CN218525561U - 用于200微米以下薄化基板的载入机构 - Google Patents
用于200微米以下薄化基板的载入机构 Download PDFInfo
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Abstract
本实用新型公开一种用于200微米以下薄化基板的载入机构,其适于在一处理薄化基板的处理设备中进行,该载入机构至少包含有设于处理设备上的一预对准装置及一搬运装置,其中预对准装置至少具有一供被选择性放置该薄化基板的基板平台,且基板平台可以被选择性对该薄化基板生成一吸附用的静电场,搬运装置至少具有一用于抓取该薄化基板的基板牙叉,且该基板牙叉可以被选择性对该薄化基板生成一吸附用的静电场,以此,使得该薄化基板的翘曲部分能被逐步作用拉平,进而可以有效地稳固、且平整的吸附,且在预对准后可以提高薄化基板放置于处理设备的工作平台上的准确度,可缩短后续精准对位的时间及减少重新精准对位的次数,进而提高制程效率与良率。
Description
技术领域
本实用新型涉及一种将薄化基板载入设备内的技术领域,具体而言为一种用于200微米以下薄化基板的载入机构,以能减少薄化基板在载入处理设备时受到翘曲影响,可以有效提升薄化基板载入的稳定性与准确度,可以避免发生偏位、甚至掉片的意外,从而提高薄化基板载入处理设备的效率。
背景技术
随着科技日新月异,半导体制程的微细化发展,如存储器和功率器件,它们的微型化朝着更小的尺寸、更高的性能以及更低的成本方向发展,为了让芯片面积变的更小,半导体业界实行的设计方案是将原本芯片水平部署的芯片设计,改换成垂直向的堆叠方式进行,亦即所谓的3D IC堆叠封装。由于3D IC堆叠封装是以垂直向进行堆叠,需利用硅穿孔〔Through-Silicon Via;TSV〕技术将IC封装内的各功能芯片进行物理电气连接,因此晶圆的厚度会被压缩在200微米以下〔以下简称薄化基板〕、甚至在100微米以下。
然而,目前生产线的处理设备通常只能做一种制程处理〔如检查、成像、印刷、激光或切割等〕,因此该等薄化基板在进行不同处理时,必须将研磨好且未切割的薄化基板搬动到另一处理设备中,该等薄化基板在载入各处理设备内部进行处理流程时如发生任何错位,都会导致严重且无可挽救的缺陷,而必须将薄化基板报废。因此,该等薄化基板在每一种处理设备的工作平台进行精准对位前,都必需预先进行该薄化基板的预对准定向,以减少精准对位的次数及时间,而被使用来识别定向的方式包括在薄化基板的周围上设置定向刻痕如缺口〔Notch〕或平边〔Flat〕,并利用预对准装置〔可以是独立结构或处理设备中的一部〕来旋转及检测该薄化基板,使得其能够检出该等定向刻痕,以避免导致后续精准对位时失败而重复实施,无形间增加精准对位工时、且降低效率;
由于该等处理设备在支撑结构内利用一载入机构来移动该等薄化基板,该载入机构包含一搬运装置及一预对准装置,使该等薄化基板可以利用该搬运装置于处理设备的进出料埠〔Load/Un-Load Port〕、预对准装置及工作平台间移动。但该等薄化基板不论是晶圆或其他如滤光片,当其厚度小于200μm、100μm或甚至小于50μm,且其表面积越大〔如8英寸、12英寸或以上的晶圆〕时,因为本身多复合性材质再加上表面镀设金属的延展性皆不同,尤其在经过研磨、抛光、退火后的变化,该等薄化基板通常会产生翘曲〔Warpage〕的现象。
由于目前处理设备内载入机构的搬运装置与预对准装置主要利用真空技术来吸附该等薄化基板,以移动或固持该等薄化基板。如图1所示,当前述薄化基板100的翘曲度较大时,会发生吸附表面200对应的吸口201没有被遮盖而暴露的现象,此时外部气流会流向这些未被遮盖的吸口201,使得那些被遮盖的吸口201没有足够的真空吸力来吸掣薄化基板100,如此当发生在搬运装置的搬运过程中,可能会有需要重复吸附、甚至在移送中发生掉片的意外,而当发生在预对准装置时,则将使薄化基板100无法完全平贴于吸附表面200,除了可能因平整度问题造成预对准失败或不准确外,也可能在预对准装置旋转中发生掉片。再者,以厚度为200微米以下等级且具硬脆材料性质的薄化基板100而言,其内部能承受的应力变化也会变小,当因吸附失败而多次重复作业、又或真空吸力过大时,可能会造成该等薄化基板100很可能会受到损害,影响到薄化基板100后续的品质及良率。
