CN113628996A - 自动粘脱设备 - Google Patents

自动粘脱设备 Download PDF

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CN113628996A
CN113628996A CN202010887368.XA CN202010887368A CN113628996A CN 113628996 A CN113628996 A CN 113628996A CN 202010887368 A CN202010887368 A CN 202010887368A CN 113628996 A CN113628996 A CN 113628996A
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substrate
wireless
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陈明生
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Stek Co ltd
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Abstract

本发明涉及一种自动粘脱设备,该粘脱设备包含有一供吸附一无线静电载盘的载板静电生成组,以及一供吸附一薄化基板的基板移载组,而该基板移载组可相对该载板静电生成组线性位移,使得该基板移载组可带动薄化基板压合于该载板静电生成组的无线静电载盘表面,如此,可作动该载板静电生成组使无线静电载盘生成静电电力场,以粘合该薄化基板,而能提升粘合效率,且可大幅降低粘合失败率,并减少生裂损或破片的发生。

Description

自动粘脱设备
技术领域
本发明涉及一种静电吸盘的自动粘合技术,具体而言系指一种自动粘脱设备,以能使静电吸盘与薄化基板如晶圆可进行自动化的粘合与解离工作,可提高工作效率,且减少粘合失败及发生基板破损的现象,从而提高薄化基板的制程自动化。
背景技术
近年来受到半导体制程的微细化发展,如存储器和功率器件,它们的微型化朝着更小的尺寸、更高的性能以及更低的成本方向发展,而为了让晶片面积变的更小,半导体业界采行的设计方案是将原本晶片水平部署的晶片设计,改换成垂直向的堆迭方式进行,也即所谓的3DIC堆迭封装。由于3DIC堆迭封装系以垂直向进行堆迭,需利用硅穿孔(Through-SiliconVia;TSV)技术将IC封装内的各功能晶片进行物理电气连结,因此硅晶圆的厚度会被压缩在100微米以下。另外近来智慧型手机的照相品质足以媲美专业单眼相机,而智慧型手机相机镜头的成像品质大幅提升的关键的一,在于手机相机镜头导入超薄的蓝玻璃滤光片,可吸收多余的红外光,还原物体的真实颜色。
而这些薄化基板不论是3D IC的薄化晶圆或镜头的超薄滤光片,当其厚度小于200μm、100μm或甚至小于50μm,且表面积越大时如半导制程的8吋、12吋或以上时。薄化基板会变得非常柔软有弹性,进而产生翘曲的现象。然不论是硅晶圆或玻璃片等薄化基板在制作上,需经抛光研磨、清净、多层镀膜、蚀刻及切割。由于超薄基板在制程中会因翘曲产生不平整及应力,会造成如镀膜时厚度不均的制程不良问题,甚至于薄化基板也因翘曲问题在检测时无法有效对焦而产生检出错误或延缓检测时间,而直接影响到不良品的检出,再者薄化基板在运送与组装过程也存在有储存量少、易碎及脆弱等问题,故薄化基板的翘曲问题对制程可靠度产生重大不良影响,而造成提高制程成本及不合格率的问题。
为了使薄化基板能保持平整来进入制程,目前薄化基板系采行暂时接合制程(Temporarybonding),来强化薄化基板的张度,而暂时接合制程主要系利用多层聚合物的接合材料将薄化基板可逆地安装到一载体上,但在进行制程后又需进行剥离,如此在接合与剥离之间都必须保持薄化基板本身的合格率,同时接合后使用的接合材料,也必须因应接合材料、被接合材料的热膨胀系数(CTE)不匹配,维持薄化晶圆的内部应力,同时维持晶圆正面/背面的表面平滑,以及制程环境中对于接合材料的酸、碱问题,这些都是进行暂时接合制程所面临的问题。
