TWI771309B - 批量移載微細元件的方法及其裝置 - Google Patents

批量移載微細元件的方法及其裝置 Download PDF

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TWI771309B
TWI771309B TW106125563A TW106125563A TWI771309B TW I771309 B TWI771309 B TW I771309B TW 106125563 A TW106125563 A TW 106125563A TW 106125563 A TW106125563 A TW 106125563A TW I771309 B TWI771309 B TW I771309B
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probe
components
transferring
transfer unit
micro
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TW201911466A (zh
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吳智孟
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創新服務股份有限公司
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Priority to US15/965,920 priority patent/US10825706B2/en
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Abstract

一種批量移載微細元件的方法及其裝置，先將數探針呈陣列載設於一移載單元上，讓探針針頭伸出移載單元底部，該移載單元內部設有一溫控流道，導入熱水到溫控流道中使探針溫度提高，然後驅動移載單元使針頭沾潤一接著材料，再導入冷水至溫控流道中，以對探針進行降溫，促使接著材料暫時附著於針頭上，接著，將移載單元位移至多數微細元件上方，並下壓藉著接著材料以批量沾黏微細元件，最後將該移載單元位移至一基板上方，並再次加溫使得接著材料熱熔後流至該基板上，並控制基板在相對低溫，使接著材料凝結在微細元件與基板之間，即完成轉移。

Description

批量移載微細元件的方法及其裝置
本創作是有關於一種巨量移載微細元件的方法，特別是有關於一種生產快速可提升產量的批量移載微細元件的方法及其裝置。
隨著發光二極體(LED)的成熟與演進，LED產業上已發展到以薄膜化、微小化、陣列化為訴求，且尺寸可高達1~10μm等級左右微發光二極體顯示器(Micro LED Display)。
然而Micro LED顯示儘管已經備受企業關注和擴大研發中，在規格上也較LCD具有多重好處，甚至畫質上可與OLED相媲美，但是現階段Micro LED發展並未普及，主要困難點有三大方面，其一，在於LED固晶上，以目前已成熟的LED燈條製程為例，在製作一LED燈條尚有壞點等失敗問題發生，何況是一片顯示器上要嵌入數百萬顆微型LED，而LCD與OLED已採用批次作業，良率表現相對較佳。其二，在LED組件上，覆晶LED適合於Micro LED顯示，因其體積小、易製作成微型化，不需金屬導線、可縮減LED彼此間的間隙等，雖然覆晶技術(Flip Chip)目前的良率還有一定問題，但是隨著LED的技術的逐漸完善和資本的不斷注入，已經在穩步提升。其三，在規模化轉移上，未來Micro LED顯示困難處在於嵌入LED製程不易採用大批量的作業方式，尤其是RGB的三色LED較單色難度更高，但是未來隨著LED黏著、印刷等技術方法的提升，則有利於Micro LED顯示導入量產化階段。
因此，針對Micro LED的黏著、印刷技術，在業界當中仍是利用表面黏著技術(Surface Mount Technology，SMT)技術或晶片直接封裝(Chip on Board，COB)技術，將微米等級的Micro LED chip一顆一顆鍵接於顯示基板上，此兩種作法皆耗時，也是導致生產速度緩慢的因素之一，進而降低製造效率，故為監控成本的考量下，必須再進一步研發解決的方針。