换言之,由于现有处理设备的载入机构在应对200微米以下的薄化基板时,会因翘曲造成真空吸力不足或吸力不均匀的现象,而需重复吸附或无法有效固持该等薄化基板,在预对准时发生检测不准确及对准效率不佳,甚至在移动或旋转中发生掉片或破片的现象,不论何者均会影响后续制程良率及效率,因此如何克服前述问题,为业者及使用者所期待的,亦为本实用新型所欲探讨解决的。
因此,本实用新型遂以从事相关技术以及产品设计制造的多年经验,秉持优良设计理念,针对以上不良处加以研究改良,经不断努力的试作,终于成功开发一种用于200微米以下薄化基板的载入机构,以克服现有薄化基板在处理设备中载入时所面临的困扰与不便。
实用新型内容
因此,本实用新型的主要目的在于提供一种用于200微米以下薄化基板的载入机构,以在搬运抓取及放置平台时,能利用一静电场对薄化基板生成逐步拉平翘曲的作用力,进而可以有效地稳定、且均匀的吸附薄化基板。
又,本实用新型的另一主要目的在于提供一种用于200微米以下薄化基板的载入机构,其能有效吸附搬运薄化基板,且在预对准时能对薄化基板提供一个稳定、且均匀的吸附力,以减少发生因真空吸附失败而重复吸附作业的次数与时间。
再者,本实用新型的又一主要目的在于提供一种用于200微米以下薄化基板的载入方法,以能提供薄化基板稳定的抓取力及固持力,在预对准时可以提高薄化基板的定向准确度,进一步缩短后续处理作业前的精准对位时间及减少重新精准对位的次数,进而提高制程效率与良率。
基于此,本实用新型主要通过下列的技术手段来具体实现前述的目的与效能;本实用新型提供一种用于200微米以下薄化基板的载入机构,其适于在一处理薄化基板的处理设备中进行,该载入机构至少包含有:
一预对准装置,其具有一设于该处理设备支撑结构上的机座,该机座内设有一驱动单元,又该驱动单元具有一通过机座顶面延伸、且被旋转的输出轴,另该输出轴端部组装一供放置该薄化基板的基板平台,且该基板平台顶面具有一供置放该薄化基板的第一接合板面,该第一接合板面可以被选择性对该薄化基板生成一吸附用的静电场,又该机座另设有一传感器单元,供该传感器单元可以对应吸附在该基板平台上的薄化基板的上表面进行预对准的检测定向作业;
一搬运装置,其可设于该处理设备的支撑结构上,该搬运装置具有一可多轴移动、旋转的基板牙叉,且该基板牙叉的两个侧表面中至少一侧表面被定义为一抓取表面,而该至少一抓取表面可以被选择性对该薄化基板生成一吸附用的静电场。
以此,本实用新型用于200微米以下薄化基板的载入机构可以通过搬运装置的基板牙叉与预对准装置的基板平台可以相对该薄化基板生成一静电场的设计,使得该薄化基板的翘曲部分能被逐步作用拉平,进而可以有效地稳固、且平整的吸附,可以避免发生如现有因真空吸附失败而重复作业的现象,且在预对准后可以提高薄化基板放置于处理设备的工作平台上的准确度,可缩短后续精准对位的时间及减少重新精准对位的次数,进而提高制程效率与良率,大幅增进其实用性,进一步可增进其经济效益。
在本实用新型一实施例中,该预对准装置的驱动单元被允许带动该放置于基板平台上的薄化基板与该传感器单元间的相对移动。
在本实用新型一实施例中,该预对准装置的基板平台外径小于该薄化基板定向刻痕的范围、且大于该薄化基板直径的三分之一,用以使该薄化基板被该基板平台的静电场吸附时,该薄化基板具定向刻痕的边缘能够被支撑呈平整状。
在本实用新型一实施例中,该预对准装置的基板平台具有一被选择性升降承接该薄化基板的顶料组。
在本实用新型一实施例中,该预对准装置的顶料组位于基板平台轴心、且贯穿该第一接合板面,使得该顶料组能够被作动升降来接收该薄化基板放置于该第一接合板面上。