而目前最新的改善方式是使用无线静电载盘(E-Chuck或Supporter)来粘合薄化基板后,供薄化基板进行制程作业。然而目前无线静电载盘在粘合薄化基板时系采手动方式进行,该手动粘脱设备系于一静电力生成座一侧枢设有一可选择性盖合的基板载座,使用上由工作人员先将该薄化基板放置于该静电力生成座上,然后将上方的基板载座以手动方式旋转方式向下盖合于该静电力生成座上,以利用该基板载座吸附该薄化基板,的后工作人员再将该无线静电载盘置于该静电力生成器上,且再次将基板载座旋转盖合,使该薄化基板压合于该无线静电载盘相对表面上,最后启动导电令该无线静电载盘相对薄化基板产生静止的电力场,使得该薄化基板能被粘合于该无线静电载盘上。且在解离该无线静电载盘与该薄化基板时,则反向操作,将粘合有薄化基板的无线静电载盘置入该静电力生成座上,然后盖合基板载座于薄化基板上方,当该静电力生成座启动解离而释放该无线静电载盘的电力场后,上方的基板载座可吸附薄化基板后向上掀起,进而分离该无线静电载盘与该薄化基板。
但这样的手动操作方式,不仅速度极慢,同时由于人员环境操作下该无线静电载盘与该薄化基板的相对粘合表面无法确保其洁净与干燥,造成其粘合失败的现象,而需重新进行粘合作业,且甚至可能因错位、滑移或压合不均匀而发生裂损或破片的问题,故其粘合效率极差。再者,由于手动操作系以人力方式进行,其难以让该无线静电载盘与该薄化基板在粘合时被准确对位,对于微细化高精度要求的半导体制程而言,其难以被直接应用于高精度制程上,而只能用于传输、储存等对于精度要求不高的场合。
换言之,由于现有无线静电载盘系以手动方式粘合薄化基板,而不仅存在效率差、失败率高的问题,甚至可能发生裂损或破片,同时也无法应付高精度的制程需求,而如何解决前述的问题系业界所期待者,也为本发明所欲解决的技术课题。
缘是,本发明人乃针对现有无线静电载盘在粘合薄化基板时所面临的问题深入探讨,并凭借近年来技术发展的需求,经不断努力的改良与试作,终于成功开发出一种自动粘脱设备,以克服现有手动操作所造成的缺点与不便。
发明内容
因此,本发明的主要目的系在提供一种自动粘脱设备,其可以提升粘合效率,且可大幅降低粘合失败率,并减少生裂损或破片的发生。
再者,本发明的另一主要目的系在提供一种自动粘脱设备,其能快速、且准确的自动粘合无线静电载盘与薄化基板,使无线静电载盘能粘合薄化基板能应用于后续制程中,可大幅提高薄化基板的制程合格率,而能降低成本及增加利润。
基于此,本发明主要系通过下列的技术手段,来具体实现前述的目的及功效:
一种自动粘脱设备,用于一无线静电载盘与一薄化基板的粘合或解离,该无线静电载盘底面具有导电生成静电电力场的导极,其特征在于,该自动粘脱设备包含有:
一框架;
一载板静电生成组,其设于该框架上,该载板静电生成组具有一供无线静电载盘平置的工作平面,该工作平面上分设有系列对应无线静电载盘底面的吸附件,且该工作平面上具有二的倍数个对应接触无线静电载盘底导极的导极,以作动生成或释放该无线静电载盘的静电电力场,该工作平面上具有一导柱组,该导柱组包含至少二个限制载盘横向位置的固定导柱及至少一能够横向推动载盘与固定导柱啮合的活动导柱,使得无线静电载盘或薄化基板能够定位于工作平面的一正确位置;
一基板移载组,其设于该框架上且与该载板静电生成组相对,该基板移载组与该载板静电生成组能够相对移动,使得该基板移载组能够吸附一具有正确位置的薄化基板;
如此,当该基板移载组带动薄化基板与无线静电载盘压合后,能够作动该载板静电生成组使无线静电载盘生成静电电力场,以粘合该薄化基板。
所述的自动粘脱设备,其中:该工作平面由一主框板及枢设于该主框板两侧边缘的侧翼板所组成,且两侧侧翼板异于主框板一端能够选择性向下位移。