本創作的批量移載微細元件的方法及其裝置，利用移載單元內的溫控流道作加熱與降溫，來進行接著材料之沾潤、降溫後轉移微細元件、再加熱致使接著材料熔融而確保微細元件移載至基板上，不但操作簡易快速，確實能穩定且確實移載Micro LED，以加快生產速度，同時能提升產量。
本創作的批量移載微細元件的方法及其裝置，探針與微細元件更透過第一結合部與第二結合部的配對嵌合，更能確保穩定移載的使用效果。
因此，本創作所提出之一種批量移載微細元件的方法及其裝置，包含以下步驟：步驟A：將複數個探針呈陣列排列載設於一移載單元上，並且讓各該探針的針頭穿伸出該移載單元的底部。步驟B：該移載單元內含一溫控流道，藉由導入熱水到溫控流道中，使探針溫度提高。步驟C：驅動該移載單元使探針的針頭沾潤上一接著材料。步驟D：再導入冷水至溫控流道中，對各該探針進行降溫動作，以促使該接著材料附著於該探針針頭上。步驟E：再將該移載單元位移至多數微細元件上方，使每一探針對準微細元件並下壓，藉著針尖上的接著材料而批量沾附各該微細元件。步驟F：最後將該移載單元位移至目標基板上方，將微細元件對準要放置的位 置並下壓。步驟G：在下壓的狀況下，再次進行加溫動作，使得接著材料熱熔後流至該基板上，並控制基板在相對低溫，使接著材料凝結在微細元件與基板之間，即完成轉移。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟B中，該溫控流道是由一圍繞在該探針周圍的蜿蜒水路所構成，且該水路的一進端及一出端分別凸伸出該移載單元的頂部，透過熱水在該水路中流通，以對探針進行加熱作用。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟D中，該溫控流道是由一圍繞在該探針周圍的水路所構成，且該水路的一進端及一出端分別凸伸出該移載單元的頂部，該進端上設有一控制閥，切換該控制閥，將冷水通入該水路中，以促使探針溫度被降回低溫。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟E中，各該微細元件已預先移到特定分布間距的一平台上，當該探針針頭上的接著材料沾附於各該微細元件，且將該移載單元上移後，各該微細元件則自該平台被帶起。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟E中，該移載單元的探針針頭底部設有一第一結合部，各該微細元件的頂部設有至少一個對應嵌合於該第一結合部的第二結合部，使得探針與微細元件暫時嵌合在一起。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟B中，該水路的熱水溫度介於攝氏50度至140度。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟D中，該水路的冷水溫度介於攝氏0度至30度。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟A之後，可對該移載單元上的探針進行整平作業，以使得該移載單元 底部的每一個探針高度齊平。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟C中，該接著材料為助焊劑、黏膠、水之其中一種。
依照上述本創作所述之批量移載微細元件的方法，其中，在步驟E中，該第一結合部、該第二結合部的形狀為錐形、多邊形、圓形、圓弧形之任一種，藉由對應形狀的配合讓探針與微細元件得以暫時穩定嵌合。
另外，本創作的批量移載微細元件的裝置，包含有一移載單元、複數個探針及一溫控流道。該移載單元，具有一移載頭及一位於該移載頭上的上蓋。前述探針，呈陣列排列貫穿在該移載頭上，並且使各該探針的一針頭穿伸出該移載頭的底部。該溫控流道，設置於該移載單元上，並具有一蜿蜒圍繞在該探針周圍的水路，該水路還具有穿伸出該移載單元頂部的一進端及一出端，透過該水路通入熱水或冷水，以對前述探針進行加溫或降溫。
依照上述本創作所述之批量移載微細元件的裝置，其中，該溫控流道的進端更設有一控制閥，以切換通入熱水或冷水。
