TWI765260B - 自動粘脫設備 - Google Patents

自動粘脫設備 Download PDF

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TWI765260B
TWI765260B TW109115331A TW109115331A TWI765260B TW I765260 B TWI765260 B TW I765260B TW 109115331 A TW109115331 A TW 109115331A TW 109115331 A TW109115331 A TW 109115331A TW I765260 B TWI765260 B TW I765260B
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carrier
electrostatic
group
wireless
substrate
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TW109115331A
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TW202143382A (zh
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陳明生
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特銓股份有限公司
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Priority to TW109115331A priority Critical patent/TWI765260B/zh
Priority to CN202021847174.9U priority patent/CN212934583U/zh
Priority to CN202010887368.XA priority patent/CN113628996A/zh
Priority to DE102021110269.3A priority patent/DE102021110269A1/de
Priority to KR1020210058910A priority patent/KR102502967B1/ko
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    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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Abstract

本發明涉及一種自動粘脫設備，該粘脫設備包含有一供吸附一無線靜電載盤之載板靜電生成組，以及一供吸附一薄化基板之基板移載組，而該基板移載組可相對該載板靜電生成組線性位移，使得該基板移載組可帶動薄化基板壓合於該載板靜電生成組之無線靜電載盤表面，藉此，可作動該載板靜電生成組使無線靜電載盤生成靜電電力場，以粘合該薄化基板，而能提升粘合效率，且可大幅降低粘合失敗率，並減少生裂損或破片的發生。

Description

自動粘脫設備
本發明係隸屬一種靜電吸盤之自動粘合技術，具體而言係指一種自動粘脫設備，藉以能使靜電吸盤與薄化基板如晶圓可進行自動化的粘合與解離工作，可提高工作效率，且減少粘合失敗及發生基板破損之現象，從而提高薄化基板的製程自動化。
按，近年來受到半導體製程的微細化發展，如存儲器和功率器件，它們的微型化朝著更小的尺寸、更高的性能以及更低的成本方向發展，而為了讓晶片面積變的更小，半導體業界採行的設計方案是將原本晶片水平部署的晶片設計，改換成垂直向的堆疊方式進行，亦即所謂的3D IC堆疊封裝。由於3D IC堆疊封裝係以垂直向進行堆疊，需利用矽穿孔〔Through-Silicon Via；TSV〕技術將IC封裝內的各功能晶片進行物理電氣連結，因此矽晶圓之厚度會被壓縮在100微米以下。另外近來智慧型手機的照相品質足以媲美專業單眼相機，而智慧型手機相機鏡頭的成像品質大幅提升的關鍵之一，在於手機相機鏡頭導入超薄的藍玻璃濾光片，可吸收多餘的紅外光，還原物體的真實顏色。
