TWI768726B - 陶瓷加熱器以及其製造方法 - Google Patents

陶瓷加熱器以及其製造方法 Download PDF

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Publication number
TWI768726B
TWI768726B TW110106266A TW110106266A TWI768726B TW I768726 B TWI768726 B TW I768726B TW 110106266 A TW110106266 A TW 110106266A TW 110106266 A TW110106266 A TW 110106266A TW I768726 B TWI768726 B TW I768726B
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TW
Taiwan
Prior art keywords
resistance heating
heating element
groove
ceramic
precursor
Prior art date
Application number
TW110106266A
Other languages
English (en)
Chinese (zh)
Other versions
TW202136172A (zh
Inventor
赤尾𨺓嘉
平田夏樹
Original Assignee
日商日本碍子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本碍子股份有限公司 filed Critical 日商日本碍子股份有限公司
Publication of TW202136172A publication Critical patent/TW202136172A/zh
Application granted granted Critical
Publication of TWI768726B publication Critical patent/TWI768726B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
TW110106266A 2020-02-26 2021-02-23 陶瓷加熱器以及其製造方法 TWI768726B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-030724 2020-02-26
JP2020030724 2020-02-26

Publications (2)

Publication Number Publication Date
TW202136172A TW202136172A (zh) 2021-10-01
TWI768726B true TWI768726B (zh) 2022-06-21

Family

ID=77491054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110106266A TWI768726B (zh) 2020-02-26 2021-02-23 陶瓷加熱器以及其製造方法

Country Status (6)

Country Link
US (1) US20220369425A1 (https=)
JP (1) JP7349010B2 (https=)
KR (1) KR102814495B1 (https=)
CN (1) CN115152321B (https=)
TW (1) TWI768726B (https=)
WO (1) WO2021172261A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1708190A (zh) * 2004-05-26 2005-12-14 京瓷株式会社 加热器和晶片加热装置及加热器的制造方法
JP2006228633A (ja) * 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) * 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
JP2006054125A (ja) * 2004-08-12 2006-02-23 Kyocera Corp ヒータとその製造方法、及びこれを用いたウェハ加熱装置
KR101098798B1 (ko) * 2004-05-26 2011-12-26 쿄세라 코포레이션 히터와 웨이퍼 가열장치 및 히터의 제조방법
CN100536621C (zh) * 2004-05-27 2009-09-02 京瓷株式会社 陶瓷加热器和采用其的氧传感器及烫发剪
JP4476701B2 (ja) 2004-06-02 2010-06-09 日本碍子株式会社 電極内蔵焼結体の製造方法
JP3969438B2 (ja) * 2005-04-21 2007-09-05 株式会社村田製作所 セラミック基板およびセラミック基板の製造方法
CN201059302Y (zh) * 2007-02-09 2008-05-14 江苏武进液压启闭机有限公司 带内置式行程检测装置的液压缸的陶瓷活塞杆
JP5458050B2 (ja) * 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
JP6054169B2 (ja) * 2012-02-17 2016-12-27 日本碍子株式会社 セラミックス素子の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1708190A (zh) * 2004-05-26 2005-12-14 京瓷株式会社 加热器和晶片加热装置及加热器的制造方法
JP2006228633A (ja) * 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Also Published As

Publication number Publication date
JPWO2021172261A1 (https=) 2021-09-02
KR102814495B1 (ko) 2025-05-30
TW202136172A (zh) 2021-10-01
KR20220124779A (ko) 2022-09-14
CN115152321B (zh) 2025-12-19
JP7349010B2 (ja) 2023-09-21
CN115152321A (zh) 2022-10-04
US20220369425A1 (en) 2022-11-17
WO2021172261A1 (ja) 2021-09-02

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