依照上述本創作所述之批量移載微細元件的裝置，其中，該探針的針頭形狀為錐形、多邊形、圓形、圓弧形之任一種。
據上所述，歸納上述，為克服現有Micro LED採以SMT技術或COB技術所導致生產速度緩慢、產量低的問題。本創作利用移載單元上的溫控流道對探針進行加熱作用，使針頭沾附接著材料，接著對探針進行降溫，讓接著材料降溫使其附著於探針針頭上，繼續，再驅動移載單元至要黏取的微細元件上方，再下壓令探針上的接著材料沾黏微細元件，進而將微細元件自平台上被帶起，再位移至基板上方，緊接著再次讓移載單元進行加熱動作，致使針頭上的接著材料經熱熔而流入該基板上，並控制 基板至相對低溫，使接著材料凝結在微細元件與基板之間，而將微細元件黏附在基板上，即快速完成批量移載作業。因此，本創作藉由移載單元內作溫控方式進行接著材料之沾潤、降溫後轉移微細元件、再加熱致使接著材料熔融而確保微細元件移載至基板上，不但操作簡易快速，確實能穩定且確實移載Micro LED，以加快生產速度，同時能提升產量，並具有降低製造成本之優點。
10‧‧‧探針
11‧‧‧針頭
111‧‧‧第一結合部
20‧‧‧移載單元
21‧‧‧移載頭
22‧‧‧上蓋
30‧‧‧溫控流道
31‧‧‧水路
32‧‧‧進端
33‧‧‧出端
34‧‧‧控制閥
40‧‧‧接著材料
50‧‧‧微細元件
51‧‧‧第二結合部
52‧‧‧第二結合部
53‧‧‧紅色微細元件
54‧‧‧綠色微細元件
55‧‧‧藍色微細元件
60‧‧‧平台
70‧‧‧基板
第1圖為本創作批量移載微細元件的方法的流程圖。
第2圖為本創作批量移載微細元件的方法及裝置的外觀立體圖。
第3圖為本創作批量移載微細元件的方法及裝置的平面圖。
第4圖為各該探針進行沾潤接著材料的示意圖。
第5圖為各該探針已沾附接著材料的示意圖。
第6圖為各該微細元件載設於平台上，且已沾黏接著材料的探針接觸在微細元件上的示意圖。
第7圖為各該微細元件已附著在針頭上的示意圖。
第8圖為微細元件位移至基板上方的示意圖。
第9圖為接著材料熔融後流入基板，以使微細元件批量移載至基板上的示意圖。
第10圖為探針與微細元件採以一對一嵌合的分解立體圖。
第11圖為探針與微細元件採以多對一嵌合的分解立體圖。
第12圖為紅色微細元件移載至基板上的示意圖。
第13圖為紅色、綠色微細元件已移載至基板上的示意圖。
第14圖為紅色、綠色、藍色微細元件皆移載至基板上的示意圖。
第15圖為本創作批量移載微細元件的裝置的組合立體圖。
參照第1圖及第2圖所示，本創作批量移載微細元件的方法一較佳實施例，包含以下步驟：步驟A：如第2圖所示，將複數個探針10呈陣列排列載設於一移載單元20上，並且讓各該探針10的一針頭11穿伸出該移載單元20的底部。接著，可對該移載單元20上的探針10進行整平作業，以使得該移載單元20底部的每一個探針10高度齊平。本實施例中，前述整平作業可利用研磨技術來達成。此整平作業並非每次執行，得視需要調整執行頻率。
步驟B：如第3圖所示，接著通過該移載單元20內部的一溫控流道30，藉由導入熱水到溫控流道30中，使探針10溫度提高。本實施例中，該溫控流道30是由一圍繞在該探針10周圍的蜿蜒水路31所構成，且該水路31的一進端32及一出端33分別凸伸出該移載單元20的頂部，透過熱水在該水路31中流通，以對探針10進行加熱作用。本實施例中，該水路31的熱水溫度介於攝氏50度至140度。
步驟C：如第4圖所示，驅動該移載單元20使探針10的針頭11沾潤一接著材料40，如第5圖所示。該接著材料40可為助焊劑、黏膠、底部填充劑(underfill)之其中一種，本實施例中，是以助焊劑為最佳方案。
步驟D：再導入冷水至溫控流道30中，以對各該探針10進行適度降溫，促使該接著材料40凝結在該探針10的針頭11上，以提升黏附力。另外，在本實施例中，參第3圖所示，在該溫控流道30的進端32上設有一控制閥34，通過切換該控制閥34，便得以適時地將冷水通入該水 路31中，以促使探針10溫度被降回低溫。本實施例中，該水路31的冷水溫度介於攝氏0度至30度。