而這些薄化基板不論是3D IC的薄化晶圓或鏡頭的超薄濾光片，當其厚度小於200μm、100μm或甚至小於50μm，且表面積越大時如半導製程的8吋、12吋或以上時。薄化基板會變得非常柔軟有彈性，進而產生翹曲的現象。然不論是矽晶圓或玻璃片等薄化基板在製作上，需經抛光研磨、清淨、多層鍍膜、蝕刻及切割。由於超薄基板在製程中會因翹曲產生不平整及應力，會造成如鍍膜時厚度不均的製程不良問題，甚至於薄化基板也因翹曲問題在檢測時無法有效對焦而產生檢出錯誤或延緩檢測時間，而直接影響到不良品的檢出，再者薄化基板在運送與組裝過程也存在有儲存量少、易碎及脆弱等問題，故薄化基板的翹曲問題對製程可靠度產生重大不良影響，而造成提高製程成本及不良率的問題。
為了使薄化基板能保持平整來進入製程，目前薄化基板係採行暫時接合製程〔Temporary bonding〕，來強化薄化基板的張度，而暫時接合製程主要係利用多層聚合物之接合材料將薄化基板可逆地安裝到一載體上，但在進行製程後又需進行剝離，如此在接合與剝離之間都必須保持薄化基板本身的良率，同時接合後使用的接合材料，亦必須因應接合材料、被接合材料的熱膨脹係數〔CTE〕不匹配，維持薄化晶圓的內部應力，同時維持晶圓正面/背面的表面平滑，以及製程環境中對於接合材料的酸、鹼問題，這些都是進行暫時接合製程所面臨的問題。
而目前最新的改善方式是使用無線靜電載盤 〔E-Chuck或Supporter〕來粘合薄化基板後，供薄化基板進行製程作業。然而目前無線靜電載盤在粘合薄化基板時係採手動方式進行，該手動粘脫設備係於一靜電力生成座一側樞設有一可選擇性蓋合之基板載座，使用上係由工作人員先將該薄化基板放置於該靜電力生成座上，然後將上方的基板載座以手動方式旋轉方式向下蓋合於該靜電力生成座上，以利用該基板載座吸附該薄化基板，之後工作人員再將該無線靜電載盤置於該靜電力生成器上，且再次將基板載座旋轉蓋合，使該薄化基板壓合於該無線靜電載盤相對表面上，最後啟動導電令該無線靜電載盤相對薄化基板產生靜止的電力場，使得該薄化基板能被粘合於該無線靜電載盤上。且在解離該無線靜電載盤與該薄化基板時，則反向操作，將粘合有薄化基板的無線靜電載盤置入該靜電力生成座上，然後蓋合基板載座於薄化基板上方，當該靜電力生成座啟動解離而釋放該無線靜電載盤的電力場後，上方的基板載座可吸附薄化基板後向上掀起，進而分離該無線靜電載盤與該薄化基板。
但這樣的手動操作方式，不僅速度極慢，同時由於人員環境操作下該無線靜電載盤與該薄化基板的相對粘合表面無法確保其潔淨與乾燥，造成其粘合失敗的現象，而需重新進行粘合作業，且甚至可能因錯位、滑移或壓合不均勻而發生裂損或破片的問題，故其粘合效率極差。再者，由於手動操作係以人力方式進行，其難以讓該無線靜電載盤與該薄化基板在粘合時被準確對位，對於微細化高精度要求的半導體製程而言，其難以被直 接應用於高精度製程上，而只能用於傳輸、儲存等對於精度要求不高的場合。
換言之，由於現有無線靜電載盤係以手動方式粘合薄化基板，而不僅存在效率差、失敗率高的問題，甚至可能發生裂損或破片，同時也無法應付高精度的製程需求，而如何解決前述的問題係業界所期待者，亦為本發明所欲解決的技術課題。
緣是，本發明人乃針對現有無線靜電載盤在粘合薄化基板時所面臨的問題深入探討，並藉由近年來技術發展的需求，經不斷努力的改良與試作，終於成功開發出一種自動粘脫設備，藉以克服現有手動操作所造成的缺點與不便。
因此，本發明之主要目的係在提供一種自動粘脫設備，其可以提升粘合效率，且可大幅降低粘合失敗率，並減少生裂損或破片的發生。
再者，本發明之另一主要目的係在提供一種自動粘脫設備，其能快速、且準確的自動粘合無線靜電載盤與薄化基板，使無線靜電載盤能粘合薄化基板能應用於後續製程中，可大幅提高薄化基板的製程良率，而能降低成本及增加利潤。
