produced, for example, by applying a resin paste containing magnetic powder to the surface of a resin or rubber base. The magnet sheet 15 is also excellent in flatness like the iron plate 12. The magnet sheet 15 is disposed on the iron plate 12 with its magnetic surface facing downward.

  The magnet sheet 15 is formed with a plurality of communication holes 17 that allow communication between the lower part of the electronic component mounting region R and the suction holes 16. Accordingly, when the iron plate 12 and the magnet sheet 15 are arranged on the table 13 and evacuation is performed, air is discharged through the communication hole 17, the suction hole 16, and the passage 13a. Then, the substrate 1 comes into close contact with the magnet sheet 15, and as a result, the substrate 1 is securely fixed to the upper surface of the table 13.

  As shown in FIGS. 5 and 7, a grinding wheel head 10 including a grinding wheel 9 is disposed above the belt conveyor 11 at a predetermined distance. The position of the grinding wheel head 10 can be adjusted on the order of several μm by a height adjusting mechanism (not shown). A grinding fluid is supplied to the grinding wheel head 10 from a polishing fluid circulation pipe 14. The supplied grinding fluid is circulated in the grinding fluid circulation pipe 14 through a collection means, a filter, a pump, and the like (not shown). The grinding fluid is for avoiding the temperature rise of the grinding part by lowering the sliding resistance of the rotating grinding wheel 9.

  As shown in FIG. 5, the grinding wheel 9 is formed by fixing an abrasive 20 on the outer peripheral surface of a base metal 19 with a binder 18. In this embodiment, two wheels, a grinding wheel 9 using a 240th CBN (Cubic boron nitride) abrasive 20 and a 400th grinding wheel 20 using a CBN abrasive 20 are used.

  Next, a procedure for manufacturing the semiconductor package 2 will be described. 1 and 6 schematically show an electronic component mounting board 1 used in a die bonding process. This substrate (length 250 mm, width 33 mm, thickness 150 μm) 1 is a so-called multi-unit flexible substrate provided with 36 electronic component mounting regions R. A conductor pattern 21 is formed on the lower surface of the substrate 1. The conductor pattern 21 is subjected to thin gold plating (not shown). A part of the conductor pattern 21 is exposed by five through holes 22 provided immediately around the electronic component mounting region R. That is, in the substrate 1, the exposed part is the bonding pad 23.

  In the die bonding step, first, the die bonding resin 24 is printed on the electronic component mounting region R of the substrate 1 by using a printing means of a conventionally known die bonding apparatus. In this embodiment, a generally used insulating epoxy resin is selected. Next, the IC chip 7 is mounted on the die bonding resin 24 using the mounter of the die bonding apparatus. Thereafter, the die bonding resin 24 is cured by curing at a predetermined temperature.

  The substrate 1 that has undergone the die bonding process is then transferred to a wire bonder for performing a wire bonding process. In the wire bonder, as shown in FIG. 2, an electrode (not shown) on the IC chip 7 side and a bonding pad 23 on the substrate 1 side are bonded via a gold wire 25.

  The substrate 1 that has undergone the wire bonding process is then transported to the screen printer 3 described above. In the resin printing process by the screen printing machine 3, first, the metal mask 5 is disposed in close contact with the upper surface of the substrate 1 fixed on the table 4. Then, the squeegee 6 is moved in a predetermined direction with the sealing resin 26 supplied to the upper surface of the metal mask 5. Then, the sealing resin 26 is pushed out from the supply port 5 a by the moving squeegee 6, and a predetermined amount of the sealing resin 26 is transferred to the electronic component mounting region R on the substrate 1. As a result, as shown in FIG. 3, the IC chip 7, the gold wire 25, and the bonding pad 23 are entirely resin-sealed. In this embodiment, an insulating epoxy resin is selected as the sealing resin 26.

  Thereafter, the metal mask 5 is removed, and the substrate 1 is heat-treated at a predetermined temperature in a curing apparatus for performing a resin curing process. Then, as shown in FIG. 4, the sealing resin 26 that has been in an uncured state is cured in a state in which the shape when printed is maintained to some extent. In this embodiment, the set thickness of the sealing resin 26 after curing is 600 μm, and the variation with respect to the set thickness is about ± 120 μm.

  The substrate 1 that has undergone the resin curing step is then transported to the surface grinding device 8 described above. In the surface grinding process in the surface grinding apparatus 8, first, the substrate 1 is fixed to the upper surface of the table 13 including the iron plate 12 via the magnet sheet 15. Next, after adjusting the height of the grindstone head 10, the table 13 is reciprocated in the horizontal direction by the belt conveyor 11. Then, when the substrate 1 passes under the grinding wheel head 10, the rotating grinding wheel 9 contacts the upper surface of the substrate 1 as shown in FIG. 5. As a result, the upper surface of the sealing resin 26 that is the protruding portion is scraped flat by the abrasive 20.