在本实用新型一实施例中,该预对准装置的顶料组顶面具有一能够被选择性生成一静电场的第二接合板面。
在本实用新型一实施例中,该预对准装置的基板平台于相对轴心两侧分别形成有一相对边缘开口的牙叉开槽,用以供搬运装置的基板牙叉伸入。
为能够进一步了解本实用新型的构成、特征及其他目的,以下举本实用新型的较佳实施例,并配合图式详细说明如下,同时让熟悉该项技术领域者能够具体实施。
附图说明
图1为现有预对准装置使用真空吸附方式固定薄化的基板的局部剖面示意图。
图2为应用本实用新型载入机构的处理设备的外观架构示意图。
图3为本实用新型载入机构的外观示意图,供说明该预对准装置与搬运装置的态样及其相对关系。
图4为本实用新型载入机构中预对准装置的局部剖面示意图,供说明其组件态样及其相对关系。
图5为本实用新型载入机构中预对准装置的基板平台另一实施例的俯视平面示意图。
图6为本实用新型用于薄化基板的预对准方法的流程架构。
图7为本实用新型载入机构于实际动作时的侧视剖面示意图,供说明该搬运及预对准的状态。
图8A为本实用新型的预对准装置于实际使用时的动作参考示意图,为说明其生成静电场的态样。
图8B为本实用新型的预对准装置于实际使用时的另一动作参考示意图,为说明其整平薄化基板的态样。
附图标记说明:100-薄化基板;105-定向刻痕;10-预对准装置;11-机座;12-驱动单元;13-输出轴;15-传感器单元;20-基板平台;21-第一接合板面;24-顶料组;25-第二接合板面;28-牙叉开槽;30-搬运装置;31-基板牙叉;32-抓取表面;200-吸附表面;201-吸口;500-处理设备;501-工作平台;502-工作模块;505-进出料埠。
具体实施方式
本实用新型为一种用于200微米以下薄化基板的载入机构,随附图例示的本实用新型光罩保持容器的具体实施例及其构件中,所有关于前与后、左与右、顶部与底部、上部与下部、以及水平与垂直的参考,仅用于方便进行描述,并非限制本实用新型,亦非将其构件限制于任何位置或空间方向。图式与说明书中所指定的尺寸,当可在不离开本实用新型权利要求书的范围内,根据本实用新型的具体实施例的设计与需求而进行变化,故并不受此种结构的限制。
本实用新型为一种用于200微米以下薄化基板的载入机构,如图2所示,其可以是一处理一薄化基板100的处理设备500的一部分,该处理设备500包含但不限定是基板缺陷检查设备、基板切割设备、基板激光设备或晶粒移转设备或基板黏合设备,且该处理设备500的支撑结构内进一步至少包含有一供放置薄化基板100的工作平台501、一对薄化基板100进行处理作业的工作模块502及一供薄化基板100进出的进出料埠505〔Load/Un-LoadPort〕,而设于该处理设备500支撑结构内的载入机构包含有一预对准装置10及一搬运装置30,使该等薄化基板100可以利用该搬运装置30于进出料埠505、预对准装置10及工作平台501间移动;
其中该预对准装置10的结构组成如图3所示,其至少包括有一设于该处理设备500的机座11,而该机座11内设有一驱动单元12,又该驱动单元12具有一通过机座11顶面延伸、且被旋转的输出轴13,另该输出轴13端部组装一基板平台20,该基板平台20可供放置该等薄化基板100,又该机座11另设有一传感器单元15,且该驱动单元12被允许带动该放置于基板平台20上的薄化基板100与该传感器单元15间的相对移动,使得该传感器单元15可以对应放置于该基板平台20上的薄化基板100的上表面进行预对准的检测定向作业,该传感器单元15可以是光学式、影像式或机械式的检测技术;