所述的自动粘脱设备,其中:该主框板内设有一能够选择性升降的顶料件,该顶料件能够在工作平面及一高于工作平面的接料平面间位移。
所述的自动粘脱设备,其中:该导柱组的固定导柱与活动导柱顶端周缘形成有一斜导缘,让该载板下降时该无线静电载盘能够导引至工作平面的正确位置。
所述的自动粘脱设备,其中:该载板静电生成组于对应无线静电载盘外周缘处设有一触动检知组,该触动检知组包含有能够伸缩且围绕于无线静电载盘外周缘的至少二根触动凸柱及至少一根能够前后移动的导正凸柱,其中该导正凸柱能利用该无线静电载盘或薄化基板的定位切口,令其以轴线为中心旋转导正。
所述的自动粘脱设备,其中:该载板静电生成组于对应无线静电载盘外周缘处设有一光学检知组,该光学检知组包含有至少三个围绕于无线静电载盘外周缘的光电元件,用以当无线静电载盘未摆正而遮蔽任何一光电元件时能够触发警报。
所述的自动粘脱设备,其中:该载板静电生成组于对应两侧侧翼板处分别设有一吹气单元,该吹气单元具有一对应无线静电载盘外周缘向轴心方向沿伸的喷射气嘴,供吹入高速气体令无线静电载盘与薄化基板能被有效的分离。
所述的自动粘脱设备,其中:该基板移载组具有一框座,且该框座表面有复数吸附件,该复数吸附件包含对应薄化基板范围内的表面吸附件或薄化基板邻近边缘的边缘吸附件,其中表面吸附件采用的是伯努利定律的吸附技术。
所述的自动粘脱设备,其中:该基板移载组于对应薄化基板外周缘处设有一光学检知组,该光学检知组包含有至少三个围绕于薄化基板外周缘的光电元件,用以当薄化基板未摆正而遮蔽任何一光电元件时能够触发警报。
所述的自动粘脱设备,其中:该基板移载组周缘可设有能够选择性伸缩的防落件,其伸出时所围范围小于薄化基板外径,用于当薄化基板进入基板移载组吸附表面时,能够伸出防落件,以避免薄化基板因未有效吸附而掉落,且该附落件能够确认薄化基板被基板移载组有效吸附后缩回。
如此,通过上述技术手段的具体实现,本发明可以提升粘合效率,且可大幅降低粘合失败率,并减少生裂损或破片的发生,使无线静电载盘能粘合薄化基板能应用于后续制程中,可大幅提高薄化基板的制程合格率,而能降低成本及增加利润,以提高其附加价值,进一步可提高其经济效益。
为使能进一步了解本发明的构成、特征及其他目的,以下乃举本发明的较佳实施例,并配合图式详细说明如后,同时让熟悉该项技术领域者能够具体实施。
附图说明
图1是本发明自动粘脱设备的外观示意图。
图2是本发明自动粘脱设备的侧视平面示意图。
图3是本发明自动粘脱设备中载盘静电生成组的外观示意图。
图4是本发明自动粘脱设备中载盘静电生成组的俯视平面示意图。
图5是本发明自动粘脱设备中基板移载组的外观示意图。
图6是本发明自动粘脱设备中基板移载组的局部仰视平面示意图。
图7是本发明自动粘脱设备中载盘静电生成组于顶料时的侧视动作示意图。
图8是本发明自动粘脱设备中载盘静电生成组于导正时的侧视动作示意图。
图9是本发明自动粘脱设备中载盘静电生成组于导正时的俯视动作示意图。
图10是本发明自动粘脱设备中载盘静电生成组于导正时的俯视局部动作示意图。
图11是本发明自动粘脱设备中载盘静电生成组于解离时的局部侧视动作示意图。
附图标记说明:50-粘脱设备;51-下框架;52-上框架;60-载板静电生成组;61-主框板;62-顶料件;620-检知元件;63-导极;64-吸附件;65-侧翼板;66-导柱;660-固定导柱;661-斜导面;665-活动导柱;666-斜导面;67-触动检知组;670-触动凸柱;675-导正凸柱;68-光学检知组;680-光电元件;69-吹气单元;690-喷射气嘴;70-驱动件;80-基板移载组;81-框座;810-检知元件;82-升降机构;83-吸附件;830-表面吸附件;835-边缘吸附件;85-光学检知组;850-光电元件;86-防落件。
具体实施方式
本发明系一种自动粘脱设备,随附图例示本发明的具体实施例及其构件中,所有关于前与后、左与右、顶部与底部、上部与下部、以及水平与垂直的参考,仅用于方便进行描述,并非限制本发明,也非将其构件限制于任何位置或空间方向。图式与说明书中所指定的尺寸,当可在不离开本发明的申请专利范围内,根据本发明的具体实施例的设计与需求而进行变化。