  In this embodiment, first, rough grinding is performed by the grinding wheel 9 to which the coarse abrasive 20 of 240 count is fixed, and then finish grinding is performed by the grinding wheel 9 to which the fine abrasive 20 of 400 count is fixed. In rough grinding, about 150 μm to 200 μm is ground, and in finish grinding, about 30 μm to 40 μm is ground. As a result, as shown in FIG. 8, the semiconductor package 2 in which the final set thickness of the sealing resin 26 is 580 μm is manufactured. At this time, the variation of the sealing resin 26 with respect to the final set thickness is about ± 20 μm. Further, the surface roughness of the upper surface of the sealing resin 26 subjected to surface grinding is Ra = 0.5 μm to 2.5 μm, and Rmax = 5 μm to 20 μm.

  In the manufacturing method of the semiconductor package 2 described in detail above, the sealing resin 26 is transferred by a screen printing method having excellent formation accuracy in the thickness direction and the planar direction. For this reason, the thickness variation of the sealing resin 26 is reduced as compared with the conventional potting method. Therefore, the amount to be cut is substantially equal in each sealing resin 26. Therefore, the upper surface of the sealing resin 26 can be surface ground easily and with high accuracy. In particular, in this embodiment, since rough grinding and finish grinding are performed using two types of grinding wheels 9, not only grinding accuracy but also grinding efficiency is excellent. Such high-precision grinding makes it extremely difficult for problems such as partial thinning of the upper surface of the sealing resin 26 and partial exposure of the gold wire 25 and the like. Therefore, the moisture resistance and reliability of the semiconductor package 2 are improved.

  In this embodiment, since the screen printing method using the metal mask 5 is adopted, the equipment cost is reduced as compared with the transfer molding method. Further, in the case of the screen printing method, even when there are electronic component mounting regions R at a plurality of locations on one substrate 1, processing can be performed at a time. For this reason, it is excellent in production efficiency compared with the potting method using a dispenser or the like.

  According to the grinding wheel type surface grinding apparatus 8 of the present embodiment, the substrate 1 is securely fixed to the upper surface of the table 13 by evacuation, so that high grinding accuracy can be ensured when performing surface grinding. Therefore, it is effective when the flexible substrate 1 is selected as in this embodiment. Moreover, since the flexible magnet sheet 15 is used, the impact applied to the substrate 1 during the surface grinding can be reliably absorbed. Therefore, the soft material constituting the substrate 1 (for example, gold plating of the conductor pattern 21 on the back surface side) is hardly damaged, and the defective product occurrence rate is also reduced.

Further, if a plurality of magnet sheets 15 having different shapes of the communication holes 17 are prepared, there is an advantage that the position of the suction holes 16 in the iron plate 12 does not need to be changed even if the dimensions of the substrate 1 are changed. Therefore, the versatility of the surface grinding device 8 can be improved. In addition, the magnet sheet 15 has an advantage that it can be easily attached and detached.
[Example 2]
Next, the manufacturing method of the semiconductor package of Example 2 is demonstrated in detail based on FIGS. 1-4, FIG. 6, FIG.

  Also in this embodiment, the semiconductor package 2 is manufactured by the die bonding process, the wire bonding process, and the resin sealing process (resin printing process, resin curing process, and surface grinding process) for the electronic component mounting substrate 1 as in the first embodiment. Yes. However, in Example 2, surface grinding is performed by the surface grinding apparatus 30 having a configuration different from that in Example 1.

  FIG. 10 schematically shows a surface grinding apparatus 30 used in the second embodiment. The surface grinding apparatus 30 is dry and belt type, and is called a so-called belt sander.

  The surface grinding apparatus 30 includes a driving roller 31, a contact roller 32, a polishing belt 33, a support head 34 incorporating a motor (not shown), a belt conveyor 11, a table 13 having an iron plate 12 on its upper surface, a vacuum pump (not shown), A magnet sheet 15 as a plate-like jig is provided. In addition, this dry surface grinding device 30 is not provided with the grinding fluid circulation pipe 14 as in the first embodiment. Since the configurations and functions of the belt conveyor 11, the iron plate 12, the table 13, the magnet sheet 15, and the like are basically not different from those of the first embodiment, detailed description thereof is omitted here.

  A drive roller 31 is fixed to a rotation shaft of a motor built in the support head 34 so as to be integrally rotatable. A contact roller 32 is rotatably disposed below the drive roller 31 at a predetermined distance. An endless polishing belt 33 as a grinding tool is wound between the drive roller 31 and the contact roller 32. Therefore, when the driving roller 31 is rotated by the motor, the driving force is transmitted through the polishing belt 33, and the contact roller 32 follows and rotates. The positions of the driving roller 31 and the contact roller 32 can be adjusted on the order of several μm by a height adjusting mechanism (not shown).

