TW202331904A - 用於200微米以下薄化基板之載入機構及載入方法 - Google Patents
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Abstract
本發明係指一種用於200微米以下薄化基板之載入機構,其適於在一處理薄化基板的處理設備中進行,該載入機構至少包含有設於處理設備上之一預對準裝置及一搬運裝置,其中該預對準裝置至少具有一供被選擇性放置該等薄化基板之基板平台,且該基板平台可以被選擇性對該薄化基板生成一吸附用之靜電場,而該搬運裝置至少具有一用於抓取該等薄化基板之基板牙叉,且該基板牙叉可以被選擇性對該薄化基板生成一吸附用之靜電場,藉此,使得該等薄化基板的翹曲部份能被逐步作用拉平,進而可以有效地穩固、且平整的吸附,且在預對準後可以提高薄化基板放置於處理設備之工作平台上的準確度,可縮短後續精準對位的時間及減少重新精準對位的次數,進而提高製程效率與良率。
Description
本發明隸屬一種將薄化基板載入設備內之技術領域,具體而言係一種用於200微米以下薄化基板之載入機構及載入方法,藉以能減少薄化基板在載入處理設備時受到翹曲影響,可以有效提升薄化基板載入的穩定性與準確度,可以避免發生偏位、甚至掉片的意外,從而提高薄化基板載入處理設備之效率。
按,隨著科技日新月異,半導體製程的微細化發展,如存儲器和功率器件,它們的微型化朝著更小的尺寸、更高的性能以及更低的成本方向發展,為了讓晶片面積變的更小,半導體業界採行的設計方案是將原本晶片水平部署的晶片設計,改換成垂直向的堆疊方式進行,亦即所謂的3D IC堆疊封裝。由於3D IC堆疊封裝係以垂直向進行堆疊,需利用矽穿孔〔Through-Silicon Via;TSV〕技術將IC封裝內的各功能晶片進行物理電氣連結,因此晶圓之厚度會被壓縮在200微米以下〔以下簡稱薄化基板〕、甚至在100微米以下。
然而,目前生產線之處理設備通常只能做一種製程處理〔如檢查、成像、印刷、雷射或切割等〕,因此該等薄化基板在進行不同處理時,必須將研磨好且未切割的薄化基板搬動到另一處理設備中,該等薄化基板在載入各處理設備內部
進行處理流程時如發生任何錯位,都會導致嚴重且無可挽救的缺陷,而必須將薄化基板報廢。因此,該等薄化基板在每一種處理設備之工作平台進行精準對位前,都必需預先進行該薄化基板的預對準定向,以減少精準對位的次數及時間,而被使用來識別定向的方式包括在薄化基板的周圍上設置定向刻痕如缺口〔Notch〕或平邊〔Flat〕,並利用預對準裝置〔可以是獨立結構或處理設備中的一部〕來旋轉及檢測該薄化基板,使得其能夠檢出該等定向刻痕,以避免導致後續精準對位時失敗而重覆實施,無形間增加精準對位工時、且降低效率;
由於該等處理設備在支撐結構內係利用一載入機構來移動該等薄化基板,該載入機構包含一搬運裝置及一預對準裝置,使該等薄化基板可以利用該搬運裝置於處理設備之進出料埠〔Load/Un-Load Port〕、預對準裝置及工作平台間移動。惟該等薄化基板不論是晶圓或其他如濾光片,當其厚度小於200μm、100μm或甚至小於50μm,且其表面積越大〔如8吋、12吋或以上之晶圓〕時,因為本身多複合性材質再加上表面鍍設金屬的延展性皆不同,尤其在經過研磨、拋光、退火後的變化,該等薄化基板通常會產生翹曲〔Warpage〕的現象。
