TWI764885B - 保護膜形成用複合片 - Google Patents
保護膜形成用複合片 Download PDFInfo
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- TWI764885B TWI764885B TW106104893A TW106104893A TWI764885B TW I764885 B TWI764885 B TW I764885B TW 106104893 A TW106104893 A TW 106104893A TW 106104893 A TW106104893 A TW 106104893A TW I764885 B TWI764885 B TW I764885B
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- Prior art keywords
- protective film
- forming
- film
- meth
- acrylate
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 266
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/406—Bright, glossy, shiny surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-042690 | 2016-03-04 | ||
| JP2016042690 | 2016-03-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201801916A TW201801916A (zh) | 2018-01-16 |
| TWI764885B true TWI764885B (zh) | 2022-05-21 |
Family
ID=59742786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106104893A TWI764885B (zh) | 2016-03-04 | 2017-02-15 | 保護膜形成用複合片 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6818009B2 (fr) |
| KR (1) | KR20180120173A (fr) |
| CN (2) | CN117656639A (fr) |
| SG (1) | SG11201807452UA (fr) |
| TW (1) | TWI764885B (fr) |
| WO (1) | WO2017150145A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020116284A1 (fr) * | 2018-12-05 | 2020-06-11 | リンテック株式会社 | Feuille composite de formation de film de protection et procédé de fabrication d'une puce semi-conductrice |
| WO2022210690A1 (fr) * | 2021-03-31 | 2022-10-06 | 積水ポリマテック株式会社 | Composition filmogène, film, feuille de circuit et feuille de capteur |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201213486A (en) * | 2010-07-30 | 2012-04-01 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor device |
| CN105009277A (zh) * | 2013-03-19 | 2015-10-28 | 琳得科株式会社 | 保护膜形成用膜 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002068192A1 (fr) * | 2001-02-26 | 2002-09-06 | Trespaphan Gmbh | Stratifie pouvant etre marque au laser |
| JP4762671B2 (ja) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | ダイシングテープ、および半導体ウェハダイシング方法 |
| KR101035297B1 (ko) * | 2006-09-27 | 2011-05-19 | 후지쯔 세미컨덕터 가부시키가이샤 | 반도체 장치의 제조 방법 |
| JP5391158B2 (ja) * | 2010-06-30 | 2014-01-15 | 古河電気工業株式会社 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
| JP5583724B2 (ja) * | 2012-09-20 | 2014-09-03 | リンテック株式会社 | レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法 |
| JP6059499B2 (ja) * | 2012-10-05 | 2017-01-11 | リンテック株式会社 | 表面保護シート |
| JP6104925B2 (ja) * | 2012-10-05 | 2017-03-29 | リンテック株式会社 | 保護膜形成層付ダイシングシートおよびチップの製造方法 |
| JPWO2014155756A1 (ja) * | 2013-03-26 | 2017-02-16 | リンテック株式会社 | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 |
| JP6405556B2 (ja) * | 2013-07-31 | 2018-10-17 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シートおよび検査方法 |
| WO2015146936A1 (fr) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | Pellicule formant une membrane de protection, feuille d'utilisation formant une membrane de protection, procédé de production et procédé d'inspection pour pièce à usiner ou produit transformé, pièce à usiner déterminée comme étant un produit adéquat et produit transformé déterminé comme étant un produit adéquat |
| JP6334223B2 (ja) * | 2014-03-26 | 2018-05-30 | リンテック株式会社 | 粘着シート |
| JP5823591B1 (ja) * | 2014-10-01 | 2015-11-25 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法 |
-
2017
- 2017-02-10 JP JP2018503001A patent/JP6818009B2/ja active Active
- 2017-02-10 CN CN202311427176.0A patent/CN117656639A/zh active Pending
- 2017-02-10 WO PCT/JP2017/004927 patent/WO2017150145A1/fr active Application Filing
- 2017-02-10 KR KR1020187025052A patent/KR20180120173A/ko not_active Application Discontinuation
- 2017-02-10 SG SG11201807452UA patent/SG11201807452UA/en unknown
- 2017-02-10 CN CN201780014253.6A patent/CN108778722A/zh active Pending
- 2017-02-15 TW TW106104893A patent/TWI764885B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201213486A (en) * | 2010-07-30 | 2012-04-01 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor device |
| CN105009277A (zh) * | 2013-03-19 | 2015-10-28 | 琳得科株式会社 | 保护膜形成用膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108778722A (zh) | 2018-11-09 |
| TW201801916A (zh) | 2018-01-16 |
| KR20180120173A (ko) | 2018-11-05 |
| JPWO2017150145A1 (ja) | 2018-12-27 |
| JP6818009B2 (ja) | 2021-01-20 |
| SG11201807452UA (en) | 2018-09-27 |
| CN117656639A (zh) | 2024-03-08 |
| WO2017150145A1 (fr) | 2017-09-08 |
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