  Here, the abrasive belt 33 is a generic term for belt-shaped belts among the types of abrasive cloths, and refers to what is called an abrasive belt. The polishing belt 33 that can ensure a long circumference has a characteristic that it has a relatively wide polishing surface and the amount of grinding work that the specific polishing material 20 takes up per unit time is small. Further, since the polishing belt 33 is automatically air-cooled at the time of grinding, there is also a feature that the temperature of the grinding portion is hardly increased.

  As shown in FIG. 9, the abrasive belt 33 is formed by fixing the abrasive 20 to the outer peripheral surface of the base material 35 with a binder 18. In this embodiment, two types are used: a polishing belt 33 using a 180th silicon carbide abrasive 20 and a polishing belt 33 using a 400th silicon carbide abrasive 20.

In the method for manufacturing the semiconductor package 2 according to the second embodiment, a die bonding process, a wire bonding process, a resin printing process, and a resin curing process are first performed according to the procedure of the first embodiment.
The board | substrate 1 which passed through the resin hardening process is conveyed by the surface grinding apparatus 30 mentioned above. In the surface grinding process in the surface grinding apparatus 30, first, the substrate 1 is fixed to the upper surface of the table 13 including the iron plate 12 via the magnet sheet 15. Next, after adjusting the height of the contact roller 32, the table 13 is reciprocated in the horizontal direction by the belt conveyor 11. Then, when the substrate 1 passes under the contact roller 32, the rotating polishing belt 33 contacts the upper surface of the substrate 1 as shown in FIG. 9. As a result, the upper surface of the sealing resin 26 that is the protruding portion is scraped flat by the abrasive 20.

  In this embodiment, first, rough grinding is performed by the polishing belt 33 to which the coarse abrasive material 20 of 180 count is fixed, and then finish grinding is performed by the polishing belt 33 to which the fine abrasive material 20 of 400 count is fixed. In rough grinding, about 150 μm to 200 μm is ground, and in finish grinding, about 30 μm to 40 μm is ground. As a result, as shown in FIG. 8, the semiconductor package 2 in which the final set thickness of the sealing resin 26 is 580 μm is manufactured. At this time, the variation of the sealing resin 26 with respect to the final set thickness is about ± 20 μm. Further, the surface roughness of the upper surface of the sealing resin 26 subjected to surface grinding is Ra = 0.5 μm to 2.5 μm and Rmax = 5 μm to 20 μm.

  It is obvious that even the manufacturing method of the semiconductor package 2 of the second embodiment as described above has the same operational effects as the first embodiment. In particular, in this embodiment, since the grinding is dry-type without using a grinding fluid, facilities for supplying and circulating the grinding fluid are not required. For this reason, the structure of the surface grinding apparatus 30 is also simplified, and the overall cost can be reduced. In addition, since the substrate 1 is not exposed to the grinding liquid, there is an advantage that, for example, the gold plating applied to the conductor pattern 21 does not get water scale. Therefore, cleaning in the post-process is not necessary and productivity is improved.

  Further, with this polishing belt 33 in which the temperature rise in the grinding portion is small, it is possible to avoid a situation in which the resin portion constituting the substrate 1, particularly the sealing resin 26, is deteriorated by heat. Therefore, the defective product generation rate can be reduced.

In addition, this invention is not limited only to the said Example, For example, it can change as follows.
(1) The grinding wheel type surface grinding device 8 of Example 1 may be used as a dry type, or the belt type surface grinding device 30 of Example 2 may be used as a wet type. Of course, it is also possible to use a surface grinding device of a type different from the surface grinding devices 8 and 30 illustrated in these embodiments. That is, a general surface grinding device can perform surface grinding with higher accuracy than a cutting device such as a planer.

(2) The sealing resin 26 is not limited to an insulating epoxy resin, and may be another thermosetting resin such as an insulating polyimide resin.
(3) In the surface grinding apparatuses 8 and 30 of the first and second embodiments, driving means other than the belt conveyor 11 may be used. In addition to moving the table 13 side by the belt conveyor 11 or the like, the grinding tool side such as the grinding wheel 9 or the polishing belt 33 may be moved. Of course, both the grinding tool and the table 13 may be moved.

  (4) The abrasive 20 is not limited to CBN and silicon carbide used in Examples 1 and 2. For example, fused alumina, garnet, emery, silica, iron oxide, zirconium carbide, silica, iron oxide, mullite, titanium nitride, silicon nitride, titanium carbide, diamond, boron carbide or the like may be selected as the abrasive 20. Good. In addition, the count of the abrasive 20 can be freely changed, and is not necessarily limited to the combination of the first and second embodiments.

  (5) The board | substrate 1 used for manufacture of the semiconductor package 2 may not be flexible, for example, may be a rigid resin substrate. In addition to a resin substrate, a ceramic substrate or the like may be used.

