JP7349010B2 - セラミックヒータ及びその製法 - Google Patents
セラミックヒータ及びその製法 Download PDFInfo
- Publication number
- JP7349010B2 JP7349010B2 JP2022503599A JP2022503599A JP7349010B2 JP 7349010 B2 JP7349010 B2 JP 7349010B2 JP 2022503599 A JP2022503599 A JP 2022503599A JP 2022503599 A JP2022503599 A JP 2022503599A JP 7349010 B2 JP7349010 B2 JP 7349010B2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- groove
- resistance heating
- ceramic
- precursor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020030724 | 2020-02-26 | ||
| JP2020030724 | 2020-02-26 | ||
| PCT/JP2021/006588 WO2021172261A1 (ja) | 2020-02-26 | 2021-02-22 | セラミックヒータ及びその製法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021172261A1 JPWO2021172261A1 (https=) | 2021-09-02 |
| JPWO2021172261A5 JPWO2021172261A5 (https=) | 2022-09-20 |
| JP7349010B2 true JP7349010B2 (ja) | 2023-09-21 |
Family
ID=77491054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022503599A Active JP7349010B2 (ja) | 2020-02-26 | 2021-02-22 | セラミックヒータ及びその製法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220369425A1 (https=) |
| JP (1) | JP7349010B2 (https=) |
| KR (1) | KR102814495B1 (https=) |
| CN (1) | CN115152321B (https=) |
| TW (1) | TWI768726B (https=) |
| WO (1) | WO2021172261A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002190373A (ja) | 2000-12-19 | 2002-07-05 | Ibiden Co Ltd | セラミックヒータの製造方法 |
| JP2006054125A (ja) | 2004-08-12 | 2006-02-23 | Kyocera Corp | ヒータとその製造方法、及びこれを用いたウェハ加熱装置 |
| JP2006228633A (ja) | 2005-02-18 | 2006-08-31 | Ngk Insulators Ltd | 基板加熱装置の製造方法及び基板加熱装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4794140B2 (ja) * | 2004-05-26 | 2011-10-19 | 京セラ株式会社 | ヒータとウェハ加熱装置及びその製造方法 |
| KR101098798B1 (ko) * | 2004-05-26 | 2011-12-26 | 쿄세라 코포레이션 | 히터와 웨이퍼 가열장치 및 히터의 제조방법 |
| CN100536621C (zh) * | 2004-05-27 | 2009-09-02 | 京瓷株式会社 | 陶瓷加热器和采用其的氧传感器及烫发剪 |
| JP4476701B2 (ja) | 2004-06-02 | 2010-06-09 | 日本碍子株式会社 | 電極内蔵焼結体の製造方法 |
| JP3969438B2 (ja) * | 2005-04-21 | 2007-09-05 | 株式会社村田製作所 | セラミック基板およびセラミック基板の製造方法 |
| CN201059302Y (zh) * | 2007-02-09 | 2008-05-14 | 江苏武进液压启闭机有限公司 | 带内置式行程检测装置的液压缸的陶瓷活塞杆 |
| JP5458050B2 (ja) * | 2011-03-30 | 2014-04-02 | 日本碍子株式会社 | 静電チャックの製法 |
| JP6054169B2 (ja) * | 2012-02-17 | 2016-12-27 | 日本碍子株式会社 | セラミックス素子の製造方法 |
-
2021
- 2021-02-22 CN CN202180007497.8A patent/CN115152321B/zh active Active
- 2021-02-22 KR KR1020227027432A patent/KR102814495B1/ko active Active
- 2021-02-22 WO PCT/JP2021/006588 patent/WO2021172261A1/ja not_active Ceased
- 2021-02-22 JP JP2022503599A patent/JP7349010B2/ja active Active
- 2021-02-23 TW TW110106266A patent/TWI768726B/zh active
-
2022
- 2022-07-29 US US17/816,022 patent/US20220369425A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002190373A (ja) | 2000-12-19 | 2002-07-05 | Ibiden Co Ltd | セラミックヒータの製造方法 |
| JP2006054125A (ja) | 2004-08-12 | 2006-02-23 | Kyocera Corp | ヒータとその製造方法、及びこれを用いたウェハ加熱装置 |
| JP2006228633A (ja) | 2005-02-18 | 2006-08-31 | Ngk Insulators Ltd | 基板加熱装置の製造方法及び基板加熱装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021172261A1 (https=) | 2021-09-02 |
| KR102814495B1 (ko) | 2025-05-30 |
| TW202136172A (zh) | 2021-10-01 |
| KR20220124779A (ko) | 2022-09-14 |
| CN115152321B (zh) | 2025-12-19 |
| CN115152321A (zh) | 2022-10-04 |
| TWI768726B (zh) | 2022-06-21 |
| US20220369425A1 (en) | 2022-11-17 |
| WO2021172261A1 (ja) | 2021-09-02 |
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