由於目前處理設備內載入機構之搬運裝置與預對準裝置主要係利用真空技術來吸附該等薄化基板,以移動或固持該等薄化基板。如第1圖所示,當前述薄化基板(100)的翹曲度較大時,會發生吸附表面(200)對應之吸口(201)沒有被遮蓋而暴露的現象,此時外部氣流會流向這些未被遮蓋的吸口(201),使得那些被遮蓋的吸口(201)沒有足夠的真空吸力來吸掣薄化基板(100),如此當發生在搬運裝置之搬運過程中,可能會有需要重覆吸附、甚至在移送中發生掉片的意
外,而當發生在預對準裝置時,則將使薄化基板(100)無法完全平貼於吸附表面(200),除了可能因平整度問題造成預對準失敗或不準確外,也可能在預對準裝置旋轉中發生掉片。再者,以厚度為200微米以下等級且具硬脆材料性質的薄化基板(100)而言,其內部能承受之應力變化也會變小,當因吸附失敗而多次重覆作業、又或真空吸力過大時,可能會造成該等薄化基板(100)很可能會受到損害,影響到薄化基板(100)後續的品質及良率。
換言之,由於現有處理設備之載入機構在應對200微米以下之薄化基板時,會因翹曲造成真空吸力不足或吸力不均勻的現象,而需重覆吸附或無法有效固持該等薄化基板,在預對準時發生檢測不準確及對準效率不佳,甚至在移動或旋轉中發生掉片或破片的現象,不論何者均會影響後續製程良率及效率,因此如何克服前述問題,係業者及使用者所期待,亦係本發明所欲探討解決者。
緣是,本發明人遂以從事相關技術以及產品設計製造之多年經驗,秉持優良設計理念,針對以上不良處加以研究改良,經不斷努力的試作,終於成功開發一種用於200微米以下薄化基板之載入機構,藉以克服現有薄化基板在處理設備中載入時所面臨的困擾與不便。
因此,本發明之主要目的係在提供一種用於200微米以下薄化基板之載入機構,藉以在搬運抓取及放置平台時,能利用一靜電場對薄化基板生成逐步拉平翹曲的作用力,進而可以有效地穩定、且均勻的吸附薄化基板。
又,本發明之另一主要目的係在提供一種用於200微米以下薄化基板之載入機構,其能有效吸附搬運薄化基板,且在預對準時能對薄化基板提供一個穩定、且均勻的吸附力,以減少發生因真空吸附失敗而重覆吸附作業的次數與時間。
再者,本發明之又一主要目的係在提供一種用於200微米以下薄化基板之載入方法,藉以能提供薄化基板穩定的抓取力及固持力,在預對準時可以提高薄化基板的定向準確度,進一步縮短後續處理作業前的精準對位時間及減少重新精準對位的次數,進而提高製程效率與良率。
基於此,本發明主要係透過下列的技術手段來具體實現前述的目的與效能;用於200微米以下薄化基板之載入機構,其適於在一處理薄化基板的處理設備中進行,該載入機構至少包含有:
一預對準裝置,其具有一設於該處理設備支撐結構上之機座,該機座內設有一驅動單元,又該驅動單元具有一通過機座頂面延伸、且被旋轉的輸出軸,另該輸出軸端部組裝一供放置該等薄化基板之基板平台,且該基板平台頂面具有一供置放該薄化基板之第一接合板面,該第一接合板面可以被選擇性對該薄化基板生成一吸附用之靜電場,又該機座另設有一感測器單元,供該感測器單元可以對應吸附在該基板平台上的薄化基板之上表面進行預對準之檢測定向作業;
一搬運裝置,其可設於該處理設備之支撐結構上,該搬運裝置具有一可多軸移動、旋轉之基板牙叉,且該基板牙叉之兩側表面中至少一側表面被定義為一抓取表面,而該等抓取表面可以被選擇性對該薄化基板生成一吸附用之靜電場。
藉此,本發明用於200微米以下薄化基板之載入機構可以透過搬運裝置的基板牙叉與預對準裝置的基板平台可以相對該等薄化基板生成一靜電場的設計,使得該等薄化基板的翹曲部份能被逐步作用拉平,進而可以有效地穩固、且平整的吸附,可以避免發生如現有因真空吸附失敗而重覆作業的現象,且在預對準後可以提高薄化基板放置於處理設備之工作平台上的準確度,可縮短後續精準對位的時間及減少重新精準對位的次數,進而提高製程效率與良率,大幅增進其實用性,進一步可增進其經濟效益。