基於此，本創作主要係透過下列的技術手段，來具體實現前述之目的及功效：係用於一無線靜電載盤與一薄化基板的粘合或解離，其該無線靜電載盤底面具有導電生成靜電電力場之導極，該粘脫設備包含有；
一框架；
一載板靜電生成組，其設於該框架上，該載板靜電生成組具有一供無線靜電載盤平置之工作平面，該工作平面上分設有系列對應無線靜電載盤底面之吸附件，且該工作平面上具有二或二倍數對應接觸無線靜電載盤底導極之導極，以作動生成或釋放該無線靜電載盤之靜電電力場，又該工作平面上具有一導柱組，該導柱組包含至少二個限制載盤橫向位置之固定導柱及至少一可橫向推動載盤與固定導柱嚙合之活動導柱，使得無線靜電載盤或薄化基板可定位於工作平面之一正確位置；
一基板移載組，其設於該框架上且與該載板靜電生成組相對，又該基板移載組與該載板靜電生成組可相對移動，使得該基板移載組可吸附一具正確位置之薄化基板；
藉此，當該基板移載組可帶動薄化基板與無線靜電載盤壓合後，可作動該載板靜電生成組使無線靜電載盤生成靜電電力場，以粘合該薄化基板。
藉此，透過上述技術手段的具體實現，本發明可以提升粘合效率，且可大幅降低粘合失敗率，並減少生裂損或破片的發生，使無線靜電載盤能粘合薄化基板能應用於後續製程中，可大幅提高薄化基板的製程良率，而能降低成本及增加利潤，以提高其附加價值，進一步可提高其經濟效益。
為使 貴審查委員能進一步了解本發明的構成、特徵及其他目的，以下乃舉本發明之較佳實施例，並配合圖式詳細 說明如後，同時讓熟悉該項技術領域者能夠具體實施。
50:粘脫設備
51:下框架
52:上框架
60:載板靜電生成組
61:主框板
62:頂料件
620:檢知元件
63:導極
64:吸附件
65:側翼板
66:導柱
660:固定導柱
661:斜導面
665:活動導柱
666:斜導面
67:觸動檢知組
670:觸動凸柱
675:導正凸柱
68:光學檢知組
680:光電元件
69:吹氣單元
690:噴射氣嘴
70:驅動件
80:基板移載組
81:框座
810:檢知元件
82:升降機構
83:吸附件
830:表面吸附件
835:邊緣吸附件
85:光學檢知組
850:光電元件
86:防落件
第一圖：本發明自動粘脫設備的外觀示意圖。
第二圖：本發明自動粘脫設備的側視平面示意圖。
第三圖：本發明自動粘脫設備中載盤靜電生成組的外觀示意圖。
第四圖：本發明自動粘脫設備中載盤靜電生成組的俯視平面示意圖。
第五圖：本發明自動粘脫設備中基板移載組的外觀示意圖。
第六圖：本發明自動粘脫設備中基板移載組的局部仰視平面示意圖。
第七圖：本發明自動粘脫設備中載盤靜電生成組於頂料時的側視動作示意圖。
第八圖：本發明自動粘脫設備中載盤靜電生成組於導正時的側視動作示意圖。
第九圖：本發明自動粘脫設備中載盤靜電生成組於導正時的俯視動作示意圖。
第十圖：本發明自動粘脫設備中載盤靜電生成組於導正時的俯視局部動作示意圖。
第十一圖：本發明自動粘脫設備中載盤靜電生成組於解離時的局部側視動作示意圖。
本發明係一種自動粘脫設備，隨附圖例示本發明之具體實施例及其構件中，所有關於前與後、左與右、頂部與底部、上部與下部、以及水平與垂直的參考，僅用於方便進行描述，並非限制本發明，亦非將其構件限制於任何位置或空間方向。圖式與說明書中所指定的尺寸，當可在不離開本發明之申請專利範圍內，根據本發明之具體實施例的設計與需求而進行變化。
本發明用於無線靜電吸盤之自動粘合系統，則係如第一、二圖所示，係用於使一無線靜電載盤(100)與一薄化基板(200)之自動粘合與粘合後之自動解離，其中該薄化基板(200)可以是半導體晶圓或玻璃片或塑膠片，該粘脫設備(50)包含有可相對位移之一供吸附無線靜電載盤(100)之載板靜電生成組(60)及一供吸附薄化基板(200)之基板移載組(80)，其中該粘脫設備(50)具有可固設於機體(10)之框架，該框架包含有一下框架(51)及一上框架(52)，其中該載板靜電生成組(60)係設於該下框架(51)頂部，而該基板移載組(80)係利用一升降機構(82)設於該上框架(52)對應該載板靜電生成組(60)的上方，使得該基板移載組(80)可帶動薄化基板(200)相對應壓合於該載板靜電生成組(60)頂面之無線靜電載盤(100)表面；