本发明用于无线静电吸盘的自动粘合系统,则系如图1、图2所示,用于使一无线静电载盘100与一薄化基板200的自动粘合与粘合后的自动解离,其中该薄化基板200可以是半导体晶圆或玻璃片或塑胶片,该粘脱设备50包含有可相对位移的一供吸附无线静电载盘100的载板静电生成组60及一供吸附薄化基板200的基板移载组80,其中该粘脱设备50具有可固设于机体10的框架,该框架包含有一下框架51及一上框架52,其中该载板静电生成组60设于该下框架51顶部,而该基板移载组80系利用一升降机构82设于该上框架52对应该载板静电生成组60的上方,使得该基板移载组80可带动薄化基板200相对应压合于该载板静电生成组60顶面的无线静电载盘100表面;
而前述的载板静电生成组60系如图3、图4所示,其具有一主框板61及枢设于该主框板61两侧边缘的侧翼板65,且该主框板61与两侧的侧翼板65具有供无线静电载盘100平置的工作平面,且该工作平面的主框板61上设有一检知元件610,供检知该无线静电载盘100或薄化基板200是否存在,另该主框板61内设有一顶料件62,该顶料件62可于工作平面及一较高的接料平面间位移(如图7、图8所示),可便于传输装置20如机械手臂的夹爪穿入放置或取走无线静电载盘100或薄化基板200,该顶料件62可以是由至少三根可同步升降的顶杆所构成、又或由一可升降的顶板所构成,又两侧侧翼板65于异于主框板61的外侧底缘中央与下框架51间设有一伸缩缸70,供选择性作动侧翼板65外侧缘向下倾斜两侧的侧翼板65的相异外侧缘可被选择性向下作动倾斜(如图11所示),供用于带动该无线静电载盘100与粘合的薄化基板200由外缘相对剥离,再者该主框板61与该侧翼板65上分设有系列对应无线静电载盘100底面的吸附件64(如真空吸盘),供选择性将无线静电载盘100固定于主框板61与侧翼板65的工作平面上,且该主框板61上具有二或二的倍数的导极63,供对应无线静电载盘100的底面正负导极105,以提供电力使无线静电载盘100表面可相对薄化基板200生成或解离静电电力场,用于让无线静电载盘100可与薄化基板200相互粘合或解离,又两侧的侧翼板65上具有一导位组66,该导位组66包含有围绕于无线静电载盘100外周缘的至少二个固定导柱660及至少一个活动导柱665,本发明系以二个固定导柱660及二个活动导柱665为主要实施例,其中该至少一个活动导柱665可将无线静电载盘100推向该至少二个固定导柱660的水平正确位置定位(如图9所示),再者该至少二个固定导柱660与该至少一个活动导柱665顶端周缘形成有一斜导缘661、666,让该顶料件62下降时该无线静电载盘100或薄化基板200可导引至工作平面的正确范围内,再者该载板静电生成组60于对应无线静电载盘100外周缘处分设有一触动检知组67及一光学检知组68,其中该触动检知组67包含有可伸缩且围绕于无线静电载盘100外周缘的至少二根触动凸柱670及至少一根可前后移动的导正凸柱675,其中该导正凸柱675可对应该无线静电载盘100或薄化基板200的定位缺口101、201,使该导正凸柱675能利用该无线静电载盘100或薄化基板200的定位切口101、201令其以轴线为中心旋转导正(如图10所示),且进一步用以当无线静电载盘100或薄化基板200未摆正而碰触任何一根触动凸柱670时可触发警报,至于该光学检知组68包含有至少三个围绕于无线静电载盘100外周缘的光电元件680,用以当无线静电载盘100或薄化基板200未摆正而遮蔽任何一光电元件680时可触发警报,以确保无线静电载盘100及薄化基板200准确对位,另如图9所示,该载板静电生成组60于下框架对应两侧侧翼板65处分别设有一吹气单元69,该吹气单元69具有一对应无线静电载盘100外周缘向轴心方向沿伸的喷射气嘴690(如图11所示),用于当无线静电载盘100于启动解离且被两侧侧翼板65带动与薄化基板200剥离时,可吹入高速气体令无线静电载盘100与薄化基板200能被有效的分离;