為使 貴審查委員能進一步了解本發明的構成、特徵及其他目的,以下乃舉本發明之較佳實施例,並配合圖式詳細說明如后,同時讓熟悉該項技術領域者能夠具體實施。
100:薄化基板
105:定向刻痕
10:預對準裝置
11:機座
12:驅動單元
13:輸出軸
15:感測器單元
20:基板平台
21:第一接合板面
24:頂料組
25:第二接合板面
28:牙叉開槽
30:搬運裝置
31:基板牙叉
32:抓取表面
200:吸附表面
201:吸口
500:處理設備
501:工作平台
502:工作模組
505:進出料埠
第1圖:為現有預對準裝置使用真空吸附方式固定薄化之基板的局部剖面示意圖。
第2圖:為應用本發明載入機構之處理設備的外觀架構示意圖。
第3圖:為本發明載入機構的外觀示意圖,供說明該預對準裝置與搬運裝置之態樣及其相對關係。
第4圖:為本發明載入機構中預對準裝置的局部剖面示意圖,供說明其組件態樣及其相對關係。
第5圖:為本發明載入機構中預對準裝置之基板平台另一實施例的俯視平面示意圖。
第6圖:為本發明用於薄化基板之預對準方法的流程架構。
第7圖:為本發明載入機構於實際動作時的側視剖面示意圖,供說明該搬運及預對準之狀態。
第8A圖:為本發明之預對準裝置於實際使用時的動作參考示意圖,為說明其生成靜電場之態樣。
第8B圖:為本發明之預對準裝置於實際使用時的另一動作參考示意圖,為說明其整平薄化基板之態樣。
本發明係一種用於200微米以下薄化基板之載入機構,隨附圖例示之本發明光罩保持容器的具體實施例及其構件中,所有關於前與後、左與右、頂部與底部、上部與下部、以及水平與垂直的參考,僅用於方便進行描述,並非限制本發明,亦非將其構件限制於任何位置或空間方向。圖式與說明書中所指定的尺寸,當可在不離開本發明之申請專利範圍內,根據本發明之具體實施例的設計與需求而進行變化,故在專利申請上並不受此種結構之限制。
本發明係一種用於200微米以下薄化基板之載入機構,如第2圖所示,其可以是一處理一薄化基板(100)之處理設備(500)的一部,該處理設備(500)包含但不限定是基板缺陷檢查設備、基板切割設備、基板雷射設備或晶粒移轉設備或基板黏合設備,且該處理設備(500)之支撐結構內進一步至少包含有一供放置薄化基板(100)之工作平台(501)、一對薄化基板(100)進行處理作業之工作模組(502)及一供薄化基板(100)進出之進出料埠(505)〔Load/Un-Load Port〕,而設於該處理設備(500)支撐結構內之載入機構包含有一預對準裝置(10)及一搬運裝置(30),使該等薄化基板(100)
可以利用該搬運裝置(30)於進出料埠(505)、預對準裝置(10)及工作平台(501)間移動;
其中該預對準裝置(10)之結構組成係如第3圖所示,其至少包括有一設於該處理設備(500)之機座(11),而該機座(11)內設有一驅動單元(12),又該驅動單元(12)具有一通過機座(11)頂面延伸、且被旋轉的輸出軸(13),另該輸出軸(13)端部組裝一基板平台(20),該基板平台(20)可供放置該等薄化基板(100),又該機座(11)另設有一感測器單元(15),且該驅動單元(12)被允許帶動該放置於基板平台(20)上的薄化基板(100)與該感測器單元(15)間的相對移動,使得該感測器單元(15)可以對應放置於該基板平台(20)上的薄化基板(100)之上表面進行預對準之檢測定向作業,該感測器單元(15)可以是光學式、影像式或機械式之檢測技術;