而如图4所示,前述的基板平台20顶面具有一供置放该薄化基板100的第一接合板面21,该第一接合板面21内部具有可以被选择性生成一静电场的复数电极,以利用该静电场提供该第一接合板面21相对该薄化基板100的吸附力,可防止薄化基板100相对于该第一接合板面21移动,且该基板平台20外径小于该薄化基板100定向刻痕105的范围、且大于该薄化基板100直径的三分之一,使该薄化基板100被该基板平台20的第一接合板面21静电场吸附时,该薄化基板100具定向刻痕105的边缘能被支撑呈平整状。又根据某些实施例,该基板平台20具有一被选择性升降承接该薄化基板100的顶料组24,其中该顶料组24可以是位于基板平台20轴心的单柱型态或分别于该基板平台20的等角等距多柱型态如三柱结构。而单柱型态的顶料组24设于该基板平台20轴心、且贯穿该第一接合板面21,用以通过上升或下降的动作来承接该薄化基板100,且该顶料组24的顶面具有一第二接合板面25,又该第二接合板面25内部具有可以被选择性生成一静电场的复数电极,以利用该静电场提供该第二接合板面25相对该薄化基板100的吸附力,且该第二接合板面25顶面的高度低于或等于该第一接合板面21的顶面。
又如图3所示,所述的搬运装置30可以是典型的六轴或七轴的机械手臂,且该搬运装置30具有一可多轴移动、旋转的基板牙叉31〔Fork或End-effector〕,该基板牙叉31的两个侧表面中至少一侧表面被定义为一抓取表面32,而该等抓取表面32内部具有可以被选择性生成一静电场的复数电极,以利用该静电场提供该基板牙叉31的抓取表面32相对该薄化基板100的吸附力,可防止薄化基板100相对于该基板牙叉31移动。再者如图6所示,根据某些实施例,前述的基板平台20于相对轴心两侧分别形成有一相对边缘开口的牙叉开槽28,可供该搬运装置30的基板牙叉31伸入;
以此,使得厚度200微米以下的薄化基板100能在处理设备500内被该搬运装置30的基板牙叉31的抓取表面32所生成的静电场作用所抓取移动,且让该薄化基板100能被基板平台20的第一接合板面21所生成的静电场作用,让该薄化基板100能被有效平贴吸附于该基板平台20上,而组构成一可使薄化基板100被有效固持、且均匀平整的载入机构。
而本实用新型用于200微米以下薄化基板的载入方法,其适于在一处理薄化基板100的处理设备500中进行,如图2、图6及图7所揭示,其执行步骤包含有:首先,提供至少一薄化基板100于一处理设备500的至少一进出料埠505;接着,使用一搬运装置30的一基板牙叉31放置于任一薄化基板100表面并利用一静电场对上述薄化基板100进行抓取作业;接下来,通过上述搬运装置30将被抓取的薄化基板100放置于一预对准装置10的一基板平台20上;然后,使上述基板平台20利用一静电场对该薄化基板100进行固持作业;之后,使上述预对准装置10对上述薄化基板100进行预对准的定向作业;紧接着,使用上述搬运装置30的基板牙叉31利用静电场对上述完成预对准定向的薄化基板100进行抓取作业;接着,通过上述搬运装置30的基板牙叉31将上述完成预对准定向的薄化基板100放置于上述处理设备500的一工作平台501上;然后,令上述处理设备500对上述完成预对准定向的薄化基板100进行相对应的处理作业;最后,使用上述搬运装置30将该完成处理作业的薄化基板100移动至任一进出料埠505。
且如图8A、图8B所示,当该搬运装置30基板牙叉31的抓取表面32或该预对准装置10基板平台20的第一接合板面21与该等薄化基板100接触时,该抓取表面32或该第一接合板面21可以通过内部电极生成静电场,如图8A所示,该静电场可将该薄化基板100翘起的部分逐步下拉,使原本翘曲高度超过静电场范围的部分也会逐步进入静电场范围内,最终如图8B所示,该薄化基板100可以完全平贴于上述基板牙叉31的抓取表面32或上述基板平台20的第一接合板面21上表面,使该薄化基板100被稳固吸附于该搬运装置30基板牙叉31或该预对准装置10基板平台20上,而能确保薄化基板100在进行搬运移动时的定位性与稳固性,并能确保薄化基板100在进行预对准作业时的平整性与固持效果,且进一步在预对准定向完成后再次搬运移动至工作平台501时,能确保该薄化基板100依预对准的定向位置准确放置于工作平台501上,使后续薄化基板100在工作平台501上进行精准对位时能快速完成。