而前述之載板靜電生成組(60)係如第三、四圖所示，其具有一主框板(61)及樞設於該主框板(61)兩側邊緣之 側翼板(65)，且該主框板(61)與兩側之側翼板(65)具有供無線靜電載盤(100)平置之工作平面，且該工作平面之主框板(61)上設有一檢知元件(610)，供檢知該無線靜電載盤(100)或薄化基板(200)是否存在，另該主框板(61)內設有一頂料件(62)，該頂料件(62)可於工作平面及一較高之接料平面間位移〔如第七、八圖所示〕，可便於傳輸裝置(20)如機械手臂之夾爪穿入放置或取走無線靜電載盤(100)或薄化基板(200)，該頂料件(62)可以是由至少三根可同步升降之頂桿所構成、又或由一可升降之頂板所構成，又兩側側翼板(65)於異於主框板(61)的外側底緣中央與下框架(51)間設有一伸縮缸(70)，供選擇性作動側翼板(65)外側緣向下傾斜兩側之側翼板(65)的相異外側緣可被選擇性向下作動傾斜〔如第十一圖所示〕，供用於帶動該無線靜電載盤(100)與粘合的薄化基板(200)由外緣相對剝離，再者該主框板(61)與該側翼板(65)上分設有系列對應無線靜電載盤(100)底面之吸附件(64)〔如真空吸盤〕，供選擇性將無線靜電載盤(100)固定於主框板(61)與側翼板(65)之工作平面上，且該主框板(61)上具有二或二之倍數的導極(63)，供對應無線靜電載盤(100)之底面正負導極(105)，以提供電力使無線靜電載盤(100)表面可相對薄化基板(200)生成或解離靜電電力場，用於讓無線靜電載盤(100)可與薄化基板(200)相互粘合或解離，又兩側之側翼板(65)上具有一導位組(66)，該導位組(66)包含有圍繞於無線靜電載盤(100) 外周緣之至少二個固定導柱(660)及至少一個活動導柱(665)，本發明係以二個固定導柱(660)及二個活動導柱(665)為主要實施例，其中該等活動導柱(665)可將無線靜電載盤(100)推向該等固定導柱(660)之水平正確位置定位〔如第九圖所示〕，再者該等固定導柱(660)與該等活動導柱(665)頂端周緣形成有一斜導緣(661、666)，讓該頂料件(62)下降時該無線靜電載盤(100)或薄化基板(200)可導引至工作平面之正確範圍內，再者該載板靜電生成組(60)於對應無線靜電載盤(100)外周緣處分設有一觸動檢知組(67)及一光學檢知組(68)，其中該觸動檢知組(67)包含有可伸縮且圍繞於無線靜電載盤(100)外周緣之至少二根觸動凸柱(670)及至少一根可前後移動之導正凸柱(675)，其中該導正凸柱(675)可對應該無線靜電載盤(100)或薄化基板(200)之定位缺口(101、201)，使該導正凸柱(675)能利用該無線靜電載盤(100)或薄化基板(200)之定位切口(101、201)令其以軸線為中心旋轉導正〔如第十圖所示〕，且進一步用以當無線靜電載盤(100)或薄化基板(200)未擺正而碰觸任何一根觸動凸柱(670)時可觸發警報，至於該光學檢知組(68)包含有至少三個圍繞於無線靜電載盤(100)外周緣之光電元件(680)，用以當無線靜電載盤(100)或薄化基板(200)未擺正而遮蔽任何一光電元件(680)時可觸發警報，以確保無線靜電載盤(100)及薄化基板(200)準確對位，另如第九圖所示，該載板靜電生成組(60)於下框架對應兩側側翼板 (65)處分別設有一吹氣單元(69)，該吹氣單元(69)具有一對應無線靜電載盤(100)外周緣向軸心方向沿伸之噴射氣嘴(690)〔如第十一圖所示〕，用於當無線靜電載盤(100)於啟動解離且被兩側側翼板(65)帶動與薄化基板(200)剝離時，可吹入高速氣體令無線靜電載盤(100)與薄化基板(200)能被有效的分離；