而如第4圖所示,前述之基板平台(20)頂面具有一供置放該薄化基板(100)之第一接合板面(21),該第一接合板面(21)內部具有可以被選擇性生成一靜電場之複數電極,以利用該靜電場提供該第一接合板面(21)相對該薄化基板(100)的吸附力,可防止薄化基板(100)相對於該第一接合板面(21)移動,且該基板平台(20)外徑小於該薄化基板(100)定向刻痕(105)之範圍、且大於該薄化基板(100)直徑的三分之一,使該薄化基板(100)被該基板平台(20)之第一接合板面(21)靜電場吸附時,該薄化基板(100)具定向刻痕(105)之邊緣能被支撐呈平整狀。又根據某些實施例,該基板平台(20)具有一被選擇性升降承接該薄化基板(100)之頂料組(24),其中該頂料組(24)可以是位於基
板平台(20)軸心之單柱型態或分別於該基板平台(20)之等角等距多柱型態如三柱結構。而單柱型態之頂料組(24)係設於該基板平台(20)軸心、且貫穿該第一接合板面(21),用以透過上升或下降的動作來承接該薄化基板(100),且該頂料組(24)之頂面具有一第二接合板面(25),又該第二接合板面(25)內部具有可以被選擇性生成一靜電場之複數電極,以利用該靜電場提供該第二接合板面(25)相對該薄化基板(100)的吸附力,且該第二接合板面(25)頂面之高度低於或等於該第一接合板面(21)之頂面。
又如第3圖所示,所述之搬運裝置(30)可以是典型之六軸或七軸之機械手臂,且該搬運裝置(30)具有一可多軸移動、旋轉之基板牙叉(31)〔Fork或End-effector〕,該基板牙叉(31)之兩側表面中至少一側表面被定義為一抓取表面(32),而該等抓取表面(32)內部具有可以被選擇性生成一靜電場之複數電極,以利用該靜電場提供該基板牙叉(31)之抓取表面(32)相對該薄化基板(100)的吸附力,可防止薄化基板(100)相對於該基板牙叉(31)移動。再者如第6圖所示,根據某些實施例,前述之基板平台(20)於相對軸心兩側分別形成有一相對邊緣開口之牙叉開槽(28),可供該搬運裝置(30)之基板牙叉(31)伸入;
藉此,使得厚度200微米以下之薄化基板(100)能在處理設備(500)內被該搬運裝置(30)之基板牙叉(31)的抓取表面(32)所生成的靜電場作用所抓取移動,且讓該薄化基板(100)能被基板平台(20)之第一接合板面(21)所生成的靜電場作用,讓該薄化基板(100)能被有效平貼吸附於該基板平台(20)上,而組構成一可使薄化基板(100)被
有效固持、且均勻平整之載入機構者。
而本發明用於200微米以下薄化基板之載入方法,其適於在一處理薄化基板(100)的處理設備(500)中進行,如第2、6及7圖所揭示,其執行步驟包含有:首先,提供至少一薄化基板(100)於一處理設備(500)之至少一進出料埠(505);接著,使用一搬運裝置(30)之一基板牙叉(31)放置於任一薄化基板(100)表面並利用一靜電場對上述薄化基板(100)進行抓取作業;接下來,透過上述搬運裝置(30)將被抓取之薄化基板(100)放置於一預對準裝置(10)之一基板平台(20)上;然後,使上述基板平台(20)利用一靜電場對該薄化基板(100)進行固持作業;之後,使上述預對準裝置(10)對上述薄化基板(100)進行預對準之定向作業;緊接著,使用上述搬運裝置(30)之基板牙叉(31)利用靜電場對上述完成預對準定向之薄化基板(100)進行抓取作業;接著,透過上述搬運裝置(30)之基板牙叉(31)將上述完成預對準定向之薄化基板(100)放置於上述處理設備(500)之一工作平台(501)上;然後,令上述處理設備(500)對上述完成預對準定向之薄化基板(100)進行相對應之處理作業;最後,使用上述搬運裝置(30)將該完成處理作業之薄化基板(100)移動至任一進出料埠(505)。