又前述的基板移载组80系如图5、图6所示,其由一可选择性吸附薄化基板200的框座81所构成,该框座81可被升降机构82上下线性作动,供带动薄化基板200相对下方无线静电载盘100选择性压合,又该框座81表面设有一检知元件810,供检知该薄化基板200是否存在,且该框座81具有一吸附表面,该框座81的吸附表面有复数吸附件83,其可包含对应薄化基板200范围内的表面吸附件830或薄化基板200邻近边缘的边缘吸附件835,其中表面吸附件830可以是伯努利定律(Bernoulli)的吸附技术,以降低对薄化基板200在吸附过程中可能造成的损伤,再者该基板移载组80于对应薄化基板200外周缘处设有一光学检知组85,该光学检知组85包含有至少三个围绕于薄化基板200外周缘的光电元件850,用以当薄化基板200未摆正而遮蔽任何一光电元件850时可触发警报,以确保薄化基板200准确对位。另根据某些实施例,该基板移载组80周缘可设有可选择性伸缩的防落件86,其伸出时所围范围小于薄化基板200外径,用于当薄化基板200进入基板移载组80吸附表面时,可伸出防落件86,以避免薄化基板200因未有效吸附而掉落,其可以确认薄化基板200被基板移载组80有效吸附后缩回。根据某些实施例,该基板移载组80可以是能相对载板静电生成组60夹取薄化基板200的机械手臂;
如此,组构成一可让无线静电载盘100与薄化基板200能自动粘合与自动解离的自动粘合系统者。
其实际操作时,系如图1、图2、图3及图4所示,该传输装置20将无线静电载盘100置于该载板静电生成组60的主框板61与侧翼板65的工作平面上(如图7、图8所示),且利用其触动检知组67及光学检知组68确保该无线静电载盘100被以指定方位准确定位后(如图9、图8所示),该载板静电生成组60可利用吸附件64固定该无线静电载盘100,另如图5、图6所示,该传输装置20将薄化基板200置于该基板移载组80的底面上,且利用其触动检知组84及光学检知组85确保该薄化基板200被以指定方位准确定位后,该基板移载组80可利用吸附件83固定该薄化基板200,且使该无线静电载盘100与该薄化基板200以同一指定方位相对;
当无线静电载盘100与薄化基板200被以同一指定方位固定在相对表面后,如图7~图10所示,将该基板移载组80带动薄化基板200相对该载板静电生成组60的无线静电载盘100线性位移,使得该薄化基板200可以同一指定方位贴合于该无线静电载盘100表面,且两者外周缘完全重迭,在完成该无线静电载盘100与该薄化基板200的贴合后,该载板静电生成组60可电气导通对该无线静电载盘100,使该无线静电载盘100可相对该薄化基板200生成一静电电力场,而完成该无线静电载盘100以静电粘合该薄化基板200的工作。
再者,该粘合的薄化基板200与无线静电载盘100也能被解离,其系将该粘合有薄化基板200的无线静电载盘100置入该载板静电生成组60中吸附固定,并将该基板移载组80线性位移吸附固定于该薄化基板200异于无线静电载盘100的一侧表面,接着令该载板静电生成组60释放该无线静电载盘100的静电电力场,使该无线静电载盘100的静电被释放,进而使该薄化基板200能被解离,并由该基板移载组80反向位移带动该薄化基板200与该无线静电载盘100相对分离,最后再利用相对的传输装置20将该无线静电载盘100与该薄化基板200分别置入相对应的载盘出入料埠18及基板出入料埠16中。而根据某些实施例,如图11示,该无线静电载盘100在静电释放后,可将该无线静电载盘100外周缘向下作动,令该无线静电载盘100外周缘可相对该薄化基板200预先剥离生成一开口,并通过一喷气单元69的喷射气嘴690将高速气体由无线静电载盘100外周缘吹入,使得该无线静电载盘100与该薄化基板200能被有效分离。
