JPWO2021172261A1 - - Google Patents

Info

Publication number
JPWO2021172261A1
JPWO2021172261A1 JP2022503599A JP2022503599A JPWO2021172261A1 JP WO2021172261 A1 JPWO2021172261 A1 JP WO2021172261A1 JP 2022503599 A JP2022503599 A JP 2022503599A JP 2022503599 A JP2022503599 A JP 2022503599A JP WO2021172261 A1 JPWO2021172261 A1 JP WO2021172261A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022503599A
Other languages
Japanese (ja)
Other versions
JPWO2021172261A5 (https=
JP7349010B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021172261A1 publication Critical patent/JPWO2021172261A1/ja
Publication of JPWO2021172261A5 publication Critical patent/JPWO2021172261A5/ja
Application granted granted Critical
Publication of JP7349010B2 publication Critical patent/JP7349010B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
JP2022503599A 2020-02-26 2021-02-22 セラミックヒータ及びその製法 Active JP7349010B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020030724 2020-02-26
JP2020030724 2020-02-26
PCT/JP2021/006588 WO2021172261A1 (ja) 2020-02-26 2021-02-22 セラミックヒータ及びその製法

Publications (3)

Publication Number Publication Date
JPWO2021172261A1 true JPWO2021172261A1 (https=) 2021-09-02
JPWO2021172261A5 JPWO2021172261A5 (https=) 2022-09-20
JP7349010B2 JP7349010B2 (ja) 2023-09-21

Family

ID=77491054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022503599A Active JP7349010B2 (ja) 2020-02-26 2021-02-22 セラミックヒータ及びその製法

Country Status (6)

Country Link
US (1) US20220369425A1 (https=)
JP (1) JP7349010B2 (https=)
KR (1) KR102814495B1 (https=)
CN (1) CN115152321B (https=)
TW (1) TWI768726B (https=)
WO (1) WO2021172261A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) * 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
JP2006054125A (ja) * 2004-08-12 2006-02-23 Kyocera Corp ヒータとその製造方法、及びこれを用いたウェハ加熱装置
JP2006228633A (ja) * 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4794140B2 (ja) * 2004-05-26 2011-10-19 京セラ株式会社 ヒータとウェハ加熱装置及びその製造方法
KR101098798B1 (ko) * 2004-05-26 2011-12-26 쿄세라 코포레이션 히터와 웨이퍼 가열장치 및 히터의 제조방법
CN100536621C (zh) * 2004-05-27 2009-09-02 京瓷株式会社 陶瓷加热器和采用其的氧传感器及烫发剪
JP4476701B2 (ja) 2004-06-02 2010-06-09 日本碍子株式会社 電極内蔵焼結体の製造方法
JP3969438B2 (ja) * 2005-04-21 2007-09-05 株式会社村田製作所 セラミック基板およびセラミック基板の製造方法
CN201059302Y (zh) * 2007-02-09 2008-05-14 江苏武进液压启闭机有限公司 带内置式行程检测装置的液压缸的陶瓷活塞杆
JP5458050B2 (ja) * 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
JP6054169B2 (ja) * 2012-02-17 2016-12-27 日本碍子株式会社 セラミックス素子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) * 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
JP2006054125A (ja) * 2004-08-12 2006-02-23 Kyocera Corp ヒータとその製造方法、及びこれを用いたウェハ加熱装置
JP2006228633A (ja) * 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Also Published As

Publication number Publication date
KR102814495B1 (ko) 2025-05-30
TW202136172A (zh) 2021-10-01
KR20220124779A (ko) 2022-09-14
CN115152321B (zh) 2025-12-19
JP7349010B2 (ja) 2023-09-21
CN115152321A (zh) 2022-10-04
TWI768726B (zh) 2022-06-21
US20220369425A1 (en) 2022-11-17
WO2021172261A1 (ja) 2021-09-02

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