且如第8A、8B圖所示,當該搬運裝置(30)基板牙叉(31)之抓取表面(32)或該預對準裝置(10)基板平台(20)之第一接合板面(21)與該等薄化基板(100)接觸時,該抓取表面(32)或該第一接合板面(21)可以透過內部電極生成靜電場,如第8A圖所示,該靜電場可將該薄化基板(100)翹起之部份逐步下拉,使原本翹曲高度超過靜電場範圍之部份
也會逐步進入靜電場範圍內,最終如第8B圖所示,該薄化基板(100)可以完全平貼於上述基板牙叉(31)之抓取表面(32)或上述基板平台(20)之第一接合板面(21)上表面,使該薄化基板(100)被穩固吸附於該搬運裝置(30)基板牙叉(31)或該預對準裝置(10)基板平台(20)上,而能確保薄化基板(100)在進行搬運移動時的定位性與穩固性,並能確保薄化基板(100)在進行預對準作業時的平整性與固持效果,且進一步在預對準定向完成後再次搬運移動至工作平台(501)時,能確保該薄化基板(100)依預對準之定向位置準確放置於工作平台(501)上,使後續薄化基板(100)在工作平台(501)上進行精準對位時能快速完成。
經由上述之說明,本發明之載入機構主要用於處理200微米以下薄化基板的處理設備,透過本發明載入機構之搬運裝置(30)的基板牙叉(31)與預對準裝置(10)的基板平台(20)可以相對該等薄化基板(100)生成一靜電場的設計,使得該等薄化基板(100)的翹曲部份能被逐步作用拉平於該基板牙叉(31)之抓取表面(32)或基板平台(20)之第一接合板面(21)上,進而可以有效地穩固、且平整的吸附於搬運裝置(30)之基板牙叉(31)或預對準裝置(10)之基板平台(20)上,可以避免發生因真空吸附失敗而重覆作業的現象,能提供薄化基板穩定的抓取力及固持力,且在預對準後可以提高薄化基板放置於處理設備(500)之工作平台(501)上的準確度,可縮短後續精準對位的時間及減少重新精準對位的次數,進而提高製程效率與良率,大幅增進其實用性。
綜上所述,可以理解到本發明為一創意極佳之新型創作,除了有效解決習式者所面臨的問題,更大幅增進功
效,且在相同的技術領域中未見相同或近似的產品創作或公開使用,同時具有功效的增進,故本發明已符合新型專利有關「新穎性」與「進步性」的要件,乃依法提出申請新型專利。
100:薄化基板
105:定向刻痕
10:預對準裝置
11:機座
15:感測器單元
20:基板平台
21:第一接合板面
30:搬運裝置
31:基板牙叉
32:抓取表面
500:處理設備
501:工作平台
502:工作模組
505:進出料埠
Claims (9)
- 一種用於200微米以下薄化基板之載入機構,其適於在一處理薄化基板的處理設備中進行,該載入機構至少包含有:一預對準裝置,其具有一設於該處理設備支撐結構上之機座,該機座內設有一驅動單元,又該驅動單元具有一通過機座頂面延伸、且被旋轉的輸出軸,另該輸出軸端部組裝一供放置該等薄化基板之基板平台,且該基板平台頂面具有一供置放該薄化基板之第一接合板面,該第一接合板面可以被選擇性對該薄化基板生成一吸附用之靜電場,又該機座另設有一感測器單元,供該感測器單元可以對應吸附在該基板平台上的薄化基板之上表面進行預對準之檢測定向作業;一搬運裝置,其可設於該處理設備之支撐結構上,該搬運裝置具有一可多軸移動、旋轉之基板牙叉,且該基板牙叉之兩側表面中至少一側表面被定義為一抓取表面,而該等抓取表面可以被選擇性對該薄化基板生成一吸附用之靜電場。