  (6) Depending on the type and material of the substrate 1, such as when there is no conductor pattern 21 on the back surface, for example, the plate-like jig 15 may be replaced with a non-flexible magnet sheet, or the flexible and magnet powder It may be replaced with a sheet that does not contain.

  (7) The table 4 of the screen printing machine 3 may be provided with a structure for evacuation similarly to the surface grinding devices 8 and 30, and the magnet sheet 15 may be disposed on the upper surface thereof. If it does in this way, since the board | substrate 1 will be reliably fixed to the table 4 at the time of screen printing, the printing precision of the resin 26 for sealing will improve more, and the cutting precision in a surface grinding process will become still higher.

  (8) The electronic component to be sealed is not limited to the IC chip 7 shown in the first and second embodiments, and may be various chip components, for example. Of course, the region where the IC chip 7 and the chip component are mounted can be entirely sealed with the sealing resin 26.

Here, in addition to the technical ideas described in the claims and the like, the technical ideas grasped by the above-described embodiments and other examples are listed below together with their effects.
(1) A magnet sheet disposed between an iron plate material on a table upper surface and a workpiece, and includes a communication hole that communicates a lower portion of a predetermined area of the workpiece and the suction hole of the iron plate material. Magnet sheet. When this magnet sheet is used, versatility of a planar polishing apparatus or the like can be improved.

  (2) A screen printing machine having a vacuum drawing means for fixing a substrate to be printed, and having a magnetic sheet of technical idea 1. With this configuration, the cutting accuracy in the surface grinding process is further increased.

  (3) A grinding wheel having a polishing surface, a rotation driving means for rotating the grinding wheel, a table for fixing a substrate on which a sealing resin is printed, and the grinding wheel and the table are relative to each other. And at least an electronic component mounting area disposed between the substrate and the table, a driving means for moving the vacuum, a vacuuming means for performing vacuuming through a suction hole opened on the upper surface of the table, A grinding wheel type surface grinding apparatus for grinding a sealing resin comprising a plate-like jig having a communication hole for communicating between a lower part of the suction hole and the suction hole. With this apparatus, it is possible to reduce the incidence of defective products, ensure grinding accuracy, and improve productivity and versatility.

The technical terms used in this specification are defined as follows.
“Electronic components: Semiconductor components such as IC chips and LSI chips made of silicon, gallium arsenide, etc., as well as chip components such as chip transistors, chip diodes, chip resistors, chip capacitors, chip inductors, etc.”

In the manufacturing method of the semiconductor package of Example 1, it is a schematic sectional drawing which shows the electronic component mounting board | substrate before mounting an IC chip. Similarly, it is a schematic sectional view showing a state where wire bonding is performed on an IC chip mounted on a substrate. Similarly, it is a schematic sectional drawing which shows the state which printed resin for sealing. Similarly, it is a schematic sectional view showing a state in which the printed sealing resin is cured. Similarly, it is a schematic sectional drawing which shows the grinding state of resin for sealing. Similarly, it is a partial schematic exploded perspective view showing a substrate, a magnet sheet, and an iron plate. Similarly, it is the partial schematic front view which shows the wet and grinding wheel type surface grinding apparatus for grinding resin for sealing. Similarly, it is a schematic sectional drawing which shows the grinding completion state of resin for sealing. In the manufacturing method of the semiconductor package of Example 2, it is a schematic sectional drawing which shows the state which grinds sealing resin. Similarly, it is a partial schematic front view showing a dry and belt type surface grinding apparatus for polishing a sealing resin.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... (Electronic component mounting) board | substrate, 2 ... Semiconductor package, 13 ... Table, 5a ... Supply port, 5 ... Metal mask, 6 ... Squeegee, 7 ... IC chip as electronic components, 8, 30 ... Surface grinding apparatus, DESCRIPTION OF SYMBOLS 11 ... Belt conveyor as drive means, 15 ... Magnet sheet as plate-shaped jig, 16 ... Suction hole, 17 ... Communication hole, 20 ... Abrasive material, 26 ... Resin for sealing, 31 ... Drive roller, 32 ... Contact Roller, 33 ... Abrasive belt, R ... Electronic component mounting area.

Claims (4)

An electronic component that prints a sealing resin on the substrate so that the electronic component mounted on the substrate is covered, cures the sealing resin, and then grinds the upper surface of the cured sealing resin Sealing method. The electronic component sealing method according to claim 1, wherein the grinding is performed with an abrasive fixed to a surface of a rotating abrasive belt. The electronic component sealing method according to claim 1, wherein the grinding is performed by rough grinding or finish grinding. The electronic component sealing method according to claim 1, wherein the grinding is performed after the substrate on which the sealing resin is cured is brought into close contact by vacuuming.

Images