又前述之基板移載組(80)係如第五、六圖所示，其係由一可選擇性吸附薄化基板(200)之框座(81)所構成，該框座(81)可被升降機構(82)上下線性作動，供帶動薄化基板(200)相對下方無線靜電載盤(100)選擇性壓合，又該框座(81)表面設有一檢知元件(810)，供檢知該薄化基板(200)是否存在，且該框座(81)具有一吸附表面，該框座(81)之吸附表面有複數吸附件(83)，其可包含對應薄化基板(200)範圍內之表面吸附件(830)或薄化基板(200)鄰近邊緣之邊緣吸附件(835)，其中表面吸附件(830)可以是伯努利定律〔Bernoulli〕之吸附技術，以降低對薄化基板(200)在吸附過程中可能造成的損傷，再者該基板移載組(80)於對應薄化基板(200)外周緣處設有一光學檢知組(85)，該光學檢知組(85)包含有至少三個圍繞於薄化基板(200)外周緣之光電元件(850)，用以當薄化基板(200)未擺正而遮蔽任何一光電元件(850)時可觸發警報，以確保薄化基板(200)準確對位。另根據某些實施例，該基板移載組(80)周緣可設有可選擇性伸縮之防落件(86)，其伸出時所圍範圍小於薄化基板(200)外徑，用於當薄化基板(200)進入基板移載組(80)吸附表面時，可伸出防落件(86)，以避免薄化基板(200)因未有效吸附而掉落，其可以確認薄化基板(200)被基板移載組(80)有效吸附後縮回。根據某些實施例，該基板移載組(80)可以是能相對載板靜電生成組(60)夾取薄化基板(200)之機械手臂；藉此，組構成一可讓無線靜電載盤(100)與薄化基板(200)能自動粘合與自動解離之自動粘合系統者。
其實際操作時，係如第一、二、三及四圖所示，該傳輸裝置(20)將無線靜電載盤(100)置於該載板靜電生成組(60)之主框板(61)與側翼板(65)的工作平面上〔如第七、八圖所示〕，且利用其觸動檢知組(67)及光學檢知組(68)確保該無線靜電載盤(100)被以指定方位準確定位後〔如第九、八圖所示〕，該載板靜電生成組(60)可利用吸附件(64)固定該無線靜電載盤(100)，另如第五、六圖所示，該傳輸裝置(20)將薄化基板(200)置於該基板移載組(80)的底面上，且利用其觸動檢知組(67)及光學檢知組(85)確保該薄化基板(200)被以指定方位準確定位後，該基板移載組(80)可利用吸附件(83)固定該薄化基板(200)，且使該無線靜電載盤(100)與該薄化基板(200)以同一指定方位相對；當無線靜電載盤(100)與薄化基板(200)被以同一指定方位固定在相對表面後，如第七~十圖所示，將該基板移載組(80)帶動薄化基板(200)相對該載板靜電生成組(60)之無線靜電載盤(100)線性位移，使得該薄化基板(200)可以同一指定方位貼合於該無線靜電載盤(100)表面，且兩者外周緣完全重疊，在完成該無線靜電載盤(100)與該薄化基板(200)之貼合後，該載板靜電生成組(60)可電氣導通對該無線靜電載盤(100)，使該無線靜電載盤(100)可相對該薄化基板(200)生成一靜電電力場，而完成該無線靜電載盤(100)以靜電粘合該薄化基板(200)之工作。
再者，該粘合的薄化基板(200)與無線靜電載盤(100)也能被解離，其係將該粘合有薄化基板(200)之無線靜電載盤(100)置入該載板靜電生成組(60)中吸附固定，並將該基板移載組(80)線性位移吸附固定於該薄化基板(200)異於無線靜電載盤(100)的一側表面，接著令該載板靜電生成組(60)釋放該無線靜電載盤(100)之靜電電力場，使該無線靜電載盤(100)之靜電被釋放，進而使該薄化基板(200)能被解離，並由該基板移載組(80)反向位移帶動該薄化基板(200)與該無線靜電載盤(100)相對分離，最後再利用相對之傳輸裝置(20)將該無線靜電載盤(100)與該薄化基板(200)分別置入相對應的載盤出入料埠(18)及基板出入料埠(16)中。而根據某些實施例，如第十一圖示，該無線靜電載盤(100)在靜電釋放後，可將該無線靜電載盤(100)外周緣向下作動，令該無線靜電載盤(100)外周緣可相對該薄化基板(200)預先剝離生 成一開口，並透過一噴氣單元(69)之噴射氣嘴(690)將高速氣體由無線靜電載盤(100)外周緣吹入，使得該無線靜電載盤(100)與該薄化基板(200)能被有效分離。
而由上述可知，本發明之自動粘脫設備可以提升粘合效率，且可大幅降低粘合失敗率，並減少生裂損或破片的發生，其可供應付高精度的製程需求，以滿足薄化基板之自動化製作的需求，使無線靜電載盤能粘合薄化基板能應用於後續製程中，可大幅提高薄化基板的製程良率，而能降低成本及增加利潤。