步驟E：如第6圖所示，再將該移載單元20位移至微細元件50上方，並下壓使探針10藉由接著材料40來批量沾黏微細元件50。附帶說明的是，在本步驟時，各該微細元件50已預先從膠膜(Blue Tape)剝離並擴開到目標間距，並移到特定分布的一平台60上，因此，當探針10上的接著材料40沾黏微細元件50後，一旦該移載單元20上移時，前述微細元件50將從該平台60上被帶起，如第7圖所示。
步驟F：如第8圖所示，最後將該移載單元20位移至一基板70上方，再次進行加溫動作(如步驟B中的加熱方式)，使得接著材料40熱熔後流至該基板70上，並控制基板70在相對低溫，使接著材料40凝結在微細元件50與基板70之間，即完成微細元件50的轉移，如第9圖所示。
如第10圖所示，進一步，該移載單元20的探針10針頭11底部設有一第一結合部111，各該微細元件50的頂部設有至少一個對應嵌合於該第一結合部111的第二結合部51，以使得在步驟E中，探針10與微細元件50暫時嵌合在一起，以控制前述微細元件50在移載過程中不會旋轉，並增加探針10抓取微細元件50時的穩定度。
其次，在第2圖至第10圖中，該探針10與該微細元件50採批量化移載作業上，探針10與微細元件50雖是利用一對一方式，藉由各該探針10上的第一結合部111與各該微細元件50的第二結合部51作配對嵌合，此外，探針10與微細元件50雖是利用一對一方式，藉由各該探針10針頭11上的第一結合部111與各該微細元件50的第二結合部51作配對嵌合。此外，探針10與微細元件50亦可利用多對一、一對多或是多對多方式作嵌合，例如第11圖中，探針10與微細元件50採以多對一方式，將兩兩探針10針頭11上的第一結合部111與各該微細元件50上的兩個第 二結合部52作配對嵌合，可以達到更好的沾附抓取的穩定度。
至於，前述探針10的第一結合部111是以矩方錐形為之，而微細元件50的第二結合部51是以矩形為之，當然，前述第一結合部111、該第二結合部51、52亦可使用錐形、多邊形、圓形、圓弧形之任一種結構作變化，藉由對應形狀的配合讓探針10與微細元件50得以獲得暫時穩定嵌合。
值得一提的是，如第12、13、14圖所示，在批量規模化的移載作業上，實現於Micro LED在紅(R)、綠(G)、藍(B)三原色的製程上，R、G、B三色分別製備有各自的移載單元，依照前述的移載作業，逐步執行紅色微細元件53→綠色微細元件54→藍色微細元件55，即可以批量化快速完成Micro LED黏著、印刷的封製作業，讓紅色微細元件53、綠色微細元件54、藍色微細元件55快速批量移載至基板10上。
此外，如第15圖所示，運用於前述方法，本創作的批量移載微細元件的裝置，包含有一移載單元20、複數個探針10及一溫控流道40。
該移載單元20，具有一移載頭21及一位於該移載頭21上的上蓋22。
各該探針10，呈陣列排列貫穿在該移載頭21上，並且使各該探針11的一針頭11穿伸出該移載頭21的底部。如前述，各該探針10的針頭11形狀為錐形、多邊形、圓形、圓弧形之任一種。
該溫控流道30，設置於該移載單元20上，並具有一蜿蜒圍繞在該探針周圍的水路31，該水路31還具有穿伸出該移載單元30之上蓋22頂部的一進端32及一出端33，而該進端32上更接設有一控制閥34，以切換通入熱水或冷水，透過該水路31讓熱水或冷水流入，以對前述探針10進行加熱或降溫。
歸納上述，為克服現有Micro LED採以SMT技術或COB技術所導致生產速度緩慢、產量低的問題。本創作利用移載單元20內的溫控流道30對探針10進行加熱作用，使針頭11能沾附接著材料40，並藉由控制加熱的溫度來控制每次沾附的劑量，接著，再降低溫控流道30使接著材料40凝結在探針10針頭11上，繼續，再控制移載單元20到要黏取的微細元件50上方，並下壓令探針10上的接著材料40沾附微細元件50，進而將微細元件50自平台60上被帶起，再位移至基板70上方，緊接著再次控制水路31進行加熱動作，致使針頭11上的接著材料40經熱熔而流入該基板70上，並控制基板70至相對低溫，使接著材料40凝結在微細元件50與基板70之間，而將微細元件50黏附在基板70上，即快速完成批量移載作業。因此，本創作藉由溫控方式進行接著材料40之沾附、降溫後轉移微細元件50、再加熱致使接著材料40熔融而確保微細元件50移載至基板70上，不但操作簡易快速，確實能穩定且確實移載Micro LED，以加快生產速度，同時能提升產量，並具有降低製造成本之優點。而且，探針11與微細元件50更透過第一結合部111與第二結合部51、52的配對嵌合，更能確保穩定移載的使用效果。