经由上述的说明,本实用新型的载入机构主要用于处理200微米以下薄化基板的处理设备,通过本实用新型载入机构的搬运装置30的基板牙叉31与预对准装置10的基板平台20可以相对该等薄化基板100生成一静电场的设计,使得该等薄化基板100的翘曲部分能被逐步作用拉平于该基板牙叉31的抓取表面32或基板平台20的第一接合板面21上,进而可以有效地稳固、且平整的吸附于搬运装置30的基板牙叉31或预对准装置10的基板平台20上,可以避免发生因真空吸附失败而重复作业的现象,能提供薄化基板稳定的抓取力及固持力,且在预对准后可以提高薄化基板放置于处理设备500的工作平台501上的准确度,可缩短后续精准对位的时间及减少重新精准对位的次数,进而提高制程效率与良率,大幅增进其实用性。
综上所述,可以理解到本实用新型为一创意极佳的实用新型,除了有效解决现有技术所面临的问题,更大幅增进功效,且在相同的技术领域中未见相同或近似的产品或公开使用,同时具有功效的增进。
Claims (8)
1.一种用于200微米以下薄化基板的载入机构,其适于在一处理薄化基板的处理设备中,其特征在于,该载入机构至少包含有:
一预对准装置,其具有一设于该处理设备支撑结构上的机座,该机座内设有一驱动单元,又该驱动单元具有一通过机座顶面延伸、且被旋转的输出轴,另该输出轴端部组装一供放置该薄化基板的基板平台,且该基板平台顶面具有一供置放该薄化基板的第一接合板面,该第一接合板面能够被选择性对该薄化基板生成一吸附用的静电场,又该机座另设有一传感器单元,供该传感器单元对应吸附在该基板平台上的薄化基板的上表面进行预对准的检测定向作业;
一搬运装置,其设于该处理设备的支撑结构上,该搬运装置具有一能够多轴移动、旋转的基板牙叉,且该基板牙叉的两个侧表面中至少一侧表面被定义为一抓取表面,而该至少一抓取表面能够被选择性对该薄化基板生成一吸附用的静电场。
2.根据权利要求1所述的用于200微米以下薄化基板的载入机构,其特征在于,该预对准装置的驱动单元被允许带动该放置于基板平台上的薄化基板与该传感器单元间的相对移动。
3.根据权利要求1所述的用于200微米以下薄化基板的载入机构,其特征在于,该预对准装置的基板平台外径小于该薄化基板定向刻痕的范围、且大于该薄化基板直径的三分之一,用以使该薄化基板被该基板平台的静电场吸附时,该薄化基板具定向刻痕的边缘能够被支撑呈平整状。
4.根据权利要求1所述的用于200微米以下薄化基板的载入机构,其特征在于,该预对准装置的基板平台具有一被选择性升降承接该薄化基板的顶料组。
5.根据权利要求4所述的用于200微米以下薄化基板的载入机构,其特征在于,该预对准装置的顶料组位于基板平台轴心、且贯穿该第一接合板面,使得该顶料组能够被作动升降来接收该薄化基板放置于该第一接合板面上。
6.根据权利要求5所述的用于200微米以下薄化基板的载入机构,其特征在于,该预对准装置的顶料组顶面具有一能够被选择性生成一静电场的第二接合板面。
7.根据权利要求1所述的用于200微米以下薄化基板的载入机构,其特征在于,该预对准装置的基板平台于相对轴心两侧分别形成有一相对边缘开口的牙叉开槽,用以供搬运装置的基板牙叉伸入。
8.一种用于200微米以下薄化基板的载入机构,其适于在一处理薄化基板的处理设备中,其特征在于,该载入机构至少包含有:
一预对准装置,其设于该处理设备上,该预对准装置至少具有一供被选择性放置该薄化基板的基板平台,且该基板平台顶面具有一供接收该薄化基板的第一接合板面,而该第一接合板面能够被选择性对该薄化基板生成一吸附用的静电场;
一搬运装置,其设于该处理设备上,该搬运装置至少具有一用于抓取该薄化基板的基板牙叉,且该基板牙叉具有至少一抓取表面,而该至少一抓取表面能够被选择性对该薄化基板生成一吸附用的静电场。
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