- 依請求項1所述之用於200微米以下薄化基板之載入機構,其中該預對準裝置之驅動單元被允許帶動該放置於基板平台上的薄化基板與該感測器單元間的相對移動。
- 依請求項1所述之用於200微米以下薄化基板之載入機構,其中該預對準裝置之基板平台外徑小於該薄化基板定向刻痕之範圍、且大於該薄化基板直徑的三分之一,使該薄化基板被該基板平台之靜電場吸附時,該薄化基板具定向刻痕之邊緣能被支撐呈平整狀。
- 依請求項1所述之用於200微米以下薄化基板之載入機構,其中該預對準裝置之基板平台具有一被選擇性升降承接該薄化基板之頂料組。
- 依請求項4所述之用於200微米以下薄化基板之載入機構,其中該預對準裝置之頂料組可以是位於基板平台軸心、且貫穿該第一接合板面,使得該頂料組可被作動升降來接收該薄化基板放置於該第一接合板面上。
- 依請求項5所述之用於200微米以下薄化基板之載入機構,其中該預對準裝置之頂料組頂面具有一可被選擇性生成一靜電場之第二接合板面。
- 依請求項1所述之用於200微米以下薄化基板之載入機構,其中該預對準裝置之基板平台於相對軸心兩側分別形成有一相對邊緣開口之牙叉開槽,可供搬運裝置之基板牙叉伸入。
- 一種用於200微米以下薄化基板之載入機構,其適於在一處理薄化基板的處理設備中進行,該載入機構至少包含有:一預對準裝置,其係設於該處理設備上,該預對準裝置至少具有一供被選擇性放置該等薄化基板之基板平台,且該基板平台頂面具有一供接收該薄化基板之第一接合板面,而該第一接合板面可以被選擇性對該薄化基板生成一吸附用之靜電場;一搬運裝置,其可設於該處理設備上,該搬運裝置至少具有一用於抓取該等薄化基板之基板牙叉,且該基板牙叉具有至少一抓取表面,而該等抓取表面可以被選擇性對該薄化基板生成一吸附用之靜電場。
- 一種用於200微米以下薄化基板之載入方法,其適於在一處理薄化基板的處理設備中進行,該載入方法步驟包含有:首先,提供至少一薄化基板於一處理設備之至少一進出料埠;接著,使用一搬運裝置之一基板牙叉放置於任一薄化基板表面並利用一靜電場對上述薄化基板進行抓取作業;接下來,透過上述搬運裝置將被抓取之薄化基板放置於一預對準裝置之一基板平台上;然後,使上述基板平台利用一靜電場對該薄化基板進行固持作業;之後,使上述預對準裝置對上述薄化基板進行預對準之定向作業;緊接著,使用上述搬運裝置之基板牙叉利用靜電場對上述完成預對準定向之薄化基板進行抓取作業;接著,透過上述搬運裝置之基板牙叉將上述完成預對準定向之薄化基板放置於上述處理設備之一工作平台上;然後,令上述處理設備對上述完成預對準定向之薄化基板進行相對應之處理作業;最後,使用上述搬運裝置將該完成處理作業之薄化基板移動至任一進出料埠。
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CN202210857903.6A CN116504705A (zh) | 2022-01-18 | 2022-07-20 | 用于200微米以下薄化基板的载入机构及载入方法 |
CN202221884078.0U CN218525561U (zh) | 2022-01-18 | 2022-07-20 | 用于200微米以下薄化基板的载入机构 |
US18/154,097 US20230227273A1 (en) | 2022-01-18 | 2023-01-13 | Substrate loader |
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