綜上所述，可以理解到本發明為一創意極佳之發明，除了有效解決習式者所面臨的問題，更大幅增進功效，且在相同的技術領域中未見相同或近似的產品創作或公開使用，同時具有功效的增進，故本發明已符合發明專利有關「新穎性」與「進步性」的要件，乃依法提出申請發明專利。
50:粘脫設備
51:下框架
52:上框架
60:載板靜電生成組
61:主框板
65:側翼板
66:導柱
660:固定導柱
665:活動導柱
690:噴射氣嘴
70:驅動件
80:基板移載組
81:框座
82:升降機構

Claims (10)

  1. 一種自動粘脫設備，係用於一無線靜電載盤與一薄化基板的粘合或解離，其該無線靜電載盤底面具有導電生成靜電電力場之導極，該粘脫設備包含有；
    一框架；
    一載板靜電生成組，其設於該框架上，該載板靜電生成組具有一供無線靜電載盤平置之工作平面，該工作平面上分設有系列對應無線靜電載盤底面之吸附件，且該工作平面上具有二或二倍數對應接觸無線靜電載盤底導極之導極，以作動生成或釋放該無線靜電載盤之靜電電力場，又該工作平面上具有一導柱組，該導柱組包含至少二個限制載盤橫向位置之固定導柱及至少一可橫向推動載盤與固定導柱嚙合之活動導柱，使得無線靜電載盤或薄化基板可定位於工作平面之一正確位置；
    一基板移載組，其設於該框架上且與該載板靜電生成組相對，又該基板移載組與該載板靜電生成組可相對移動，使得該基板移載組可吸附一具正確位置之薄化基板；
    藉此，當該基板移載組可帶動薄化基板與無線靜電載盤壓合後，可作動該載板靜電生成組使無線靜電載盤生成靜電電力場，以粘合該薄化基板。
  2. 如申請專利範圍請求項1所述之自動粘脫設備，其中該工作平面係由一主框板及樞設於該主框板兩側邊 緣之側翼板所組成，且兩側側翼板異於主框板一端可選擇性向下位移。
  3. 如申請專利範圍請求項2所述之自動粘脫設備，其中該主框板內設有一可選擇性升降之頂料件，該頂料件可於工作平面及一較高之接料平面間位移。
  4. 如申請專利範圍請求項1所述之自動粘脫設備，其中該等導柱之固定導柱與活動導柱頂端周緣形成有一斜導緣，讓該載板下降時該無線靜電載盤可導引至工作平面之正確位置。
  5. 如申請專利範圍請求項1所述之自動粘脫設備，其中該載板靜電生成組於對應無線靜電載盤外周緣處設有一觸動檢知組，該觸動檢知組包含有可伸縮且圍繞於無線靜電載盤外周緣之至少二根觸動凸柱及至少一根可前後移動之導正凸柱，其中該導正凸柱能利用該無線靜電載盤或薄化基板之定位切口，令其以軸線為中心旋轉導正。
  6. 如申請專利範圍請求項1或5所述之自動粘脫設備，其中該載板靜電生成組於對應無線靜電載盤外周緣處設有一光學檢知組，該光學檢知組包含有至少三個圍繞於無線靜電載盤外周緣之光電元件，用以當無線靜電載盤未擺正而遮蔽任何一光電元件時可觸發警報。
  7. 如申請專利範圍請求項2所述之自動粘脫設備，其中該載板靜電生成組於對應兩側側翼板處分別設有一吹氣單元，該吹氣單元具有一對應無線靜電載盤外周緣向軸心方向沿伸之噴射氣嘴，供吹入高速氣體令無線靜電載盤與薄化基板能被有效的分離。
  8. 如申請專利範圍請求項1所述之自動粘脫設備，其中該基板移載組具有一框座，且該框座表面有複數吸附件，其可包含對應薄化基板範圍內之表面吸附件或薄化基板鄰近邊緣之邊緣吸附件，其中表面吸附件可以是伯努利定律之吸附技術。
  9. 如申請專利範圍請求項1或9所述之自動粘脫設備，其中該基板移載組於對應薄化基板外周緣處設有一光學檢知組，該光學檢知組包含有至少三個圍繞於薄化基板外周緣之光電元件，用以當薄化基板未擺正而遮蔽任何一光電元件時可觸發警報。
  10. 如申請專利範圍請求項1所述之自動粘脫設備，其中該基板移載組周緣可設有可選擇性伸縮之防落件，其伸出時所圍範圍小於薄化基板外徑，用於當薄化基板進入基板移載組吸附表面時，可伸出防落件，以避免薄化基板因未有效吸附而掉落，且該附落件可以確認薄化基板被基板移載組有效吸附後縮回。
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