再附帶說明，前述第2至15圖中，所揭露出的微細元件均是舉例運用在Micro LED為實施樣態，當然，微細元件的批量移載方式並不僅限於電子元件上，也可運用在各類型的寶石等微細的元件上，其使用的方法及功效皆與前述相同，不再多加說明。
以上所述；僅為本創作之一個較佳實施例而已，當不能以此限定本創作實施之範圍，即大凡依本創作申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆應仍屬本創作專利涵蓋之範圍內。

Claims (13)

  1. 一種批量移載微細元件的方法，包含以下步驟：步驟A：將複數個探針呈陣列排列載設於一移載單元上，並且讓各該探針的針頭穿伸出該移載單元的底部；步驟B：該移載單元內含一溫控流道，藉由導入熱水到溫控流道中，使探針溫度提高；步驟C：驅動該移載單元使探針的針頭沾潤上一接著材料；步驟D：再導入冷水至溫控流道中，對各該探針進行降溫動作，以促使該接著材料附著於該探針針頭上；步驟E：再將該移載單元位移至多數微細元件上方，使每一探針對準微細元件並下壓，藉著針尖上的接著材料而批量沾附各該微細元件；步驟F：最後將該移載單元位移至目標基板上方，將微細元件對準要放置的位置並下壓；步驟G：在下壓的狀況下，再次進行加溫動作，使得接著材料熱熔後流至該基板上，並控制基板在相對低溫，使接著材料凝結在微細元件與基板之間，即完成轉移。
  2. 如請求項1所述之批量移載微細元件的方法，其中，在步驟B中，該溫控流道是由一圍繞在該探針周圍的蜿蜒水路所構成，且該水路的一進端及一出端分別凸伸出該移載單元的頂部，透過熱水在該水路中流通，以對探針進行加熱作用。
  3. 如請求項1所述之批量移載微細元件的方法，其中，在步驟D中，該溫控流道是由一圍繞在該探針周圍的水路所構成，且該水路的一進端及一出端分別凸伸出該移載單元的頂部，該進端上設有一控制閥，切換該控制閥，將冷水通入該水路中，以促使探針溫度被降回低溫。
  4. 如請求項1所述之批量移載微細元件的方法，其中，在步驟E中，各該微 細元件已預先移到特定分布間距的一平台上，當該探針針頭上的接著材料沾附於各該微細元件，且將該移載單元上移後，各該微細元件則自該平台被帶起。
  5. 如請求項1所述之批量移載微細元件的方法，其中，在步驟E中，該移載單元的探針針頭底部設有一第一結合部，各該微細元件的頂部設有至少一個對應嵌合於該第一結合部的第二結合部，使得探針與微細元件暫時嵌合在一起。
  6. 如請求項1所述之批量移載微細元件的方法，其中，在步驟B中，該水路的熱水溫度介於攝氏50度至140度。
  7. 如請求項1所述之批量移載微細元件的方法，其中，在步驟D中，該水路的冷水溫度介於攝氏0度至30度。
  8. 如請求項1所述之批量移載微細元件的方法，其中，在步驟A之後，可對該移載單元上的探針進行整平作業，以使得該移載單元底部的每一個探針高度齊平。
  9. 如請求項1所述之批量移載微細元件的方法，其中，在步驟C中，該接著材料為助焊劑、黏膠、水之其中一種。
  10. 如請求項5所述之批量移載微細元件的方法，其中，在步驟E中，該第一結合部、該第二結合部的形狀為錐形、多邊形、圓形、圓弧形之任一種，藉由對應形狀的配合讓探針與微細元件得以暫時穩定嵌合。
  11. 一種批量移載微細元件的裝置，包含有：一移載單元，具有一移載頭及一位於該移載頭上的上蓋；複數個探針，呈陣列排列貫穿在該移載頭上，並且使各該探針的一針頭穿伸出該移載頭的底部；一溫控流道，設置於該移載單元上，並具有一蜿蜒圍繞在該探針周圍的水路，該水路還具有穿伸出該移載單元頂部的一進端及一出端，透 過該水路通入熱水或冷水，以對前述探針進行加溫或降溫。
  12. 如請求項11所述之批量移載微細元件的裝置，其中，該溫控流道的進端更設有一控制閥，以切換通入熱水或冷水。
  13. 如請求項11所述之批量移載微細元件的裝置，其中，該探針的針頭形狀為錐形、多邊形、圓形、圓弧形之任一種。
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