KR102814495B1 - 세라믹 히터 및 그 제법 - Google Patents

세라믹 히터 및 그 제법 Download PDF

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Publication number
KR102814495B1
KR102814495B1 KR1020227027432A KR20227027432A KR102814495B1 KR 102814495 B1 KR102814495 B1 KR 102814495B1 KR 1020227027432 A KR1020227027432 A KR 1020227027432A KR 20227027432 A KR20227027432 A KR 20227027432A KR 102814495 B1 KR102814495 B1 KR 102814495B1
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South Korea
Prior art keywords
heating element
resistance heating
concave groove
ceramic
precursor
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KR1020227027432A
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English (en)
Korean (ko)
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KR20220124779A (ko
Inventor
다카요시 아카오
나츠키 히라타
Original Assignee
엔지케이 인슐레이터 엘티디
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Publication of KR20220124779A publication Critical patent/KR20220124779A/ko
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Publication of KR102814495B1 publication Critical patent/KR102814495B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
KR1020227027432A 2020-02-26 2021-02-22 세라믹 히터 및 그 제법 Active KR102814495B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020030724 2020-02-26
JPJP-P-2020-030724 2020-02-26
PCT/JP2021/006588 WO2021172261A1 (ja) 2020-02-26 2021-02-22 セラミックヒータ及びその製法

Publications (2)

Publication Number Publication Date
KR20220124779A KR20220124779A (ko) 2022-09-14
KR102814495B1 true KR102814495B1 (ko) 2025-05-30

Family

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Application Number Title Priority Date Filing Date
KR1020227027432A Active KR102814495B1 (ko) 2020-02-26 2021-02-22 세라믹 히터 및 그 제법

Country Status (6)

Country Link
US (1) US20220369425A1 (https=)
JP (1) JP7349010B2 (https=)
KR (1) KR102814495B1 (https=)
CN (1) CN115152321B (https=)
TW (1) TWI768726B (https=)
WO (1) WO2021172261A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) * 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
JP2006054125A (ja) * 2004-08-12 2006-02-23 Kyocera Corp ヒータとその製造方法、及びこれを用いたウェハ加熱装置
JP2006228633A (ja) * 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4794140B2 (ja) * 2004-05-26 2011-10-19 京セラ株式会社 ヒータとウェハ加熱装置及びその製造方法
KR101098798B1 (ko) * 2004-05-26 2011-12-26 쿄세라 코포레이션 히터와 웨이퍼 가열장치 및 히터의 제조방법
CN100536621C (zh) * 2004-05-27 2009-09-02 京瓷株式会社 陶瓷加热器和采用其的氧传感器及烫发剪
JP4476701B2 (ja) 2004-06-02 2010-06-09 日本碍子株式会社 電極内蔵焼結体の製造方法
JP3969438B2 (ja) * 2005-04-21 2007-09-05 株式会社村田製作所 セラミック基板およびセラミック基板の製造方法
CN201059302Y (zh) * 2007-02-09 2008-05-14 江苏武进液压启闭机有限公司 带内置式行程检测装置的液压缸的陶瓷活塞杆
JP5458050B2 (ja) * 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
JP6054169B2 (ja) * 2012-02-17 2016-12-27 日本碍子株式会社 セラミックス素子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) * 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
JP2006054125A (ja) * 2004-08-12 2006-02-23 Kyocera Corp ヒータとその製造方法、及びこれを用いたウェハ加熱装置
JP2006228633A (ja) * 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Also Published As

Publication number Publication date
JPWO2021172261A1 (https=) 2021-09-02
TW202136172A (zh) 2021-10-01
KR20220124779A (ko) 2022-09-14
CN115152321B (zh) 2025-12-19
JP7349010B2 (ja) 2023-09-21
CN115152321A (zh) 2022-10-04
TWI768726B (zh) 2022-06-21
US20220369425A1 (en) 2022-11-17
WO2021172261A1 (ja) 2021-09-02

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