而由上述可知,本发明的自动粘脱设备可以提升粘合效率,且可大幅降低粘合失败率,并减少生裂损或破片的发生,其可供应付高精度的制程需求,以满足薄化基板的自动化制作的需求,使无线静电载盘能粘合薄化基板能应用于后续制程中,可大幅提高薄化基板的制程合格率,而能降低成本及增加利润。
以上说明对本发明而言只是说明性的,而非限制性的,本领域普通技术人员理解,在不脱离权利要求所限定的精神和范围的情况下,可作出许多修改、变化或等效,但都将落入本发明的保护范围之内。

Claims (10)

1.一种自动粘脱设备,用于一无线静电载盘与一薄化基板的粘合或解离,该无线静电载盘底面具有导电生成静电电力场的导极,其特征在于,该自动粘脱设备包含有:
一框架;
一载板静电生成组,其设于该框架上,该载板静电生成组具有一供无线静电载盘平置的工作平面,该工作平面上分设有系列对应无线静电载盘底面的吸附件,且该工作平面上具有二的倍数个对应接触无线静电载盘底导极的导极,以作动生成或释放该无线静电载盘的静电电力场,该工作平面上具有一导柱组,该导柱组包含至少二个限制载盘横向位置的固定导柱及至少一能够横向推动载盘与固定导柱啮合的活动导柱,使得无线静电载盘或薄化基板能够定位于工作平面的一正确位置;
一基板移载组,其设于该框架上且与该载板静电生成组相对,该基板移载组与该载板静电生成组能够相对移动,使得该基板移载组能够吸附一具有正确位置的薄化基板;
如此,当该基板移载组带动薄化基板与无线静电载盘压合后,能够作动该载板静电生成组使无线静电载盘生成静电电力场,以粘合该薄化基板。
2.如权利要求1所述的自动粘脱设备,其特征在于:该工作平面由一主框板及枢设于该主框板两侧边缘的侧翼板所组成,且两侧侧翼板异于主框板一端能够选择性向下位移。
3.如权利要求2所述的自动粘脱设备,其特征在于:该主框板内设有一能够选择性升降的顶料件,该顶料件能够在工作平面及一高于工作平面的接料平面间位移。
4.如权利要求1所述的自动粘脱设备,其特征在于:该导柱组的固定导柱与活动导柱顶端周缘形成有一斜导缘,让该载板下降时该无线静电载盘能够导引至工作平面的正确位置。
5.如权利要求1所述的自动粘脱设备,其特征在于:该载板静电生成组于对应无线静电载盘外周缘处设有一触动检知组,该触动检知组包含有能够伸缩且围绕于无线静电载盘外周缘的至少二根触动凸柱及至少一根能够前后移动的导正凸柱,其中该导正凸柱能利用该无线静电载盘或薄化基板的定位切口,令其以轴线为中心旋转导正。
6.如权利要求1或5所述的自动粘脱设备,其特征在于:该载板静电生成组于对应无线静电载盘外周缘处设有一光学检知组,该光学检知组包含有至少三个围绕于无线静电载盘外周缘的光电元件,用以当无线静电载盘未摆正而遮蔽任何一光电元件时能够触发警报。
7.如权利要求2所述的自动粘脱设备,其特征在于:该载板静电生成组于对应两侧侧翼板处分别设有一吹气单元,该吹气单元具有一对应无线静电载盘外周缘向轴心方向沿伸的喷射气嘴,供吹入高速气体令无线静电载盘与薄化基板能被有效的分离。
8.如权利要求1所述的自动粘脱设备,其特征在于:该基板移载组具有一框座,且该框座表面有复数吸附件,该复数吸附件包含对应薄化基板范围内的表面吸附件或薄化基板邻近边缘的边缘吸附件,其中表面吸附件采用的是伯努利定律的吸附技术。
9.如权利要求1或8所述的自动粘脱设备,其特征在于:该基板移载组于对应薄化基板外周缘处设有一光学检知组,该光学检知组包含有至少三个围绕于薄化基板外周缘的光电元件,用以当薄化基板未摆正而遮蔽任何一光电元件时能够触发警报。
10.如权利要求1所述的自动粘脱设备,其特征在于:该基板移载组周缘可设有能够选择性伸缩的防落件,其伸出时所围范围小于薄化基板外径,用于当薄化基板进入基板移载组吸附表面时,能够伸出防落件,以避免薄化基板因未有效吸附而掉落,且该附落件能够确认薄化基板被基板移载组有效吸附后缩回。
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